A method, device and system for processing transparent medium material

Abstract

The present invention discloses a method, device and system for processing transparent medium materials, which can solve the problem of material edge collapse during processing, greatly improve the yield rate, and solve the technical problem of low yield rate in the prior art.

Description

Technical Field

[0001] The present invention relates to the field of transparent dielectric material processing, and in particular to a transparent dielectric material processing method, device and system. Background Art

[0002] Transparent dielectric materials are important basic raw materials for a series of optical components, such as lenses, gratings, wave plates, laser crystals, nonlinear frequency conversion and modulation devices.

[0003] The cutting and separation of the above materials are mainly carried out by mechanical cutting and laser cutting. Laser cutting can solve the problems of slow processing speed, complex process, and poor cutting quality existing in mechanical cutting. However, laser cutting is difficult because the dielectric material is exposed to air during the cutting process. The edge of the material contacts the air, resulting in a huge refractive index difference. This prevents the dielectric material from being destroyed uniformly and effectively, resulting in a certain degree of edge collapse and low yield in the laser processing process, especially in the processing of high-precision or mesoscopic optical components. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide a method, device and system for processing transparent dielectric materials.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] According to one aspect of the present application, a method for processing a transparent medium material is provided, comprising:

[0007] According to the transparent medium material to be processed, selecting a matching liquid or a semi-fluid solid matching material that matches the refractive index of the transparent medium material;

[0008] performing edge wrapping or covering processing on the edge of the transparent medium material according to the matching liquid or semi-fluid solid matching material;

[0009] The processed transparent medium material to be processed is subjected to laser processing.

[0010] Optionally, the matching liquid or semi-fluid solid matching material maintains a consistent height with the plane of the transparent medium material to be processed. The semi-fluid solid matching material may include a gel material, a resin material, or a matching paste that matches the refractive index of the transparent medium material.

[0011] Optionally, after wrapping or covering the edge of the transparent medium material with the matching liquid or semi-fluid solid matching material, the method further includes:

[0012] Other transparent medium materials are covered on the transparent medium material to be processed after the edge processing.

[0013] The transparent medium material includes: plane glass, crystal, ceramic or plastic, etc.

[0014] Optionally, performing edge wrapping or covering processing on the edge of the transparent medium material according to the matching liquid or semi-fluid solid matching material includes:

[0015] Fully wrapping or covering the edge of the transparent medium material to be processed with the matching liquid or semi-fluid solid matching material;

[0016] Alternatively, the matching liquid or semi-fluid solid matching material is filled into an open groove near the edge of the transparent medium material to be processed, and the processing track of the transparent medium material to be processed covers the matching liquid or semi-fluid solid matching material in the open groove.

[0017] Optionally, the laser processing of the processed transparent medium material to be processed may further include:

[0018] Adjusting the focal depth of the Bessel-Gaussian beam to match the thickness of the transparent medium material to be processed, and performing edge-non-destructive cutting processing on the transparent medium material to be processed by the Bessel-Gaussian laser beam;

[0019] and / or irradiating the processed area of ​​the transparent medium material with a carbon dioxide laser beam to perform non-destructive self-splitting processing;

[0020] And / or by using other light fields that meet the processing power / energy requirements, the transparent medium material to be processed is processed into a specific periodic morphology structure.

[0021] According to another aspect of the present application, a transparent medium material processing device is provided, which is applied to the above method, comprising:

[0022] an open slot;

[0023] A matching liquid or a semi-fluid solid matching material having a refractive index matching that of the transparent medium material to be processed is placed in the open groove;

[0024] The matching liquid or semi-fluid solid matching material wraps or covers the edge of the transparent medium material.

[0025] Optionally, the opening slot and the transparent medium material to be processed are located on a movable platform.

[0026] The edge of the transparent medium material to be processed wraps or covers the matching liquid or semi-fluid solid matching material, and both are located in the open groove;

[0027] or

[0028] The transparent medium material to be processed is a large-format material to be processed, the open groove and the large-format material to be processed are located on the movable platform, the matching liquid or semi-fluid solid matching material is filled in the open groove adjacent to the edge of the large-format material to be processed, and the processing trajectory of the large-format material to be processed covers the matching liquid or semi-fluid solid matching material in the open groove.

[0029] Optionally, the transparent medium material to be processed after the edge wrapping or covering treatment is covered with other transparent medium materials; the matching liquid or semi-fluid solid matching material maintains a consistent height with the plane of the transparent medium material to be processed.

[0030] The transparent medium material may include: flat glass, crystal, ceramic or plastic, etc. The semi-fluid solid matching material may include gel material, resin material or matching paste, etc.

[0031] Optionally, the mobile platform can perform laser processing on the transparent medium material to be processed by receiving the laser beam, including:

[0032] The mobile platform moves at high speed to receive a Gaussian Bessel light beam to perform edge-cutting processing on the transparent medium material to be processed; and / or the mobile platform irradiates the processed area of ​​the transparent medium material with a received carbon dioxide laser beam to perform self-splitting processing without loss; and / or the mobile platform performs specific periodic morphological structure processing on the transparent medium material to be processed through a light field that meets the processing power / energy requirements.

[0033] According to another aspect of the present application, a transparent medium material processing system is provided, characterized in that it includes:

[0034] A beam generating device for generating a laser beam for processing;

[0035] A movable platform is provided with an open slot, in which a matching liquid or a semi-fluid solid matching material having a refractive index matching that of the transparent dielectric material to be processed is placed; the matching liquid or the semi-fluid solid matching material wraps or covers the edge of the transparent dielectric material;

[0036] The mobile platform performs laser processing on the transparent medium material to be processed by using the received laser beam.

[0037] Optionally, the edges of the transparent medium material to be processed are completely wrapped or covered by the matching liquid or semi-fluid solid matching material, and are all located in the open groove;

[0038] or

[0039] The transparent medium material to be processed is a large-format material to be processed, which is located outside the open groove. The matching liquid or semi-fluid solid matching material is filled in the open groove adjacent to the edge of the large-format material to be processed. The processing trajectory of the large-format material to be processed covers the matching liquid or semi-fluid solid matching material in the open groove, and the large-format material to be processed and the open groove can move relative to each other.

[0040] Optionally, when the beam generating device generates a Gaussian Bessel beam, it includes a picosecond laser, a conic lens, and a double telecentric system consisting of a pair of lenses to generate a Gaussian Bessel laser beam;

[0041] and / or when the beam generating device generates a carbon dioxide laser beam, it includes a carbon dioxide laser, a galvanometer and a field lens;

[0042] The light beam generating device includes a phase modulator, a Fourier transform lens, and / or generates other novel light fields that meet the processing power / energy requirements.

[0043] Optionally, the beam generating device adjusts the resonant cavity structure inside the laser system to phase-modulate the Gaussian beam in the resonant cavity, and then generates other new light fields that meet the processing power / energy requirements through Fourier transform lenses, diffraction optical elements, etc., such as Airy beams, Matthew beams, cosine beams, parabolic beams, etc., to achieve processing requirements of specific periodic morphologies and specific cutting cross-sectional shapes. Combined with the above methods, the integrity of the edges of the processed materials can be ensured and the yield rate can be improved.

[0044] The method, device, and system proposed in the present invention have one or more aspects having the following technical effects:

[0045] By wrapping or covering the edges of the material being processed with a semi-fluid solid, such as a liquid or gel, resin, or matching paste, which matches the refractive index, the edge of the transparent material being processed can be kept consistent with the rest of the processing location during processing, thereby resolving issues such as edge chipping during precision cutting and slicing. This approach can also be applied to industrial applications involving the cutting of large-format, meter-scale transparent material sheets, significantly improving yield and addressing the low yield problem inherent in existing technologies. To prevent Gaussian Bessel focus spot distortion caused by sudden changes in the refractive index of the material being processed during cutting, this solution uses a liquid or semi-fluid solid matching material with a refractive index that is consistent or similar to that of the material being processed to wrap or cover the edges of the material being processed. The material being processed can be glass, crystal, ceramic, or plastic, among other transparent materials. This same method can also achieve non-destructive self-splitting and other processing techniques, such as the creation of periodic, specific structures. Because the refractive index of the edges matches that of the material being processed, edge chipping is avoided, whether in slicing or other structures, such as specific periodic features. This significantly improves yield, saves costs, and increases production efficiency.

[0046] In one or more embodiments of the present invention, the liquid or semi-fluid solid matching material used to match the refractive index of the material to be processed can be maintained at a height consistent with the plane of the material to be processed. In order to prevent the highly fluid matching liquid from shaking or flooding the edge of the material to be processed during the processing movement during precision cutting, a piece of transparent medium such as quartz glass or sapphire that can block the liquid from flowing can be placed above the material to be processed and the matching material.

[0047] The mainstream laser cutting light source in the prior art is mainly based on Gaussian beams, which have a short focal depth and a certain taper. It is necessary to constantly change the focus position to achieve the cutting of dielectric materials with a thickness of millimeters, which seriously restricts the efficiency of material cutting. In the embodiment of the present invention, a Bessel beam can be used during the cutting process. It is a typical non-diffraction beam that can be obtained by Gaussian beam transformation (Bessel-Gaussian beam). It can maintain the focal spot unchanged within a range of several millimeters, and the central focus size is an order of magnitude smaller than the focus spot of the traditional Gaussian beam. It is very suitable for deep hole processing and high-precision material cutting at the micro-nano scale. The embodiment of this solution can use a Gaussian Bessel beam to further assist the carbon dioxide laser in irradiating the cutting area, which can achieve an automatic splitting effect. The present invention can also use Airy beams, Matthew beams, cosine beams, parabolic beams, etc. to achieve specific periodic morphologies and specific cutting cross-sectional shapes, realize periodic curved structures and other processing on the surface of the transparent dielectric material to be processed, and ensure the integrity of the edge of the processed material.

[0048] In the embodiments of the present invention, during the processes of cutting, splitting, or specific needs, the medium material to be processed is exposed to the air, and the edge of the material is in contact with the air, resulting in a huge refractive index difference, which causes the focused spot of the Bessel beam to diffract and distort at the edge of the medium. Due to the use of edge wrapping or covering matching materials, the edge of the material to be processed can be destroyed evenly and effectively, avoiding the problem of edge collapse in the subsequent splitting process, and greatly improving the yield of the laser processing process, especially the processing process involving high-precision or mesoscopic-scale optical elements.

[0049] In an embodiment of the present invention, the problem of edge chipping in the splitting process of transparent dielectric materials caused by the distortion of the focused light field at the edge of the dielectric material can be overcome. It is proposed to maintain the consistency of the edge light field of the dielectric material with other cutting positions during the cutting process through refractive index matching, maintain the laser light field at the edge of the material to be processed without distortion, and achieve edge-free splitting. Similarly, other processing such as periodic curved structures can be achieved. Since the refractive index at the edge is consistent with that of the material to be processed, no edge chipping will occur during the splitting or other processing of the curved structure, greatly improving the yield rate, saving costs, and improving production efficiency. The present invention can also be applied to processing such as cutting of large-format transparent dielectric material plates to be processed at the meter level, which can greatly improve the yield rate. The use of an open groove structure at a portion of the edge can further save the waste of refractive index matching materials and the cost and complexity of engineering implementation.

[0050] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purposes and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0051] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0053] Figure 1 A schematic diagram of an embodiment of a transparent dielectric material processing method and a transparent dielectric material processing device according to the present invention;

[0054] Figure 2 1 is an overall schematic diagram of an embodiment of a transparent medium material processing system of the present invention;

[0055] Figure 3 It is a structural schematic diagram of another embodiment of the transparent medium material processing device of the present invention;

[0056] Figure 4 It is a schematic diagram of an embodiment of the structure of a splitting system of a transparent medium material processing system of the present invention.

[0057] List of parts and reference numerals:

[0058] 1—Picosecond laser; 22, 21, 26, 27, 28—Laser shaping lens; 23, 24, 25, 29, 210—Laser reflector; 211—Laser galvanometer; 212—Laser field mirror; 3—Open slot; 4—Refractive index matching liquid or semi-fluid solid matching material; 5—Transparent dielectric material to be processed; 11—Large-format transparent dielectric plate; 111—Laser trace to be processed; 51—Gaussian Bessel laser processing trace; 6—Quartz cover glass; 8—Three-dimensional moving platform; 9—CO2 laser; 10—Gaussian Bessel beam; 91 CO2 laser. DETAILED DESCRIPTION

[0059] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0060] Figure 1 FIG. 1 is a schematic diagram of an embodiment of a transparent medium material processing method and a transparent medium material processing device according to the present invention. Figure 1 As shown, it is also a schematic diagram of an embodiment of the present application using a Gaussian Bessel beam to perform non-destructive cutting of a medium material to be processed whose edge is covered with a refractive index matching material, as shown in FIG. Figure 1 As shown:

[0061] The Bessel light field can be formed by the interference of surface wave vectors after a Gaussian beam passes through a conical lens. The final expression of the Gaussian Bessel beam is formula 1:

[0062]

[0063] Among them, k r =ksinθ,k z = kcosθ are the transverse and longitudinal components of the wave vector k respectively. Where k = λ / 2n, n and θ are the refractive index of the conical lens and the semi-conical angle of the Gaussian Bessel beam, r, and z refer to the radius, azimuth, and distance in the cylindrical coordinate system, respectively. x1, y1, and z1 are the three reference coordinate axes mapped from the cylindrical coordinate system to the Cartesian coordinate system through coordinate transformation. In the Cartesian coordinate system, based on the Fresnel diffraction integral formula, the Gaussian Bessel light field E(x1, y1) at position z1 is transmitted through the distance Δz, and the Gaussian Bessel light field E(x2, y2) at position z2 is expressed as Formula 2:

[0064]

[0065] k i =λ / 2n i , i = 1, and 2 indicate the refractive index of the material edge (including air) and the material being processed, respectively. Therefore, in conventional laser processing, the Gaussian Bessel beam must pass through a region consisting of both air and the material being processed. The significant difference in refractive index between the two regions results in differences in the transmission speed of the Gaussian Bessel light field in different regions, which in turn causes wavefront distortion caused by phase differences on the same horizontal plane.

[0066] Figure 1 This is a schematic diagram of an embodiment of a processing device for processing precision transparent dielectric materials. Figure 1 In the embodiment, in order to avoid the distortion of the Gaussian Bessel focusing spot caused by the sudden change in the refractive index at the edge of the medium material 5 to be processed, a matching liquid or semi-fluid solid matching material 4 is selected, which is consistent with or close to the refractive index n1 of the material to be processed 5. At this time, the refractive index of the matching liquid or semi-fluid solid matching material 4 is n2, which is consistent with or close to n1, and the edge of the material to be processed 5 is wrapped or covered, thereby ensuring that there is no sudden change in the refractive index at the edge of the processed material during the light field transmission process described by Formula 2, thereby ensuring the integrity of the edge processing.

[0067] The material to be processed 5 can be a transparent medium material such as glass, crystal, ceramic or plastic.

[0068] Generally, the matching liquid, gel, colloid, or paste-like matching material 4, used to match the refractive index of the material to be processed 5, is maintained at a height consistent with the plane of the material to be processed 5. Of course, it is also possible to have the matching liquid or semi-fluid solid material 4 be higher than the material to be processed 5, but there will be light loss, and the thickness of the transparent dielectric material 5 that can be cut and processed will be thinner.

[0069] The matching material 4 and the material to be processed 5 are placed in the open shallow groove 3, as shown in FIG. Figure 1 As shown, in this embodiment, the edge of one side of the material to be processed 5 is completely wrapped or covered with the refractive index matching material 4. During the specific implementation process, if the material to be processed 5 is placed in the middle of the open groove 3, the matching material 4 can also be filled on both sides of the edge of the material to be processed 5. Specifically, one side or both sides of the edge can be wrapped and covered depending on the position of the material to be processed 5 and the open groove.

[0070] like Figure 1 and Figure 2As shown, in order to prevent the highly fluid matching liquid 4 from shaking or covering the edge of the material to be processed 5 during the movement of the processing platform 8 during the precision cutting process, a piece of quartz glass 6 can be placed above the material to be processed 5 and the matching material 4. It can also be made of other transparent medium materials such as sapphire, as long as it can block the matching liquid from flowing.

[0071] This embodiment uses a semi-fluid solid such as a liquid or gel with a consistent refractive index to perform edge wrapping (edge ​​wrapping) processing or covering, which can maintain the consistency of the Bessel light field at the edge of the transparent medium material to be processed and other cutting positions during the processing. It can solve the edge collapse problem in the splitting process caused by the distortion of the focused light field at the edge of the medium material during the process of using a laser beam to cut the transparent medium material into pieces, and can greatly improve the finished product rate.

[0072] In this embodiment, when selecting a liquid or semi-fluid solid matching material 4 that matches the refractive index of the transparent medium material 5 to be processed, it is preferably transparent relative to the cutting wavelength, such as a transparent matching liquid or gel, resin or other material relative to the processing wavelength.

[0073] Figure 2 is an overall schematic diagram of an embodiment of a transparent medium material processing system of the present invention, Figure 2 The figure shows an overall embodiment schematic diagram of a system for non-destructive cutting using a Gaussian Bessel beam using the processing method of the present invention in an embodiment of the present application.

[0074] like Figure 2 As shown:

[0075] The device for generating the Gaussian Bessel beam 10 is composed of a picosecond laser 1 , a conic lens 26 , and a double telecentric system consisting of a pair of lenses 27 and 28 .

[0076] An open shallow groove 3 containing a refractive index matching material 4 and a workpiece material 5 is placed on a precision three-dimensional displacement platform 8. The liquid or colloid 4, used to match the refractive index of the workpiece material 5, is maintained at a consistent height relative to the workpiece material 5. To prevent the highly fluid matching liquid from sloshing or flooding the workpiece material during precision cutting, a sheet of quartz glass 6 is placed over the workpiece material 5 and matching material 4. Other transparent materials, such as sapphire, can also be used, as long as they can prevent the matching liquid from flowing.

[0077] Adjust the height of the platform 8 so that the focal depth of the Bessel-Gaussian beam 10 completely covers the thickness of the material to be processed 5. Start the three-dimensional motion platform 8, which can move at high speed in the horizontal direction. The Bessel-Gaussian laser beam is fixed, and start the picosecond laser 1 to perform edge-free cutting on the material to be processed 5.

[0078] Figure 3 This is a schematic diagram of another embodiment of the transparent medium material processing device of the present invention. This embodiment is an example of using the edge processing method of the present invention in the field of industrial application. In the field of industrial application, if it involves cutting large-scale transparent medium material plates to be processed, such as automobile glass, display LCD screens, etc. Figure 3 The embodiment achieves the goal of avoiding the waste of refractive index matching materials and the cost and complexity of engineering implementation. Figure 1 In the embodiment shown, if a large area of ​​processing material 5 is involved, a large amount of matching liquid or matching material 4 is required for the complete edge wrapping process. However, in this embodiment, for a large-format medium material 11 to be processed, only a small opening shallow groove 4 is required, and it is located at a part of the edge of 11, such as Figure 3 As shown, the refractive index matching material 4 is filled into the open shallow groove 3 of the movable platform 8, close to the edge of the large-format dielectric plate 11 (the edge near the processing track 111). The refractive index matching material 4 is fixed to the movable platform 8, so that the cutting track 111 of the laser beam to be processed, such as the Gaussian Bessel beam, covers the refractive index matching material 4 in the shallow groove 3. The movement of the platform 8 is controlled to ensure the integrity of the edge of the large-format dielectric material 11 during the cutting and splitting process, prevent edge collapse, and improve the yield rate. Furthermore, the movable platform 8 drives the open groove 3 and the matching material 4 in the shallow groove forward or backward, or the large-format dielectric plate 11 moves forward and backward relative to the platform 8. The purpose is to move the open groove and the large-format dielectric plate 11 relative to each other so that the next laser cutting station (such as the next cutting track 111) can be entered. Regardless of the two implementation methods, the purpose is to ensure that the cutting track 111 covers the matching material in the open groove 3, thereby improving efficiency and product yield.

[0079] In this embodiment, the large-surface dielectric plate 11 does not need to be fully edge-wrapped with matching material at all edges of the large-surface dielectric plate 11, which wastes a large amount of matching material 4. Only the edges to be processed, such as the areas near the laser traces 111 to be processed, are covered. Figure 3 The matching material 4 can be filled into the opening groove 3 similar to the ear or pot handle. Of course, the opening groove can be of any shape as long as the matching material inside covers the processing track of the material to be processed. Figure 4 When using a large area plate material to be processed, it is sufficient to wrap the matching liquid or matching material 4 around the edge near the laser processing mark 51, which can greatly save costs and also achieve non-destructive cutting and self-splitting of the cutting part. It is easy to operate and has strong feasibility.

[0080] Figure 4This is a schematic diagram of an embodiment of a splitting system for a transparent dielectric material processing system according to the present invention. The splitting process can be accomplished by a CO2 laser 9, a galvanometer 211, and a field lens 212. By modulating the power of the CO2 laser 9 so that the focused CO2 laser 91 irradiates the cut area 51 of the Gaussian Bessel beam 10 on the surface of the material 5 to be processed, automatic splitting with intact edges can be achieved. Figure 2 During the cutting process in this embodiment, the three-dimensional motion platform 8 moves, while the Bessel laser is stationary. In this embodiment, the non-destructive automatic sharding process is generally performed without moving the three-dimensional motion platform. Vibrating mirrors, field lenses, and other components are used to control the carbon dioxide beam to scan the transparent medium to be processed within the opening, achieving non-destructive self-sharding. This embodiment utilizes a Gaussian Bessel beam to assist the carbon dioxide laser in irradiating the cutting area, achieving automatic sharding. While automatic sharding can also be achieved manually through mechanical means, this embodiment utilizes the entire system after cutting to transform the carbon dioxide laser beam for automatic sharding, achieving greater efficiency and significantly improving the yield rate of laser processing, particularly for processing high-precision or mesoscopic optical components.

[0081] Other embodiments: In addition to the Gaussian Bessel beam that has been widely used, the present invention can also achieve other processing besides cutting and non-destructive self-splitting through the method, device and system of the present invention. For example: Another embodiment of the present invention can adjust the resonant cavity structure inside the laser system to phase modulate the Gaussian beam in the resonant cavity, and then focus it on the processing surface through a Fourier transform lens to form a high-power / high-energy Airy beam, which is used to process periodic curved structures (such as Airy spots) on the surface of the material and perform curved structure processing. Combined with the above method, the integrity of the edge of the processed material and the yield rate can be improved.

[0082] Similarly, by adjusting the resonant cavity structure within the laser system, the Gaussian beam within the resonant cavity can be phase-modulated. This can then be generated through Fourier transform lenses, diffractive optical elements, and other methods to meet the processing power / energy requirements, such as Airy beams, Matthew beams, cosine beams, and parabolic beams. This allows for specific periodic morphologies and specific cutting cross-sectional shapes to be processed, ensuring the integrity of the edges of the processed material and the yield rate. The consistency of the light field at the edges of the material to be processed (e.g., 5 or 11 in the accompanying drawings) after edge wrapping by the method described in the present invention can ensure the consistency of the refractive index at the edges of the material, thereby improving cost efficiency and avoiding technical issues such as edge collapse.

[0083] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage and optical storage, etc.) containing computer-usable program code.

[0084] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0085] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0086] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0087] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A method for processing a transparent medium material, characterized in that: include: According to the transparent medium material to be processed, selecting a matching liquid or a semi-fluid solid matching material that matches the refractive index of the transparent medium material; performing edge wrapping or covering processing on the edge of the transparent medium material according to the matching liquid or semi-fluid solid matching material; performing laser processing on the processed transparent medium material to be processed; Filling the matching liquid or semi-fluid solid matching material into an open groove located near an edge of the portion of the transparent dielectric material to be processed, so that the processing track of the transparent dielectric material to be processed covers the matching liquid or semi-fluid solid matching material in the open groove; The opening groove is located at a portion of the edge of the transparent medium material to be processed near a track to be processed.

2. The method according to claim 1, characterized in that The matching liquid or semi-fluid solid matching material maintains a consistent height with the plane of the transparent medium material to be processed. The semi-fluid solid matching material includes a gel material, a resin material or a matching paste.

3. The method according to claim 1, characterized in that After the edge of the transparent medium material is wrapped or covered with the matching liquid or semi-fluid solid matching material, the following steps are further included: Other transparent medium materials are covered on the transparent medium material to be processed after the edge processing.

4. The method according to any one of claims 1 to 3, characterized in that The laser processing of the processed transparent medium material to be processed includes: Adjusting the focal depth of the Bessel-Gaussian beam to match the thickness of the transparent medium material to be processed, and performing edge-non-destructive cutting processing on the transparent medium material to be processed by the Bessel-Gaussian laser beam; and / or irradiating the processed area of ​​the transparent medium material with a carbon dioxide laser beam to perform non-destructive self-fragmentation processing; And / or performing periodic topography structure processing on the transparent medium material to be processed by using a light field that meets the processing power / energy requirements.

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