Laser cutting method, system, equipment and medium for brittle materials

Abstract

The present invention discloses a method, system, device, and medium for laser cutting of brittle materials. The method comprises the following steps: obtaining a laser cutting request, the laser cutting request including target cutting parameters; obtaining cutting control parameters corresponding to a current cutting point based on the target cutting parameters; cutting the current cutting point corresponding to an object to be cut based on the cutting control parameters corresponding to the current cutting point, and obtaining current position data corresponding to the current cutting point; when the current cutting point is not the end cutting point, obtaining cutting control parameters corresponding to a next cutting point based on the target cutting parameters and the current position data corresponding to the current cutting point, updating the next cutting point to the current cutting point, and repeatedly performing cutting based on the cutting control parameters corresponding to the current cutting point, and obtaining current position data corresponding to the current cutting point. This technical solution can ensure consistent cutting effects on the cutting edges of the object to be cut.

Description

Technical Field

[0001] The present invention relates to the field of laser cutting technology, and in particular to a method, system, equipment and medium for laser cutting of brittle materials. Background Art

[0002] Brittle materials generally refer to materials such as sapphire and tempered glass. For a long time, brittle materials have been primarily processed using traditional wheel-based machining. However, with the rapid development of the consumer electronics industry, the demand for ultra-thin, ultra-hard, and special-shaped brittle materials is increasing. Using traditional wheel-based mechanical cutting or drilling can easily cause edge chipping or cracking of brittle materials, severely affecting the yield and quality of brittle material processing and severely restricting the development of the consumer electronics industry.

[0003] To address these issues, ultrafast laser cutting technology has been gradually applied to the processing of brittle materials. However, traditional laser cutting methods for brittle materials have significant shortcomings when applied to these materials. Because the cutting platform's speed varies as it moves along a contoured cutting path, while the laser output frequency of the cutting equipment is fixed, this leads to inconsistent processing results on the cut edges of brittle materials. Summary of the Invention

[0004] Embodiments of the present invention provide a method, system, device, and medium for laser cutting of brittle materials to solve the problem of inconsistent processing effects on the cutting edges of brittle materials.

[0005] A brittle material laser cutting method is applied to a brittle material laser cutting system, wherein the brittle material laser cutting system includes a cutting device, including the steps performed by the cutting device:

[0006] Obtaining a laser cutting request, wherein the laser cutting request includes target cutting parameters;

[0007] Based on the target cutting parameters, obtaining cutting control parameters corresponding to the current cutting point;

[0008] Based on the cutting control parameters corresponding to the current cutting point, cutting the object to be cut corresponding to the current cutting point, and obtaining current position data corresponding to the current cutting point;

[0009] When the current cutting point is not the end cutting point, based on the target cutting parameters and the current position data corresponding to the current cutting point, the cutting control parameters corresponding to the next cutting point are obtained, the next cutting point is updated to the current cutting point, and the cutting control parameters based on the current cutting point are repeatedly executed to cut the current cutting point corresponding to the object to be cut, and the current position data corresponding to the current cutting point is obtained.

[0010] Furthermore, the target cutting parameters include a target cutting trajectory and initial control parameters; the target cutting trajectory includes a plurality of configured cutting points;

[0011] The obtaining of the cutting control parameters corresponding to the current cutting point based on the target cutting parameters includes:

[0012] determining a current cutting point from a plurality of configured cutting points based on the target cutting trajectory;

[0013] Based on the initial control parameters, the cutting control parameters corresponding to the current cutting point are obtained.

[0014] Furthermore, when the current cutting point is not the end cutting point, based on the target cutting parameter and the current position data corresponding to the current cutting point, obtaining the cutting control parameter corresponding to the next cutting point, and updating the next cutting point to the current cutting point, includes:

[0015] If the current cutting point is not the end cutting point, determining whether the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point corresponding to the current cutting point;

[0016] If the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point corresponding to the current cutting point, a pulse cutting signal is generated;

[0017] Based on the pulse cutting signal, a target laser corresponding to the target laser energy is output, and based on the target cutting trajectory and the initial control parameters, a cutting control parameter corresponding to the next cutting point is obtained.

[0018] Furthermore, the obtaining of cutting control parameters corresponding to the next cutting point based on the target cutting trajectory and the initial control parameters includes:

[0019] If the current cutting point is not the end cutting point, the configured cutting point adjacent to the configured cutting point corresponding to the current cutting point is determined as the next cutting point, and the cutting control parameters corresponding to the next cutting point are obtained based on the initial control parameters;

[0020] If the current cutting point is the end cutting point, the execution ends and the cutting control parameters corresponding to the next cutting point are obtained.

[0021] Furthermore, the brittle material laser cutting system includes a grating scale reading head connected to the cutting device;

[0022] The obtaining of the current position data corresponding to the current cutting point includes:

[0023] Receiving real-time position data corresponding to the current cutting point collected by the grating ruler reading head in real time;

[0024] Acquire X-axis position data and Y-axis position data from the real-time position data;

[0025] The current position data is acquired based on the X-axis position data and the Y-axis position data.

[0026] Furthermore, the target cutting trajectory includes a linear cutting trajectory and a non-linear cutting trajectory; the initial control parameters include a first preset acceleration and a second preset acceleration;

[0027] The cutting control parameter corresponding to the current cutting point is used to cut the object to be cut, and the cutting control parameter is used to cut the object to be cut. The ...

[0028] Based on the linear cutting trajectory, using a first preset acceleration, cutting the object to be cut according to the linear cutting trajectory;

[0029] Based on the non-linear cutting trajectory, the object to be cut is cut according to the non-linear cutting trajectory using a second preset acceleration.

[0030] Furthermore, the brittle material laser cutting system further includes a driver; the cutting device is connected to the driver, and before obtaining the laser cutting request, the brittle material laser cutting method further includes:

[0031] Get debug request;

[0032] If the debugging request is an automatic debugging request, the position loop, speed loop and current loop of the driver are debugged using a preset debugging program;

[0033] If the debugging request is a manual debugging request, the driver debugging parameters are obtained, and the position loop, speed loop and current loop of the driver are debugged based on the driver debugging parameters.

[0034] A brittle material laser cutting system comprises a linear platform, a cutting device and a driver; the cutting device comprises a laser and a cutting controller; the cutting device is connected to the linear platform and the driver; the cutting controller comprises a laser cutting program that can be run on the cutting controller and is connected to the laser, and the linear platform comprises a grating reading head with a resolution of 0.1 μm; when the cutting controller executes the laser cutting program, the above-mentioned brittle material laser cutting method is implemented.

[0035] A cutting device includes a memory, a laser, a cutting controller, and a cutting control program stored in the memory and executable on the cutting controller. The cutting controller is connected to the laser, and the cutting controller implements the above-mentioned laser cutting method for brittle materials when executing the cutting control program.

[0036] A readable storage medium stores a cutting control program, and when the cutting control program is executed by a cutting controller, the above-mentioned brittle material laser cutting method is implemented.

[0037] The above-mentioned laser cutting method, system, equipment and medium for brittle materials, the cutting equipment obtains a laser cutting request to laser cut the object to be cut according to the target cutting parameters in the laser cutting request; the cutting equipment outputs the same size of target laser energy to each configured cutting point based on the feature that the distances between multiple configured cutting points in the target cutting trajectory are equal, which can ensure that the cutting effect of the cutting edge of the object to be cut is consistent. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0039] Figure 1 is a schematic diagram of a brittle material laser cutting system according to an embodiment of the present invention;

[0040] Figure 2 is a flow chart of a method for laser cutting brittle materials in one embodiment of the present invention;

[0041] Figure 3 is another flow chart of a method for laser cutting brittle materials according to an embodiment of the present invention;

[0042] Figure 4 is another flow chart of a method for laser cutting brittle materials according to an embodiment of the present invention;

[0043] Figure 5 is another flow chart of a method for laser cutting brittle materials according to an embodiment of the present invention;

[0044] Figure 6 is another flow chart of a method for laser cutting brittle materials according to an embodiment of the present invention;

[0045] Figure 7 is another flow chart of a method for laser cutting brittle materials according to an embodiment of the present invention;

[0046] Figure 8 4 is another flow chart of the laser cutting method for brittle materials in one embodiment of the present invention. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0048] The brittle material laser cutting method provided by the embodiment of the present invention can be applied as follows: Figure 1 Specifically, the brittle material laser cutting method is applied in a brittle material laser cutting system, which includes: Figure 1 The linear platform, cutting device and drive shown, the cutting device includes a laser and a cutting controller; the cutting device is connected to the linear platform and the drive; the cutting controller includes a laser cutting program that can be run on the cutting controller and is connected to the laser to achieve consistency in the processing process of the object to be cut.

[0049] In one embodiment, if Figure 2 As shown, a laser cutting method for brittle materials is provided, which is applied in Figure 1 The cutting equipment in the example is used as an example to illustrate, including the following steps:

[0050] S11: Obtain a laser cutting request, which includes target cutting parameters.

[0051] Among them, the laser cutting request is a request for laser cutting of the object to be cut. The object to be cut is the object to be laser cut. For example, the object to be cut may be a brittle material, such as sapphire, tempered glass, or other materials that require high consistency in the laser cutting process. The target cutting parameters are parameters for laser cutting the object to be cut. For example, the target cutting parameters include but are not limited to the target cutting trajectory and cutting control parameters. The target cutting trajectory is a custom-set trajectory for laser cutting the object to be cut. The cutting control parameters are control parameters that instruct the cutting device to laser cut the object to be cut. For example, the cutting control parameters include but are not limited to the target cutting speed and the target laser energy. The target cutting speed is the speed at which the object to be cut is laser cut. The target laser energy is the laser energy for laser cutting the object to be cut. It can be understood that the cutting device obtains the laser cutting request to laser cut the object to be cut according to the target cutting parameters in the laser cutting request.

[0052] S12: Based on the target cutting parameters, obtain the cutting control parameters corresponding to the current cutting point.

[0053] The current cutting point is the cutting point where the laser cutting is performed on the object to be cut at the current moment.

[0054] As an example, the target cutting parameters include a target cutting trajectory and initial control parameters. The target cutting trajectory includes multiple configured cutting points. The first configured cutting point is the starting cutting point, and the last configured cutting point is the ending cutting point. The distances between the multiple configured cutting points are equal. The initial control parameters are custom-set parameters, including but not limited to target cutting speed and target laser energy. The starting cutting point is the starting cutting position for laser cutting of the object to be cut. The ending cutting point is the ending cutting position for laser cutting of the object to be cut. The configured cutting points are pre-configured cutting points for interval laser cutting of the object to be cut.

[0055] In this embodiment, the cutting device obtains the cutting control parameters corresponding to the current cutting point corresponding to the target cutting trajectory based on the target cutting trajectory and the initial control parameters. For example, if the current cutting point is the first configured cutting point in the target cutting trajectory, the target cutting speed and target laser energy corresponding to the first configured cutting point are obtained, that is, the cutting control parameters corresponding to the first configured cutting point. If it is the last configured cutting point in the target cutting trajectory, the target cutting speed and target laser energy corresponding to the last configured cutting point are obtained, that is, the cutting control parameters corresponding to the last configured cutting point. It should be noted that since the distances between multiple configured cutting points are equal, the target laser energy corresponding to each configured cutting point is the same, which can ensure that the cutting effect of the cutting edge of the object to be cut is consistent.

[0056] S13: Based on the cutting control parameters corresponding to the current cutting point, the object to be cut is cut at the current cutting point, and current position data corresponding to the current cutting point is obtained.

[0057] Among them, the current position data is the position data corresponding to the current cutting point.

[0058] As an example, after obtaining a laser cutting request, the cutting device determines the starting cutting point as the current cutting point, and uses the target cutting speed and target laser energy to perform laser cutting on the object to be cut at the current cutting point, and the current position data corresponding to the current cutting point. Specifically, after obtaining the laser cutting request, the cutting device determines whether the current position data corresponding to the current cutting point is consistent with the position data corresponding to the starting cutting point. If the current position data corresponding to the current cutting point is consistent with the position data corresponding to the starting cutting point, the laser is controlled to output the target laser energy to perform laser cutting on the object to be cut. If the current position data corresponding to the current cutting point is inconsistent with the position data corresponding to the starting cutting point, the laser is controlled to move to the starting cutting point and perform laser cutting on the object to be cut to ensure that the cutting effect of the cutting edge of the object to be cut is consistent.

[0059] S14: When the current cutting point is not the end cutting point, based on the target cutting parameters and the current position data corresponding to the current cutting point, obtain the cutting control parameters corresponding to the next cutting point, update the next cutting point to the current cutting point, repeat the cutting control parameters based on the current cutting point, cut the current cutting point corresponding to the object to be cut, and obtain the current position data corresponding to the current cutting point.

[0060] As an example, the current cutting point is the starting cutting point. If the current position data corresponding to the current cutting point is consistent with the position data corresponding to the starting cutting point, laser cutting is performed on the object to be cut at the current cutting point, and the next cutting point adjacent to the starting cutting point is updated as the current cutting point. The target cutting speed is used to move from the previous cutting point to the updated current cutting point, that is, from the starting cutting point to the next adjacent cutting point. In other words, the current cutting point corresponding to the cutting control parameters corresponding to the current cutting point is repeatedly cut, and the current cutting point corresponding to the object to be cut is obtained. If the current cutting point is a configured cutting point, and the current position data corresponding to the current cutting point is consistent with the position data corresponding to the modified configured cutting point, laser cutting is performed on the object to be cut at the current cutting point, and the configured cutting point adjacent to the configured cutting point is updated as the current cutting point. The target cutting speed is used to move from the previous cutting point to the updated current cutting point, that is, from the previous cutting point to the next cutting point. The current cutting point corresponding to the cutting control parameters corresponding to the current cutting point is repeatedly cut, and the current cutting point corresponding to the object to be cut is obtained. The current position data corresponding to the current cutting point is obtained. If the current cutting point is the end cutting point, the cutting control parameters corresponding to the current cutting point are stopped, and the object to be cut is cut at the current cutting point.

[0061] It should be noted that, because the target cutting speed of existing cutting technology varies when running a special-shaped target cutting trajectory, while the frequency of the target laser energy is fixed, the cutting edge of the object to be cut has inconsistent processing effects.

[0062] In this embodiment, the cutting device obtains a laser cutting request to perform laser cutting on the object to be cut according to the target cutting parameters in the laser cutting request; the cutting device outputs target laser energy of the same size to each configured cutting point based on the feature that the distances between multiple configured cutting points in the target cutting trajectory are equal, thereby ensuring that the cutting effect of the cutting edge of the object to be cut is consistent.

[0063] In one embodiment, the target cutting parameters include a target cutting trajectory and initial control parameters; the target cutting trajectory includes a plurality of configured cutting points, such as Figure 3 As shown, in step S12, based on the target cutting parameters, the cutting control parameters corresponding to the current cutting point are obtained, including:

[0064] S21: Based on the target cutting trajectory, determine the current cutting point from multiple configured cutting points.

[0065] S22: Based on the initial control parameters, obtain the cutting control parameters corresponding to the current cutting point.

[0066] As an example, the cutting device sequentially determines the current cutting point based on the order of multiple configured cutting points within the target cutting trajectory. For example, after receiving a laser cutting request, the cutting device determines the first configured cutting point within the target cutting trajectory, also known as the starting cutting point, as the current cutting point. Furthermore, after the cutting device cuts the starting cutting point within the target cutting trajectory, it determines the configured cutting point adjacent to the first configured cutting point as the current cutting point, and this continues until the last configured cutting point is cut.

[0067] As another example, the initial control parameters include a target cutting speed and a target laser energy. The cutting device then obtains the cutting control parameters corresponding to the current cutting point from the initial control parameters. It should be noted that the target cutting speeds may vary between different current cutting points, but the target laser energy corresponding to each configured cutting point remains the same to ensure consistent cutting results along the cutting edge of the object being cut.

[0068] In this embodiment, the cutting device determines the current cutting point from multiple configured cutting points based on the target cutting trajectory; and obtains the cutting control parameters corresponding to the current cutting point from the initial control parameters to ensure consistent cutting effects on the cutting edges of the object to be cut.

[0069] In one embodiment, if Figure 4As shown, in step S14, when the current cutting point is not the end cutting point, based on the target cutting parameters and the current position data corresponding to the current cutting point, the cutting control parameters corresponding to the next cutting point are obtained, and the next cutting point is updated to the current cutting point, including:

[0070] S31: If the current cutting point is not the end cutting point, determine whether the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point corresponding to the current cutting point.

[0071] S32: If the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point corresponding to the current cutting point, a pulse cutting signal is generated.

[0072] S33: Based on the pulse cutting signal, output a target laser corresponding to the target laser energy, and based on the target cutting trajectory and the initial control parameters, obtain a cutting control parameter corresponding to the next cutting point.

[0073] The pulse cutting signal is a signal that instructs the laser to output a target laser corresponding to the target laser energy. The laser may be a Draco picosecond laser with integrated POD (Pulse On Demand) functionality. The Draco picosecond laser can output a target laser corresponding to the target laser energy by receiving the pulse cutting signal.

[0074] As an example, when the current cutting point is not the end cutting point, that is, when the current cutting point is not the last configured cutting point, if the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point corresponding to the current cutting point, that is, the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point in the target cutting trajectory, then it means that the position of the laser is the correct cutting position. Since the distances between multiple configured cutting points in the target cutting trajectory are equal, the current position data corresponding to the current cutting point is consistent with the position data corresponding to the configured cutting point, then the target laser corresponding to the target laser energy is output, and based on the target cutting trajectory and the initial control parameters, the cutting control parameters corresponding to the next cutting point are obtained to achieve uniform cutting of the object to be cut.

[0075] In this embodiment, the cutting device generates a pulse cutting signal when the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point corresponding to the current cutting point, and outputs a target laser corresponding to the target laser energy based on the pulse cutting signal, and obtains the cutting control parameters corresponding to the next cutting point based on the target cutting trajectory and the initial control parameters, so as to achieve uniform cutting of the object to be cut, and further make the cutting effect of the cutting edge of the object to be cut consistent.

[0076] In one embodiment, if Figure 5As shown, in step S33, based on the target cutting trajectory and the initial control parameters, the cutting control parameters corresponding to the next cutting point are obtained, including:

[0077] S41: If the current cutting point is not the end cutting point, the configured cutting point adjacent to the configured cutting point corresponding to the current cutting point is determined as the next cutting point, and the cutting control parameters corresponding to the next cutting point are obtained based on the initial control parameters.

[0078] S42: If the current cutting point is a configured cutting point, a configured cutting point adjacent to the configured cutting point is determined as the next cutting point, and a cutting control parameter corresponding to the next cutting point is obtained based on the initial control parameter.

[0079] S43: If the current cutting point is the end cutting point, then the execution ends to obtain the cutting control parameters corresponding to the next cutting point.

[0080] As an example, if the current cutting point is the starting cutting point, that is, the first configured cutting point, after the cutting equipment performs laser cutting on the current cutting point, the configured cutting point adjacent to the starting cutting point in the target cutting trajectory is determined as the next cutting point, and based on the initial control parameters, the cutting control parameters corresponding to the next cutting point are obtained.

[0081] As another example, if the current cutting point is not the first configured cutting point or the last configured cutting point, after the cutting device performs laser cutting on the current cutting point, the configured cutting point adjacent to the configured cutting point in the target cutting trajectory is determined as the next cutting point, and based on the initial control parameters, the cutting control parameters corresponding to the next cutting point are obtained.

[0082] As another example, if the current cutting point is the end cutting point, the process of obtaining the cutting control parameters corresponding to the next cutting point is terminated.

[0083] In this embodiment, since the distances between multiple configured cutting points are equal; when the current cutting point is not the first configured cutting point or the last configured cutting point, after the cutting equipment performs laser cutting on the current cutting point, the configured cutting point adjacent to the configured cutting point in the target cutting trajectory is determined as the next cutting point, and based on the initial control parameters, the cutting control parameters corresponding to the next cutting point are obtained, which can ensure that the cutting effect of the cutting edge of the object to be cut is consistent.

[0084] In one embodiment, the brittle material laser cutting system includes a grating scale reading head connected to the cutting device, such as Figure 6 As shown, in step S13, the current position data corresponding to the current cutting point is obtained, including:

[0085] S51: Receive in real time the real-time position data corresponding to the current cutting point collected by the grating ruler reading head.

[0086] S52: Acquire X-axis position data and Y-axis position data from the real-time position data.

[0087] S53: Based on the X-axis position data and the Y-axis position data, current position data is acquired.

[0088] The grating ruler readout head has a 0.1µm resolution. The real-time position data is the position data corresponding to the current cutting point. The X-axis position data is the position data of the current cutting point in the X-axis direction. The Y-axis position data is the position data of the current cutting point in the Y-axis direction.

[0089] In this embodiment, the cutting device receives real-time position data corresponding to the current cutting point collected by the grating scale reading head, obtains X-axis position data and Y-axis position data from the real-time position data, and obtains current position data based on the X-axis position data and Y-axis position data. As can be understood, because the grating scale reading head has a 0.1 μm resolution, it can accurately obtain the current position data corresponding to the current cutting point, thereby improving the cutting accuracy of the cutting device.

[0090] In one embodiment, the target cutting trajectory includes a straight cutting trajectory and a non-straight cutting trajectory; the initial control parameters include a first preset acceleration and a second preset acceleration, such as Figure 7 As shown, in step S13, based on the cutting control parameters corresponding to the current cutting point, the current cutting point corresponding to the object to be cut is cut, and the following steps are also included:

[0091] S61: Based on the straight-line cutting trajectory, the object to be cut is cut using a first preset acceleration according to the straight-line cutting trajectory.

[0092] S62: Based on the non-linear cutting trajectory, the object to be cut is cut using a second preset acceleration according to the non-linear cutting trajectory.

[0093] The linear cutting trajectory is a linear cutting trajectory. The first preset acceleration is the acceleration used to accelerate the target cutting speed when the target cutting trajectory is a linear cutting trajectory. The non-linear cutting trajectory is a non-linear cutting trajectory. For example, non-linear cutting trajectories include but are not limited to curved cutting trajectories and corner cutting trajectories. The second preset acceleration is the acceleration used to accelerate the target cutting speed when the target cutting trajectory is a non-linear cutting trajectory. The first preset acceleration is greater than the second preset acceleration.

[0094] As an example, when the target cutting trajectory is a straight cutting trajectory, that is, a straight cutting trajectory, the cutting device needs to control the driver to drive the cutting device along the target cutting trajectory to cut the object to be cut. Thus, when the target cutting trajectory is a straight cutting trajectory, since the straight cutting trajectory is a straight line, the driver can use a larger acceleration, that is, a first preset acceleration, to accelerate the target cutting speed to improve cutting efficiency. However, if the first preset acceleration is too large, the cutting device may deviate from the straight cutting trajectory.

[0095] As another example, when the target cutting trajectory is a non-linear cutting trajectory, that is, a non-linear cutting trajectory, such as a curved cutting trajectory. Since the curved cutting trajectory is a curve, when the driver drives the cutting device to perform curved cutting, if a larger acceleration is used, the target cutting speed will be accelerated. Due to the larger acceleration, the cutting device will deviate from the curved cutting trajectory. Therefore, when the target cutting trajectory is a non-linear cutting trajectory, since the second preset acceleration is less than the first preset acceleration, the second preset acceleration is used to accelerate the target cutting speed, thereby preventing the cutting device from deviating from the non-linear cutting trajectory and improving the reliability of the cutting device in laser cutting the object to be cut when the target cutting trajectory is a non-linear cutting trajectory.

[0096] Understandably, this embodiment can accelerate the target cutting speed using the first preset acceleration and the second preset acceleration for different target cutting trajectories, i.e., linear cutting trajectories and non-linear cutting trajectories, respectively. This ensures cutting efficiency while preventing the cutting device from deviating from the target cutting trajectory, thereby improving the reliability of laser cutting of the object being cut. Furthermore, this allows the cutting device to adapt to a wider range of cutting scenarios.

[0097] In this embodiment, if the target cutting trajectory is a straight line, the cutting device uses a first preset acceleration to cut the object along the straight line. If the target cutting trajectory is a non-linear line, the cutting device uses a second preset acceleration to cut the object along the non-linear line. This ensures cutting efficiency while preventing the cutting device from deviating from the target cutting trajectory, improving the reliability of laser cutting of the object. This also enables the cutting device to adapt to a wider range of cutting scenarios.

[0098] In one embodiment, the brittle material laser cutting system further comprises a driver, such as Figure 8 As shown, before step S11, before the cutting device is connected to the driver and before the laser cutting request is obtained, the brittle material laser cutting method further includes:

[0099] S71: Get a debugging request.

[0100] S72: If the debugging request is an automatic debugging request, the position loop, speed loop and current loop of the driver are debugged using a preset debugging program.

[0101] S73: If the debugging request is a manual debugging request, obtain the driver debugging parameters, and debug the position loop, speed loop, and current loop of the driver based on the driver debugging parameters.

[0102] A debug request is a request to debug the driver. A position loop is a parameter corresponding to the driver's position. A speed loop is a parameter corresponding to the cutting speed of the driver's cutting device. A current loop is a parameter corresponding to the driver's driving current. An automatic debug request is a request to automatically debug the driver. A preset debug program is a program for automatically debugging the driver. A manual debug request is a request to instruct the cutting device to debug the driver according to the driver's debug parameters. Driver debug parameters are parameters used to debug the driver.

[0103] As an example, the cutting device obtains a debugging request, and based on the debugging request, debugs the position loop, speed loop, and current loop of the driver, which can improve the accuracy of the cutting device when performing laser cutting on the object to be cut according to the target cutting trajectory.

[0104] In this embodiment, if the debugging request is automatic, a preset debugging program is used to debug the position, velocity, and current loops of the driver. If the debugging request is manual, driver debugging parameters are obtained and, based on these parameters, the position, velocity, and current loops of the driver are debugged. It is understood that the cutting device can debug the driver according to different debugging requests, improving the applicability of the cutting device and, at the same time, enhancing the accuracy of the cutting device when performing laser cutting on the target cutting path.

[0105] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0106] In one embodiment, a brittle material laser cutting system is provided, such as Figure 1As shown, it includes a linear platform, a cutting device and a driver; the cutting device includes a laser and a cutting controller; the cutting device is connected to the linear platform and the driver; the cutting controller includes a laser cutting program that can be run on the cutting controller and is connected to the laser, and the linear platform includes a grating reading head with a resolution of 0.1um; when the cutting controller executes the cutting control program, the laser cutting method of brittle materials in the above embodiment is implemented, such as steps S11 to S14. To avoid repetition, they are not repeated here.

[0107] In one embodiment, a cutting device is provided, including a memory, a laser, a cutting controller, and a cutting control program stored in the memory and executable on the cutting controller. The cutting controller is connected to the laser. When the cutting controller executes the cutting control program, the laser cutting method for brittle materials in the above-mentioned embodiment is implemented, such as steps S11 to S14. To avoid repetition, they are not described here.

[0108] In one embodiment, a readable storage medium is provided, on which a cutting control program is stored. When the cutting control program is executed by a processor, the laser cutting method for brittle materials in the above embodiment is implemented, such as steps S11 to S14. To avoid repetition, they are not repeated here.

[0109] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a cutting control program. The cutting control program can be stored in a non-volatile computer-readable storage medium. When the cutting control program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0110] Those skilled in the art will clearly understand that for the sake of convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0111] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A brittle material laser cutting method, applied to a brittle material laser cutting system, wherein the brittle material laser cutting system comprises a cutting device, characterized in that: The cutting device comprises the following steps: Obtaining a laser cutting request, wherein the laser cutting request includes target cutting parameters; Based on the target cutting parameters, obtaining cutting control parameters corresponding to the current cutting point; Based on the cutting control parameters corresponding to the current cutting point, cutting the object to be cut corresponding to the current cutting point, and obtaining current position data corresponding to the current cutting point; When the current cutting point is not the end cutting point, based on the target cutting parameter and the current position data corresponding to the current cutting point, the cutting control parameter corresponding to the next cutting point is obtained, the next cutting point is updated as the current cutting point, and the cutting control parameter corresponding to the current cutting point is repeatedly executed to cut the current cutting point corresponding to the object to be cut, and the current position data corresponding to the current cutting point is obtained; Wherein, the target cutting parameters include a target cutting trajectory and initial control parameters; the target cutting trajectory includes a plurality of configured cutting points; The obtaining of the cutting control parameters corresponding to the current cutting point based on the target cutting parameters includes: determining a current cutting point from a plurality of configured cutting points based on the target cutting trajectory; Based on the initial control parameters, obtaining cutting control parameters corresponding to the current cutting point; When the current cutting point is not the end cutting point, obtaining a cutting control parameter corresponding to a next cutting point based on the target cutting parameter and the current position data corresponding to the current cutting point, and updating the next cutting point as the current cutting point, includes: If the current cutting point is not the end cutting point, determining whether the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point corresponding to the current cutting point; If the current position data corresponding to the current cutting point is consistent with the position data of the configured cutting point corresponding to the current cutting point, a pulse cutting signal is generated; Based on the pulse cutting signal, a target laser corresponding to the target laser energy is output, and based on the target cutting trajectory and the initial control parameters, a cutting control parameter corresponding to the next cutting point is obtained.

2. The laser cutting method for brittle materials according to claim 1, wherein: The obtaining of cutting control parameters corresponding to the next cutting point based on the target cutting trajectory and the initial control parameters includes: If the current cutting point is not the end cutting point, the configured cutting point adjacent to the configured cutting point corresponding to the current cutting point is determined as the next cutting point, and the cutting control parameters corresponding to the next cutting point are obtained based on the initial control parameters; If the current cutting point is the end cutting point, the execution ends and the cutting control parameters corresponding to the next cutting point are obtained.

3. The laser cutting method for brittle materials according to claim 1, wherein: The brittle material laser cutting system includes a grating scale reading head connected to the cutting device; The obtaining of the current position data corresponding to the current cutting point includes: Receiving real-time position data corresponding to the current cutting point collected by the grating ruler reading head in real time; Acquire X-axis position data and Y-axis position data from the real-time position data; The current position data is acquired based on the X-axis position data and the Y-axis position data.

4. The laser cutting method for brittle materials according to claim 1, wherein: The target cutting trajectory includes a linear cutting trajectory and a non-linear cutting trajectory; the initial control parameters include a first preset acceleration and a second preset acceleration; The cutting control parameter corresponding to the current cutting point is used to cut the object to be cut, and the cutting control parameter is used to cut the object to be cut. The ... Based on the linear cutting trajectory, using a first preset acceleration, cutting the object to be cut according to the linear cutting trajectory; Based on the non-linear cutting trajectory, the object to be cut is cut according to the non-linear cutting trajectory using a second preset acceleration.

5. The laser cutting method for brittle materials according to claim 1, wherein: The brittle material laser cutting system further includes a driver; the cutting device is connected to the driver, and before obtaining the laser cutting request, the brittle material laser cutting method further includes: Get debug request; If the debugging request is an automatic debugging request, the position loop, speed loop and current loop of the driver are debugged using a preset debugging program; If the debugging request is a manual debugging request, driver debugging parameters are obtained, and based on the driver debugging parameters, the position loop, speed loop, and current loop of the driver are debugged.

6. A brittle material laser cutting system comprising a linear platform, a cutting device, and a driver; the cutting device comprising a laser and a cutting controller; the cutting device being connected to the linear platform and the driver; the cutting controller comprising a laser cutting program executable on the cutting controller and being connected to the laser, characterized in that: The linear platform includes a grating reading head with a resolution of 0.1um; when the cutting controller executes the laser cutting program, the laser cutting method for brittle materials as described in any one of claims 1 to 5 is implemented.

7. A cutting device comprising a memory, a laser, a cutting controller, and a cutting control program stored in the memory and operable on the cutting controller, wherein the cutting controller is connected to the laser, characterized in that: When the cutting controller executes the cutting control program, the brittle material laser cutting method according to any one of claims 1 to 5 is implemented.

8. A readable storage medium storing a cutting control program, characterized in that: When the cutting control program is executed by the cutting controller, the brittle material laser cutting method according to any one of claims 1 to 5 is implemented.

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