Testing Instrument and Its Testing Method

Abstract

The present invention discloses a testing instrument and a testing method thereof. The testing instrument includes a testing platform, a loading device, a testing signal generating device, a sound sensing device, a control unit, and an unloading device. The loading device is used to load a plurality of devices under test onto the testing platform. The testing signal generating device is configured to generate at least one testing signal, wherein the plurality of devices under test receive the at least one testing signal and generate at least one testing sound according to the at least one testing signal. The sound sensing device is used to receive the at least one testing sound. The control unit controls the unloading device to unload the plurality of devices under test from the testing platform, and controls the unloading device to classify the plurality of devices under test into a plurality of groups according to the at least one testing sound received by the sound sensing device.

Description

Technical Field

[0001] This application relates to a test instrument and a test method thereof, and particularly to a test instrument and a test method thereof that can improve the detection efficiency and quality. Background Art

[0002] Microelectromechanical Systems (MEMS) acoustic transducers are typically fabricated in wafer form during the semiconductor manufacturing process. After the semiconductor manufacturing process, the wafer is separated into individual MEMS dies in a singular / sawing process, and then assembled into a protective packaging structure during the packaging process.

[0003] Testing is the process of attempting to separate defective products from non-defective products. Manufacturers are committed to the rapid and accurate acoustic testing of MEMS acoustic transducers. However, MEMS acoustic transducers are typically tested manually, which presents various challenges and consumes time, money, and effort. Manual testing limits the number of MEMS acoustic transducers that can be tested at one time. During the testing process, the MEMS acoustic transducer is attached to a test board and placed next to a microphone inside an acoustic chamber. It is difficult to stably and quickly transfer between a first position outside the acoustic chamber in the exposed state and a second position inside the acoustic chamber in the shielded state. Sound insulation problems also exist in manual testing. The distance between the MEMS acoustic transducer and the microphone needs to be manually corrected / adjusted each time, which reduces the accuracy.

[0004] Therefore, there is still room for improvement in the acoustic testing of MEMS acoustic transducers. Summary of the Invention

[0005] Therefore, the main objective of the present invention is to provide a test instrument and a test method thereof that can improve the detection efficiency and quality.

[0006] An embodiment of this application discloses a test instrument, including a test platform; a loading device for loading a plurality of devices under test onto the test platform; a test signal generating device for generating at least one test signal, wherein the plurality of devices under test receive the at least one test signal and generate at least one test sound according to the at least one test signal; a sound sensing device for receiving the at least one test sound; a control unit; and an unloading device, wherein the control unit controls the unloading device to unload the plurality of devices under test from the test platform and controls the unloading device to classify the plurality of devices under test into a plurality of groups according to the at least one test sound received by the sound sensing device.

[0007] An embodiment of the present application discloses a testing method, including loading a plurality of devices under test onto a test platform by means of a testing instrument; generating at least one test signal; the plurality of devices under test receiving the at least one test signal and generating at least one test sound according to the at least one test signal; and classifying the plurality of devices under test into a plurality of groups by means of the testing instrument according to the at least one test sound received by a sound sensing device.

[0008] An embodiment of the present application discloses a testing method, including generating a plurality of test signals, wherein the plurality of test signals have a plurality of tones; transmitting the plurality of test signals having the plurality of tones to a plurality of devices under test; the plurality of devices under test generating a test sound according to the plurality of test signals; and classifying the plurality of devices under test into a plurality of groups according to the test sound.

[0009] The present application uses a conventional semiconductor testing process for mass production to ensure high reliability and obtain high throughput. Description of the Drawings

[0010] Figure 1 is a schematic diagram of an acoustic testing system according to an embodiment of the present application;

[0011] Figure 2 is a schematic diagram of a device under test according to an embodiment of the present application;

[0012] Figure 3 is a schematic diagram of a socket, a sound sensing device and Figure 2 the device under test shown;

[0013] Figure 4 is a schematic diagram of the socket, the sound sensing device and the device under test shown when the socket is open / exposed; Figure 3 is a schematic diagram of the socket, the sound sensing device and the device under test shown when the socket is closed / shielded;

[0014] Figure 5 is a schematic diagram of the socket and the sound sensing device shown when the socket is closed / shielded; Figure 3 is a schematic diagram of the socket, the sound sensing device and the device under test shown when the socket is closed / shielded;

[0015] Figure 6 is Figure 3 a schematic diagram of the socket and the sound sensing device shown;

[0016] Figure 7 is a schematic diagram of a device under test according to an embodiment of the present application;

[0017] Figure 8 is a schematic diagram of a socket, a sound sensing device and Figure 7 the device under test shown in an exploded view;

[0018] Figure 9 is when the socket is open / exposed,Figure 8 Schematic diagram of the shown socket, sound sensing device and device under test;

[0019] Figure 10 When the socket is closed / shielded, Figure 8 Schematic diagram of the shown socket, sound sensing device and device under test;

[0020] Figure 11 and Figure 12 and Figure 13 are Figure 8 Schematic diagram of the shown socket and sound sensing device;

[0021] Figure 14 Schematic diagram of the socket, sound sensing device and device under test in Embodiment 1 of the present application;

[0022] Figure 15 Schematic diagram of the acoustic test system in Embodiment 1 of the present application;

[0023] Figure 16 Schematic diagram of the acoustic test system in Embodiment 1 of the present application.

[0024] Among them, the description of the reference numerals is as shown in Table 1 below:

[0025] Table 1 Reference Numerals

[0026] 10 Acoustic testing system DUT1 Device under test 110 Testing instrument 111 Footrest 112 Testing platform 113 Loading device 114 Testing signal generating device 116 Tester 117 Unloading device 119 Control unit Detailed Embodiment

[0027] The test method disclosed in the present application utilizes a conventional semiconductor test process for mass production to ensure high reliability and obtain high throughput. However, compared with the conventional semiconductor test process, since the purpose of the present application is to (finally) test (semiconductor-packaged) speakers, a microphone is provided in a test instrument of the present application. In addition, in order to improve the detection quality, the test instrument of the present application further includes a sealing member to prevent the air pressure change in a rear / second sub-chamber of the speaker from interfering with the air pressure change in a front / first sub-chamber of the speaker during the test.

[0028] Figure 1 Schematic diagram of the acoustic test system 10 in Embodiment 1 of the present application. The acoustic test system 10 includes a device under test DUT1 and a test instrument 110. The test instrument 110 is similar to a conventional handler. As is well known in the art, this handler is usually used for the final test in the manufacture of semiconductor devices for mass production. As a handler, the test instrument 110 may include a socket 111, a test platform 112, a loading device 113, a test signal generating device 114, a tester 116, an unloading device 117, and a control unit 119. Using the test instrument 110, a large number of tests can be automatically performed.

[0029] Unlike a conventional handler for the final test of semiconductor devices not used for sound generation, the test instrument 110 for acoustic testing further includes a sound sensing device (e.g., Figure 3 a sound sensing device 315 among them), which is for the final test of sound-emitting devices used in semiconductor process manufacturing (especially mass production).

[0030] The control unit 119 can be a controller or a control circuit, and its implementation / mode of implementation can be a processing circuit (e.g., a central processing unit (CPU), a microcontroller unit (MCU), or a controller), a logic or digital circuit, or an application specific integrated circuit (ASIC), which is not limited thereto. As long as the control unit 119 can be programmed to execute certain control programs, the requirements for the control unit 119 are met.

[0031] The loading device 113 moves the device under test DUT1 from a tray / carrier and loads the device under test DUT1 onto the test platform 112. The loading device 113 can be a robotic arm to perform the automated actions of picking up and placing the device under test DUT1, and thus can be implemented by a loader of a conventional semiconductor test instrument.

[0032] The test signal generating device 114 is used to generate test signals (such as Figure 16 the direct current (DC) voltage Vdc or the input signal Sn16 shown). After the loading device 113 places the device under test DUT1 on the test platform 112, each device under test DUT1 can receive the test signal and then generate a test sound according to the test signal (e.g., Figure 16 the test sound TS16 among them).

[0033] The sound sensing device installed on the test platform 112 receives the test sound. Each sound sensing device can be implemented by a microphone.

[0034] The unloading device 117 is used to remove the device under test DUT1 from the test platform 112. The unloading device 117 can be a robotic arm and thus can be implemented by an unloader of a conventional semiconductor test instrument.

[0035] The control unit 119 controls the unloading device 117 to unload the device under test (DUT) 1 from the test platform 112 and controls the unloading device 117 to classify the DUT 1 into different groups according to the test sound, which is generated by the DUT 1 and received by the sound sensing device. For example, the test sound can be analyzed (by the tester 116) to judge the performance of the DUT 1 corresponding to the test sound. Then, the control unit 119 can notify the unloading device 117 which bin / tray to assign the DUT 1 to according to the results of the test / analysis. If the test sound meets specific requirements, the DUT 1 is classified into a pass group or a first type of group. Otherwise, the DUT 1 is classified into a fail group or other type of group.

[0036] In summary, the test instrument 110 uses a conventional semiconductor test instrument for mass production to ensure high reliability and obtain high throughput. In addition, the sound sensing device of the test instrument 110 facilitates the acoustic test of the DUT 1.

[0037] The socket 111 disposed on the test platform 112 of the test instrument 110 (the kit / foot board 111b with pogo pins) can be designed into a more complex form according to the structure of the DUT 1 to improve the test quality and / or the quality of the generated test sound.

[0038] Specifically, different from the socket on a traditional loader / unloader, the socket of the present application may further include a sealing member. The sealing member is used to isolate the first chamber formed in the DUT from the second chamber to achieve better test sound quality.

[0039] For example, Figure 2 is a schematic diagram of a DUT 2 according to the first embodiment of the present application. Figure 3 is an exploded schematic diagram of the socket 311, the sound sensing device 315 and Figure 2 the DUT 2 shown in the first embodiment of the present application. Figure 4 is a schematic diagram of the socket 311, the sound sensing device 315 and the DUT 2 when the socket 311 is opened / exposed. Figure 5 is a schematic diagram of the socket 311, the sound sensing device 315 and the DUT 2 when the socket 311 is closed / shielded. Figure 6 is a schematic diagram of the socket 311 and the sound sensing device 315.

[0040] Figure 2 In (a) of Figure 2 shows a view of the DUT 2. Figure 2 In (b) of Figure 2As shown, the device under test DUT2 may include a base 210, a chip 220, a cover 230, and a chamber CB. The device under test DUT2 may have a packaging structure similar to that disclosed in U.S. Application No. 16 / 699,078, which is incorporated herein by reference.

[0041] The chip 220 may include a diaphragm 222 and an actuator 224 (which may be similar to that disclosed in U.S. Application No. 16 / 920,384 or 16 / 699,078, which is incorporated herein by reference). The diaphragm 222 is used to generate a test sound (e.g., by generating an air pulse), and may divide the chamber CB into a front / first sub-chamber CB1 and a rear / second sub-chamber CB2. The front / first sub-chamber CB1 is located between the diaphragm 222 and the cover 230, and the rear / second sub-chamber CB2 is located between the diaphragm 222 and the base 210.

[0042] The cover 230 of the device under test DUT2 may have an outlet S02 connected to the front / first sub-chamber CB1, such that the test sound generated by the diaphragm 222 can propagate outwards through the outlet S02. The outlet S02 may be located on the upper side of the chip 220 and may face the diaphragm 222 (parallel to the upper side). Therefore, the device under test DUT2 can be classified as a top-emitting sound-generating device. In other words, top emission refers to a packaging structure in which an outlet is formed in the top structure / plate of the cover 230, and the top structure / plate of the cover 230 is (substantially) parallel to the diaphragm 222. Figure 2 As shown, and the top structure / plate of the cover 230 is (substantially) parallel to the diaphragm 222.

[0043] The base 210 of the device under test DUT2 may have a rear opening B02 connected to the rear / second sub-chamber CB2 to allow air to flow freely in / out, and / or bonding pads BP3 are provided on the outermost side of the base 210. The size of the rear opening B02 is less than or equal to the size of the outlet S02. The bonding pads BP3 can be electrically connected to the chip 220 by traces / wires, such that the actuator 224 of the chip 220 can receive signals such as test signals from the outside.

[0044] Figure 4 and Figure 5 Illustrates the operating principle of the socket 311. The socket 311 may include a socket cover 311C and a socket base 311B. The socket base 311B can be mounted / fixed on the test platform 112. After the loading device 113 picks up the device under test DUT2 and places the device under test DUT2 on the socket 311 as shown in Figure 4 as shown, the socket cover 311C can apply a moderate force downward to the top of the device under test DUT2 and / or the top of the socket base 311B, so as to as shown in Figure 5As shown, the socket cover 311C is brought into contact with the device under test DUT2 and / or the socket base 311B. The device under test DUT2 can thus be inserted between the socket cover 311C and the socket base 311B for rapid automated (final) testing.

[0045] As Figure 3 shown, the socket cover 311C can include socket cover components 311C1 to 311C3, (elastic) spring pins 311PGP, and / or a printed circuit board 311PCB. The socket cover components 311C1 to 311C3 are separate components that are assembled to fix / accommodate the printed circuit board 311PCB and the spring pins 311PGP.

[0046] During the test, as Figure 5 shown, the (open / exposed) socket base 311B is enclosed / shielded by the socket cover 311C. The bonding pads BP3 of the device under test DUT2 can be connected to the printed circuit board 311PCB by the spring pins 311PGP (or in other embodiments by other pressure-type connectors), and the test signal generating device 114 can be connected to the printed circuit board 311PCB. In this way, test signals are sent from the test signal generating device 114 to the device under test DUT2, and the device under test DUT2 can generate test sounds downward according to the test signals.

[0047] To discharge air from the rear / second sub-chamber CB2 to the outside, the socket cover components 311C1 to 311C3 and the printed circuit board 311PCB respectively have openings 311C1h to 311C3h and 311PCBh. As Figure 5 shown, the openings 311C1h to 311C3h and 311PCBh of the socket 311 are designed according to the distribution of the rear opening B02 of the device under test DUT2 to allow free in / out air flow. Taking the socket cover component 311C3 as an example: the area of the opening 311C3h is greater than or equal to the distribution area of the rear opening B02, which can be distributed in the central region of the base 210 of the device under test DUT2. The opening 311C3h overlaps all the rear openings B02.

[0048] As Figure 3As shown, the pedestal base 311B may include pedestal base components 311B1 to 311B2, a sealing component 311SG, a silicone bar 311SB, and / or a silicone ring 311SR. The pedestal base components 311B1 to 311B2 and the pedestal plate 111b are separate components, which are assembled to fix / accommodate the sealing component 311SG, the silicone bar 311SB, the silicone ring 311SR, and the sound sensing device 315. For example, the area / perimeter / profile of an opening 311B1h of the pedestal base component 311B1 is similar to (the same as or matches) the area / perimeter / profile of the device under test DUT2, such that the device under test DUT2 can be fixed or clamped in the opening 311B1h.

[0049] To send a test sound from the sound outlet S02 of the device under test DUT2, the pedestal base component 311B2 and the sealing component 311SG respectively have openings 311B2h, 311SGh. As Figure 5 shown, the openings 311B2h and 311SGh of the pedestal 311 are designed according to the size of the sound outlet S02 of the device under test DUT2, so as to output the test sound to the sound sensing device 315, for example. Taking the sealing component 311SG as an example: the area of the opening 311SGh is greater than or equal to the area of the sound outlet S02 to prevent the sealing component 311SG from blocking / covering the sound outlet S02. The opening 311SGh overlaps the sound outlet S02. The geometric center of the sound outlet S02 is generally aligned with the geometric center of the opening 311SGh of the sealing component 311SG or the geometric center of a receiving surface 315r of the sound sensing device 315.

[0050] As Figure 5 shown, the pedestal base components 311B1 to 311B2, the sealing component 311SG, and the silicone ring 311SR erect a barrier to prevent noise from infiltrating and limit the test sound in the enclosed space surrounded by the pedestal base components 311B1 to 311B2, the sealing component 311SG, and the sound sensing device 315.

[0051] More specifically, when the device under test DUT2 (sent to the test platform 112 by the loading device 113) generates a test sound according to the test signal, the sealing component 311SG (as a gasket) of the pedestal 311 is used as Figure 5As shown, the front / first sub-chamber CB1 of the device under test DUT2 is separated from the rear / second sub-chamber CB2 of the test instrument DUT2. Therefore, when the diaphragm 222 of the device under test DUT2 vibrates to cause a slight change in air pressure, the change in air pressure in the rear / second sub-chamber CB2 will not interfere with the change in air pressure in the front / first sub-chamber CB1. The change in air pressure in the front / first sub-chamber CB1 travels as waves through the openings 311B1h - 311B2h, 311SGh of the pedestal base 311B and is detected / measured by the sound sensing device 315.

[0052] The sealing member 311SG can be made of a material with a certain degree of flexibility, such that the sealing member 311SG can deform to tightly fill the space it is designed to fill, and / or seal the (slightly irregular) gap between the pedestal base members 311B1 - 311B2 and the device under test DUT2. The sealing member 311SG can be made of silicone; alternatively, the sealing member 311SG can be made of paper, rubber, metal, cork, felt, neoprene, nitrile rubber, fiberglass, polytetrafluoroethylene (PTFE or Teflon), or a plastic polymer such as polychlorotrifluoroethylene. The hardness of the sealing member 311SG can be 20 newtons per square millimeter (N / mm 2 , newtons per square millimeter).

[0053] In summary, the pedestal base 311B of the pedestal 311 has openings 311B1h - 311B2h, 311SGh for the test sound from the device under test DUT2 to pass through and travel outward to the sound sensing device 315. The sealing member 311SG (under compression) can prevent air from leaking from the rear / second sub-chamber CB2 into the front / first sub-chamber CB1 during the test, such that the change in air pressure in the rear / second sub-chamber CB2 travels through the openings 311C1h - 311C3h and 311PCBh of the pedestal cover 311C of the pedestal 311 without interfering with the pressure change in the front / first sub-chamber CB1. These improve the test quality and / or enhance the quality of the generated test sound.

[0054] The structure of the pedestal 311 can change according to the structure of the device under test DUT2. For example, Figure 7 is a schematic diagram of the device under test DUT7 in the first embodiment of this application. Figure 8 is an exploded schematic diagram of the pedestal 811, the sound sensing device 315 and Figure 7 the device under test DUT7 shown. Figure 9It is a schematic diagram of the pedestal 811, the sound sensing device 315, and the device under test DUT7 when the pedestal 811 is open / exposed. Figure 10 It is a schematic diagram of the pedestal 811, the sound sensing device 315, and the device under test DUT7 when the pedestal 811 is closed / shielded. Figures 11 - 13 It is a schematic diagram of the pedestal 811 and the sound sensing device 315.

[0055] Figure 7 In (a) shows a view of the device under test DUT7. Figure 7 In (b) shows a cross-sectional view along a cross-sectional plane CSP7 as shown in Figure 7 In (a). Compared with the sound outlet S02 of the cover 230 of the device under test DUT2 shown in Figure 2 the sound outlet S07 of a cover 730 of the device under test DUT7 shown in Figure 7 can be located on the side of the chip 220 (perpendicular to the diaphragm 222 of the chip 220). Therefore, the device under test DUT7 can be classified as a side-emitting sound device. In other words, side emission refers to a package structure in which the sound outlet is formed on the side wall of the cover 730 as shown in Figure 7 and the side wall of the cover 730 is (substantially) perpendicular to the diaphragm 222. The device under test DUT7 can have a package structure similar to that disclosed in U.S. Application No. 17 / 348,773, which is incorporated herein by reference.

[0056] As Figure 8 shown, the pedestal 811 can include a pedestal cover 811C and a pedestal base 811B. Compared with the pedestal cover 311C shown in Figure 3 the pedestal cover 811C shown in Figure 8 can include pedestal cover components 811C1 to 811C4 and / or a sealing component 811SG in addition to the (elastic) spring pins 311PGP and / or the printed circuit board 311PCB.

[0057] In order to discharge air from the rear / second sub-chamber CB2 to the outside, the pedestal cover components 811C1 to 811C3, the sealing component 811SG, and the printed circuit board 311PCB respectively have openings 811C1h to 811C3h, 811SGh, and 311PCBh. As Figure 10 shown, the openings 811C1h to 811C3h, 811SGh, and 311PCBh of the pedestal 811 are designed according to the distribution of the rear opening B02 of the device under test DUT7 to allow free air in / out flow. Taking the sealing component 811SG as an example: the area of the opening 811SGh is greater than or equal to the distribution area of the rear opening B02. The opening 811SGh overlaps all the rear openings B02.

[0058] Compared with Figure 3The pedestal base 311B shown, Figure 7 The pedestal base 811B shown may include pedestal base components 811B1 to 811B2 in addition to the silicone ring 311SR. As Figure 12 shown, Figure 12 A bottom view of the pedestal base component 811B1 and the device under test DUT7 is shown. The pedestal base component 811B1 not only has an opening 811B1h but also has a groove 811B1g. The area / perimeter / contour of the opening 811B1h of the pedestal base component 811B1 is similar to the area / perimeter / contour of the device under test DUT7 to fix the device under test DUT7 to the pedestal base component 811B1. The width W1 of the groove 811B1g of the pedestal base component 811B1 is narrower than or equal to the width W1h of the opening 811B1h of the pedestal base component 811B17 to prevent the device under test DUT7 from slipping out.

[0059] To transmit the test sound from the sound outlet S07 of the device under test DUT7, the pedestal base component 811B2 has an opening 811B2h. As Figure 11 shown, the width W1g or length L1g of the groove 811B1g of the pedestal base component 811B1 is designed according to the size (e.g., width WW or length LL) of the sound outlet S07 of the device under test DUT7 so as to output, for example, the test sound of the sound sensing device 315. The width W1g or length L1g of the groove 811B1g of the pedestal base component 811B1 may be greater than or equal to the width WW or length LL of the sound outlet S07 of the device under test DUT7. As Figure 10 shown, the depth D2 of the opening 811B2h of the pedestal base component 811B2 is designed according to the depth D1g of the groove 811B1g of the pedestal base component 811B1 to output the test sound of the sound sensing device 315. The opening 811B2h overlaps the groove 811B1g. The geometric center of the sound outlet S07 is substantially aligned with the geometric center of the groove 811B1g of the pedestal base component 811B1 or the geometric center of the receiving surface 315r of the sound sensing device 315.

[0060] As Figure 10 shown, when the device under test DUT7 has been loaded onto the test platform 112 and test sound is generated according to the test signal, the sealing component 811SG of the pedestal 811 is used to as Figure 10The front / first sub-chamber CB1 of the device under test DUT7 is isolated from the rear / second sub-chamber CB2 of the device under test DUT7 as shown. Therefore, when the diaphragm 222 of the device under test DUT7 vibrates, the change in air pressure in the rear / second sub-chamber CB2 does not interfere with the change in air pressure in the front / first sub-chamber CB1. The change in air pressure in the front / first sub-chamber CB1 passes through the groove 811B1g and the opening 811B2h of the pedestal base 811B in the form of a wave and is detected / measured by the sound sensing device 315.

[0061] In summary, the pedestal base 811B of the pedestal 811 has a groove 811B1g and an opening 811B2h for the test sound from the device under test DUT7 to pass through and run outwards to the sound sensing device 315. The sealing member 811SG prevents air leakage from the rear / second sub-chamber CB2 and / or into the front / first sub-chamber CB1 during the test. The change in air pressure in the rear / second sub-chamber CB2 propagates through the openings 811C1h - 811C3h, 811SGH, and 311PCBh of the pedestal cover 811C of the pedestal 811 without interfering with the change in air pressure in the front / first sub-chamber CB1. These improve the test quality and / or enhance the quality of the generated test sound.

[0062] As Figure 10 shown, the receiving surface 315r of the sound sensing device 315 is parallel to the diaphragm 222 of the device under test DUT7, and the sound outlet S07 is located on the side surface (perpendicular to the diaphragm 222) of the cover 730 of the device under test DUT7. The structure of the pedestal base 811B of the pedestal 811 is designed according to the configuration / structure of the sound sensing device 315 and the device under test DUT7.

[0063] The structure of the pedestal base can vary according to the configuration / structure of the sound sensing device and / or the device under test. Figure 14 is a schematic diagram of the pedestal 1411, the sound sensing device 315, and the device under test DUT7 in the first embodiment of the present application. Compared with Figure 10 the pedestal base component 811B2 of the pedestal base 811B as shown, Figure 14 the shaping of a pedestal base component 1411B2 of a pedestal base 1411 of the pedestal 1411 as shown makes the receiving surface 315r of the sound sensing device 315 perpendicular to the diaphragm 222 of the device under test DUT7 but parallel to the side surface (where the sound outlet S07 is located) of the cover 730 of the device under test DUT7.

[0064] Please note that in Figure 8 , the pedestal base 811B of the pedestal 811 houses a sound sensing device 315 and a device under test DUT7. Each sound sensing device 315 corresponds to one device under test DUT7.

[0065] On the other hand, a sound sensing device 315 may correspond to more than one device under test. Figure 15 FIG. Figure 15 is a schematic diagram of an acoustic test system 15 according to an embodiment of the present application. The acoustic test system 15 includes devices under test DUT15a to DUT15d and a test instrument 1510. In addition to the footrest 111, the test platform 112, the loading device 113, the test signal generating device 114, the tester 116, the unloading device 117, and / or the control unit 119, the test instrument 1510 may further include a sound sensing device 1515 and an amplifier 1514w.

[0066] Compared with the acoustic test system 10, the tests of the devices under test DUT15a to DUT15d can occur in parallel. The test signal generating device 114 can separately send test signals Sn15a to Sn15d (corresponding to different frequencies / tones) to the devices under test DUT15a to DUT15d at one time. After separately receiving the test signals Sn15a to Sn15d, test sounds TS15a to TS15d may be respectively generated in the devices under test DUT15a to DUT15d, and the test sounds TS15a to TS15d may be superimposed to form a test sound. The sound sensing device 1515 can detect the test sounds TS15a to TS15d at one time, which correspond to different frequencies from each other. By providing the test signals Sn15a to Sn15d with different frequencies / tones to the devices under test DUT15a to DUT15d, since the test sounds TS15a to TS15d generated from the devices under test DUT15a to DUT15d respectively have different frequencies, the tester 116 can distinguish each test sound TS15a to TS15d. In this way, the audio performance of each device under test DUT15a to DUT15d can be separately judged. Parallelizing the tests of the devices under test DUT15a to DUT15d can reduce the number of sound sensing devices and the test cost / space.

[0067] Each of the devices under test DUT15a to DUT15d may be a sound generating device, such as a packaged device under test, a (semiconductor package) speaker, a bare chip on a wafer, or a sound generating bare chip formed on a wafer before the singulation / dicing process.

[0068] The test instrument 110 / 1510 of the present application can perform acoustic tests and DC tests. Figure 16 FIG. Figure 16 is a schematic diagram of an acoustic test system 16 according to an embodiment of the present application. The acoustic test system 16 can be implemented by the acoustic test system 10 or 15.

[0069] Figure 16(a) in shows a DC test. During the DC test, the test signal generating device 114 can input a test signal (such as a DC voltage Vdc) to a device under test DUT16, and then the circuit behavior of the device under test DUT16 can be electrically tested / measured by the tester 116. DC tests typically include testing capacitance, leakage current (at input pins and / or tri-state pins), open circuits and short circuits, voltage levels, and / or standby current / active power dissipation. DC tests can verify that all wire bonds are correctly connected, check signal continuity to the device under test DUT16, verify operating characteristics, and / or determine whether the device under test DUT16 operates according to standard requirements.

[0070] Figure 16 (b) in shows an acoustic test. During the acoustic test, the test signal generating device 114 inputs a test signal (such as an input signal / voltage Sn16) to the device under test DUT16, and then the sound sensing device 1615 can receive / detect the test sound TS16 generated by the device under test DUT16. The tester 116 can analyze the output of a sound sensing device 1615 to verify the acoustic function of the device under test DUT16. Acoustic tests can involve sound intensity, sound power, sound quality, or sound spectrum measurements. For example, the test instrument 110 can measure the sound pressure level (SPL) or total harmonic distortion (THD) of the device under test DUT16. The acoustic test system 16 can check whether the sound pressure level of the test sound TS16 exceeds a certain threshold, such as 55 decibels (dB). The acoustic test system 16 can determine whether distortion is formed or increased.

[0071] The test instrument 110 / 1510 can be dedicated to a final test. Basically, a semiconductor manufacturing process (which forms wafers), wafer-level DC and acoustic tests, a singulation / dicing process, a packaging process (which packages each separated bare die and / or mounts each separated bare die in a housing), and a final test are performed in the above order. The device under test DUT16 (which can be a microelectromechanical system) can also be formed by a semiconductor manufacturing process. Defects that may occur during the semiconductor manufacturing process, such as contamination or metal short circuits, can be checked during wafer-level DC and acoustic tests. Wafer-level DC and acoustic tests are disclosed in U.S. Application No. 17 / 009,789 (which is incorporated herein by reference) and are performed at the wafer level. Defects (generated after the semiconductor manufacturing process), such as wire short circuits, lifted balls, and bridging, can be screened out during the final test. The final test can be performed by the test instrument 110 / 1510 on a packaged speaker (i.e., the device under test DUT16) and includes acoustic tests and DC tests.

[0072] In summary, the present application uses a conventional semiconductor testing process for mass production to ensure high reliability and achieve high throughput. In addition, since the present application aims to perform (final) testing on a speaker (in a semiconductor package), a microphone is provided in the testing apparatus of the present application. Further, to improve the quality of the testing, the testing apparatus of the present application further includes a sealing member to prevent the air pressure change in the rear / second sub-chamber of a speaker from interfering with the air pressure change in the front / first sub-chamber of the speaker during testing.

[0073] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A test instrument, characterized in that, Comprising: A test platform; A loading device for loading a plurality of devices under test onto the test platform, wherein the plurality of devices under test are configured to generate sound; A test signal generating device for generating at least one test signal, wherein the plurality of devices under test receive the at least one test signal and generate at least one test sound based on the at least one test signal; A footrest disposed on the test platform, wherein each device under test of the plurality of devices under test includes a first chamber and a second chamber, and the footrest includes a sealing member configured to isolate the first chamber from the second chamber when each device under test is loaded on the test platform and generates a portion of the at least one test sound; A sound sensing device for receiving the at least one test sound generated by at least one of the plurality of devices under test; A control unit; and An unloading device, wherein the control unit controls the unloading device to unload the plurality of devices under test from the test platform and controls the unloading device to classify the plurality of devices under test into a plurality of groups based on the at least one test sound generated by the at least one device under test and received by the sound sensing device.

2. The test instrument according to claim 1, wherein The sealing member has an opening, the area of the opening being greater than or equal to the area of a sound outlet of each device under test, and each device under test is a top-emitting sound generating device.

3. The test instrument according to claim 1, characterized in that, The footrest includes a footrest base, the footrest base including an opening, the area of the opening being greater than or equal to the area of a sound outlet of each device under test, and each device under test is a top-emitting sound generating device.

4. The test instrument according to claim 1, characterized in that The sealing member includes an opening, the area of the opening being greater than or equal to the distribution area of the rear openings of each device under test, and each device under test is a side-emitting sound generating device.

5. The test instrument according to claim 1, characterized in that, The footrest includes a footrest base having an opening and a groove, the size of the groove being wider than or equal to the size of a sound outlet of each device under test, and each device under test is a side-emitting sound generating device.

6. The test instrument according to claim 1, wherein The geometric center of a receiving surface of the sound sensing device is aligned with the geometric center of an opening of the sealing member, the geometric center of a sound outlet of each device under test, or the geometric center of a groove of the footrest.

7. The test instrument according to claim 1, characterized in that The footrest includes a footrest cover having at least one opening, the at least one opening being connected to the second chamber to allow pressure changes to propagate through the at least one opening, and the area of the at least one opening being greater than or equal to the distribution area of the rear openings of each device under test.

8. The test instrument according to claim 1, characterized in that, At least one footrest base member, the sealing member, the sound sensing device, or each device under test encloses an enclosed space.

9. The test instrument according to claim 1, wherein The at least one test signal includes a plurality of test signals; The plurality of test signals have a plurality of tones; The plurality of test signals having the plurality of tones are transmitted to the plurality of devices under test to generate the at least one test sound.

10. A testing method, characterized in that, Comprising: By means of a test instrument, loading a plurality of devices under test onto a test platform; Generate at least one test signal, wherein each device under test of the plurality of devices under test includes a first chamber and a second chamber, and generating the at least one test signal includes isolating the first chamber from the second chamber when each device under test is loaded on the test platform and generates a part of the at least one test sound; The plurality of devices under test receive the at least one test signal and generate at least one test sound according to the at least one test signal; and Detect the at least one test sound generated by at least one device under test of the plurality of devices under test; By means of the test instrument, classify the plurality of devices under test into a plurality of groups according to the at least one test sound generated by the at least one device under test and received by a sound sensing device.

11. The test method according to claim 10, wherein The at least one test signal includes a plurality of test signals; The plurality of test signals have a plurality of tones; The plurality of test signals having the plurality of tones are transmitted to the plurality of devices under test, thereby generating the at least one test sound.

12. A testing method, characterized in that, Comprising: Generate a plurality of test signals, wherein the plurality of test signals have a plurality of tones; Transmit the plurality of test signals having the plurality of tones to a plurality of devices under test; The plurality of devices under test generate a test sound according to the plurality of test signals, wherein each device under test of the plurality of devices under test includes a first chamber and a second chamber; When each device under test is loaded on a test platform and generates a part of the test sound, isolate the first chamber from the second chamber; And Classify the plurality of devices under test into a plurality of groups according to the test sound.

13. The test method according to claim 12, wherein One of the plurality of devices under test is a packaged device under test.

14. The test method according to claim 12, characterized in that One of the plurality of devices under test is a sounding bare chip formed on a wafer, and the steps of transmitting the plurality of test signals having the plurality of tones to the plurality of devices under test and the plurality of devices under test generating the test sound according to the plurality of test signals are performed before a singulation process performed on the wafer.

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