Display panel, display panel manufacturing method and display device

Abstract

The display panel manufacturing method and the display panel and the display device provided by the embodiments of the present application relate to the technical field of display. The display panel comprises a signal trace and an auxiliary block close to the signal trace and arranged in a spaced manner with the signal trace. The signal trace comprises a first conductive layer, a second conductive layer and a third conductive layer which are stacked in sequence. The etching resistance of the second conductive layer is lower than the etching resistance of the first conductive layer and the etching resistance of the third conductive layer. The auxiliary block is obtained by etching the original auxiliary block by an etching liquid. The above display panel structure slows down the lateral etching of the second conductive layer in the signal trace by the etching liquid in the mode of consuming the etching liquid by the auxiliary etching block arranged on one side of the signal trace. In this way, the encapsulation failure caused by the excessive lateral etching of the second conductive layer in the signal trace can be avoided, and the photoresist layer protection of the signal trace is not needed when etching other structures in the display panel, thereby reducing the manufacturing cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a display panel manufacturing method and a display device. BACKGROUND

[0002] As a core component of electronic devices, the display panel has a high manufacturing cost. How to reduce the manufacturing cost of the display panel has become a technical problem to be solved by those skilled in the art. SUMMARY

[0003] In order to overcome the technical problems mentioned in the above technical background, the embodiments of the present application provide a display panel, a display panel manufacturing method and a display device.

[0004] In a first aspect, the present application provides a display panel, comprising a substrate, a signal trace on the substrate, and an auxiliary block close to the signal trace and spaced apart from the signal trace.

[0005] The signal trace has a composite conductive structure, which comprises a first conductive layer, a second conductive layer and a third conductive layer stacked in turn in a direction away from the substrate, wherein the etch resistance of the second conductive layer is lower than that of the first conductive layer and the third conductive layer.

[0006] In a possible embodiment of the present application, the display panel has a display area, an opening area and an isolation area between the display area and the opening area.

[0007] The display panel further comprises a light-emitting functional layer on the substrate, the light-emitting functional layer being located in the display area and the isolation area, the isolation area being provided with a laminated structure, the light-emitting functional layer covering the laminated structure and being separated by the laminated structure.

[0008] Optionally, the laminated structure has the same composite conductive structure as the signal trace.

[0009] Optionally, the second conductive layer in the laminated structure is recessed on the same side as the first conductive layer and the third conductive layer relative to the side facing away from the opening area.

[0010] Optionally, the second conductive layer in the signal trace is recessed on the same side as the first conductive layer and the third conductive layer relative to the side facing the auxiliary block.

[0011] Optionally, the thickness of the auxiliary block in the first direction is less than the sum of the thicknesses of the first conductive layer and the second conductive layer of the signal trace in the first direction, the first direction being parallel to the thickness direction of the substrate.

[0012] Optionally, the auxiliary block comprises a first portion arranged in the same layer as the first conductive layer, or the auxiliary block comprises a first portion arranged in the same layer as the first conductive layer and a second portion arranged in the same layer as the second conductive layer, which are sequentially stacked in a direction away from the substrate.

[0013] In a possible embodiment of the present application, the signal traces are at least two, and the auxiliary block is located between the adjacent signal traces.

[0014] Optionally, the adjacent signal traces comprise a high-potential signal trace and a low-potential signal trace.

[0015] Optionally, the display panel further has a non-display area, the signal traces extend from the display area to the non-display area, and the auxiliary block is located in the non-display area.

[0016] Optionally, the first conductive layer and the third conductive layer are made of the same material, the first conductive layer and the third conductive layer are made of Ti or Mo, and the second conductive layer is made of Al.

[0017] Optionally, the isolation area is provided with a plurality of stacked structures, and the plurality of stacked structures are arranged in a direction from the opening area to the display area.

[0018] The gap between the adjacent stacked structures is smaller than the gap between the signal traces located on both sides of the auxiliary block and adjacent to each other.

[0019] In a possible embodiment of the present application, the display panel further comprises an encapsulation layer, and the encapsulation layer comprises a first inorganic layer, the first inorganic layer being located on a side of the signal traces and the auxiliary block away from the substrate,

[0020] The first inorganic layer is in contact with the third conductive layer of the signal traces and the auxiliary block.

[0021] In a second aspect of the present application, a display device is provided, comprising: a photosensitive element and the display panel in the first aspect, the photosensitive element being located on a non-light-emitting side of the display panel.

[0022] The photosensitive element is located in the opening area of the display panel, and the photosensitive element is used to collect light passing through the opening area.

[0023] In a third aspect of the present application, a display panel manufacturing method is provided, comprising:

[0024] A substrate is provided.

[0025] The signal trace and the original auxiliary block close to the signal trace are manufactured on the substrate, wherein the signal trace has a composite conductive structure, and the composite conductive structure comprises a first conductive layer, a second conductive layer and a third conductive layer which are sequentially stacked in a direction away from the substrate, and the etching resistance of the second conductive layer is lower than the etching resistance of the first conductive layer and the etching resistance of the third conductive layer.

[0026] The signal trace is laterally etched, and the etching of the second conductive layer in the signal trace by the etching liquid is slowed down by slowing down the etching of the part of the conductive layer in the original auxiliary block by the etching liquid, to obtain the auxiliary block and the signal trace after lateral etching, wherein the auxiliary block is obtained by etching the part of the conductive layer in the original auxiliary block.

[0027] In a possible embodiment of the present application, the display panel comprises a display area, an aperture area and an isolation area between the display area and the aperture area, and the step of manufacturing the signal trace and the original auxiliary block close to the signal trace on the substrate comprises:

[0028] A composite conductive layer is manufactured on the substrate, and the composite conductive layer comprises a first conductive layer, a second conductive layer and a third conductive layer.

[0029] The composite conductive layer is subjected to a patterning process to obtain the signal trace, the original auxiliary block on one side of the signal trace and the stack structure in the isolation area.

[0030] In a possible embodiment of the present application, the original auxiliary block is composed of the first conductive layer and the second conductive layer, and the step of patterning the composite conductive layer to obtain the signal trace, the original auxiliary block on one side of the signal trace and the stack structure in the isolation area comprises:

[0031] An optical glue layer is manufactured on the composite conductive layer.

[0032] After the optical glue layer is exposed and developed by a mask, the pattern is transferred to the optical glue layer, so that the thickness of the optical glue layer at the corresponding position of the stack structure and the signal trace is greater than the thickness of the optical glue layer at the corresponding position of the original auxiliary block.

[0033] The composite conductive layer is etched to obtain the stack structure, the signal trace and the original auxiliary block, wherein the third conductive layer at the position of the original auxiliary block is removed, and the second conductive layer at the position of the original auxiliary block is exposed.

[0034] Optionally, the signal trace is at least two, and the auxiliary block is located between the adjacent signal traces; the exposed area of the second conductive layer in the original auxiliary block is greater than or equal to the sum of the exposed areas of the second conductive layer on the side of the original auxiliary block of the adjacent signal traces corresponding to the original auxiliary block.

[0035] Optionally, the display panel further has a non-display area, the signal trace extends from the display area to the non-display area, and the auxiliary block is located in the non-display area.

[0036] In a possible embodiment of the present application, the mask is a semi-transparent mask.

[0037] Optionally, the step of transferring the pattern to the optical adhesive layer after the optical adhesive layer is exposed and developed by the mask, so that the thickness of the optical adhesive layer at the position corresponding to the stack structure and the signal trace is greater than the thickness of the optical adhesive layer at the position corresponding to the original auxiliary block, comprises:

[0038] The semi-transparent mask comprising an opaque region, a full-transparency region and a semi-transparency region is selected, and the semi-transparent mask is aligned with the substrate substrate, wherein the optical adhesive layer is a positive photoresist layer, the opaque region corresponds to the position region where the stack structure and the signal trace are located, and the semi-transparency region corresponds to the position region where the original auxiliary block is located; the full-transparency region corresponds to the gap region between the signal trace and the original auxiliary block; or, the optical adhesive layer is a negative photoresist layer, the full-transparency region corresponds to the position region where the stack structure and the signal trace are located, and the semi-transparency region corresponds to the position region where the original auxiliary block is located; the opaque region corresponds to the gap region between the signal trace and the original auxiliary block.

[0039] The optical adhesive layer is exposed and developed by the semi-transparent mask, so that the thickness of the optical adhesive layer at the position corresponding to the stack structure and the signal trace is greater than the thickness of the optical adhesive layer at the position corresponding to the original auxiliary block.

[0040] In a possible embodiment of the present application, the step of transferring the pattern to the optical adhesive layer after the optical adhesive layer is exposed and developed by the mask, so that the thickness of the optical adhesive layer at the position corresponding to the stack structure and the signal trace is greater than the thickness of the optical adhesive layer at the position corresponding to the original auxiliary block, comprises:

[0041] The first mask comprising a first full-transparency region and an opaque region and the second mask comprising a second full-transparency region and an opaque region are selected.

[0042] The first mask is aligned with the substrate substrate, and the optical adhesive layer is exposed by the first mask; wherein the optical adhesive layer is a positive photoresist layer, the first full-transparency region corresponds to the gap position region between the signal trace and the original auxiliary block, or the optical adhesive layer is a negative photoresist layer, and the first full-transparency region corresponds to the position region where the stack structure and the signal trace are located.

[0043] The second mask is aligned with the substrate substrate, and the optical adhesive layer is exposed by the second mask; the second full-transparency region corresponds to the position region where the original auxiliary block is located, wherein the light intensity of the light transmitted through the first full-transparency region is greater than the light intensity of the light transmitted through the second full-transparency region.

[0044] The optical adhesive layer is developed so that the thickness of the optical adhesive layer at the corresponding position of the stack structure and the signal trace is greater than the thickness of the optical adhesive layer at the corresponding position of the original auxiliary block.

[0045] The display panel, the display device and the display panel manufacturing method provided by the embodiments of the present application, the display panel comprises a signal trace and an auxiliary block arranged close to the signal trace and spaced apart from the signal trace, the signal trace comprises a first conductive layer, a second conductive layer and a third conductive layer stacked in turn in a direction away from a substrate, the etching resistance of the second conductive layer is lower than the etching resistance of the first conductive layer and the etching resistance of the third conductive layer, and the auxiliary block is obtained by etching the original auxiliary block by an etching liquid. The above display panel structure slows down the lateral etching of the second conductive layer in the signal trace by the etching liquid in the way that the original auxiliary block arranged on one side of the signal trace consumes the etching liquid. In this way, the packaging failure caused by excessive lateral etching of the second conductive layer in the signal trace can be avoided, and the photoresist layer of the signal trace does not need to be protected when other structures in the display panel are etched, thereby reducing the manufacturing cost of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0047] Figure 1 The film layer cross-sectional view between the signal trace and the encapsulation layer which is excessively laterally etched is illustrated;

[0048] Figure 2 A possible film layer structure schematic diagram of the display panel provided by the embodiments is illustrated;

[0049] Figure 3 The film layer cross-sectional view between the signal trace and the encapsulation layer provided by the embodiments is illustrated;

[0050] Figure 4 The cross-sectional structure schematic diagram of the stack structure is illustrated;

[0051] Figure 5 A possible distribution schematic diagram of each region in the display panel is illustrated;

[0052] Figure 6 For Figure 5 A cross-sectional view in AA direction;

[0053] Figure 7 For Figure 5Another cross-sectional view in the AA direction;

[0054] Figure 8 A structural schematic diagram of the display device provided by the embodiment is shown;

[0055] Figure 9 A flowchart of the display panel manufacturing method provided by the embodiment is shown;

[0056] Figure 10 A possible flowchart of step S52 in the embodiment is shown; Figure 9 A corresponding process flowchart is shown;

[0057] Figure 11 A possible flowchart of step S522 in the embodiment is shown; Figure 9 A corresponding process flowchart is shown;

[0058] Figure 12 A possible flowchart of step S522 in the embodiment is shown; Figure 11 A corresponding process flowchart is shown;

[0059] Figure 13 A possible flowchart of step S522 in the embodiment is shown; Figure 12 A possible flowchart of step S522 in the embodiment is shown;

[0060] Figure 14 A possible flowchart of step S522 in the embodiment is shown; Figure 13 A possible flowchart of step S522 in the embodiment is shown;

[0061] Figure 15 A possible flowchart of step S522 in the embodiment is shown; Figure 13 A possible flowchart of step S522 in the embodiment is shown.

[0062] Icon:

[0063] 10 - display device; 100 - display panel; 110 - display area; 120 - aperture area; 130 - non-display area; 140 - isolation area; 1101 - substrate; 1102 - composite conductive layer; 11021 - first conductive layer; 11022 - second conductive layer; 11023 - third conductive layer; 1103 - photoresist layer; 111 - signal trace; 112 - original auxiliary block; 112' - auxiliary block; 113 - laminated structure; 114 - light-emitting functional layer; 115 - first inorganic layer; 30 - gap; 410 - semi-transparent mask; 4101 - full-transmissive area; 4102 - semi-transmissive area; 4103 - non-transmissive area; 420 - first mask; 4201 - first full-transmissive area; 430 - second mask; 4301 - second full-transmissive area; 200 - light-sensing element. DETAILED DESCRIPTION

[0064] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will be clearly and completely described the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0065] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0066] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0067] In the description of the present application, it should be noted that the orientation or position relationship indicated by the terms "upper", "lower" and the like is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship commonly placed when the product of the present application is used, only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0068] It should be noted that the different features in the embodiments of the present application can be combined with each other without conflict.

[0069] The inventors found that in the process of manufacturing a display panel, a part of the panel is often etched while another part of the panel is avoided from being etched. Therefore, in the prior art, a photoresist layer is often set on the panel area which does not need to be etched before etching to protect it, so that a shielding mask, a photoresist layer and a solution for removing part of the photoresist layer are needed, which increases the manufacturing cost, and if the photoresist layer is not set on the panel area, the signal wiring in the panel area will be excessively side-etched, please refer to Figure 1 , Figure 1Fig. 1 shows a schematic diagram of a signal trace of a three-layer composite conductive layer structure after excessive lateral etching and encapsulation, the signal trace 111 is on a substrate 1101, and the encapsulation layer 115 encapsulates the signal trace 111. Due to excessive lateral etching of the signal trace 111, the encapsulation layer 115 and the side surface of the signal trace 111 cannot be closely fitted, and a gap 30 extending along the signal trace 111 (perpendicular to the cross-sectional direction shown) is formed. In this way, water and oxygen in the air can easily enter the display panel through the gap 30, resulting in encapsulation failure and causing display defects such as black spots. Figure 1

[0070] To solve the above technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings.

[0071] It should be noted that the defects in the above prior art solutions are the result of the inventors' careful research and practice, and therefore the discovery process of the above technical problems and the solutions proposed by the embodiments of the present application to solve the above problems should be considered as the contribution of the inventors to the present application, and should not be understood as technical content known to those skilled in the art.

[0072] Please refer to Figure 2 and Figure 3 As shown in Figs. 1 and 2, the display panel 100 can include a substrate 1101, a signal trace 111 on the substrate 1101, and an auxiliary block 112' disposed close to and spaced apart from the signal trace 111.

[0073] The signal trace 111 has a composite conductive structure 1102, which in this embodiment includes a first conductive layer 11021, a second conductive layer 11022, and a third conductive layer 11023 stacked in order away from the substrate 1101. The second conductive layer 11022 has a lower etch resistance than the first conductive layer 11021 and the third conductive layer 11023.

[0074] The auxiliary block 112' can be obtained by assisting the signal trace 111 in lateral etching by the original auxiliary block 112. In detail, the original auxiliary block 112 slows down the lateral etching of the second conductive layer 11022 in the signal trace 111 by its structure (dashed line in the figure) to consume etching liquid.

[0075] ​The structure provided above does not need to protect the signal line 111 by a photoresist layer when etching other structures at other positions of the display panel 100 (for example, a laminated structure with the same composite conductive structure as the signal line, and the laminated structure and the signal line are located in different areas of the display panel), thereby reducing the manufacturing cost of the display panel 100. Please refer to Figure 3 In the scheme provided in the embodiment, the lateral etching amount of the signal line 111 is controlled, and the first inorganic layer 115 in the packaging layer can be closely attached to the signal line 111 on the side of the signal line 111, so as to reduce the gap, or even eliminate the gap, and avoid packaging failure caused by excessive lateral etching of the second conductive layer 11022 in the signal line 111.

[0076] The inventors have further found that with the development of display technology, the full-screen technology has become a research hotspot in the industry. The full-screen can be realized by digging a hole in the display screen (for example, an OLED display screen) and placing a light-sensitive element (for example, a camera or a fingerprint recognition module) below the display screen. The hole digging brings great challenges to packaging. At the cutting position of the hole digging area, the organic material layer evaporated in the hole digging area is exposed to the air, and the organic material layer is extremely easy to absorb water and oxygen in the air, thereby causing packaging failure. In order to prevent packaging failure caused by the above situation, a laminated structure (as a separation column) can be arranged in the isolation area around the hole digging area by using a composite conductive layer (for example, TiAlTi or MoAlMo), and then the middle conductive layer (for example, an Al layer) in the composite conductive layer is laterally etched by using an etching liquid, as shown in Figure 4 The cross section of the laminated structure 113 forms an I-shaped type, so that the evaporated light-emitting functional layer 114 can be disconnected on the side of the I-shaped type (the dashed area in the figure), thereby avoiding water and oxygen in the air from invading into the display screen body along the light-emitting functional layer 114, and causing display failure. Part of the signal line 111 in the display screen is made in the same layer as the laminated structure 113, and the signal line 111 needs to be avoided from being excessively etched laterally when the laminated structure 113 is laterally etched.

[0077] The technical scheme provided in the embodiment can be used to solve the technical problems involved in the full-screen described above. Please refer to Figure 5 and Figure 6 , Figure 5 An example is shown in a schematic diagram of the distribution of each area of a full-screen display panel, Figure 6 Figure 5 ​FIG. 2 is a cross-sectional view along the direction AA. The display panel 100 can have a display area 110, an aperture area 120, and a separation area 140 between the display area 110 and the aperture area 120. The aperture area 120 can be disposed within the display area 110, and the separation area 140 is between the display area 110 and the aperture area 120. Optionally, the display panel 100 can also have a non-display area 130 surrounding at least part of the display area 110.

[0078] In this embodiment, the separation area 140 can be provided with a laminated structure 113 (which can be a separation column), and the signal line 111 and the laminated structure 113 can be made of the same composite conductive film layer, i.e., the laminated structure 113 and the signal line 111 have the same composite conductive structure.

[0079] Optionally, the second conductive layer 11022 in the laminated structure 113 is recessed towards and / or away from the same side of the first conductive layer 11021 and the third conductive layer 11023 of the aperture area 120. That is, the second conductive layer 11022 in the laminated structure 113 is laterally etched.

[0080] Optionally, the second conductive layer 11022 in the signal line 111 is recessed towards the side of the auxiliary block 112, i.e., the second conductive layer 11022 in the signal line 111 is laterally etched.

[0081] Optionally, the thickness H1 of the auxiliary block 112' along the first direction (Z direction) is less than the sum H2 of the thicknesses of the first conductive layer 11021 and the second conductive layer 11022 of the signal line 111 along the first direction (Z direction), where the first direction is parallel to the thickness direction of the substrate substrate 1101.

[0082] Please refer again to Figure 6 In one embodiment of this embodiment, the auxiliary block 112' can include a first part disposed in the same layer as the first conductive layer 11021. Please refer to Figure 7 In another embodiment of this embodiment, the auxiliary block 112' can include a first part disposed in the same layer as the first conductive layer 11021 and a second part disposed in the same layer as the second conductive layer 11022, which are sequentially stacked away from the substrate substrate 1101, and the thickness H4 of the second part along the first direction (Z direction) is less than the thickness H3 of the second conductive layer 11022 of the signal line 111 along the first direction (Z direction).

[0083] The inventor further finds that the main reason for the lateral etching excess of the second conductive layer 11022 in the signal line 111 is that the wiring density of the signal line 111 on the non-display area 130 is smaller than that on the area where the laminated structure is located (for example, in the isolation area 140). When lateral etching is performed, the etching liquid on the side of the laminated structure 113 is less than that at the position of the signal line 111, so that the lateral etching speed of the laminated structure 113 is smaller than that of the signal line 111, thereby causing the lateral etching amount of the signal line 111 to be too large when the lateral etching amount of the laminated structure 113 reaches the requirement. By setting the original auxiliary block 112, the etching liquid is consumed by the original auxiliary block 112 (dashed structure in the figure) to slow down the lateral etching of the second conductive layer 11022 in the signal line 111.

[0084] The signal line 111 can be extended from the display area 110 to the non-display area 130, and the auxiliary block 112' is located in the non-display area 130. The auxiliary block 112' set in the non-display area 130 can consume the excess etching liquid in the etching process, and slow down the lateral etching of the second conductive layer 11022 in the signal line 111.

[0085] Further, the number of signal lines 111 can be multiple, and the auxiliary block 112' can be between adjacent signal lines 111. Among them, the adjacent signal lines 111 can include high potential signal lines (such as VDD lines) and low potential signal lines (such as VSS lines). Multiple spaced original auxiliary blocks can be arranged between at least part of the two adjacent signal lines 111, that is, multiple spaced auxiliary blocks can be arranged between at least part of the two adjacent signal lines 111. The auxiliary block 112' can be located between the adjacent signal lines 111. The auxiliary block 112' is not used for signal transmission.

[0086] In the embodiment, the materials of the first conductive layer 11021 and the third conductive layer 11023 can be the same or different. For example, the materials of the first conductive layer 11021 and the third conductive layer 11023 can be Ti or Mo, and the material of the second conductive layer 11022 can be Al.

[0087] Further, in a possible implementation, the stacked structure 113 can be an isolation column. A plurality of stacked structures 113 can be arranged in the isolation area 140, and the plurality of stacked structures 113 can be arranged in a direction from the opening area 120 to the display area 110. For example, the number of stacked structures 113 can be 2-200. Arranging more stacked structures 113 can enhance the blocking effect of the isolation area 140 on water and oxygen. Any stacked structure 113 can be arranged around the opening area 120. The plurality of stacked structures 113 can be arranged in multiple circles from the inside to the outside. The gap between adjacent stacked structures 113 is smaller than the gap between adjacent signal lines 111. The gap between adjacent stacked structures 113 is smaller than the gap between the signal lines 111 located on the two sides of the auxiliary block and adjacent to each other.

[0088] Referring again to Figure 3 In this embodiment, the display panel 100 further includes an encapsulation layer. The encapsulation layer can include a first inorganic layer 115 located on a side of the signal line 111 and the auxiliary block 112 away from the substrate 1101. Optionally, the first inorganic layer 115 is in contact with the third conductive layer 11023 of the signal line 111 and the auxiliary block 112. The first inorganic layer 115 can include one or more of silicon oxide, silicon nitride, and silicon-based oxynitride.

[0089] Optionally, the encapsulation layer can further include an organic layer located on a side of the first inorganic layer 115 away from the substrate 1101. The encapsulation layer can further include a second inorganic layer located on a side of the organic layer away from the substrate 1101. The encapsulation layer can include a plurality of organic layers and a plurality of inorganic layers alternately arranged along the thickness direction of the substrate. The organic layer can include one or more of polyolefin, polyvinyl chloride, polystyrene, polyimide (PI), polyethylene terephthalate (PET), epoxy resin, and phenolic resin. The inorganic layer can include one or more of silicon oxide, silicon nitride, and silicon-based oxynitride. The encapsulation layer can cover part of the signal line 111. The end of the signal line 111 away from the display area 110 is not covered by the encapsulation layer 115. Optionally, the end of the signal line 111 not covered by the encapsulation layer 115 can be used as a bonding terminal and can be bonded with a bonding element such as a flexible circuit board and / or a driving chip.

[0090] Optionally, as Figure 4 shown, the display panel further includes a light-emitting functional layer 114 on the substrate 1101. The light-emitting functional layer 114 is located in the display area 110 and the isolation area 140. The light-emitting functional layer 114 covers the stacked structure 113 and is separated by the stacked structure 113. The encapsulation layer can be located on a side of the light-emitting functional layer 114 away from the stacked structure 113.

[0091] Optionally, the display panel 100 further comprises a light-emitting device layer, which can be located in the display area and between the encapsulation layer and the substrate 1101. The light-emitting device layer can comprise an anode layer, a light-emitting functional layer and a cathode layer which are sequentially stacked along the thickness direction of the substrate. The light-emitting functional layer can be an organic light-emitting functional layer. In the isolation area 140, the light-emitting functional layer can be located between the isolation column and the encapsulation layer. The light-emitting functional layer can comprise an organic light-emitting layer (EML) located in the display area 110 and a common organic layer located in the display area 110 and the isolation area 140. The common organic layer can comprise one or more of an electron injection layer (EIL), an electron transport layer (ETL), a hole blocking layer (HBL), an electron blocking layer (EBL), a hole transport layer (HTL), a hole injection layer (HIL) and the like. Optionally, the common organic layer in the light-emitting functional layer is broken at the sidewall of the isolation column to avoid encapsulation failure. The encapsulation layer can be located in the display area 110, the non-display area 130 and the isolation area 140.

[0092] Please refer to Figure 8 The embodiment also provides a display device 10, which can comprise the display panel 100 described above. Optionally, the display device 10 can further comprise a photosensitive element 200. The photosensitive element 200 can be arranged on the non-light-emitting side of the display panel 100.

[0093] Optionally, the photosensitive element 200 is located in the opening area 120, and the photosensitive element 200 is used for collecting light passing through the opening area 120. The photosensitive element 200 can comprise a camera, a fingerprint identification module and the like. The use of the display panel 100 with lower manufacturing cost can enhance the market competitiveness of the display device 10.

[0094] The display device 10 provided by the embodiment comprises the display panel provided by any of the above embodiments, so the display device provided by the embodiment has the beneficial effects of the above embodiments, which will not be described here.

[0095] The embodiment also provides a manufacturing method of the display panel described above. Please refer to Figure 9 and Figure 10 , Figure 9 The embodiment illustrates a flowchart of the manufacturing method of the display panel provided by the embodiment, Figure 10 corresponding to Figure 9 process flowchart, the manufacturing method of the display panel provided by the embodiment will be described in detail in combination with Figure 9 and Figure 10 The manufacturing method of the display panel provided by the embodiment can be used to manufacture the display panel provided by any of the above embodiments.

[0096] In step S51, a substrate 1101 is provided.

[0097] In the embodiment, the substrate 1101 can be a hard substrate (such as a glass substrate) or a flexible substrate (such as a polyimide substrate).

[0098] In step S52, a signal line 111 and an original auxiliary block 112 close to the signal line are formed on the substrate 1101.

[0099] The signal line 111 has a composite conductive structure, which includes a first conductive layer 11021, a second conductive layer 11022 and a third conductive layer 11023 stacked in sequence away from the substrate 1101, and the etching resistance of the second conductive layer 11022 is lower than that of the first conductive layer 11021 and the third conductive layer 11023. The first conductive layer 11021, the second conductive layer 11022 and the third conductive layer 11023 of the composite conductive layer 1102 can be Ti conductive layer, Al conductive layer and Ti conductive layer respectively, thereby forming a TiAlTi composite structure as the composite conductive layer 1102, or the first conductive layer 11021, the second conductive layer 11022 and the third conductive layer 11023 of the composite conductive layer 1102 can be Mo conductive layer, Al conductive layer and Mo conductive layer respectively, thereby forming a MoAlMo composite structure as the composite conductive layer 1102.

[0100] In step S53, the signal line 111 is laterally etched, and the etching of part of the conductive layer in the original auxiliary block 112 slows down the lateral etching of the second conductive layer 11022 in the signal line 111 by the etching liquid, thereby obtaining an auxiliary block 112' and a signal line 111 after lateral etching.

[0101] In this step, the auxiliary block 112' is obtained by etching part of the conductive layer in the original auxiliary block 112. The etching resistance of the surface of the original auxiliary block 112 away from the substrate can be less than or equal to that of the second conductive layer 11022 in the signal line 111.

[0102] The display panel manufacturing method provided by the embodiments of the present application can be used to manufacture the display panel provided by any of the above embodiments, so the display panel manufacturing method provided by the embodiments of the present application has the beneficial effects of the above embodiments, which will not be repeated here.

[0103] The display panel manufacturing method provided by the embodiments of the present application will be further introduced in combination with the specific scene of the full-screen.

[0104] Further, the display panel 100 can have a display area 110, an aperture area 120, and an isolation area 140 between the display area 110 and the aperture area 120. The aperture area 120 can be arranged in the display area 110, and the isolation area 140 is between the display area 110 and the aperture area 120. Optionally, the display panel 100 can further have a non-display area 130 surrounding at least part of the display area 110. Please refer to Figure 11 and Figure 12 The step S52 in the embodiment can be implemented in the following way.

[0105] In step S521, a composite conductive layer 1102 is made on the substrate 111.

[0106] The composite conductive layer 1102 includes a first conductive layer 11021, a second conductive layer 11022, and a third conductive layer 11023.

[0107] In step S522, the composite conductive layer 1102 is patterned to obtain the signal line 111, the original auxiliary block 112 on one side of the signal line 111, and the laminated structure 113.

[0108] Exemplarily, please refer to Figure 13 The step S522 can be implemented in the following sub-steps. The laminated structure 113 can also be located at other positions of the display panel, which is not limited in the embodiment. The laminated structure 113 can be located in the isolation area 140.

[0109] In sub-step S5221, an optical glue layer 1103 is made on the composite conductive layer 1102.

[0110] In the embodiment, an optical glue layer 1103 can be formed on the surface of the composite conductive layer 1102 by a glue coating device such as a spin coating device. The optical glue layer 1103 can be a positive photoresist layer or a negative photoresist layer, which is not limited in the embodiment. The solubility of the optical glue layer in the developing solution is changed by exposure. The stronger the light intensity of the positive photoresist layer, the greater the solubility of the positive photoresist layer in the developing solution, and the smaller the thickness of the residual positive photoresist layer after development. The stronger the light intensity of the negative photoresist layer, the smaller the solubility of the negative photoresist layer in the developing solution, and the greater the thickness of the residual negative photoresist layer after development.

[0111] In sub-step S5222, the optical glue layer 1103 is exposed and developed by a mask to transfer the pattern to the optical glue layer 1103, so that the thickness of the optical glue layer 1103 at the corresponding position of the laminated structure 113 and the signal line 111 is greater than the thickness of the optical glue layer 1103 at the corresponding position of the original auxiliary block 112.

[0112] The pattern transfer can specifically refer to, after exposure and development, removing the optical adhesive layer 1103 outside the stacked structure 113, the signal trace 111 and the original auxiliary block 112, and thinning the optical adhesive layer 1103 at the position corresponding to the original auxiliary block 112, while retaining the optical adhesive layer 1103 at the positions corresponding to the stacked structure 113 and the signal trace 111 without thinning. After exposure and development, the thickness of the optical adhesive layer 1103 at the positions corresponding to the stacked structure 113 and the signal trace 111 is greater than the thickness of the optical adhesive layer 1103 at the position corresponding to the original auxiliary block 112.

[0113] In the sub-step S5223, the composite conductive layer is etched to obtain the stacked structure 113, the signal trace 111 and the original auxiliary block 112, wherein the third conductive layer 11023 at the position of the original auxiliary block 112 is removed, and the second conductive layer 11022 at the position of the original auxiliary block 112 is exposed.

[0114] After exposure and development, the smaller the thickness of the optical adhesive layer 1103 on the composite conductive layer, the greater the thickness of the composite conductive layer etched by the etching liquid in the sub-step S5223.

[0115] Further, the signal trace 111 is at least two, and the auxiliary block 112 is located between adjacent signal traces 111; the exposed area of the second conductive layer 11022 in the original auxiliary block 112 is greater than or equal to the sum of the exposed areas of the second conductive layer 11022 on the side of the original auxiliary block 112 of the adjacent signal traces 111 corresponding to the original auxiliary block 112.

[0116] Further, the signal trace 111 can extend from the display area 110 to the non-display area 130, and the auxiliary block 112 is located in the non-display area 130.

[0117] In an embodiment of the present embodiment, referring to the process flow chart shown in Figure 14 The sub-step S5222 can be implemented in the following manner.

[0118] First, a halftone mask 410 including a full light transmission area 4101, a half light transmission area 4102 and a non-light transmission area 4103 is selected, and the halftone mask 410 is aligned with the substrate 1101. When the optical adhesive layer 1103 is a positive photoresist layer, as shown in Figure 14As shown, the opaque region 4103 corresponds to the position region where the laminated structure 113 and the signal trace 111 are located, the semi-transparent region 4102 corresponds to the position region where the original auxiliary block is located, and the fully transparent region 4101 corresponds to the region where the gap between the signal trace 111 and the original auxiliary block 112 is located. When the photoresist layer 1103 is a negative photoresist layer, the fully transparent region 4101 corresponds to the position region where the laminated structure 113 and the signal trace 111 are located, the semi-transparent region 4102 corresponds to the position region where the original auxiliary block 112 is located, and the opaque region 4103 corresponds to the region where the gap between the signal trace 111 and the original auxiliary block 112 is located.

[0119] Next, after the photoresist layer 1103 is exposed and developed by the semi-transparent mask 111, the thickness of the photoresist layer 1103 at the position corresponding to the laminated structure 113 and the signal trace 111 is greater than the thickness of the photoresist layer 1103 at the position corresponding to the original auxiliary block 112, so that the composite conductive layer at the position corresponding to the laminated structure 113 and the signal trace 111 is retained, the third conductive layer 11023 at the position of the original auxiliary block 112 is removed, and the second conductive layer 11022 at the position of the original auxiliary block 112 is exposed.

[0120] In another embodiment of the present embodiment, referring to the process flow chart shown in Figure 15 The sub-step S5222 can also be implemented in the following manner.

[0121] First, a first mask 420 including a first fully transparent region 4201 and an opaque region is aligned with the substrate 1101, and the photoresist layer 1103 is exposed by the first mask 420.

[0122] When the photoresist layer 1103 is a positive photoresist layer, as shown in Figure 15 the first fully transparent region 4201 corresponds to the position region where the gap between the signal trace 111 and the original auxiliary block 112 is located; when the photoresist layer 1103 is a negative photoresist layer, the first fully transparent region 4201 corresponds to the position region where the laminated structure 113 and the signal trace 111 are located.

[0123] Next, the first mask 420 is removed, a second mask 430 including a second fully transparent region 4301 and an opaque region is aligned with the substrate 1101, and the photoresist layer 1103 is exposed by the second mask 430. The second fully transparent region 4301 corresponds to the position region where the original auxiliary block 112 is located, wherein the light intensity of the light passing through the first fully transparent region 4201 is greater than the light intensity of the light passing through the second fully transparent region 4301.

[0124] Then, the second mask 430 is removed, and the optical adhesive layer 1103 is developed, so that the thickness of the optical adhesive layer 1103 at the positions corresponding to the stacked structure 113 and the signal trace 111 is greater than the thickness of the optical adhesive layer 1103 at the positions corresponding to the original auxiliary block 112'. The optical adhesive layer 1103 at the positions corresponding to the stacked structure 113 and the signal trace 111 can be retained, the optical adhesive layer 1103 at the positions other than the stacked structure 113, the signal trace 111 and the original auxiliary block 112 is removed, the optical adhesive layer 1103 at the positions corresponding to the gap between the signal trace 111 and the original auxiliary block 112 is removed, and the optical adhesive layer 1103 at the position of the original auxiliary block 112 is thinned.

[0125] The execution order of the step of exposing the optical adhesive layer 1103 by the first mask 420 and the step of exposing the optical adhesive layer 1103 by the second mask 430 can be exchanged. The exposure of the optical adhesive layer 1103 by the first mask 420 can be performed before or after the exposure of the optical adhesive layer 1103 by the second mask 430. After the exposure of the optical adhesive layer 1103 by the first mask 420 and the exposure of the optical adhesive layer 1103 by the second mask 430, the development process can be performed.

[0126] Further, after the patterning process in step S52, the third conductive layer 11023 at the positions corresponding to the original auxiliary block 112 is removed, so that the second conductive layer 11022 of the original auxiliary block 112 is exposed. Compared with the method of providing a non-functional auxiliary etching trace (for example, a Dummy line, the non-functional auxiliary etching trace includes the stacked first conductive layer, the second conductive layer and the third conductive layer), the original auxiliary block 112 in the embodiment has a smaller metal area, and the problem of excessive lateral etching of the signal trace 111 is solved. In subsequent packaging, the metal layer in the embodiment contacts the inorganic packaging layer, and the area of the metal layer is smaller and there is no problem of poor adhesion of the side surface of the auxiliary etching trace to the inorganic packaging layer, so that the probability of packaging failure is reduced.

[0127] In the embodiments of the present application, the original auxiliary block 112 can be located between the adjacent signal lines 111, wherein the size of the original auxiliary block 112 is proportional to the size of the gap between the adjacent signal lines 111, and the exposed area of the second conductive layer 11022 in the original auxiliary block 112 is not less than the sum of the side exposed areas of the second conductive layer 11022 on the side of the original auxiliary block 112 in the two adjacent signal lines 111. The above design can consume the etching liquid during the lateral etching by increasing the area of the exposed second conductive layer 11022 in the original auxiliary block 112, and weaken the lateral etching speed of the etching liquid on the second conductive layer 11022 in the adjacent signal lines 111. The etching liquid can be a mixed solution of H3PO4, HNO3 and CH3COOH, a mixed solution of H3PO4 and HNO3, or a mixed solution of H2SO4 and HNO3, etc.

[0128] In the embodiments of the present application, the adjacent signal lines 111 can include a high potential signal line (for example, a VDD signal line) and a low potential signal line (for example, a VSS signal line) for providing an electrical signal to the display driving circuit.

[0129] In the embodiments of the present application, an organic adhesive layer can also be made on the signal line 111 in the non-display area 130 which is not covered by the encapsulation layer 115, so as to prevent the signal line 111 at this position from being eroded by water and oxygen in the air.

[0130] In summary, the display panel, the display device and the display panel manufacturing method provided by the embodiments of the present application have the following advantages. The display panel includes signal lines and auxiliary blocks which are arranged close to and spaced apart from the signal lines. The signal lines include a first conductive layer, a second conductive layer and a third conductive layer which are stacked in turn in the direction away from the substrate. The etching resistance of the second conductive layer is lower than the etching resistance of the first conductive layer and the etching resistance of the third conductive layer. The auxiliary blocks are obtained by etching the original auxiliary blocks by etching liquid. The above display panel structure slows down the lateral etching of the second conductive layer in the signal lines by the etching liquid through the way of consuming the etching liquid by the original auxiliary blocks arranged on the side of the signal lines. In this way, the encapsulation failure caused by the excessive lateral etching of the second conductive layer in the signal lines can be avoided, and the photoresist layer protection of the signal lines is not needed when etching other structures in the display panel, thereby reducing the manufacturing cost of the display panel.

[0131] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Various modifications and changes can be made by those skilled in the art within the spirit and principle of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that, The display panel includes a substrate, signal traces located on the substrate, and an auxiliary block disposed near and spaced apart from the signal traces. The signal trace has a composite conductive structure, which includes a first conductive layer, a second conductive layer and a third conductive layer stacked sequentially along a direction away from the substrate. The etching resistance of the second conductive layer is lower than that of the first conductive layer and the third conductive layer. The auxiliary block includes a first portion disposed on the same layer as the first conductive layer, or the auxiliary block includes a first portion disposed on the same layer as the first conductive layer and a second portion disposed on the same layer as the second conductive layer, which are sequentially stacked along a direction away from the substrate; the thickness of the second portion along the first direction is less than the thickness of the second conductive layer of the signal trace along the first direction; The display panel has a display area, an opening area, and an isolation area located between the display area and the opening area; The display panel further includes a light-emitting functional layer located on the substrate. The light-emitting functional layer is located between the display area and the isolation area. A stacked structure is disposed in the isolation area. The light-emitting functional layer covers the stacked structure and is separated by the stacked structure. The stacked structure and the signal trace have the same composite conductive structure. The side of the second conductive layer in the stacked structure facing and / or away from the opening area is recessed relative to the same side of its first and third conductive layers.

2. The display panel as described in claim 1, characterized in that, The second conductive layer in the signal trace is recessed on the side facing the auxiliary block relative to the same side of its first and third conductive layers.

3. The display panel as described in claim 1, characterized in that, The thickness of the auxiliary block along the first direction is less than the sum of the thicknesses of the first conductive layer and the second conductive layer of the signal trace along the first direction, and the first direction is parallel to the thickness direction of the substrate.

4. The display panel as described in claim 1, characterized in that, The signal traces are at least two, and the auxiliary block is located between adjacent signal traces; The adjacent signal traces include high-potential signal traces and low-potential signal traces.

5. The display panel as described in claim 1, characterized in that, The display panel also has a non-display area, the signal traces extend from the display area to the non-display area, and the auxiliary block is located in the non-display area.

6. The display panel as described in claim 1, characterized in that, The first conductive layer and the third conductive layer are made of the same material, which is either Ti or Mo, while the second conductive layer is made of Al.

7. The display panel as described in claim 1, characterized in that, The isolation area is provided with multiple stacked structures, which are arranged along the direction from the opening area to the display area; The gap between adjacent stacked structures is smaller than the gap between adjacent signal traces located on both sides of the auxiliary block.

8. The display panel as described in any one of claims 1 to 7, characterized in that, The display panel further includes an encapsulation layer, which includes a first inorganic layer located on the side of the signal traces and the auxiliary block away from the substrate. The first inorganic layer is in contact with the third conductive layer of the signal trace and the auxiliary block.

9. A display panel, characterized in that, The display panel includes a substrate, signal traces located on the substrate, and an auxiliary block disposed near and spaced apart from the signal traces. The signal trace has a composite conductive structure, which includes a first conductive layer, a second conductive layer and a third conductive layer stacked sequentially along a direction away from the substrate. The etching resistance of the second conductive layer is lower than that of the first conductive layer and the third conductive layer. The auxiliary block is obtained by performing auxiliary side etching on the signal trace using the original auxiliary block. The original auxiliary block reduces the lateral etching of the second conductive layer in the signal trace by the etching solution through its own structure.

10. A display device, characterized in that, include: A photosensitive element and a display panel as described in any one of claims 1-9, wherein the photosensitive element is located on the non-light-emitting side of the display panel; The photosensitive element is located in the opening area of ​​the display panel, and the photosensitive element is used to collect light passing through the opening area.

11. A method for manufacturing a display panel, characterized in that, The method includes: Provide a substrate; Signal traces and an original auxiliary block near the signal traces are fabricated on the substrate. The signal traces have a composite conductive structure. The composite conductive structure includes a first conductive layer, a second conductive layer, and a third conductive layer stacked sequentially in a direction away from the substrate. The etching resistance of the second conductive layer is lower than that of the first conductive layer and the third conductive layer. The signal trace is laterally etched, and the lateral etching of the second conductive layer in the signal trace is slowed down by etching a portion of the conductive layer in the original auxiliary block with an etching solution, resulting in an auxiliary block and the laterally etched signal trace. The auxiliary block is obtained by etching a portion of the conductive layer in the original auxiliary block.

12. The method for manufacturing a display panel as described in claim 11, characterized in that, The display panel includes a display area, an aperture area, and an isolation area located between the display area and the aperture area. The step of fabricating signal traces and an initial auxiliary block near the signal traces on the substrate includes: A composite conductive layer is fabricated on the substrate, the composite conductive layer comprising a first conductive layer, a second conductive layer and a third conductive layer; The composite conductive layer is patterned to obtain the signal trace, the original auxiliary block located on one side of the signal trace, and the stacked structure located in the isolation region.

13. The method for manufacturing a display panel as described in claim 12, characterized in that, The original auxiliary block is composed of the first conductive layer and the second conductive layer. The step of patterning the composite conductive layer to obtain the signal trace, the original auxiliary block located on one side of the signal trace, and the stacked structure located in the isolation region includes: An optical adhesive layer is fabricated on the composite conductive layer; After exposing and developing the optical adhesive layer using a photomask, the pattern is transferred onto the optical adhesive layer so that the thickness of the optical adhesive layer at the corresponding positions of the stacked structure and the signal trace is greater than the thickness of the optical adhesive layer at the corresponding positions of the original auxiliary block. The composite conductive layer is etched to obtain the stacked structure, the signal traces, and the original auxiliary block, wherein the third conductive layer at the location of the original auxiliary block is removed, and the second conductive layer at the location of the original auxiliary block is exposed. Wherein, there are at least two signal traces, and the auxiliary block is located between adjacent signal traces; the exposed area of ​​the second conductive layer in the original auxiliary block is greater than or equal to the sum of the exposed areas of the second conductive layers of the adjacent signal traces facing the original auxiliary block; The display panel also has a non-display area, the signal traces extend from the display area to the non-display area, and the auxiliary block is located in the non-display area.

14. The method for manufacturing a display panel as described in claim 13, characterized in that, The mask is a semi-transparent mask; The step of exposing and developing the optical adhesive layer using a mask, and then transferring the pattern onto the optical adhesive layer so that the thickness of the optical adhesive layer at the corresponding positions of the stacked structure and the signal traces is greater than the thickness of the optical adhesive layer at the corresponding positions of the original auxiliary block includes: Select a semi-transparent photomask comprising opaque, fully transparent, and partially transparent regions, and align the semi-transparent photomask with the substrate. The optical resist layer is a positive photoresist layer. The opaque region corresponds to the location of the stacked structure and the signal traces, the partially transparent region corresponds to the location of the original auxiliary block, and the fully transparent region corresponds to the gap between the signal traces and the original auxiliary block. Alternatively, the optical resist layer is a negative photoresist layer. The fully transparent region corresponds to the location of the stacked structure and the signal traces, the partially transparent region corresponds to the location of the original auxiliary block, and the opaque region corresponds to the gap between the signal traces and the original auxiliary block. After the optical adhesive layer is exposed and developed using the semi-transparent mask, the thickness of the optical adhesive layer at the corresponding positions of the stacked structure and the signal trace is made greater than the thickness of the optical adhesive layer at the corresponding positions of the original auxiliary block.

15. The method for manufacturing a display panel as described in claim 13, characterized in that, The step of exposing and developing the optical adhesive layer using a mask, and then transferring the pattern onto the optical adhesive layer so that the thickness of the optical adhesive layer at the corresponding positions of the stacked structure and the signal traces is greater than the thickness of the optical adhesive layer at the corresponding positions of the original auxiliary block includes: Select a first mask that includes a first fully transparent area and an opaque area, and a second mask that includes a second fully transparent area and an opaque area; Align the first photomask with the substrate, and expose the optical resist layer through the first photomask; wherein, the optical resist layer is a positive photoresist layer, and the first fully transparent area corresponds to the location of the gap between the signal trace and the original auxiliary block; or, the optical resist layer is a negative photoresist layer, and the first fully transparent area corresponds to the location of the stacked structure and the signal trace. The second mask is aligned with the substrate, and the optical adhesive layer is exposed through the second mask; the second fully transparent area corresponds to the location of the original auxiliary block, wherein the light intensity of the light transmitted through the first fully transparent area is greater than the light intensity transmitted through the second fully transparent area; The optical adhesive layer is developed so that the thickness of the optical adhesive layer at the corresponding positions of the stacked structure and the signal trace is greater than the thickness of the optical adhesive layer at the corresponding positions of the original auxiliary block.

Images