Server chassis design for high power density electronic equipment thermal management

Abstract

A server chassis for an electronic rack is disclosed. The server chassis includes a tray to house one or more information technology (IT) components. The server chassis is stackable in a stack on the electronic rack, where each server chassis is divisible into a top section and a bottom section in a design. The bottom section of the server includes the tray. The top section of the server includes a fixed panel that is fixed to the server chassis, one or more frames that are adjustably attached to the fixed panel, and one or more cooling units that are attachable to the one or more frames. The one or more cooling units interface with the one or more IT components to cool the one or more IT components, where the one or more frames are repositionable to different locations of the fixed panel.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to cooling of servers and data centers. More specifically, embodiments of the present invention relate to server chassis designs for thermal management of high power density electronic devices. Background Technology

[0002] Generally, a computing motherboard includes various interfaces for exchanging data with various components. These interfaces include the Peripheral Component Interconnect (PCI), which accepts peripheral printed circuit boards (PCBs). Peripheral PCBs (or peripheral devices) are generally smaller than the motherboard and can include electronic devices such as graphics processing units (GPUs), cryptographic accelerators, application-specific integrated circuits (ASICs), high-performance computing IC chips or chips, etc. Various standards are available for peripheral component interconnect, such as PCI, PCI-X, AGP, PCIe (PCIexpress), etc. What these standards have in common is that they all enable communication between components mounted on the motherboard and components mounted on the peripheral PCB at different speeds.

[0003] As modern computing demands increase, more and more tasks are offloaded from the main CPU to other components, including those mounted on peripheral PCBs. Consequently, the processing power of these peripheral PCBs increases, leading to higher energy demands and thus increased heat dissipation requirements.

[0004] As workloads become more diverse and computing architectures become more heterogeneous, a new thermal management solution is needed that can interoperate with different server system designs and peripheral PCB constructions. Summary of the Invention

[0005] The present invention provides a server chassis for an electronic rack, comprising: a tray for accommodating one or more IT components, wherein the server chassis are stackable in a stack on an electronic rack, wherein each server chassis is further divided into a top section and a bottom section, the bottom section including the tray, wherein the top section includes: a mounting panel fixed to the server chassis; one or more frames adjustably attached to the mounting panel; and one or more cooling units attached to the one or more frames, the one or more cooling units mating with the one or more IT components to cool the one or more IT components, wherein the one or more frames are repositionable to different locations on the mounting panel.

[0006] According to some embodiments, the frame includes a mountable arm, and the one or more cooling units can be mounted on the mountable arm.

[0007] According to some embodiments, the one or more IT components comprise one or more PCIE devices, and the server having the one or more IT components, when in operation, the one or more frames are repositionable to different locations on the fixed panel.

[0008] According to some embodiments, the fixed panel comprises one or more recessed channels, wherein the first portion of the frame is insertable into a recessed channel of the one or more recessed channels.

[0009] According to some embodiments, the server chassis further comprises a locking kit insertable between the first portion of the frame and the fixed panel, the locking kit is rotatable to lock the frame to the fixed panel.

[0010] According to some embodiments, the locking kit comprises an oblong pin, and the first end of the frame comprises an oblong opening, wherein the oblong pin is insertable into the oblong opening.

[0011] According to some embodiments, the fixed panel comprises one or more first cushion layers and one or more second cushion layers, the one or more second cushion layers facing the one or more first cushion layers, wherein the one or more first cushion layers and the one or more second cushion layers form one or more recessed channels.

[0012] According to some embodiments, if the locking kit is in a locked position, the locking kit causes a top portion of the frame to press against the second cushion layer, which in turn causes the PCIE devices coupled to the frame to mate with the PCIE slots.

[0013] According to some embodiments, if the locking kit is in an unlocked position, the PCIE devices associated with the locking kit are raised from the PCIE slots.

[0014] According to some embodiments, the cooling unit comprises a heat sink or a cooling fan, wherein the cooling unit can be integrated individually to the top section, or as a peripheral package, wherein the peripheral package comprises the cooling unit and a peripheral device.

[0015] The present invention provides an electronic rack for a data center, comprising: a plurality of server chassis according to claims 1-10 arranged in a stack.

[0016] The present invention provides an electronic rack for a data center, comprising: a fixing panel fixed to the electronic rack; one or more frames adjustablely attached to the fixing panel; and one or more cooling units attached to the one or more frames, the one or more cooling units docking with one or more IT components to cool the one or more IT components, wherein the one or more frames are repositionable to different locations on the fixing panel.

[0017] According to some embodiments, each frame includes a mountable arm, and the one or more cooling units can be mounted on the mountable arm.

[0018] According to some embodiments, the one or more IT components include one or more PCIe devices, and when the server having the one or more IT components is in operation, the one or more frames can be repositioned to different positions on the fixed panel.

[0019] According to some embodiments, the fixing panel includes one or more recessed channels, wherein a first portion of the frame can be inserted into the recessed channels of the one or more recessed channels.

[0020] According to some embodiments, the electronic rack further includes an insertable locking kit between a first portion of the frame and the fixed panel, the locking kit being rotatable to lock the frame to the fixed panel. Attached Figure Description

[0021] Embodiments of the present invention are shown in the accompanying drawings by way of example rather than limitation, wherein the same reference numerals denote similar elements.

[0022] Figure 1 This is a perspective view of a server chassis according to one embodiment.

[0023] Figure 2A This is a top view of the top cooling section of a server chassis according to one embodiment.

[0024] Figure 2B This is a front view of the top cooling section according to one embodiment, showing a frame with a single mounting arm.

[0025] Figure 3A This is a top view of the top cooling section of a server chassis according to one embodiment.

[0026] Figure 3B This is a front view of the top cooling section according to one embodiment, showing a frame with dual mounting arms.

[0027] Figure 4A is a side view of a top cooling section according to one embodiment, showing a locking kit in an unlocked position.

[0028] Figure 4B is a side view of a top cooling section according to one embodiment, showing a locking kit in a locked position.

[0029] Figure 5 is a front view of a frame according to one embodiment, showing an embodiment of a locking kit.

[0030] Figure 6 is a front view of a top cooling section according to one embodiment, showing a locking and unlocking of a locking kit.

[0031] Figure 7A is a front view of a chassis assembled with one or more cooling units according to one embodiment.

[0032] Figure 7B is a side view of a chassis assembled with one or more cooling units according to one embodiment.

[0033] Figure 8A is a front view of a chassis assembled with one or more cooling units according to one embodiment.

[0034] Figure 8B is a top view of a chassis assembled with one or more cooling units according to one embodiment.

[0035] Figure 9A is a front view of a chassis assembled with one or more cooling units supporting a first peripheral device arrangement according to one embodiment.

[0036] Figure 9B is a front view of a chassis assembled with one or more cooling units supporting a second peripheral device arrangement according to one embodiment.

[0037] Figure 10 cooling units are shown as insertable from the top of the chassis according to one embodiment.

[0038] Figure 11A is a front view of a chassis according to one embodiment, showing cooling units and peripherals as insertable and / or removable from the front / back of the chassis.

[0039] Figure 11B is a side view of a chassis according to one embodiment, showing cooling units and peripherals as insertable and / or removable from the front / back of the chassis.

[0040] Figure 12A is a front view of a chassis according to one embodiment, showing a spacing when a peripheral PCB is mated with a motherboard.

[0041] Figure 12B is a front view of a chassis according to one embodiment, showing the spacing when the peripheral PCB is not mated with the motherboard.

[0042] Figure 13 is a front view of a rack according to one embodiment.

[0043] Figure 14 is a perspective view of a server rack with systems of different power densities and peripheral configurations according to one embodiment.

[0044] Figure 15 is a block diagram illustrating an example of an electronic rack according to one embodiment. DETAILED DESCRIPTION

[0045] Various embodiments and aspects of the present invention will be described with reference to details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and drawings are illustrative of the present invention and are not to be construed as limiting the present invention. Numerous specific details are described to provide a thorough understanding of various embodiments of the present invention. However, in certain instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the present inventions.

[0046] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the disclosure. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

[0047] Embodiments of the present disclosure provide a server chassis layout that is compatible with server systems having different power densities and / or peripheral configurations in an electronic rack used in a data center. The server chassis is hot-pluggable, and cooling units used within the server chassis can be serviced and / or replaced without having to remove the server chassis from the electronic rack. The cooling units can support air cooling or liquid / fluid cooling. Note that server systems with different energy densities can refer to servers running different numbers of peripherals. Different peripheral configurations can refer to peripherals having different form factors and / or peripherals that are mated at different peripheral expansion locations on the motherboard.

[0048] According to one embodiment, a server chassis of an electronic rack includes a tray to house one or more information technology (IT) components. The server chassis is stackable in a stack on the electronic rack, and wherein each server chassis is dividable into a top section and a bottom section, wherein the bottom section includes the tray. The top section of the server chassis includes a fixed panel fixed to the server chassis, one or more frames adjustably attached to the fixed panel, and one or more cooling units attachable to the one or more frames. The one or more cooling units interface with the one or more IT components to cool the one or more IT components, wherein the one or more frames are repositionable to different locations on the fixed panel.

[0049] In one embodiment, the frame includes mountable arms, and the one or more cooling units are mountable on the mountable arms. In one embodiment, the one or more IT components include one or more peripheral component interconnect express (PCIE) devices, and the one or more frames are repositionable to different locations on the fixed panel while the server is operating with the one or more IT components.

[0050] In one embodiment, the fixed panel includes one or more recessed channels, wherein a first portion of the frame is insertable into a recessed channel of the one or more recessed channels. In one embodiment, the server chassis further includes a locking kit insertable between the first portion of the frame and the fixed panel, the locking kit is rotatable to lock the frame to the fixed panel.

[0051] In one embodiment, the locking kit includes an oblong pin, and a first end of the frame includes an oblong opening, wherein the oblong pin is insertable into the oblong opening. In one embodiment, the fixed panel includes one or more first cushion layers and one or more second cushion layers facing the one or more first cushion layers, wherein the one or more first cushion layers and the one or more second cushion layers form the one or more recessed channels.

[0052] In one embodiment, if the locking kit is in a locked position, the locking kit presses a top portion of the frame against the second cushion layer, which in turn causes a PCIE device coupled to the frame to interface with a PCIE slot. In one embodiment, if the locking kit is in an unlocked position, the PCIE device associated with the locking kit is raised from the PCIE slot. In one embodiment, the cooling unit includes a heat sink and a cooling fan.

[0053] Figure 1is an isometric view of a server chassis 203 according to an embodiment. In an embodiment, the server chassis 203 includes a cooling unit 305 and peripherals 307 cooled by the cooling unit 305. The server chassis 203 can include one or more IT components and / or trays for housing one or more IT components (e.g., central processing units or CPUs and / or peripherals). The IT components can perform data processing tasks, where the IT components can include software installed in a storage device, loaded into a memory, and executed by one or more processors to perform the data processing tasks. The server chassis 203 can include a host server or computing server (e.g., a CPU server or a GPU server). The host server (with one or more CPUs) typically interfaces with customers over a network (e.g., the Internet) to receive requests for certain services such as storage services (e.g., cloud-based storage services such as backup and / or recovery), execute applications to perform certain operations (e.g., image processing, deep data learning algorithms or modeling, etc. as part of a software as a service or SaaS platform). To respond to the requests, the host server allocates tasks to computing servers (with one or more GPUs) managed by the host server. The computing servers perform the actual tasks, which can generate heat during operation.

[0054] In an embodiment, the server chassis 203 can be divided into a top cooling section 301 and a bottom IT component section 303. The top section includes various cooling components (such as the cooling unit 305) to cool the servers within the server chassis. The bottom IT component section 303 can include trays 310, a main electronic board 309 placed on the trays 310, and one or more peripherals 307 connected to the main electronic board 309. The peripherals 307 can be GPUs, application specific integrated circuits (ASICs), compute accelerators, high compute based IC chips or chips, etc. The peripherals can interface with the main electronic board 309 through a peripheral expansion bus (e.g., PCIe).

[0055] Figure 2A and Figure 3A is a top view of the top cooling section 301 of the server chassis 203 according to some embodiments. Figure 2B and Figure 3B is a front view of the top cooling section 301 according to some embodiments, showing a frame 403 with a single mounting arm and a frame 405 with a double mounting arm.

[0056] Referring to FIGS. 2-3, the top cooling section 301 can include a fixed panel 401. The fixed panel 401 can be integrated with the server chassis 203 or can be a separate panel that can be flexibly assembled to the server chassis 203. In one embodiment, the fixed panel 401 can be fixed to a side panel of the server chassis.

[0057] In one embodiment, the fixed panel 401 can be used to secure one or more frames 403-405 to the server chassis 203. For example, the fixed panel 401 can include one or more recessed channels. The frames 403-405 can slide into the recessed channels and the frames 403-405 can be locked into the recessed channels via a locking kit (as further shown in FIGS. 4-6). In one embodiment, the frames 403-405 are single frames 403 or double frames 405. The single frames 403 can include a single fixed mounting arm while the double frames 405 can include two fixed mounting arms. The frames 403-405 are then used to attach to cooling units, as further shown in FIGS. 7-9. Note that the length of the arms of the frames 403-405 can vary to support cooling units of different form factors. Figure 6 In one embodiment, the fixed panel 401 can be used to secure one or more frames 403-405 to the server chassis 203. For example, the fixed panel 401 can include one or more recessed channels. The frames 403-405 can slide into the recessed channels and the frames 403-405 can be locked into the recessed channels via a locking kit (as further shown in FIGS. 4-6). In one embodiment, the frames 403-405 are single frames 403 or double frames 405. The single frames 403 can include a single fixed mounting arm while the double frames 405 can include two fixed mounting arms. The frames 403-405 are then used to attach to cooling units, as further shown in FIGS. 7-9. Note that the length of the arms of the frames 403-405 can vary to support cooling units of different form factors.

[0058] As shown in FIGS. 2-3, the number of frames 403-405 and the location of the frames 403-405 can vary. The varying frame count and / or varying locations enable the fixed panel 401 to support server systems with different power densities and peripherals of different configurations.

[0059] In one embodiment, the double frames 405 can be used to attach to cooling units having a standard form factor since the spacing between the two arms of the double frame is fixed and cannot be changed. In one embodiment, the single frames 403 can be used to attach cooling units of cooling devices having a non-standard form factor. In one embodiment, the arms of the single or double frames can be used to secure the cooling devices on one side of the arms or on both sides of the arms. In some embodiments, the size of the frames can vary.

[0060] Figure 4A FIG. 4 is a side view of a top cooling section according to one embodiment, showing a locking kit in an unlocked position. Figure 4B FIG. 5 is a side view of a top cooling section according to one embodiment, showing a locking kit in a locked position.

[0061] As Figure 4AAs shown, the fixed panel 401 includes one or more top buffer layers 503 and one or more bottom buffer layers 505. In one embodiment, the top buffer layer 503 and the bottom buffer layer 505 include flexible material layers and / or mechanical buffer layers. In one embodiment, the flexible material / mechanical buffer of the top buffer layer 503 faces the flexible material / mechanical buffer of the bottom buffer layer 505. In one embodiment, the fixed panel 401 includes a structural beam extending from the top buffer layer 503 to the bottom buffer layer 505 to provide structural support between the top buffer layer 503 and the bottom buffer layer 505.

[0062] In one embodiment, two buffer layers 503 to 505 form a recessed channel for assembling the frame to the fixed panel 401. The frame 403 may include two portions: a top portion 403A and a bottom portion 403B. The top portion 403A may be molded to mechanically fit within the recessed channel formed by the buffer layers 503 to 505 within the fixed panel 401. The bottom portion 403B may be used for integration with one or more cooling units.

[0063] In one embodiment, a locking kit 501 is provided to structurally lock the frame 403 to the fixed panel 401. When the locking kit 501 is in the unlocked position (e.g. Figure 4A As shown), the position of the frame can be slidably adjusted along the recessed channel. In one embodiment, the locking kit 501 can be rotated to place the locking kit 501 in the locked position. Figure 4B As shown, the locking kit 501 in the locked position secures the frame 403 against the top buffer layer 503 or the bottom buffer layer 505 of the fixed panel 401.

[0064] Figure 5 This is a front view of a frame according to one embodiment, illustrating an embodiment of the locking kit. Figure 5 As shown, the locking kit 501 may include a tube or plate having an elliptical body, wherein one end of the frames 403 to 405 may include an elliptical opening for the locking kit 501 to be inserted between the frames 403 to 405 and the top buffer layer. In one embodiment, the locking kit 501 may resemble a rod of a plate body having an elliptical head. In one embodiment, when the locking kit is inserted into the frame 403 between the frame 403 and the top buffer layer of the fixed panel 401, the locking kit 501 may rotate approximately 90 degrees to lock the frame 403 onto the fixed panel 401. In one embodiment, when the locking kit 501 is in the locked position, the rod of the locking kit 501 is pressed against the top pad layer 503 and the frame 403. In one embodiment, when the locking kit 501 is in the locked position, the top portion 403A of the frame is pressed against the bottom buffer layer 505 of the fixed panel 401.

[0065] In one embodiment, the fixed panel 401 and the frames 403-405 are used as a structural support for the cooling units and the peripheral devices coupled with the frames 403-405.

[0066] Figure 6 is a front view showing the top cooling section according to one embodiment, showing the locking and unlocking of the locking kit. Figure 6 It is shown that the double frame 405 includes a top portion and two mounting arms. The top portion of the frame 405 is assembled within the recessed channel between the top cushion layer 503 and the bottom cushion layer 505, which collectively support the top portion of the double frame 405. The left frame 405A shows the locking kit 501 in the locked position, and the right frame 405B shows the locking kit 501 in the unlocked position.

[0067] Figure 7A is a front view of the chassis 203 assembled with one or more cooling units according to one embodiment. Figure 7B is a side view of the chassis 203 assembled with one or more cooling units according to one embodiment.

[0068] As shown in Figures 7A-7B , the cooling unit 701 is assembled with the electronic package 307 using the fixed panel 401 and the frame 403 / 405 to the chassis 203. It can be seen that the frame 403 / 405 is used to secure the cooling unit 701. In one embodiment, the cooling unit 701 can include a heat exchanger, a heat sink, and / or a fan, where the cooling unit 701 is located between any two arms of the frame 403 / 405.

[0069] Figure 8A is a front view of the chassis assembled with one or more cooling units according to one embodiment. Figure 8B is Figure 8A a top view of the chassis.

[0070] Figures 8A-8B shows four cooling units 701 assembled in the chassis 203. Figure 8B shows the fixed panel 401 covered by the cooling unit 701, where the cooling unit 701 is secured by one or more frames 403-405 (not shown). In one embodiment, the cooling unit 701 can include one or more cooling devices. The cooling device can be a fan, a heat sink, a heat exchanger, a liquid-cooled cold plate, etc.

[0071] In one embodiment, reference is made to Figure 8BThe spacing not covered by the cooling components 801-803 can be covered by blank panels 805. The blank panels 805, together with the cooling units 701, can form air channels 811 between the peripheral devices to direct airflow from the front to the back of the server chassis.

[0072] Figure 8B It is shown that the channels formed between the frames 403-405 can be equipped with different cooling components, such as fans 803, and heat exchangers 801. In one embodiment, the length of the arms (not shown) of the frames 403-405 can be different, e.g., full length or half length frames. For example, large cooling fans 803 can be assembled between one or more full length frames and then inserted within the server chassis. Cooling heat exchangers 801 can then be assembled between the full length frames and the half length frames and then inserted within the server chassis. In one embodiment, the cooling fans 803 can be used as shared fans for one or more heat exchangers 801.

[0073] Figure 9A is a front view of a chassis supporting a first arrangement of peripheral devices assembled with one or more cooling units according to one embodiment. Figure 9B is a front view of a chassis supporting a second arrangement of peripheral devices assembled with one or more cooling units according to one embodiment.

[0074] As shown in Figures 9A-9B , since the main server board can vary in the number of peripheral device expansions and their locations, the server IT component section 303 can be configured with different numbers of peripheral devices at different locations. For example, the IT components in section 303 can have different numbers of PCIe expansion slots and the locations of the PCIe expansion slots can vary. Here, the top section 301 allows for different numbers of cooling units 701 to be installed and allows for installation at different locations, thus, this flexibility of the top section 301 improves interoperability between different server board designs.

[0075] Figure 10According to one embodiment, the cooling unit is shown to be insertable from the top of the chassis 203. As shown, in one embodiment, the design of the fixed panel should allow the cooling unit to be installed to the server before the server is installed to the rack. In one embodiment, a portion of the top section 301 is not fully covered by the fixed panel 401 (not shown). For example, the recessed channel formed by the fixed panel 401 (not shown) can not span the entire length of the chassis 203. In one embodiment, the recessed channel can be formed on opposite sides of the fixed panel, while the middle portion of the fixed panel has an opening for the cooling unit to be inserted. In this case, when the server chassis 203 is detached from the electronic rack, the frame 403 to 405 and the cooling unit 701 can be inserted into the server 203 from the opening along with the peripherals 307. The locking kits then secure the frame 403 to 405 to the fixed panel 401.

[0076] Figure 11A is a front view of the chassis according to one embodiment, and Figure 11B is a side view of the chassis according to one embodiment, showing that the cooling unit and peripherals are insertable and / or removable from the front / back of the chassis. Figures 11A-11B As shown, the server chassis 203 allows the addition and / or removal of cooling units and / or electronic packages even when the server chassis is installed in an electronic rack. In one embodiment, the frame can be moved along the recessed channel formed by the two buffer layers when unlocked. In one embodiment, the entire peripheral package 1103 (e.g., electronic package and cooling unit) can be lifted as shown when unlocked. For example, when the cooling unit 701 needs to be serviced or removed from the chassis 203, one or more locking kits (not shown) of the frame can be turned, and then the frame is lifted to remove the peripheral package 1103 from the peripheral connector 1101. The peripheral package 1103 can then be moved along the recessed channel and removed horizontally from the front or back side of the chassis 203. Figure 11B

[0077] Figure 12A is a front view of the chassis according to one embodiment, showing one or more clearances when the peripheral PCB is mated with the mainboard. Figure 12B is Figure 12A a front view of Figures 12A-12B As shown, the chassis 204 with clearances 1201 to 1205 can be used to add and / or remove peripherals 1103 from the chassis 203 while the chassis 203 remains in the electronic rack. For example, when the peripherals 1103 are unlocked and removed through the front or back side of the chassis, the clearance 1201 ensures there is enough gap between the cooling unit 701 and the fixed panel 401. The clearances 1203 and 1205 can be the distance from the frame to the top buffer layer of the fixed panel 401 when the frame is locked and unlocked, respectively. For example, as shown, the frame 403 to 405 can be moved along the recessed channel formed by the fixed panel 401 (not shown) when the frame is unlocked.​Figure 12A As shown, there is a gap 1203 between the frame and the top cushion layer of the securing panel 401 when the frame is locked. As shown, there is a gap 1205 between the frame and the top cushion layer of the securing panel 401 when the frame is locked. In one embodiment, the peripheral device interfaces with the peripheral slot 1101 when the frame is locked. The gaps 1203-1205 can provide sufficient clearance so that the peripheral package 1103 can interface with the peripheral slot 1101 and / or disengage from the peripheral slot 1101 as the locking assembly is turned. Figure 12B As shown, there is a gap 1203 between the frame and the top cushion layer of the securing panel 401 when the frame is locked. As shown, there is a gap 1205 between the frame and the top cushion layer of the securing panel 401 when the frame is locked. In one embodiment, the peripheral device interfaces with the peripheral slot 1101 when the frame is locked. The gaps 1203-1205 can provide sufficient clearance so that the peripheral package 1103 can interface with the peripheral slot 1101 and / or disengage from the peripheral slot 1101 as the locking assembly is turned.

[0078] Figure 13 is a front view of a rack according to one embodiment. Figure 13 Racks with different server system implementations are shown. For example, in one embodiment, a server system can include a chassis 203 having a top section 301 and a bottom section 302. In one embodiment, a cooling section (such as the cooling section 301 of Figure 1 ) can be implemented as part of a server system, as shown by the server 1301. In this case, the securing panel (including the locking assembly) of the cooling section can be structurally secured to the motherboard of the server 1301, rather than to the server chassis. In some embodiments, the support Figure 5 The same locking mechanism securing panel 401 described in FIGS. 13A-13D can be implemented directly on the rack 200, rather than as part of a server chassis. In this case, the rack 200 can include one or more securing panels 401, where the cooling unit 701 can be directly attached to one or more of the securing panels of the rack 200.

[0079] Figure 14 is a perspective view of a server rack 200 of a server system with different power densities and peripheral configurations according to one embodiment. The electronic rack 200 can include a plurality of server slots (e.g., standard racks or chassis configured with the same or similar form factor) and a plurality of server chassis that can be inserted into and removed from the server slots. Each server chassis can be associated with a host server or computing server. In addition, one or more cooling fans can be associated with the server chassis to provide air cooling for the host / computing servers housed therein. Cool air can enter the electronic rack 200 through their front ends, while warm / hot air can exit the electronic rack 200 from their rear ends.

[0080] As shown, there is a gap 1203 between the frame and the top cushion layer of the securing panel 401 when the frame is locked. As shown, there is a gap 1205 between the frame and the top cushion layer of the securing panel 401 when the frame is locked. In one embodiment, the peripheral device interfaces with the peripheral slot 1101 when the frame is locked. The gaps 1203-1205 can provide sufficient clearance so that the peripheral package 1103 can interface with the peripheral slot 1101 and / or disengage from the peripheral slot 1101 as the locking assembly is turned. Figure 14As shown, server systems 1401-1407 can use server chassis 203 to construct different power densities and / or different peripheral arrangements within a single rack. For example, server systems 1401-1407 can be server setups with different numbers of peripherals and / or peripheral configurations. System 1405 can be a high power density and high performance system with four peripherals. Server systems 1401-1403 can have the same power density, but have different server board layouts. Thus, rack 200 can include server systems 1401-1407 using different configurations of server chassis 203 to meet different computing requirements. Further, within each server system 1401-1407, the airflow management and cooling system configuration can be individualized, independent of one another.

[0081] Figure 15 is a block diagram of an electronic rack according to one embodiment. Electronic rack 1500 can represent any of the electronic racks described in this application. According to one embodiment, electronic rack 1500 includes, but is not limited to, a coolant distribution unit (CDU) 1501, a rack management unit (RMU) 1502, and one or more server chassis 1503A-1503E (collectively, server chassis 1503). Server chassis 1503 can be inserted into an array of server slots (e.g., a standard rack) from either the front end 1504 or the rear end 1505 of electronic rack 1500, respectively. Note that while five server chassis 1503A-1503E are shown here, more or fewer server chassis can be maintained within electronic rack 1500. It is also noted that the particular locations of CDU 1501, RMU 1502, and / or server chassis 1503 are for illustrative purposes only; other arrangements or configurations of CDU 1501, RMU 1502, and / or server chassis 1503 can also be implemented. In one embodiment, electronic rack 1500 can be either open to the environment or housed in part by a rack enclosure, as long as the cooling fans are able to generate airflow from the front end to the rear end.

[0082] Further, for at least some server chassis 1503, optional fan modules (not shown) are associated with the server chassis. Each fan module includes one or more cooling fans. The fan modules can be mounted on the rear end of server chassis 1503 or on the electronic rack to generate airflow from front end 1504, through the air space of server chassis 1503, and exist at rear end 1505 of electronic rack 1500.

[0083] In one embodiment, the CDU 1501 mainly includes a heat exchanger 1511, a liquid pump 1512, and a pump controller (not shown), and some other components (such as a liquid tank, a power supply, monitoring sensors, etc.). The heat exchanger 1511 can be a liquid-liquid heat exchanger. The heat exchanger 1511 includes a first circuit with an inlet port and an outlet port having a first pair of liquid connectors coupled to external liquid supply / return lines 1531-1532 to form a primary circuit. The connectors coupled to the external liquid supply / return lines 1531-1532 can be arranged or mounted on the back end 1505 of the electronic rack 1500. The liquid supply / return lines 1531-1532, also referred to as room liquid supply / return lines, can be coupled to an external cooling system.

[0084] In addition, the heat exchanger 1511 further includes a second circuit with two ports having a second pair of liquid connectors coupled to a liquid manifold 1525 (also referred to as a rack manifold) to form a secondary circuit, which can include a supply manifold (also referred to as a rack liquid supply line or a rack supply manifold) that supplies cooling liquid to the server chassis 1503 and a return manifold (also referred to as a rack liquid return line or a rack return manifold) that returns the warm liquid to the CDU 1501. Please note that the CDU 1501 can be any commercially available CDU or a custom-made CDU. Therefore, the details of the CDU 1501 will not be described here.

[0085] Each server chassis 1503 can include one or more IT components (e.g., central processing units or CPUs, general-purpose / graphics processing units (GPUs), memories, and / or storage devices). Each IT component can perform data processing tasks, where the IT component can include software installed in a storage device, loaded into a memory, and executed by one or more processors to perform data processing tasks. The server chassis 1503 can include a host server (referred to as a host node) coupled to one or more computing servers (also referred to as compute nodes, such as CPU servers and GPU servers). The host server (with one or more CPUs) typically interfaces with customers over a network (e.g., the Internet) to receive requests for specific services, such as storage services (e.g., cloud-based storage services, such as backup and / or recovery), execute applications to perform certain operations (e.g., image processing, deep data learning algorithms or modeling, etc., as part of a software-as-a-service or SaaS platform). To respond to the request, the host server allocates tasks to one or more compute nodes or computing servers (with one or more GPUs) managed by the host server. The computing servers perform the actual tasks, which can generate heat during operation.

[0086] The electronic rack 1500 further includes an optional RMU 1502 configured to provide and manage power supplied to the servers 1503, and a CDU 1501. The RMU 1502 can be coupled to a power supply unit (not shown) to manage power consumption of the power supply unit. The power supply unit can include necessary circuitry (e.g., alternating current (AC) to direct current (DC) or DC to DC power converters, batteries, transformers, or voltage regulators, etc.) to provide power to the remaining components of the electronic rack 1500.

[0087] In one embodiment, the RMU 1502 includes an optimization module 1521 and a rack management controller (RMC) 1522. The RMC 1522 can include a monitor to monitor operating conditions of various components within the electronic rack 1500, e.g., the compute nodes 1503, the CDU 1501, and the fan modules. In particular, the monitor receives operating data from various sensors representative of operating conditions of the electronic rack 1500. For example, the monitor can receive operating data representative of processor temperatures, coolant temperatures, and airflow temperatures, which can be captured and collected via various temperature sensors. The monitor can also receive data representative of fan power and pump power generated by the fan modules and the liquid pump 1512, which can be directly proportional to their respective speeds. These operating data are referred to as real-time operating data. Note that the monitor can be implemented as a separate module within the RMU 1502.

[0088] Based on the operating data, the optimization module 1521 uses a predetermined optimization function or optimization model to optimize to derive a set of optimal fan speeds for the fan modules and an optimal pump speed for the liquid pump 1512 such that the total power consumption of the liquid pump 1512 and the fan modules is minimized while the operating data associated with the cooling fans of the liquid pump 1512 and the fan modules are within their respective design specifications. Once the optimal pump speed and the optimal fan speeds are determined, the RMC 1522 configures the cooling fans of the liquid pump 1512 and the fan modules according to the optimal pump speed and the fan speeds.

[0089] As one embodiment, based on the optimal pump speed, the RMC 1522 communicates with the pump controller of the CDU 1501 to control the speed of the liquid pump 1512, which in turn controls the liquid flow rate of the cooling liquid supplied to the liquid manifold 1525, which will be distributed to at least some of the server enclosures 1503. Likewise, based on the optimal fan speeds, the RMC 1522 communicates with each fan module to control the speed of each cooling fan of the fan module, which in turn controls the airflow rate of the fan module. Note that each fan module can be individually controlled at its particular optimal fan speed, and different fan modules and / or different cooling fans within the same fan module can have different optimal fan speeds.

[0090] Note that the rack configuration shown is for illustrative purposes only; other configurations or arrangements can also be applicable. For example, the CDUs 1501 can be optional units. The cold plates of the server chassis 1503 can be coupled to a rack manifold, which can be coupled directly to the room manifolds 1531-1532 without using the CDUs. Although not shown, power supply units can be arranged within the electronic rack 1500. The power supply units can be implemented as the same or similar standard chassis as the server chassis, where the power supply chassis can be plugged into any one of the standard racks in place of any one of the server chassis 1503. Further, the power supply chassis can further include a battery backup unit (BBU) to provide battery power to the server chassis 1503 when the main power is not available. The BBU can include one or more battery packs, each of which includes one or more battery cells and the necessary charging and discharging circuitry for charging and discharging the battery cells.

[0091] In the foregoing specification, embodiments of the application have been described with reference to specific exemplary embodiments thereof. It will be evident that various modifications can be made thereto without departing from the broader spirit and scope of the application. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.

Claims

1. A server chassis of an electronic rack, comprising: a tray to house one or more IT components, the IT components comprising peripherals, wherein the server chassis is stackable in a stack on an electronic rack, wherein each server chassis is dividable into a top section and a bottom section, the bottom section comprising the tray, wherein the top section comprises: a fixed panel fixed to the server chassis; one or more frames adjustably attached to the fixed panel, wherein the fixed panel comprises one or more recessed channels, wherein a first portion of the frame is insertable into the one or more recessed channels; and one or more cooling units attachable to the one or more frames, the one or more cooling units interfacing with the one or more IT components to cool the one or more IT components, wherein the one or more frames are repositionable to different locations on the fixed panel; further comprising a locking kit insertable between the first portion of the frame and the fixed panel, the locking kit rotatable to lock the frame to the fixed panel, when the locking kit is in an unlocked position, the position of the frame is slidably adjustable along the recessed channel, such that the fixed panel is capable of supporting peripherals of different configurations.

2. The server chassis of claim 1, wherein the frame comprises mountable arms, and the one or more cooling units are mountable on the mountable arms.

3. The server chassis of claim 1, wherein the one or more IT components comprise one or more PCIE devices, and the server with the one or more IT components is operable, the one or more frames are repositionable to different locations on the fixed panel.

4. The server chassis of claim 1, wherein the locking kit comprises an oblong pin, and the first end of the frame comprises an oblong opening, wherein the oblong pin is insertable into the oblong opening.

5. The server chassis of claim 1, wherein, the fixed panel comprises one or more first cushion layers and one or more second cushion layers, the one or more second cushion layers facing the one or more first cushion layers, wherein the one or more first cushion layers and the one or more second cushion layers form the one or more recessed channels.

6. The server chassis of claim 1, wherein if the locking kit is in a locked position, the locking kit presses a top portion of the frame against the second cushion layer, which in turn causes PCIE devices coupled to the frame to interface with PCIE slots.

7. The server chassis of claim 1, wherein, if the locking kit is in an unlocked position, PCIE devices associated with the locking kit are raised from the PCIE slots.

8. The server chassis of claim 1, wherein the cooling units comprise heat sinks or cooling fans, wherein the cooling units are integrable to the top section individually, or as a peripheral package, wherein the peripheral package comprises the cooling units and peripherals.

9. An electronic rack of a data center, comprising: a plurality of server enclosures according to any one of claims 1-8 arranged in a stack.

10. The electronic rack of claim 9, further comprising: a fixed panel fixed to the electronic rack; one or more frames adjustably attached to the fixed panel; and one or more cooling units attachable to the one or more frames, the one or more cooling units interfacing with one or more IT components to cool the one or more IT components, wherein the one or more frames are repositionable to different locations of the fixed panel.

11. The electronic rack of claim 10, wherein each frame comprises a mountable arm and the one or more cooling units are mountable on the mountable arm.

12. The electronic rack of claim 10, wherein the one or more IT components comprise one or more PCIE devices, and the server having the one or more IT components is operable with the one or more frames repositionable to different locations on the fixed panel.

13. The electronic rack of claim 10, wherein the fixed panel comprises one or more recessed channels, wherein a first portion of a frame is insertable into a recessed channel of the one or more recessed channels.

14. The electronic rack of claim 10, further comprising a locking kit insertable between the first portion of the frame and the fixed panel, the locking kit rotatable to lock the frame to the fixed panel. ​

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