Cooling system, method, device, electronic device and non-volatile storage medium

Abstract

The present disclosure provides a cooling system, method, device, electronic device and non-volatile storage medium, which relate to the field of computer technology, and in particular to the field of equipment cooling. The specific implementation scheme is as follows: a cooling system is provided, including a first heat exchange module, a second heat exchange module, a cooling module, and a cooling medium, wherein the cooling medium circulates among the first heat exchange module, the second heat exchange module, and the cooling module in sequence; when the cooling medium flows to the first heat exchange module, the cooling medium in the first heat exchange module absorbs the heat generated when the first element is working; when the cooling medium flows to the second heat exchange module, the cooling medium in the second heat exchange module undergoes a phase change of the first phase change type after absorbing heat, and continues to absorb the heat generated when the second element is working during the phase change process. Compared with the prior art, the cooling system provided by the present disclosure does not need to be equipped with inter-row air conditioners to assist in heat dissipation, which reduces the space required for installing the cooling system and reduces costs.

Description

Technical Field

[0001] The present disclosure relates to the field of computer technology, and in particular to a cooling system, method, device, electronic equipment and non-volatile storage medium. Background Art

[0002] As electronic components develop towards high performance and miniaturization, the integration and energy consumption of electronic components continue to increase, resulting in a rapid increase in heat flux density. The current air cooling method can no longer meet the heat dissipation needs of high-performance components. Liquid cooling has become a new cooling method to solve the heat dissipation problem of high heat flux density due to its more efficient and energy-saving characteristics.

[0003] Cold plate liquid cooling is to transfer the heat of the heating element to the coolant through the plate wall, and then the coolant transfers the heat to the external environment through micro grooves or pipes. During the whole process, the coolant does not directly contact the heating element, so cold plate liquid cooling is an indirect cooling method. In the prior art, the cold plate liquid cooling device uses a single-phase working fluid to take away the heat of the high heat flux density components, and the remaining heat of the components needs to be equipped with inter-row air conditioners to assist in heat dissipation. Summary of the invention

[0004] The present disclosure provides a system, method, apparatus, device and storage medium for cooling.

[0005] According to one aspect of the present disclosure, a cooling system is provided, comprising a first heat exchange module, a second heat exchange module, a cooling module, and a cooling medium, wherein the cooling medium circulates among the first heat exchange module, the second heat exchange module, and the cooling module in sequence; when the cooling medium flows to the first heat exchange module, the cooling medium in the first heat exchange module absorbs heat generated when the first element is working; when the cooling medium flows to the second heat exchange module, the cooling medium in the second heat exchange module undergoes a phase change of a first phase change type after absorbing heat, and continues to absorb heat generated when the second element is working during the phase change process; when the cooling medium flows to the cooling module, the cooling medium in the cooling module undergoes a phase change of a second phase change type, and dissipates the heat of the cooling medium to the external environment.

[0006] According to another aspect of the present disclosure, a cooling method is provided, which is applicable to a cooling system, comprising: driving a cooling medium to flow in a first heat exchange module, thereby absorbing heat generated when a first element is operating; when the temperature of the cooling medium is equal to a first phase change temperature, driving the cooling medium to flow from the first heat exchange module to the second heat exchange module, thereby absorbing heat generated when the second element is operating, wherein the cooling medium in the second heat exchange module undergoes a phase change of a first phase change type after absorbing heat, and continues to absorb heat generated when the second element is operating during the phase change process; driving the cooling medium to flow into the cooling module; when the temperature of the cooling medium in the cooling module is equal to the second phase change temperature, driving the cooling medium to flow into the first heat exchange module.

[0007] According to another aspect of the present disclosure, a cooling device is provided, which is suitable for use in a cooling system, and includes: a first driving module, used to drive a cooling medium to flow in a first heat exchange module, thereby absorbing heat generated when the first element is working; a second driving module, used to drive the cooling medium to flow from the first heat exchange module to the second heat exchange module when the temperature of the cooling medium is equal to the first phase change temperature, thereby absorbing heat generated when the second element is working, wherein the cooling medium in the second heat exchange module undergoes a phase change of the first phase change type after absorbing heat, and continues to absorb heat generated when the second element is working during the phase change process; a third driving module, used to drive the cooling medium to flow into the cooling module; and a fourth driving module, used to drive the cooling medium to flow into the first heat exchange module when the temperature of the cooling medium in the cooling module is equal to the second phase change temperature.

[0008] According to another aspect of the present disclosure, an electronic device is provided, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform a cooling method.

[0009] According to another aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause a computer to execute a cooling method.

[0010] According to another aspect of the present disclosure, a computer program product is provided, comprising a computer program, which implements the cooling method when executed by a processor.

[0011] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure.

[0013] Figure 1 is a block diagram of a cooling system according to an embodiment of the present disclosure;

[0014] Figure 2 is a schematic diagram of a cooling medium according to an embodiment of the present disclosure;

[0015] Figure 3 is a schematic diagram of a phase change process according to an embodiment of the present disclosure;

[0016] Figure 4 is a schematic diagram of the cooling system structure according to an embodiment of the present disclosure;

[0017] Figure 5 is a schematic diagram of a cooling method according to an embodiment of the present disclosure;

[0018] Figure 6 is a schematic diagram of a cooling device according to an embodiment of the present disclosure;

[0019] Figure 7 is a block diagram of another electronic device for implementing the cooling method according to the embodiment of the present disclosure. DETAILED DESCRIPTION

[0020] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0021] Figure 1 FIG. 1 is a block diagram of a cooling system according to an embodiment of the present disclosure. Figure 1 As shown, the system includes a first heat exchange module 10, a second heat exchange module 20, a cooling module 30, and a cooling medium 40, wherein the cooling medium 40 circulates among the first heat exchange module 10, the second heat exchange module 20, and the cooling module 30 in sequence; when the cooling medium 40 flows to the first heat exchange module 10, the cooling medium 40 in the first heat exchange module 10 absorbs the heat generated when the first element 80 is working; when the cooling medium 40 flows to the second heat exchange module 20, the cooling medium 40 in the second heat exchange module 20 undergoes a phase change of the first phase change type after absorbing heat, and continues to absorb the heat generated when the second element 90 is working during the phase change process; when the cooling medium 40 flows to the cooling module 30, the cooling medium in the cooling module 30 undergoes a phase change of the second phase change type, and dissipates the heat of the cooling medium to the external environment.

[0022] It should be noted that the first phase change type may refer to a phase change from solid to liquid, and the second phase change type may refer to a phase change from liquid to solid. It is understandable that the cooling medium 40 absorbs heat when undergoing the first phase change type, and releases heat when undergoing the second phase change type.

[0023] In addition, in the actual application of the above cooling system, since the cooling medium 40 is in a state of only absorbing heat but not undergoing phase change in the first heat exchange module 10 for most of the time, and in the second heat exchange module 20 for most of the time, it is in a phase change process of the first phase change type. And the heat absorbed by the cooling medium in the actual working process can be divided into sensible heat and latent heat, wherein sensible heat refers to the heat that only increases the thermal kinetic energy of the molecules of the heat-absorbing object, that is, the heat that only increases the temperature of the object, and latent heat refers to the heat that only increases the thermal potential energy of the molecules of the heat-absorbing object, that is, the heat that only changes the phase of the object. Specifically, the cooling medium 40 will only absorb sensible heat in the process of only absorbing heat without undergoing phase change, while the cooling medium 40 can absorb a large amount of latent heat in addition to sensible heat when it is in the phase change process of the first phase change type. Therefore, the cooling medium 40 in the second heat exchange module 20 has a stronger ability to absorb heat than the cooling medium 40 in the first heat exchange module 10, that is, the heat dissipation efficiency of the second heat exchange module 20 is stronger than the heat dissipation efficiency of the first heat exchange module 10.

[0024] Specifically, when there is a difference in heat dissipation efficiency between the second heat exchange module 20 and the first heat exchange module 10, since the heat flux density generated by various electronic components during operation is also different, the first heat exchange module 10 can be set to be responsible for dissipating heat for the first component 80, wherein the first component 80 is a component whose heat flux density in the working state is less than the preset heat flux density. Let the second heat exchange module 20 be responsible for dissipating heat for the second component 90, wherein the second component 90 is a component whose heat flux density in the working state is not less than the preset heat flux density.

[0025] In some embodiments of the present disclosure, by utilizing the difference in heat absorption capacity of the cooling medium 40 when the first phase change type phase change occurs and when the phase change does not occur, the first heat exchange module 10 absorbs the heat generated by the low heat flux density element, while the second heat exchange module 20 absorbs the heat generated by the high heat flux density element. Compared with the traditional heat dissipation method that does not distinguish between different heat exchange modules, when there are both high heat flux density elements and low heat flux density elements in a heat dissipation object, the cooling system provided by the present disclosure not only ensures the heat dissipation requirements of the high heat flux density element, but also avoids the loss of heat dissipation capacity when dissipating the low heat flux density element.

[0026] In order to make full use of the different heat absorption capabilities of the cooling medium 40 in different states, and to minimize the waste of the cooling medium 40's heat absorption capability caused by the phase change of the cooling medium 40 in the first heat exchange module 10. At the same time, to avoid the problem that the cooling medium 40 still needs a certain period of time to undergo phase change in the second heat exchange module 20, resulting in insufficient heat absorption capability, which makes the operating temperature of the second element 90 too high, the cooling system provided by some embodiments of the present disclosure can determine the system location of the cooling medium 40 based on the temperature of the cooling medium 40.

[0027] Specifically, during the process of absorbing heat and heating up, the cooling medium 40 will begin to undergo a phase change of the first phase change type when the temperature reaches a pre-determined temperature range. Therefore, the first phase change temperature can be selected in the temperature range according to actual needs, and the cooling medium 40 can be moved from the first heat exchange module 10 to the second heat exchange module 20 when the temperature reaches the first phase change temperature. For the cooling medium 40 in the second heat exchange module 20, the temperature range for measuring the complete phase change of the cooling medium 40 can also be selected, and a temperature lower than the minimum value of the temperature range can be selected as the temperature at which the cooling medium 40 flows from the second heat exchange module 20 to the cooling module 30. In this way, it can be ensured that the cooling medium 40 is in the phase change process of the first phase change type throughout the second heat exchange module 20, and the heat absorption capacity of the cooling medium 40 is guaranteed. As for the cooling medium 40 in the cooling module 30, since the cooling medium 40 itself has the problem of supercooling, the second phase change temperature needs to be lower than the minimum value of the temperature range when the cooling medium 40 is completely solidified, which is measured in advance.

[0028] In this way, by dividing the locations of the cooling medium 40 according to the temperature, not only the problem of the phase change of the cooling medium 40 in the first heat exchange module 10 causing the waste of the heat absorption capacity of the cooling medium 40 is solved, but also the problem of insufficient heat absorption capacity caused by the cooling medium 40 still needing a certain period of time to undergo phase change in the second heat exchange module 20, which in turn causes the operating temperature of the second element 90 to be too high, is avoided, and it is also ensured that the cooling medium 40 can fully dissipate heat in the cooling module 30.

[0029] In some embodiments of the present disclosure, in order to determine the location of the cooling system where the coolant 40 is located in different situations by temperature, a plurality of temperature sensors are provided in the cooling system provided by the present disclosure to respectively collect the temperature of the coolant 40 in different components of the cooling system. After collecting the temperature of the coolant 40, the temperature sensor can send the temperature of the coolant 40 to the processor that controls the operation of the entire cooling system, so that the processor can drive the coolant 40 in the cooling system to move to the appropriate component through a pump or other equipment according to the received temperature of the coolant 40, thereby realizing the accurate allocation of the heat dissipation capacity of the cooling system.

[0030] It should be noted that, in the actual application process, in addition to setting a temperature sensor to control the flow of the cooling medium 40 in the cooling system, the specifications and working conditions of the electronic components that need to dissipate heat are usually known, that is, the heat flux density of the first component 80 and the second component 90 is known. Therefore, the specifications of each component of the cooling system can be planned based on the heat flux density of the first component 80 and the second component 90, and the amount of heat that the cooling medium 40 can absorb per unit time, so as to achieve the effect that the cooling medium 40 does not undergo a phase change in the first heat exchange module 10, undergoes a phase change of the first phase change type in the second heat exchange module 20 and absorbs a large amount of heat, and undergoes a phase change of the second phase change type in the cooling module 30 and releases heat. The specific method includes planning the flow rate, flow rate, etc. of the cooling medium 40 flowing in the cooling system. In addition, whether the flow of the cooling medium 40 is driven by a temperature sensor or by a pre-set method, the cooling medium 40 can be kept flowing throughout the cooling system.

[0031] In some embodiments of the present disclosure, in order to enable the cooling medium 40 to flow in the cooling system under any temperature conditions and ensure the heat absorption capacity of the cooling medium 40, the cooling medium 40 can be prepared as follows: Figure 2 The mixed solution shown. Figure 2 As shown, the cooling medium 40 includes phase change microcapsules 430, solvent 410 and auxiliary agent 420, and the phase change microcapsules 430 include phase change microcapsule core 432 and shell 431. The solvent 410 of the cooling medium 40 can be deionized water, etc., and the auxiliary agent 420 can be an anionic surfactant.

[0032] Specifically, the phase change microcapsules 430 in the above-mentioned cooling medium 40 refer to capsules with a size of micrometers, which can be made by in-situ polymerization. Since the cooling medium 40 will circulate in various components in the cooling system, and in order to prevent the phase change microcapsule core 432 from leaking into the solvent 410, the shell 431 of the phase change microcapsule 430 can be an inert material with good solubility resistance and thermal stability, high mechanical properties, adaptability to different construction conditions and good wear resistance. At the same time, in order to ensure the heat absorption capacity of the cooling medium 40, the shell 431 of the phase change microcapsule 430 also needs strong thermal conductivity, such as urea-formaldehyde resin and other materials.

[0033] In some embodiments of the present disclosure, in order to ensure the heat absorption capacity of the cooling medium 40, the phase change microcapsule core 432 should be selected to be solid at room temperature and easily undergo a first phase change type of phase change after absorbing heat, turning into a liquid solid phase change material.

[0034] Specifically, the phase change of the cooling medium 40 described in the embodiment of the present disclosure substantially refers to the phase change of the phase change microcapsule core 432 of the phase change microcapsule 430 in the cooling medium 40. And in the process of the cooling medium 40 completing a complete cycle, the phase change process and state change of the phase change microcapsule core 432 are as follows: Figure 3 As shown in the figure, it can be seen that under ideal conditions, during a cycle of the cooling medium 40, the phase change microcapsule core 432 inside is solid at first, and gradually melts during the heat absorption process until it completely becomes liquid, and then releases heat and solidifies until it completely becomes solid. In some embodiments of the present disclosure, in order to avoid the loss of heat dissipation capacity, the cooling medium 40 is usually not driven to flow into the cooling module 30 until the phase change microcapsule core 432 is completely melted.

[0035] In addition, in the embodiment of the present disclosure, the phase change microcapsule 430 is prepared by using the solid phase change material as the capsule core of the phase change microcapsule 430, and the phase change microcapsule 430 is mixed into the solvent 410 to prepare the cooling medium 40. Compared with directly using the liquid-gas phase change material as the cooling medium 40, the problem of the increase in volume of the liquid-gas phase change material during the transformation from liquid to gas, which leads to an increase in the space required for the liquid-gas phase change material, is avoided, thereby saving space for the cooling system and reducing costs. Compared with directly using the solid-liquid phase change material or the solid-gas phase change material as the cooling medium 40, the fluidity of the cooling medium 40 is guaranteed, thereby laying the foundation for realizing the gradient utilization of the heat absorption capacity of the cooling medium 40.

[0036] In some embodiments of the present disclosure, the overall structure of the cooling system can be as follows: Figure 4 Specifically, from Figure 4 It can be seen that the first heat exchange module 10 is provided with a fan 102 and a heat exchanger 101, and the heat exchanger 101 is provided with a first medium flow channel 103, and the cooling medium 40 flows into the first medium flow channel 103 from the inlet of the first medium flow channel 103. In addition, in order to ensure the heat absorption capacity of the first heat exchange module 10, the heat exchanger 101 in the first heat exchange module 10 can be set as a fin-type heat exchanger 101, and the fan 102 in the first heat exchange module 10 can generate airflow to speed up the rate at which the first heat exchange module 10 absorbs the heat generated by the first element 80 during operation.

[0037] It can be seen that the heat absorption capacity of the first heat exchange module 10 is ensured by setting the fan 102 and the heat exchanger 101 in the first heat exchange module 10. At the same time, since there is no direct contact between the first heat exchange module 10 and the first element 80, even if the first heat exchange module 10 leaks, the leaked cooling medium 40 will not contaminate the first element 80. In addition, since the first element 80 is a low heat flux density element, it is usually not necessary for the first heat exchange module 10 to be directly in close contact with the first element 80. It is only necessary to generate airflow through the fan 102 to speed up the heat exchange efficiency between the first element 80 and the air, and to allow the first element 80 to absorb environmental heat, that is, air heat, to ensure the heat dissipation requirements of the first element 80.

[0038] In some embodiments of the present disclosure, Figure 4 It can be seen that the cooling medium 40 flowing in from the inlet of the first medium flow channel 103 is the cooling medium 40 that has completely released heat and flows from the cooling module 30, and the other end of the cooling module 30 is connected to the second heat exchange module 20 through the liquid collector 60.

[0039] The reason why the second heat exchange module 20 is connected through the liquid collector 60 is that the second heat exchange module 20 can be divided into multiple parallel liquid cooling plates 201 according to actual needs. The coolant in each liquid cooling plate 201 is collected by the liquid collector 60 and flows into the cooling module 30, which can effectively prevent the cooling medium 40 from flowing back. In addition, the cooling medium 40 flows directly into the first heat exchange module 10 after cooling, which can prevent the cooling medium 40 itself from being contaminated.

[0040] In some embodiments of the present disclosure, Figure 4 As shown, the second heat exchange module 20 includes a plurality of parallel liquid cooling plates 201 and second medium flow channels 202 corresponding to the liquid cooling plates 201. As can be seen from the figure, the second medium flow channel 202 is connected to the first heat exchange module 10 through the liquid separator 50, and the cooling medium 40 flows into the second medium channel through the liquid separator 50, and further flows into each liquid cooling plate 201. In addition, the part of the second medium flow channel 202 inside the liquid cooling plate 201 is a microchannel with a smaller channel diameter.

[0041] Specifically, by arranging the heat exchanger 101 between the first heat exchange module 10 and the second heat exchange module 20 , not only the problem of coolant backflow is avoided, but also the coolant can flow evenly into each liquid cooling plate 201 in the second heat exchange module 20 .

[0042] In addition, from Figure 4It can be seen that in order to ensure the heat absorption efficiency of the second heat exchange module 20, the second heat exchange module 20 and the second element 90 are connected through the heat conductive layer 70, and the second heat exchange module 20 is installed above the heat conductive layer 70, while the second element 90 is fixed below the heat conductive layer 70, wherein the second heat exchange module 20 can be arranged above the heat conductive layer 70 by welding. In addition, in order to prevent the second heat exchange module 20 from leaking and contaminating the liquid cooling plate 201, a water leakage detection rope is arranged around the second heat exchange module 20, so that the leakage point can be confirmed in time when leakage occurs, thereby quickly eliminating the fault.

[0043] According to an embodiment of the present disclosure, a cooling method embodiment is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0044] Figure 5 is a flow chart of a cooling method according to an embodiment of the present disclosure, such as Figure 5 As shown, the method comprises the following steps:

[0045] Step S502, driving the cooling medium to flow in the first heat exchange module, thereby absorbing the heat generated when the first element is working;

[0046] In some embodiments of the present disclosure, the cooling medium includes phase change microcapsules, solvents, and auxiliary agents. The phase change microcapsules include a phase change microcapsule core made of solid phase change material, and a shell including the phase change microcapsule core.

[0047] Step S504, when the temperature of the cooling medium is not lower than the first phase change temperature, driving the cooling medium to flow from the first heat exchange module to the second heat exchange module, so as to absorb the heat generated when the second element is working, wherein the cooling medium in the second heat exchange module undergoes a phase change of the first phase change type after absorbing the heat, and continues to absorb the heat generated when the second element is working during the phase change process;

[0048] Step S506, driving the cooling medium to flow into the cooling module;

[0049] Step S508: When the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature, the cooling medium is driven to flow into the first heat exchange module.

[0050] In some embodiments of the present disclosure, the cooling medium is Figure 2 As shown, it is composed of phase change microcapsules, solvents, and auxiliary agents, wherein the phase change microcapsules are composed of two parts: a phase change microcapsule shell and a phase change microcapsule core.

[0051] Specifically, compared with directly using liquid-gas phase change materials as cooling media, the present invention processes the phase change materials into capsules and further processes them into cooling media together with solutions and auxiliary agents, thereby avoiding the problem of increased volume of liquid-gas phase change materials during the process of transforming from liquid to gas, resulting in increased space required for the liquid phase change materials, thereby saving space for the cooling system and reducing costs.

[0052] In some embodiments of the present disclosure, since the heat absorption capacity of the cooling medium when no phase change occurs and when the first phase change type occurs is greatly different, and the heat absorption capacity when the first phase change type occurs is greater than the heat absorption capacity when no phase change occurs, the cooling medium can absorb the heat generated by the low heat flux density element when the cooling medium absorbs heat but the temperature does not reach the first phase change temperature. And when the cooling medium undergoes the first phase change type of phase change, the cooling medium can absorb the heat of the high heat flux density element.

[0053] Specifically, when the temperature of the cooling medium is equal to the first phase change temperature, the cooling medium can be driven to flow from the first heat exchange module to the second heat exchange module. In order to achieve that the cooling medium absorbs heat in the first heat exchange module but does not undergo a phase change, and absorbs heat in the second heat exchange module while undergoing a second phase change type of phase change, since in actual heat dissipation scenarios, the amount of heat generated by the electronic components that need to dissipate heat during operation is certain, and the amount of heat that the cooling medium can absorb per unit time is also certain, the residence time of the cooling medium in different heat exchange modules can be determined by determining in advance the amount of heat that the first component and the second component need to absorb per unit time, as well as the total amount of heat that the cooling medium can absorb in the first heat exchange module and the second heat exchange module. The specific steps are as follows:

[0054] Determine the unit heat that needs to be absorbed by the first element per unit time; determine the total heat absorbed by the cooling medium in the first heat exchange module when the temperature is equal to the first phase change temperature; determine the target residence time of the cooling medium in the first heat exchange module based on the total heat and the unit heat; when the actual residence time of the cooling medium in the first heat exchange module is equal to the target residence time, drive the cooling medium to move from the first heat exchange module to the second heat exchange module.

[0055] Specifically, by setting the residence time of the cooling medium in each component of the cooling system, not only is it possible to efficiently absorb the heat generated by the components, but it is also unnecessary to set up additional temperature sensors in the system, thus saving costs.

[0056] In some embodiments of the present disclosure, multiple groups of temperature sensors may be provided in the cooling system to obtain the temperature of the cooling medium in real time, and the cooling medium may be driven to circulate in the cooling system according to the temperature. For example, when the temperature of the cooling medium reaches the first phase change temperature, the cooling medium may be driven to move from the first heat exchange module to the second heat exchange module.

[0057] Specifically, when the temperature of the cooling medium is equal to the first phase change temperature, the step of driving the cooling medium to flow from the first heat exchange module to the second heat exchange module includes: determining the actual temperature of the cooling medium in the first heat exchange module; when the actual temperature is equal to the first phase change temperature, driving the cooling medium to move from the first heat exchange module to the second heat exchange module.

[0058] By driving the cooling medium to flow between different components of the cooling system based on the cooling medium temperature provided by the embodiment of the present disclosure, efficient use of the cooling medium can be achieved. For example, when the cooling medium is in the first heat exchange module, it can absorb the heat of the low heat flux density element, and this part of the heat is sensible heat. Then when the temperature reaches the first phase change temperature, it can flow to the second heat exchange module and undergo a phase change in the second heat exchange module, absorbing not only sensible heat but also a large amount of latent heat.

[0059] Similar to the process of the cooling medium flowing from the first heat exchange module to the second heat exchange module, it is also possible to determine whether the cooling medium in the cooling module has completely released heat by determining the temperature of the cooling medium, and drive the completely released heat cooling medium into the first heat exchange module. For example, when the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature, the cooling medium is driven to flow into the first heat exchange module.

[0060] In some embodiments of the present disclosure, when the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature, the step of driving the cooling medium to flow into the first heat exchange module includes: determining the actual temperature of the cooling medium in the cooling module; when the actual temperature is equal to the second phase change temperature, driving the cooling medium to move from the cooling module to the first heat exchange module.

[0061] It should be noted that, due to the supercooling of the phase change material, in order to ensure that the core of the phase change microcapsule completely releases heat and solidifies, the second phase change temperature must be lower than the solidification temperature of the core material of the phase change microcapsule. In addition, by allowing the cooling medium to completely release heat in the cooling module before flowing into the first heat exchange module, the cooling efficiency of the cooling medium in the heat exchange module is ensured.

[0062] In some examples of the present disclosure, the first phase change temperature is the temperature of the cooling medium when the phase change microcapsule core undergoes a first phase change type of phase change, and the second phase change temperature is the temperature of the cooling medium when the phase change microcapsule core completes a second phase change type of phase change.

[0063] Specifically, by setting the position of the cooling medium in the cooling system at different temperatures, the heat absorption capacity of the cooling medium can be reasonably allocated, thereby avoiding waste of heat absorption capacity at low heat flux density elements and insufficient heat absorption capacity at high heat flux density elements, thereby well balancing the heat exchange capacity of the entire system.

[0064] It should be noted that Figure 5 The cooling method shown in Figure 1 The cooling system shown in FIG. Figure 1 The explanations about the cooling system shown in also apply to Figure 5 The cooling method shown in will not be described in detail here.

[0065] According to an embodiment of the present disclosure, an embodiment of a cooling device is provided. Figure 6 is a schematic diagram of a cooling device provided according to an embodiment of the present disclosure, such as Figure 6 As shown, the device includes: a first driving module 60, used to drive the cooling medium to flow in the first heat exchange module, so as to absorb the heat generated when the first element is working; a second driving module 61, used to drive the cooling medium to flow from the first heat exchange module to the second heat exchange module when the temperature of the cooling medium is not lower than the first phase change temperature, so as to absorb the heat generated when the second element is working, wherein the cooling medium in the second heat exchange module undergoes a phase change of the first phase change type after absorbing heat, and continues to absorb the heat generated when the second element is working during the phase change process; a third driving module 62, used to drive the cooling medium to flow into the cooling module; a fourth driving module 63, used to drive the cooling medium to flow into the first heat exchange module when the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature.

[0066] It should be noted that Figure 6 The cooling device shown in FIG. Figure 5 The cooling method shown in Figure 1 In the cooling system shown in Figure 1 The cooling system shown and Figure 5 The explanations of the cooling method shown in also apply to Figure 6 The cooling device shown in FIG. 1 is not described in detail here.

[0067] According to an embodiment of the present disclosure, an electronic device is provided. The electronic device includes: at least one processor; and a memory connected to the at least one processor in communication; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the following cooling method: driving the cooling medium to flow in the first heat exchange module, thereby absorbing the heat generated when the first element is working; when the temperature of the cooling medium is not lower than the first phase change temperature, driving the cooling medium to flow from the first heat exchange module to the second heat exchange module, thereby absorbing the heat generated when the second element is working, wherein the cooling medium in the second heat exchange module undergoes a phase change of the first phase change type after absorbing heat, and continues to absorb the heat generated when the second element is working during the phase change process; driving the cooling medium to flow into the cooling module; when the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature, driving the cooling medium to flow into the first heat exchange module.

[0068] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device, a readable storage medium and a computer program product.

[0069] Specifically, in some embodiments of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause a computer to execute the following cooling method: driving a cooling medium to flow in a first heat exchange module, thereby absorbing heat generated when the first element is working; when the temperature of the cooling medium is not lower than a first phase change temperature, driving the cooling medium to flow from the first heat exchange module to the second heat exchange module, thereby absorbing heat generated when the second element is working, wherein the cooling medium in the second heat exchange module undergoes a phase change of a first phase change type after absorbing heat, and continues to absorb heat generated when the second element is working during the phase change process; driving the cooling medium to flow into the cooling module; when the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature, driving the cooling medium to flow into the first heat exchange module.

[0070] In some embodiments of the present disclosure, a computer program product is provided, including a computer program. When the computer program is executed by a processor, the following cooling method is implemented: driving a cooling medium to flow in a first heat exchange module, thereby absorbing the heat generated when the first element is working; when the temperature of the cooling medium is not lower than the first phase change temperature, driving the cooling medium to flow from the first heat exchange module to the second heat exchange module, thereby absorbing the heat generated when the second element is working, wherein the cooling medium in the second heat exchange module undergoes a phase change of the first phase change type after absorbing heat, and continues to absorb the heat generated when the second element is working during the phase change process; driving the cooling medium to flow into the cooling module; when the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature, driving the cooling medium to flow into the first heat exchange module.

[0071] Figure 7A schematic block diagram of an example electronic device 700 that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0072] like Figure 7 As shown, the device 700 includes a computing unit 701, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 702 or a computer program loaded from a storage unit 708 into a random access memory (RAM) 703. In the RAM 703, various programs and data required for the operation of the device 700 can also be stored. The computing unit 701, the ROM 702, and the RAM 703 are connected to each other via a bus 704. An input / output (I / O) interface 705 is also connected to the bus 704.

[0073] A number of components in the device 700 are connected to the I / O interface 705, including: an input unit 706, such as a keyboard, a mouse, etc.; an output unit 707, such as various types of displays, speakers, etc.; a storage unit 708, such as a disk, an optical disk, etc.; and a communication unit 709, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 709 allows the device 700 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0074] The computing unit 701 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 701 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 701 performs the various methods and processes described above. For example, in some embodiments, the cooling method may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 708. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 700 via ROM 702 and / or communication unit 709. When the computer program is loaded into RAM 703 and executed by the computing unit 701, one or more steps of the cooling method described above may be performed. Alternatively, in other embodiments, the computing unit 701 may be configured to perform the cooling method in any other appropriate manner (e.g., by means of firmware).

[0075] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0076] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0077] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0078] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0079] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0080] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server combined with a blockchain.

[0081] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0082] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A cooling system, comprising a first heat exchange module, a second heat exchange module, a cooling module, and a cooling medium, wherein: The cooling medium circulates among the first heat exchange module, the second heat exchange module, and the cooling module in sequence; When the cooling medium flows to the first heat exchange module, the cooling medium in the first heat exchange module absorbs the heat generated when the first element is working; When the cooling medium flows to the second heat exchange module, the cooling medium in the second heat exchange module absorbs heat and undergoes a phase change of the first phase change type, and continues to absorb heat generated when the second element is working during the phase change process; When the cooling medium flows into the cooling module, the cooling medium in the cooling module undergoes a phase change of a second phase change type, and dissipates the heat of the cooling medium into the external environment; When the cooling medium flows to the first heat exchange module, in response to the actual residence time of the cooling medium in the first heat exchange module being equal to the target residence time, the cooling medium is driven to move from the first heat exchange module to the second heat exchange module, wherein the target residence time is determined based on the unit heat that needs to be absorbed by the first element per unit time and the total heat absorbed by the cooling medium in the first heat exchange module when the temperature is equal to the first phase change temperature.

2. The cooling system according to claim 1, wherein: The cooling medium includes phase change microcapsules, solvents, and auxiliary agents. The phase change microcapsules include a phase change microcapsule core made of solid phase change material and an outer shell that wraps the phase change microcapsule core.

3. The cooling system according to claim 2, wherein: When the temperature of the cooling medium reaches the first phase change temperature, it flows from the first heat exchange module to the second heat exchange module. When the temperature of the cooling medium reaches the second phase change temperature, it flows from the cooling module to the first heat exchange module. The first phase change temperature is the temperature of the cooling medium when the phase change microcapsule core undergoes the first phase change type of phase change. The second phase change temperature is the temperature of the cooling medium when the phase change microcapsule core completes the second phase change type of phase change.

4. The cooling system according to claim 1, wherein: The first heat exchange module includes a fan and a heat exchanger, the heat exchanger includes a first medium flow channel, the cooling medium flows into the first medium flow channel from the inlet of the first medium flow channel, the fan is used to generate an airflow, and the airflow is used to accelerate the rate at which the first heat exchange module absorbs the heat generated by the first element.

5. The cooling system according to claim 4, wherein: One end of the cooling module is connected to the second heat exchange module through a liquid collector, and the other end is connected to the inlet of the first medium flow channel.

6. The cooling system according to claim 1, wherein: The second heat exchange module includes a liquid cooling plate and a second medium flow channel. The second medium flow channel is connected to the first heat exchange module through a liquid separator. The cooling medium flows from the first heat exchange module to the second medium flow channel in the second heat exchange module through the liquid separator.

7. The cooling system according to claim 6, wherein: The liquid cooling plate is arranged above the heat conducting layer, the second element is fixed below the heat conducting layer, and a water leakage detection rope is arranged outside the liquid cooling plate and the second medium flow channel.

8. The cooling system according to claim 1, wherein: The cooling system also includes a temperature sensor, which is used to obtain the temperature of the cooling medium.

9. The cooling system according to claim 1, wherein: The first element is an element whose heat flux density in the working state is less than the preset heat flux density, and the second element is an element whose heat flux density in the working state is not less than the preset heat flux density.

10. A cooling method, applicable to the cooling system according to claim 1, comprising: Driving the cooling medium to flow in the first heat exchange module, thereby absorbing the heat generated when the first element is working; When the temperature of the cooling medium is not lower than the first phase change temperature, the cooling medium is driven to flow from the first heat exchange module to the second heat exchange module, so as to absorb the heat generated when the second element is working, wherein the cooling medium in the second heat exchange module undergoes a phase change of the first phase change type after absorbing heat, and continues to absorb the heat generated when the second element is working during the phase change process; Driving the cooling medium to flow into the cooling module; When the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature, driving the cooling medium to flow into the first heat exchange module; Wherein, when the temperature of the cooling medium is not lower than the first phase change temperature, the step of driving the cooling medium to flow from the first heat exchange module to the second heat exchange module includes: Determine the unit heat that needs to be absorbed by the first element per unit time; determine the total heat absorbed by the cooling medium in the first heat exchange module when the temperature is equal to the first phase change temperature; determine the target residence time of the cooling medium in the first heat exchange module based on the total heat and the unit heat; when the actual residence time of the cooling medium in the first heat exchange module is equal to the target residence time, drive the cooling medium to move from the first heat exchange module to the second heat exchange module.

11. The method according to claim 10, wherein: The cooling medium comprises phase change microcapsules, solvents and auxiliary agents. The phase change microcapsules comprise a phase change microcapsule core made of solid phase change material and an outer shell comprising the phase change microcapsule core.

12. The method according to claim 11, wherein: The first phase change temperature is the temperature of the cooling medium when the phase change microcapsule core undergoes the first phase change type of phase change, and the second phase change temperature is the temperature of the cooling medium when the phase change microcapsule core completes the second phase change type of phase change.

13. The method according to claim 10, wherein: When the temperature of the cooling medium is not lower than the first phase change temperature, the step of driving the cooling medium to flow from the first heat exchange module to the second heat exchange module further includes: Determining an actual temperature of the cooling medium in the first heat exchange module; When the actual temperature is equal to the first phase change temperature, the cooling medium is driven to move from the first heat exchange module to the second heat exchange module.

14. The method according to claim 10, wherein: When the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature, the step of driving the cooling medium to flow into the first heat exchange module comprises: Determining an actual temperature of the cooling medium in the cooling module; When the actual temperature is equal to the second phase change temperature, the cooling medium is driven to move from the cooling module to the first heat exchange module.

15. A cooling device, applicable to the cooling system according to claim 1, comprising: A first driving module, used for driving the cooling medium to flow in the first heat exchange module, so as to absorb the heat generated when the first element is working; A second driving module is used to drive the cooling medium to flow from the first heat exchange module to the second heat exchange module when the temperature of the cooling medium is not lower than the first phase change temperature, so as to absorb the heat generated when the second element is working, wherein the cooling medium in the second heat exchange module undergoes a phase change of the first phase change type after absorbing heat, and continues to absorb the heat generated when the second element is working during the phase change process; A third driving module, used for driving the cooling medium to flow into the cooling module; a fourth driving module, configured to drive the cooling medium to flow into the first heat exchange module when the temperature of the cooling medium in the cooling module is not higher than the second phase change temperature; Among them, the second driving module is also used to: determine the unit heat that needs to be absorbed by the first element per unit time; determine the total heat absorbed by the cooling medium in the first heat exchange module when the temperature is equal to the first phase change temperature; determine the target residence time of the cooling medium in the first heat exchange module based on the total heat and the unit heat; when the actual residence time of the cooling medium in the first heat exchange module is equal to the target residence time, drive the cooling medium to move from the first heat exchange module to the second heat exchange module.

16. An electronic device, comprising: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the cooling method according to any one of claims 10 to 14.

17. A non-transitory computer-readable storage medium storing computer instructions, wherein: The computer instructions are used to cause the computer to execute the cooling method according to any one of claims 10-14.

18. A computer program product, comprising a computer program, which, when executed by a processor, implements the cooling method according to any one of claims 10 to 14.

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