Double stack "v" heat exchanger

CN115135945BActive Publication Date: 2026-08-28IVOPUO
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202180015715.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-02-19
Filing Date
2021-02-19
Publication Date
2026-08-28
Estimated Expiration
2041-02-19

Smart Images

  • Figure CN115135945B_ABST
    Figure CN115135945B_ABST
Patent Text Reader

Abstract

A modular, dual-V stacked, dry or adiabatic heat exchanger having a bottom module with two heat exchangers arranged in a V-shape, a top module configured to rest on top of and be supported by the bottom module and having two heat exchangers configured to continue and extend the V-shape formed by the two bottom heat exchangers, and a fan module configured to rest on top of and be supported by the top module. The modules are factory assembled and configured to be easily transported and easily connected to each other on site. An insulation pad or nozzle can be provided to pre-cool the air entering the system.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to an air-cooled coil heat exchanger. Background Technology

[0002] Air-cooled heat exchangers remove heat from a working fluid by transferring heat from the working fluid to the air. An air-cooled heat exchanger typically consists of tubes connected to fins. The working fluid is transported through the interior of the tubes, and heat is conducted to the exterior of the tubes and the fins. Air passing through the fins and tubes removes heat; generally, one or more fans are used to move the air. The working fluid can be a liquid, gas, condensing refrigerant, or any other fluid that requires heat removal. The tubes are typically constructed of copper, aluminum, or stainless steel, but other metals and non-metals have been used. The fins are typically made of copper or aluminum, but other thermally conductive materials have been used.

[0003] In order to remove heat from the working fluid, the temperature of the working fluid must be greater than the temperature of the air entering the cooler. The greater the temperature difference between the air entering the cooler and the working fluid, the less air volume is required to remove heat; therefore, the less fan horsepower is needed to move the air. Summary of the Invention

[0004] According to the present invention, a modular V-shaped heat exchange assembly is presented, wherein a first lower module includes two heat exchangers arranged in a V-shape, and a second upper module including two additional heat exchangers is stacked on top of the first lower module, wherein the two heat exchangers in the upper module continue and extend the V-shape formed by the two heat exchangers at the bottom. The V-shape results in a more even airflow through the heat exchangers. Finally, a fan module is placed on top of the upper heat exchange module. According to various embodiments, the modules are pre-assembled, sized, and configured in the factory for easy transport and assembly. Compared to prior art V-shaped air-cooled heat exchangers using the same footprint, the present invention provides substantially higher fluid flow rates and greater heat exchange capacity, especially considering the required spacing between devices to allow sufficient airflow. Multiple double-V-shaped stacked compartments according to the present invention can also be arranged in a line or in a rectangular array under a common fan, with all air coming from the bottom. The present invention can be used as a cooler for fluid cooling or as a condenser for refrigerant condensation. Optional insulating pads or insulating pre-cooling nozzles can be provided to pre-cool the air entering the system.

[0005] Accordingly, the present invention provides a modular V-shaped heat exchange device, characterized in that: 1) a factory-assembled and transportable bottom heat exchange module having a bottom module frame and two bottom module heat exchange plates arranged and supported in a V-shape within the bottom module frame; 2) a factory-assembled and transportable top heat exchange module having a top module frame and two top module heat exchange plates arranged and supported in the top module frame such that the two top module heat exchange plates continue and extend the V-shape formed by the two bottom module heat exchange plates, the top heat exchange module being positioned on and supported by the bottom heat exchange module; and 3) a factory-assembled and transportable fan module having a fan module frame and at least one fan, the fan module being positioned on top of and supported by the top heat exchange module, the at least one fan being positioned and configured to draw air through the two bottom module heat exchange plates and the two top module heat exchangers.

[0006] According to a further feature or embodiment of the invention, each of the two bottom module heat exchange plates and the two top module heat exchange plates has an inlet header and an outlet header, the inlet header being configured and positioned to receive hot process fluid and distribute it to the corresponding heat exchange plate, and the outlet header being configured and positioned to receive cooled process fluid from the heat exchange plate.

[0007] According to one embodiment of the present invention, each of the two bottom module heat exchange plates and the two top module heat exchange plates contains the same process fluid.

[0008] According to other embodiments of the present invention, at least one of the bottom module heat exchange plate and the top module heat exchange plate contains a first process fluid, and at least another heat exchange plate contains a second process fluid different from the first process fluid.

[0009] According to a further embodiment of the invention, at least one of the bottom module heat exchange plate and the top module heat exchange plate contains a first process fluid, while at least another heat exchange plate does not contain a process fluid.

[0010] According to a further embodiment of the invention, the modular V-shaped heat exchange device may be equipped with an insulation plate and / or nozzles, the nozzles being configured to spray water into the airflow entering the bottom heat exchange module and the top heat exchange module.

[0011] According to another embodiment of the present invention, each of the top module heat exchange plates shares a common plane with an adjacent bottom module heat exchange plate in the bottom module heat exchange plates.

[0012] According to another embodiment of the present invention, there is provided: 1) a plurality of factory-assembled and transportable bottom heat exchange modules, each of the bottom heat exchange modules having a bottom module frame and two bottom module heat exchange plates, the two bottom module heat exchange plates being arranged and supported in a V-shape within the bottom module frame; 2) a plurality of factory-assembled and transportable top heat exchange modules, each of the top heat exchange modules having a top module frame and two top module heat exchange plates, the two top module heat exchange plates being arranged and supported in the top module frame such that the two top module heat exchange plates continue and extend from the two The bottom heat exchange plate forms a V-shape with two bottom heat exchange plates, each of the plurality of top heat exchange modules is positioned on and supported by a corresponding bottom heat exchange module; and wherein the bottom heat exchange module and the top heat exchange module are configured to receive ambient air from below; 3) a lifting frame that supports each of the plurality of bottom heat exchange modules; and 4) a fan module comprising a single fan that is sized and positioned to draw air through a plurality of compartments, each compartment including a top heat exchange module and a bottom heat exchange module.

[0013] According to another embodiment of the present invention, a method for assembling a heat exchange device is provided, the method comprising the following steps:

[0014] The factory-assembled bottom heat exchange module, which has a bottom module frame and two bottom module heat exchange plates, is transported to the assembly location. The two bottom module heat exchange plates are arranged in a V-shape and supported within the bottom module frame.

[0015] The top heat exchange module, which is assembled in the factory, is transported to the assembly location. The top heat exchange module has a top module frame and two top module heat exchange plates.

[0016] The factory-assembled fan module, which has a fan module frame and at least one fan, is transported to the assembly location.

[0017] Install the bottom heat exchange module at the installation location;

[0018] The top heat exchange module is mounted on top of the bottom heat exchange module, wherein the top module heat exchange plates are arranged and supported within the top module frame, such that the two top module heat exchange plates continue and extend the V-shape formed by the two bottom module heat exchange plates; and

[0019] The fan module is mounted on top of the top heat exchange module.

[0020] The present invention further provides a method for assembling a heat exchange device, the method comprising:

[0021] a. Assemble the raised frame at the installation location;

[0022] b. Multiple factory-assembled and transportable bottom heat exchange modules are mounted on the raised frame, each of the bottom heat exchange modules having a bottom module frame and two bottom module heat exchange plates arranged in a V-shape and supported within the bottom module frame.

[0023] c. Install the corresponding factory-assembled and transportable top heat exchange module on top of each of the bottom heat exchange modules, the top heat exchange module having a top module frame and two top module heat exchange plates arranged and supported in the top module frame such that the two top module heat exchange plates continue and extend the V-shape formed by the two bottom module heat exchange plates;

[0024] d. A fan is mounted and positioned above the top heat exchange module, the fan being configured to draw ambient air into an air collection section formed by the raised frame and upward through the plurality of bottom heat exchange modules and the plurality of top heat exchange modules. According to a further embodiment of the invention, an insulating pad may be mounted on the raised frame. Alternatively or additionally, a nozzle may be mounted on the raised frame and oriented to spray water into the air drawn into the air collection section or into the air passing through the air collection section. Attached Figure Description

[0025] Figure 1 This is a perspective view of two V-shaped air-cooled heat exchangers of the type used in this invention.

[0026] Figure 2 yes Figure 1 A close-up perspective view of the opposite ends of the two V-shaped air-cooled heat exchangers shown.

[0027] Figure 3 yes Figure 1 and Figure 2A diagram illustrating the operation of a V-type air-cooled heat exchanger of the type shown.

[0028] Figure 4 A perspective view of two V-shaped air-cooled heat exchangers is shown. These two V-shaped air-cooled heat exchangers have been fitted with insulation pads after being put on the market and are installed in the field for pre-cooling incoming air.

[0029] Figure 5 It shows Figure 3 A close-up side sectional view of one of the V-shaped air-cooled heat exchangers shown.

[0030] Figure 6 It has Figure 4 and Figure 5 The diagram illustrates the operation of the V-type air-cooled heat exchanger with the pre-cooled insulation pad shown.

[0031] Figure 7 This is an illustration of a standard fan size module according to an embodiment of the present invention.

[0032] Figure 8 This is an illustration of a top heat exchange module according to an embodiment of the present invention.

[0033] Figure 9 This is a diagram of a bottom heat exchange module according to an embodiment of the present invention.

[0034] Figure 10 This is an illustration of a modular double V-stack air-cooled heat exchanger according to an embodiment of the present invention.

[0035] Figure 11 This is an illustration of a modular double V-shaped stacked air-cooled heat exchanger with a pre-cooled insulation pad according to an embodiment of the present invention.

[0036] Figure 12 This is an illustration of a modular double V-shaped stacked air-cooled heat exchanger with pre-cooled insulating nozzles according to an embodiment of the present invention.

[0037] Figure 13 This is an illustration of a large fan module according to another embodiment of the present invention.

[0038] Figure 14 This is an illustration of a modular double-V-shaped stacked air-cooled heat exchanger according to an embodiment of a large fan module of the present invention.

[0039] Figure 15 This is an illustration of a modular double V-shaped stacked air-cooled heat exchanger with a pre-cooled insulation pad, according to another embodiment of a large fan module of the present invention.

[0040] Figure 16This is an illustration of a modular double-V-shaped stacked air-cooled heat exchanger with pre-cooled insulating nozzles, according to another embodiment of a large fan module of the present invention.

[0041] Figure 17 This is an illustration of an embodiment of the present invention, in which multiple double-V-shaped stacked heat exchanger compartments are mounted on a raised frame below an oversized fan.

[0042] Figure 18 This is an illustration of an embodiment of the present invention, in which the middle module can be placed between the top and bottom modules to create a triple V-shaped stacked air-cooled heat exchanger.

[0043] Figure 19 This is an illustration of an embodiment of the present invention, in which one or more modules may have a second set of coils.

[0044] The features in the accompanying drawings are numbered using the following reference numerals:

[0045] 101 Bottom heat exchange module; 113 Bottom module frame top part

[0046] 102 Intermediate heat exchange module; 115 Bottom module frame side section

[0047] 103 Top heat exchange module; 119 Top corner of bottom module frame

[0048] 105 Fan Module 121 Bottom Heat Exchanger Top and Bottom

[0049] The distance between the top corners of the 109 bottom heat exchange coil module

[0050] 111 Bottom module frame base section 161 Return water pipe

[0051] 125 top heat exchange coil, 163 bottom module slot

[0052] 131 Top frame module top corner 165 pump

[0053] 133 Top module frame base section 167 Large fan module

[0054] 135 Top Module Frame Top Section 169 Lift Frame

[0055] 137 Top module frame side section 171 Extra-large fan module

[0056] 139 Inlet Manifold 173 Intermediate Module Framework

[0057] 141 Outlet manifold 175 Intermediate module heat exchange coil

[0058] 147 Intermediate manifold, 177 Cryogenic process fluid coil

[0059] 151 Insulating Precooling Pad 179 High Temperature Process Fluid Coil

[0060] 151a top insulation pad, 181 high-process fluid coil and low-process

[0061] The space between the 151b bottom insulation pad and the fluid coil

[0062] 153 Top Module Water Distribution Pipe

[0063] 157 nozzles

[0064] 159 Nozzle Supply Pipe Detailed Implementation

[0065] Figure 1 and Figure 2 An example of a V-shaped cooler is shown. A frame supports two heat exchange plates (also called “tube bundles” or “coils”), each panel comprising multiple horizontally arranged finned tubes in a V-shape configuration. At one end of each tube bundle or coil, the tubes are connected at the inlet end to an inlet manifold and then to an outlet manifold. At the opposite end of each tube bundle, each horizontal tube is connected to the adjacent horizontal tube via a return bend. Hot process fluid enters the inlet manifold via the inlet manifold connection and is then distributed from the inlet manifold to the tubes. Cooled fluid exits the tubes via the outlet manifold and returns to the process / system of the heating fluid. The frame supports one or more fans at the top of the cooler, drawing ambient air through the tubes and fins into the unit and exhausting it from the top of the unit.

[0066] Figure 3 It shows Figure 1 and Figure 2 The operating principle of the V-shaped air-cooled heat exchanger of the type shown is as follows: Hot process fluid, shown in red, enters the inlet manifold via the inlet manifold connector. The hot process fluid travels laterally across the heat exchanger from the inlet manifold, generally parallel to the horizontal direction. Heat from the process fluid dissipates across the surface of the coils and is released to the fins (not shown). Ambient air is drawn in above the coil surface by a fan located at the top of the unit. Heat from the process fluid is transferred to the air and discharged into the atmosphere. Cooled process fluid, shown in blue, exits the unit through the outlet manifold.

[0067] An example of a V-shaped cooler with an insulating pre-cooling pad is shown in Figure 4 and Figure 5As shown in the diagram. A frame supports two heat exchange coils, each comprising multiple horizontally arranged finned tubes in a V-shape configuration. At one end of each coil bundle, the tubes are connected to an inlet manifold and an outlet manifold at the inlet end. At the opposite end of each coil bundle, each horizontal tube is connected to the adjacent horizontal tube via a return bend. Hot process fluid enters the inlet manifold via the inlet manifold connector and is then distributed from the inlet manifold to the tubes. Cooled fluid exits the tubes via the outlet manifold and returns to the process / system of the heating fluid. Insulation pads are mounted along both sides of the unit from left to right and from top to bottom and span across both sides of the unit. A water distribution system drips water onto the top of the pads to saturate them. Water that does not evaporate from the pads is collected at the bottom of the unit and either sent to a drain pipe or recirculated back to the top of the unit and back to the pads. The frame supports one or more fans at the top of the cooler and draws ambient air into the unit through the saturated pads, through pipes and fins, and out from the top of the unit.

[0068] Figure 6 The diagram illustrates the operating principle of a V-shaped air-cooled heat exchanger with an insulating pad for pre-cooling the incoming air. Hot process fluid, shown in red, enters the inlet manifold via an inlet manifold connector. The hot process fluid travels laterally across the heat exchanger from the inlet manifold, generally parallel to the horizontal direction. Heat from the process fluid dissipates across the coil surface and dissipates to the fins (not shown). The insulation system includes a fully wetted fiber pad located in front of the coil. Ambient air is drawn through the insulating pre-cooling pad by a fan located at the top of the unit. As the air passes through the insulating pad, it becomes humidified, thereby reducing the dry-bulb temperature to within a few degrees of the wet-bulb temperature. This new air temperature is referred to as the reduced dry-bulb temperature. This pre-cooled air is then drawn through the tube and fin surfaces, providing a significant increase in heat dissipation capacity. Heat from the process fluid is transferred to the air and discharged into the atmosphere. Cooled process fluid, shown in blue, exits the unit through the outlet manifold. In a recirculating water system, water used to wet the insulation pad but not evaporated is collected at the bottom of the unit and recirculated to the water distribution system at the top of the pad. In a direct-flow water system, water used to wet the insulation pad but not evaporated is collected and sent to a drain pipe.

[0069] According to an alternative embodiment, instead of using an insulating pad to pre-cool the incoming air, the V-shaped air-cooled heat exchanger can be equipped with nozzles configured to spray water mist into the incoming air to humidify the ambient air before it is drawn through the fins and tube surfaces. A trough located at the bottom of the heat exchanger collects pre-cooled water via a recirculation pump, a return pipe, and a water distribution pipe that distributes the pre-cooled water to the nozzles, and optionally recirculates the pre-cooled water back to the nozzles. According to an alternative direct-flow water system, water sprayed into the incoming air that does not evaporate is collected and sent to a drain pipe.

[0070] Figures 7 to 10 An embodiment is shown consisting of three modules: a bottom heat exchange module 101, a top heat exchange module 103, and a fan module 105. Bottom module 101 ( Figure 9 The device includes a bottom module frame and two bottom heat exchange coils 109 supported within the bottom module frame and arranged in a V-shape. The bottom module frame may include a base portion 111, a top portion 113, and a side portion 115 extending between the base portion 111 and the top portion 113. The dimensions (width and length) of the top portion 111 and the bottom portion 113 of the bottom module frame may be the same, but not necessarily the same. The tops of the two bottom heat exchange coils 109 do not converge with the top corners 119 of the bottom module frame, but are separated from the side portion 115 of the bottom frame module by a distance 121.

[0071] Top module 103 ( Figure 8 The system includes a top module frame and two top heat exchange coils 125 supported within the top module frame, such that when the top heat exchange module 103 is placed on top of the bottom heat exchange module 101, the two top heat exchange coils 125 continue and extend the V-shape formed by the two bottom heat exchange coils 109. The top heat exchange module 103 is sized to fit on top of and be supported by the bottom heat exchange module 101. The top heat exchange coils 125 slope away from each other from bottom to top. The distance between the bottoms of the top heat exchange coils 125 is approximately the same as the distance 121 between the tops of the bottom heat exchangers 109. The tops of the top heat exchangers 125 preferably terminate at opposite top corners 131 of the top frame module. The top module frame may include a base portion 133, a top portion 135, and a side portion 137 extending between the base portion 133 and the top portion 135. The dimensions (width and length) of the top and bottom portions of the top module frame can be the same, but not necessarily the same, and can be the same as the dimensions of the top and bottom portions of the bottom module frame. According to a preferred embodiment, the base portion 133 of the top module frame is configured to mate with and be fixed to the top portion 113 of the bottom module frame.

[0072] Each of the four heat exchange coils (two top coils 125 and two bottom coils 109) may include a dedicated inlet manifold 139 (red shading / dotted line) and outlet manifold 141 (blue shading / crosshair line) connected by multiple pipes having horizontal sections and U-shaped return bends.

[0073] According to one embodiment, adjacent top and bottom coils are fluidly isolated from each other. According to one aspect of this embodiment, the coils can be manufactured from different materials compatible with the process fluids, thereby allowing the cooling of multiple different process fluids in a single component.

[0074] According to another embodiment, the fluid to be cooled in the top heat exchange coil 125 can be transferred from the outlet manifold 141 of the top heat exchange coil 125 to the inlet manifold of the adjacent bottom heat exchange coil 109 via the intermediate manifold 147.

[0075] Fan module 105 ( Figure 7 It is sized and configured to rest on and be supported by the top module 103.

[0076] According to a first optional embodiment of the present invention, the double V-shaped stacked heat exchanger of the present invention may be provided with an insulating pre-cooling pad, for example, see [reference needed]. Figure 11 According to another optional embodiment of the invention, each of the top and bottom modules may be fitted with insulating pre-cooling pads 151a, 151b, for example, see... Figure 15 According to this embodiment, the top module water distribution pipe 153 is located above the top insulating pre-cooling pad 151a and drips or sprays water onto the top insulating pad. According to a first variant of this embodiment, water passing through the top insulating pad 151a is drained into the bottom insulating pad 151b. According to a second variant of this embodiment (not shown), water passing through the top insulating pad 151a is collected in a top module water collection tray and redistributed to the bottom module insulating pad 151b.

[0077] According to another alternative embodiment ( Figure 12 Instead of having an insulating pre-cooling pad, the top and bottom modules may be equipped with a pre-cooling spray system, which includes nozzles 157 positioned and configured to spray water into an incoming airflow. Nozzles 157 may be attached to and supplied by a nozzle supply pipe 159, which receives fresh water from a fresh water supply, or, if unused water is collected in a water collection tank, water from a return water pipe 161.

[0078] According to one embodiment, each of the top and bottom modules can have a separate and independent water supply, water collection, and water recirculation (or drainage) system, whether using an insulating pad or an insulating pre-cooling nozzle. According to an alternative embodiment, an integrated water supply, collection, and recirculation (or drainage) system may exist, wherein all water supplied to this system is collected in a trough or tray assembly 163 at the bottom of the bottom module and discharged or returned to the respective water distribution locations in the top and bottom modules via a return pipe 161 supplied by one or both pumps 165 located in the bottom module.

[0079] Figure 13 It shows that it can be replaced Figure 7 The large fan module 167 used in module 105 employs two or more smaller fans. In the large fan module embodiment, one or more fans have a diameter 60% larger than the distance separating the tops of the two top heat exchangers 126. Figure 7 As in the previous embodiment, the large fan module 167 is sized and configured to rest on and be supported by the top heat exchange module 103. Figures 14 to 16 It shows the corresponding Figures 10 to 12 Other large fan embodiments of the same type.

[0080] According to another embodiment of the present invention, such as Figure 17 As shown, multiple top and bottom heat exchange modules can be mounted adjacent to each other in a line or in a rectangular matrix on the raised frame 169. According to this embodiment, a single oversized fan module 171 can be positioned on top of the matrix of V-shaped module heat exchangers to draw air into and through the open space created by the raised frame 169, and upward through the multiple bottom and top heat exchange modules. In this embodiment, a single fan draws air through at least two, and preferably three, four, five, or six double-V-shaped stacked compartments. The bottom raised air section may be equipped with an insulating pre-cooling pad and / or a sprayer to pre-cool the incoming air.

[0081] According to Figure 18In another embodiment of the invention shown in the figure, one or more intermediate heat exchange modules 102 may be placed between the top heat exchange module 101 and the bottom heat exchange module 103 to create a triple, quadruple, or more V-shaped stacked air-cooled heat exchanger. According to this embodiment, each intermediate heat exchange module 102 includes an intermediate heat exchange coil 175 supported in an intermediate module frame 173. The modular air-cooled heat exchanger with triple, quadruple, or more V-shaped stacks according to the invention may have a single large fan module, or a fan module with two or more fans. Furthermore, the modular air-cooled heat exchanger with triple, quadruple, or more V-shaped stacks according to the invention may optionally be equipped with an insulation pad or insulation jet system as described above.

[0082] According to another embodiment of the invention, one or more heat exchange modules in the V-shaped stacked modular air-cooled heat exchanger of the invention may include a second set of coils nested adjacent to a first set of coils and separated by a certain space. According to this embodiment, the bottom module, top module, or intermediate module (or a combination thereof) has a set of low-temperature process fluid coils 177 and a second set of high-temperature process fluid coils 179. The low-temperature process fluid coils 177 are preferably located on the inlet side of the module, and the high-temperature process fluid coils 179 are located on the plenum side of the module. According to this embodiment, ambient air (e.g., 80°F) drawn into the module first passes through the low-temperature process fluid coils 177, cooling the low-temperature process fluid (e.g., from 100°F to 90°F), and then heating the air to 88°F. The heated air then passes through the space 181 between the coils, and then through the high-temperature process fluid coil 179, cooling the hot process fluid (e.g., from 130°F to 115°F), further heating the ambient air, which in turn heats the module to, for example, 110°F. It should be noted that the air temperature and process fluid temperature mentioned above are for illustrative purposes only. The high-temperature process fluid and the low-temperature process fluid can be completely different fluids produced by different processes. Alternatively, the low-temperature process fluid can be the same fluid as the high-temperature process fluid, wherein the process fluid first flows through the high-temperature process fluid coil and then subsequently flows through the low-temperature process fluid coil.

[0083] Specifically, it is anticipated that each feature embodiment disclosed herein can be used in conjunction with each of the other features and embodiments disclosed herein.

[0084] The description of this invention is merely exemplary in nature, and therefore, variations that do not depart from the concept of a modular double-V-shaped stacked cooler or condenser are intended to be within the scope of protection of this invention. Any variations of the specific embodiments described herein (but which otherwise constitute a modular double-V-shaped stacked cooler or condenser) should not be considered as departing from the spirit and scope of protection of the invention as set forth in the appended claims.

Claims

1. A modular V-shaped heat exchange device, comprising: A factory-assembled and transportable bottom heat exchange module, the bottom heat exchange module having a bottom module frame, a first bottom module heat exchange plate and a second bottom module heat exchange plate, the first bottom module heat exchange plate and the second bottom module heat exchange plate being arranged and supported in a V-shape in the bottom module frame, the bottom heat exchange module having a first air inlet side and a second air inlet side, the first bottom module heat exchange plate being located on the first air inlet side of the bottom heat exchange module, and the second bottom module heat exchange plate being located on the second air inlet side of the bottom heat exchange module; A factory-assembled and transportable top heat exchange module, the top heat exchange module having a top module frame, a first top module heat exchange plate and a second top module heat exchange plate, the first top module heat exchange plate and the second top module heat exchange plate being arranged and supported in the top module frame such that the first top module heat exchange plate and the second top module heat exchange plate continue and extend the V-shape formed by the first bottom module heat exchange plate and the second bottom module heat exchange plate, the top heat exchange module having a first air inlet side and a second air inlet side, the first top module heat exchange plate being located on the first air inlet side of the top heat exchange module, the second top module heat exchange plate being located on the second air inlet side of the top heat exchange module, the top heat exchange module being supported by the bottom heat exchange module; A factory-assembled and transportable fan module having a fan module frame and at least one fan, the fan module being positioned on top of and supported by a top heat exchange module, the at least one fan being positioned and configured to draw air through a first bottom module heat exchange plate and a second bottom module heat exchange plate from a first air intake side of the bottom heat exchange module and a second air intake side of the second bottom module heat exchange plate, and to draw air through the first top module heat exchange plate and the second top module heat exchange plate from a first air intake side and a second air intake side of the top module heat exchange module.

2. The modular V-shaped heat exchange device according to claim 1, wherein, Each of the first bottom module heat exchange plate, the second bottom module heat exchange plate, the first top module heat exchange plate, and the second top module heat exchange plate has an inlet manifold and an outlet manifold, the inlet manifold being configured and positioned to receive hot process fluid and distribute the hot process fluid to the corresponding heat exchange plate, and the outlet manifold being configured and positioned to receive cooled process fluid from the heat exchange plate. Each of the first bottom module heat exchange plate, the second bottom module heat exchange plate, the first top module heat exchange plate, and the second top module heat exchange plate includes a plurality of horizontally arranged finned tubes, which are connected to adjacent tubes having tube bends.

3. The modular V-shaped heat exchange device according to claim 2, wherein, Each of the first bottom module heat exchange plate, the second bottom module heat exchange plate, the first top module heat exchange plate, and the second top module heat exchange plate contains the same process fluid.

4. The modular V-shaped heat exchange device according to claim 2, wherein, At least one of the first bottom module heat exchange plate, the second bottom module heat exchange plate, the first top module heat exchange plate, and the second top module heat exchange plate contains a first process fluid, and wherein at least two of the first bottom module heat exchange plate, the second bottom module heat exchange plate, the first top module heat exchange plate, and the second top module heat exchange plate contain a second process fluid that is different from the first process fluid.

5. The modular V-shaped heat exchange device according to claim 1, further comprising an insulation plate.

6. The modular V-shaped heat exchange device of claim 1, further comprising a nozzle configured to spray water into an airflow entering the bottom heat exchange module and the top heat exchange module.

7. The modular V-shaped heat exchange device according to claim 1, wherein, Each of the first and second top module heat exchange plates shares a common plane with an adjacent bottom module heat exchange plate of the first and second bottom module heat exchange plates.

8. The modular V-shaped heat exchange device according to claim 1, further comprising one or more factory-assembled and transportable intermediate heat exchange modules, each intermediate heat exchange module having an intermediate module frame and two intermediate module heat exchange plates, the two intermediate module heat exchange plates being arranged and supported in the intermediate module frame such that the intermediate module heat exchange plates continue and extend the V-shape formed by the first bottom module heat exchange plate, the second bottom module heat exchange plate, the first top module heat exchange plate, and the second top module heat exchange plate, wherein... The first intermediate heat exchange module of the one or more intermediate heat exchange modules is placed on top of the bottom heat exchange module and supported by the bottom heat exchange module, wherein the top heat exchange module is supported by the one or more intermediate heat exchange modules.

9. The modular V-shaped heat exchange device according to claim 1, wherein, The bottom heat exchange module includes a second set of heat exchange plates. Each heat exchange plate in the second set of heat exchange plates is arranged parallel to a corresponding bottom heat exchange plate in the first and second bottom module heat exchange plates and is separated from the corresponding bottom heat exchange plate in the first and second bottom module heat exchange plates by a space. The temperature of the process fluid contained in the second set of heat exchange plates is different from the temperature of the process fluid in the first and second bottom module heat exchange plates.

10. The modular V-shaped heat exchange device according to claim 1, wherein, The top heat exchange module includes a second set of heat exchange plates. Each heat exchange plate in the second set is arranged parallel to a corresponding top heat exchange plate in the first and second top module heat exchange plates and is separated from the corresponding top heat exchange plate in the first and second top module heat exchange plates by a space. The temperature of the process fluid contained in the second set of heat exchange plates is different from the temperature of the process fluid in the first and second top module heat exchange plates.

11. The modular V-shaped heat exchange device according to claim 8, wherein, An intermediate heat exchange module, which is assembled and transportable in one or more plants, includes a second set of heat exchange plates, each of which is arranged parallel to and separated from a corresponding intermediate module heat exchange plate in the intermediate module heat exchange modules by a space, wherein the temperature of the process fluid contained in the second set of heat exchange plates is different from the temperature of the process fluid in the intermediate module heat exchange plates.

12. A heat exchange device, comprising: Multiple factory-assembled and transportable bottom heat exchange modules, each of which has a bottom module frame and two bottom module heat exchange plates arranged in a V-shape and supported within the bottom module frame. Multiple factory-assembled and transportable top heat exchange modules, each of the top heat exchange modules having a top module frame and two top module heat exchange plates arranged and supported in the top module frame such that the two top module heat exchange plates continue and extend a V-shape formed by two of the two bottom module heat exchange plates, each of the multiple top heat exchange modules being positioned on and supported by a corresponding bottom heat exchange module, and wherein the bottom heat exchange modules and the top heat exchange modules are configured to receive ambient air from below; A raised frame, which supports each of the plurality of bottom heat exchange modules; and A fan module comprising a single fan sized and positioned to draw air through multiple compartments, each compartment comprising a single top heat exchange module and a single bottom heat exchange module.

13. The heat exchange device according to claim 12, further comprising an insulation plate.

14. The heat exchange apparatus of claim 12, further comprising a nozzle configured to spray water into an airflow entering the bottom heat exchange module and the top heat exchange module.

15. A method for assembling a heat exchange device, comprising: The factory-assembled bottom heat exchange module is transported to the assembly location. The bottom heat exchange module has a bottom module frame, a first air inlet side, and a second air inlet side. A first bottom module heat exchange plate is located on the first air inlet side of the bottom heat exchange module, and a second bottom module heat exchange plate is located on the second air inlet side of the bottom heat exchange module. The first and second bottom module heat exchange plates are arranged in a V-shape and supported within the bottom module frame. The factory-assembled top heat exchange module is transported to the assembly location. The top heat exchange module has a top module frame, a first air inlet side and a second air inlet side. A first top module heat exchange plate is located on the first air inlet side of the top heat exchange module, and a second top module heat exchange plate is located on the second air inlet side of the top heat exchange module. The fan module, which is assembled in the factory, is transported to the assembly location. The fan module has a fan module frame and at least one fan and is mounted on top of the top heat exchange module. Install the bottom heat exchange module at the installation location; and The top heat exchange module is mounted above the bottom heat exchange module, and the top module heat exchange plate is arranged and supported in the top module frame such that the first top module heat exchange plate and the second top module heat exchange plate continue and extend the V-shape formed by the first bottom module heat exchange plate and the second bottom module heat exchange plate.

16. A method for assembling a heat exchange device, comprising: Assemble the raised frame at the installation location; Multiple factory-assembled and transportable bottom heat exchange modules are mounted on the raised frame. Each bottom heat exchange module has a bottom module frame, a first air inlet side, and a second air inlet side. A first bottom module heat exchange plate is located on the first air inlet side of the bottom heat exchange module, and a second bottom module heat exchange plate is located on the second air inlet side of the bottom heat exchange module. The first and second bottom module heat exchange plates are arranged in a V-shape and supported within the bottom module frame. A corresponding factory-assembled and transportable top heat exchange module is installed above each of the bottom heat exchange modules. The top heat exchange module has a top module frame, a first air inlet side and a second air inlet side. A first top module heat exchange plate is located on the first air inlet side of the top heat exchange module, and a second top module heat exchange plate is located on the second air inlet side of the top heat exchange module. The first and second top module heat exchange plates are arranged and supported in the top module frame such that the first and second top module heat exchange plates continue and extend the V-shape formed by the first and second bottom module heat exchange plates. The top heat exchange module includes a fan configured to draw ambient air into an air collection section formed by the raised frame and to pass upward through a plurality of the bottom heat exchange modules from a first air intake side and a second air intake side of the bottom heat exchange module, and to pass upward through a plurality of the top heat exchange modules from a first air intake side and a second air intake side of the top heat exchange module.

17. The method of claim 16, further comprising mounting an insulation pad on the raised frame.

18. The method of claim 16, further comprising mounting a nozzle on the raised frame and oriented the nozzle to spray water into air drawn into the air collection section or into air passing through the air collection section.

Citation Information

Patent Citations

  • Modular heat exchange tower and method of assembling same

    US20170037650A1

  • Air-cooled heat transfer device with integrated and mechanized air pre-cool system

    US20190137183A1