Embedded Substrate, Circuit Board Assembly and Electronic Device

Abstract

The present application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate of the present application includes an insulating layer, and electronic components and conductive connectors embedded inside the insulating layer. The conductive connectors are electrically connected to the electronic components; the conductive connectors include at least one fuse unit, and the fuse unit includes a fusible structure and two electrical connection ends. The fusible structure is connected between the two electrical connection ends along the electrical path direction of the conductive connector. The fusible structure is configured to fuse when the passing current exceeds a preset current threshold to disconnect the electrical connection between the electronic component and the external connection end. The present application has lower maintenance and replacement costs when preventing current burnout, and at the same time has a relatively compact volume.

Description

Technical Field

[0001] The present application relates to the field of electronic devices, and in particular, to an embedded substrate, a circuit board assembly, and an electronic device. Background Art

[0002] With the continuous thinning and miniaturization of electronic products, the packaging integration degree of electronic components inside electronic products is getting higher and higher, and the embedded substrate that embeds electronic components inside the circuit board has been more and more widely used.

[0003] Currently, when applying an embedded substrate in an electronic product, the embedded substrate can be arranged on the circuit board of the electronic product, and other electronic components are also arranged on the circuit board. In order to protect the embedded substrate on the circuit board, a fuse tube is also arranged on the circuit board. The fuse tube is connected in the electrical path of the circuit board. When the current in the embedded substrate is too large, the fuse in the fuse tube will melt, thereby disconnecting the electrical connection between the embedded substrate and the circuit board, so as to play a protective role. Generally, the fuse tube and the embedded substrate can be laid flat on the circuit board together.

[0004] However, since a relatively high temperature will be generated when the fuse in the fuse tube melts, it is still possible to burn other components on the circuit board, resulting in the scrapping of the entire circuit board, and the fuse tube will occupy a certain space on the circuit board, increasing the volume of the circuit board. Summary of the Invention

[0005] The present application provides an embedded substrate, a circuit board assembly, and an electronic device. The present application has lower maintenance and replacement costs when preventing current from burning, and at the same time has a relatively compact volume.

[0006] In a first aspect, the present application provides an embedded substrate, including an insulating layer, an electronic component, and a conductive connection body. The electronic component and the conductive connection body are embedded inside the insulating layer. The conductive connection body is electrically connected to the electronic component, and the conductive connection body has an external connection end for introducing an electrical signal into the electronic component. The conductive connection body includes at least one insurance unit. The insurance unit includes a fusible structure and two electrical connection ends. The fusible structure is connected between the two electrical connection ends along the electrical path direction of the conductive connection body. The fusible structure is used to melt when the passing current exceeds a preset current threshold, so as to disconnect the electrical connection between the electronic component and the external connection end.

[0007] In this way, the fuse unit is arranged on the embedded substrate. When the current is too large, the fuse unit will melt and protect the circuit. Since the melting part is located on the embedded substrate, only the embedded substrate may be affected by the high temperature during melting, and other electronic components in the circuit board assembly will not be damaged by the high temperature during melting. In this way, if it melts due to current overload, only a single component, i.e., the embedded substrate, needs to be repaired or replaced, and the other electronic components on the circuit board can still work normally, with lower repair and replacement costs. At the same time, because the fuse unit is integrated on the embedded substrate, it does not occupy extra space on the circuit board, and the volume of the circuit board is relatively compact.

[0008] As an alternative implementation, the fusible structure is exposed on the outer surface of the insulating layer. In this way, the fusible structure can be directly arranged on the outer surface of the insulating layer by means of printing, etching, etc., so the processing and manufacturing are relatively convenient; at the same time, even if the fusible structure melts, the melting part will be located on the surface layer of the embedded substrate, which is convenient for cleaning or repairing the melting part.

[0009] As an alternative implementation, the insulating layer includes a first insulating layer and a second insulating layer arranged in a stacked manner, and the second insulating layer has a hollowed-out area; the electronic component and the conductive connection body are embedded in the first insulating layer, and the fuse unit is located on the surface of the first insulating layer facing the second insulating layer and is exposed in the hollowed-out area.

[0010] As an alternative implementation, the fusible structure at least fills part of the hollowed-out area. In this way, the amount of the fusible structure can be correspondingly controlled by adjusting the filling range of the fusible structure in the hollowed-out area.

[0011] As an alternative implementation, the fusible structure is a fusible conductor, and two electrical connection ends are arranged at intervals along the electrical path direction of the conductive connection body, and the fusible structure is connected between the two electrical connection ends. In such a setting method, the electrical connection ends of the conductive connection body have less restrictions on the material and structural form of the fusible conductor, and the form of the fusible conductor is relatively free.

[0012] As an alternative implementation, a receiving space capable of accommodating the fusible conductor is formed between the two electrical connection ends in the fuse unit, and the fusible conductor is arranged in the receiving space. In this way, a receiving space is formed between the electrical connection ends, and the fusible conductor can be arranged in the receiving space, and the fusible conductor is not likely to interfere with and touch other parts of the conductive connection body, and the work is relatively reliable.

[0013] As an alternative implementation, the two electrical connection ends in the fuse unit jointly define the receiving space.

[0014] As an alternative embodiment, there are two first insulators arranged at intervals between two electrical connection terminals. The distance between the two first insulators is smaller than the width of the other parts of the fusible conductive material in the direction of the electrical path. The part of the fusible conductive material located between the two first insulators forms a break point. In this way, after the fusible conductive material melts, it will be blocked by the first insulator and will not reconnect, having relatively high reliability. At the same time, since the intervals of these first insulators are small, the cross-sectional area of the fusible conductive material in the electrical path can also be small; when a relatively large current is applied, it may melt first. In this way, through the setting of the break point, the specific position where the fusible conductive material melts can also be set.

[0015] As an alternative embodiment, the two electrical connection terminals in the fuse unit are arranged opposite to each other; the fuse unit further includes a second insulator, and an accommodation space is provided inside the second insulator, and the accommodation space is communicated with both electrical connection terminals.

[0016] As an alternative embodiment, the second insulator has a protruding portion protruding into the accommodation space, so that the fusible conductive material forms a break point at a position corresponding to the protruding portion. In this way, the fusible conductive material has a smaller cross-sectional area at the break point and will correspondingly melt at this point. After the fusible conductive material melts, it will be divided into two parts, and the two parts can maintain a mutually disconnected state, preventing the fusible conductive material from approaching and contacting each other again in the molten state. In addition, through the setting of the break point, the specific position where the fusible conductive material melts can also be set.

[0017] As an alternative embodiment, the accommodation space is a meandering channel, and the fusible conductive material is at least filled in the meandering channel. In this way, when the space occupied by the accommodation space is small, a relatively large contact area can be provided between the fusible conductive material and the electrical connection terminals, so as to ensure the formation of a normal and reliable electrical path in the normal working state of the fuse unit.

[0018] As an alternative embodiment, the meandering channel is in the shape of a square frame or a maze. In this way, in a relatively small accommodation space, a contact area as large as possible can be formed between the fusible conductive material and the electrical connection terminals.

[0019] As an alternative embodiment, the fusible conductive material is a jelly containing metal particles, and the melting point of the metal particles is lower than the melting point of the conductive connection body. At this time, since the fusible conductive material is a jelly, it can be flexibly and conveniently arranged between the two electrical connection terminals of the fuse unit, and the two electrical connection terminals are connected by the conductivity of the metal particles. When a relatively large current is applied to the embedded substrate through the electrical path, the fusible conductive material will melt before other parts of the conductive connection body, thereby disconnecting the circuit of the embedded substrate and protecting the embedded substrate and the entire circuit board.

[0020] As an alternative embodiment, the fusible conductive material is solder paste. Tin has a low melting point and a small resistivity. Therefore, as the fusible conductive material in the form of solder paste, it has a low melting point and good electrical conductivity, and can maintain the electrical path conduction of the fuse unit when the embedded substrate is operating normally, and the disconnection function when the current passing through the embedded substrate is too large.

[0021] As an alternative embodiment, the fusible conductive material is printed and cured on the surface of the insulating layer. In this way, the fusible conductive material can be conveniently set into various different shapes and styles.

[0022] As an alternative embodiment, the fusible structure is a fusible part integrally connected between two electrical connection ends, and the cross-sectional area of the fusible structure in the direction perpendicular to the electrical path is smaller than the cross-sectional area of other parts of the conductive connection body in the direction perpendicular to the electrical path.

[0023] At this time, the two electrical connection ends in the fuse unit are not disconnected, but are connected together through the fusible part 3. Therefore, the electrical path between the electrical connection ends can be maintained; so when a large current passes through, the fusible part will fuse prior to other parts of the conductive connection body, thereby interrupting the electrical connection of the embedded substrate and realizing the protection of the embedded substrate and the entire circuit board.

[0024] As an alternative embodiment, the side of the fusible part has a notch to form a break point at the notched part of the fusible part. When the current flowing through the electrical path of the fuse unit is large, the part corresponding to the notch of the fusible part will fuse first, and a necking phenomenon will occur at the notch. At this time, the part corresponding to the notch of the fusible part shrinks inward, and thus will not reconnect.

[0025] As an alternative embodiment, the fusible part is a metal component. In this way, the fusible part and other parts of the conductive connection body can be conveniently formed into an integral structure.

[0026] As an alternative embodiment, the number of fuse units is at least two; the fuse units are connected in parallel to the electrical path of the conductive connection body and / or the fuse units are connected in series to the electrical path of the conductive connection body. In this way, the fuse units can respectively protect different electronic components and different electrical paths in the embedded substrate.

[0027] As an alternative embodiment, the fusible structures in different fuse units have different preset current thresholds. In this way, different fuse units can adapt to the safety current thresholds of different electronic components and different electrical paths.

[0028] As an optional implementation, the fusible structures in different fuse units have at least one of the following different parameters: the melting point of the fusible structure, the amount of the fusible structure in the fuse unit, and the cross-sectional area of ​​the fusible structure in a direction perpendicular to the electrical path.

[0029] As an optional embodiment, the insulating layer has a first side and a second side that are arranged opposite to each other, the external connection end is located on the first side of the insulating layer, and the fuse unit is located on the second side of the insulating layer. In this way, when the fusible structure in the fuse unit is blown, the distance between the blown position and the circuit board will be relatively far, and the circuit board will not be damaged.

[0030] As an optional embodiment, the insulating layer further includes a third insulating layer, the third insulating layer is located on a side of the first insulating layer away from the second insulating layer, and the third insulating layer has a hollow area; the external connection terminal is located on a surface of the first insulating layer facing the third insulating layer and exposed in the hollow area. In this way, the external connection terminal will not protrude from the overall surface of the embedded substrate, so that the embedded substrate can be conveniently and stably installed on the circuit board.

[0031] In a second aspect, the present application provides a circuit board assembly, comprising a circuit board and an embedded substrate as described above, wherein the embedded substrate is disposed on the circuit board, and the external connection end of the embedded substrate is electrically connected to the circuit board. In this way, if the circuit board is blown due to an overcurrent, only the embedded substrate needs to be repaired or replaced, and other electronic components on the circuit board can still work normally, so the repair and replacement costs are low, and the circuit board is relatively compact.

[0032] As an optional implementation, the circuit board is a printed circuit board.

[0033] As an optional embodiment, the embedded substrate is a power source for powering the circuit board. Since a large current may flow through the embedded substrate used as a power source, the fuse unit provided in the embedded substrate can perform fuse protection when the current in the circuit of the circuit board assembly is too large.

[0034] In a third aspect, the present application provides an electronic device, including the circuit board assembly as described above, so that if the circuit board is blown due to current overload, only the embedded substrate needs to be repaired or replaced, and other electronic components on the circuit board can still work normally, the repair and replacement costs are low, and the circuit board is relatively compact.

[0035] The embedded substrate, circuit board assembly and electronic device provided by the present application. The embedded substrate includes an insulating layer, electronic components and conductive connectors. The electronic components and conductive connectors are embedded inside the insulating layer. The conductive connectors are electrically connected to the electronic components, and the conductive connectors have external connection ends for introducing electrical signals into the electronic components. The conductive connectors include at least one fuse unit. The fuse unit includes a fusible structure and two electrical connection ends. The fusible structure is connected between the two electrical connection ends along the electrical path direction of the conductive connector. The fusible structure is used to fuse when the passing current exceeds a preset current threshold to disconnect the electrical connection between the electronic components and the external connection ends. In this way, if it fuses due to current overload, only a single component, i.e., the embedded substrate, needs to be repaired or replaced, and other electronic components on the circuit board can still work normally, with lower repair and replacement costs, and the volume of the circuit board is relatively compact. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a schematic structural diagram of an existing circuit board assembly;

[0037] Figure 2 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application;

[0038] Figure 3 is Figure 2 a cross-sectional schematic diagram of the circuit board assembly in ;

[0039] Figure 4 is a schematic structural diagram of an embedded substrate provided by an embodiment of the present application;

[0040] Figure 5 is Figure 4 a partial enlarged schematic diagram of part A in ;

[0041] Figure 6 is Figure 5 a schematic structural diagram when the fuse unit in does not have a fusible structure;

[0042] Figure 7 is a schematic diagram of the electrical path direction in the embedded substrate provided by an embodiment of the present application;

[0043] Figure 8 is Figure 5 a possible schematic structural diagram of the fuse unit in in the B direction;

[0044] Figure 9 is Figure 8 a schematic structural diagram when the fuse unit in does not have a fusible conductive object;

[0045] Figure 10 is a schematic diagram of the fuse point structure of the fusible conductive object in the first accommodation space provided by an embodiment of the present application;

[0046] Figure 11 Yes Figure 10 Schematic diagram of the fuse point structure after the fusible conductive object in [object] melts;

[0047] Figure 12 Yes Figure 5 Another schematic diagram of the fuse unit in [object];

[0048] Figure 13 Yes Figure 12 Schematic diagram of the structure of the fuse unit in [object] when the fusible conductive object is not provided;

[0049] Figure 14 Yes Figure 13 Partial enlarged schematic diagram at position C in [object];

[0050] Figure 15a Schematic diagram of the step of setting the accommodation space in the setting process of the fusible conductive object provided by the embodiment of the present application;

[0051] Figure 15b Schematic diagram of the printing and curing steps of the fusible conductive object in the setting process of the fusible conductive object provided by the embodiment of the present application;

[0052] Figure 16 Yes Figure 5 Another possible schematic diagram of the fuse unit in the [object] in the B direction;

[0053] Figure 17 Yes Figure 16 Partial enlarged schematic diagram at position D in [object];

[0054] Figure 18 Schematic diagram of a possible arrangement mode of the fuse unit in the embedded substrate provided by the embodiment of the present application;

[0055] Figure 19 Schematic diagram of another possible arrangement mode of the fuse unit in the embedded substrate provided by the embodiment of the present application.

[0056] Explanation of reference numerals:

[0057] 1 - Insulating layer; 2 - Electronic component; 3 - Conductive connector; 10, 10a - Embedded substrate; 20, 20a - Circuit board; 30, 30a - Electronic components; 40a - Fuse; 21, 22, 23, 24, 25 - Chips; 31 - External connection terminal; 32, 32a, 32b, 32c, 32d, 32e, 32f - Fuse unit; 321 - Fusible structure; 322 - Electrical connection terminal; 323, 326 - Meandering channels; 324 - First insulator; 325 - Second insulator; 121, 131 - Hollowed - out areas; 11 - First insulating layer; 12 - Second insulating layer; 13 - Third insulating layer; 321a - Fusible conductor; 321b - Fusible part; 3211 - Notch; 3251 - Protrusion; 100, 100a - Circuit board assembly. Detailed implementation mode

[0058] An embedded substrate is a kind of electronic device packaging structure that integrates electronic components into the substrate. In the embedded substrate, a cavity can be set inside the substrate, and the electronic components can be arranged inside the cavity by surface - mounting method, or the electronic components can be embedded into the cavity by lamination method, etc., and then a base material is covered outside the electronic components. The electronic components inside the embedded substrate can be interconnected with the components outside the substrate through the printed conductors inside the substrate. In this way, the embedded substrate has a relatively simple shape and a high integration degree of internal electronic components.

[0059] Currently, the embedded substrate can be used in cooperation with other electronic components. For example, it can be arranged together with other electronic components on another circuit board, and the embedded substrate realizes signal interconnection with other electronic components on the circuit board through the printed conductors of the circuit board. Among them, the circuit board used to set and fix the embedded substrate can be a printed circuit board (PCB).

[0060] To prevent the electronic components in the circuit board from being burned out due to current overload and other situations, a fuse is generally set in the circuit board. Figure 1 It is a schematic structural diagram of an existing circuit board assembly. As Figure 1As shown, in the existing circuit board assembly 100a, the embedded substrate 10a and other electronic components 30a are both disposed on the circuit board 20a. A fuse tube 40a is also provided on the circuit board 20a. The fuse tube 40a, the embedded substrate 10a, and other electronic components 30a are mounted side by side on the circuit board 20a, and the fuse tube 40a is connected in series in the circuit of the circuit board 20a. Generally, a resistive fuse is provided in the fuse tube 40a. When an overcurrent or the like occurs in the circuit of the circuit board 20a, the fuse in the fuse tube 40a generates high heat under a large current, and thus melts. In this way, the fuse tube 40a disconnects the connection of the circuit in the circuit board 20a due to melting, thereby protecting the circuit board 20a.

[0061] However, when the fuse tube 40a on the circuit board 20a melts, since a relatively high temperature will be generated during the melting process, the electronic components 30a around the fuse tube 40a may fail or even be burned out under the influence of the high temperature. These electronic components 30a are generally soldered on the circuit board 20a and are not easily disassembled and replaced. Therefore, when they are burned out, it is often necessary to replace the entire circuit board assembly 100a, resulting in relatively high maintenance and replacement costs. In addition, the fuse tube 40a also occupies a large volume and space on the circuit board 20a, restricting the further reduction of the size of the circuit board 20a and the improvement of the integration degree.

[0062] Therefore, the present application provides a new embedded substrate, circuit board assembly, and electronic device, which can avoid the situation where the entire circuit board needs to be replaced when an overcurrent occurs in the circuit board.

[0063] Figure 2 It is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application. Figure 3 is Figure 2 a cross-sectional schematic diagram of the circuit board assembly in Figure 2 and Figure 3 As shown, in an electronic device, there may be one or more circuit board assemblies 100. These circuit board assemblies 100 form different functional modules and achieve various different functions and operations through the interconnection inside and between the circuit board assemblies 100. Specifically, the circuit board assembly 100 in the present application may include a circuit board 20 and at least one embedded substrate 10. The embedded substrate 10 is disposed on the circuit board 20 and has an electrical connection with the circuit board 20, thereby realizing interconnection and signal transmission. Among them, the circuit board 20 serving as the carrier of the embedded substrate 10 may specifically be a printed circuit board.

[0064] In addition, in order to implement the functions of the circuit board assembly 100, other electronic components 30 may also be provided on the circuit board 20. The other electronic components 30 provided on the circuit board 20 may be active electronic components, such as chips, diodes, transistors, etc., or may be passive electronic components, such as resistors, inductors or capacitors, etc., or may also be a combination of the above active and passive electronic components, etc.

[0065] In this embodiment, as an alternative, the embedded substrate 10 can be a power supply and is used to supply power to the circuit board assembly 100. In this case, a relatively large current may pass through the embedded substrate 10 used as a power supply. When the current is too large, it may damage the embedded substrate 10 and the electronic components in the entire circuit board assembly 100. For this reason, a fuse unit is provided in the embedded substrate 10, which can perform fuse protection when the current in the circuit of the circuit board assembly 100 is too large.

[0066] Figure 4 It is a schematic structural diagram of an embedded substrate provided by an embodiment of the present application. Figure 5 is Figure 4 a partial enlarged schematic diagram of part A in. As Figure 4 and Figure 5 shown, specifically, the embedded substrate 10 provided in the circuit board assembly 100 may specifically include components such as an insulating layer 1, an electronic component 2, and a conductive connection body 3. The electronic component 2 and the conductive connection body 3 are buried inside the insulating layer 1. The conductive connection body 3 is electrically connected to the electronic component 2, and the conductive connection body 3 has an external connection end 31 for introducing an electrical signal into the electronic component 2; the conductive connection body 3 includes at least one fuse unit 32. The fuse unit 32 includes a fusible structure 321 and two electrical connection ends 322. The fusible structure 321 is connected between the two electrical connection ends 322 along the electrical path direction of the conductive connection body 3. The fusible structure 321 is used to fuse when the passing current exceeds a preset current threshold to disconnect the electrical connection between the electronic component 2 and the external connection end 31.

[0067] Among them, the electronic component 2 in the embedded substrate 10 can be an active electronic component, such as a chip, a diode, a transistor, etc., or can be a passive electronic component, such as a resistor, an inductor or a capacitor, etc., or can also be a combination of both active and passive electronic components. In this embodiment, the case where the electronic component 2 in the embedded substrate 10 is a chip is taken as an example for description.

[0068] In the insulating layer 1 of the embedded substrate 10, one or more cavities may be provided. The electronic components 2 and the conductive connectors 3 can be arranged in the cavities by surface mounting or lamination, and the materials of the insulating layer 1 are used to cover the surfaces of the electronic components 2 and the conductive connectors 3. In this way, the electronic components 2 and the conductive connectors 3 can be encapsulated inside the embedded substrate 10. Under the isolation and shielding of the insulating layer 1, the electronic components 2 can only be electrically connected to the external circuit through the conductive connectors 3, thereby realizing the insulation protection of the electronic components 2.

[0069] Among them, the material constituting the insulating layer 1 can be epoxy resin, phenolic resin, and other insulating materials well-known to those skilled in the art, etc., which are not limited in this embodiment.

[0070] In order to realize the connection between the electronic components 2 and the external circuit of the embedded substrate 10, the conductive connectors can be interconnected and electrically connected to the electronic components 2, and the conductive connectors have external connection ends that can be connected to other circuits outside the embedded substrate 10. In this way, one or more electrical paths are constructed between the electronic components 2 and the external circuit of the embedded substrate 10, and the electronic components 2 can be interconnected with the external circuit of the embedded substrate 10 through the electrical paths, thereby transmitting electrical signals.

[0071] As can be seen from the above, for the electronic components 2 in the embedded substrate 10, the connection and signal conduction between it and the external circuit are mainly realized by the electrical paths provided by the conductive connectors 3. Therefore, a fuse unit 32 can be provided on the conductive connector 3. The fuse unit 32 can disconnect the circuit when the passing current is too large. In this way, when there is an overcurrent phenomenon in the electrical path of the conductive connector 3, the connection between the electronic components 2 and the external circuit can be disconnected through the fuse function of the fuse unit 32, thereby protecting the embedded substrate 10 and the circuits in the entire circuit board assembly.

[0072] In this way, by providing the fuse unit 32 on the embedded substrate 10, when the current is too large, the fuse unit 32 will fuse and protect the circuit. Since the fusing part is located on the embedded substrate 10, only the embedded substrate 10 may be affected by the high temperature during fusing, and other electronic components in the circuit board assembly 100 will not be damaged by the high temperature during fusing. In this way, if it fuses due to overcurrent, only a single component, i.e., the embedded substrate 10, needs to be repaired or replaced, and the other electronic components on the circuit board 20 can still work normally, and the repair and replacement costs are relatively low. At the same time, because the fuse unit 32 is integrated on the embedded substrate 10, it does not occupy additional space on the circuit board 20, and the volume of the circuit board 20 is relatively compact.

[0073] It can be understood that since more than one chip may be provided inside the embedded substrate 10 and each chip may require a safety current of a different magnitude, correspondingly, one or more fuse units 32 may be included in the electrical path of the embedded substrate 10. In this way, different fuse units can provide fusing protection for different chips respectively.

[0074] Specifically, each fuse unit 32 includes a fusible structure 321 and two electrical connection terminals 322. The two electrical connection terminals 322 are arranged in sequence along the direction of the electrical path, and the fusible structure 321 is located between the two electrical connection terminals 322. Moreover, the fusible structure 321 itself is a conductor and can conduct the two electrical connection terminals 322 to each other. When a current flows through the electrical path of the embedded substrate 10, the conductor in the electrical path generates a certain amount of heat due to its own resistance; when the current is too large, the generated heat will also be higher. When the current flowing through the electrical path of the embedded substrate 10 exceeds the preset threshold, the fusible structure 321 will be fused earlier than other parts of the conductive connection body 3, thereby timely disconnecting the circuit and playing a protective role for the embedded substrate 10 and the entire circuit board assembly 100.

[0075] Among them, in order to make the fusible structure 321 fuse earlier than other parts of the electrical path in the embedded substrate 10, compared with other parts of the conductive connection body 3, the fusible structure 321 may have a greater resistance, so as to be fused due to accumulating more heat, or be fused because the fusible structure 321 has a lower melting point than the conductive connection body 3.

[0076] Among them, optionally, the conductive connection body 3 can be made of a metal material with a lower resistivity, for example, made of copper, etc. Correspondingly, the main material constituting the fusible structure 321 can be a metal material with a melting point lower than that of copper.

[0077] Correspondingly, the fusible structure 321 can have various different types and structures, and the fusible structure 321 can also have different setting methods and setting positions.

[0078] As an optional implementation manner, in order to facilitate the setting of the fusible structure 321 on the embedded substrate 10 and for the fusible structure 321 to be easily repaired and reconnected after fusing, the fusible structure 321 can be exposed on the outer surface of the insulating layer 1.

[0079] At this time, the fusible structure 321 is exposed and covers a part of the surface area of the embedded substrate 10. In this way, the fusible structure 321 can be directly set on the outer surface of the insulating layer 1 by means of printing, etching, etc., so the processing and manufacturing are relatively convenient. At the same time, even if the fusible structure 321 is fused, the fused part will be located on the surface layer of the embedded substrate 10, which is convenient for cleaning or repairing the fused part.

[0080] It can be understood that, in order to avoid the fuseable structure 321 affecting the overall shape of the embedded substrate 10, as an alternative implementation, the part where the fuseable structure 321 is located can be lower than the overall outer surface of the embedded substrate 10, or flush with the outer surface of the embedded substrate 10. In this way, the fuseable structure 321 will not protrude from the outermost surface of the embedded substrate 10, that is, it will not affect the overall shape and size of the embedded substrate 10.

[0081] In addition, in the embedded substrate 10, the insulating layer 1 can be a multi-layer structure. Correspondingly, the fuseable structure 321 can be in a different layer from other structures of the conductive connection body 3. Among them, the structures of different layers can be made of different materials. Exemplarily, the insulating layer on the surface of the embedded substrate 10 and the insulating layer inside the embedded substrate 10 can be formed of different materials.

[0082] Figure 6 Yes Figure 5 is a schematic structural diagram when there is no fuseable structure in the fuse unit in. As Figure 4 and Figure 6 shown, in an alternative embedded substrate structure, the insulating layer 1 includes a first insulating layer 11 and a second insulating layer 12 arranged in a stacked manner, and the second insulating layer 12 has a hollowed-out area 121. Specifically, the hollowed-out area 121 penetrates the entire second insulating layer 12 and reaches the first insulating layer 11. At this time, the bottom of the hollowed-out area 121 is the demarcation area between the first insulating layer 11 and the second insulating layer 12. In this way, the electronic component 2 and the conductive connection body 3 can be embedded in the first insulating layer 11, and the fuse unit 32 is located on the surface of the first insulating layer 11 facing the second insulating layer 12 and is exposed in the hollowed-out area 121, as specifically shown in Figure 4 shown.

[0083] At this time, the first insulating layer 11 and the second insulating layer 12 can be formed of different materials and formed through different processes. Therefore, when manufacturing the embedded substrate 10, the electronic component 2 and the conductive connection body 3 can be first embedded in the first insulating layer 11, and then the second insulating layer 12 and the fuse unit 32 are provided on the surface of the first insulating layer 11. In this way, the fuse unit 32 and the electronic component 2 are provided in different processes respectively. The setting of the fuse unit 32 is relatively convenient and has little impact on the overall structure of the embedded substrate 10.

[0084] Optionally, the fusible structure 321 may fill or occupy a portion of the hollow area 121, or may occupy the entire range of the hollow area 121. The filling area or filling ratio of the fusible structure 321 in the hollow area 121 may be determined accordingly according to the specific form of the fusible structure and the performance index requirements of the safety unit 32. In this way, the amount of the fusible structure 321 may be controlled accordingly by adjusting the filling range of the fusible structure 321 in the hollow area 121.

[0085] When the fuse unit 32 in the embedded substrate 10 is performing fuse protection, the fusible structure 321 may generate high heat. If the fusible structure 321 is close to the circuit board 20 where the embedded substrate 10 is located, the high temperature generated by the fusible structure 321 when it is fused may damage the circuit board 20. In order to prevent the fusible structure from burning the circuit board, as an optional method, in the embedded substrate 10, the insulating layer 1 has a first side and a second side that are arranged oppositely, the external connection end 31 of the conductive connector 3 is located on the first side of the insulating layer 1, and the fuse unit 32 is located on the second side of the insulating layer 1. At this time, the external connection end 31 can be far away from the fuse unit 32.

[0086] Specifically, because the external connection end 31 of the conductive connector 3 is directly connected to the circuit board 20, the first side of the embedded substrate 10 faces the circuit board 20 and is connected and fixed to the circuit board 20, and the insurance unit 32 is located on the side of the embedded substrate 10 that is away from the circuit board 20. At this time, the insurance unit 32 is far away from the circuit board 20. Figure 7 Schematic diagram of the direction of the electrical path in the embedded substrate provided by the embodiment of the present application. Figure 7 As shown, the insurance unit 32 is arranged on the side of the embedded substrate 10 away from the circuit board 20. In the embedded substrate 10, the electrical path I formed by the conductive connector 3 will present an "upward winding" structure, that is, after the electrical path I is connected from the circuit board 20 to the external connection terminal 31, it will lead to the side of the embedded substrate 10 away from the circuit board 20, and connect to the insurance unit 32 also located on the side of the embedded substrate 10 away from the circuit board 20. When the fusible structure 321 in the insurance unit 32 is blown, the distance between the blown position and the circuit board 20 will also be relatively far, and the circuit board 20 will not be damaged.

[0087] Since the external connection terminal 31 of the conductive connector 3 is arranged facing the circuit board 20, in order to connect the external connection terminal 31 to the circuit board 20, the embedded substrate 10 also has a corresponding connection structure. Optionally, in an optional structure, the insulating layer 1 also includes a third insulating layer 13, the third insulating layer 13 is located on the side of the first insulating layer 11 away from the second insulating layer 12, and the third insulating layer 13 has a hollow area 131. The external connection terminal 31 is located on the surface of the first insulating layer 11 facing the third insulating layer 13, and is exposed in the hollow area 131.

[0088] At this time, the structure of the third insulating layer 13 is similar to that of the first insulating layer 11, and both are located on the surface layer of the embedded substrate 10. A hollow area 131 is provided in the third insulating layer 13, and the bottom of the hollow area 131 is the boundary area between the third insulating layer 13 and the first insulating layer 11. Due to the existence of the hollow area 131, the external connection end 31 of the conductive connector 3 buried in the first insulating layer 11 can be exposed on the surface of the first insulating layer 11 and exposed in the hollow area 131. In this way, the hollow area 131 is provided in the third insulating layer 13, and the external connection end 31 is provided in the hollow area 131, and the external connection end 31 does not protrude from the overall surface of the embedded substrate 10, so that the embedded substrate 10 can be conveniently and stably installed on the circuit board 20.

[0089] In addition, the overall structure of the embedded substrate 10 may also be in other possible forms or structures, which will not be described in detail here.

[0090] In order to realize the fusing function when a large current passes through, the fusible structure 321 can have a variety of different forms and structures. For example, the fusible structure 321 can be made of a material with a low melting point, so that when a large current passes through, the heat generated by the resistance of the fusible structure 321 can melt the fusible structure 321. In another implementation form, the fusible structure 321 can be formed of the same material as the other parts of the conductive connector 3, but the fusible structure 321 can be set to have a smaller cross-sectional area, so that the fusible structure 321 forms a larger resistance, and when a large current passes through, the heat generated by the resistance is used to melt the fusible structure 321. The various possible implementation methods of the fusible structure 321 and the related structures of the embedded substrate 10 are described in detail below.

[0091] in, Figure 8 yes Figure 5 A possible structural diagram of the insurance unit in the B direction. Figure 8As shown, as an alternative implementation of the fuseable structure 321, the fuseable structure 321 can be a fuseable conductive object 321a. The two electrical connection ends 322 are arranged at intervals along the electrical path direction of the conductive connection body 3, and the fuseable structure 321 is connected between the two electrical connection ends 322.

[0092] At this time, the fuseable conductive object 321a that constitutes the fuseable structure 321 can be made of a different material from the conductive connection body 3. In this way, when setting the fuseable structure 321, the electrical connection end 322 and the fuseable conductive object 321a can be of a split structure and formed by a process. In such a setting method, the electrical connection end of the conductive connection body 3 has less restriction on the material and structural form of the fuseable conductive object 321a, and the form of the fuseable conductive object 321a is relatively free.

[0093] Among them, the fuseable conductive object 321a can be made of a material that can conduct electricity and has a low melting point, so as to achieve conduction or melting in the electrical path of the conductive connection body 3. In addition, the fuseable conductive object 321a can be made of a material that is easy to form, which is conducive to setting the fuseable conductive object 321a between the two electrical connection ends 322 in a preset shape or structure.

[0094] In order to set the fuseable conductive object 321a between the two electrical connection ends 322, optionally, a receiving space capable of accommodating the fuseable conductive object 321a can be formed between the two electrical connection ends 322 in the fuse unit, and the fuseable conductive object 321a is arranged in the receiving space. Among them, the two electrical connection ends can be arranged at intervals, and the interval area between the two electrical connection ends 322 can be used as the receiving space for accommodating the fuseable conductive object 321a. Among them, the shape and size of the receiving space can be determined according to the shapes and relative positions of the two electrical connection ends 322 in the fuse unit, or can be determined according to other structures in the fuse unit. In this way, a receiving space is formed between the electrical connection ends 322, and the fuseable conductive object 321a can be arranged in the receiving space, and the fuseable conductive object 321a is not likely to interfere with and touch other parts of the conductive connection body 3, and the work is relatively reliable.

[0095] Among them, in an alternative way, the two electrical connection ends 322 in the fuse unit can jointly define the receiving space, specifically as Figure 8 shown. At this time, only relying on the relative positions, distances of the two electrical connection ends 322 and the shape jointly surrounded by the two electrical connection ends 322, the shape and size of the receiving space can be defined, and the fuseable conductive object 321a can be arranged in the receiving space.

[0096] It can be understood that the electrical connection end 322 can be a side wall or a "fence" structure with a certain extension length, and the structures of the two electrical connection ends 322 can cooperate with each other to jointly form a semi-closed pattern or structure. The fusible conductive material 321a can be blocked by the side walls of the electrical connection end 322 and thus restricted within the semi-closed pattern jointly enclosed by the two electrical connection ends 322. In this way, by using the different extension lengths and extension directions of the electrical connection end 322, the fusible conductive material 321a can have a specific shape and size.

[0097] In this way, the fusible conductive material 321a will form different shapes according to the shape of the accommodating space. Figure 9 Yes Figure 8 Schematic diagram of the structure when the fuse unit in Figure 9 As shown, in an optional structure, the two electrical connection ends 322 can be bent and coiled around each other, so that the accommodating space enclosed by the electrical connection ends 322 is in the shape of a meandering channel 323. The fusible conductive material 321a can be filled in the meandering channel 323, as Figure 8 shown. At this time, the meandering channel 323 has relatively two side walls that are coiled around each other, and these two side walls are respectively formed by the two electrical connection ends 322. The fusible conductive material 321a located between the relatively two side walls of the meandering channel 323 will conduct the two relatively electrical connection ends 322 under its own conductive action, and when the current passing through is relatively large, it will fuse to disconnect the electrical connection between the relatively two side walls of the meandering channel 323. Because the accommodating space itself is in the shape of the meandering channel 323, the fusible conductive material 321a will correspondingly also be in a meandering structure. Therefore, when the space occupied by the accommodating space is relatively small, a relatively large contact area can be provided between the fusible conductive material 321a and the electrical connection end 322, so as to ensure that a normal and reliable electrical path is formed in the fuse unit 32 under normal working conditions. In addition, the meandering channel 323 formed by the accommodating space should be a single channel, so as to avoid forming redundant paths between the fusible conductive material 321a and the electrical connection end 322, thus interfering with the operation of the normal electrical path in the embedded substrate 10, or when the current passing through is relatively large, the fusible conductive material 321a in some meandering channels does not fuse smoothly, affecting the insurance function of the fuse unit 32.

[0098] At this time, in order to make the two electrical connection terminals 322 jointly enclose a meandering channel 323, the two electrical connection terminals 322 can be located at similar or the same height in the embedded substrate 10. Exemplarily, the two electrical connection terminals 322 in the fuse unit can be located at the same height, that is, both are on the same layer. At this time, the meandering channel 323 and the fusible conductive material 321a disposed in the meandering channel 323 are both planar layer structures extending in the plane direction of the embedded substrate 10. In this embodiment, the case where the two electrical connection terminals 322 in the fuse unit are located at the same height and the meandering channel is a planar layer structure is taken as an example for description.

[0099] In addition, it can be understood that in other embodiments, the two electrical connection terminals 322 can also be at different heights in the embedded substrate 10. At this time, the two electrical connection terminals 322 can jointly enclose a meandering channel with a three-dimensional shape, or the two electrical connection terminals 322 can respectively form opposite side walls of the meandering channel in the thickness direction of the embedded substrate 10. The specific shape of the meandering channel when the electrical connection terminals 322 are at different heights is not elaborated here.

[0100] Specifically, the two electrical connection terminals 322 of the fuse unit can be located on the outermost layer of the embedded substrate 10, so that the fusible conductive material 321a connected between the two electrical connection terminals 322 can be on the surface of the embedded substrate 10, which is convenient for the setting, maintenance and replacement of the fusible conductive material 321a.

[0101] Among them, the meandering channel formed by the accommodating space can have a variety of different specific forms. For example, as Figure 9 shown, the meandering channel can be similar to a "hui" character shape, that is, the two electrical connection terminals 322 in the fuse unit are bent and coiled around each other in a symmetrical or opposite direction, and there is always a gap between the two electrical connection terminals 322, so as to form a meandering channel in the shape of a "hui" character between the two electrical connection terminals 322.

[0102] Alternatively, the meandering channel can also be in a shape similar to a maze. At this time, the two electrical connection terminals 322 are arranged parallel to each other and at intervals, and extend along the same direction at the same time; as the extending direction of the electrical connection terminals 322 changes, the meandering channel in the accommodating space as a whole is in a shape similar to a maze.

[0103] In addition, the meandering channel can also be in other different forms. In this embodiment, the specific shape of the meandering channel is not limited.

[0104] Among them, the fusible conductive object 321a can fill a part of the space of the meandering channel 323 or the entire meandering channel 323; alternatively, the fusible conductive object 321a can fill the space inside the meandering channel 323 and the space outside the meandering channel. Different filling amounts and filling forms can make the fusible conductive object 321a arranged between the two electrical connection ends 322 have different dosages, so that the current for melting the fusible conductive object 321a also has different magnitudes. Figure 8 In [description], the fusible conductive object 321a fills the space inside and outside the meandering channel 323.

[0105] In addition, since the fusible conductive object 321a may have certain deformation characteristics, such as local structure melting and flowing phenomena at high temperatures, etc., after the fusible conductive object 321a melts, it may still re - contact and conduct due to its own deformation or backflow. To avoid the re - connection phenomenon after the fusible conductive object 321a melts, at certain specific positions of the fusible conductive object 321a, a certain partition structure can be set to prevent the backflow of the fusible conductive object 321a after melting. This specific position can be regarded as the partition point of the fusible conductive object 321a. In this way, after the fusible conductive object 321a melts, it is blocked by the partition structure and will not be re - connected, having high reliability. At the same time, since the partition structure is provided at these specific positions, its cross - sectional area in the electrical path can also be smaller; when a larger current is applied, it may melt first. In this way, through the setting of the partition point, the specific position where the fusible conductive object 321a melts can also be set.

[0106] Figure 10 It is a schematic diagram of the melting point structure of the fusible conductive object in the first accommodation space provided by the embodiment of the present application. Figure 11 is Figure 10 The schematic diagram of the melting point structure after the fusible conductive object in [description] melts. As Figure 10 and Figure 11 shown, in order to form the partition point of the fusible conductive object 321a, there are two first insulators 324 arranged at intervals between the two electrical connection ends 322, and the distance between the two first insulators 324 is less than the width of the remaining part of the fusible conductive object 321a in the electrical path direction, so that the part of the fusible conductive object 321a located between the two first insulators 324 forms a partition point.

[0107] Specifically, since there is a small spacing between two oppositely arranged first insulators 324, the cross-sectional area of the corresponding fusible conductive object 321a between the two first insulators 324 is small, and the corresponding resistance value is also large. When the fusible conductive object 321a is fused, the fusible conductive object 321a can be disconnected from the positions corresponding to the two first insulators 324. At this moment, the fusible conductive object 321a will be divided into a first part connected to one of the electrical connection terminals 322 and a second part connected to the other electrical connection terminal 322 at the fused position, and there will be a gap between the first part and the second part due to melting. As the temperature of the fused fusible conductive object 321a drops, it will return to the solid state; at this time, under the influence of surface tension, the first part and the second part will tend to retract towards their respective corresponding electrical connection terminals 322. Under the action of this trend, the distance between the first part and the second part will increase, and the residual fusible conductive object 321a located between the first part and the second part will be pulled away by the first part or the second part, thereby maintaining the disconnected state between the first part and the second part and preventing the first part and the second part from approaching and contacting each other again in the molten state. At the same time, during the process of the fusible conductive object 321a returning to the solid state, the fusible conductive object 321a will not remain on the surface of the insulating layer to cause a micro short circuit. Among them, the spacing between the two first insulators 324 can be set accordingly according to the material of the fusible conductive object 321a and the fusing current.

[0108] Figure 12 Yes Figure 5 It is another structural schematic diagram of the fuse unit in Figure 5 . In addition to the above-mentioned method of directly defining the shape of the accommodating space by the two electrical connection terminals 322, as another alternative implementation manner, the two electrical connection terminals 322 in the fuse unit are arranged oppositely; the fuse unit further includes a second insulator 325, and an accommodating space is provided inside the second insulator 325, and the accommodating space communicates with both of the two electrical connection terminals 322.

[0109] At this time, the accommodating space is not directly surrounded by the electrical connection terminals 322, but is formed by the second insulator 325 arranged between the two electrical connection terminals 322. Correspondingly, the fusible conductive object 321a accommodated in the accommodating space will also be located inside the second insulator. In order to keep the fusible conductive object 321a connected to the two electrical connection terminals 322, the accommodating space inside the second insulator communicates with both of the two electrical connection terminals 322 in the fuse unit. In this way, the overall accommodating space can be in a shape and structure similar to a channel, and the fusible conductive object 321a is arranged in this channel and has a shape matching or consistent with this channel.

[0110] Since the two electrical connection terminals 322 in the channel and the fuse unit 32 remain connected, correspondingly, the shape formed by the fusible conductive object 321a will also contact the electrical connection terminals 322, so that the two electrical connection terminals 322 are electrically connected through the fusible conductive object 321a. When the fusible conductive object 321a melts under the condition of excessive current passing through, the electrical path between the two electrical connection terminals 322 will also be disconnected accordingly, thus playing a protective role for the embedded substrate 10 and the circuits in the entire circuit board.

[0111] Specifically, the second insulator 325 can be an integral structure with the insulating layer 1 of the embedded substrate 10, or a split structure with the insulating layer 1. In this embodiment, the second insulator 325 and the insulating layer 1 are described as an independent split structure.

[0112] Among them, the two electrical connection terminals 322 in the fuse unit can be located at the same or similar height of the embedded substrate 10, or at different layers or different heights of the embedded substrate 10. Correspondingly, as the heights of the two electrical connection terminals 322 are the same or different, the second insulator 325 can be in a planar layer structure or a three-dimensional structure accordingly. In this embodiment, the two electrical connection terminals 322 in the fuse unit are located at the same or similar height on the embedded substrate 10, and the second insulator 325 is in a planar layer structure as an example for description.

[0113] Specifically, the two electrical connection terminals 322 in the fuse unit are arranged opposite to each other and have a spacing sufficient to accommodate the second insulator therebetween. Since the structure for accommodating the fusible conductive object 321a is formed by the second insulator 325, the electrical connection terminals 322 can have relatively simple and regular shapes and structures. Exemplarily, for the two oppositely arranged electrical connection terminals 322, the edge shapes can be parallel to each other. In this way, a relatively uniform spacing is formed between the electrical connection terminals 322, avoiding the situation that the two electrical connection terminals 322 are directly touched and conducted due to the irregular shape of the electrical connection terminals 322.

[0114] Figure 13 is Figure 12 The schematic structural diagram of the fuse unit in [when the fusible conductive object is not provided]. As Figure 13As shown, at this time, similar to the case where the accommodation space is directly enclosed by the electrical connection terminal 322, when the accommodation space is formed inside the second insulator 325, the accommodation space can also be a tortuous and circuitous channel 326. Among them, different from the structure of the circuitous channel when the accommodation space is directly enclosed by the electrical connection terminal 322, at this time, the opposite side walls constituting the circuitous channel 326 are both formed by the second insulator 325, and the fusible conductive object 321a will fill all the spaces of the circuitous channel 326, so as to contact two electrical connection terminals 322 located at both ends of the circuitous channel 326 respectively. When the embedded substrate 10 operates normally, the fusible conductive object 321a will conduct the opposite two electrical connection terminals 322 under its own conductive action, and when the passing current is relatively large, it will fuse to disconnect the electrical connection between both ends of the circuitous channel 326. In this way, because the fusible conductive object 321a has a circuitous shape corresponding to the circuitous channel 326, when the space occupied by the accommodation space is relatively small, a relatively large contact area can be formed between the fusible conductive object 321a and the electrical connection terminal 322, so as to ensure that the fuse unit 32 forms a normal and reliable electrical path under the normal working state.

[0115] Specifically, when the accommodation space is the circuitous channel 326 arranged inside the second insulator 325, the circuitous channel 326 formed by the accommodation space can also have a variety of different specific forms. For example, as Figure 13 shown, the circuitous channel 326 inside the second insulator 325 can be similar to the shape of a maze, or in the shape of a Chinese character 'hui' (square with a hole in the middle), or the circuitous channel 326 presents other different forms and shapes, etc.

[0116] When the fuse unit 32 uses the second insulator 325 to form an accommodation space for accommodating the fusible conductive object 321a, the fuse point of the fusible conductive object 321a can also be formed. Figure 14 is Figure 13 a partial enlarged schematic diagram at position C in Figure 13 and Figure 14 shown, in an optional implementation manner, the second insulator 325 has a protruding portion 3251 protruding into the accommodation space, so that the fusible conductive object 321a forms a breaking point at a position corresponding to the protruding portion 3251.

[0117] Specifically, the accommodation space in the second insulator 325 can be in the shape of a channel. Exemplarily, as Figure 13As shown, a meandering channel 326 is formed in the second insulator 325, and the widths and cross-sectional areas of the segments of the meandering channel 326 are substantially equal. In order to avoid the phenomenon of reconnection after the fusible conductive object 321a is fused, the second insulator 325 can have a protruding portion 3251, and the protruding portion 3251 is located in the accommodating space, that is, at the edge of the meandering channel 326. Therefore, at the position corresponding to the protruding portion 3251 in the accommodating space, the width and cross-sectional area will suddenly decrease, thus forming a cut-off point. In this way, when the fusible conductive object 321a is fused, it will be cut off into two parts by the protruding portion 3251, and these two parts will also contract due to the characteristics of thermal expansion and contraction and surface tension, pulling away the residual fusible conductive object 321a on one side of the protruding portion 3251, keeping the fusible conductive object 321a in a cut-off state, and enabling the fuse unit 32 to have a relatively reliable fuse function. Among them, the distance between the two protruding portions 3251 can be set accordingly according to the material of the fusible conductive object 321a and the fusing current.

[0118] Among them, the protruding portion 3251 of the second insulator 325 can have a variety of different shapes and forms. For example, Figure 14 As shown, in an optional second insulator structure, the second insulator 325 can be provided with protruding portions 3251 on both opposite sides of the accommodating space, and a cut-off point of the fusible conductive object 321a is formed between the two protruding portions 3251. Or, in another optional second insulator structure, the second insulator 325 is provided with a protruding portion 3251 only on one side of the accommodating space, and the protruding portion 3251 and the side wall on the other side of the accommodating space jointly form a cut-off point of the fusible conductive object 321a. In this embodiment, the case where the second insulator 325 is provided with protruding portions 3251 on both opposite sides of the accommodating space is taken as an example for description.

[0119] In order to improve the working reliability of the fuse unit 32, in the accommodating space, there can be multiple cut-off points of the fusible conductive object 321a, such as Figure 13 As shown. In this way, after the fusible conductive object 321a is fused, multiple cut-off points can respectively cut off the parts of the fusible conductive object 321a after fusing, avoiding the situation where the fusible conductive object 321a maintains a connected state due to the failure of a single cut-off point.

[0120] Optionally, the fusible conductive object 321a can be of a variety of different materials or forms. In an optional manner, the fusible conductive object 321a can be a jelly containing metal particles, and the melting point of the metal particles is lower than the melting point of the conductive connection body 3.

[0121] At this time, the fusible conductor 321a is a jelly-like substance, so it can be flexibly and conveniently arranged between the two electrical connection terminals 322 of the fuse unit. For example, it is arranged in the accommodation space of the fuse unit by laying or filling. The fusible conductor 321a contains metal particles, and the metal particles have conductivity, so the fusible conductor 321a can connect the two electrical connection terminals 322. The melting point of the metal particles is lower than the melting point of the material constituting the conductive connector 3. Therefore, when the current passing through the buried substrate 10 in the electrical path is large, the fusible conductor 321a will fuse prior to other parts of the conductive connector 3, thereby disconnecting the circuit of the buried substrate 10 and playing a protective role for the buried substrate 10 and the entire circuit board.

[0122] Among them, the metal particles contained in the fusible conductor 321a can be made of a metal material with a relatively low melting point such as tin. Tin has a relatively low melting point (about 230 degrees Celsius) and a relatively small resistivity. Therefore, the fusible conductor 321a containing tin particles has a relatively low melting point and good conductivity, and can maintain the electrical path conduction of the fuse unit when the buried substrate 10 is working normally, and the disconnection function when the current passing through the buried substrate 10 is too large.

[0123] Exemplarily, in an optional manner, the fusible conductor 321a can be solder paste. In this way, the shape of the fusible conductor 321a is not fixed before curing, so it can be more conveniently arranged between the intervals of the two electrical connection terminals 322 in the fuse unit.

[0124] When arranging the fusible conductor 321a, the fusible conductor 321a can also be fixed between the two electrical connection terminals 322 in a variety of different ways. Optionally, the fusible conductor 321a can be printed and cured on the surface of the insulating layer 1. In this way, the fusible conductor 321a can be conveniently arranged in a variety of different shapes and styles.

[0125] Specifically, Figures 15a to 15b The setting process of the fusible conductor 321a is shown. Figure 15a It is a schematic diagram of the step of setting the accommodation space in the setting process of the fusible conductor provided by the embodiment of the present application. As Figure 15a shown, since the fusible conductor 321a can be a jelly-like substance containing metal particles, an accommodation space capable of accommodating the fusible conductor 321a can be first set on the surface of the buried substrate 10. The accommodation space can be located between the two electrical connection terminals 322, such as a meandering channel 323, etc. Figure 15b It is a schematic diagram of the printing and curing steps of the fusible conductor in the setting process of the fusible conductor provided by the embodiment of the present application. As Figure 15bAs shown, after setting a receiving space, such as a meandering channel 323, the fusible conductive material 321a can be printed at a position between two electrical connection terminals 322 in the fuse unit. Finally, the fusible conductive material 321a is cured by means of high temperature or the like, so that the fusible conductive material 321a is cured from a jelly-like substance to form a structure with a certain hardness and shape.

[0126] In this way, the fusible conductive material 321a in the form of a jelly-like substance is laid in the receiving space by means of printing or the like, and then the fusible conductive material 321a is cured and formed. This is not only convenient for the setting of the fusible conductive material 321a, but also enables the fusible conductive material 321a to have a fixed shape after curing, thereby achieving high working reliability.

[0127] 165 is Figure 5 Another possible structural schematic diagram of the fuse unit in the B direction in. As Figure 16 shown, as another implementation manner of the fusible structure 321, the fusible structure 321 can be a fusible portion 321b integrally connected between two electrical connection terminals 322, and the cross-sectional area of the fusible structure 321 in the direction perpendicular to the electrical path is smaller than the cross-sectional area of other parts of the conductive connection body 3 in the direction perpendicular to the electrical path.

[0128] At this time, the two electrical connection terminals 322 in the fuse unit are not disconnected, but are connected together through the fusible portion 321b. Therefore, the electrical connection between the electrical connection terminals 322 can be maintained. And because the cross-sectional area of the fusible portion 321b is smaller than the cross-sectional area of the rest of the conductive connection body 3, when a larger current passes through, the fusible portion 321b will fuse prior to other parts of the conductive connection body 3, thereby interrupting the electrical connection of the embedded substrate 10 and realizing the protection of the embedded substrate 10 and the entire circuit board.

[0129] In one optional manner, the fusible portion 321b and the electrical connection terminal 322 can be an integral structure made of the same material, such as metal. At this time, both the fusible portion 321b and the electrical connection terminal 322 are metal components.

[0130] Among them, the fusible portion 321b can specifically have a variety of different structures and shapes. Optionally, the fusible portion 321b can be an arm-like or rod-like structure connected between two electrical connection terminals 322. In this way, the fusible portion 321b has a smaller cross-sectional area in the direction perpendicular to the electrical path, and the fusible portion 321b has a relatively regular shape, which is convenient for processing and manufacturing.

[0131] When the fusible part 321b passes a large current and fuses due to the heat generated by its own resistance, in order to prevent the phenomenon of re - contact connection at the fusing part after the fusible part 321b fuses, similar to the fusible conductive object 321a, the fusible part 321b can also have a breaking point.

[0132] Among them, Figure 17 is Figure 16 a partial enlarged schematic diagram at position D in. As Figure 16 and Figure 17 shown, as an optional implementation manner, the side of the fusible part 321b can have a notch 3211 to form a breaking point at the position corresponding to the fusible notch 3211.

[0133] Specifically, because the resistance of the fusible part 321b is related to the cross - sectional area of the fusible part 321b in the direction perpendicular to the electrical path, when the side of the fusible part 321b has a notch 3211, the cross - sectional area at the notch 3211 will be smaller. Correspondingly, the resistance of the fusible part 321b at the notch 3211 will be larger. Therefore, when the current flowing through the electrical path of the fuse unit is large, the part corresponding to the notch 3211 of the fusible part 321b will fuse first, and a necking phenomenon will occur at the notch 3211. At this time, the part corresponding to the notch 3211 of the fusible part 321b shrinks inward, so that it will not reconnect.

[0134] The following specifically describes the setting and arrangement of the fuse units in the embedded substrate 10.

[0135] Since the embedded substrate 10 often includes more than one electronic component such as a chip 2, and at the same time, there may be multiple different electrical paths in the embedded substrate 10, and these electronic components 2 and electrical paths often have different safety current thresholds and need to be protected independently. Therefore, in order to protect different electronic components 2 and different electrical paths in the embedded substrate 10 respectively, as an optional way, the number of fuse units included in the embedded substrate 10 is at least two; these fuse units can be connected in parallel to the electrical path of the conductive connection body 3; or these fuse units are connected in series to the electrical path of the conductive connection body 3; or these fuse units can be connected in the electrical path of the conductive connection body 3 by series or parallel methods respectively.

[0136] Among them, in order to adapt to the safety current thresholds of different electronic components 2 and different electrical paths, optionally, different fuse units can be set in different electrical paths, and these fuse units have different preset current thresholds.

[0137] In order to enable different fuse units to have different preset current thresholds, the parameters and characteristics of the fusible structure 321 in different fuse units can be controlled and adjusted so that the fusible structure 321 in the fuse unit has a specific preset current threshold. Optionally, the fusible structures 321 in different fuse units can have different parameters: for example, the melting point of the fusible structure 321, the amount of the fusible structure 321 used in the fuse unit, the cross-sectional area of the fusible structure 321 in the direction perpendicular to the electrical path, etc. Among the above parameters, each fuse unit can have only one parameter different from other fuse units, while other parameters are the same; or at least two of the above parameters in the fuse unit are different from other fuse units.

[0138] Among them, when the melting points of the fusible structures 321 are different, the heat required for the fusible structures 321 to fuse is also different. For the fusible structure 321 with a lower melting point, as long as a smaller current is passed, enough heat can be generated to fuse the fusible structure 321; while for the fusible structure 321 with a higher melting point, when a larger current is passed, enough heat can be generated to fuse the fusible structure 321. Therefore, different melting points of the fusible structure 321 can enable the fuse unit to have different preset current thresholds accordingly.

[0139] Similarly, when the amount of the fusible structure 321 used in the fuse unit is small, a smaller current can cause the fusible structure 321 to be fused; while when the amount of the fusible structure 321 used in the fuse unit is large, a larger current and its generated heat are sufficient to cause the fusible structure 321 to be fused.

[0140] The cross-sectional area of the fusible structure 321 in the direction perpendicular to the electrical path can limit the resistance of the fusible structure 321 itself. When the resistance of the fusible structure 321 itself is large, even if a smaller current is passed, its generated heat will be large and cause the fusible structure 321 to fuse. Therefore, by making different fusible structures 321 have different cross-sectional areas in the direction perpendicular to the electrical path, the resistance of the fusible structure 321 and the corresponding preset current threshold at the time of fusing can be controlled. This can control the preset current threshold corresponding to the fusible structure 321 when it is difficult to distinguish the material and amount of the fusible structure 321, for example, when the fusible structure 321 is the fusible part 321b.

[0141] Figure 18 It is a schematic diagram of a possible arrangement method of the fuse unit in the embedded substrate provided by the embodiment of the present application. Figure 18 In, in order to facilitate the representation of the arrangement relationship of each fuse unit, the structure of the electrical path 4 formed by the electronic component 2 and the conductive connection body 3 is simplified for representation. As Figure 18As shown, when there are multiple fuse units, they can be connected in parallel in the electrical path 4 formed in the embedded substrate, and different fuse units correspond to different electronic components 2. Among them, in order to make different fuse units have different preset current thresholds, different amounts of the fusible structure 321 can be provided in different fuse units. Specifically, the fuse unit 32a, the fuse unit 32b, the fuse unit 32c, and the fuse unit 32d are respectively connected to different chips 21, 22, 23, and 24, and these fuse units are all connected in parallel in the electrical path 4. At this time, different fuse units can have different preset current thresholds and different on-off states. Specifically, the fuse units 32a and 32b have a fusible conductor 321a, and the amounts of the fusible conductor 321a in the fuse units 32a and 32b are different; while the fuse units 32c and 32d do not have the fusible conductor 321a provided. In this way, the fuse units 32a and 32b in the embedded substrate 10 can be connected to the electrical path 4 and have a protection function, and the fuse units 32a and 32b have different preset current thresholds; while the fuse units 32c and 32d are not connected to the electrical path 4.

[0142] Figure 19 FIG. is a schematic diagram of another possible arrangement of the fuse units in the embedded substrate provided by the embodiment of the present application. As Figure 19 shown, when there are multiple fuse units, they can also be connected in series in the electrical path 4 of the embedded substrate, so as to provide electrical connection for the chip 25; and for different fuse units, their corresponding fusible structures 321 have different amounts. Specifically, the amount of the fusible conductor 321a in the fuse unit 32e is more than the amount of the fusible conductor 321a in the fuse unit 32f. If the current in the electrical path in the embedded substrate 10 is too large, the fusible conductor 321a in the third fuse unit will first fuse. In this way, the occurrence position of the fuse point in the embedded substrate 10 can be controlled according to the different amounts of the fusible structure 321 in different fuse units.

[0143] In addition, when there are multiple fuse units, they can also have other different arrangement ways and relative positions, which are not limited herein.

[0144] In this embodiment, the circuit board assembly includes a circuit board and an embedded substrate disposed on the circuit board. The embedded substrate includes an insulating layer, electronic components, and conductive connectors. The electronic components and conductive connectors are embedded inside the insulating layer. The conductive connectors are electrically connected to the electronic components, and the conductive connectors have external connection ends for introducing electrical signals to the electronic components. The conductive connectors include at least one fuse unit. The fuse unit includes a fusible structure and two electrical connection ends. The fusible structure is connected between the two electrical connection ends along the electrical path direction of the conductive connector. The fusible structure is configured to fuse when the passing current exceeds a preset current threshold to disconnect the electrical connection between the electronic components and the external connection ends. In this way, if it fuses due to current overload, only a single component, i.e., the embedded substrate, needs to be repaired or replaced, and other electronic components on the circuit board can still work normally, with lower repair and replacement costs. At the same time, the circuit board has a relatively compact volume.

[0145] In addition, the present application also provides an electronic device. The electronic device includes the circuit board assembly in the above embodiment. The circuit board assembly has a circuit board and an embedded substrate disposed on the circuit board. A fuse unit is provided on the embedded substrate, and can provide fuse protection for the embedded substrate and the entire circuit board assembly by fusing the fusible structure therein. Among them, the specific structures, functions, and working principles of the circuit board assembly and the embedded substrate can refer to the descriptions in the foregoing embodiments and will not be elaborated here.

[0146] Specifically, the electronic device in the present application may include, but is not limited to, a desktop computer, a workbench, a server, a blade server, a mainframe computer, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as mobile phones, tablet computers, personal digital assistants (PDAs), point-of-sales (POS) terminals, in-vehicle computers, etc. The components shown in the present application, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or claimed herein.

[0147] In this application, the electronic device includes one or more circuit board assemblies. The circuit board assembly includes a circuit board and an embedded substrate disposed on the circuit board. The embedded substrate includes an insulating layer, electronic components, and conductive connectors. The electronic components and the conductive connectors are embedded inside the insulating layer. The conductive connectors are electrically connected to the electronic components, and the conductive connectors have external connection ends for introducing electrical signals into the electronic components. The conductive connector includes at least one fuse unit. The fuse unit includes a fusible structure and two electrical connection ends. The fusible structure is connected between the two electrical connection ends along the electrical path direction of the conductive connector. The fusible structure is configured to fuse when the passing current exceeds a preset current threshold to disconnect the electrical connection between the electronic component and the external connection end. In this way, if it fuses due to current overload, only a single component, i.e., the embedded substrate, needs to be repaired or replaced. Other electronic components on the circuit board can still work normally, and the repair and replacement costs are relatively low, and the volume of the circuit board is relatively compact.

Claims

1. An embedded substrate, characterized in that, it includes an insulating layer, electronic components, and conductive connectors. The electronic components and the conductive connectors are embedded inside the insulating layer. The conductive connectors are electrically connected to the electronic components, and the conductive connectors have external connection ends for introducing electrical signals to the electronic components. The conductive connectors include at least one fuse unit. The fuse unit includes a fusible structure and two electrical connection ends. The fusible structure is connected between the two electrical connection ends along the electrical path direction of the conductive connector. The fusible structure is used to fuse when the passing current exceeds a preset current threshold to disconnect the electrical connection between the electronic components and the external connection ends; the fusible structure is exposed on the outer surface of the insulating layer.

2. The embedded substrate according to claim 1, characterized in that, the insulating layer includes a first insulating layer and a second insulating layer arranged in a stacked manner. The second insulating layer has a hollowed-out area. The electronic components and the conductive connectors are embedded in the first insulating layer. The fuse unit is located on the surface of the first insulating layer facing the second insulating layer and is exposed within the hollowed-out area.

3. The embedded substrate according to claim 2, characterized in that, the fusible structure at least fills part of the hollowed-out area.

4. The embedded substrate according to any one of claims 1-3, characterized in that, the fusible structure is a fusible conductive material. The two electrical connection ends are spaced along the electrical path direction of the conductive connector, and the fusible structure is connected between the two electrical connection ends.

5. The embedded substrate according to claim 4, characterized in that, a receiving space capable of accommodating the fusible conductive material is formed between the two electrical connection ends in the fuse unit, and the fusible conductive material is arranged in the receiving space.

6. The embedded substrate according to claim 5, characterized in that, the two electrical connection ends in the fuse unit jointly define the receiving space.

7. The embedded substrate according to claim 6, characterized in that, there are two first insulators arranged at intervals between the two electrical connection ends. The distance between the two first insulators is less than the width of the remaining part of the fusible conductive material in the electrical path direction. The part of the fusible conductive material located between the two first insulators forms a break point.

8. The embedded substrate according to claim 7, characterized in that, the two electrical connection ends in the fuse unit are arranged opposite to each other; the fuse unit further includes a second insulator. A receiving space is formed inside the second insulator, and the receiving space is communicated with both of the two electrical connection ends.

9. The embedded substrate according to claim 8, characterized in that, the second insulator has a protruding part protruding into the receiving space, so that the fusible conductive material forms a break point at the position corresponding to the protruding part.

10. The embedded substrate according to any one of claims 5-9, characterized in that, The accommodating space is a meandering channel, and the fusible conductive material is at least filled in the meandering channel.

11. The embedded substrate according to claim 10, wherein, the meandering channel is in the shape of a square within a square or a maze.

12. The embedded substrate according to claim 4, wherein, the fusible conductive material is a jelly-like substance containing metal particles, and the melting point of the metal particles is lower than the melting point of the conductive connector.

13. The embedded substrate according to any one of claims 5-9, 11, wherein, the fusible conductive material is a jelly-like substance containing metal particles, and the melting point of the metal particles is lower than the melting point of the conductive connector.

14. The embedded substrate according to claim 10, wherein, the fusible conductive material is a jelly-like substance containing metal particles, and the melting point of the metal particles is lower than the melting point of the conductive connector.

15. The embedded substrate according to claim 12 or 14, wherein, the fusible conductive material is solder paste.

16. The embedded substrate according to claim 13, wherein, the fusible conductive material is solder paste.

17. The embedded substrate according to any one of claims 12, 14, 16, wherein, the fusible conductive material is printed and cured on the surface of the insulating layer.

18. The embedded substrate according to claim 13, wherein, the fusible conductive material is printed and cured on the surface of the insulating layer.

19. The embedded substrate according to claim 15, wherein, the fusible conductive material is printed and cured on the surface of the insulating layer.

20. The embedded substrate according to any one of claims 1-3, wherein, the fusible structure is a fusible part integrally connected between the two electrical connection ends, and the cross-sectional area of the fusible structure in the direction perpendicular to the electrical path is smaller than the cross-sectional area of the other parts of the conductive connector in the direction perpendicular to the electrical path.

21. The embedded substrate according to claim 20, wherein, a notch is provided on the side of the fusible part to form a break point at the notched part of the fusible part.

22. The embedded substrate according to claim 20, wherein, the fusible part is a metal member.

23. The embedded substrate according to claim 21, wherein, the fusible part is a metal member.

24. The embedded substrate according to any one of claims 1-3, 5-9, 11-12, 14, 16, 18-19, 21-23, wherein, the number of the fuse units is at least two; the fuse units are connected in parallel to the electrical path of the conductive connector and / or the fuse units are connected in series to the electrical path of the conductive connector.

25. The embedded substrate according to claim 4, wherein, the number of the fuse units is at least two; the fuse units are connected in parallel to the electrical path of the conductive connector and / or the fuse units are connected in series to the electrical path of the conductive connector.

26. The embedded substrate according to claim 10, It is characterized in that the number of the insurance units is at least two; the insurance units are connected in parallel to the electrical path of the conductive connector and / or the insurance units are connected in series to the electrical path of the conductive connector.

27. The embedded substrate according to claim 13, It is characterized in that the number of the insurance units is at least two; the insurance units are connected in parallel to the electrical path of the conductive connector and / or the insurance units are connected in series to the electrical path of the conductive connector.

28. The embedded substrate according to claim 15, It is characterized in that the number of the insurance units is at least two; the insurance units are connected in parallel to the electrical path of the conductive connector and / or the insurance units are connected in series to the electrical path of the conductive connector.

29. The embedded substrate according to claim 17, It is characterized in that the number of the insurance units is at least two; the insurance units are connected in parallel to the electrical path of the conductive connector and / or the insurance units are connected in series to the electrical path of the conductive connector.

30. The embedded substrate according to claim 20, It is characterized in that the number of the insurance units is at least two; the insurance units are connected in parallel to the electrical path of the conductive connector and / or the insurance units are connected in series to the electrical path of the conductive connector.

31. The embedded substrate according to claim 24, It is characterized in that the fusing structures in different insurance units have different preset current thresholds.

32. The embedded substrate according to any one of claims 25 - 30, It is characterized in that the fusing structures in different insurance units have different preset current thresholds.

33. The embedded substrate according to claim 31, It is characterized in that the fusing structures in different insurance units have at least one of the following different parameters: the melting point of the fusing structure, the dosage of the fusing structure in the insurance unit, the cross-sectional area of the fusing structure in the direction perpendicular to the electrical path.

34. The embedded substrate according to claim 32, It is characterized in that the fusing structures in different insurance units have at least one of the following different parameters: the melting point of the fusing structure, the dosage of the fusing structure in the insurance unit, the cross-sectional area of the fusing structure in the direction perpendicular to the electrical path.

35. The embedded substrate according to any one of claims 1 - 3, 5 - 9, 11 - 12, 14, 16, 18 - 19, 21 - 23, 25 - 31, 33 - 34, It is characterized in that the insulating layer has a first side and a second side which are oppositely arranged, the external connection end is located on the first side of the insulating layer, and the insurance unit is located on the second side of the insulating layer.

36. The embedded substrate according to claim 4, It is characterized in that the insulating layer has a first side and a second side which are oppositely arranged, the external connection end is located on the first side of the insulating layer, and the insurance unit is located on the second side of the insulating layer.

37. The embedded substrate according to claim 10, It is characterized in that The insulating layer has a first side and a second side that are opposite to each other, the external connection end is located on the first side of the insulating layer, and the safety unit is located on the second side of the insulating layer.

38. The buried substrate according to claim 13, It is characterized in that The insulating layer has a first side and a second side that are opposite to each other, the external connection end is located on the first side of the insulating layer, and the safety unit is located on the second side of the insulating layer.

39. The buried substrate according to claim 15, It is characterized in that The insulating layer has a first side and a second side that are opposite to each other, the external connection end is located on the first side of the insulating layer, and the safety unit is located on the second side of the insulating layer.

40. The buried substrate according to claim 17, It is characterized in that The insulating layer has a first side and a second side that are opposite to each other, the external connection end is located on the first side of the insulating layer, and the safety unit is located on the second side of the insulating layer.

41. The buried substrate according to claim 20, It is characterized in that The insulating layer has a first side and a second side that are opposite to each other, the external connection end is located on the first side of the insulating layer, and the safety unit is located on the second side of the insulating layer.

42. The buried substrate according to claim 24, It is characterized in that The insulating layer has a first side and a second side that are opposite to each other, the external connection end is located on the first side of the insulating layer, and the safety unit is located on the second side of the insulating layer.

43. The buried substrate according to claim 32, It is characterized in that The insulating layer has a first side and a second side that are opposite to each other, the external connection end is located on the first side of the insulating layer, and the safety unit is located on the second side of the insulating layer.

44. The buried substrate according to claim 2 or 3, It is characterized in that The insulating layer also includes a third insulating layer, which is located on a side of the first insulating layer away from the second insulating layer, and has a hollow area; the external connection end is located on a surface of the first insulating layer facing the third insulating layer and is exposed in the hollow area.

45. A circuit board assembly, comprising a circuit board and the embedded substrate according to any one of claims 1 to 44, wherein the embedded substrate is arranged on the circuit board, and an external connection terminal of the embedded substrate is electrically connected to the circuit board.

46. ​​The circuit board assembly of claim 45, It is characterized in that The circuit board is a printed circuit board PCB.

47. A circuit board assembly according to claim 45 or 46, It is characterized in that The embedded substrate is a power source for supplying power to the circuit board.

48. An electronic device comprising the circuit board assembly according to any one of claims 45 to 47.

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