Sensor chip position detection device and method with electronic excitation

Abstract

The present invention provides a sensor chip position detection device and method with electronic excitation, wherein the sensor chip position detection device with electronic excitation includes: a multi-angle electronic excitation module, a mounting fixture, a sensor power supply and load module, a phase acquisition and processing module, a chip position detection module, and a power supply module. The multi-angle electronic excitation module is electrically connected to the chip position detection module; the mounting fixture fixes the sensor at the electronic excitation signal position; the sensor power supply and load module is electrically connected to the sensor; the phase acquisition and processing module is electrically connected to the sensor and the chip position detection module respectively; and the power supply module is electrically connected to the sensor power supply and load module, the phase acquisition and processing module, the chip position detection module, and the multi-angle electronic excitation module respectively. The device and method of the present invention do not require physical cutting of the sensor, which will not cause damage or waste, and the installation and detection of the sensor are simple, fast, low-cost, and highly efficient.

Description

Technical Field

[0001] The present invention belongs to the technical field of product detection and testing, and in particular relates to a sensor chip position detection device and method with electronic excitation. Background Art

[0002] During the design, production and verification of sensors, especially engine sensors, it is necessary to check the chip position. Any offset or tilt of the chip will cause the phase angle of the sensor detection signal to shift, which will in turn reduce the measurement accuracy. In the past, the conventional practice for checking the position of the chip inside the sensor was to use physical cutting methods, which required damaging the sensor. After the inspection, the sensor was scrapped. This method greatly caused product waste, high inspection costs, complex methods and slow inspection speeds. Although the applicant is also researching and developing new dynamic inspection devices and methods, the sensor needs to be frequently disassembled and assembled to different installation positions, the inspection device is large in size, and there is still room for improvement in operation and efficiency. Summary of the Invention

[0003] In order to overcome the deficiencies in the prior art, the present invention provides a sensor chip position detection device and method with electronic excitation, which has simple operation, fast speed, high efficiency, small size, low cost and does not damage the sensor.

[0004] To achieve the above objectives, the present invention proposes a sensor chip position detection device with electronic excitation, comprising: a multi-angle electronic excitation module, a mounting fixture, a sensor power supply and load module, a phase acquisition and processing module, a chip position detection module, and a power supply module; wherein,

[0005] The multi-angle electronic excitation module is electrically connected to the chip position detection module and provides multi-angle electronic excitation signals for the sensor to be tested;

[0006] The mounting fixture fixes the sensor to be tested at the electronic excitation signal position;

[0007] The sensor power supply and load module is electrically connected to the sensor to be tested and provides power and workload for the sensor to be tested;

[0008] The phase acquisition and processing module is electrically connected to the sensor to be tested and the chip position detection module to acquire and process the phase signal output by the sensor to be tested, and transmit the processed phase signal to the chip position detection module;

[0009] The chip position detection module includes a main control computer and a chip position detection unit installed on the main control computer, which receives the phase signal output by the phase acquisition and processing module and measures and calculates the phase signal to determine the chip position status in the sensor to be tested;

[0010] The power supply module is electrically connected to the power supply and load module of the sensor to be tested, the phase acquisition and processing module, the chip position detection module and the multi-angle electronic excitation module respectively.

[0011] Preferably, the multi-angle electronic excitation module is composed of a coil system, and the coil system includes two groups of coils arranged orthogonally.

[0012] Preferably, the multi-angle electronic excitation module is composed of a coil system, which can generate two pairs of alternating magnetic fields in four directions, and provide electronic excitation signals at four angles of 0 degrees, 90 degrees, 180 degrees and 270 degrees.

[0013] Preferably, the sensor to be tested is fixedly mounted at a middle position of two groups of coils orthogonally arranged in the multi-angle electronic excitation module.

[0014] Preferably, the sensor power supply and load module includes a DC regulated power supply, a load resistor, a load capacitor and a custom load protection circuit.

[0015] Preferably, the phase acquisition and processing module includes a signal acquisition card and a signal conditioning circuit; wherein, the signal acquisition card is connected to the sensor to be tested and is used to acquire the phase signal output by the sensor to be tested; the signal conditioning circuit is connected to the signal acquisition card and is used to receive and dynamically analyze the phase signal to filter out glitches in the phase signal.

[0016] Preferably, the chip position checking module measures and calculates the phase angle and the phase angle difference of the phase signal, and compares the phase angle difference with a preset checking threshold to determine whether the position of the chip is offset or tilted.

[0017] Preferably, the chip position inspection unit can set and schedule the multi-angle electronic excitation module, sensor power supply and load module, phase acquisition and processing module, and can measure and calculate the phase signal to determine the chip position status in the sensor to be tested.

[0018] Preferably, the chip position checking unit measures and calculates the phase angle and the phase angle difference of the phase signal, and compares the phase angle difference with a preset checking threshold to determine whether the position of the chip is shifted or tilted.

[0019] Preferably, the chip position detection module further includes an electronic excitation synchronization unit installed on a main control computer, and the electronic excitation synchronization unit is capable of receiving instructions and configuration parameters of the chip position detection unit to synchronize and calibrate the electronic excitation signal of the multi-angle electronic excitation module.

[0020] Preferably, the chip position inspection module further comprises a result display screen and a result display light; the result display screen is used to display the intermediate information and result information output by the chip position inspection unit; the result display light is used to indicate whether the inspection is completed.

[0021] Preferably, the sensor to be tested is an engine sensor, and the engine sensor includes a crankshaft sensor or a camshaft sensor.

[0022] To achieve the above object, the present invention further provides a method for detecting the position of a sensor chip, comprising the following steps:

[0023] The sensor to be tested is fixedly installed at the position of the electronic excitation signal;

[0024] Starting the sensor chip position inspection device with electronic excitation to start inspection;

[0025] The check is completed and the results are displayed.

[0026] Preferably, the method further comprises the step of synchronizing and calibrating the multi-angle electronic excitation module using the electronic excitation synchronization unit before starting the inspection.

[0027] Preferably, the method further comprises the step of setting parameters for each module of the sensor chip position inspection device with electronic excitation before starting the inspection.

[0028] Preferably, the method further includes generating alternating electronic excitation signals for the sensors to be tested in sequence according to angles during the inspection process, and processing, measuring and calculating phase signals output by the sensors to be tested to obtain phase angle differences.

[0029] Preferably, the method further comprises comparing the phase angle difference with a preset inspection threshold to determine whether the position of the sensor chip to be tested is offset or tilted.

[0030] Preferably, the step of displaying the inspection result also includes displaying the phase angle, the phase angle difference and the inspection result, and at the same time, the result display light is on.

[0031] Compared with the prior art, the sensor chip position inspection device and method with electronic excitation of the present invention determines whether the chip position is offset or tilted by analyzing and processing the sensor detection signal. The present invention does not require physical cutting of the sensor, will not cause damage and waste of the sensor, and has a fast detection speed, high efficiency and low cost. In addition, the present invention uses a multi-angle electronic excitation module to excite the sensor with electronic signals, which greatly reduces the size of the inspection device and has low power consumption, and the sensor only needs to be installed once to achieve all angle inspections, saving time and effort. The present invention has a high degree of automation. Through automated configuration and automated detection, the sensor inspection method is very simple, the operation method is easy to repeat, and it is suitable for large-scale detection with high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a structural block diagram of the sensor chip position detection device with electronic excitation of the present invention;

[0033] Figure 2 This is a schematic diagram of the assembly structure of the sensor and the multi-angle electronic excitation module;

[0034] Figure 3 This is a flowchart of the sensor chip position detection device with electronic excitation of the present invention. DETAILED DESCRIPTION

[0035] The solution of the present invention is further described below in conjunction with the accompanying drawings and preferred embodiments.

[0036] In the following description, many specific details are set forth in order to enable those skilled in the art to more fully understand the present invention. However, it will be apparent to those skilled in the art that the present invention may be implemented without some of these specific details. Furthermore, it should be understood that the present invention is not limited to the specific embodiments described. On the contrary, any combination of the following features and elements may be considered to implement the present invention, regardless of whether they relate to different embodiments. Therefore, the following aspects, features, embodiments and advantages are for illustrative purposes only and should not be regarded as elements or limitations of the claims unless expressly set forth in the claims. In addition, if words indicating directions appear in this document, such as up, down, left, right, upper side, lower side, etc., they are only for convenience of expression and are expressed based on the relative positions of the components in the current drawings and should not be understood as limiting the scope of protection.

[0037] See also Figure 1 As shown, this embodiment proposes a sensor chip position inspection device with electronic excitation, wherein the type of sensor to be tested is preferably an engine sensor, such as a crankshaft sensor, a camshaft sensor, etc., but of course it is not limited to this, and also includes other types of sensors such as wheel speed sensors, rotation speed sensors, etc., which can be inspected using the inspection device.

[0038] The above-mentioned sensor chip position inspection device with electronic excitation includes: a multi-angle electronic excitation module, a mounting fixture, a sensor power supply and load module, a phase acquisition and processing module, a chip position inspection module, and a power supply module electrically connected to the multi-angle electronic excitation module, the sensor power supply and load module, the phase acquisition and processing module, and the chip position inspection module respectively.

[0039] Multi-angle electronic excitation module: electrically connected to the chip position detection module and provides static, multi-angle electronic excitation signals for the sensor to be tested. The multi-angle electronic excitation module consists of a coil system, such as Figure 2 As shown, the coil system includes two orthogonally arranged coil groups C1C3 and C2C4. Under static conditions, the coil system can generate two pairs of alternating magnetic fields in four directions, providing electronic excitation signals at four angles: 0 degrees, 90 degrees, 180 degrees, and 270 degrees. For example, coil C1C3 generates a horizontal excitation signal from right to left to the sensor under test, i.e., an electronic excitation signal in the 0-degree direction. Similarly, coil C1C3 can also generate a horizontal excitation signal from left to right to the sensor under test, or coil C2C4 can generate a vertical excitation signal from top to bottom or from bottom to top to the sensor under test, i.e., electronic excitation signals corresponding to the 180-degree, 90-degree, and 270-degree directions, respectively. The electronic excitation signals in each direction are detected by the sensor under test and a phase signal is output accordingly. The multi-angle electronic excitation module can also communicate with the chip position detection module and receive control instructions.

[0040] For example, a mounting hole is provided on the mounting fixture for mounting the sensor to be tested and fixing it at the position of the electronic excitation signal, thereby indirectly detecting the chip position. Figure 2 As shown, the sensor to be tested is installed in the middle position of two groups of coils arranged orthogonally. When the chip in the sensor to be tested is offset, the center of the chip will be offset by a certain distance relative to the center of the sensor.

[0041] The sensor power supply and load module electrically connects to the sensor under test and provides power and load for the sensor under test. It includes a DC regulated power supply, load resistors, and load capacitors. Furthermore, the sensor power supply and load module can include a custom load protection circuit that defines overcurrent thresholds for different sensor types, protecting the load circuitry, including the load resistors and load capacitors, from overcurrent damage.

[0042] Phase acquisition and processing module: Electrically connected to the sensor under test and the chip position detection module, the phase acquisition and processing module includes a signal acquisition card and a signal conditioning circuit for acquiring and processing the phase signal output by the sensor under test. The signal acquisition card connects to the sensor under test and acquires the phase signal output by the sensor under test. The signal conditioning circuit connects to the signal acquisition card and collects and dynamically analyzes the phase signal based on the sensor's signal characteristics to filter out glitches and improve phase signal acquisition accuracy.

[0043] The chip position detection module receives the phase signal output by the phase acquisition and processing module and measures and calculates the phase signal to determine the chip position within the sensor under test. The chip position detection module includes a main control computer, a chip position detection unit installed on the main control computer, an electronic excitation synchronization unit, a result display screen, a result display light, and a detection switch. The chip position detection unit can configure and schedule other modules. Furthermore, the chip position detection unit measures and calculates the phase angle and phase angle difference of the phase signal under test, and compares the phase angle difference with a preset detection threshold to determine whether the chip position has shifted or tilted. For example, the chip position detection unit measures and calculates the phase signal output corresponding to the 0-degree direction to determine whether the chip position of the sensor has shifted or tilted in this direction. Similarly, the chip position detection unit sequentially determines whether the chip position in the sensor has shifted or tilted in other angular directions, such as 90, 180, and 270 degrees, ultimately determining whether the chip position in the sensor has shifted or tilted.

[0044] Among them, the electronic excitation synchronization unit is used to synchronize and calibrate the electronic excitation signal of the coil system in the multi-angle electronic excitation module after each startup, and during the inspection process, it can receive instructions and configuration parameters from the chip position inspection unit to control the coil system and provide a phase signal reference for the sensor. The result display screen is used to display the intermediate information and result information output by the chip position inspection unit, such as the signal phase angle, phase angle difference and inspection results corresponding to the four excitation directions. The result display light is used to indicate whether the inspection is completed. At the same time, when the inspection result exceeds the preset threshold, a red light will light up to alarm, and a green light will light up if it does not exceed the threshold. The inspection switch is a start switch used to start the inspection program.

[0045] Power supply module: electrically connected to the sensor power supply and load module, the phase acquisition and processing module, the chip position detection module and the multi-angle electronic excitation module, and provides working power and leakage protection for the above modules.

[0046] See also Figure 3 FIG. 1 shows the working steps of the sensor chip position detection device with electronic excitation according to the present invention, including:

[0047] Power on and electronic excitation synchronization: After the device is powered on, the electronic excitation synchronization unit synchronizes and calibrates the coil system in the multi-angle electronic excitation module.

[0048] Sensor Installation: Install the sensor to be tested, such as an engine sensor. Use bolts or other fixings to secure the sensor to the mounting fixture, ensuring that the sensor is centered between the two orthogonal coils.

[0049] Chip Position Check Module Settings: Configure the chip position check module's parameters, including sensor type selection, current threshold settings, electronic excitation signal settings (including excitation magnitude and period), signal acquisition frequency and period settings, and check threshold settings. The electronic excitation synchronization unit receives instructions from the chip position check unit and electronic excitation signal settings to synchronize the coil systems in the multi-angle electronic excitation module.

[0050] The inspection switch is triggered: After the inspection switch is triggered, the inspection is started, the chip position inspection module is started and the functional modules are scheduled to start working.

[0051] Chip position check: Execute chip position check. The coil system of the multi-angle electronic excitation module generates alternating electronic excitation signals in sequence according to the angle. The phase acquisition and processing module acquires and processes the phase signal output by the sensor. The chip position check unit receives the phase signal output by the phase acquisition and processing module, and measures and calculates the phase angle and phase angle difference of the phase signal. The phase angle and phase angle difference are displayed in real time on the result display.

[0052] Chip Position Check Completed: After the chip position check is complete, the chip position check unit stores and analyzes the phase angles and phase angle differences of the sensor at multiple measured angles. It then compares the phase angle differences at each of these measured angles with preset check thresholds to determine whether the sensor chip position is offset or tilted. The result display shows the phase angle, phase angle difference, and check result. The result indicator lights up, and a red alarm appears if the check result exceeds the preset threshold; a green alarm appears if it does not.

[0053] End inspection: End this round of inspection.

[0054] Although the present invention has been disclosed above with reference to preferred embodiments, the present invention is not limited thereto. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A sensor chip position detection device with electronic excitation, characterized in that: include: Multi-angle electronic excitation module, installation fixture, sensor power supply and load module, phase acquisition and processing module, chip position detection module, power supply module; Among them, The multi-angle electronic excitation module is composed of a coil system, which includes two groups of orthogonally arranged coils. The sensor to be tested is fixedly installed in the middle position of the two orthogonally arranged coils. The multi-angle electronic excitation module is electrically connected to the chip position detection module and provides two pairs of alternating magnetic fields in four directions for the sensor to be tested, providing electronic excitation signals at four angles of 0 degrees, 90 degrees, 180 degrees and 270 degrees. The mounting fixture fixes the sensor to be tested at the electronic excitation signal position; The sensor power supply and load module is electrically connected to the sensor to be tested and provides power and workload for the sensor to be tested; The phase acquisition and processing module is electrically connected to the sensor to be tested and the chip position detection module to acquire and process the phase signal output by the sensor to be tested, and transmit the processed phase signal to the chip position detection module; The chip position detection module includes a main control computer and a chip position detection unit installed on the main control computer, which receives the phase signal output by the phase acquisition and processing module and measures and calculates the phase signal to determine the chip position status in the sensor to be tested; The power supply module is electrically connected to the power supply and load module of the sensor to be tested, the phase acquisition and processing module, the chip position detection module and the multi-angle electronic excitation module respectively.

2. A sensor chip position detection device with electronic excitation according to claim 1, characterized in that: The sensor power supply and load module includes a DC regulated power supply, a load resistor, a load capacitor and a custom load protection circuit.

3. A sensor chip position detection device with electronic excitation according to claim 1, characterized in that: The phase acquisition and processing module includes a signal acquisition card and a signal conditioning circuit; wherein, the signal acquisition card is connected to the sensor to be tested and is used to acquire the phase signal output by the sensor to be tested; the signal conditioning circuit is connected to the signal acquisition card and is used to receive and dynamically analyze the phase signal to filter out burrs in the phase signal.

4. A sensor chip position detection device with electronic excitation according to any one of claims 1 to 3, characterized in that: The chip position checking module measures and calculates the phase angle and the phase angle difference of the phase signal, and compares the phase angle difference with a preset checking threshold to determine whether the position of the chip is offset or tilted.

5. A sensor chip position detection device with electronic excitation according to any one of claims 1 to 3, characterized in that: The chip position detection unit sets and schedules the multi-angle electronic excitation module, sensor power supply and load module, phase acquisition and processing module, and can measure and calculate the phase signal to determine the chip position status in the sensor to be tested.

6. A sensor chip position detection device with electronic excitation according to claim 5, characterized in that: The chip position checking unit measures and calculates the phase angle and the phase angle difference of the phase signal, and compares the phase angle difference with a preset checking threshold to determine whether the position of the chip is shifted or tilted.

7. A sensor chip position detection device with electronic excitation according to claim 5, characterized in that: The chip position checking module further comprises an electronic excitation synchronization unit installed on a main control computer, and the electronic excitation synchronization unit is capable of receiving instructions and configuration parameters of the chip position checking unit to synchronize and calibrate the electronic excitation signal of the multi-angle electronic excitation module.

8. A sensor chip position detection device with electronic excitation according to any one of claims 1 to 3, characterized in that: The chip position inspection module further includes a result display screen and a result display light; the result display screen is used to display the intermediate information and result information output by the chip position inspection unit; the result display light is used to indicate whether the inspection is completed.

9. A sensor chip position detection device with electronic excitation according to any one of claims 1 to 3, characterized in that: The sensor to be tested includes a crankshaft sensor or a camshaft sensor.

10. A sensor chip position inspection method using a sensor chip position inspection device with electronic excitation according to any one of claims 1 to 9, characterized in that The following steps are involved: The sensor to be tested is fixedly installed at the position of the electronic excitation signal; Starting the sensor chip position inspection device with electronic excitation to start inspection; The check is completed and the results are displayed.

11. A sensor chip position inspection method according to claim 10, characterized in that: The method further includes the step of synchronizing and calibrating the multi-angle electronic excitation module using the electronic excitation synchronization unit before starting the inspection.

12. A sensor chip position inspection method according to claim 10, characterized in that: The method further includes the step of setting parameters for each module of the sensor chip position inspection device with electronic excitation before starting the inspection.

13. A sensor chip position inspection method according to claim 10, characterized in that: The method further includes the steps of generating alternating electronic excitation signals for the sensors to be tested according to angles in sequence during the inspection process, and processing, measuring and calculating phase signals output by the sensors to be tested to obtain phase angle differences.

14. A sensor chip position inspection method according to claim 13, characterized in that: The method further includes comparing the phase angle difference with a preset inspection threshold to determine whether the position of the sensor chip to be tested is offset or tilted.

15. The method for inspecting the position of a sensor chip according to claim 10, wherein: The step of displaying the inspection result also includes displaying the phase angle, the phase angle difference and the inspection result, and at the same time, the result display light is on.

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