A pre-inspection device and method

Abstract

The present invention provides a pre-inspection device and method. The pre-inspection device is used for pre-inspecting and correcting a wafer. The wafer includes a base substrate and dielets. The pre-inspection device includes: a workbench; a movable stage for carrying the wafer; a first camera assembly for photographing the wafer to obtain a first detection image of the wafer; a second camera assembly for photographing the wafer to obtain a second detection image of the dielets; a beam splitting element. The beam splitting element is used to direct the transmission optical path of the first detection image to the first camera assembly, and the beam splitting element is used to direct the transmission optical path of the second detection image to the second camera assembly. Through this application, the first camera assembly can not only pre-inspect the wafer to reduce the workload in subsequent detection modules, but also assist the second camera assembly in calibrating the position of the wafer, so that the calibration effect of the second camera assembly is better and the calibration efficiency is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of optical detection devices, and particularly relates to a pre-inspection device and method. Background Art

[0002] A wafer refers to a wafer used to fabricate silicon semiconductor circuits, and its raw material is usually silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer.

[0003] In the process of wafer fabrication, a series of processes such as single-crystal pulling, slicing, grinding, polishing, layering, lithography, doping, heat treatment, and dicing may cause defects on the wafer surface. In order to prevent wafers with defects from flowing into the packaging process, it is necessary to use an optical detection device to identify, classify, and mark the defects on the wafer surface to assist in wafer sorting.

[0004] When detecting wafers, it is necessary to calibrate each wafer separately to improve the detection efficiency. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a pre-inspection device and method to solve the above-mentioned deficiencies in the prior art.

[0006] To achieve the above purpose, the present invention provides a pre-inspection device for pre-inspecting and correcting wafers. The wafers include a base substrate and dielets arrayed on the base substrate. The pre-inspection device includes:

[0007] A workbench;

[0008] A movable stage, arranged on the workbench and used to carry the wafer;

[0009] A first camera assembly, arranged on the workbench and used to take a picture of the wafer to obtain a first detection image of the wafer, and the first detection image is used to show the distribution of each dielet on the wafer;

[0010] A second camera assembly, arranged on the workbench and used to take a picture of the dielet to obtain a second detection image of the dielet, and the second detection image is used to show the current angle information of the dielet;

[0011] A beam splitting element, arranged on the workbench. The beam splitting element is used to direct the transmission optical path of the first detection image to the first camera assembly when the first camera assembly takes a picture, and the beam splitting element is used to direct the transmission optical path of the second detection image to the second camera assembly when the second camera assembly takes a picture;

[0012] Wherein, the movable stage can drive the wafer to move according to the die distribution shown in the first detection image so that there are dies available for reference calibration within the field of view of the second camera assembly, and the movable stage can drive the wafer to rotate according to the current angle information of the dies shown in the second detection image to calibrate the wafer.

[0013] The beneficial effects of the present invention are as follows: The first camera assembly comprehensively captures the wafer to obtain a first image and sends the first image to the central control mechanism. The central control mechanism analyzes the image captured by the first camera assembly to obtain the die distribution on the base wafer, so as to judge the die situation within the field of view of the second camera assembly. After controlling the movable stage to move so that there is at least one die available for reference calibration within the field of view of the second camera assembly, then control the second camera assembly to capture the wafer to obtain a second image and feedback it to the central control mechanism. The central control analyzes the second image to obtain the angle information of the dies, and adjusts the movable stage according to the angle information of the dies to calibrate the wafer, so that the wafer is adjusted to the expected angle for the next operation. Through this device, the first camera assembly can pre-inspect the wafer to reduce the workload in the subsequent detection module, and at the same time can assist the second camera assembly to calibrate the position of the wafer, so that the calibration effect of the second camera assembly is better and the calibration efficiency is higher.

[0014] Preferably, the first camera assembly includes a first camera and a large field of view lens connected to the first camera. The field of view of the large field of view lens can cover the surface of the wafer. The large field of view lens obtains the first detection image and transmits it to the first camera. The second camera assembly includes a second camera and a collimating lens connected to the second camera. The collimating lens obtains the second detection image and transmits it to the second camera.

[0015] Preferably, the beam splitting element has a first end face and a second end face arranged back to back. The transmission optical path of the first detection image sequentially passes through the first end face and the second end face and is transmitted to the large field of view lens. The transmission optical path of the second detection image is reflected by the first end face and then transmitted to the collimating lens.

[0016] Preferably, the beam splitting element is inclined and installed between the large field of view lens and the movable stage. The optical axis of the large field of view lens is perpendicular to the bearing surface of the stage. The first end face faces the movable stage and is inclined relative to the bearing surface of the movable stage. The second end face is parallel to the first end face. The collimating lens faces the first end face and the optical axis of the collimating lens is perpendicular to the optical axis of the large field of view lens.

[0017] Preferably, a bracket is provided on the workbench. The first camera assembly is connected to one end of the bracket away from the workbench through a first connecting member. The first connecting member extends above the movable stage so that the large field-of-view lens can face the second end face. The second camera assembly is connected to the bracket through a second connecting member. The second connecting member is installed between the workbench and the first connecting member, and the collimating lens faces the first end face.

[0018] Preferably, the second connecting member extends between the movable stage and the first camera assembly. The beam splitting element is installed at one end of the second connecting member away from the bracket, and the second camera assembly is installed between the beam splitting element and the bracket.

[0019] Preferably, both the first connecting member and the second connecting member are movably connected to the bracket through movable connecting members. The movable connecting member includes a first block and a second block. Fitting grooves are respectively formed on the first block and the second block. The first block and the second block are stacked so that the fitting groove of the first block faces the fitting groove of the second block to form a plugging channel.

[0020] Preferably, the second connecting member includes a first plate body and a second plate body. One end of the first plate body is connected to the movable connecting member, and the other end is movably connected to the second plate body. The second camera assembly lies horizontally on the plate surface of the second plate body so that the collimating lens faces the beam splitting element.

[0021] Preferably, a screw rod and a limiting member are vertically arranged on the workbench. The limiting member is in close contact with the outer side wall of the bracket. A bolt hole adapted to the screw rod is formed on the bracket. The bracket is sleeved on the screw rod through the bolt hole. By driving the screw rod to rotate by a driving motor, under the limitation of the limiting member, the bracket can move along the axial direction of the screw rod.

[0022] The present invention also provides a pre-inspection method, which uses the above-mentioned pre-inspection device and includes the following steps:

[0023] Transfer the wafer to the movable stage;

[0024] Control the first camera to take a picture of the wafer to obtain a first detection image, and judge whether there are die grains available for reference calibration within the field of view of the second camera according to the first detection image;

[0025] If not, control the movable stage to move so that there are die grains available for reference calibration within the field of view of the second camera;

[0026] Control the second camera to capture the wafer to obtain a second detection image, and determine whether the angle information of the die available for reference calibration matches the preset information according to the second detection image;

[0027] If not, control the movable stage to drive the wafer to rotate so that the angle information of the die matches the preset information.

[0028] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0029] Figure 1 Schematic structural diagram of the pre-inspection device provided in the first embodiment of the present invention from a first perspective;

[0030] Figure 2 Schematic structural diagram of the pre-inspection device provided in the first embodiment of the present invention from a second perspective;

[0031] Figure 3 Schematic diagram of a wafer with abnormal dies provided in the first embodiment of the present invention;

[0032] Figure 4 Schematic diagram of a wafer in an ideal state provided in the first embodiment of the present invention;

[0033] Figure 5 Flowchart of the pre-inspection method provided in the second embodiment of the present invention.

[0034] Main element symbol description:

[0035] Pre-inspection device 100 Second end face 52 Workbench 10 Bracket 11 Moving stage 20 First connecting piece 33 First camera assembly 30 Second connecting piece 43 First camera 31 Moving connecting piece 60 Large field-of-view lens 32 First block 61 Second camera assembly 40 Second block 62 Second camera 41 Wafer 70 Collimating lens 42 Substrate 71 Beam splitter element 50 Chiplet 72 First end face 51

[0036] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific Embodiments

[0037] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described and explained below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0038] Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. In addition, it can also be understood that although the efforts made in such a development process may be complex and lengthy, for those of ordinary skill in the art related to the content disclosed in the present application, some design, manufacturing, or production changes based on the technical content disclosed in the present application are only conventional technical means and should not be understood as insufficient disclosure of the content of the present application.

[0039] Reference to "embodiment" in the present application means that the specific features, structures, or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appears at various positions in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those of ordinary skill in the art explicitly and implicitly understand that the embodiments described in the present application can be combined with other embodiments without conflict.

[0040] Unless otherwise defined, the technical terms or scientific terms involved in the present application should have the ordinary meaning understood by those of ordinary skill in the technical field to which the present application belongs. The words "a", "an", "one kind", "the" and other similar words involved in the present application do not represent a quantity limitation and can represent a singular or plural number. The terms "include", "comprise", "have" and any variations thereof involved in the present application are intended to cover non-exclusive inclusion; for example, a process, method, device, product or equipment that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may also include other steps or units inherent to these processes, methods, products or equipment. The terms "connect", "be connected", "be coupled" and other similar words involved in the present application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The term "plurality" involved in the present application refers to two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after. The terms "first", "second", "third", etc. involved in the present application are only used to distinguish similar objects and do not represent a specific order for the objects.

[0041] Please refer to Figures 1 to 2 , which is the pre-inspection device in the first embodiment of the present invention and is used for pre-inspecting and correcting the wafer 70. In this embodiment, the wafer 70 is as Figure 3 , Figure 4As shown Figure 4 The wafer 70 in the ideal state is shown. The wafer 70 includes a base substrate 71 and dielets 72 arrayed on the base substrate 71. The distribution of the dielets 72 on the base substrate 71 is neat and without defects. During the preparation process of the wafer 70, a series of processes such as single crystal pulling, slicing, lapping, polishing, epitaxial growth, lithography, doping, heat treatment, and scribing may cause defects on the surface of the wafer 70. Specifically, as Figure 3 shown, abnormal conditions such as missing or skewed dielets 72 may exist on the produced wafer 70.

[0042] The pre-inspection device in this embodiment includes a workbench 10, a movable stage 20, a first camera assembly 30, a second camera assembly 40, and a beam splitter 50.

[0043] Among them: The movable stage 20, the first camera assembly 30, the second camera assembly 40, and the beam splitter 50 are respectively arranged on the workbench 10. The movable stage 20 is used to carry the wafer 70. When the wafer 70 is placed on the movable stage 20, one side of the base substrate 71 without dielets 72 is closely attached to the carrying surface of the movable stage 20. Adapted to the structure of the wafer 70, the carrying surface of the movable stage 20 is disc-shaped. The first camera assembly 30 is located above the movable stage 20, and the imaging end of the first camera assembly 30 faces the carrying surface of the movable stage 20 to achieve a full view of the wafer 70 placed on the movable stage 20, so as to obtain the first detection image of the wafer 70. The first detection image is like Figure 3 or Figure 4 the structure of the surface of the wafer 70 shown therein Figure 1 consistent, which can reflect the overall situation of the distribution of dielets 72 on the base substrate 71 in the wafer 70. The second camera assembly 40 is used to photograph the wafer 70 to obtain the second detection image of the dielets 72 on the wafer 70. The second detection image is an image taken of a certain dielet 72 or several dielets 72 in a small area on the base substrate 71, which can clearly show the edge lines of the photographed dielet 72, so as to obtain the current angle information of the dielet 72. The beam splitter 50 is used to direct the transmission optical path of the first detection image to the first camera assembly 30 when the first camera assembly 30 takes a picture, and the beam splitter 50 is used to direct the transmission optical path of the second detection image to the second camera assembly 40 when the second camera assembly 40 takes a picture. The setting of the beam splitter 50 enables the first camera assembly 30 to smoothly obtain the first detection image and the second camera assembly 40 to smoothly obtain the second detection image.

[0044] According to the above structure, when using the pre-inspection device 100 in this embodiment, the wafer 70 is placed on the movable stage 20, and the first camera assembly 30 is used to obtain a first detection image. The movable stage drives the wafer 70 to move according to the distribution of the dielets 72 shown in the first detection image, so that there are dielets 72 available for reference calibration within the field of view of the second camera assembly 40. Then the second camera assembly 40 can obtain a second detection image. The movable stage 20 further drives the wafer 70 to rotate according to the current angle information of the dielets 72 shown in the second detection image, so as to adjust the overall angle of the wafer 70, and thus calibrate the wafer 70 to facilitate subsequent further imaging and detection of the wafer 70.

[0045] It should be noted that when the wafer 70 is being inspected, the wafer 70 is transported to the movable stage 20 by a human or a manipulator. This process may cause the position of the wafer 70 on the movable stage 20 to not conform to the preset. In this way, during the entire automated inspection process of the wafer 70, it will inevitably affect the subsequent inspection and analysis of the wafer 70. Therefore, it is necessary to use the pre-inspection device 100 proposed in this embodiment to judge and correct the position of the wafer 70 to facilitate further inspection and analysis of the wafer 70. The wafer 70 placed on the movable stage 20 may be Figure 3 the situation shown in Figure 4 or may be Figure 3 the situation shown in Figure 3 where the wafer has dielet 72 defects and angular skew. It can be understood that the dielets 72 in this defective and skewed area cannot be used for reference calibration. Figure 3 In Figure 4 only some dielets 72 that meet the requirements of the array distribution, such as Figure 4 can be used for reference calibration. The second camera assembly 40 takes pictures of some areas of the wafer 70 to obtain images of specific dielets 72. If the situation of the inspected wafer 70 is as shown in Figure 4 and there are no dielets 72 available for reference calibration within the field of view of the second camera assembly 40, it is necessary to first adjust the position of the wafer 70 according to the distribution of the dielets 72 fed back by the first detection image to ensure that the angle information of the dielets 72 fed back by the second image obtained by the second camera assembly 40 can be used for reference calibration.

[0046] Furthermore, the pre-inspection device 100 in this embodiment further includes a central control mechanism (not shown), which is electrically connected to the first camera assembly 30 and the second camera assembly 40. The central control mechanism can judge the distribution of the die 72 on the base wafer 71 based on the first detection image captured by the first camera assembly 30, and control the movement of the movable stage 20 according to the distribution of the die 72, so that there is at least one die 72 available for reference calibration within the field of view of the second camera assembly 40. Then, the central control mechanism controls the second camera assembly 40 to capture the wafer 70 to obtain a second detection image, and feeds the second detection image back to the central control mechanism. The central control mechanism obtains the angular information of the die 72 on the base wafer 71 according to the second detection image, and the central control mechanism can adjust the rotation of the movable stage 20 according to the angular information of the die 72. The movable stage 20 drives the wafer 70 to rotate, so that the wafer 70 can be calibrated to adjust the wafer 70 to the expected angle for the next operation. Moreover, after the movable stage 20 rotates, the second camera assembly 40 can further capture the wafer 70 to obtain a third detection image that can feedback the angular information of the die 72. The central control mechanism can ensure whether the wafer is calibrated by analyzing the third detection image.

[0047] It can be understood that if manual observation is used to distinguish the missing position of the die 72 on the wafer 70 to avoid the position where the die 72 is missing on the wafer 70, it is not only extremely difficult, but also there are human errors. At the same time, for wafers in mass production, it will also cause serious physical damage to the staff. However, through the pre-inspection device in this embodiment, the first camera assembly 30 assists the second camera assembly 40 to perform positioning and calibration on the wafer 70, which can not only enable the second camera assembly 40 to accurately avoid the position where the die 72 is missing on the wafer 70 during calibration, improve the calibration efficiency, but also the calibration efficiency is better.

[0048] In addition, in the traditional mode, the pre-inspection step is in the main detection process, while in this embodiment, the first camera assembly 30 pre-inspects the wafer 70, and this step is carried out in the positioning module, which can reduce the operations in the subsequent detection module, and can also use the second camera assembly 40 to capture the die 72 on the detected wafer 70 to obtain a second detection image, and adjust the detected wafer 70 to the expected angle through the angular information of the die 72 on the second detection image, so that the detection step of the die 72 is smoother.

[0049] In this embodiment, the lens magnifications of both the first camera assembly 30 and the second camera assembly 40 can be replaced according to the different wafers 70 to ensure the accuracy of the captured images.

[0050] In the pre-inspection device of this embodiment, the first camera component 30 obtains the first detection image of the wafer 70. The distribution information of the die 72 fed back by the first detection image can ensure that the second camera component 40 obtains the image of the die 72 that can be used for reference calibration, so that the position of the wafer 70 on the movable stage 20 is calibrated, facilitating subsequent inspection. Moreover, the distribution of the die 72 fed back by the first detection image can further facilitate the subsequent inspection of the wafer 70, reducing the workload in the subsequent inspection module.

[0051] Please refer to Figure 1 , as a specific embodiment of the pre-inspection device 100 proposed in this application, the first camera component 30 includes a first camera 31 and a large field-of-view lens 32 connected to the first camera 31. The field-of-view range of the large field-of-view lens 32 can cover the surface of the wafer 70. The large field-of-view lens 32 obtains the first detection image and transmits it to the first camera 31. The second camera component 40 includes a second camera 41 and a collimating lens 42 connected to the second camera 41. The collimating lens 42 obtains the second detection image and transmits it to the second camera 41.

[0052] Specifically, in the general lens design, the angle formed by the two edges of the maximum range of the object image of the measured target passing through the lens with the lens as the vertex is called the field-of-view angle. That is to say, the field of view is the range size of the object that can be seen when the lens is connected to the camera. The size of the field-of-view angle determines the field-of-view range of the optical instrument. The larger the field-of-view angle, the larger the field of view and the smaller the optical magnification. It can be understood that the large field-of-view lens 32 mentioned in this embodiment has a large field-of-view angle, so that within the distance range that meets the design requirements, the field-of-view range of the large field-of-view lens 32 can cover the entire surface of the wafer 70, enabling the first detection image obtained by the first camera 31 to reflect the distribution of the die 72 on the entire wafer 70. The collimating lens 42 can turn the divergent light into collimated light, so that when detecting a specific die 72, the second detection image obtained by the second camera 41 can feedback the edge line of the die 72, thereby obtaining the angle information of the die 72.

[0053] Please refer to Figure 1 and Figure 2 , as a specific embodiment of the pre-inspection device 100 proposed in this application, the beam-splitting element 50 has a first end face 51 and a second end face 52 arranged back to back. The transmission optical path of the first detection image passes through the first end face 51 and the second end face 52 in sequence and is transmitted to the large field-of-view lens 32. The transmission optical path of the second detection image is reflected by the first end face 51 and then transmitted to the collimating lens 42.

[0054] Specifically, the beam splitting element 50 in this embodiment is a beam splitter. The beam splitter can transmit and reflect light of different wavelengths respectively. Therefore, when light of different wavelength bands irradiates the wafer 70 and the wafer 70 reflects to form an imaging optical path, the imaging optical path formed by the light that can pass through the beam splitting element 50 can be transmitted into the large field-of-view lens 32, and the imaging optical path formed by the light that cannot pass through the beam splitting element 50 can be reflected and then transmitted into the collimating lens 52. In this way, the first camera 31 can obtain the first detection image, and the second camera 32 can obtain the second detection image.

[0055] In more alternative embodiments, by selecting beam splitting elements with different properties and changing the wavelengths of the light transmitted and reflected by the beam splitting element, the pre-inspection device 100 can also be designed such that the transmission optical path of the second detection image sequentially passes through the first end face 51 and the second end face 52 and is transmitted to the collimating lens 42, and the transmission optical path of the first detection image is reflected by the first end face 51 and then transmitted to the large field-of-view lens 32.

[0056] Please refer to Figure 1 and Figure 2 As a specific implementation manner of the pre-inspection device 100 proposed in this application, the beam splitting element 50 is inclinedly installed between the large field-of-view lens 32 and the movable stage 20. The optical axis of the large field-of-view lens 32 is perpendicular to the bearing surface of the movable stage 20. The first end face 51 faces the movable stage 20 and is inclined relative to the bearing surface of the movable stage 20. The second end face 52 is parallel to the first end face 51. The collimating lens 42 faces the first end face 51 and the optical axis of the collimating lens 42 is perpendicular to the optical axis of the large field-of-view lens 32.

[0057] In this embodiment, the beam splitting element 50 is inclined relative to the bearing surface of the movable stage 20, the optical axis of the large field-of-view lens 32 is perpendicular to the bearing surface of the movable stage 20, and the optical axis of the collimating lens 42 is perpendicular to the optical axis of the large field-of-view lens 32. Then, actually, the beam splitting element 50 is inclined relative to both the optical axis of the large field-of-view lens 32 and the optical axis of the collimating lens 42, so that when the transmission optical path of the second detection image is reflected by the beam splitting element 50, it can change direction and be transmitted to the collimating lens 42.

[0058] Please refer to Figure 1 and Figure 2, as a specific embodiment of the pre-inspection device 100 proposed in this application, a bracket 11 is provided on the workbench 10. The first camera assembly 30 is connected to one end of the bracket 11 away from the workbench 10 through a first connecting member 33. The first connecting member 33 extends above the movable stage 20 so that the large field-of-view lens 32 can face the second end face 52. The second camera assembly 40 is connected to the bracket 11 through a second connecting member 43. The second connecting member 43 is installed between the workbench 10 and the first connecting frame 33 so that the collimating lens 42 can face the first end face 51. The second connecting member 43 extends between the movable stage 20 and the first camera assembly 30. The beam splitting element 50 is installed at one end of the second connecting member 43 away from the bracket 11, and the second camera assembly 40 is installed between the beam splitting element 50 and the bracket 11.

[0059] Furthermore, both the first connecting member 33 and the second connecting member 43 are movably connected to the bracket 11 through a movable connecting member 60. Specifically, the movable connecting member 60 includes a first block 61 and a second block 62. The first block 61 and the second block 62 are respectively provided with fitting grooves, and the first block 61 and the second block 62 are stacked so that the fitting groove on the first block 61 is opposite to the fitting groove on the second block 62 to form a plugging channel, which is adapted to the bracket 11, and the bracket 11 is fixedly clamped in the plugging channel through a bolt structure.

[0060] Among them, the bolt structure is specifically that bolt holes and through holes are respectively provided on the first block 61 and the second block 62. When the first block 61 and the second block 62 are stacked to form a plugging channel, the bolt holes and the through holes are in corresponding positions. It can be understood that by screwing a bolt through the through hole and threadedly connecting it with the bolt hole, when it is necessary to clamp the bracket 11 in the plugging channel, the bolt is tightened. When it is necessary to disassemble the first camera assembly 30, the bolt is loosened to disassemble the first block 61 and the second block 62, and at the same time, it is convenient to preliminarily adjust the height position of the first camera assembly 30 and / or the second camera assembly 40.

[0061] In this embodiment, a screw rod and a limiting member are vertically arranged on the workbench 10. The limiting member is a rod-shaped structure, and the limiting member, the screw rod, and the bracket 11 are parallel to each other. The limiting member is in close contact with the outer side wall of the bracket 11. A threaded hole adapted to the screw rod is provided on the bracket 11, and the bracket 11 is sleeved on the screw rod through the threaded hole. It can be understood that by driving the screw rod to rotate by a driving motor, under the limitation of the limiting member, the bracket 11 can move along the axial direction of the screw rod, so as to perform secondary adjustment on the bracket 11. It should be noted that the driving motor is electrically connected to the central control mechanism, and the central control mechanism analyzes the best shooting distance between the first camera assembly 30 or the second camera assembly 40 and the wafer 70 according to the clarity of the images captured by the first camera assembly 30 and / or the second camera assembly 40.

[0062] In this embodiment, the first connecting member 33 has a planar plate structure, and the second connecting member 43 is stepped. The second connecting member 43 includes a first plate and a second plate. One end of the first plate is connected to the movable connecting member 60, and the other end is movably connected to the second plate through a link mechanism, so that the second plate can be moved relative to the first plate in the horizontal direction, thereby adjusting the shooting angle of the second camera assembly 40 and the distance between the second camera assembly 40 and the beam splitting element 50.

[0063] In this embodiment, the movable stage 20 includes a carrier for carrying the wafer 70 and an adjustment assembly connected to the carrier. The adjustment assembly includes a driving member and a lifting member. The driving member is used to drive the movable stage 20 to rotate, and the lifting member is used to drive the movable stage 20 to reciprocate in the height direction of the bracket 11. The driving member and the lifting member are respectively electrically connected to the central control mechanism. The driving member is located directly below the movable stage 20 and is fixedly connected to the center of the movable stage 20.

[0064] In this embodiment, the pre-inspection device further includes an identification mechanism (not shown), and the identification mechanism is used to read the code of the wafer 70. The identification mechanism is electrically connected to the central control mechanism.

[0065] In specific implementation, the first camera assembly 30 comprehensively shoots the wafer 70 to obtain a first detection image of the distribution of the die 72 on the wafer 70, and sends the first detection image to the central control mechanism. The central control mechanism analyzes the image taken by the first camera assembly 30 to obtain the distribution of the die 72 on the base wafer 71, so that there is at least one die 72 available for reference calibration within the field of view of the second camera assembly 40. Then, the second camera assembly 40 is controlled to shoot the wafer 70 to obtain a second detection image of the die 72. The second camera assembly 40 feeds back the taken second detection image to the central control mechanism. The central control mechanism can obtain the second detection image and obtain the angle information of the die 72 according to the second detection image, and the central control mechanism can adjust the movable stage 20 according to the angle information of the die 72 to calibrate the wafer 70, so that the wafer 70 is adjusted to the expected angle for the next operation. Through this device, the first camera assembly 30 can pre-inspect the wafer 70 to reduce the workload in the subsequent detection module, and at the same time can assist the second camera assembly 40 to perform position calibration on the wafer 70, so that the calibration effect of the second camera assembly 40 is better and the calibration efficiency is higher.

[0066] It should be noted that the above implementation process is only to illustrate the feasibility of the present application, but this does not mean that the pre-inspection device of the present application has only the above-mentioned unique implementation process. On the contrary, as long as the pre-inspection device of the present application can be implemented, it can be incorporated into the feasible implementation solutions of the present application.

[0067] Please refer to Figure 5 , which shows a pre-inspection method provided by the second embodiment of the present invention. Using the pre-inspection device of the above first embodiment, it includes the following steps:

[0068] Step S101, transfer the wafer 70 to the movable stage 20;

[0069] Step S102, control the first camera assembly 30 to take a picture of the wafer 70 to obtain a first detection image;

[0070] Step S103, the central control mechanism determines whether there are die 72 available for reference calibration within the field of view of the second camera assembly 40 according to the first detection image;

[0071] Step S104, if not, the central control mechanism controls the movable stage 20 to move so that there is at least one die 72 available for reference calibration within the field of view of the second camera assembly 40;

[0072] Step S105, the central control mechanism controls the second camera assembly 40 to take a picture of the wafer 70 to obtain a second detection image;

[0073] Step S106, the central control mechanism obtains the angle information of the die 72 according to the second detection image, and determines whether the angle information of the die 72 is consistent with the preset information;

[0074] Step S107, if not, control the movable stage 20 to drive the wafer 70 to rotate so that the angle information of the die 72 is consistent with the preset information.

[0075] In a specific embodiment, the central control mechanism can judge the distribution of the die 72 on the base wafer 71 based on the first detection image captured by the first camera assembly 30, and control the rotation and / or lifting of the movable stage 20 according to the distribution of the die 72, so that there is at least one die 72 available for reference calibration within the field of view of the second camera assembly 40. Then, control the second camera assembly to take a picture of the wafer 70 to obtain a second detection image, and feedback the second detection image to the central control mechanism. The central control mechanism obtains the angle information of the die 72 on the base wafer 71 according to the second detection image, and the central control mechanism can adjust the movable stage 20 according to the angle information of the die 72 to calibrate the wafer, so that the wafer 70 is adjusted to the expected angle for the next operation. At the same time, the central control device obtains the final distribution of the die 72 after angle rotation and transmits it to the detection module. Through this device, the first camera assembly 30 can pre-inspect the wafer 70 to reduce the workload in the subsequent detection module, and at the same time can assist the second camera assembly 40 to perform position calibration on the wafer 70, so that the calibration effect of the second camera assembly 40 is better and the calibration efficiency is higher.

[0076] In this embodiment, after the step of the control activity stage 20 driving the wafer 70 to rotate so that the angle of the die 72 conforms to a preset angle, the method further includes:

[0077] The central control mechanism calculates the range of the rotated die 72 and transmits the die 72 range to the detection module.

[0078] Among them, the calculated die 72 range is transmitted to the detection module through the central control mechanism to reduce the workload of the detection module.

[0079] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0080] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A pre-inspection device for pre-inspecting and correcting a wafer, the wafer including a base substrate and dielets arrayed on the base substrate, characterized in that, The pre-inspection device includes: A workbench; A movable stage, provided on the workbench and used for carrying the wafer; A first camera assembly, provided on the workbench and used for photographing the wafer to obtain a first detection image of the wafer, the first detection image being used to show the distribution of each die on the wafer. The first camera assembly includes a first camera and a large field-of-view lens connected to the first camera, and the field-of-view range of the large field-of-view lens can cover the surface of the wafer; A second camera assembly, provided on the workbench and used for photographing the wafer to obtain a second detection image of the die, the second detection image being used to show the current angle information of the die. The second camera assembly includes a second camera and a collimating lens connected to the second camera, and the collimating lens is used to turn divergent light into collimated light so that when detecting the die on the wafer, the second detection image obtained by the second camera can reflect the edge line of the die; A beam-splitting element, provided on the workbench. The beam-splitting element is used to direct the transmission optical path of the first detection image to the first camera assembly when the first camera assembly takes a picture, and the beam-splitting element is used to direct the transmission optical path of the second detection image to the second camera assembly when the second camera assembly takes a picture; Wherein, the movable stage can drive the wafer to move according to the die distribution shown in the first detection image, so that there are dies available for reference calibration within the field-of-view range of the second camera assembly, and the movable stage can drive the wafer to rotate to calibrate the wafer according to the current angle information of the die shown in the second detection image.

2. The pre-inspection device according to claim 1, wherein The large field-of-view lens obtains the first detection image and transmits it to the first camera, and the collimating lens obtains the second detection image and transmits it to the second camera.

3. The pre-inspection device according to claim 2, wherein The beam-splitting element has a first end face and a second end face arranged back to back. The transmission optical path of the first detection image sequentially passes through the first end face and the second end face and is transmitted to the large field-of-view lens, and the transmission optical path of the second detection image is transmitted to the collimating lens after being reflected by the first end face.

4. The pre-inspection device according to claim 3, characterized in that, The beam-splitting element is inclined and installed between the large field-of-view lens and the movable stage. The optical axis of the large field-of-view lens is perpendicular to the bearing surface of the stage. The first end face faces the movable stage and is inclined relative to the bearing surface of the movable stage. The second end face is parallel to the first end face. The collimating lens faces the first end face and the optical axis of the collimating lens is perpendicular to the optical axis of the large field-of-view lens.

5. The pre-inspection device according to claim 4, characterized in that, A bracket is provided on the workbench. The first camera assembly is connected to one end of the bracket away from the workbench through a first connecting member. The first connecting member extends above the movable stage so that the large field-of-view lens can face the second end face. The second camera assembly is connected to the bracket through a second connecting member. The second connecting member is installed between the workbench and the first connecting member, and the collimating lens faces the first end face.

6. The pre-inspection device according to claim 5, wherein The second connecting member extends between the movable stage and the first camera assembly. The beam splitting element is mounted at one end of the second connecting member away from the bracket, and the second camera assembly is mounted between the beam splitting element and the bracket.

7. The pre-inspection device according to claim 6, characterized in that, Both the first connecting member and the second connecting member are movably connected to the bracket through a movable connecting member. The movable connecting member includes a first block and a second block. Fitting grooves are respectively formed on the first block and the second block. The first block and the second block are stacked so that the fitting groove of the first block faces the fitting groove of the second block to form a plugging channel.

8. The pre-inspection device according to claim 7, wherein The second connecting member includes a first plate body and a second plate body. One end of the first plate body is connected to the movable connecting member, and the other end is movably connected to the second plate body. The second camera assembly lies horizontally on the plate surface of the second plate body so that the collimating lens faces the beam splitting element.

9. The pre-inspection device according to claim 5, wherein A screw and a limiting member are vertically arranged on the workbench. The limiting member is in close contact with the outer side wall of the bracket. A bolt hole adapted to the screw is formed on the bracket. The bracket is sleeved on the screw through the bolt hole. By driving the screw to rotate with a driving motor, under the limitation of the limiting member, the bracket can move along the axial direction of the screw.

10. A pre-inspection method, characterized in that, Using the pre-inspection device according to any one of claims 1 to 9, comprising the following steps: Transfer the wafer to the movable stage; Control the first camera to take a picture of the wafer to obtain a first detection image, and judge whether there are die grains available for reference calibration within the field of view of the second camera according to the first detection image; If not, control the movable stage to move so that there are die grains available for reference calibration within the field of view of the second camera; Control the second camera to take a picture of the wafer to obtain a second detection image, and judge whether the angular information of the die grains available for reference calibration is consistent with the preset information according to the second detection image; If not, then control the movable stage to drive the wafer to rotate so that the angular information of the die grains is consistent with the preset information.

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