Substrate processing equipment

Abstract

The present invention provides a substrate processing apparatus capable of improving the uniformity of the processing rate across the entire circumference of a substrate. The substrate processing apparatus of an embodiment includes: a holding portion including a plurality of chuck pins for holding the outer periphery of the substrate; a chuck opening and closing mechanism for moving the plurality of chuck pins between an open position away from the substrate and a closed position in which the chuck pins engage with the outer periphery of the substrate and hold the substrate; a ring member integrally formed over the entire circumference, having an inner periphery shaped along the outer periphery of the substrate and notches provided in the inner periphery for entry of the chuck pins in the closed position; and a ring moving mechanism for moving the ring member between an approach position in which the inner periphery of the ring member approaches and surrounds the outer periphery of the substrate and a retracted position in which the ring member is retracted from the outer periphery of the substrate.

Description

Technical Field

[0001] The present invention relates to a substrate processing device. Background Art

[0002] In the manufacturing process of semiconductor devices and flat-panel displays, an etching liquid is supplied to a film formed on the surface of a substrate, such as a wafer or glass substrate, to form a desired pattern. As a device for performing this etching process, a substrate processing apparatus has been proposed that supplies the etching liquid to the center of a rotating substrate. In this case, the etching liquid supplied to the center of the substrate spreads toward the periphery of the substrate due to centrifugal force, etching the substrate surface with the supplied etching liquid.

[0003] In this type of substrate processing, residual contact marks on the substrate's surface, such as those left behind to support the substrate, can lead to a decrease in substrate quality. Furthermore, residual contact marks not only on the substrate's surface but also on its backside can affect substrate quality, resulting in poor quality. Therefore, the substrate is processed while being rotated while being held by multiple retaining members, rather than by the substrate's front or backside. For example, multiple chuck pins that move in a direction of contact with and separation from the substrate's outer periphery are used as such retaining members.

[0004] Here, etching is performed through a chemical reaction between the etching solution and the target area to be etched, so the contact time between the etching solution and the target area must be ensured. In this case, increasing the substrate's rotational speed per unit time increases the rate at which the etching solution is discharged, slowing down the etching reaction. Therefore, during etching, the substrate's rotational speed is reduced compared to cleaning processes using a rinse solution or other cleaning solution.

[0005] Reducing the substrate's rotational speed slows the rate at which the etching liquid is discharged, thereby prolonging the time the etching liquid remains in contact with the object being removed. This accelerates the etching reaction. However, near the outer edge of the substrate, surface tension makes it difficult for the etching liquid to be discharged. Furthermore, reducing the substrate's rotational speed reduces the centrifugal force acting in the discharge direction.

[0006] Therefore, it is difficult to discharge the etching liquid from the substrate, and the etching liquid tends to accumulate near the outer periphery of the substrate. In other words, the etching liquid that diffuses from the central area of ​​the substrate to the outer periphery flows closer to the periphery of the substrate, and the flow rate of the etching liquid decreases. This causes a change in the flow rate of the etching liquid near the periphery of the substrate. In this case, the etching liquid supplied to the central area of ​​the substrate flows toward the periphery of the substrate while chemically reacting with the removed portion. The etching liquid that flows to the periphery of the substrate becomes the used etching liquid, that is, the etching liquid with reduced reactivity with the removed portion. If the etching liquid with reduced reactivity accumulates near the periphery of the substrate, the etching rate near the periphery of the substrate decreases, which will damage the uniformity of the etching rate on the surface of the substrate.

[0007] Therefore, the following substrate processing apparatus has been proposed: a recess is provided in a receiving portion for receiving a substrate, and when the substrate is received within the recess, the surface of the receiving portion, which is the opening of the recess, is flush with the surface of the substrate (the surface undergoing etching). If the surface of the receiving portion and the surface of the substrate are flush with each other, the surface of the substrate is substantially extended, thereby reducing variations in the flow rate of the etching liquid near the periphery of the substrate. This makes it easier to discharge the etching liquid that has flowed near the periphery of the substrate back to the surface of the receiving portion. This prevents the etching liquid, whose reactivity has decreased, from accumulating near the periphery of the substrate, thereby improving the uniformity of the etching rate across the substrate surface.

[0008] [Prior art literature]

[0009] [Patent Document]

[0010] [Patent Document 1] Japanese Patent Application Laid-Open No. 7-221062 Summary of the Invention

[0011] [Problems to be solved by the invention]

[0012] Here, generally, a cleaning process using a rinse solution or other cleaning liquid is performed following the etching process. For example, in the substrate processing apparatus described above, the substrate is accommodated in a receiving portion having an interior serving as a recessed portion, and a rinse solution or other cleaning liquid is supplied to the central area of ​​the substrate to process the substrate.

[0013] Since the substrate processing is performed with the backside of the substrate grounded to the loading platform, it is believed that the cleanliness of the substrate's backside is compromised. Furthermore, in order to load and unload the substrate onto and from the loading platform using a robot, a mechanism is required to raise and lower the substrate onto the loading platform. This requires that the lifting pins, etc., used to raise and lower the substrate contact the backside of the substrate, thereby affecting the cleanliness of the substrate's backside.

[0014] Therefore, it is desired to develop a substrate processing apparatus that can improve the uniformity of the etching rate and the cleanliness of the back surface of the substrate.

[0015] The problem to be solved by the present invention is to provide a substrate processing apparatus that can improve the uniformity of the processing rate in the entire circumference of the substrate.

[0016] [Technical means to solve the problem]

[0017] The substrate processing device of the present invention includes: a holding portion, including a plurality of chuck pins for holding the outer periphery of the substrate; a chuck opening and closing mechanism, which enables the plurality of chuck pins to move between an open position away from the substrate and a closed position in contact with the outer periphery of the substrate to hold the substrate; a ring member, which has an inner periphery shaped along the outer periphery of the substrate and a cutout provided on the inner periphery for the chuck pins in the closed position to enter, and is formed integrally over the entire circumference; a ring moving mechanism, which moves between an approach position in which the inner periphery of the ring member approaches and surrounds the outer periphery of the substrate and a retreat position in which the ring member retreats from the outer periphery of the substrate; a rotating body, which includes the chuck pins and the ring member, and causes the substrate held by the chuck pins and the ring member in the approach position to rotate; and a supply portion, which supplies processing liquid to the substrate held by the chuck pins and rotated by the rotating body.

[0018] [Effects of the Invention]

[0019] The present invention can provide a substrate processing apparatus capable of improving the uniformity of a processing rate in the entire circumferential direction of a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a diagram showing the structure of a substrate processing apparatus according to an embodiment.

[0021] Figure 2 Yes Figure 1 A three-dimensional diagram of the internal structure of a substrate processing device.

[0022] Figure 3 It is a three-dimensional diagram showing the cutout and the chuck pin.

[0023] Figure 4 (A) Figure 4 (B) is an explanatory diagram showing the flow of the processing liquid near the outer periphery of the substrate.

[0024] Figure 5 This is a vertical cross-sectional view of the interior of the rotating cover when the chuck pin is in the open position and the ring member is in the retracted position.

[0025] Figure 6This is a vertical cross-sectional view of the interior of the rotating cover when the chuck pin is in the closed position and the ring member is in the retracted position.

[0026] Figure 7 It is a vertical cross-sectional view inside the rotating cover when the chuck pin is in the closed position and the ring member is in the approximated position.

[0027] Figure 8 This is a perspective view showing the opening and closing mechanism when the chuck pin is in the closed position.

[0028] Figure 9 It is a perspective view showing the ring moving mechanism when the ring members are in the close position.

[0029] Figure 10 It is a perspective view showing the installation position of the detection unit.

[0030] Figure 11 (A) is a perspective view showing the opening and closing detection unit. Figure 11 (B) is an explanatory diagram showing the detection position.

[0031] Figure 12 This is a flowchart showing the procedure of substrate processing.

[0032] Figure 13 (A)~ Figure 13 (C) is a perspective view showing the positions of the cutout of the ring member and the groove of the holding portion.

[0033] Figure 14 (A) Figure 14 (B) is a plan view showing the operation of the eccentric rotating type holding member.

[0034] Figure 15 (A) Figure 15 (B) is a perspective view showing the positions of the chuck pin and the cutout of the ring member of the eccentric swing type holding member.

[0035] [Explanation of Symbols]

[0036] 1: Substrate processing equipment

[0037] 10: Maintenance

[0038] 11: Chuck pin

[0039] 12: Hood

[0040] 12a, 68a: Annular groove

[0041] 13: Chuck part

[0042] 13a: Groove

[0043] 14: Rotation axis

[0044] 15: Arm

[0045] 15a: Hole

[0046] 20: Ring component

[0047] 21: Inner circumference

[0048] 22: Outer periphery

[0049] 23: Incision

[0050] 30: Rotating body

[0051] 31: Rotating cover

[0052] 31a: Workbench

[0053] 31b: Side

[0054] 31c: Exhaust port

[0055] 31d, 31f, 741a: through holes

[0056] 31e, 31g: Annular wall

[0057] 32: Rotating base

[0058] 32a: Pillar

[0059] 33, 42: Connecting tube

[0060] 40: Rotating mechanism

[0061] 41: Driving source

[0062] 50: Chuck opening and closing mechanism

[0063] 51: Open and close cylinder

[0064] 52: Opening and closing lever

[0065] 52a: Fulcrum

[0066] 53: Open and close the elevator

[0067] 54: Open and close cam follower

[0068] 55: Open and close shaft

[0069] 55a: Fixed ring

[0070] 56: Open and closed loop

[0071] 56a, 66a: Slider

[0072] 56b: Connection part

[0073] 56c, 66b: Spring

[0074] 56d: Axis

[0075] 60: Ring moving mechanism

[0076] 61: Lifting cylinder

[0077] 62: Lifting rod

[0078] 63: Lifting Elevator

[0079] 64: Lifting cam follower

[0080] 65: Lifting shaft

[0081] 66: First lifting ring

[0082] 67: Second lifting ring

[0083] 68: Lifting axis

[0084] 69: Lifting link

[0085] 69a, 69b: Pin

[0086] 69c: Fulcrum axis

[0087] 70: Supply Department

[0088] 71: Treatment liquid supply mechanism

[0089] 71a: Treatment liquid tank

[0090] 71b: Individual delivery pipe

[0091] 71c: Processing liquid supply pipe

[0092] 71d: Flow control valve

[0093] 71e: Flow meter

[0094] 72: Processing liquid holding unit

[0095] 72a: Spout

[0096] 73: Lifting mechanism

[0097] 74: Heating unit

[0098] 80: Testing Department

[0099] 81: Opening and closing detection unit

[0100] 82: Ring position detection unit

[0101] 83: Transmitted light detection area

[0102] 90: Control device

[0103] 531: Drive shaft

[0104] 532: Small gear

[0105] 533: Big gear

[0106] 741: Heater

[0107] A: Rotation axis

[0108] a: solid line

[0109] B: Base

[0110] b: dotted line

[0111] c: single dot dash line

[0112] h: gap

[0113] L: Treatment liquid

[0114] W: substrate

[0115] w: width

[0116] We: outer periphery

[0117] S01~S22:Steps

[0118] α, β1, β2, γ: arrows DETAILED DESCRIPTION

[0119] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0120] [summary]

[0121] like Figure 1 As shown, the substrate processing apparatus 1 of this embodiment is an apparatus that processes a substrate W while holding and rotating it. The substrate W to be processed is, for example, a wafer or glass substrate used in the manufacturing process of microstructures such as semiconductor devices or flat panel displays. The processing performed by the substrate processing apparatus 1 is, for example, a wet process in which a processing liquid is supplied while rotating the substrate W. In this manner, the surface of the substrate W to be processed is referred to as the front surface, and the surface opposite thereto is referred to as the back surface. The wet processing of this embodiment includes etching processing in which a film provided on the surface of the substrate W is etched using a chemical solution, and cleaning processing in which a cleaning liquid is used to clean the film.

[0122] The substrate processing apparatus 1 includes a holding portion 10 and a ring member 20. The holding portion 10 is a plurality of members including chuck pins 11 for holding the outer periphery We of the substrate W. The ring member 20 is an annular shape integrally formed over the entire circumference. Figure 2As shown, the ring member 20 has an inner periphery 21 that is shaped along the outer periphery We of the substrate W. That is, the inner periphery 21 is circular relative to the circular substrate W. The diameter of the circle drawn by the inner periphery 21 of the ring member 20 is slightly larger than the diameter of the circle drawn by the outer periphery We of the substrate W. That is, when the outer periphery We enters the inner periphery 21, a certain gap can be generated between the two. Figure 3 As shown, the inner peripheral edge 21 is provided with cutouts 23 for entry of the chuck pins 11 holding the substrate W. The surface of the ring member 20 facing the substrate W is referred to as the front surface of the ring member 20, and the opposite surface is referred to as the back surface.

[0123] In addition, if Figures 1 to 3 As shown, the substrate processing apparatus 1 includes a rotating body 30, a rotating mechanism 40, a chuck opening and closing mechanism 50, a ring moving mechanism 60, a supply unit 70, a detection unit 80, and a control unit 90. The rotating body 30 includes a holding unit 10 and a ring member 20, and rotates the substrate W held by the chuck pins 11 and the ring member 20. The rotating mechanism 40 is a mechanism for rotating the rotating body 30.

[0124] The chuck opening and closing mechanism 50 moves the plurality of chuck pins 11 between an open position away from the substrate W and a closed position in which the chuck pins 11 are in contact with the outer peripheral edge We of the substrate W and hold the substrate W. The ring moving mechanism 60 moves between an approach position in which the inner peripheral edge 21 of the ring member 20 approaches and surrounds the outer peripheral edge We of the substrate W and a retracted position in which the ring member 20 is retracted from the outer peripheral edge We of the substrate W. Figure 4 (A) Figure 4 As shown in (B), the approach position refers to the outer peripheral edge We of the substrate W and the inner peripheral edge 21 of the ring member 20 being close to each other in a non-contact manner to the extent that most of the processing liquid L does not fall. That is, the gaps formed when the outer peripheral edge We of the substrate W enters its inner peripheral edge 21 when the ring member 20 is in the approach position are gaps in which the processing liquid L that reaches the outer peripheral edge We on the surface of the substrate W can easily reach (contact) the inner peripheral edge 21 of the ring member 20. In this embodiment, the upper surface of the ring member 20 and the surface of the substrate W in the approach position are set to be the same plane. In addition, since there is only a gap in which the processing liquid L that reaches the outer peripheral edge We on the surface of the substrate W can easily reach (contact) the inner peripheral edge 21 of the ring member 20, they do not necessarily have to be the same plane. For example, the ring member 20 can also be positioned at a position lower than the substrate W.

[0125] Since the shape of the outer peripheral edge We varies depending on the substrate W, a groove or step difference may be generated between the upper surface of the substrate W and the upper surface of the ring member 20. For example, a micro groove may be generated due to the difference in the shape or tilt angle of the chamfer caused by beveling. Figure 4As shown in (B), by creating a state in which the groove is filled with the processing liquid L, leakage of the liquid can be prevented, and a continuous liquid surface is formed to flow outward.

[0126] like Figure 1 As shown, the supply unit 70 supplies the processing liquid to the substrate W held by the chuck pins 11 and rotated by the rotating body 30. The detection unit 80 detects the positions of the ring member 20 and the chuck pins 11 (see Figure 2 、 Figure 10 、 Figure 11 (A) Figure 11 (B) When the detection unit 80 detects that the ring member 20 is in the retracted position, the control device 90 moves the chuck pin 11 to the chuck opening and closing mechanism 50 .

[0127] [structure]

[0128] (rotating body)

[0129] like Figure 1 、 Figures 5 to 7 As shown, the rotating body 30 includes a rotating cover 31, a rotating base 32, and a connecting tube 33. The rotating cover 31 is a cylindrical shape with one end blocked by a workbench 31a. The workbench 31a is a circular surface with a diameter larger than the substrate W. Figure 1 As shown, a discharge port 31c serving as a through hole for discharging the treatment liquid is formed on the side surface 31b of the rotary cover 31. Figures 5 to 7 These are cross-sectional views taken along a vertical plane including the rotation axis A within the rotating cover 31. The right side of each figure shows a cross-sectional view of the chuck opening and closing mechanism 50, and the left side shows a cross-sectional view of the ring moving mechanism 60. When the chuck opening and closing mechanism 50 is provided with six chuck pins 11, as described later, the cross-sectional view is identical at six locations. When the ring moving mechanism 60 is provided with three lifting shafts 68, as described later, the cross-sectional view is identical at three locations.

[0130] Furthermore, the worktable 31a has multiple through-holes 31d at equal intervals around the circumference of the substrate W. A cylindrical annular wall 31e protruding upward is erected around the periphery of the through-holes 31d. In this embodiment, six through-holes 31d are arranged at 60-degree intervals. Since the holding portions 10 are disposed in each of the through-holes 31d, the holding portions 10 are arranged at equal intervals around the circumference of the substrate W.

[0131] The worktable 31a also has multiple through-holes 31f around the perimeter of the substrate W. A cylindrical annular wall 31g protrudes upward from the periphery of each through-hole 31f. In this embodiment, three through-holes 31f are provided at 120-degree intervals. Each through-hole 31f is equipped with a lifting shaft 68 for raising and lowering the ring member 20.

[0132] The rotating base 32 is mounted on the lower surface of the workbench 31a and is a disc-shaped member coaxial with the workbench 31a. The rotating cover 31 and the rotating base 32 are coaxially arranged. The axis is the rotating axis A which is the center of rotation. Figure 1 and Figure 2 As shown, the rotating body 30 is rotatably provided on the base portion B by the rotating mechanism 40 (see Figure 2 ), the base portion B is fixed on a bracket provided on a setting surface not shown in the figure.

[0133] (Rotation mechanism)

[0134] The rotating mechanism 40 is a mechanism for rotating the rotating body 30. Figure 1 、 Figure 2 、 Figures 5 to 7 As shown, the rotating mechanism 40 includes a drive source 41 and a connecting cylinder 33. The drive source 41 is a hollow motor consisting of a hollow rotor and a stator that rotates it, and is fixed to the base portion B. The connecting cylinder 33 is a cylindrical body coaxially connected to the side opposite the worktable 31a of the rotating base 32. The lower end of the connecting cylinder 33 is connected to the rotor of the drive source 41. The drive source 41 energizes the coils of the stator, causing the connecting cylinder 33 to rotate along with the rotor, thereby rotating the rotating cover 31 and the rotating base 32 together about the rotation axis A.

[0135] (Maintaining part)

[0136] like Figure 1 As shown in FIG. 1 , the holding portion 10 holds the substrate W in parallel with the work table 31 a and at a distance therefrom. Figures 5 to 7 As shown, the holding portion 10 includes, in addition to the chuck pin 11, a cover 12, a chuck portion 13, a rotating shaft 14, and an arm 15. The cover 12 is a cylindrical member positioned to cover the through-hole 31d of the worktable 31a. The cover 12 includes an annular groove 12a that receives the annular wall 31e, covering the annular wall 31e with a gap therebetween. This creates a labyrinthine structure, a curved path, between the annular wall 31e and the annular groove 12a, thereby preventing the process liquid from flowing into the interior of the rotating body 30 through the through-hole 31d.

[0137] like Figure 3 As shown, the chuck portion 13 is wedge-shaped, and the sharpened tip of each wedge rises on the upper surface of the cover 12 toward the rotation axis A. A chuck pin 11 is provided on the upper surface of the chuck portion 13. The chuck pin 11 is in the shape of a truncated cone with a reduced diameter at the bottom.

[0138] The chuck pins 11 are moved to an open position (see FIG. 1 ) away from the outer periphery We of the substrate W as the holding portion 10 rotates. Figure 5 ) and the closed position where the substrate W is held in contact with the outer periphery We of the substrate W (refer to Figure 6 and Figure 8 ) between them. Thus, a plurality of chuck pins 11 are arranged at equal intervals along the periphery of the substrate W. In this embodiment, six chuck pins 11 are arranged at intervals of 60 degrees.

[0139] The chuck pins 11 are part of the holding portion 10 and may include a surface that contacts the outer periphery We of the substrate W and can hold the substrate W. Thus, shapes such as cylinders, prisms, and pyramids with rotational symmetry are possible, but are not limited to these. Preferably, the chuck pins 11 are at a height that prevents contact with the front and back surfaces of the substrate W in the closed position, thereby minimizing any impact on the flow of the processing liquid.

[0140] The rotation axis 14 is the axis of rotation of the holding part 10. The rotation axis 14 is provided inside the through hole 31d along the tangent direction of the rotation circle of the rotating body 30. As the holding part 10 rotates around the rotation axis 14, the chuck pin 11 moves in a direction perpendicular to the outer peripheral edge We of the substrate W. That is, the chuck pin 11 is configured to be movable in a manner of being in contact with or separated from the outer peripheral edge We of the substrate W. The arm 15 is a component extending from the bottom of the rotation axis 14 toward the rotation axis A inside the rotating body 30. The lower end of the arm 15 is connected to the connecting part 56b described later and is operated by the chuck opening and closing mechanism 50.

[0141] (Chuck opening and closing mechanism)

[0142] like Figure 2 、 Figures 5 to 7 As shown, the chuck opening and closing mechanism 50 includes an opening and closing cylinder 51, an opening and closing lever 52, an opening and closing elevator 53, an opening and closing cam follower 54, an opening and closing rotating shaft 55, and an opening and closing ring 56. The opening and closing cylinder 51 is fixed to the lower part of the base portion B in such a manner that the driving rod is directed downward in the vertical direction. The opening and closing lever 52 is a component that is rotatably provided on the base portion B with a fulcrum 52a as the center. The end of the opening and closing lever 52 is rotatably connected to the driving rod of the opening and closing cylinder 51. The opening and closing lever 52 is in a U-shape so as to surround the driving source 41. The opening and closing lever 52 is connected to the opening and closing elevator 53 in pairs.

[0143] A pair of opening and closing elevators 53 are provided on the base portion B so as to be able to be raised and lowered. In addition, the pair of opening and closing elevators 53 are arranged symmetrically with respect to the rotation axis A. Each opening and closing elevator 53 is rotatably connected to both ends of a U-shaped opening and closing rod 52. Therefore, as the driving rod of the opening and closing cylinder 51 moves, the opening and closing rod 52 rotates, and the pair of opening and closing elevators 53 are raised and lowered. The opening and closing cam follower 54 is provided on the upper portion of the opening and closing elevator 53 and protrudes toward the upper portion of the base portion B. The opening and closing cam follower 54 includes a roller that rotates around a horizontal axis and is raised and lowered by the opening and closing elevator 53. That is, the two opening and closing elevators 53 and the two opening and closing cam followers 54 are raised and lowered by one opening and closing cylinder 51.

[0144] The opening and closing shaft 55 is a rod-shaped member fixed to a fixing ring 55a in the vertical direction inside the rotating body 30, and the fixing ring 55a is fixed around the connecting tube 33. The opening and closing ring 56 is an annular member provided inside the rotating body 30 so as to be able to be raised and lowered. Figure 8 As shown, the opening / closing ring 56 includes a slider 56a, a connecting portion 56b, and a spring 56c. The slider 56a is cylindrical and hollow inside. The opening / closing shaft 55 is inserted into the hollow of the slider 56a, and the slider 56a rises and falls along the opening / closing shaft 55. Because the opening / closing ring 56 is fixed to the slider 56a via the connecting portion 56b, it moves up and down integrally with the slider 56a. The upper end of the connecting portion 56b is connected to the lower end of the arm 15. Specifically, a horizontally long hole 15a is formed at the lower end of the arm 15. By inserting the shaft 56d of the connecting portion 56b into the hole 15a, the connecting portion 56b is connected to the arm 15. The spring 56c is a biasing member that biases the slider 56a downward. In other words, the opening / closing ring 56 itself is also biased downward by the spring 56c via the slider 56a.

[0145] The opening and closing ring 56 is connected to / disconnected from the opening and closing cam follower 54 which is lifted and lowered. Figure 5 As shown, when the opening and closing cam follower 54 contacts the opening and closing ring 56 and rises, the opening and closing ring 56 rises against the force of the spring 56c, the holding portion 10 rotates around the rotating shaft 14, and the chuck pin 11 moves to the open position. Figure 6 and Figure 7 As shown, when the opening and closing cam follower 54 descends and moves away from the closed ring 56, the opening and closing ring 56 descends due to the urging force of the spring 56c, the holding portion 10 rotates around the rotating shaft 14, and the chuck pin 11 moves to the closed position.

[0146] (Ring member)

[0147] As described above, the ring member 20 is an annular member formed integrally. The so-called integral formation means continuous without gaps in the entire circumferential direction. For example, it can be formed seamlessly from a common material, or it can be formed by fixedly connecting multiple members. Figure 4 (A) Figure 4 As shown in FIG. 2 (B), the surface of the ring member 20 is flush with the surface of the substrate W at the close position.

[0148] like Figure 2 As shown, the outer diameter of the ring member 20 is larger than the outer diameter of the substrate W. In this case, the inner diameter of the ring member 20 is a diameter sufficient to allow the outer periphery We of the substrate W to approach the inner periphery 21. The ring member 20 is supported by a lifting shaft 68 (described later) and is coaxially arranged with the rotation axis A of the rotating body 30.

[0149] like Figure 3 As shown, a plurality of cutouts 23 are provided on the inner periphery 21 of the ring member 20 corresponding to the plurality of chuck pins 11. That is, six cutouts 23 are provided at equal intervals along the outer periphery We of the substrate W on the inner periphery 21 of the ring member 20. Figure 3 As shown, the chuck pin 11 in the closed position enters the notch 23 in a non-contact manner, functioning as a relief portion to prevent interference between the chuck pin 11 and the ring member 20. The notch 23 is shaped so that the chuck pin 11 can enter when the ring member 20 is positioned in the close position. In this embodiment, the notch 23 is shown as a U-shaped example, but is not limited to this shape.

[0150] In this embodiment, the inner peripheral edge 21 side of the cutout 23 is narrower than the outer peripheral edge 22 side. This narrows the gap between the cutout 23 and the chuck pins 11. Therefore, when the processing liquid flows on the substrate W and outflows onto the surface of the ring member 20, the intrusion of the processing liquid between the chuck pins 11 and the cutout 23 is minimized. Therefore, the flow around the chuck pins 11 can be made uniform with the flow in other parts, thereby reducing uneven processing.

[0151] (Ring moving mechanism)

[0152] like Figure 2 、 Figures 5 to 7 As shown, the ring moving mechanism 60 includes: a lifting cylinder 61, a lifting rod 62, a lifting elevator 63, a lifting cam follower 64, a lifting shaft 65, a first lifting ring 66, a second lifting ring 67, a lifting shaft 68, and a lifting connecting rod 69.

[0153] The lift cylinder 61 is fixed to the lower portion of the base B with its drive rod facing vertically downward. The lift rod 62 is a plate rotatably mounted on the base B about a fulcrum (not shown). The end of the lift rod 62 is rotatably connected to the drive rod of the lift cylinder 61. The lift rod 62 is U-shaped, surrounding the drive source 41. The lift rods 62 are connected to a pair of lifters 63.

[0154] A pair of lifts 63 in Figure 2Next to the pair of opening and closing elevators 53 shown (on the side of the rotation axis A), they are arranged on the base portion B so as to be able to be raised and lowered in the same manner as the opening and closing elevators 53. Each lifting elevator 63 is rotatably connected to the two ends of a U-shaped lifting rod 62. Therefore, as the driving rod of the lifting cylinder 61 moves, the lifting rod 62 rotates, and the pair of lifting elevators 63 are raised and lowered. The lifting cam follower 64 is provided on the upper part of the lifting elevator 63 and protrudes toward the upper part of the base portion B. The lifting cam follower 64 includes a roller that rotates around a horizontal axis and is raised and lowered by the lifting elevator 63. That is, the two lifting elevators 63 and the two lifting cam followers 64 are raised and lowered by one lifting cylinder 61.

[0155] The lifting shaft 65 is a rod-shaped member fixed to the fixing ring 55a in the vertical direction inside the rotating body 30. The first lifting ring 66 is an annular member provided inside the rotating body 30 so as to be able to be lifted. Figure 9 As shown, the first lifting ring 66 includes a slider 66a and a spring 66b. The slider 66a is cylindrical and hollow. The lifting shaft 65 is inserted into the hollow of the slider 66a, and the slider 66a rises and falls along the lifting shaft 65. The spring 66b acts as a biasing member, urging the slider 66a downward.

[0156] The second lifting ring 67 is an annular member having a larger diameter than the substrate W. The lifting shaft 68 is a vertical shaft, and its lower end is connected to the second lifting ring 67. The upper end of the lifting shaft 68 is inserted into the through hole 31f and protrudes toward the upper part of the workbench 31a, supporting the lower surface of the ring member 20. Thus, by arranging a plurality of lifting shafts 68 at equal intervals along the periphery of the substrate W, the ring member 20 and the second lifting ring 67 are lifted and moved integrally. In this embodiment, three lifting shafts 68 are arranged at intervals of 120 degrees. In addition, the three lifting shafts 68 are always kept parallel and are slidably mounted on the workbench 31a in a manner that allows them to move in a direction parallel to the rotation axis A.

[0157] The upper end of the lifting shaft 68 is cylindrical and covers the through-hole 31f. It includes an annular groove 68a therein, which is received by the annular wall 31g while covering it with a gap therebetween. This creates a labyrinthine structure, a winding path, between the annular wall 31g and the annular groove 68a, thereby preventing the processing liquid from flowing into the interior of the rotating body 30 through the through-hole 31f.

[0158] The lift link 69 is rotatably mounted on a support member extending from the rotating base 32 within the rotating body 30. A fulcrum shaft 69c is provided at the center of the lift link 69. The lift link 69 is rotatably mounted about the fulcrum shaft 69c. The fulcrum shaft 69c is mounted on a support column 32a extending downward from the bottom surface of the rotating base 32. One end of the lift link 69 is rotatably connected to the lower end of the lift shaft 68 via a pin 69a, and the other end is rotatably connected to the slider 66a of the first lift ring 66 via a pin 69b.

[0159] The first lifting ring 66 is connected to / disconnected from the lifting cam follower 64. Figure 5 and Figure 6 As shown, when the lifting cam follower 64 contacts the first lifting ring 66 and rises, the first lifting ring 66 rises against the force of the spring 66b, the lifting link 69 rotates, and the lifting shaft 68 descends, so that the ring member 20 descends and moves to the retracted position. Figure 7 As shown, when the lift cam follower 64 moves downward and away from the first lift ring 66, the first lift ring 66 moves downward due to the biasing force of the spring 66b, the lift link 69 rotates, and the lift shaft 68 moves upward, so that the ring member 20 moves upward and moves to the close position.

[0160] When the ring member 20 is in the approximate position, as shown in FIG. Figure 3 As shown in FIG. 2 , the chuck pin 11 enters the cutout 23, thereby avoiding interference with the chuck pin 11. Figure 5 As shown, when the ring member 20 is in the retracted position, the height of the lifting shaft 68 is set so that a gap h is formed between the ring member 20 and the substrate W, through which a robot hand of a transfer robot can be inserted. The formation of this gap h enables the robot hand to be inserted to place the substrate W and to be removed.

[0161] Furthermore, the mechanism above the opening and closing cam follower 54 and the lifting cam follower 64 and the connecting cylinder 33 are rotated by the rotor of the driving source 41. During the rotation of the rotating body 30, the opening and closing cam follower 54 and the opening and closing ring 56, and the lifting cam follower 64 and the first lifting ring 66, are out of contact.

[0162] (Supply Department)

[0163] like Figure 1 As shown, the supply unit 70 supplies the processing liquid to the surface of the substrate W, that is, the surface of the substrate W held by the holding unit 10 opposite to the work table 31a. The supply unit 70 includes a processing liquid supply mechanism 71, a processing liquid holding unit 72, a lifting mechanism 73, and a heating unit 74.

[0164] The treatment liquid supply mechanism 71 is a mechanism for supplying a variety of treatment liquids. In this embodiment, for example, pure water (H2O), an aqueous solution containing phosphoric acid (H3PO4) (hereinafter referred to as a phosphoric acid solution), and an aqueous solution containing hydrogen fluoride (HF) (hereinafter referred to as a hydrofluoric acid solution) are supplied as treatment liquids. The treatment liquid supply mechanism 71 includes a treatment liquid tank 71a for storing each treatment liquid.

[0165] Individual feed pipes 71b are connected in parallel to the processing liquid supply pipes 71c from each processing liquid tank 71a. The front end of the processing liquid supply pipe 71c faces the substrate W held by the holding unit 10. Thus, the processing liquid from each processing liquid tank 71a is supplied to the surface of the substrate W via the individual feed pipes 71b and the processing liquid supply pipe 71c. The individual feed pipes 71b are respectively provided with a flow control valve 71d and a flow meter 71e.

[0166] The processing liquid holding portion 72 is circular with a diameter larger than that of the substrate W. It has a basin-like shape due to a wall formed on its peripheral edge that rises toward the side opposite to the rotating body 30. The outer bottom surface of the processing liquid holding portion 72 faces the substrate W. The distal end of the processing liquid supply pipe 71 c is inserted into the processing liquid holding portion 72, forming a discharge port 72 a that is exposed toward the substrate W.

[0167] The lifting mechanism 73 is a mechanism for moving the processing liquid holding unit 72 in a direction of contact with or separation from the substrate W. As the lifting mechanism 73, various mechanisms such as a cylinder and a ball screw mechanism that move the processing liquid holding unit 72 in a direction parallel to the axis of the rotating body 30 can be used, but the details are omitted.

[0168] The heating unit 74 heats the processing liquid supplied by the supply unit 70 onto the surface of the substrate W. The heating unit 74 includes a heater 741 disposed on the surface of the processing liquid holding unit 72 opposite the surface facing the substrate W. The heater 741 is in the shape of a circular plate. A through-hole 741a is formed in the heater 741, through which the processing liquid supply pipe 71c is inserted.

[0169] (Testing Department)

[0170] like Figure 10 As shown, the detection unit 80 includes an opening and closing detection unit 81 and a ring position detection unit 82. The opening and closing detection unit 81 is provided near the opening and closing ring 56 on the base B. The ring position detection unit 82 is provided near the first lifting ring 66 on the base B. The opening and closing detection unit 81 and the ring position detection unit 82 are respectively transmissive optical sensors including a light-transmitting portion and a light-receiving portion facing each other. The opening and closing detection unit 81 and the ring position detection unit 82 detect the light by outputting a light-receiving window of the light-receiving portion relative to the transmitted light detection area 83 (refer to FIG. 1 ). Figure 11 The electrical signal proportional to the amount of light (B) can detect the position of the component between the light-transmitting part and the light-receiving part.

[0171] like Figure 11 As shown in (A), the opening / closing detection unit 81 is located between the light-transmitting portion and the light-receiving portion, where the open / closed ring 56 is located. As the height of the open / closed ring 56 changes, the amount of light blocked changes, causing the output of the opening / closing detection unit 81 to change. The height of the open / closed ring 56 determines whether the chuck pin 11 is in the closed or open position, so the output of the opening / closing detection unit 81 can detect the position of the chuck pin 11.

[0172] The ring position detector 82 is located between the light-transmitting portion and the light-receiving portion, interposing the first lift ring 66. As the height of the first lift ring 66 changes, the amount of light blocked changes, causing the output of the ring position detector 82 to change. The height of the first lift ring 66 determines whether the ring member 20 is in the approached position or the retracted position. Therefore, the output of the ring position detector 82 can detect the position of the ring member 20.

[0173] For example, Figure 11 As shown in (B), when the bottom of the open-closed loop 56 is at the position indicated by the solid line a relative to the transmitted light detection area 83 of the light receiving section, the chuck pin 11 is in the open position. When the bottom of the open-closed loop 56 is at the position indicated by the dashed line b, the chuck pin 11 is in the closed position, properly holding the substrate W. Furthermore, the position b has a predetermined width w (allowable range). When the bottom of the open-closed loop 56 is at the position indicated by the dashed line c, the chuck pin 11 has moved beyond the closed position, indicating a swinging state in which the substrate W cannot be held.

[0174] (Control device)

[0175] The control device 90 controls various components of the substrate processing apparatus 1. The control device 90 includes a processor for executing programs, a memory for storing various information such as programs and operating conditions, and a drive circuit for driving various components to implement the various functions of the substrate processing apparatus 1. Specifically, the control device 90 controls the rotation mechanism 40, the chuck opening and closing mechanism 50, the ring moving mechanism 60, the processing liquid supply mechanism 71, the lifting mechanism 73, the heating unit 74, and the like. The control device 90 also includes an input device for inputting information and a display device for displaying information.

[0176] In this embodiment, when the opening and closing detection unit 81 detects that the chuck pin 11 is in the closed position, the control device 90 causes the ring moving mechanism 60 to move the ring member 20 to the approach position. Furthermore, when the ring position detection unit 82 detects that the ring member 20 is in the retracted position, the control device 90 causes the chuck opening and closing mechanism 50 to move the chuck pin 11 to the open position.

[0177] [action]

[0178] In addition to the reference Figures 1 to 11 (A) Figure 11 In addition to (B), also refer to Figure 12 The operation of the substrate processing apparatus 1 according to the present embodiment described above will be described with reference to the flowchart of FIG. Furthermore, a substrate processing method for processing a substrate W according to the following procedure is also one aspect of the present embodiment.

[0179] First, if Figure 1 As shown, the processing liquid holding portion 72 of the supply portion 70 is in the upper standby position, the chuck pin 11 is in the open position, and the ring member 20 is in the retracted position ( Figure 5 In this state, when a substrate W mounted on the manipulator of the transfer robot is loaded between the processing liquid holding portion 72 and the rotating body 30 (step S01), the opening and closing cylinder 51 is activated to lower the opening and closing cam follower 54. As a result, the holding portion 10 is rotated by the biasing force of the spring 56c, and the plurality of chuck pins 11 are moved to the closed position (step S02).

[0180] When the opening / closing detection unit 81 detects that the chuck pins 11 are in the closed position normally holding the outer peripheral edge We of the substrate W (YES in step S03 ), Figure 6 The lifting cylinder 61 is operated to lower the lifting cam follower 64, thereby raising the lifting shaft 68 by the biasing force of the spring 66b, and moving the ring member 20 to the close position (step S04) ( Figure 7 If the chuck pins 11 are not detected in the normal position (NO in step S03), the apparatus is considered abnormal and stops. For example, the apparatus stops when it is detected that the chuck pins 11 cannot contact the outer edge We of the substrate W and have moved excessively inward.

[0181] If the ring position detection unit 82 detects that the ring member 20 is in the approach position (Yes in step S05), the drive source 41 is activated and the rotator 30 begins to rotate (step S06). The rotator 30 rotates at a relatively low, predetermined speed (e.g., approximately 50 rpm), and the substrate W and the holding unit 10 rotate at the predetermined speed. If the ring member 20 is not detected to be in the normal position (No in step S05), an abnormality is detected and the device is stopped. For example, the ring member 20 may be detected to be in contact with the outer peripheral edge We of the substrate W and unable to rise to the normal height, thereby stopping the device.

[0182] The etching liquid is supplied from the nozzle 72a of the processing liquid holding part 72 to the gap between the processing liquid holding part 72 and the surface of the substrate W (step S07). That is, when the hydrofluoric acid solution is supplied to the surface of the rotating substrate W, the etching liquid moves toward the outer peripheral edge We of the substrate W, so that the surface of the substrate W is etched and the oxide film and organic matter are removed. Figure 4 (A) Figure 4 As shown in FIG. 5 (B), the processing liquid flowing toward the outer peripheral edge We of the substrate W flows from the outer peripheral edge We of the substrate W along the surface of the ring member 20 and is discharged to the outside through the gaps between the chuck pins 11 .

[0183] At this time, the surface of the substrate W is substantially extended, and the change in the flow rate near the periphery of the substrate W becomes smaller, so that the etching liquid is less likely to stay near the periphery of the substrate W, thereby promoting the discharge of the etching liquid. Figure 3 As shown, the chuck pins 11 enter the cutouts 23, so that the surface of the substrate W and the surface of the ring member 20 are present in a manner surrounding the chuck pins 11. This reduces the gap around the chuck pins 11, and thus the liquid flowing from the peripheral end of the substrate W toward the chuck pins 11 is discharged toward the surface of the ring member 20 around the chuck pins 11. Therefore, the blocking effect of the chuck pins 11 on the liquid flow can be reduced.

[0184] Next, the processing liquid holding unit 72 stops supplying the etching liquid (step S08) and supplies pure water from the nozzle 72a to the gap between the processing liquid holding unit 72 and the surface of the substrate W (step S09). As the pure water is supplied to the surface of the rotating substrate W, it moves sequentially toward the outer peripheral edge We of the substrate W, thereby rinsing the hydrofluoric acid from the surface of the substrate W. The role of the ring member 20 in promoting the flow is the same as described above. Then, the processing liquid holding unit 72 stops supplying pure water (step S10).

[0185] The processing liquid holding unit 72 is lowered to bring the heater 741 closer to the substrate W (step S11), and the phosphoric acid solution is supplied to the gap between the processing liquid holding unit 72 and the surface of the substrate W (step S12). In this way, the phosphoric acid solution supplied between the processing liquid holding unit 72 and the surface of the substrate W is heated by the processing liquid holding unit 72 heated by the heater 741 and reaches a high temperature.

[0186] In this state, when phosphoric acid solution is continuously supplied from the discharge port 72a of the processing liquid holding unit 72, the phosphoric acid solution gradually moves toward the outer peripheral edge We of the substrate W on the surface of the substrate W. As a result, the pure water on the surface of the substrate W is replaced by phosphoric acid, and the nitride film is removed by etching. The role of the ring member 20 in promoting flow is the same as described above.

[0187] Next, the processing liquid holding portion 72 stops the supply of phosphoric acid solution and rises (step S13), and pure water is supplied from the nozzle 72a to the gap between the processing liquid holding portion 72 and the surface of the substrate W (step S14). When pure water is supplied to the surface of the rotating substrate W, the pure water moves sequentially toward the outer peripheral edge We of the substrate W, thereby rinsing the phosphoric acid on the surface of the substrate W. The role of promoting flow by the ring member 20 is the same as described above. Then, after a prescribed cleaning time, the processing liquid holding portion 72 stops the supply of pure water (step S15). Then, the processing liquid holding portion 72 rises (step S16), the drive source 41 stops and the rotating body 30 stops rotating, whereby the substrate W stops (step S17).

[0188] Thereafter, the lift cylinder 61 operates to raise the lift cam follower 64 against the biasing force of the spring 66 b , thereby lowering the lift shaft 68 and moving the ring member 20 to the retracted position (step S18 ).

[0189] When the ring position detection unit 82 detects that the ring member 20 is in the retracted position (step S19), the robot is inserted into the lower part of the substrate W, and the opening and closing cylinder 51 is operated to resist the force applied by the spring 56c and raise the opening and closing cam follower 54, thereby rotating the holding unit 10 and moving the multiple chuck pins 11 to the open position (step S20).

[0190] Then, if the opening and closing detection unit 81 detects that the chuck pins 11 are in the normal open position (Yes in step S21), the substrate W is unloaded by the robot (step S22). If the ring member 20 is not detected in the retracted position (No in step S19), the chuck pins 11 are not moved to the open position, but the device is stopped. If the chuck pins 11 are not detected in the normal open position (No in step S21), the device is stopped.

[0191] Furthermore, the opening and closing detection unit 81 and the ring position detection unit 82 continuously monitor the substrate. If an abnormality occurs during the sequence (steps S05 to S09), the control unit 90 halts substrate processing. Specifically, the control unit 90 only starts rotating the substrate W and performing processing when the closed position of the chuck pins 11 and the proximity position of the ring member 20 are both within the normal range. Furthermore, if the outputs from the opening and closing detection unit 81 and the ring position detection unit 82 deviate from the normal range during processing, the control unit 90 immediately takes measures such as stopping the apparatus.

[0192] [Effect]

[0193] (1) As described above, the substrate processing apparatus 1 of the present embodiment includes: a holding portion 10 including a plurality of chuck pins 11 for holding the outer peripheral edge We of the substrate W; a chuck opening and closing mechanism 50 for moving the plurality of chuck pins 11 between an open position away from the substrate W and a closed position in which the chuck pins 11 are in contact with the outer peripheral edge We of the substrate W and hold the substrate W; a ring member 20 having an inner peripheral edge 21 along the shape of the outer peripheral edge We of the substrate W and a cutout 23 provided on the inner peripheral edge 21 for the chuck pins 11 in the closed position to enter, and being integrally formed over the entire circumference; and a ring moving mechanism 60 for moving, in the substrate processing apparatus 1, between an approach position in which the inner peripheral edge 21 of the ring member 20 approaches and surrounds the outer peripheral edge We of the substrate W and a retreat position in which the ring member 20 is retreated from the outer peripheral edge We of the substrate W.

[0194] Furthermore, the substrate processing device 1 includes: a rotating body 30, which includes a chuck pin 11 and a ring member 20, and rotates the substrate W held by the chuck pin 11 and the ring member 20 in a close position; and a supply part 70, which supplies processing liquid to the substrate W held by the chuck pin 11 and rotated by the rotating body 30.

[0195] Therefore, by using the chuck pins 11 to hold the outer peripheral edge We of the substrate W while processing without bringing the back side of the substrate W into contact with the loading surface or the lifting pins, the cleanliness of the surface of the substrate W can be maintained while reducing the change in the flow rate of the processing liquid near the peripheral edge of the substrate W and improving the uniformity of the processing rate. In the close position, the chuck pins 11 enter the cutout 23, so that the chuck pins 11 are surrounded by the surface of the substrate W and the surface of the ring member 20 that expands it. Therefore, the difference between the peripheral portion of the chuck pins 11 and the portion outside the peripheral portion can be reduced, thereby promoting the flow of the processing liquid near the peripheral edge of the substrate W. Therefore, it is not easily affected by the chuck pins 11, and the uniformity of the processing rate in the circumferential direction can be improved.

[0196] Furthermore, the ring moving mechanism 60 only needs to move the integral ring member 20. This makes it easier to align the ring member 20 with respect to the substrate W than when separate control bodies are driven independently, and there is no need to synchronize multiple parts. Furthermore, the robot arm can access the gap below the substrate W, making it easier to load and unload the substrate W.

[0197] (2) The chuck pins 11 are arranged to be movable between an open position and a closed position by moving in a direction perpendicular to the outer peripheral edge We of the substrate W. When the chuck pins 11 are perpendicular to the outer peripheral edge We of the substrate W, the chuck pins 11 in the closed position enter the notch 23 and thus do not interfere with the raising and lowering of the ring member 20.

[0198] (3) The ring position detecting unit 82 detects the position of the ring member 20, and the control device 90 controls the chuck opening and closing mechanism 50 and the ring moving mechanism 60. When the ring position detecting unit 82 detects that the ring member 20 is in the retracted position, the control device 90 causes the chuck opening and closing mechanism 50 to move the chuck pin 11 to the open position. This prevents the ring member 20 from interfering with the movement of the chuck pin 11 to the open position.

[0199] (4) The opening / closing detection unit 81 is provided to detect the position of the chuck pin 11. When the opening / closing detection unit 81 detects that the chuck pin 11 is in the closed position, the control device 90 causes the ring moving mechanism 60 to move the ring member 20 to the close position. This prevents the holding unit 10 from interfering with the movement of the ring member 20 to the close position. Furthermore, any abnormality in the holding of the substrate W can be detected and safely stopped.

[0200] [Modification]

[0201] (1) The holding portion 10 may be provided with a groove 13a which, when the chuck pin 11 is in the open position, enters the notch 23 of the ring member 20 in the retracted position. Figure 13 As shown in (A), a recessed groove 13a is formed on the outer peripheral side of the chuck portion 13. Figure 13 (B) Figure 13 As shown in (C), when the holding portion 10 rotates to move the chuck pin 11 to the open position, the groove 13a functions as a relief portion to avoid interference with the ring member 20. Thus, even if the curved portion of the cutout 23 becomes shallower, the movement of the chuck pin 11 to the open position can be ensured, thereby preventing interference between the substrate W and the chuck pin 11 during loading and unloading. Therefore, the gap between the chuck pin 11 and the ring member 20 caused by the cutout 23 can be reduced, thereby suppressing the influence on the flow of the processing liquid. That is, by minimizing the gap between the chuck pin 11 and the ring member 20, the processing liquid can be prevented from winding around to the back side of the ring member 20. Therefore, the amount of processing liquid falling relative to the back side of the ring member 20 and the back side of the substrate W can be minimized, thereby ensuring the cleanliness of the back side of the substrate W.

[0202] (2) The chuck pin 11 may also be of an eccentric rotary type that can be moved between an open position and a closed position by rotating about an axis parallel to the rotation axis A of the rotating body 30. For example, Figure 14 (A) Figure 14 As shown in (B), the following structure may be adopted: as the cover 12 rotates, the chuck pin 11 contacts the edge of the substrate W and holds the substrate W in the closed position (see Figure 14 (A)) and the opening position of the substrate W by opening the substrate W by moving away from the edge of the substrate W (refer to Figure 14 (B)).

[0203] The chuck opening and closing mechanism 50 includes, for example, a drive shaft 531, a small gear 532, and a large gear 533. The drive shaft 531 is a cylindrical member provided coaxially with the rotation axis of the cover 12 on the side opposite to the top surface of the cover 12.

[0204] The pinion gear 532 is a sector gear provided at the end of the drive shaft 531 on the side opposite the cover 12. The large gear 533 is a gear with gear grooves intermittently formed corresponding to the pinion gear 532. The large gear 533 is rotatably provided coaxially with the rotating body 30 via the rotation mechanism 40 that rotates the rotating body 30. The large gear 533 has six protrusions formed at predetermined intervals along the circumference, corresponding to the intervals between the pinion gears 532. A gear groove is formed on the outer circumferential surface of the distal end of each protrusion to mesh with the pinion gear 532.

[0205] The large gear 533 is biased by a spring or other biasing member not shown. Figure 14 1 (A) ). Consequently, the pinion gear 532 is forced in the clockwise direction indicated by arrow β1. Consequently, the cover 12 rotates in conjunction with the pinion gear 532, causing the chuck pin 11 to move toward the center of the rotating body 30 while maintaining the closed position abutting the substrate W. Furthermore, during substrate processing, the cover 12, drive shaft 531, chuck pin 11, pinion gear 532, and gear 533 rotate together with the rotating body 30 while maintaining the closed position.

[0206] In addition, the rotation of the large gear 533 is stopped by a stop mechanism (not shown). Figure 14 As shown in FIG. 3B , when the rotating body 30 is rotated in the direction of arrow γ, the small gear 532 meshing with the large gear 533, which has been blocked from rotation, rotates counterclockwise as indicated by arrow β2. As a result, the rotating cover 31 rotates, and the chuck pins 11 move away from the edge of the substrate W, reaching the open position.

[0207] Furthermore, in more detail, Figure 15 (A) Figure 15 As shown in FIG. 1 (B), the chuck pin 11 is provided on a chuck portion 13 provided upright on the cover 12. The chuck portion 13 is provided with the same groove 13a as described above.

[0208] In this form, Figure 15As shown in (A), when the chuck pin 11 is in the closed position, the chuck pin 11 enters the cutout 23 of the ring member 20, thereby avoiding interference with the chuck pin 11. In addition, when the chuck pin 11 moves horizontally around the axis as described above, even when the ring member 20 is in the retreat position, in order to avoid interference with the chuck pin 11 moved to the open position, it is necessary to deepen the cutout 23 by an amount equivalent to the moving range of the chuck pin 11. As a result, the flow of the processing liquid changes in the portion where the cutout 23 is enlarged. In this case, in particular, the gap between the chuck pin 11 and the cutout 23 is enlarged, so the processing liquid flows from the gap to the back side of the ring member 20 or the back side of the substrate W, which will impair the cleanliness of the said part. In order to cope with this problem, in this form, as Figure 15 As shown in FIG. 1B , the following structure is employed: when the cover 12 rotates to move the chuck pins 11 to the open position, the cutouts 23 enter the grooves 13a. This prevents the cutouts 23 from expanding while ensuring sufficient movement of the chuck pins 11 toward the open position, thus preventing interference between the chuck pins 11 and the substrate W during loading and unloading. Consequently, the gap between the chuck pins 11 and the ring member 20 caused by the cutouts 23 is reduced, thereby minimizing any impact on the flow of the processing liquid.

[0209] (3) The structure for driving the chuck opening and closing mechanism 50 and the ring moving mechanism 60 is not limited to the above-described configuration. For example, a structure may be adopted in which the chuck opening and closing mechanism 50 and the ring moving mechanism 60 are raised and lowered in a non-contact manner using the repulsive force of a magnet instead of a cam follower.

[0210] (4) The surface of the ring member 20 in the close position may not be flush with the surface of the substrate W as long as it can prevent the processing liquid from flowing out of the gap. The surface of the ring member 20 may also be lower than the surface of the substrate W. In addition, the shape of the ring member 20 is preferably set to prevent the liquid from flowing into the back side of the substrate W in the gap between the ring member 20 and the substrate W.

[0211] (5) The processing contents and processing liquid of the substrate processing apparatus 1 are not limited to those exemplified above. The substrate W and film to be processed are also not limited to those exemplified above.

[0212] [Other embodiments]

[0213] While the embodiments of the present invention and variations of each component have been described above, these embodiments and variations of each component are provided as examples and are not intended to limit the scope of the invention. The novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments or variations thereof are included in the scope and spirit of the invention and are included in the invention described in the claims.

Claims

1. A substrate processing device, characterized in that: include: a holding portion including a plurality of chuck pins for holding an outer peripheral edge of the substrate; a chuck opening and closing mechanism for moving the plurality of chuck pins between an open position away from the substrate and a closed position in contact with an outer peripheral edge of the substrate to hold the substrate; a ring member integrally formed over the entire circumference, having an inner peripheral edge shaped along the outer peripheral edge of the base plate and a notch provided in the inner peripheral edge for receiving the chuck pin in the closed position; a ring moving mechanism that moves the ring member between an approach position in which the inner periphery of the ring member approaches the outer periphery of the substrate and surrounds the outer periphery of the substrate, and a retracted position in which the ring member is lowered than the approach position and retracted from the outer periphery of the substrate; a rotating body including the chuck pin and the ring member, and rotating the substrate held by the chuck pin and the ring member in the close position, and having a through hole through which the chuck pin protrudes; a cover, disposed at a position covering the through hole and connected to the chuck pin; as well as a supply unit that supplies a processing liquid to the substrate held by the chuck pins and rotated by the rotating body, The ring moving mechanism moves the ring member between the retreat position above the upper surface of the cover and the approach position. When the ring member is positioned at the approach position, the inner peripheral edge of the cutout is located on a side closer to the chuck pin than the outer peripheral edge of the cover.

2. The substrate processing apparatus according to claim 1, wherein: The cutout is shaped such that the chuck pin can enter when the ring member is positioned at the approximated position.

3. The substrate processing apparatus according to claim 1 or 2, wherein: include: a ring position detection unit for detecting the position of the ring member; as well as A control device controls the chuck opening and closing mechanism and the ring moving mechanism, The control device is In a state where the ring position detection unit detects that the ring member is in the retracted position, the chuck opening and closing mechanism is caused to move the chuck pin to the open position.

4. The substrate processing apparatus according to claim 3, wherein: comprising an opening and closing detection portion for detecting the position of the chuck pin, The control device is In a state where the opening / closing detection unit detects that the chuck pin is in the closed position, the ring moving mechanism is caused to move the ring member to the close position.

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