A wafer UV de-gluing machine

Abstract

The present invention provides a wafer UV debonding machine, comprising: a chassis with an open top; an ultraviolet lamp disposed inside the chassis; a placing mechanism that movably penetrates through the side wall of the chassis, the placing mechanism is slidably connected to the inner wall of the chassis and slides in and out of the chassis, the placing mechanism is located above the ultraviolet lamp and is used for holding wafers; a machine cover disposed on the top of the chassis, one end of the machine cover is hinged to the chassis; a blocking mechanism disposed on the top of the placing mechanism along the sliding direction of the placing mechanism, the blocking mechanism includes a number of blocking blocks connected in sequence; an elastic limiting mechanism disposed on the machine cover, the elastic limiting mechanism cooperates with the blocking mechanism, the elastic limiting mechanism does not hinder the blocking block from moving towards the side close to the chassis, and the elastic limiting mechanism hinders the blocking block from moving towards the side away from the chassis. In the present invention, the elastic limiting mechanism does not hinder the placing mechanism from sliding into the chassis and hinders the placing mechanism from sliding out of the chassis, effectively preventing the wafers from accidentally leaving the working area irradiated by the ultraviolet lamp during normal operation.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer degumming equipment, and particularly relates to a wafer UV degumming machine. Background Art

[0002] In the semiconductor industrial production, sometimes it is necessary to stick a UV film on the surface of the wafer to facilitate the processing of the wafer. After the processing is completed, it is necessary to remove the UV film. After irradiating with a UV lamp, the viscosity of the UV film is reduced, and the UV film can be conveniently removed.

[0003] The existing UV degumming machine uses an ultraviolet lamp as a light source to irradiate the wafer, and manually removes the wafer after the timing ends. Since the ultraviolet lamp needs to irradiate the wafer in a closed space, and after the wafer is placed on the placement plate and pushed into the irradiation area of the ultraviolet lamp, if there is no locking member to fix the placement plate or the locking member is damaged, the placement plate will accidentally carry the wafer out of the irradiation area of the ultraviolet lamp during the wafer processing, affecting the normal progress of the wafer degumming work. Improper operation or forgetting to operate the locking member will also cause the same problem. Therefore, it is necessary to provide a wafer UV degumming machine to solve the above existing problems. Summary of the Invention

[0004] In view of this, the present invention provides a wafer UV degumming machine, which can be normally pulled and pushed the placement mechanism as needed, with convenient operation. The elastic limit mechanism does not prevent the baffle block from moving towards the side close to the chassis, that is, it does not prevent the placement mechanism from sliding into the chassis. However, the elastic limit mechanism prevents the baffle block from moving towards the side away from the chassis, that is, it prevents the placement mechanism from sliding out of the chassis, effectively preventing the wafer from accidentally leaving the working area irradiated by the ultraviolet lamp during normal operation.

[0005] To achieve the above technical effects, the present invention provides a wafer UV degumming machine, adopting the following technical solutions:

[0006] A wafer UV degumming machine, comprising:

[0007] A chassis with an open top;

[0008] An ultraviolet lamp disposed inside the chassis;

[0009] A placement mechanism that movably penetrates the side wall of the chassis, the placement mechanism is slidably connected to the inner wall of the chassis and slides in and out of the chassis, and the placement mechanism is located above the ultraviolet lamp and is used for holding the wafer;

[0010] A machine cover disposed on the top of the chassis, one end of the machine cover is hinged to the chassis;

[0011] Blocking mechanism, the blocking mechanism is arranged on the top of the storage mechanism along the sliding direction of the storage mechanism, and the blocking mechanism includes a number of blocking blocks connected in sequence;

[0012] Elastic limiting mechanism, the elastic limiting mechanism is arranged on the machine cover, the elastic limiting mechanism cooperates with the blocking mechanism, the elastic limiting mechanism does not prevent the blocking block from moving towards the side close to the chassis, and the elastic limiting mechanism prevents the blocking block from moving towards the side away from the chassis.

[0013] Further, the top of the blocking block has an inclined slope, and the height of the end of the blocking block close to the chassis is lower than the height of the end away from the chassis.

[0014] Further, the elastic limiting mechanism includes a fixed seat arranged on the machine cover, a shaft assembly detachably arranged on the fixed seat, a limiting assembly rotatably sleeved on the shaft assembly, and a spring arranged between the limiting assembly and the fixed seat.

[0015] Further, the fixed seat includes a fixed block, a limiting groove for limiting the limiting assembly is opened on the fixed block, the shaft assembly penetrates through the fixed block and the limiting groove and is detachably connected to the fixed block, and the limiting assembly is rotatably sleeved on the shaft assembly and rotates in the limiting groove.

[0016] Further, a shaft hole communicating with the limiting groove is opened on the fixed block, a mounting hole communicating with the limiting groove is opened on the fixed block, the extension line of the central axis of the shaft hole coincides with the extension line of the central axis of the mounting hole, the shaft hole and the mounting hole are respectively located on both sides of the limiting groove, the limiting assembly includes a positioning shaft arranged in the shaft hole and a mounting bolt arranged in the mounting hole, a threaded hole matched with the mounting bolt is opened at one end of the positioning shaft close to the mounting bolt, and the limiting assembly is rotatably sleeved on the positioning shaft.

[0017] Further, the limiting assembly includes a limiting plate rotatably sleeved on the positioning shaft, a first accommodating groove is opened on the fixed block, a second accommodating groove corresponding to the first accommodating groove is opened on the limiting plate, the spring is arranged in the first accommodating groove and the second accommodating groove, and both ends of the spring are respectively connected to the fixed block and the limiting plate.

[0018] Further, the storage mechanism includes a storage plate slidably connected to the inner wall of the chassis, an end plate arranged at one end of the storage plate away from the chassis, a handle arranged on the end plate, and a containing groove for containing wafers is penetrated and opened on the storage plate.

[0019] Further, an opening communicating with the containing groove is penetrated and opened on the storage plate.

[0020] Furthermore, the machine cover is hinged to the chassis through a hinge. The chassis is made of iron, and a magnet for adsorbing the top of the chassis is provided at one end of the side wall of the machine cover close to the chassis and away from the hinge.

[0021] The above technical solutions of the present invention at least include the following beneficial effects:

[0022] 1. The structure of the present invention is simple and easy to use. The storage mechanism can be normally pulled and pushed as needed, and the operation is convenient. The elastic limit mechanism does not prevent the baffle block from moving towards the side close to the chassis, that is, it does not prevent the storage mechanism from sliding into the chassis. However, the elastic limit mechanism prevents the baffle block from moving towards the side away from the chassis, that is, it prevents the storage mechanism from sliding out of the chassis, effectively preventing the wafer from accidentally leaving the working area irradiated by the ultraviolet lamp during normal operation.

[0023] 2. Pulling out the storage mechanism from the chassis facilitates the loading and unloading of the wafer; directly opening the machine cover facilitates the maintenance / replacement of the ultraviolet lamp in the chassis.

[0024] 3. The top of the baffle block has an inclined slope, and the height of the end of the baffle block close to the chassis is lower than the height of the end away from the chassis. In this way, when the baffle block enters the chassis, the lower end contacts the elastic limit mechanism first, and the elastic limit mechanism does not prevent the baffle block from entering the chassis; when the baffle block is about to leave the chassis, the side wall of the higher end directly abuts against the elastic limit mechanism, and the elastic limit mechanism blocks the baffle block from sliding out of the chassis.

[0025] 4. The limit component includes a positioning shaft inserted into the shaft hole and a mounting bolt inserted into the mounting hole. A threaded hole matching the mounting bolt is provided at one end of the positioning shaft close to the mounting bolt, and the connection is by threaded connection, which is convenient for disassembly and assembly.

[0026] 5. The fixing block is provided with a first accommodation groove, the limiting plate is provided with a second accommodation groove corresponding to the first accommodation groove, and the spring is installed in the first accommodation groove and the second accommodation groove. The two ends of the spring are respectively connected to the fixing block and the limiting plate. The spring plays a role in resetting the limiting plate, and the first accommodation groove and the second accommodation groove play a role in guiding the spring, which helps the stretched spring to return to its original state.

[0027] 6. The machine cover is hinged to the chassis through a hinge. The chassis is made of iron, and a magnet for adsorbing the top of the chassis is installed at one end of the side wall of the machine cover close to the chassis and away from the hinge, ensuring that when the machine cover is closed, the machine cover is tightly connected to the chassis, and it can only be opened when the machine cover is subjected to an upward pulling force, preventing the machine cover from easily separating from the chassis during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic structural diagram of the wafer UV debonding machine in the embodiment of the present invention;

[0029] Figure 2 isFigure 1 Top view;

[0030] Figure 3 Schematic diagram of a state structure of a wafer UV debonding machine in an embodiment of the present invention;

[0031] Figure 4 Stereogram of a blocking mechanism in an embodiment of the present invention;

[0032] Figure 5 Schematic diagram of a structure of an elastic limiting mechanism in an embodiment of the present invention;

[0033] Figure 6 is Figure 5 Left view;

[0034] Figure 7 is Figure 6 Schematic diagram of a sectional structure in the A-A direction in;

[0035] Figure 8 Stereogram of an elastic limiting mechanism in an embodiment of the present invention;

[0036] Figure 9 Exploded view of an elastic limiting mechanism in an embodiment of the present invention.

[0037] In the figure:

[0038] 1, chassis;

[0039] 2, machine cover;

[0040] 3, placing mechanism; 31, placing plate; 32, end plate; 33, handle; 34, opening;

[0041] 4, blocking mechanism; 41, blocking block;

[0042] 5, elastic limiting mechanism;

[0043] 51, fixed seat; 511, fixed block; 512, first accommodating groove; 513, limiting groove; 514, shaft hole; 515, mounting hole;

[0044] 52, shaft assembly; 521, positioning shaft; 522, mounting bolt;

[0045] 53, limiting assembly; 531, limiting plate; 532, second accommodating groove; 533, positioning hole;

[0046] 54, spring;

[0047] 6, ultraviolet lamp. Detailed implementation manners

[0048] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will combine the drawings of the embodiments of the present inventionFigures 1-9 The technical solutions of the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention fall within the scope of protection of the present invention.

[0049] A wafer UV debonding machine, comprising:

[0050] A chassis 1 with an opening at the top;

[0051] An ultraviolet lamp 6 disposed inside the chassis 1;

[0052] An object placing mechanism 3 movably penetrating through the side wall of the chassis 1, the object placing mechanism 3 being slidably connected to the inner wall of the chassis 1 and sliding in and out of the chassis 1, and the object placing mechanism 3 being located above the ultraviolet lamp 6;

[0053] A machine cover 2 disposed on the top of the chassis 1, one end of the machine cover 2 being hinged to the chassis 1;

[0054] A blocking mechanism 4 disposed on the top of the object placing mechanism 3 along the sliding direction of the object placing mechanism 3, the blocking mechanism 4 including a plurality of blocking blocks 41 connected in sequence;

[0055] An elastic limiting mechanism 5 disposed on the machine cover 2, the elastic limiting mechanism 5 cooperating with the blocking mechanism 4, the elastic limiting mechanism 5 not hindering the movement of the blocking block 41 toward the side close to the chassis 1, and the elastic limiting mechanism 5 hindering the movement of the blocking block 41 toward the side away from the chassis 1.

[0056] Specifically, as Figures 1-3As shown in the figure, a wafer UV glue remover includes a chassis 1 with an open top. An ultraviolet lamp 6 is installed inside the chassis 1. The ultraviolet lamp 6 and its installation structure are prior art and will not be described in further detail here. A sliding hole is opened at the top of the left side wall of the chassis 1, and a placement mechanism 3 is slidably installed in the sliding hole. The front and rear ends of the placement mechanism 3 are slidably connected to the inner walls of the front and rear side walls of the chassis 1. The connection structure is the same as the sliding connection structure of a drawer in the prior art and will not be described in further detail here. The placement mechanism 3 slides left and right in the horizontal direction so as to slide in and out of the chassis 1. The placement mechanism 3 is located above the ultraviolet lamp 6. The top of the chassis 1 is hinged with a machine cover 2. The machine cover 2 is hinged to the right end of the chassis 1, and the opening and closing are convenient. A blocking mechanism 4 is installed on the top of the placement mechanism 3 along the sliding direction of the placement mechanism 3. The blocking mechanism 4 includes nine blocking blocks 41 connected in sequence. The nine blocking blocks 41 are arranged in a straight line. An elastic limiting mechanism 5 is installed on the machine cover 2 and is matched with the blocking mechanism 4. The elastic limiting mechanism 5 does not prevent the blocking block 41 from moving towards the side close to the chassis 1, and the elastic limiting mechanism 5 prevents the blocking block 41 from moving towards the side away from the chassis 1. Pulling out the placement mechanism 3 from the chassis 1 facilitates the picking and placing of the wafer; directly opening the machine cover 2 facilitates the replacement of the ultraviolet lamp 6 inside the chassis 1; closing the machine cover 2 and directly pushing the placement mechanism 3 into the chassis 1 can start working. The elastic limiting mechanism 5 does not prevent the blocking block 41 from moving towards the side close to the chassis 1, that is, it does not prevent the placement mechanism 3 from sliding into the chassis 1. However, the elastic limiting mechanism 5 prevents the blocking block 41 from moving towards the side away from the chassis 1, that is, it prevents the placement mechanism 3 from sliding out of the chassis 1, effectively preventing the wafer from accidentally leaving the working area irradiated by the ultraviolet lamp 6 during the normal working process.

[0057] According to an embodiment of the present invention, as Figure 4 shown, the top of the blocking block 41 has an inclined slope. The height of the end of the blocking block 41 close to the chassis 1 is lower than the height of the end away from the chassis 1. Specifically, the longitudinal section of the blocking block 41 is trapezoidal. In this way, when the blocking block 41 enters the chassis 1, the lower end contacts the elastic limiting mechanism 5 first, and the elastic limiting mechanism 5 does not prevent the blocking block 41 from entering the chassis 1; when the blocking block 41 is about to leave the chassis 1, the side wall of the higher end directly abuts against the elastic limiting mechanism 5, and the elastic limiting mechanism blocks the blocking block 41 from sliding out of the chassis 1.

[0058] According to another embodiment of the present invention, as Figures 5-6As shown in the figure, the elastic limit mechanism 5 includes a fixed seat 51 fixed on the machine cover 2, a shaft assembly 52 detachably installed on the fixed seat 51, a limit assembly 53 rotatably sleeved on the shaft assembly 52, and a spring 54 installed between the limit assembly 53 and the fixed seat 51. The limit assembly 53 is in contact and cooperation with the blocking block 41. The limit assembly 53 can rotate on the shaft assembly 52. At the same time, the spring 54 provides a restoring force for the limit assembly 53 to ensure good cooperation between the limit assembly 53 and the blocking block 41. The fixed seat 51 includes a fixed block 511. A limit groove 513 for limiting the limit assembly 53 is formed on the fixed block 511. The shaft assembly 52 penetrates through the fixed block 511 and the limit groove 513 and is detachably connected to the fixed block 511. The limit assembly 53 is rotatably sleeved on the shaft assembly 52 and rotates within the limit groove 513. The limit groove 513 limits the limit assembly 53, so that the limit assembly 53 can only rotate on the shaft assembly 52 and cannot translate, ensuring that the limit assembly 53 is always on the moving path of the blocking block 41.

[0059] As Figures 7-9 shown, a shaft hole 514 communicating with the limit groove 513 is formed on the fixed block 511, and a mounting hole 515 communicating with the limit groove 513 is formed on the fixed block 511. The extension line of the central axis of the shaft hole 514 coincides with the extension line of the central axis of the mounting hole 515. The shaft hole 514 and the mounting hole 515 are respectively located on both sides of the limit groove 513. The limit assembly 53 includes a positioning shaft 521 inserted into the shaft hole 514 and a mounting bolt 522 inserted into the mounting hole 515. A threaded hole matching with the mounting bolt 522 is formed at one end of the positioning shaft 521 close to the mounting bolt 522. The mounting bolt 522 is inserted into the threaded hole and is threadedly connected to the positioning shaft 521. It is convenient to disassemble and assemble. The limit assembly 53 is rotatably sleeved on the positioning shaft 521. The limit assembly 53 includes a limit plate 531 rotatably sleeved on the positioning shaft 521. A positioning hole 533 is formed through the limit plate 531, and the positioning shaft 521 penetrates through the positioning hole 533. A first accommodation groove 512 is formed on the fixed block 511, and a second accommodation groove 532 corresponding to the first accommodation groove 512 is formed on the limit plate 531. The spring 54 is installed in the first accommodation groove 512 and the second accommodation groove 532. The two ends of the spring 54 are respectively connected to the fixed block 511 and the limit plate 531. The spring 54 plays a role in resetting the limit plate 531. When the blocking block 41 enters the chassis 1 and the limit plate 531 rotates on the positioning shaft 521 due to abutting against the blocking block 41, the spring 54 is stretched and applies a pulling force (restoring force) to the limit plate 531. Once the abutting force of the blocking block 41 on the limit plate 531 disappears, the spring 54 will pull the phase plate to reset, so that the limit plate 531 abuts against the upper end of the blocking block 41, preventing the blocking block 41 from leaving the chassis 1.

[0060] In an embodiment of the present invention, as Figure 2As shown in the figure, the storage mechanism 3 includes a storage board 31 slidably connected to the inner wall of the chassis 1, an end plate 32 installed at one end of the storage board 31 away from the chassis 1, and a handle 33 installed on the end plate 32. A storage groove for holding wafers is formed through the storage board 31 to facilitate the placement of wafers. Two through holes 34 communicating with the storage groove are symmetrically formed through the storage board 31 to facilitate the user to insert fingers to take out the wafers.

[0061] As Figure 3 shown in the figure, the machine cover 2 is hinged to the chassis 1 through a hinge. The material of the chassis 1 is iron. A magnet for adsorbing the top of the chassis 1 is installed at one end of the side wall of the machine cover 2 close to the chassis 1 away from the hinge, ensuring that when the machine cover 2 is closed, the machine cover 2 is tightly connected to the chassis 1, and it can only be opened when an upward pulling force is applied to the machine cover 2, preventing the machine cover 2 from easily separating from the chassis 1 during the working process.

[0062] Working principle / usage method of the present invention:

[0063] Open the machine cover 2, hold the handle 33 by hand, and pull out the storage board 31. The ultraviolet lamp 6 is exposed. The staff can repair or replace the ultraviolet lamp 6. After ensuring that the ultraviolet lamp 6 can work normally, close the machine cover 2. The staff puts the wafers to be processed into the storage groove on the storage board 31, and then holds the handle 33 and applies a thrust force towards the chassis 1. The lower end of the blocking block 41 abuts against the limiting plate 531. As the storage board 31 moves into the chassis 1, until the upper end of the blocking block 41 abuts against the limiting plate 531. During this process, the limiting plate 531 rotates around the positioning shaft 521, and the spring 54 stretches. When the limiting plate 531 disengages from the upper end of the blocking block 41, the spring 54 pulls the limiting plate 531 to rotate back to its original position, and the limiting plate 531 abuts against the lower end of the next adjacent blocking block 41. Repeat the previous actions until the storage board 31 completely enters the chassis 1, and the ultraviolet lamp 6 irradiates the wafers on the storage board 31. During the processing, the end of the upper end of the limiting plate 531 abuts against the blocking block 41 and will not easily rotate, achieving the purpose of restricting the blocking block 41 from moving towards the side away from the chassis 1, thereby achieving the purpose of preventing the storage board 31 from sliding out of the chassis 1, effectively preventing the wafers from accidentally leaving the irradiation area of the ultraviolet lamp 6 during the debinding process, and ensuring the normal progress of the debinding work.

[0064] In the present invention, unless otherwise clearly specified and limited, for example, it can be fixedly connected, detachably connected, or integrated; it can be mechanically connected, electrically connected; it can be directly connected, or indirectly connected through an intermediate medium. It can be the communication inside two components or the interaction relationship between two components. Unless otherwise clearly limited, for those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0065] The above are the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A wafer UV debonding machine, characterized in that: It includes: A chassis (1) with an opening at the top; An ultraviolet lamp (6) disposed inside the chassis (1); A placing mechanism (3) movably penetrating through the side wall of the chassis (1), the placing mechanism (3) being slidably connected to the inner wall of the chassis (1) and sliding in and out of the chassis (1), the placing mechanism (3) being located above the ultraviolet lamp (6) and used for holding wafers; A machine cover (2) disposed on the top of the chassis (1), one end of the machine cover (2) being hinged to the chassis (1); A blocking mechanism (4) disposed along the sliding direction of the placing mechanism (3) on the top of the placing mechanism (3), the blocking mechanism (4) including a number of blocking blocks (41) connected in sequence; An elastic limiting mechanism (5) disposed on the machine cover (2), the elastic limiting mechanism (5) cooperating with the blocking mechanism (4), the elastic limiting mechanism (5) not hindering the movement of the blocking block (41) toward the side close to the chassis (1), and the elastic limiting mechanism (5) hindering the movement of the blocking block (41) toward the side away from the chassis (1); The top of the blocking block (41) has an inclined slope, and the height of the end of the blocking block (41) close to the chassis (1) is lower than the height of the end away from the chassis (1); The elastic limiting mechanism (5) includes a fixed seat (51) disposed on the machine cover (2), a shaft assembly (52) detachably disposed on the fixed seat (51), a limiting assembly (53) rotatably sleeved on the shaft assembly (52), and a spring (54) installed between the limiting assembly (53) and the fixed seat (51); The limiting assembly 53 is in contact and cooperation with the blocking block 41, the limiting assembly 53 can rotate on the shaft assembly 52, and at the same time, the spring 54 provides a restoring force to the limiting assembly 53 to ensure good cooperation between the limiting assembly 53 and the blocking block 41.

2. A wafer UV debonding machine according to claim 1, characterized in that: The fixed seat (51) includes a fixed block (511), a limiting groove (513) for limiting the limiting assembly (53) is formed on the fixed block (511), the shaft assembly (52) penetrates through the fixed block (511) and the limiting groove (513) and is detachably connected to the fixed block (511), and the limiting assembly (53) is rotatably sleeved on the shaft assembly (52) and rotates in the limiting groove (513).

3. A wafer UV debonding machine according to claim 2, characterized in that: An axial hole (514) communicating with the limiting groove (513) is formed in the fixed block (511), and a mounting hole (515) communicating with the limiting groove (513) is formed in the fixed block (511). The extension line of the central axis of the axial hole (514) coincides with the extension line of the central axis of the mounting hole (515). The axial hole (514) and the mounting hole (515) are respectively located on both sides of the limiting groove (513). The limiting component (53) includes a positioning shaft (521) arranged in the axial hole (514) and a mounting bolt (522) arranged in the mounting hole (515). A threaded hole matching with the mounting bolt (522) is formed at one end of the positioning shaft (521) close to the mounting bolt (522). The limiting component (53) is rotatably sleeved on the positioning shaft (521).

4. A wafer UV degumming machine according to claim 3, characterized in that: An axial hole (514) communicating with the limiting groove (513) is formed in the fixed block (511), and a mounting hole (515) communicating with the limiting groove (513) is formed in the fixed block (511). The extension line of the central axis of the axial hole (514) coincides with the extension line of the central axis of the mounting hole (515). The axial hole (514) and the mounting hole (515) are respectively located on both sides of the limiting groove (513). The limiting component (53) includes a positioning shaft (521) arranged in the axial hole (514) and a mounting bolt (522) arranged in the mounting hole (515). A threaded hole matching with the mounting bolt (522) is formed at one end of the positioning shaft (521) close to the mounting bolt (522). The limiting component (53) is rotatably sleeved on the positioning shaft (521).

5. A wafer UV degumming machine according to claim 1, characterized in that: The placing mechanism (3) includes a placing plate (31) slidably connected to the inner wall of the chassis (1), an end plate (32) arranged at one end of the placing plate (31) away from the chassis (1), and a handle (33) arranged on the end plate (32). A placing groove for containing wafers is formed through the placing plate (31).

6. A wafer UV degumming machine according to claim 5, characterized in that: An opening (34) communicating with the placing groove is formed through the placing plate (31).

7. A wafer UV degumming machine according to claim 1, characterized in that: The machine cover (2) is hinged to the chassis (1) through a hinge. The chassis (1) is made of iron. A magnet for adsorbing the top of the chassis (1) is arranged at one end of the side wall of the machine cover (2) close to the chassis (1) and away from the hinge.

Images