A method for manufacturing a transfer test board, a transfer test board and a test mechanism

Abstract

The present application discloses a method for manufacturing a transfer test board, a transfer test board and a test mechanism. The method for manufacturing the transfer test board includes: providing a preset first circuit board and a second circuit board, wherein the first circuit board is provided with a first conductive circuit layer, and the second circuit board is provided with a second conductive circuit layer; wherein the first circuit board and / or the second conductive circuit board is also provided with a component mounting portion electrically connected to the component to be detected; the component mounting portion is electrically connected to the first conductive circuit layer and / or the second conductive circuit layer; the first conductive circuit layer and the second conductive circuit layer are electrically connected by a conductive wire; and a flexible fixing layer is provided between the first circuit board and the second circuit board to fix the first circuit board and the second circuit board.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic component testing devices, and in particular, relates to a manufacturing method of a transfer test board, a transfer test board, and a testing mechanism. Background Art

[0002] In the testing field of electronic components such as chips, an adapter board can be set up, and multiple mounting parts can be set on the adapter board, so that multiple electronic components to be tested can be installed through the multiple mounting parts, and then the testing device is electrically connected to the adapter board, so that the multiple electronic components installed on the adapter board can be tested synchronously, thereby improving the testing efficiency.

[0003] In the prior art, the mounting portion on the adapter board usually needs to be provided with a test probe to connect the electronic component to be tested, such as a Pogo Pin test probe. However, since the Pogo Pin test probe has a weak ability to transmit high-frequency detection signals, it may cause inaccurate testing of electronic components. In addition, the Pogo Pin test probe is large in size and requires a large installation position on the adapter board, which will affect the wiring on the adapter board, reduce the layout utilization of the adapter board, and increase the cost. Summary of the invention

[0004] The present application provides a manufacturing method of a transfer test board, a transfer test board and a testing mechanism to solve the above-mentioned technical problems.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a method for manufacturing a transfer test board, comprising:

[0006] A preset first circuit board and a second circuit board are provided, wherein a first conductive circuit layer is provided on the first circuit board, and a second conductive circuit layer is provided on the second circuit board; wherein the first circuit board and / or the second conductive circuit board are further provided with a component mounting portion electrically connected to the electronic component to be detected; and the component mounting portion is electrically connected to the first conductive circuit layer and / or the second conductive circuit layer;

[0007] Using a conductive wire to electrically connect the first conductive circuit layer and the second conductive circuit layer;

[0008] A flexible fixing layer is provided between the first circuit board and the second circuit board to fix the first circuit board and the second circuit board.

[0009] Optionally, a through hole is provided on the first circuit board and / or the second circuit board;

[0010] The step of electrically connecting the first conductive circuit layer and the second conductive circuit layer using a conductive wire comprises:

[0011] One end of the conductive wire is electrically connected to the first conductive circuit layer, and the other end of the conductive wire is electrically connected to the second conductive circuit layer after passing through at least one of the through holes.

[0012] Optionally, the step of providing a flexible fixing layer between the first circuit board and the second circuit board includes:

[0013] Space the first circuit board and the second circuit board by a preset distance;

[0014] A flexible material is filled between the first circuit board and the second circuit board, and is cured to form the flexible fixing layer.

[0015] Optionally, a through hole is provided on the first circuit board and / or the second circuit board;

[0016] The step of electrically connecting the first conductive circuit layer and the second conductive circuit layer using a conductive wire comprises:

[0017] One end of the conductive wire is electrically connected to the first conductive circuit layer, and the other end of the conductive wire is electrically connected to the second conductive circuit layer after passing through at least one of the through holes;

[0018] After the step of spacing the first circuit board and the second circuit board by a preset distance; and before the step of filling the space between the first circuit board and the second circuit board with a flexible material, the method further includes:

[0019] A conductive packaging layer is provided at the opening of the through hole on the side of the first circuit board and / or the second circuit board away from each other, and the conductive packaging layer covers the portion of the conductive wire outside the through hole and is electrically connected to the conductive wire.

[0020] Optionally, the step of electrically connecting the first conductive circuit layer and the second conductive circuit layer using a conductive wire includes:

[0021] The opposite ends of the conductive wire are respectively fixed to the first conductive circuit layer and the second conductive circuit layer by welding.

[0022] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide a transfer test board, the transfer test board comprising:

[0023] A first circuit board, a flexible fixing layer, and a second circuit board are sequentially stacked; the first circuit board is provided with a first conductive circuit layer, and the second circuit board is provided with a second conductive circuit layer; the first conductive circuit layer and / or the second conductive circuit layer are provided with a component mounting portion for electrical connection of a component to be detected; and

[0024] A conductive wire, one end of which is electrically connected to the first conductive circuit layer, and the other end of which passes through the flexible fixing layer and is electrically connected to the second conductive circuit layer.

[0025] Optionally, a through hole is provided on the first circuit board and / or the second circuit board;

[0026] One end of the conductive line is electrically connected to the first conductive circuit layer, and the other end thereof is electrically connected to the second conductive circuit layer after passing through at least one of the through holes.

[0027] Optionally, a conductive packaging layer is further provided on the transfer test board, and the conductive packaging layer is provided on a side of the first circuit board and / or the second circuit board away from each other, and covers the opening of the through hole;

[0028] The conductive wire is partially accommodated in the conductive packaging layer and is electrically connected to the conductive packaging layer.

[0029] Optionally, the conductive wire is a gold wire.

[0030] Optionally, the thickness of the flexible fixing layer is 0.1-5 mm; and the flexible fixing layer is made of silicone.

[0031] In order to solve the above technical problems, a technical solution adopted in the present application is: providing a testing mechanism, the testing mechanism comprising a testing device and a transfer test board as described above;

[0032] The component mounting portion is used to connect the electronic component to be tested;

[0033] The testing device is electrically connected to the first conductive circuit layer and / or the second conductive circuit layer to send a testing signal to the electronic component to be tested and detect the electronic component to be tested.

[0034] The beneficial effects of the present application are as follows: in the above scheme of the present application, a first conductive circuit layer on a first circuit board and a second conductive circuit layer on a second circuit board are electrically connected by a conductive wire, so that signal transmission between the first conductive circuit layer and the second conductive circuit layer can be realized, and high-frequency test signals can be transmitted through the conductive wire; further, by connecting the first conductive circuit layer and the second conductive circuit layer by a conductive wire, since the diameter of the conductive wire is small, the aperture of the mounting hole thereof can be reduced, thereby improving the layout utilization rate of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0036] Figure 1 It is a structural schematic diagram of an embodiment of a test board in the prior art;

[0037] Figure 2 It is a flow chart of an embodiment of a method for manufacturing a transfer test board provided by the present application;

[0038] Figure 3a-3c It is a flowchart of a specific embodiment of the method for manufacturing the transfer test board provided by the present application;

[0039] Figure 4 It is a structural schematic diagram of an embodiment of a transfer test board provided in the present application. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0042] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0043] See also Figure 1 , Figure 1It is a structural schematic diagram of an embodiment of a test board in the prior art.

[0044] Among them, the test board 10 includes a circuit board 110, and a component mounting portion is provided on the circuit board 110 for mounting the electronic component to be tested, wherein a test probe 120 is provided in the component mounting portion, and the test probe 120 can be used to be electrically connected to the electronic component, so that a test signal can be sent to the electronic component through the test probe 120 to test the electronic component.

[0045] Among them, in the existing solution, when the electronic component to be tested is a component such as a chip, in order to make the component such as the chip pluggable and installed on the component mounting portion, the test probe 120 can also be set inside the circuit board 110.

[0046] The test probe 120 may generally be a Pogo Pin probe. That is, the test probe 120 may include a fixing portion 121, an elastic portion 122, and a contact 123. The fixing portion 121 may be fixedly connected to the circuit board 110 and electrically connected to the conductive circuit on the circuit board 110, the contact 123 may be elastically connected to the fixing portion 121 through the elastic portion 122, and the fixing portion 121 may be electrically connected to the contact 123, and the contact 123 may be exposed from the circuit board 110 and electrically connected to the electronic component. Therefore, the electronic component may be electrically connected to the conductive circuit on the circuit board 110 through the contact 123 and the fixing portion 121.

[0047] Through the above solution, when components such as chips are installed on the component installation part, the pressure of pressing and installing the components such as chips can be buffered by the elastic part 122, thereby avoiding damage to the components on the circuit board. However, when a Pogo Pin probe is used as the test probe 120, the Pogo Pin probe has limited ability to transmit high-frequency test signals, and the use of the Pogo Pin probe will result in excessively high production costs for the test board 10.

[0048] In order to solve the above technical problems, the present application provides a method for manufacturing a transfer test board. Figure 2 , Figure 2 It is a flow chart of an embodiment of a method for manufacturing a transfer test board provided in the present application.

[0049] The manufacturing method of the transfer test board specifically includes the following steps:

[0050] S210: Provide a preset first circuit board and a second circuit board, wherein a first conductive circuit layer is arranged on the first circuit board, and a second conductive circuit layer is arranged on the second circuit board; wherein the first circuit board and / or the second conductive circuit board are also provided with a component mounting portion electrically connected to the component to be detected; and the component mounting portion is electrically connected to the first conductive circuit layer and / or the second conductive circuit layer.

[0051] In this step, it is necessary to understand that the first conductive circuit layer on the first circuit board may include multiple conductive circuits, and the multiple conductive circuits may constitute a preset conductor pattern; the second conductive circuit layer on the second circuit board may also include multiple conductive circuits, and the multiple conductive circuits may constitute a conductor pattern that is the same as or different from that described above.

[0052] When the component mounting portion is disposed on the first circuit board, the component mounting portion is electrically connected to the conductive circuit in the first conductive circuit layer; when the component mounting portion is disposed on the second circuit board, the component mounting portion is electrically connected to the conductive circuit in the second conductive circuit layer.

[0053] S220: electrically connecting the first conductive circuit layer and the second conductive circuit layer using a conductive wire.

[0054] In this step, the first conductive circuit layer and the second conductive circuit layer can be electrically connected through a conductive wire. Specifically, one end of the conductive wire can be electrically connected to at least one conductive circuit in the first conductive circuit layer, and the other end of the conductive wire can be electrically connected to at least one conductive circuit in the second conductive circuit layer, so that the first conductive circuit layer and the second conductive circuit layer can be electrically connected.

[0055] The two opposite ends of the conductive wire may be fixedly connected to the conductive circuits in the first conductive circuit layer and the second conductive circuit layer by welding, or may be fixedly connected by bonding with a conductive adhesive.

[0056] S230: Disposing a flexible fixing layer between the first circuit board and the second circuit board to securely connect the first circuit board and the second circuit board.

[0057] After completing step S220, the first circuit board and the second circuit board may be further fixedly connected.

[0058] Specifically, a flexible fixing layer may be provided between the first circuit board and the second circuit board so that the first circuit board and the second circuit board are fixedly connected, and the first circuit board and the second circuit board may be respectively connected to opposite sides of the flexible fixing layer.

[0059] The flexible fixing layer may be made of a flexible material such as silica gel, so that the first circuit board and the second circuit board are elastically connected.

[0060] Therefore, the above scheme adopts a method of setting a flexible fixed layer between the first circuit board and the second circuit board to elastically connect the first circuit board and the second circuit board, so that when the electronic component to be tested is installed on the first circuit board and / or the second circuit board, the pressure of the electronic component during pressing and installing can be buffered by the flexible fixed layer, thereby avoiding damage to the components; and the first conductive circuit layer on the first circuit board and the second conductive circuit layer on the second circuit board are electrically connected by conductive wires, so that signal transmission between the first conductive circuit layer and the second conductive circuit layer can be achieved, and high-frequency test signals can be transmitted through the conductive wires; further, by connecting the first conductive circuit layer and the second conductive circuit layer with conductive wires, since the diameter of the conductive wires is small, the aperture of its mounting hole can be reduced, thereby improving the layout utilization rate of the circuit board.

[0061] In order to more intuitively describe the manufacturing method of the transfer test board of the present application, the present application is further described in conjunction with a specific embodiment, please refer to Figure 3a-3c , Figure 3a-3c It is a flow chart of a specific embodiment of the method for manufacturing the transfer test board provided in the present application.

[0062] 1. Prepare the first circuit board and the second circuit board. For details, please refer to Figure 3a , a first conductive circuit layer 311 is disposed on the first circuit board 310, and a second conductive circuit layer 321 is disposed on the second circuit board 320. The first circuit board 310 and / or the second circuit board 320 are further provided with a component mounting portion 301 electrically connected to the component to be detected; and the component mounting portion 301 is electrically connected to the first conductive circuit layer 311 and / or the second conductive circuit layer 321.

[0063] The single-layer circuit boards in the first circuit board 310 and the second circuit board 320 may also be multi-layer circuit boards.

[0064] Taking the first circuit board 310 as an example, when the first circuit board 310 is a single-layer circuit board, the first circuit board 310 may include a substrate 312 and a first conductive layer 311, wherein the first conductive layer 311 is disposed on one side of the substrate. Alternatively, the first circuit board 310 may also include a substrate 312 and two first conductive layers 311, wherein the two first conductive layers 311 are disposed on opposite sides of the substrate 312. When the first circuit board 310 is a single-layer circuit board, the first circuit board 310 may be formed by alternately and stacking multiple layers of substrates 312 and multiple layers of first conductive layers 311.

[0065] Similar to the above step S210 , each first conductive layer 311 may include a plurality of conductive circuits, and the plurality of conductive circuits may form a preset conductive line pattern.

[0066] 2. Use conductive wires to electrically connect the first conductive circuit layer and the second conductive circuit layer. For details, please refer to Figure 3b In this step, through holes 302 may be provided on the first circuit board 310 and / or the second circuit board 320 , one end of the conductive wire 330 may be electrically connected to the first conductive circuit layer 311 , and the other end of the conductive wire 330 may be electrically connected to the second conductive circuit layer 321 after passing through at least one through hole 302 .

[0067] For example, Figure 3b As shown, the first conductive layer 311 on the first circuit board 310 is arranged on the side of the first circuit board 310 away from the second circuit board 320; the second conductive layer 321 is arranged on the side close to the first circuit board 310, and the through hole 302 is opened on the first circuit board 310, then one end of the conductive wire 330 can be electrically connected to the first conductive layer 311, and the other end passes through the through hole 302 and then is electrically connected to the second conductive layer 321.

[0068] It can be understood that in other embodiments, the first conductive layer 311 on the first circuit board 310 can be set on the side of the first circuit board 310 away from the second circuit board 320; the second conductive layer 321 on the second circuit board 320 can be set on the side of the second circuit board 320 away from the first circuit board 310. In this case, through holes 302 are provided on both the first circuit board 310 and the second circuit board 320, and one end of the conductive wire 330 can be electrically connected to the first conductive layer 311, and the other end passes through the through holes 302 on the first circuit board 310 and the second circuit board 320 in sequence and then is electrically connected to the second conductive layer 321.

[0069] In other embodiments, the first conductive layer 311 and the second conductive layer 321 may be disposed on the first circuit board 310 and the second circuit board 320 facing each other. In this case, the first circuit board 310 and the second circuit board 320 do not need to be provided with through holes 302 for the conductive wires 330 to pass through.

[0070] In order to prevent the conductive wire 330 from falling off and causing a circuit break, in some embodiments, the opposite ends of the conductive wire 330 can be welded and fixed to the conductive circuits in the first conductive circuit layer 311 and the second conductive circuit layer 321, respectively, or can be fixed by bonding with a conductive adhesive.

[0071] 3. A flexible fixing layer is provided between the first circuit board and the second circuit board to fix the first circuit board and the second circuit board. Figure 3cAfter the first conductive layer 311 and the second conductive layer 321 are electrically connected by the conductive wire 330, the first circuit board 310 and the second circuit board 320 can be separated to a preset spacing distance, that is, the first circuit board 310 and the second circuit board 320 are spaced apart (at this time, it is necessary to ensure that the first conductive layer 311 and the second conductive layer 321 are in an electrically connected state through the conductive wire 330). Then, a flexible material is filled in the spacing area between the first circuit board 310 and the second circuit board 320, and the flexible material is cured to form a flexible fixed layer 340. The conductive wire 330 can then pass through the flexible fixed layer 340.

[0072] In this step, the spacing between the first circuit board 310 and the second circuit board 320 can be adjusted so that the formed flexible fixed layer 340 has a preset thickness. For example, the spacing between the first circuit board 310 and the second circuit board 320 can be set to 0.1-5 mm. For example, the spacing between the first circuit board 310 and the second circuit board 320 can be set to 0.1 mm, 1 mm, 3 mm or 5 mm, etc.

[0073] It can be understood that the flexible fixing layer 340 has a certain elasticity, so that the first circuit board 310 and the second circuit board 320 can be elastically connected. In one embodiment, the flexible material can be silicone rubber or the like.

[0074] Please read further Figure 3c In some other embodiments, after the step of spacing the first circuit board 310 and the second circuit board 320 by a preset distance; and before the step of filling the flexible material between the first circuit board 310 and the second circuit board 320, a conductive packaging layer 350 may be firstly covered at the opening of the through hole 302 on the side away from each other of the first circuit board 310 and / or the second circuit board 320. The conductive packaging layer 350 may at least partially cover the conductive circuit connected to the conductive wire 330 and be electrically connected to the conductive wire 330. In this scheme, the conductive packaging layer 350 is used to cover the opening of the through hole 302, so as to prevent the problem of the flexible material overflowing from the through hole 302 when the flexible material is subsequently filled between the first circuit board 310 and the second circuit board 320. Furthermore, by setting the conductive packaging layer 350 to cover the conductive wire 330 and electrically connected to the conductive wire 330, the conductive packaging layer 350 can form a flat component mounting portion to avoid the problem that the height difference caused by the connection between the conductive wire 330 and the conductive circuit may cause damage to the electronic component when installing the electronic component.

[0075] Optionally, one end of the conductive wire 330 may be buried in the conductive packaging layer 350 , or may be configured to be partially exposed from the conductive packaging layer 350 .

[0076] In the above embodiments, the first conductive layer 311 and the second conductive layer 321 are electrically connected by the conductive wire 330 , and then the flexible material is filled between the first circuit board 310 and the second circuit board 320 .

[0077] In other embodiments, a flexible material may be first filled between the first circuit board 310 and the second circuit board 320 to form a flexible fixing layer 340 so that the first circuit board 310 and the second circuit board 320 are elastically connected; and then the first conductive layer 311 and the second conductive layer 321 are electrically connected using a conductive wire 330. In one embodiment, after the flexible fixing layer 340 is formed, a through hole may be opened in the flexible fixing layer 340; and then one end of the conductive wire 330 is electrically connected to the first conductive layer 311, and the other end of the conductive wire 330 is electrically connected to the second conductive layer 321 after passing through the through hole.

[0078] Another aspect of the present application also provides a transfer test board. Figure 4 , Figure 4 It is a structural schematic diagram of an embodiment of a transfer test board provided by the present application. The transfer test board 40 provided by the present application includes a first circuit board 410, a flexible fixing layer 440 and a second circuit board 420 which are stacked in sequence. The first circuit board 410 is provided with a first conductive circuit layer 411, and the second circuit board 420 is provided with a second conductive circuit layer 421; the first conductive circuit layer 411 and / or the second conductive circuit layer 421 are provided with a component mounting portion for electrical connection of the component to be tested. The first conductive circuit layer 411 and the second conductive circuit layer 421 can be electrically connected through a conductive wire 430.

[0079] Specifically, one end of the conductive wire 430 is electrically connected to the first conductive circuit layer 411 , and the other end thereof passes through the flexible fixing layer 440 and is electrically connected to the second conductive circuit layer 421 .

[0080] In some embodiments, a through hole 402 may be opened on the first circuit board and 410 / or the second circuit board 420, one end of the conductive wire 430 is electrically connected to the first conductive circuit layer 411, and the other end may pass through the through hole 402 and the flexible fixing layer 440 and then be electrically connected to the second conductive circuit layer 421.

[0081] Furthermore, a conductive packaging layer 450 may be provided on the transfer test board 40, and the conductive packaging layer 450 may be provided on the side away from the first circuit board and 410 / or the second circuit board 420, and cover the opening of the through hole 402; the conductive wire 430 is partially accommodated in the conductive packaging layer 450 and is electrically connected to the conductive packaging layer 450. The specific structure of the conductive packaging layer 450 and the relationship between the conductive wire 430 and the conductive wire 430 can be specifically referred to in the above text, and will not be described in detail here.

[0082] In some embodiments, the conductive wire 430 may be a gold wire.

[0083] In some embodiments, the thickness of the flexible fixing layer 440 is 0.1-5 mm. More specifically, in one embodiment, the flexible fixing layer 440 can be made of silicone rubber, and the thickness can be 0.1-5 mm.

[0084] In another aspect of the present application, a testing mechanism is provided, wherein the testing mechanism may include a testing device and a transfer test board 40 as described above, wherein a plurality of component mounting portions may be provided on the first conductive circuit layer 411 and / or the second conductive circuit layer 421 on the transfer test board 40 for mounting and electrically connecting electronic components. The transfer test board 40 may be electrically connected to the testing device, so that the testing device may send a test signal to the electronic component to be tested through the transfer test board 40, and detect the electronic component to be tested. Since the test mechanism of the present application includes the above-mentioned transfer test board 40, based on the above-mentioned analysis of the beneficial effects of the transfer test board 40, during the test, the test mechanism of the present application elastically connects the first circuit board and the second circuit board by setting a flexible fixed layer between the first circuit board and the second circuit board, so that when the electronic component to be tested is installed on the first circuit board and / or the second circuit board, the pressure of the electronic component during pressing and installing can be buffered by the flexible fixed layer, thereby avoiding damage to the components; and the first conductive circuit layer on the first circuit board and the second conductive circuit layer on the second circuit board are electrically connected by conductive wires, so that signal transmission between the first conductive circuit layer and the second conductive circuit layer can be achieved, and high-frequency test signals can be transmitted through the conductive wires; further, by connecting the first conductive circuit layer and the second conductive circuit layer by conductive wires, since the diameter of the conductive wires is small, the aperture of the mounting hole can be reduced, thereby improving the layout utilization rate of the circuit board.

[0085] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for manufacturing a transfer test board, include: A preset first circuit board and a second circuit board are provided, wherein a first conductive circuit layer is provided on the first circuit board, and a second conductive circuit layer is provided on the second circuit board; wherein the first circuit board and / or the second circuit board are further provided with a component mounting portion electrically connected to the electronic component to be detected; the component mounting portion is electrically connected to the first conductive circuit layer and / or the second conductive circuit layer; characterized in that, The first conductive circuit layer and the second conductive circuit layer are electrically connected by conductive wires; wherein the first circuit board and / or the second circuit board are provided with through holes; the step of electrically connecting the first conductive circuit layer and the second conductive circuit layer by conductive wires comprises: One end of the conductive wire is electrically connected to the first conductive circuit layer, and the other end of the conductive wire is electrically connected to the second conductive circuit layer after passing through at least one of the through holes; A flexible fixing layer is provided between the first circuit board and the second circuit board to fix the first circuit board and the second circuit board, wherein the step of providing the flexible fixing layer between the first circuit board and the second circuit board comprises: A conductive packaging layer is provided at the opening of the through hole on the first circuit board and / or the second circuit board away from each other, the conductive packaging layer covers the portion of the conductive wire outside the through hole and is electrically connected to the conductive wire, and the conductive packaging layer further forms the component mounting portion; A flexible material is filled between the first circuit board and the second circuit board, and is cured to form the flexible fixing layer.

2. The manufacturing method according to claim 1, It is characterized in that Before the step of covering the opening of the through hole on the first circuit board and / or the second circuit board away from each other with a conductive packaging layer, wherein the conductive packaging layer covers the portion of the conductive wire outside the through hole and is electrically connected to the conductive wire, the step further includes: The first circuit board and the second circuit board are spaced apart by a preset distance.

3. The manufacturing method according to any one of claims 1 to 2, It is characterized in that The step of electrically connecting the first conductive circuit layer and the second conductive circuit layer using a conductive wire comprises: The opposite ends of the conductive wire are respectively fixed to the first conductive circuit layer and the second conductive circuit layer by welding.

4. A transfer test board, It is characterized in that The transfer test board comprises: A first circuit board, a flexible fixing layer, and a second circuit board are stacked in sequence; the first circuit board is provided with a first conductive circuit layer, and the second circuit board is provided with a second conductive circuit layer; the first conductive circuit layer and / or the second conductive circuit layer are provided with a component mounting portion for electrical connection of a component to be detected; the first circuit board and / or the second circuit board are provided with a through hole; and A conductive wire, one end of which is electrically connected to the first conductive circuit layer, and the other end of which is electrically connected to the second conductive circuit layer after passing through at least one of the through holes and the flexible fixing layer; The transfer test board is also provided with a conductive packaging layer, which is arranged on a side of the first circuit board and / or the second circuit board away from each other and covers the opening of the through hole; The conductive wire portion is accommodated in the conductive packaging layer and is electrically connected to the conductive packaging layer, and the conductive packaging layer further forms the component mounting portion.

5. The transfer test board according to claim 4, It is characterized in that The conductive wire is a gold wire.

6. The transfer test board according to claim 4, It is characterized in that The thickness of the flexible fixing layer is 0.1-5 mm; the flexible fixing layer is made of silicone.

7. A testing organization, It is characterized in that The testing mechanism comprises a testing device and a transfer testing board as claimed in any one of claims 4 to 6; The component mounting portion is used to connect the electronic component to be tested; The testing device is electrically connected to the first conductive circuit layer and / or the second conductive circuit layer to send a testing signal to the electronic component to be tested and detect the electronic component to be tested.

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