A shock absorbing structure for acoustic mould
By using shock absorbing devices such as engaging seats, telescopic columns, support plates and buffer pads in the audio mold, the problem of offsetting the position of the moving mold and the fixed mold when the mold is closed is solved, and the smooth closing and opening of the mold is achieved. Avoid deformation of the audio model.
Patent Information
- Application Number
- CN202210706501.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-21
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2042-06-21
AI Technical Summary
When the shock-absorbing structure of existing audio molds is closed, the movable die extrusion spring to the limit will cause the positional deviation between the movable die and the fixed die, causing the injection molded audio model to be deformed.
The shock absorbing device is adopted that includes components such as engaging seats, telescopic columns, support plates, return springs, and buffer pads. The return spring is squeezed through the moving die and the support plate is supported by the buffer pads, so that the return spring continues to shrink. Provides buffering force to prevent vibration between the moving and fixed modes.
Effectively prevent vibration between the moving mold and the fixed mold, avoid deformation of the audio model, ensure smooth closing and opening of the mold, and improve injection molding accuracy.
Smart Images
Figure CN115157558B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of audio and optical disks, in particular to a shock absorbing structure for an audio mould. Background Art
[0002] When the acoustic mold is being injected, the mold needs to be opened and closed. After the mold is closed, injection molding can be carried out so that the plasticizer can cool and form. After the mold is opened, the molded acoustic model can be removed, thus completing the entire processing flow. When the acoustic mold is closed, the movable mold will impact the fixed mold, causing the mold to vibrate, so a shock-absorbing structure is needed to cushion the mold.
[0003] Based on the above, the inventors have found that the existing shock-absorbing structure for an acoustic mold has the following main deficiencies. For example, the shock-absorbing structure uses a spring as a shock-absorbing material. When the mold is closed, the movable mold will squeeze the spring in the fixed mold for buffering. When the movable mold squeezes the spring to the limit, vibration will also occur between the movable mold and the spring, resulting in a positional offset between the movable mold and the fixed mold, causing deformation of the injected acoustic model. Summary of the invention
[0004] In view of the above problems, the present invention provides a shock absorbing structure for an acoustic mould.
[0005] In order to achieve the above-mentioned purpose, the present invention is implemented through the following technical scheme: a shock-absorbing structure for an acoustic mold, which structure includes a base, a main body, and a movable mold. The upper end of the base is provided with a main body, and the movable mold is movably matched with the upper end of the main body. The main body includes a fixed mold, a model groove, an installation groove, and a shock-absorbing device. The fixed mold is installed on the upper end surface of the base, and the model groove is arranged in the middle of the top of the fixed mold. There are two installation grooves, which are respectively arranged at the left and right ends of the fixed mold. There are two shock-absorbing devices, which are respectively vertically installed in the middle of the installation grooves.
[0006] Furthermore, the shock absorbing device includes a snap-fit seat, a telescopic column, a support plate, a return spring, and a buffer pad. The snap-fit seat is embedded in the upper end surface of the mounting groove, the telescopic column is snap-fitted to the upper end of the snap-fit seat, the support plate is embedded in the top end of the telescopic column, the return spring is nested in the outer end surface of the snap-fit seat and is connected to the bottom end surface of the support plate, the buffer pad is arranged at the top side end of the mounting groove, and the support plate is flush with the end surface of the buffer pad.
[0007] Furthermore, the support plate includes a support body, a rubber layer, a hollow groove, a support strip, and a contact pad. The support body is embedded in the top of the telescopic column, the rubber layer is located on the upper end surface of the support body, the hollow groove is arranged between the support body and the rubber layer, seven support strips are provided and are arranged horizontally inside the hollow groove, the contact pad is embedded in the bottom side end of the support body, and the width of the support strip gradually decreases from both ends to the middle.
[0008] Furthermore, the rubber layer includes a rubber block, a deformation groove, and a protruding block. The rubber block is arranged on the upper end surface of the support plate. There are more than five deformation grooves and they are arranged transversely inside the rubber block. There are more than four protruding blocks and they are arranged transversely on the upper end surface of the rubber block. The protruding blocks are in the shape of an arc.
[0009] Furthermore, the raised block includes a frame, a deformation block, and a pull strip. The frame is arranged on the upper end surface of the rubber block, the deformation block is installed in the middle of the frame, three pull strips are provided and arranged vertically inside the deformation block, and the pull strips are made of rubber and are curved.
[0010] Furthermore, the buffer pad includes a cutting groove, a lifting groove, a lifting plate, a buffer pad, and a buffer spring. The cutting groove is arranged at the side end of the mounting groove, the lifting groove is located at the side end of the cutting groove, the lifting plate is transversely engaged in the lifting groove, the buffer pad is attached to the upper end surface of the lifting plate, and two buffer springs are provided, which are respectively arranged at the two ends of the bottom of the lifting plate, and the buffer spring is movably matched with the lifting plate.
[0011] Furthermore, the buffer pad includes a buffer body, a recessed groove, a cavity, and a smooth pad. The buffer body is embedded in the upper end surface of the lifting plate. The recessed grooves are provided with six and are arranged transversely on the upper end surface of the buffer body. The cavity is arranged inside the buffer body. The smooth pad is attached to the top side end of the buffer body. The width of the recessed groove gradually decreases from the upper end to the lower end.
[0012] Furthermore, the recessed groove includes a protective pad, a groove body, and a downward pressure groove. The protective pad is arranged on the upper end surface of the buffer body. The groove body is located at the upper end of the protective pad. There are six downward pressure grooves, which are arranged in groups of three at the left and right ends of the groove body. The shape of the downward pressure groove is triangular.
[0013] Beneficial Effects
[0014] Compared with the prior art, the present invention has the following beneficial effects:
[0015] 1. The present invention utilizes the closing of the movable mold and the fixed mold to buffer the extrusion of the return spring by the movable mold, and then utilizes the buffer pad to support the support plate, so that when the return spring contracts to the limit, the movable mold can also obtain the buffer force again, so that the movable mold can be smoothly closed with the fixed mold, preventing the vibration caused by the collision between the movable mold and the fixed mold, and avoiding the deformation of the injected sound model.
[0016] 2. The present invention utilizes the lifting plate to contact the end surface of the buffer body, so that the buffer body can be deformed into the recessed groove, so that the lifting plate can be buffered, so that when the movable mold squeezes the reset spring to the limit, it will not impact with the fixed mold to cause vibration, thereby avoiding deformation of the injected sound model. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 The present invention is a schematic diagram of the main structure of a shock absorbing structure for an acoustic mould.
[0018] Figure 2 It is a schematic diagram of the main structure of the present invention.
[0019] Figure 3 It is a front view structural schematic diagram of the shock absorbing device of the present invention.
[0020] Figure 4 It is a front view structural schematic diagram of the support plate of the present invention.
[0021] Figure 5 It is a schematic diagram of the front view structure of the rubber layer of the present invention.
[0022] Figure 6 It is a schematic diagram of the front view structure of the protruding block of the present invention.
[0023] Figure 7 It is a schematic diagram of the front view structure of the buffer pad of the present invention.
[0024] Figure 8 It is a schematic diagram of the front view structure of the buffer pad of the present invention.
[0025] Fig. 9 It is a schematic diagram of the front view structure of the concave groove of the present invention.
[0026] In the figure: base 1, main body 2, movable mold 3, fixed mold 21, model groove 22, installation groove 23, shock absorbing device 24, snap-fit seat 241, telescopic column 242, support plate 243, return spring 244, buffer pad 245, support body a1, rubber layer a2, empty groove a3, support strip a4, contact pad a5, rubber block a21, deformation groove a22, raised block a23, frame b1, deformation block b2, pull strip b3, cutting groove c1, lifting groove c2, lifting plate c3, buffer pad c4, buffer spring c5, buffer body c41, recessed groove c42, cavity c43, smooth pad c44, protective pad d1, groove body d2, downward pressure groove d3. DETAILED DESCRIPTION
[0027] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.
[0028] Example 1: Please refer to Figure 1-Figure 6 , the specific embodiments of the present invention are as follows:
[0029] Its structure includes a base 1, a main body 2, and a movable mold 3. The main body 2 is provided at the upper end of the base 1. The movable mold 3 is movably matched with the upper end of the main body 2. The main body 2 includes a fixed mold 21, a model groove 22, a mounting groove 23, and a shock absorbing device 24. The fixed mold 21 is installed on the upper end surface of the base 1, and the model groove 22 is arranged in the middle of the top of the fixed mold 21. There are two mounting grooves 23, which are respectively arranged at the left and right ends of the fixed mold 21. There are two shock absorbing devices 24, which are respectively vertically installed in the middle of the mounting grooves 23.
[0030] The shock absorbing device 24 includes a snap-fit seat 241, a telescopic column 242, a support plate 243, a return spring 244, and a buffer pad 245. The snap-fit seat 241 is embedded in the upper end surface of the mounting groove 23, the telescopic column 242 is snap-fitted to the upper end of the snap-fit seat 241, the support plate 243 is embedded in the top end of the telescopic column 242, the return spring 244 is nested in the outer end surface of the snap-fit seat 241, and is connected to the bottom end surface of the support plate 243. The buffer pad 245 is arranged at the top side end of the mounting groove 23, and the end surfaces of the support plate 243 and the buffer pad 245 are flush, which is conducive to closing the movable mold 3 and the fixed mold 21, so that the movable mold 3 squeezes the return spring 244 to be buffered.
[0031] The support plate 243 includes a support body a1, a rubber layer a2, a slot a3, a support strip a4, and a contact pad a5. The support body a1 is embedded in the top of the telescopic column 242, the rubber layer a2 is located on the upper end surface of the support body a1, the slot a3 is arranged between the support body a1 and the rubber layer a2, seven support strips a4 are provided and are arranged transversely inside the slot a3, the contact pad a5 is embedded in the bottom side end of the support body a1, and the width of the support strip a4 gradually decreases from both ends to the middle, which is conducive to supporting the end surface of the rubber layer a2 through the support strip a4, so that the movable mold 3 can deform toward the slot a3 when squeezing the rubber layer a2.
[0032] The rubber layer a2 includes a rubber block a21, a deformation groove a22, and a protruding block a23. The rubber block a21 is arranged on the upper end surface of the support plate 243. The deformation grooves a22 are provided with more than five and are arranged transversely inside the rubber block a21. The protruding blocks a23 are provided with more than four and are arranged transversely on the upper end surface of the rubber block a21. The protruding blocks a23 are in the shape of an arc, which is conducive to the protruding blocks a23 first contacting with the end surface of the movable mold 3 and then deforming toward the deformation grooves a22 in the rubber block a21.
[0033] The raised block a23 includes a frame b1, a deformation block b2, and a pull strip b3. The frame b1 is arranged on the upper end surface of the rubber block a21, and the deformation block b2 is installed in the middle of the frame b1. Three pull strips b3 are provided and are vertically arranged inside the deformation block b2. The pull strip b3 is made of rubber and is curved, which is conducive to first contacting the end surface of the movable mold 3 through the frame b1, and then using the deformation of the frame b1 to squeeze the deformation block b2, so that the movable mold 3 can obtain a buffering force.
[0034] Based on the above embodiment, the specific working principle is as follows: when the movable mold squeezes the spring to the limit, vibration will also occur between the movable mold and the spring, resulting in a positional offset between the movable mold and the fixed mold. The movable mold 3 and the fixed mold 21 can be closed to allow the movable mold 3 to squeeze the reset spring 244 to be buffered, and then the buffer pad 245 is used to support the support plate 243, so that when the reset spring 244 shrinks to the limit, the movable mold 3 can also obtain a buffering force again, so that the movable mold 3 can be smoothly closed with the fixed mold 21, and then the support strip a4 is used to support the end face of the rubber layer a2, so that when the movable mold 3 squeezes the rubber layer a2, it can be deformed toward the empty groove a3, so that the movable mold 3 can be buffered. The movable mold 3 is punched to prevent vibration when it impacts the fixed mold 21, and then the protruding block a23 is used to contact the end face of the movable mold 3 first, and then the deformation groove a22 in the rubber block a21 is deformed, so that the movable mold 3 and the fixed mold 21 can be buffered when closing to prevent the mold from vibrating. Finally, the frame b1 is used to contact the end face of the movable mold 3 first, and then the frame b1 is deformed to squeeze the deformation block b2, so that the movable mold 3 can obtain a buffering force, and then the pulling strip b3 is used to pull the two ends of the deformation block b2, which can improve the reset performance of the frame b1, so that the frame b1 can be reset in time when the movable mold 3 and the fixed mold 21 are opened.
[0035] Example 2: Please refer to Figure 7-Figure 9 , the specific embodiments of the present invention are as follows:
[0036] The buffer pad 245 includes a cutting groove c1, a lifting groove c2, a lifting plate c3, a buffer pad c4, and a buffer spring c5. The cutting groove c1 is arranged at the side end of the mounting groove 23, the lifting groove c2 is located at the side end of the cutting groove c1, the lifting plate c3 is laterally engaged in the lifting groove c2, the buffer pad c4 is attached to the upper end surface of the lifting plate c3, two buffer springs c5 are provided, and are respectively arranged at the two ends of the bottom of the lifting plate c3, the buffer spring c5 and the lifting plate c3 are movably matched, which is conducive to contacting the bottom end surface of the support plate 243 through the buffer pad c4, and then the buffer force is obtained by squeezing the buffer spring c5 through the lifting plate c3.
[0037] The buffer pad c4 includes a buffer body c41, a recessed groove c42, a cavity c43, and a smooth pad c44. The buffer body c41 is embedded in the upper end surface of the lifting plate c3. There are six recessed grooves c42, which are arranged transversely on the upper end surface of the buffer body c41. The cavity c43 is arranged inside the buffer body c41. The smooth pad c44 is attached to the top side end of the buffer body c41. The width of the recessed groove c42 gradually decreases from the upper end to the lower end, which is conducive to contact between the lifting plate c3 and the end surface of the buffer body c41, so that the buffer body c41 can be deformed into the recessed groove c42.
[0038] The recessed groove c42 includes a protective pad d1, a groove body d2, and a downward pressure groove d3. The protective pad d1 is arranged on the upper end surface of the buffer body c41. The groove body d2 is located at the upper end of the protective pad d1. Six downward pressure grooves d3 are provided, and are arranged in groups of three at the left and right ends of the groove body d2. The shape of the downward pressure groove d3 is triangular, which is conducive to squeezing the end surface of the protective pad d1 into the downward pressure groove d3 through the lifting plate c3 to cause deformation.
[0039] Based on the above embodiment, the specific working principle is as follows: the buffer pad c4 is used to contact the bottom end face of the support plate 243, and then the buffer spring c5 is squeezed by the lifting plate c3 to obtain a buffer force to prevent the movable mold 3 from impacting the fixed mold 21 and causing vibration when the reset spring 244 shrinks to the limit. The lifting plate c3 is then used to contact the end face of the buffer body c41, so that the buffer body c41 can be deformed into the recessed groove c42, so that the lifting plate c3 can be buffered. Finally, the lifting plate c3 is used to squeeze the end face of the protective pad d1 into the downward groove d3 to cause deformation, thereby increasing the buffering force of the lifting plate c3, so that when the movable mold 3 squeezes the reset spring 244 to the limit, it will not impact the fixed mold 21 and cause vibration.
[0040] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0041] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and range of equivalent elements of the claims are included in the present invention. Any reference sign in the claims should not be regarded as limiting the claims involved.
Claims
1. A shock absorbing structure for an acoustic mold, comprising a base (1), a main body (2), and a movable mold (3), wherein the upper end of the base (1) is provided with the main body (2), and the movable mold (3) is movably matched with the upper end of the main body (2), characterized in that: The main body (2) comprises a fixed mold (21), a mold groove (22), a mounting groove (23), and a shock absorbing device (24); the fixed mold (21) is mounted on the upper end surface of the base (1); the mold groove (22) is arranged in the middle of the top of the fixed mold (21); two mounting grooves (23) are provided, and are respectively arranged at the left and right ends of the fixed mold (21); and two shock absorbing devices (24) are provided, and are respectively vertically mounted in the middle of the mounting grooves (23); The shock absorbing device (24) comprises a snap-fit seat (241), a telescopic column (242), a support plate (243), a return spring (244), and a buffer pad (245); the snap-fit seat (241) is embedded in the upper end surface of the mounting groove (23); the telescopic column (242) is snap-fitted to the upper end of the snap-fit seat (241); the support plate (243) is embedded in the top end of the telescopic column (242); the return spring (244) is nested in the outer end surface of the snap-fit seat (241) and connected to the bottom end surface of the support plate (243); and the buffer pad (245) is arranged at the top side end of the mounting groove (23); The support plate (243) comprises a support body (a1), a rubber layer (a2), a hollow groove (a3), a support strip (a4), and a contact pad (a5); the support body (a1) is embedded in the top of the telescopic column (242); the rubber layer (a2) is located on the upper end surface of the support body (a1); the hollow groove (a3) is arranged between the support body (a1) and the rubber layer (a2); seven support strips (a4) are provided and are arranged transversely inside the hollow groove (a3); and the contact pad (a5) is embedded in the bottom side end of the support body (a1); The rubber layer (a2) comprises a rubber block (a21), a deformation groove (a22), and a protrusion block (a23); the rubber block (a21) is arranged on the upper end surface of the support plate (243); the deformation grooves (a22) are provided with more than five and are arranged transversely inside the rubber block (a21); the protrusion blocks (a23) are provided with more than four and are arranged transversely on the upper end surface of the rubber block (a21); The protruding block (a23) comprises a frame (b1), a deformable block (b2), and a pull strip (b3); the frame (b1) is arranged on the upper end surface of the rubber block (a21); the deformable block (b2) is installed in the middle of the frame (b1); and three pull strips (b3) are provided and vertically arranged inside the deformable block (b2); The buffer pad (245) comprises a cutting groove (c1), a lifting groove (c2), a lifting plate (c3), a buffer pad (c4), and a buffer spring (c5); the cutting groove (c1) is arranged at the side end of the mounting groove (23); the lifting groove (c2) is located at the side end of the cutting groove (c1); the lifting plate (c3) is transversely engaged in the lifting groove (c2); the buffer pad (c4) is attached to the upper end surface of the lifting plate (c3); and two buffer springs (c5) are provided, and are respectively arranged at the two ends of the bottom of the lifting plate (c3); The buffer pad (c4) comprises a buffer body (c41), a recessed groove (c42), a cavity (c43), and a smooth pad (c44); the buffer body (c41) is embedded in the upper end surface of the lifting plate (c3); six recessed grooves (c42) are provided and arranged transversely on the upper end surface of the buffer body (c41); the cavity (c43) is arranged inside the buffer body (c41); and the smooth pad (c44) is attached to the top side end of the buffer body (c41); The recessed groove (c42) comprises a protective pad (d1), a groove body (d2), and a downward pressure groove (d3); the protective pad (d1) is arranged on the upper end surface of the buffer body (c41); the groove body (d2) is located at the upper end of the protective pad (d1); six downward pressure grooves (d3) are provided and are arranged in groups of three at the left and right ends of the groove body (d2).
Citation Information
Patent Citations
Perforating machine for flat panel display device
CN113927666A
Damping silica gel mold
CN210911033U