Production process method of a waterproof material for an electronic paper module

Abstract

The present invention provides a production process method for a waterproof material of an electronic paper module, which relates to the technical field of module encapsulation glue. The method includes the following steps: S1. Place the electronic paper module and clamp and fix the electronic paper module that needs to be dispensed with glue; S2. Adopt a curing method of photo-curing plus room-temperature curing through an acrylic combined with epoxy glue system. Photo-curing hardens the surface of the glue to achieve preliminary curing, and after room-temperature curing for 24 hours, the glue reaches complete curing; S3: Reduce the energy release of photo-curing by reducing the proportion of acrylic acid; S4: Set the curing band of the glue between 390 nm and 405 nm; S5: Set the temperature of the acrylic combined with epoxy within 70 °C. This method can solve the disadvantages of thermosetting glue and the problems existing in the combination of UV glue with the module, thereby improving the quality and efficiency of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of module encapsulation glue, and more specifically, to a production process method for a waterproof material of an electronic paper module. Background Art

[0002] Electronic paper modules are now widely used in the fields of electronic devices such as supermarket price tags, e-books, mobile phones, etc. With the increasing market demand and the growing maturity of automation equipment, the defects of module encapsulation glue have emerged. Since the existing thermosetting glue needs to be cured in an oven at 70°C for 60 minutes, it causes the single-piece flow of the product to be interrupted and offline, making it difficult to achieve automation. Because electronic paper is a moisture-sensitive material, curing at a high temperature of 70°C causes irreversible loss of water content in the electronic paper, resulting in poor low-temperature performance of the product. The high-temperature epoxy glue has a strong adhesion to the glass substrate, making the product irreparable.

[0003] Currently, modules designed with the current material composition have the following difficulties in introducing UV due to the fragility of the electronic paper material structure and the anti-UV function of the waterproof protective film material: The microcup structure of the electronic paper is fragile, and the energy released by the instantaneous UV curing is too large, resulting in damage to the microcup structure and affecting the reliability of the product. The waterproof protective film has an anti-UV function, and light with a wavelength of 365 nm - 380 nm cannot pass through, resulting in the inability of the UV glue to cure. Summary of the Invention

[0004] The problem solved by the present invention is how to solve the disadvantages of thermosetting glue and the problems existing in the combination of UV glue with the module, so as to improve the quality and efficiency of the product.

[0005] To solve the above problems, the present invention provides a production process method for a waterproof material of an electronic paper module, including the steps of:

[0006] S1. Place the electronic paper module and clamp and fix the electronic paper module that needs to be dispensed with glue;

[0007] S2. Adopt a curing method of photo-curing plus room-temperature curing through a glue system combining acrylic acid and epoxy. Photo-curing hardens the surface of the glue to achieve preliminary curing, and room-temperature curing for 24 hours makes the glue reach complete curing;

[0008] S3: Reduce the energy release of photo-curing by reducing the proportion of acrylic acid;

[0009] S4: Set the curing wavelength range of the glue between 390 nm and 405 nm;

[0010] S5: Set the temperature of the combination of acrylic acid and epoxy within 70°C.

[0011] In the above method, an acrylic combined with epoxy adhesive system is used, and the curing method adopts photo-curing plus room-temperature curing. Photo-curing hardens the surface of the glue to achieve preliminary curing to meet the subsequent manufacturing process. After 24 hours of room-temperature curing, the performance of the glue will reach the required curing rate. Reducing the proportion of acrylic reduces the energy release of photo-curing and ensures the integrity of the micro-cup structure of the product. The curing band of the glue is set between 390 nm and 405 nm to solve the curing problem caused by the waterproof protective film blocking UV. Designing the temperature of the acrylic combined with epoxy within 70 °C ensures the repairability of the product.

[0012] Further, the electronic paper module can be clamped and fixed by a fixture.

[0013] Further, the maximum deformation of the electronic paper module in the fixture under the dispensing state is controlled within 0.2 mm.

[0014] Further, the curing method adopts cold light source curing.

[0015] Further, the dispensing method adopts syringe pressure or spray valve.

[0016] Further, the dispensing workflow includes: dispensing UV glue on the electronic paper module that needs to be dispensed, performing photo-curing for 10 s, and then dispensing silicone.

[0017] The present invention adopting the above technical solutions has the following beneficial effects:

[0018] The present invention can replace the thermally cured glue with a photoinitiator-cured glue, reducing the curing time and curing temperature of the product; using an acrylic combined with epoxy adhesive system, and the curing method adopts photo-curing plus room-temperature curing. Photo-curing hardens the surface of the glue to achieve preliminary curing to meet the subsequent process operations. After 24 hours of room-temperature curing, the performance of the glue reaches the required curing rate; reducing the proportion of acrylic reduces the energy release of photo-curing and ensures the integrity of the micro-cup structure of the product; the curing band of the glue is set between 390 nm and 405 nm to solve the curing problem caused by the waterproof protective film blocking UV; the temperature of the acrylic combined with epoxy is designed within 70 °C to ensure the repairability of the product. Description of the Drawings

[0019] Figure 1 It is a process flow chart of the production process method of the waterproof material for the electronic paper module provided by the embodiment of the present invention;

[0020] Figure 2 It is a schematic structural diagram of the electronic paper module of the production process method of the waterproof material for the electronic paper module provided by the embodiment of the present invention; Description of the Drawings:

[0022] 1 - Waterproof protective film, 2 - Encapsulation area, 3 - Electronic paper. Detailed Implementation Modes

[0023] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of specific embodiments of the present invention will be given in conjunction with the accompanying drawings.

[0024] The following are specific embodiments of the present invention and, in conjunction with the accompanying drawings, further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0025] Embodiment

[0026] This embodiment provides a production process method for a waterproof material of an electronic paper module. As Figure 1 and Figure 2 shown, this method includes the steps:

[0027] S1. Place the electronic paper module and clamp and fix the electronic paper module that needs to be dispensed.

[0028] S2. Through an acrylic combined with epoxy glue system, adopt a curing method of photocuring plus room temperature curing. Photocuring hardens the surface of the glue to achieve preliminary curing, and after room temperature curing for 24 hours, the glue reaches complete curing.

[0029] S3: Reduce the energy release of photocuring by reducing the proportion of acrylic acid.

[0030] S4: Set the curing wavelength range of the glue between 390 nm and 405 nm.

[0031] S5: Set the temperature of the acrylic combined with epoxy within 70 °C.

[0032] Specifically, using a photoinitiator to cure the glue instead of a thermally cured glue reduces the curing time of the product and the curing temperature of the product.

[0033] Specifically, using an acrylic combined with epoxy glue system and adopting a curing method of photocuring plus room temperature curing, photocuring hardens the surface of the glue to achieve preliminary curing to meet the subsequent production process, and after room temperature curing for 24 hours, the performance of the glue will reach a curing rate that meets the requirements.

[0034] Specifically, reducing the proportion of acrylic acid reduces the energy release of photocuring to ensure the integrity of the microcup structure of the product.

[0035] Specifically, the curing wavelength range of the glue is set between 390 nm and 405 nm to solve the curing problem of UV blocked by the waterproof protective film. Designing the temperature of the acrylic combined with epoxy within 70 °C ensures the repairability of the product.

[0036] Among them, in step S1, the electronic paper module can be clamped and fixed by a fixture.

[0037] Among them, the maximum deformation of the electronic paper module in the dispensing state within the fixture is controlled within 0.2 mm.

[0038] Among them, the curing method adopts cold light source curing.

[0039] Among them, the dispensing method is carried out by syringe pressurization or spray valve.

[0040] Among them, the dispensing work process includes: dispensing UV glue on the electronic paper module that needs to be dispensed, performing photo-curing for 10 s, and then dispensing silicone.

[0041] Specifically, this method is a solution that uses UV glue to replace thermosetting glue, which can cure the product under a cold light source, greatly shortening the operation time and the product cycle, and solving the problem of water vapor loss of the product.

[0042] Specifically, the method of using syringe pressurization or spray valve dispensing is adopted, and a UV curing tunnel furnace that meets the wavelength band between 390 nm and 405 nm is selected and threaded with the automatic line body. The specific process is to dispense UV glue first, then cure it with UV for 10 s, and then dispense silicone.

[0043] Refer to Figure 2 , the waterproof protective film 1 is attached above the electronic paper 3, the sealing glue area 2 is the application area of dispensing, and the sealing glue area 2 is dispensed by the above method.

[0044] This method can use a photoinitiator to cure the glue to replace the thermosetting glue, reducing the curing time and curing temperature of the product; using a glue system that combines acrylic and epoxy, and the curing method adopts photo-curing plus room temperature curing. Photo-curing hardens the surface of the glue to achieve preliminary curing to meet the post-process operation, and room temperature curing for 24 h makes the performance of the glue reach the required curing rate; reducing the proportion of acrylic to reduce the energy release of photo-curing and ensuring the integrity of the microcup structure of the product; setting the curing wavelength band of the glue between 390 nm and 405 nm to solve the problem of UV curing blocked by the waterproof protective film; designing the temperature of the acrylic combined with epoxy within 70 °C to ensure the repairability of the product.

[0045] Although the present disclosure is disclosed as above, the protection scope of the present disclosure is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, and these changes and modifications will all fall within the protection scope of the present invention.

Claims

1. A production process method for waterproof materials of an electronic paper module, characterized in that, it includes the following steps: S1. Place the electronic paper module and clamp and fix the electronic paper module that needs to be dispensed with glue; S2. Through an acrylic combined with epoxy glue system, adopt a curing method of light curing plus room temperature curing. Light curing hardens the surface of the glue to achieve preliminary curing, and after room temperature curing for 24 hours, the glue reaches complete curing; S3: Reduce the energy release of light curing by reducing the proportion of acrylic acid; S4: Set the curing band of the glue to be between 390 nm and 405 nm; S5: Set the temperature of the acrylic combined with epoxy to be within 70 °C.

2. The production process method for waterproof materials of an electronic paper module according to claim 1, characterized in that, in the step S1, the electronic paper module is clamped and fixed by a fixture.

3. The production process method for waterproof materials of an electronic paper module according to claim 2, characterized in that, the maximum deformation of the electronic paper module in the dispensing state within the fixture is controlled within 0.2 mm.

4. The production process method for waterproof materials of an electronic paper module according to claim 1, characterized in that, the curing method adopts cold light source curing.

5. The production process method for waterproof materials of an electronic paper module according to claim 1, characterized in that, the dispensing method adopts syringe pressurization or spray valve.

6. The production process method for waterproof materials of an electronic paper module according to claim 1, characterized in that, the working process of the dispensing includes: dispensing UV glue on the electronic paper module that needs to be dispensed with glue, performing light curing for 10 s, and then dispensing silicone.

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