Phased array antenna and its transient heat dissipation structure based on phase change material

Abstract

The present invention discloses a phased array antenna and a transient heat dissipation structure based on a phase change material. The transient heat dissipation structure comprises a temperature-dissipating plate (100) and a phase change heat storage device (200) designed separately from the temperature-dissipating plate (100). The phase change heat storage device (200) is mainly composed of a metal shell (201), a metal frame (202), and a phase change material (203) from the outside to the inside. The metal frame (202) is in tight contact with the metal shell (201) under the interference pressure of the phase change material (203). The phased array antenna and the transient heat dissipation structure proposed by the present invention absorb the latent heat of phase change through the phase change material during transient operation, thereby taking away most of the heat and ensuring the stability of various components under normal working conditions. It solves the special heat dissipation and heat control problems of heat diffusion of a concentrated heat source, and has excellent heat transfer performance, good temperature balancing performance, high heat diffusion performance, and good integration performance.

Description

Technical Field

[0001] The invention relates to a phased array antenna and a transient heat dissipation structure thereof based on phase change materials. Background Art

[0002] Due to the relatively high frequency band of phased array antennas, the device power consumption is high, and the heat generation is large, thus placing high demands on the design of the heat dissipation structure. Currently, heat dissipation is mainly divided into radiation, conduction, convection, and evaporation. However, due to some special application environments with strict requirements on product appearance and space, convection and evaporation heat dissipation design cannot be adopted, and radiation and conduction are the only options. However, phased array antennas have difficulties such as high heat dissipation, small size, and low thermal capacity. In transient operating environments, traditional radiation and conduction heat dissipation designs cannot meet the transient operating time requirements of various device performance and indicators, and cannot effectively remove heat. Summary of the Invention

[0003] The object of the present invention is to overcome the deficiencies of the prior art and to provide a phased array antenna transient heat dissipation structure based on phase change material and a phased array antenna based on the heat dissipation structure.

[0004] The object of the present invention is achieved through the following technical solutions:

[0005] The transient heat dissipation structure of the phased array antenna based on phase change material mainly includes a temperature spreader and a phase change heat storage device designed separately from the temperature spreader; the phase change heat storage device is mainly composed of a metal shell, a metal frame and phase change material from the outside to the inside, and the metal frame is in tight contact with the metal shell under the interference pressure of the phase change material.

[0006] Preferably, based on the above embodiment, the temperature equalizing plate is provided with a heat energy input area for installing the antenna heat source module and a heat energy output area for installing the phase change heat storage device; the heat energy output area is distributed outside the heat energy input area.

[0007] Preferably, based on any of the above embodiments, a plurality of the phase change heat storage devices are generally separately distributed on the temperature equalizing plate.

[0008] Preferably, based on any of the above embodiments, the phase change heat storage device is mainly composed of a metal shell, a metal skeleton and a solid phase change material from the outside to the inside, the solid phase change material is filled into the metal shell, the metal skeleton is in tight contact with the metal shell under the interference pressure of the phase change material, and the metal cover of the metal shell is welded by laser welding to form the phase change heat storage device.

[0009] Preferably, based on any of the above embodiments, a plurality of the phase change heat storage devices are separately distributed on the temperature equalizing plate, and the phase change heat storage devices generally have an L-shaped structure.

[0010] Preferably, based on any of the above embodiments, the L-shaped phase change heat storage device includes a first portion, a bending portion and a second portion in sequence; the length of the first portion is smaller than the length of the second portion, and / or the width of the first portion is smaller than the width of the second portion.

[0011] Preferably, based on any of the above embodiments, multiple phase change heat storage devices are separately distributed and arranged on the temperature equalizing plate. When arranged, the multiple phase change heat storage devices are arranged in pairs, with the first parts thereof being arranged opposite to the first parts, or the second parts being arranged opposite to the second parts.

[0012] Preferably, based on any of the above embodiments, the temperature homogenizing plate is generally a planar structure.

[0013] Preferably, based on any of the above embodiments, the metal shell can be mainly made of a metal material with high thermal conductivity and light weight. The metal skeleton can be mainly made of a metal material with high thermal conductivity and soft weight. The phase change material can include a composite phase change material.

[0014] The present invention also provides a phased array antenna, comprising the transient heat dissipation structure as described in any of the above embodiments.

[0015] The beneficial effects of the present invention are:

[0016] 1) The transient heat dissipation structure of the phased array antenna based on phase change material proposed in this invention absorbs the latent heat of phase change through the phase change material during transient operation, thereby removing most of the heat and ensuring the stability of various components under normal operating conditions. It also solves the special heat dissipation and thermal control problems of heat diffusion from a concentrated heat source.

[0017] 2) The present invention has adaptively improved the design of the phase change heat spreader, separating the heat spreader from the phase change portion. This can meet the design requirements of the phase change heat storage device that occupies a large space, and can reserve sufficient volume space for the phase change material to absorb the high transient heat generated by the phased array antenna.

[0018] 3) The transient heat dissipation structure of the phased array antenna and the phased array antenna thereof of the present invention have excellent heat transfer performance, good temperature uniformity performance, high heat diffusion performance and good integration performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a side schematic diagram of the transient heat dissipation structure of the present invention;

[0020] Figure 2Schematic diagram comparing the temperature rise of conventional materials and phase change materials;

[0021] Figure 3 It is a three-dimensional schematic diagram of the transient heat dissipation structure of the present invention;

[0022] Figure 4 It is a front schematic diagram of the transient heat dissipation structure of the present invention;

[0023] In the picture:

[0024] 100-vaporizing plate, 200-phase change energy storage device, 300-antenna heat source module;

[0025] 201-metal shell, 202-metal skeleton, 203-phase change material;

[0026] 211 - first portion, 212 - bending portion, 213 - second portion. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the scope of protection of the present invention.

[0028] This invention addresses the heat dissipation issues of phased array antennas, particularly those operating at high frequencies like the Ka band. These antennas place stringent demands on circuit processing, structural processing, and assembly processes. They are used in enclosed environments with small footprints and limited space, relying primarily on radiation and conduction for heat dissipation. The antenna heat source module primarily includes a SIP module, a wave control module, and a power supply module. The antenna array's heat source primarily comes from the SIP module, wave control circuitry, high-power power supply conversion losses, and passive insertion loss. When the system operates at a 25% duty cycle, the heat dissipation of each component is tabulated below.

[0029] Table 1 Antenna internal heat source parameters (25% duty cycle)

[0030]

[0031] In order to ensure the stability of the performance of each component of the product under normal working conditions and test conditions, the present invention proposes a transient heat dissipation structure of a phased array antenna based on phase change materials. Figure 1 As shown, the transient heat dissipation structure of the phased array antenna proposed in the present invention mainly includes a temperature vapor chamber 100 and one or more phase change heat storage devices 200 fixed on the temperature vapor chamber 100 .

[0032] The present invention designs the mounting plate of the phased array antenna as a temperature-averaging plate, which can conduct heat from antenna heat source modules such as SIP to the temperature-averaging plate, reduce the thermal resistance between the heating component and the heat sink, minimize the temperature difference in the heat transfer path, and fully utilize the heat sink of the phased array antenna to improve heat absorption.

[0033] Phase change materials have a huge heat storage capacity. The main applications of phase change materials are characterized by high enthalpy value (latent heat), accurate phase change temperature, small volume change rate, stable physical and chemical properties, non-toxicity, non-corrosiveness, stable price and easy access. However, phase change materials absorb latent heat during phase change. Due to their physical properties, they cannot exist independently as structural components. Therefore, in the transient heat dissipation structure of the present invention, the phase change heat storage device 200 is mainly composed of a metal shell 201, a metal skeleton 202 and a phase change material 203 from the outside to the inside. The metal skeleton 202 is in close contact with the metal shell 201 under the interference pressure of the phase change material 203. Figure 2 As shown, phase change materials can maintain a constant temperature within a given timeframe, ensuring the heat source operates within the required operating temperature range. Because the phase change occurs rapidly and heat transfer is robust, the temperature difference between the evaporation and condensation surfaces is minimal, resulting in a uniform temperature distribution.

[0034] Based on some embodiments, the temperature homogenizing plate 100 is provided with a heat energy input area for installing the antenna heat source module 300 and a heat energy output area for installing the phase change heat storage device 200; the heat energy output area is distributed outside the heat energy input area, and the weight distribution of each antenna component is rationally planned to maximize the utilization rate of the antenna heat capacity.

[0035] In some embodiments, only one phase-change heat storage device may be provided on the temperature homogenizing plate; in some embodiments, multiple phase-change heat storage devices may be separately distributed on the temperature homogenizing plate. Figure 3 As shown, in this embodiment, four phase-change heat storage devices are provided on the heat spreader of the heat dissipation structure, and the four phase-change heat storage devices are separately installed around the heat spreader. The present invention separates the heat spreader from the phase-change portion and the multiple phase-change portions into a separate body. The advantages are: due to the large overall heat generation of the phased array antenna, sufficient volume space needs to be reserved for the phase-change material to absorb heat energy, and the space occupied by the phase-change portion is relatively large; at the same time, if the size of the antenna mounting plate is designed to be too large, or if an integrated design is adopted, the product itself will have many disadvantages in terms of aesthetics, manufacturability, and operability during testing, installation, and actual use. Therefore, the present invention proposes a solution of adopting a separate design of the heat spreader and the phase-change heat storage device.

[0036] In order to improve the thermal conductivity, the present invention adds a metal skeleton between the phase change material and the metal shell. In some embodiments, the metal skeleton is mainly made of a high thermal conductivity, soft metal material, such as copper. Copper is a metal material with a high thermal conductivity and its material is relatively soft, which is suitable for pressure contact with the metal shell. Through a certain pressure and interference, the contact area between the copper skeleton and the metal shell can be increased, and its function is to quickly conduct a large amount of heat to the interior of the phase change material. In some embodiments, the phase change heat storage device 200 of the present invention can be mainly composed of a metal shell 201, a metal skeleton 202 and a solid phase change material 203 from the outside to the inside. The solid phase change material 203 is filled into the metal shell 201. The metal skeleton 202 is in close contact with the metal shell 201 under the interference pressure of the phase change material 203. The metal cover of the metal shell 201 is welded by laser seam to form the phase change heat storage device 200, and the phase change heat storage device can be fixed to the temperature plate by screws. When the phased array antenna is working, the temperature of the temperature homogenizer rises and conducts the heat energy of the antenna heat source module 300 to the metal shell. The solid phase change material 203 melts due to the heat and consumes part of the heat in the process of converting from solid to liquid and stores it, thereby achieving transient heat dissipation.

[0037] To facilitate heat conduction and production, in some embodiments, especially when multiple phase change heat storage devices are provided on the temperature homogenizing plate, the phase change heat storage devices are L-shaped. Figure 4 As shown, in some embodiments, the L-shaped phase change heat storage device 200 may be mainly composed of a first portion 211, a bending portion 212, and a second portion 213 in sequence. The length of the first portion 211 may be smaller than the length of the second portion 213, or the width of the first portion 211 may be smaller than the width of the second portion 213, or the length and width of the first portion 211 may be smaller than the second portion 213. Of course, the length and width of the first portion 211 may also be greater than or equal to the second portion 213. The two portions may also be designed differently in terms of height, and may be designed according to the actual structure of the antenna. Generally, the height of the phase change heat storage device is higher than the height of the antenna heat source module 300, which is conducive to heat radiation. In some embodiments, the bending portion 212 may be a right-angled bending portion, a rounded bending portion, or a portion as follows. Figure 4 The chamfered bending portion shown; the chamfered bending portion can further optimize the heat dissipation structure and antenna structure, making the volume compact and the layout reasonable, such as Figure 4 As shown, since the bending portion of the L-shaped structure has a chamfered corner, a fixed mounting hole can be opened on the temperature homogenizing plate at the chamfered corner of the bending portion to facilitate installation on the phased array antenna.

[0038] Given a given volume, the more phase change material contained within the metal shell, the lighter the overall mass and the greater the heat storage capacity. Therefore, in the above-described embodiment, the metal shell can be primarily constructed of a high-thermal-conductivity, lightweight metal material, such as aluminum alloy, which is lightweight, has excellent thermal conductivity, good weldability, and has mature manufacturing technology and widespread application. Phase change materials include inorganic, organic, and complex phase change materials. Composite phase change materials such as higher carbon alcohols are generally preferred, such as the 85 higher carbon alcohol phase change material, which has a latent heat of greater than 240 J / g. However, its thermal conductivity is only 0.3 W / m·K, while the thermal conductivity of the conventional metal material, aluminum alloy 5A06, is 400 times greater.

[0039] In some embodiments, a plurality of phase change heat storage devices 200 are separately distributed on the temperature homogenizing plate 100. When the plurality of phase change heat storage devices 200 are arranged, the first portion 211 is arranged opposite to the first portion 211, or the second portion 213 is arranged opposite to the second portion 213. Figure 4 As shown, the temperature plate is equipped with four phase change heat storage devices. Figure 4 Starting from the upper left corner, the first portion 211 of the first phase change heat storage device is arranged opposite to the first portion 211 of the second phase change heat storage device, the second portion 213 of the second phase change heat storage device is arranged opposite to the second portion 213 of the third phase change heat storage device, the first portion of the third phase change heat storage device is arranged opposite to the first portion of the fourth phase change heat storage device, and the second portion of the fourth phase change heat storage device is arranged opposite to the second portion of the first phase change heat storage device. In this embodiment, the distribution structure of the four phase change heat storage devices is symmetrical.

[0040] In addition, in this embodiment, the distances between the two phase-change heat storage devices are not exactly the same. The distance between the first phase-change heat storage device and the second phase-change heat storage device is smaller than the distance between the first phase-change heat storage device and the fourth phase-change heat storage device. This design takes into account both antenna performance and heat dissipation requirements.

[0041] Based on some embodiments, the temperature vapor chamber can generally adopt a planar structural design. The flat shape makes the temperature vapor chamber more suitable for special heat dissipation and thermal control problems with high integration installation requirements and the need to diffuse heat from concentrated heat sources. This makes the transient heat dissipation structure of the present invention and the phased array antenna based on it have the characteristics of high integration performance, and the planar structure is more suitable for assembly with components and loads.

[0042] The present invention also proposes a phased array antenna, including a transient heat dissipation structure as described in any of the above embodiments, wherein the temperature vapor chamber 100 serves as a phased array antenna mounting plate, the antenna heat source module 300 is installed in the middle part of the temperature vapor chamber, and a plurality of phase change energy storage devices 200 are distributed and installed at the edge of the temperature vapor chamber 100.

[0043] Because some application environments have high requirements for product appearance and space, convection and evaporation designs cannot be implemented and can only rely on radiation and conduction. Due to factors such as high heat loss, small size, and small heat capacity, the performance, indicators, and requirements of various components cannot be met during transient conditions. The present invention can be used for Ka phased array antennas in closed application environments, relying on radiation and conduction for heat dissipation. The SIP heat source module conducts heat to the antenna vapor chamber, and then transfers the heat to the phase change heat storage device through the phase change heat storage device tightly connected to the vapor chamber screws, ensuring stable performance of the components under normal operating conditions and test conditions.

[0044] Heat dissipation simulation analysis of the phased array antenna of the present invention:

[0045] Assume that the heat source power of the phased array antenna is P = 75.52 W and the working time is t = 1800 s. The total heat generated during the working time is =75.53 w * 1800 s = 135954 J. If the phase change temperature of the composite phase change material selected in the present invention is around 80°C, the total heat that the entire temperature plate can absorb is .

[0046]

[0047] in is the specific heat capacity of the metal shell, such as the specific heat capacity of aluminum alloy =879 J / kg K; is the specific heat capacity of the phase change material, such as the specific heat capacity of the higher alcohol composite phase change material =2000J / kg K, its density is 0.9g / cm 3 ; is the mass of the metal shell; is the mass of the phase change material; To allow for increased temperature differences, the general Assuming it is 50K, that is, when the starting temperature is 60°C, the maximum allowable temperature at the bottom of the antenna chip is 110°C. Calculation based on the weight of the product's own aluminum alloy and the weight of the filled composite phase change material yields: =159110 J; it can be seen that the total heat that the entire temperature plate can absorb >Total calorific value .

[0048] Device Analysis temperature (℃) Rated temperature (℃) Is it satisfied Final SOC 97.73 150 satisfy Amplitude and phase control chip 97.56 150 satisfy Power Module 82.18 120 satisfy

[0049] At the same time, the product also has radiation heat dissipation, so this design can meet the system's working time requirements.

[0050] The foregoing description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein and should not be construed as excluding other embodiments. Rather, the present invention can be used in various other combinations, modifications, and environments and can be modified within the scope of the concept described herein through the above teachings or techniques or knowledge in the relevant field. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention are intended to be protected by the appended claims.

Claims

1. A transient heat dissipation structure for a phased array antenna based on phase change materials, characterized by: It comprises a temperature averaging plate (100), and a plurality of phase change heat storage devices (200) fixed on the temperature averaging plate (100); The temperature homogenizing plate (100) is provided with a heat energy input area for installing the antenna heat source module (300) and a heat energy output area for installing the phase change heat storage device (200); the heat energy output area is distributed outside the heat energy input area; The plurality of phase-change heat storage devices (200) are separately and distributedly arranged on the temperature homogenizing plate (100), and the phase-change heat storage devices (200) are in an L-shaped structure; The phase change heat storage device (200) is mainly composed of a metal shell (201), a metal skeleton (202), and a phase change material (203) from the outside to the inside, and the metal skeleton (202) is in tight contact with the metal shell (201) under the interference pressure of the phase change material (203); The L-shaped phase change heat storage device (200) comprises a first portion (211), a bent portion (212), and a second portion (213) in sequence; the length of the first portion (211) is smaller than the length of the second portion (213), and / or the width of the first portion (211) is smaller than the width of the second portion (213); When the phase-change heat storage devices (200) are arranged in a split distribution, the first portions (211) are arranged opposite to the first portions (211), or the second portions (213) are arranged opposite to the second portions (213).

2. The transient heat dissipation structure according to claim 1, wherein: The phase change heat storage device (200) is mainly composed of a metal shell (201), a metal skeleton (202) and a solid phase change material (203) from the outside to the inside. The solid phase change material (203) is filled into the metal shell (201), and the metal skeleton (202) is in tight contact with the metal shell (201) under the interference pressure of the phase change material (203). The metal cover plate of the metal shell (201) is welded by laser welding to form the phase change heat storage device (200).

3. The transient heat dissipation structure according to claim 1, wherein: The temperature equalizing plate (100) is a planar structure.

4. The transient heat dissipation structure according to claim 1, wherein: The metal shell (201) is mainly made of a metal material with high thermal conductivity and light weight; The metal skeleton (202) is mainly made of a metal material with high thermal conductivity and softness; The phase change material (203) includes a composite phase change material.

5. Phased array antenna, characterized by The method comprises the transient heat dissipation structure according to any one of claims 1 to 4.

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