Thin electronic devices

Abstract

A thin electronic device includes a first sealing member, a second sealing member, a first circuit member, and a second circuit member. The first sealing member includes a first film formed of a thin film as its substrate and includes a conductive portion made of a conductor. The device forms an enclosed space. The enclosed space is sealed by the first and second sealing members and is isolated from an external space located outside the device. The first and second circuit members are enclosed within the enclosed space and respectively include a first contact point and a second contact point. At least one of the first and second circuit members includes an electrode. The conductive portion contacts the electrode within the enclosed space and is partially exposed to the external space located outside the device. The device provided by this invention has a thinner thickness.

Description

Technical Field

[0001] The present invention relates to a device comprising a circuit component sealed by a film. Background Art

[0002] For example, a device that can be made thinner is disclosed in JP2001-332654A (Patent Document 1), the contents of which are incorporated herein by reference.

[0003] Reference Fig.17 Patent document 1 discloses a module (device) 90 with a built-in semiconductor chip. The device 90 includes a thermosetting resin composition (sealing resin) 92 and a circuit member 94 including a semiconductor chip 96 and a wiring pattern 98. The sealing resin 92 is formed so that the circuit member 94 is embedded therein. Then, the surface of the sealing resin 92 is polished, so that the device 90 becomes thinner.

[0004] There is a need for further thickness reduction for devices including circuit components. Summary of the invention

[0005] It is therefore an object of the present invention to provide a new device which can be made thinner.

[0006] One aspect of the present invention provides a thin electronic device, comprising a first sealing member, a second sealing member, a first circuit member and a second circuit member. The first sealing member comprises a first film formed of a film as a base of the first sealing member, and comprises a conductive portion made of a conductor. The device is formed with a closed space. The closed space is closed by the first sealing member and the second sealing member, and is isolated from an external space outside the device. The first circuit member and the second circuit member are enclosed in the closed space. The first circuit member comprises a first contact point. The second circuit member comprises a second contact point. The first contact point and the second contact point are pressed against each other in the closed space to contact each other. At least one of the first circuit member and the second circuit member comprises an electrode. The conductive portion contacts the electrode in the closed space and is partially exposed to the external space outside the device.

[0007] Another aspect of the present invention provides a thin electronic device, comprising a first sealing member, a second sealing member, a first circuit member and a second circuit member. The first sealing member comprises a first film formed of a thin film as a base of the first sealing member, and contains a conductive gel. The device is formed with a closed space. The closed space is closed by the first sealing member and the second sealing member, and is isolated from an external space outside the device. The first circuit member and the second circuit member are enclosed in the closed space. The first circuit member comprises a first contact point. The second circuit member comprises a second contact point. The first contact point and the second contact point are pressed against each other in the closed space to contact each other. At least one of the first circuit member and the second circuit member comprises an electrode. The conductive gel comprises a conductive portion. The conductive portion contacts the electrode in the closed space and is partially exposed to the external space outside the device.

[0008] According to a thin electronic device of one aspect of the present invention, a first sealing member and a second sealing member overlap each other, and a first circuit member and a second circuit member (hereinafter referred to as "circuit member") are sandwiched therebetween. The first sealing member is basically formed by a film. In addition, except that the circuit member should be provided with a contact point and an electrode, the structure of each circuit member is not limited. Therefore, the circuit member of one aspect of the present invention has a simple structure and can be formed by various materials. For example, each circuit member can be an insulating film formed with a conductive pattern having a contact point and an electrode. In this case, the thickness of the entire device can be made very thin. Therefore, one aspect of the present invention provides a new device that can be made thinner.

[0009] A more comprehensive understanding of the purpose and structure of the present invention may be obtained by reading the following description of the preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 2 is a perspective view showing a thin electronic device according to an embodiment of the present invention, in which an outline of a hidden main opening of a first film and a boundary line of a contact area formed between a first sealing member and a second sealing member are shown with dotted lines.

[0011] Figure 2 It is shown Figure 1 A perspective view of a thin electronic device in which a first sealing member is removed and an outline of a hidden main opening of the first film and a boundary line of a contact area are shown in dotted lines.

[0012] Figure 3 It is shown Figure 1 A top view of a first sealing member of a thin electronic device, wherein the outline of the hidden main opening of the first film is shown in dotted lines.

[0013] Figure 4 It is shown Figure 3A bottom view of the first sealing component, wherein the hidden outlines of the sub-components and the air valve are shown in dotted lines.

[0014] Figure 5 yes Figure 1 A schematic cross-sectional view of a thin electronic device along line VV, wherein the internal structure of the device is only schematically shown, and the size and arrangement of each component are not equal to its actual size and arrangement.

[0015] Figure 6 yes Figure 1 An exploded perspective view of a thin electronic device, in which a portion of a first film surrounded by a dotted line and a portion of a second film surrounded by a dotted line are enlarged and shown.

[0016] Figure 7 It is shown Figure 6 A perspective view of an air valve, wherein the valve of the air valve is open.

[0017] Figure 8 It is shown Figure 1 A side view of a thin electronic device, wherein the device is in the manufacturing process.

[0018] Fig. 9 It is shown Figure 1 A schematic cross-sectional view of a thin electronic device along line VV, wherein the device is in the manufacturing process, and only the internal structure of the device is schematically shown, the size and arrangement of each component are not equal to its actual size and arrangement, and the side surface of the instrument for vacuuming is shown.

[0019] Fig.10 It is shown Figure 5 The cross-sectional view of a modified example of the thin electronic device only schematically shows the internal structure of the device, and the size and arrangement of the components are not equal to their actual size and arrangement.

[0020] Fig.11 It is shown Figure 5 The cross-sectional view of another modified example of the thin electronic device only schematically shows the internal structure of the device, and the size and arrangement of each component are not equal to its actual size and arrangement.

[0021] Fig.12 It is shown Fig.11 A top view of a first sealing member of a thin electronic device, wherein the hidden outline of the sub-member is shown in dotted lines.

[0022] Fig.13 It is shown Fig.12 A bottom view of the first sealing member, wherein the outline of the hidden main opening of the first membrane and the outline of the hidden air valve are shown in dotted lines.

[0023] Fig.14It is shown Figure 1 1 is a perspective view of a modified example of a thin electronic device, in which a boundary line of a contact area formed between a first sealing member and a second sealing member is shown by a dotted line.

[0024] Fig.15 It is shown Fig.14 A schematic cross-sectional view of a thin electronic device taken along line XV-XV, in which the internal structure of the device is only schematically shown, and the size and arrangement of each component are not equal to its actual size and arrangement.

[0025] Fig.16 It is shown Figure 1 A perspective view of another variation of a thin electronic device, wherein an outline of a hidden main opening of a first film and a boundary line of a contact area formed between a first sealing member and a second seal are shown with dotted lines.

[0026] Fig.17 is a cross-sectional view showing the device of Patent Document 1.

[0027] Although the present invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will be described in detail herein. However, it should be understood that the drawings and their detailed description are not intended to limit the present invention to the specific forms disclosed, but rather, are intended to cover all modifications, equivalents and alternatives that fall within the spirit and scope of the present invention. The present invention is defined by the appended claims. DETAILED DESCRIPTION

[0028] Reference Figure 1 , the thin electronic device 10 according to an embodiment of the present invention is an independent electronic device. More specifically, the thin electronic device 10 can work alone without being physically connected to another electronic device (not shown). For example, the thin electronic device 10 measures the heart rate of a subject by attaching the thin electronic device 10 near the heart of the subject, and sends the measurement result to another electronic device. Therefore, the thin electronic device 10 can be used as an electronic device for measuring bio-information such as heart rate. However, the present invention is not limited to this, but is applicable to various devices with various functions.

[0029] Together with Figure 1 See also Figure 2, the thin electronic device 10 of this embodiment includes a circuit structure 12 and a sealing member 14. The circuit structure 12 is a member for making the thin electronic device 10 work as an electronic device. For example, the circuit structure 12 has an electronic circuit (not shown) for receiving an electrical signal (hereinafter referred to as a "biosignal") generated by the electrical pulse of the subject's heart, another electronic circuit (not shown) for measuring the cardiac electrical pulse based on the received biosignal, and another electronic circuit (not shown) for transmitting the measurement result to another electronic device (not shown). The sealing member 14 completely accommodates the circuit structure 12 inside it and protects the circuit structure 12 from the external environment. Therefore, the circuit structure 12 is enclosed in the sealing member 14.

[0030] The circuit structure 12 of the present embodiment includes a first circuit member 40 and a second circuit member 50. The sealing member 14 of the present embodiment includes a first sealing member 20 and a second sealing member 30. Therefore, the thin electronic device 10 includes the first sealing member 20, the second sealing member 30, the first circuit member 40 and the second circuit member 50. Figure 1 and Figure 2 Refer to Figure 8 , four components of the thin electronic device 10, namely the first sealing member 20, the second sealing member 30, the first circuit member 40 and the second circuit member 50, are stacked and combined in the up-down direction (Z direction) to form the thin electronic device 10 into a single structure. The thin electronic device 10 of the present embodiment includes only the above four components. However, the present invention is not limited thereto, and the thin electronic device 10 may further include another component in addition to the above four components.

[0031] Hereinafter, each component of the thin electronic device 10 of the present embodiment will be described.

[0032] Reference Figure 6 , the first sealing member 20 of the present embodiment is formed by a first film 22 as an insulating film as a base. In other words, the first sealing member 20 includes a first film 22 formed by a thin film as a base of the first sealing member 20. The first film 22 of the present embodiment is a thin rectangular sheet and is bendable. For example, the thickness of the first film 22 is about 0.01 to 0.5 mm. The first film 22 extends parallel to a horizontal plane (sheet plane: XY-plane). The first film 22 has a peripheral edge 229 in the XY plane.

[0033] Reference Figure 3 and Figure 4 , the first film 22 has an outer surface 232 and an inner surface 234. The outer surface 232 is the upper surface (positive Z-side surface) of the first film 22. The inner surface 234 is the lower surface (negative Z-side surface of the first film 22).

[0034] Reference Figure 6 , the first film 22 of the present embodiment includes two layers, which are composed of a meltable layer 146 that can be melted by heat treatment and a non-meltable layer 148 that cannot be melted by heat treatment. The meltable layer 146 is located below the non-meltable layer 148. For example, the material of the meltable layer 146 is polyethylene, and the material of the non-meltable layer 148 is nylon. According to this structure, the meltable layer 146 can be fused to another meltable layer of another member while maintaining the non-meltable layer 148. However, the present invention is not limited to this. For example, the first film 22 can include only the non-meltable layer 148, or can include three or more layers.

[0035] The first film 22 is formed with a main opening 244 and a valve opening 248. Each of the main opening 244 and the valve opening 248 of the present embodiment has a small circular shape in the XY plane and passes through the first film 22 in the Z direction. For example, the main opening 244 has a diameter of 0.5 mm or less. Each of the main opening 244 and the valve opening 248 as described above can be formed by a forming method such as laser irradiation. However, the present invention is not limited thereto. For example, the shape and size of each of the main opening 244 and the valve opening 248 in the XY plane are not specifically limited.

[0036] Reference Figure 1 and 6 In addition to the first membrane 22 , the first sealing component 20 of this embodiment further includes a sub-component 26 and an air valve 28 .

[0037] The sub-member 26 of the present embodiment is a circular thin sheet and is bendable. The sub-member 26 includes a thin bondable portion 262 made of a resin such as polyethylene terephthalate (PET) or polyurethane (PU) and a thin conductive portion 266 made of a conductor such as metal. Therefore, the first sealing member 20 includes a bondable portion 262 formed of a thin film and a thin film-shaped conductive portion 266.

[0038] For example, each of the engageable portion 262 and the conductive portion 266 of the present embodiment has a thickness of about 0.01 to 0.5 mm. The sub-component 26 is formed with a sub-opening 264. The sub-opening 264 has a small circular shape in the XY plane. For example, the sub-opening 264 has a diameter of 0.5 mm or less. The sub-opening 264 passes through the engageable portion 262 in the Z direction. However, the sub-opening 264 is filled with the conductive portion 266 so that no gap is left. In other words, the conductive portion 266 extends in the XY plane to cover the entire sub-opening 264 and close the sub-opening 264. The conductive portion 266 is exposed upward and downward. In other words, the positive Z side surface and the negative Z side surface of the conductive portion 266 are exposed outward. Therefore, the sub-component 26 is formed to be electrically connected in the Z direction.

[0039] For example, the sub-component 26 of the present embodiment can be formed as described below. First, a film having a thickness of about 0.01 to 0.5 mm is formed from a resin such as PET or PU. Then, a film having a sub-opening 264 with a diameter of 0.5 mm or less is formed by a forming method such as laser irradiation. Thus, a bondable portion 262 is formed. Then, a conductive paste is filled in the sub-opening 264 using an appropriate mask and a scraper, and the conductive paste is applied to one of the opposite surfaces of the film. Then, the film is heated to harden the conductive paste. Then, by using an appropriate mask and a scraper, a conductive paste is filled in the sub-opening 264, and the conductive paste is applied to the remaining one of the opposite surfaces of the film. Then, the film is heated to harden the conductive paste. As a result of the above two heat treatments, the conductive portion 266 is formed by the conductive paste.

[0040] The sub-component 26 of the present embodiment is formed as described above and has the above structure. However, the present invention is not limited thereto. For example, the conductive portion 266 may be formed by electroplating or inkjet. The conductive portion 266 may be formed by a metal foil laminated on the upper surface or the lower surface of the engageable portion 262 to cover the entire sub-opening 264. The conductive portion 266 may partially protrude downward. In addition, the shape and size of the sub-component 26 are not particularly limited.

[0041] In the present embodiment, the diameter of the main opening 244 of the first film 22 is smaller than the diameter of the engageable portion 262 of the sub-component 26 but larger than the diameter of the conductive portion 266 of the sub-component 26. The engageable portion 262 of the present embodiment is engaged on the outer surface 232 so as to surround the main opening 244 in the XY plane. In other words, a portion of the engageable portion 262 located around the sub-opening 264 is engaged with the first film 22 over its entire circumference to surround the main opening 244. The engageable portion 262 is firmly attached to the outer surface 232 and the edge that seals the entire periphery of the main opening 244 in the XY plane. Therefore, the sub-component 26 completely closes the main opening 244 and blocks the air that may flow through the main opening 244.

[0042] The engageable portion 262 of the present embodiment is engaged on the outer surface 232 of the first film 22 by a fixing member such as an adhesive. However, the present invention is not limited thereto. Figure 6 , the first film 22 may further include another meltable layer (not shown) located above the non-meltable layer 148. The bondable portion 262 may include a meltable layer (not shown) and a non-meltable layer (not shown). The meltable layer of the bondable portion 262 may be the lower layer of the bondable portion 262. According to the above modification, the bondable portion 262 may be bonded to the outer surface 232 of the first film 22 by fusing the meltable layer of the bondable portion 262 and the meltable layer of the first film 22 to each other.

[0043] Reference Figure 3 and Figure 4, the engageable portion 262 of the present embodiment has an outer edge in the XY plane, which is located on the outside of the main opening 244 in the XY plane. In addition, the engageable portion 262 has an inner edge in the XY plane, which is located on the inner side of the main opening 244 in the XY plane. Therefore, the conductive portion 266 of the present embodiment is located on the inner side of the main opening 244 in the XY plane. The conductive portion 266 arranged in this way can move vertically, while the engageable portion 262 is partially elastically deformed. In particular, when the engageable portion 262 is made of PU, the engageable portion 262 is easily elastically deformed. However, the present invention is not limited to this. For example, various modifications can be made to the dimensional relationship between the engageable portion 262, the main opening 244 and the conductive portion 266 in the XY plane as needed.

[0044] Reference Figure 6 and 7 The air valve 28 of this embodiment includes a cover portion 282 formed of a thin insulating film and a base portion 286 made of an insulator. Figure 7 As shown, the base 286 is formed with a through hole 288. The through hole 288 passes through the base 286 in the Z direction. The cover 282 is formed with five valves 284 and five cutouts 285 respectively corresponding to the valves 284. Each cutout 285 passes through the cover 282 in the Z direction. The valves 284 and the cutouts 285 are located inside the outer circumference of the cover 282 in the XY plane.

[0045] and Figure 6 Refer to Figure 7 , the cover 282 is adhered and fixed to the upper surface of the base 286. In particular, the outer circumference of the cover 282 in the XY plane is tightly adhered to the upper surface of the base 286 over its entire circumference. On the contrary, the inner part of the cover 282 located inside the outer circumference of the cover 282 in the XY plane can be pulled away from the upper surface of the base 286. Therefore, a channel allowing air to pass is formed between the through hole 288 and each cutout 285. The base 286 has a lower surface, which is adhered and fixed to the first membrane 22 so that the through hole 288 is communicated with the valve opening 248 of the first membrane 22.

[0046] and Figure 7 Refer to Figure 1 , the air valve 28 can be taken Figure 7 The open state shown or Figure 1 When the air valve 28 is in the open state, each valve 284 is separated from the corresponding cutout 285. When the air valve 28 is in the closed state, each valve 284 completely covers the corresponding cutout 285. When the air valve 28 is in the open state, an air passage through the air valve 28 is formed between the inside and the outside of the thin electronic device 10. When the air valve 28 is in the closed state, the inside of the thin electronic device 10 is cut off from the outside of the device 10.

[0047] As described below, the air valve 28 is used to evacuate the interior of the thin electronic device 10 when manufacturing the thin electronic device 10. The air valve 28 of the present embodiment has a structure suitable for this purpose. However, the present invention is not limited to this. For example, there is no particular limitation on the structure of the air valve 28, as long as the internal air of the thin electronic device 10 can be discharged through the air valve 28. In addition, the interior of the thin electronic device 10 can also be evacuated without providing the air valve 28. In other words, the air valve 28 can be provided as needed.

[0048] Reference Figure 6 , the second sealing member 30 of the present embodiment is formed by a second film 32 as an insulating film as its base. In other words, the second sealing member 30 includes a second film 32 formed by a thin film as the base of the second sealing member 30. The second film 32 of the present embodiment is formed by a material similar to the first film 22 and has a structure similar to the first film 22. For example, the second film 32 is a thin rectangular sheet and is bendable. The second film 32 extends parallel to the XY plane. The second film 32 has a peripheral edge 329 in the XY plane. However, the present invention is not limited to this. For example, the second sealing member 30 may include a rigid circuit board as its base instead of the second film 32. The rigid circuit board may have rigidity and may hardly bend.

[0049] The second film 32 or the rigid circuit board of the present embodiment includes two layers similar to the first film 22, including a meltable layer 146 that can be melted by heat treatment and an infusible layer 148 that cannot be melted by heat treatment. The meltable layer 146 is located above the infusible layer 148. According to this structure, the two meltable layers 146 of the first film 22 and the second film 32 can be fused to each other while maintaining the infusible layer 148. However, the present invention is not limited to this. For example, each of the first film 22 and the second film 32 can have a structure according to the formation method of the thin electronic device 10. For example, the first film 22 and the second film 32 can be combined together by using a fixing member. Such as an adhesive. In this case, each of the first film 22 and the second film 32 can include only a layer of the infusible layer 148. On the contrary, each of the first film 22 and the second film 32 can include three or more layers.

[0050] Reference Figure 2 and Figure 6, the second sealing member 30 of the present embodiment includes an additional film 38 composed of an insulating film in addition to the second film 32. The additional film 38 has an uneven portion 382. As described below, the uneven portion 382 is provided so as to maintain a passage allowing air to pass when the interior of the thin electronic device 10 is evacuated. In detail, the uneven portion 382 is formed with a large number of protrusions 384. Each protrusion 384 is a protrusion that protrudes upward and can be elastically deformed. The protrusions 384 are uniformly and continuously formed on the entire additional film 38 in the XY plane. According to the above structure, a passage for air to pass is formed between every two adjacent protrusions 384. The shape and size of each protrusion 384 are not specifically limited, as long as a passage allowing air to pass can be formed.

[0051] and Figure 2 Refer to Figure 1 , the first film 22 and the second film 32 of the present embodiment overlap each other so that the position of the peripheral edge 229 and the position of the peripheral edge 329 are aligned with each other in the XY plane. However, the present invention is not limited to this. For example, the size of the first film 22 in the XY plane and the size of the second film 32 in the XY plane may be different from each other. The shape of each of the first film 22 and the second film 32 is not limited to a rectangle, but can be modified as needed.

[0052] Reference Figure 6 , the first circuit member 40 of the present embodiment has a first base 42 and a first conductive pattern 44. The first base 42 of the present embodiment is a rectangular sheet formed of an insulating film and is bendable. The first base 42 extends parallel to the XY plane. The first conductive pattern 44 is formed on the first base 42. Specifically, the first conductive pattern 44 is composed of a conductor such as copper, and is formed on the lower surface of the first base 42 by a forming method such as silver ink printing or etching.

[0053] The second circuit member 50 of the present embodiment has a second base 52 and a second conductive pattern 54. The second base 52 of the present embodiment is a thin rectangular sheet formed of an insulating film and is bendable. The second base 52 extends parallel to the XY plane. The second conductive pattern 54 is formed on the second base 52. Specifically, the second conductive pattern 54 is composed of a conductor such as copper and is formed on the upper surface of the second base 52 by a formation method such as silver ink printing or etching.

[0054] The first circuit member 40 and the second circuit member 50 of the present embodiment have the above-mentioned structures, respectively. However, the present invention is not limited thereto. For example, each of the first circuit member 40 and the second circuit member 50 may be provided with one or more electronic components. One of the first circuit member 40 and the second circuit member 50 may be a single electronic component. Each of the first circuit member 40 and the second circuit member 50 may be a rigid circuit board. There is no particular limitation on the method for forming the first conductive pattern 44 and the second conductive pattern 54, as long as the first conductive pattern 44 and the second conductive pattern 54 are both composed of conductors.

[0055] The first conductive pattern 44 of the present embodiment has a first contact point 48. The second conductive pattern 54 of the present embodiment has a second contact point 58 and an electrode 59. Therefore, the first circuit member 40 includes the first contact point 48, and the second circuit member 50 includes the second contact point 58 and the electrode 59. Figure 2 and Figure 5 In the manufactured thin electronic device 10, the first contact point 48 and the second contact point 58 are in contact with each other. Figure 5 In the manufactured thin electronic device 10, the electrode 59 and the conductive portion 266 are in contact with each other. Therefore, the first conductive pattern 44 and the second conductive pattern 54 are electrically connected to each other and can be electrically connected to a member located outside the thin electronic device 10 through the conductive portion 266.

[0056] Figure 6 The first conductive pattern 44 and the second conductive pattern 54 shown are abstract conductive patterns for simply explaining the present invention and have no specific function. In other words, even when the illustrated first contact 48 and the illustrated second contact 58 are in contact with each other, the thin electronic device 10 does not operate as an electronic device. For example, the actual first conductive pattern 44 and the actual second conductive pattern 54 are formed by an electronic circuit (not shown) that can measure the electrical pulses of the subject's heart. Figure 1 , the electronic circuit can obtain a biological signal based on the electrical pulse of the subject's heart through the conductive part 266.

[0057] Reference Figure 2 , the number of the first contact point 48 and the second contact point 58 of the present embodiment is one each. In addition, the number of the electrodes 59 and the number of the conductive parts 266 are one each. However, the present invention is not limited thereto. For example, each of the number of the first contact points 48 and the number of the second contact points 58 may be two or more. In addition, the number of the electrodes 59 and the number of the conductive parts 266 may be more than two, respectively. In the manufactured thin electronic device 10, the first contact point 48 should be in contact with the second contact point 58, respectively, and the electrode 59 should be in contact with the conductive part 266, respectively.

[0058] Hereinafter, the thin electronic device 10 of this embodiment will be described in more detail.

[0059] Reference Figure 1 and Figure 2 , the first film 22 of the present embodiment has a first inner portion 222 and a first outer portion 224. The first outer portion 224 of the present embodiment has a first sealing portion 226 and a first contact portion 228. The first inner portion 222 is located inside the first outer portion 224 in the XY plane. In other words, the first outer portion 224 is a portion of the first film 22 surrounding the first inner portion 222.

[0060] Reference Figure 2 The second film 32 of the present embodiment has a second inner portion 322 and a second outer portion 324. The second outer portion 324 of the present embodiment has a second sealing portion 326 and a second contact portion 328. The second inner portion 322 is located inside the second outer portion 324 in the XY plane. In other words, the second outer portion 324 is a portion of the second film 32 surrounding the second inner portion 322.

[0061] Reference Figure 1 and Figure 2 , the first inner portion 222 of the first film 22 of the thin electronic device 10 and the second inner portion 322 of the second film 32 are used to accommodate the circuit structure 12, and are separated from each other. The first sealing portion 226 and the second sealing portion 326 of the present embodiment are combined together to form a sealing trace 16. According to the present embodiment, the first sealing portion 226 and the second sealing portion 326 are combined together by heat sealing. Therefore, the sealing trace 16 of the present embodiment is a trace in which the first sealing portion 226 and the second sealing portion 326 are welded to each other by heat treatment. However, the present invention is not limited to this, and the first sealing portion 226 and the second sealing portion 326 can be joined together by various methods such as high frequency, ultrasonic wave, laser or adhesive.

[0062] The sealing trace 16 of the present embodiment is formed on the entire circumference of the first sealing portion 226 and the second sealing portion 326. The sealing trace 16 runs through the entire circumference around the first contact portion 228 and the second contact portion 328 in the XY plane. However, the present invention is not limited thereto, and the sealing trace 16 may be formed on a necessary portion according to the forming method of the thin electronic device 10. For example, the sealing trace 16 may be partially formed or may not be formed at all.

[0063] Reference Figure 5As described below, after the first sealing portion 226 and the second sealing portion 326 are joined together, the interior of the thin electronic device 10 is evacuated. According to the present embodiment, when evacuating, the first contact portion 228 and the second contact portion 328 contact each other in the contact area 17 due to the air pressure difference. Therefore, the thin electronic device 10 is formed with a closed space 18. The closed space 18 is surrounded by the first inner portion 222 and the second inner portion 322. The contact area 17 of the present embodiment seamlessly surrounds the entire circumference of the first inner portion 222 and the second inner portion 322 in the XY plane. However, the present invention is not limited thereto, but the contact area 17 can be formed on a necessary part according to the formation method of the thin electronic device 10. For example, the contact area 17 can be partially formed or can be formed entirely.

[0064] The closed space 18 formed as described above is surrounded by the first sealing member 20 and the second sealing member 30 and is isolated from the external space outside the thin electronic device 10. According to the present embodiment, the first sealing portion 226 and the second sealing portion 326 are firmly combined together. In addition, the contact area 17 is located inside the sealing trace 16 in the XY plane and blocks the air that may flow between the inside and the outside of the closed space 18. Therefore, the air pressure in the closed space 18 is maintained at a low pressure lower than the atmospheric pressure.

[0065] The first circuit member 40 and the second circuit member 50 are enclosed in the closed space 18 maintaining the above-mentioned low pressure. The first contact point 48 and the second contact point 58 are pressed against each other in the closed space 18 to contact each other. In detail, due to the air pressure difference between the inside and the outside of the closed space 18, a contact force is generated between the first contact point 48 and the second contact point 58. Due to the air pressure difference, the first contact point 48 and the second contact point 58 are pressed against each other. Therefore, the contact of the first contact point 48 with the second contact point 58 can be reliably maintained.

[0066] Summarize the above description, the first sealing member 20 and the second sealing member 30 of the thin electronic device 10 of the present embodiment overlap each other to contact each other, and the first circuit member 40 and the second circuit member 50 (hereinafter referred to as "circuit member") are sandwiched between them. Each of the first sealing member 20 and the second sealing member 30 of the present embodiment is basically formed by a film.

[0067] In addition, except that the circuit member should be provided with an electrode 59 and a contact point composed of a first contact point 48 and a second contact point 58, the structure of each circuit member is not limited. Therefore, each circuit member of the present embodiment has a simple structure and can be formed by various materials. For example, the circuit member can be two insulating films formed with a conductive pattern composed of a first conductive pattern 44 and a second conductive pattern 54. The conductive pattern can only have a contact point and an electrode 59. In this case, the thickness of the entire thin electronic device 10 can be made very thin. Therefore, the present embodiment provides a new and thinner thin electronic device 10.

[0068] According to the present embodiment, the first sealing portion 226 and the second sealing portion 326 are combined together, and the first contact portion 228 and the second contact portion 328 are in contact with each other. According to this structure, the airtightness of the enclosed space 18 can be reliably maintained. However, the present invention is not limited to the present embodiment. For example, the first sealing portion 226 and the second sealing portion 326 can partially surround the first contact portion 228 and the second contact portion 328 in the XY plane. The first sealing portion 226 and the second sealing portion 326 can partially surround the first inner portion 222 and the second inner portion 322 in the XY plane.

[0069] According to the present embodiment, the first circuit member 40 and the second circuit member 50 can be easily taken out from the closed space 18 by cutting the first sealing portion 226 and the second sealing portion 326. In the present embodiment, the members can be easily collected separately and can be reused.

[0070] The conductive portion 266 of the present embodiment is in contact with the electrode 59 in the closed space 18 and is partially exposed to the external space located outside the thin electronic device 10. In detail, the outer surface 232 of the first film 22 is located outside the closed space 18. The engageable portion 262 of the sub-member 26 is engaged on the outer surface 232 arranged in this way. The conductive portion 266 and the electrode 59 are pressed against each other due to the air pressure difference between the inside and the outside of the closed space 18, so that the contact between the conductive portion 266 and the electrode 59 can be reliably maintained.

[0071] If the conductive portion 266 as described above is not provided, the electronic circuit (not shown) formed in the first conductive pattern 44 and the second conductive pattern 54 should obtain the biological signal of the subject without contacting the subject. For example, the electronic circuit should obtain the biological signal of the subject through contactless communication. However, weak biological signals are difficult to accurately obtain through contactless communication. In contrast, according to this embodiment, the biological signal can be accurately obtained by the conductive portion 266 in contact with the skin of the subject.

[0072] Each of the first sealing member 20 and the second sealing member 30 preferably has a high barrier to oxygen. More specifically, each of the first film 22 and the second film 32 (or the rigid circuit board) preferably includes a layer made of a high oxygen barrier material, which is a material with a high barrier to oxygen. According to this layer structure, the oxidation of the metal member of the circuit structure 12 can be reduced.

[0073] For example, the high oxygen barrier material may be a linear low-density polyethylene (LLDPE). More specifically, the high oxygen barrier material may be PET / Al / PE formed by laminating polyethylene terephthalate, aluminum, and polyethylene; ON / PE formed by laminating biaxially stretched nylon and polyethylene; PET / EVOH / PE formed by laminating polyethylene terephthalate, polyvinyl chloride, and polyethylene; or may be formed by laminating a transparent high barrier film and polyethylene. The transparent high barrier film may be polyethylene terephthalate (PET) deposited with SiOx or alumina.

[0074] The first sealing member 20 and the second sealing member 30 of the present embodiment preferably have a high barrier to water vapor in addition to a high barrier to oxygen. More specifically, each of the first film 22 and the second film 32 (or a rigid circuit board) preferably includes a layer made of a high water vapor barrier material, which is a material with a high barrier to water vapor. According to the layer structure, the circuit structure 12 can be waterproof. For example, the high water vapor barrier material can be a sheet made of ON / PE, biaxially stretched polypropylene (OPP) or PET and coated with a material of polyvinylidene chloride (PVDC).

[0075] In addition to high barrier properties to oxygen and high barrier properties to water vapor, each of the first sealing member 20 and the second sealing member 30 may have various barrier properties, such as barrier properties to nitrogen. Therefore, it is preferred that each of the first sealing member 20 and the second sealing member 30 has high barrier properties according to its use.

[0076] The thin electronic device 10 (see Figure 1 ) is formed by four steps, including a preparation step (step 1), a lamination step (step 2), a sealing step (step 3) and a vacuuming step (step 4). However, the present invention is not limited thereto, but the method for forming the thin electronic device 10 can be modified as needed. Hereinafter, an example of the method for forming the thin electronic device 10 of the present embodiment will be described.

[0077] Reference Figure 8 First, in the preparation step, the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50 are prepared.

[0078] Then, in the lamination step, the first sealing member 20, the first circuit member 40, the second circuit member 50 and the second sealing member 30 are sequentially laminated from top to bottom along the Z direction. At the same time, the first circuit member 40 and the second circuit member 50 are arranged so that the first contact point 48 and the second contact point 58 are opposite to each other in the Z direction. In addition, the conductive portion 266 and the electrode 59 are arranged to be opposite to each other in the Z direction. The additional film 38 is located in the middle of the second film 32 in the XY plane. The first circuit member 40 and the second circuit member 50 are located in the middle of the additional film 38 in the XY plane. In addition, the first film 22 and the second film 32 are arranged so that their two meltable layers 146 (see Figure 6 ) face each other in the Z direction.

[0079] Then, in the sealing step, the first film 22 and the second film 32 are heat-sealed. In detail, the portions of the two meltable layers 146 located at the peripheries of the first film 22 and the second film 32 in the XY plane are welded to each other by heat sealing. Fig. 9 As a result of heat sealing, a thin electronic device 10 having a sealing trace 16 is formed. The thin electronic device 10 has an inner space enclosed by the first sealing member 20 and the second sealing member 30, and the inner space is isolated from the outside of the thin electronic device 10 except for the air valve 28.

[0080] Then, in the vacuuming step, the inside of the thin electronic device 10 is vacuumed. According to the present embodiment, the air valve 28 and the instrument 80 are used to exhaust the air inside the thin electronic device 10. The instrument 80 of the present embodiment is a syringe piston pump. The instrument 80 includes a syringe 82 and a plunger 84. The syringe 82 has a lower end, which has an annular shape in the XY plane. The annular shape of the syringe 82 corresponds to the periphery of the cover 282 of the air valve 28.

[0081] In the vacuuming step, first, the lower end of the syringe 82 is pressed against the upper surface of the cover 282. Then, the plunger 84 is pulled upward. At the same time, the air valve 28 is in an open state, and an air passage is formed between the interior of the thin electronic device 10 and the interior of the syringe 82. The air in the thin electronic device 10 is discharged through the through hole 288 and the cutout 285 of the air valve 28 (see FIG. 28). Figure 7 ) is discharged into the syringe 82. As a result, the air pressure inside the thin electronic device 10 gradually decreases. When the air pressure inside the thin electronic device 10 becomes a low pressure close to vacuum, the vacuuming performed by the instrument 80 is stopped.

[0082] and Fig. 9 Refer to Figure 5 When the vacuuming stops, due to the pressure difference between the air pressure inside the thin electronic device 10 and the atmospheric pressure, the valve 284 of the air valve 28 (see Figure 7 ) covers the cutout 285 (see Figure 7 ), so that the air valve 28 is in a closed state. As a result, the air pressure inside the thin electronic device 10 is maintained at a low pressure. Therefore, the thin electronic device 10 forms a closed space 18 that is isolated from the outside and has a low pressure. The first contact point 48 and the second contact point 58 are pressed against each other and contact each other due to the air pressure difference between the inside and outside of the closed space 18. The conductive portion 266 and the electrode 59 are pressed against each other and contact each other due to the air pressure difference between the inside and outside of the closed space 18.

[0083] The first film 22 and the second film 32 tend to be in close contact with each other when evacuated, and thus tend to form a close contact portion such as the contact area 17. If the additional film 38 is not provided, the close contact portion of the first film 22 and the second film 32 will be formed in the closed space 18. The close contact portion thus formed may block the air passage between the air valve 28 and the contact area where the first contact point 48 and the second contact point 58 are provided. As a result, the air pressure of the space where the first contact point 48 and the second contact point 58 are located may not be sufficiently reduced, resulting in a situation where the first contact point 48 and the second contact point 58 may not reliably contact each other. Similarly, the conductive portion 266 and the electrode 59 may not reliably contact each other.

[0084] In contrast, since the additional film 38 of the present embodiment is located between the first film 22 and the second film 32, direct contact between the first film 22 and the second film 32 is prevented. Furthermore, since the additional film 38 has the uneven portion 382, ​​even in the case where the first film 22 and the second film 32 are indirectly in contact via the additional film 38, air circulation through the air valve 28 can be maintained. Therefore, the first contact 48 and the second contact 58 can be reliably in contact with each other. Similarly, the conductive portion 266 and the electrode 59 can be reliably in contact with each other.

[0085] The additional film 38 of the present embodiment is an embossed film that is different from and separable from the second film 32, and is disposed on the second film 32. The uneven portion 382 is formed on the upper surface and the lower surface of the additional film 38. However, the present invention is not limited thereto. For example, the additional film 38 may be adhered and fixed on the upper surface of the second film 32. The uneven portion 382 may be formed only on the upper surface of the additional film 38. The second film 32 may be embossed so that the uneven portion 382 is formed. In this case, it is not necessary to provide the additional film 38. Therefore, the second sealing member 30 may only include the second film 32 having the uneven portion 382.

[0086] The additional film 38 of the present embodiment forms the second sealing member 30 together with the second film 32. However, the present invention is not limited thereto. For example, the additional film 38 may form the first sealing member 20 together with the first film 22. More specifically, the additional film 38 may be arranged below the first film 22. In addition, the first film 22 may be embossed so as to be formed with an uneven portion 382. In this case, it is not necessary to provide the additional film 38.

[0087] According to the forming method of the present embodiment, the first contact point 48 and the second contact point 58 are firmly in contact with each other without using a fixing member such as an adhesive. The conductive portion 266 and the electrode 59 are firmly in contact with each other without using a fixing member such as an adhesive. Therefore, when the thin electronic device 10 is no longer used, the thin electronic device 10 can be disassembled by simply cutting off the first outer portion 224 and the second outer portion 324. In addition, the first circuit member 40 and the second circuit member 50 can be closed in the closed space 18 with low pressure, so that, for example, the degradation of the metal member due to oxidation can be reduced.

[0088] Reference Fig. 9 According to the forming method of the present embodiment, a simple instrument 80 can be used to easily evacuate. The evacuation of the instrument 80 can be repeated. For example, even if the air pressure in the closed space 18 becomes high during the use of the thin electronic device 10, the evacuation can be performed again using the device 80. Therefore, during the use of the thin electronic device 10, the contact force between the first contact point 48 and the second contact point 58 can be maintained, and the contact force between the conductive portion 266 and the electrode 59 can be maintained. However, the present invention is not limited thereto, and the forming method of the thin electronic device 10 can be modified as needed.

[0089] For example, the structure of the instrument 80 is not particularly limited as long as it can be used for vacuuming. A nozzle may be used instead of the illustrated instrument 80. The nozzle may be inserted into the thin electronic device 10 and the thin electronic device 10 may be vacuumed. In this case, there is no need to provide the air valve 28. Alternatively, a commercially available desktop vacuum packaging machine (not shown) may be used for sealing and vacuuming. Figure 8 , the components of the thin electronic device 10 can be arranged in a chamber (not shown) so that vacuum is drawn while heat sealing. According to this forming method, it is not necessary to provide the additional film 38. In addition, other components may not be provided with the uneven portion 382. However, from the perspective of easy manufacture of the thin electronic device 10, it is preferred that the instrument 80 (refer to Fig. 9 ) and other simple tools available on the market.

[0090] According to the forming method of the present embodiment, when the preparation step starts, the sub-component 26 has been bonded to the first film 22. However, the present invention is not limited thereto. For example, the sub-component 26 may be bonded to the first film 22 by fusion after the vacuuming step is completed. However, from the viewpoint of reliably vacuuming the interior of the thin electronic device 10, the forming method of the present embodiment is preferred.

[0091] In addition to the modifications already described, various modifications may be made to the present embodiment as described below.

[0092] Compare Fig.10 and Figure 5 The thin electronic device 10A according to the first modification includes the second sealing member 30 that is the same as the thin electronic device 10. In addition, the thin electronic device 10A includes a first sealing member 20A, a first circuit member 40A, and a second circuit member 50A that are different from the first sealing member 20, the first circuit member 40, and the second circuit member 50 of the thin electronic device 10, respectively.

[0093] The first sealing member 20A includes a first film 22A similar to the first film 22, and includes the same sub-member 26 and air valve 28 as the first sealing member 20. The first film 22A is formed with a main opening 244A similar to the main opening 244. The main opening 244A is located above the first circuit member 40A.

[0094] The second circuit member 50A has a structure similar to that of the second circuit member 50, except that the electrode 59 is not provided. On the other hand, the first circuit member 40A has an electrode 49A. In detail, the first circuit member 40A includes a first base 42A and a first conductive pattern 44A. The first base 42A is formed with a through hole that vertically passes through the first base 42A. The electrode 49A is formed on the upper surface of the first base 42A and is connected to the first conductive pattern 44A formed on the lower surface of the first base 42A through the through hole. The sub-member 26 is bonded to the outer surface 232 of the first film 22A to close the main opening 244A. The conductive portion 266 of the sub-member 26 contacts the electrode 49A of the first conductive pattern 44A, rather than the electrode 59 of the second conductive pattern 54.

[0095] Except for the above-described difference, the thin electronic device 10A has a similar structure to the thin electronic device 10, and operates similarly to the thin electronic device 10. Therefore, according to the present modification, effects similar to those of the above-described embodiment can be obtained.

[0096] As can be seen from the above description, the first circuit member 40A may include the electrode 49A, and the second circuit member 50 may include the electrode 59. Conversely, the first circuit member 40A may include the electrode 49A, and the second circuit member 50 may include the electrode 59. Therefore, at least one of the first circuit member and the second circuit member should include an electrode configured to be connected to the conductive portion 266.

[0097] Compare Fig.11 and Figure 5 , the thin electronic device 10B according to the second modification includes the second sealing member 30, the first circuit member 40 and the second circuit member 50 which are the same as the thin electronic device 10. In addition, the thin electronic device 10B includes a first sealing member 20B which is different from the first sealing member 20 of the thin electronic device 10. The first sealing member 20B includes the first film 22, the sub-member 26 and the air valve 28 which are the same as the first sealing member 20. The inner surface 234 of the first film 22 is located inside the closed space 18. The engageable portion 262 of the sub-member 26 is engaged on the inner surface 234 which is thus arranged by using a fixing member such as an adhesive.

[0098] Except for the above-mentioned differences, the thin electronic device 10B has a similar structure to the thin electronic device 10 and operates similarly to the thin electronic device 10. For example, referring to Figures 11 to 13 , a portion of the engageable portion 262 located around the sub-opening 264 is bonded to the first film 22 over the entire circumference of the first film 22 so as to surround the main opening 244. The conductive portion 266 is in contact with the electrode 59 in the closed space 18, and is partially exposed to the external space located outside the thin electronic device 10. The conductive portion 266 and the electrode 59 are pressed against each other due to the air pressure difference between the inside and the outside of the closed space 18, thereby, the contact between the conductive portion 266 and the electrode 59 can be reliably maintained. Therefore, according to this modification, an effect similar to that of the above-mentioned embodiment and the first modification can be obtained.

[0099] The bondable portion 262 of the present modification may include a meltable layer (not shown) and a non-meltable layer (not shown). The meltable layer of the bondable portion 262 may be an upper layer of the bondable portion 262. In this case, the bondable portion 262 may be fused to the meltable layer 146 (see FIG. 1 ) of the first film 22. Figure 6 ).

[0100] Will Fig.14 and Fig.15 With Figure 1 and Figure 5In comparison, the thin electronic device 10C according to the third modification includes the second sealing member 30, the first circuit member 40 and the second circuit member 50 which are the same as the thin electronic device 10. In addition, the thin electronic device 10C includes a first sealing member 20C which is different from the first sealing member 20 of the thin electronic device 10. The first sealing member 20C includes the first film 22 and the air valve 28 which are the same as the first sealing member 20. However, the first sealing member 20C does not include the sub-member 26. The first sealing member 20C includes a conductive portion 246C to replace the conductive portion 266 of the sub-member 26.

[0101] The conductive portion 246C is composed of a conductor such as metal similarly to the conductive portion 266, and is formed by the same forming method as the conductive portion 266. The conductive portion 246C closes the main opening 244 of the first film 22. The conductive portion 246C extends over the entire main opening 244 in the XY plane and completely closes the main opening 244. Therefore, the conductive portion 246C blocks air that may flow through the main opening 244.

[0102] Except for the above-mentioned differences, the thin electronic device 10C has a similar structure to the thin electronic device 10 and operates similarly to the thin electronic device 10. For example, referring to Fig.15 , the conductive portion 246C is in contact with the electrode 59 in the closed space 18, and is partially exposed to the external space outside the thin electronic device 10. Due to the air pressure difference between the inside and outside of the closed space 18, the conductive portion 246C and the electrode 59 are pressed against each other, and thus, the contact between the conductive portion 246C and the electrode 59 can be reliably maintained. Therefore, according to this modification, effects similar to those of the above-described embodiment, the first modification, and the second modification can be obtained.

[0103] In addition to the modifications already described, various modifications may be made to the present embodiment.

[0104] For example, refer to Figure 6 , the peripheral edge 229 of the first film 22 and the peripheral edge 329 of the second film 32 may be connected to each other at the rear end (negative X-side end) in the front-rear direction (X direction) thereof. In other words, each of the first film 22 and the second film 32 may be part of a single planar sheet that is folded so that the first film 22 and the second film 32 overlap each other. On the contrary, except for the rear end thereof, the peripheral edge 229 of the first film 22 and the peripheral edge 329 of the second film 32 may be connected to each other. In other words, each of the first film 22 and the second film 32 may be part of a single folded sheet.

[0105] The folded sheet may have an openable and closable fastener disposed on its rear end. In this case, vacuuming may be performed with the fastener closed. Thereafter, the first film 22 and the second film 32 portions located in front of the fastener (positive X side) may be fused to each other. The portion provided with the air valve 28 may be cut off after fusion.

[0106] The first circuit member 40 may be a member integral with the first sealing member 20. The second circuit member 50 may be a member integral with the second sealing member 30. For example, the first base 42 may be adhered and fixed on the lower surface of the first film 22. On the contrary, the first conductive pattern 44 may be formed on the lower surface of the first film 22. The second circuit member 50 may be disposed on the additional film 38. For example, the second base 52 may be adhered and fixed on the upper surface of the additional film 38. On the contrary, the second conductive pattern 54 may be formed on the upper surface of the additional film 38. In addition, when the second sealing member 30 does not include the additional film 38, the second base 52 may be adhered and fixed on the upper surface of the second film 32. On the contrary, the second conductive pattern 54 may be formed on the upper surface of the second film 32.

[0107] and Figures 9 to 11 Refer to Fig.16 As described above, the method for forming the conductive portion 266 of the sub-component 26 is not particularly limited. For example, the sub-component 26 may be a conductive gel 26D. In other words, the first sealing member 20, 20A or 20B may include the conductive gel 26D (see Fig.16 The conductive gel 26D is preferably a thin electronic device 10D) instead of the sub-component 26. The conductive gel 26D has flexibility and adhesiveness as well as conductivity, and is therefore suitable for being directly attached to the human body. When the conductive gel 26D is used, there is no need to form the sub-opening 264. A portion of the conductive gel 26D covering the main opening 244 or 244A serves as the conductive portion 266, and another portion of the conductive gel 26d configured to be bonded to the first film 22 or 22a serves as the engageable portion 262. Therefore, the conductive gel 26D includes the conductive portion 266 and the engageable portion 262 similarly to the sub-component 26, and works similarly to the sub-component 26.

Claims

1. A thin electronic device comprising a first sealing member, a second sealing member, a first circuit member and a second circuit member, characterized in that: The first sealing member includes a first film formed of a thin film as a base of the first sealing member, and includes a conductive portion made of a conductor; The device is formed with a closed space; The closed space is closed by the first sealing member and the second sealing member and is isolated from the external space outside the device; The first circuit member and the second circuit member are enclosed in a closed space; The first circuit member includes a first contact point; The second circuit member includes a second contact point; The first contact point and the second contact point are pressed against each other to contact each other in the closed space due to the air pressure difference between the inside and the outside of the closed space without using a fixing member; At least one of the first circuit member and the second circuit member comprises an electrode; and The conductive portion contacts the electrode in the closed space and is partially exposed to an external space outside the device.

2. The thin electronic device according to claim 1, wherein: The first film is formed with a main opening A main opening passes through the first membrane; and The conductive portion closes the main opening.

3. The thin electronic device according to claim 1, wherein: The first sealing member includes a sub-member in addition to the first membrane; The first membrane is formed with a main opening; A main opening passes through the first membrane; The sub-component includes an engageable portion and a conductive portion; The sub-member is formed with a sub-opening; The sub-opening passes through the engageable portion; The conductive portion closes the sub-opening; as well as A portion of the engageable portion located around the sub-opening is engaged to the first film over the entire circumference of the first film.

4. The thin electronic device according to claim 3, characterized in that: The first film has an outer surface; The exterior surface is located outside the enclosure; and The engageable portion is engaged on the outer surface.

5. The thin electronic device according to claim 3, characterized in that: The first film has an inner surface; The interior surface is located within an enclosed space; and The engageable portion is engaged on the inner surface.

6. The thin electronic device according to claim 3, characterized in that: The engageable portion of the sub-member is formed of a film.

7. The thin electronic device according to claim 1, wherein: The second sealing member includes a second film formed of a thin film as a base of the second sealing member.

8. A thin electronic device comprising a first sealing member, a second sealing member, a first circuit member and a second circuit member, characterized in that: The first sealing member includes a first film as a base of the first sealing member, the first film being formed of a thin film and containing a conductive gel; The device is formed with a closed space; The closed space is closed by the first sealing member and the second sealing member and is isolated from the external space outside the device; The first circuit member and the second circuit member are enclosed in a closed space; The first circuit member includes a first contact point; The second circuit member includes a second contact point; The first contact point and the second contact point are pressed against each other to contact each other in the closed space due to the air pressure difference between the inside and the outside of the closed space without using a fixing member; At least one of the first circuit member and the second circuit member comprises an electrode; The conductive gel includes a conductive portion; and The conductive portion contacts the electrode in the closed space and is partially exposed to an external space outside the device.

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