A switching device, electronic equipment, terminal and method for manufacturing a switching device

Abstract

The application provides a switching device, an electronic device, a terminal and a preparation method of the switching device, relates to the field of radio frequency, and is used for solving the connection problem between a microstrip line and a waveguide, for example, the antenna structure of a sensor such as a radar. The switching device provided by the application comprises a substrate, a coupling cavity and a resonant cavity. The substrate is provided with a through slot penetrating through a first plate surface and a second plate surface, and the inner wall of the through slot is provided with a conductive layer. The coupling cavity is arranged on the first plate surface of the substrate, and the coupling cavity is coupled with the first end of the through slot. The waveguide can be coupled with the second end of the through slot, so that the coupling cavity and the waveguide can be coupled through the through slot. The resonant cavity is arranged on the first plate surface of the substrate, and the resonant cavity is provided with at least one gap and a connecting end. The gap is coupled with the coupling cavity, and the connecting end of the resonant cavity is connected with the microstrip line. Through the through slot, electromagnetic signals can be transmitted between the first plate surface and the second plate surface of the substrate, so that the out-of-plane transmission effect is realized.

Description

Technical Field

[0001] This application relates to the field of radio frequency, and more particularly to a method for manufacturing a switching device, electronic device, terminal, and switching device, such as radar and radar antenna structure. Background Technology

[0002] Compared to traditional PCB (Printed Circuit Board) antennas, waveguide antennas offer significant advantages in terms of low loss and high bandwidth, making them easier to achieve high efficiency, long-range coverage, and high range resolution. Furthermore, waveguide antennas have a wider horizontal beamwidth, providing a larger field of view and extending the detection range. Therefore, waveguide antennas are increasingly being widely used.

[0003] In practical applications, waveguide antennas need to be connected to devices such as chips. However, since the output lines of chips and other devices are generally microstrip lines, while the interface of waveguide antennas is a standard waveguide structure, direct energy transfer is not possible. To enable signal transmission between waveguide antennas and chips and other devices, a bridging device is needed to bridge the waveguide and the microstrip line. The main function of the bridging device is to convert different modes of electromagnetic energy in the microstrip line and the waveguide, and to reduce energy loss during the energy conversion process.

[0004] However, there is currently no adapter that can achieve efficient energy conversion and transmission. Summary of the Invention

[0005] This application provides a method for preparing a switching device, electronic device, terminal, and switching device that can effectively avoid energy leakage during transmission and achieve efficient energy conversion and transmission.

[0006] On one hand, this application provides a switching device including a substrate, a coupling cavity, and a resonant cavity. The substrate has a first plate surface and a second plate surface, and the substrate has a through-slot penetrating the first plate surface and the second plate surface. The inner wall of the through-slot has a conductive layer to enable efficient transmission of electromagnetic signals within the through-slot. The coupling cavity is disposed on the first plate surface of the substrate and is coupled to the first end of the through-slot. A waveguide can be coupled to the second end of the through-slot so that the coupling cavity and the waveguide can be coupled through the through-slot. The resonant cavity is disposed on the first plate surface of the substrate and has at least one slot and a connecting end. The slot is coupled to the coupling cavity, and the connecting end of the resonant cavity is connected to a microstrip line. It should be noted that coupling refers to the effective transmission of electromagnetic signals or energy between two components, and is not a limitation on the mechanical structural connection relationship between the two components. In practical applications, various different types of mechanical structures can be used to achieve coupling between two components. In the switching device provided in this application, electromagnetic signals can be transmitted between the first plate surface and the second plate surface of the substrate through the through-slot, thereby achieving a non-planar transmission effect. This also avoids additional insertion loss when electromagnetic signals pass through the substrate, which helps improve signal transmission efficiency. The resonant cavity is coupled to the coupling cavity through a gap, which helps reduce the overall size of the adapter. Furthermore, it allows for efficient transmission of electromagnetic signals from the resonant cavity to the coupling cavity. Alternatively, electromagnetic signals from the coupling cavity can also be efficiently transmitted to the resonant cavity, further improving signal transmission efficiency.

[0007] In some implementations, the switching device may also include a microstrip line disposed on the first plate surface. The microstrip line may include a gradient transition structure, and the connection end of the resonant cavity is used to connect to the microstrip line through the gradient transition structure.

[0008] In some implementations, the coupling cavity can be a stepped structure with an opening towards the first surface of the substrate. This stepped structure design effectively increases the bandwidth of the coupling cavity and ensures stable performance.

[0009] When the coupling cavity is fixed to the first plate surface, the edge of the coupling cavity opening can be welded to the first plate surface of the substrate. This ensures the connection between the coupling cavity and the substrate and prevents energy leakage.

[0010] In addition, to ensure the relative positional accuracy between the coupling cavity and the substrate, in a specific implementation, the coupling cavity may have a first positioning structure, wherein the first positioning structure is used to position the coupling cavity at a target position on the substrate.

[0011] In some embodiments, the cross-sectional shape of the slot can be the same as or similar to that of the waveguide to prevent insertion loss, impedance mismatch, and other adverse effects when the signal propagates between the waveguide and the substrate slot. It should be noted that the aforementioned identical shapes are an ideal situation. In specific product design and manufacturing, the cross-sectional shapes of the slot and the waveguide may deviate to some extent, or the difference in cross-sectional shapes may not cause a significant performance deviation. Therefore, this application does not strictly limit the cross-sectional shapes to being completely identical; they can also be similar or have some differences.

[0012] In some implementations, the resonant cavity may include a substrate integrated waveguide. A first end of the substrate integrated waveguide may include a connection terminal, and a second end may be provided with an electric wall to allow electromagnetic signals within the integrated waveguide to be efficiently transmitted outward through a slot. The slot may be located on the surface of the substrate integrated waveguide facing away from the substrate.

[0013] In a specific implementation, the length of the gap can be 0.5λg, where λg is the wavelength of the electromagnetic wave propagating in the first medium. Optionally, the first medium can be a substrate, a resonant cavity, or air. It is understood that in a specific implementation, the number, shape, size, and other parameters of the gaps can be reasonably set according to actual conditions, and this application does not limit this.

[0014] In some implementations, the adapter may also include a waveguide, the first end of which may have a flange, the top surface of which is in contact with the second surface of the substrate. The flange's structural design facilitates the fabrication of a flat surface with high flatness, thus improving the fit between the waveguide and the lower surface of the substrate 11 and preventing signal leakage and other adverse conditions.

[0015] In addition, to ensure the positioning accuracy between the waveguide and the substrate, a second positioning structure can be set in the waveguide, and a third positioning structure can be set on the second surface of the substrate. During assembly, the second and third positioning structures can cooperate with each other to ensure the relative position between the waveguide and the substrate. Finally, the waveguide and the substrate can be fixedly connected by welding, screws, clips, adhesives, or other connection methods.

[0016] On the other hand, embodiments of this application also provide an electronic device, including a chip and a waveguide antenna, and further including any of the aforementioned adapters. The chip can be connected to the connection end of the resonant cavity via a microstrip line, and the waveguide antenna can be connected to the second end of the through slot via a waveguide.

[0017] In practical applications, electronic devices can also be radars, base stations, detectors, etc. This application does not limit the specific type of electronic device.

[0018] On the other hand, embodiments of this application also provide a terminal, including the aforementioned electronic device. The terminal may be a drone, smart home device, smart manufacturing equipment, surveying equipment, etc. This application does not limit the application scope of the adapter and the electronic device equipped with the adapter.

[0019] On the other hand, embodiments of this application also provide a fabrication method, comprising: forming a through-groove in a substrate having a first plate surface and a second plate surface, and providing a conductive layer on the inner wall of the through-groove, wherein a first end of the through-groove extends through the first plate surface, and a second end of the through-groove extends through the second plate surface. A coupling cavity is disposed on the first plate surface, and the coupling cavity is coupled to the first end of the through-groove. A resonant cavity is disposed on the first plate surface. The resonant cavity has at least one gap and a connecting end, the gap being coupled to the coupling cavity, and the connecting end being used to connect a microstrip line.

[0020] In a specific implementation, the method may further include: placing a microstrip line on the first plate surface. The microstrip line includes a gradient transition structure, and the connecting end is used to connect to the microstrip line through the gradient transition structure.

[0021] In some embodiments, the method may further include providing a first positioning structure in the coupling cavity. The coupling cavity is positioned at a target location on the substrate using an auxiliary tooling having a fixing structure for engaging with the first positioning structure.

[0022] When fixing the coupling cavity to the first plate, surface mounting, laser welding, or other methods can be used to weld the coupling cavity to the first plate to achieve a fixed connection between the coupling cavity and the substrate.

[0023] Additionally, the method may also include: attaching the top surface of the flange of the first end face of the waveguide to the second plate surface.

[0024] In some embodiments, a second positioning structure can be provided on the waveguide, and a third positioning mechanism can be provided on the second surface of the substrate. The second and third positioning structures are engaged to position the waveguide on the second surface. Finally, the waveguide and the substrate can be fixedly connected by welding or by fasteners such as screws. Attached Figure Description

[0025] Figure 1 This is a perspective structural diagram of an adapter provided in an embodiment of this application;

[0026] Figure 2 This is a cross-sectional structural schematic diagram of an adapter provided in an embodiment of this application;

[0027] Figure 3 This is a three-dimensional structural diagram of a coupling cavity provided in an embodiment of this application;

[0028] Figure 4 This is a schematic cross-sectional view of a coupling cavity provided in an embodiment of this application;

[0029] Figure 5 A cross-sectional structural schematic diagram of another coupling cavity provided in an embodiment of this application;

[0030] Figure 6 This is a schematic diagram of a planar structure of a substrate provided in an embodiment of this application;

[0031] Figure 7 A three-dimensional structural diagram of a resonant cavity provided in an embodiment of this application;

[0032] Figure 8 A three-dimensional structural schematic diagram of another resonant cavity provided in an embodiment of this application;

[0033] Figure 9 A cross-sectional structural schematic diagram of another adapter provided in an embodiment of this application;

[0034] Figure 10 A three-dimensional structural diagram of a waveguide provided in an embodiment of this application;

[0035] Figure 11 A three-dimensional structural schematic diagram of a substrate provided in an embodiment of this application;

[0036] Figure 12 This is a schematic diagram of a waveguide structure provided in an embodiment of this application;

[0037] Figure 13 A signal data simulation diagram of an adapter provided in an embodiment of this application;

[0038] Figure 14 An electric field intensity distribution diagram of an adapter provided in an embodiment of this application;

[0039] Figure 15 A flowchart illustrating a method for manufacturing an adapter according to an embodiment of this application;

[0040] Figure 16 A flowchart illustrating another method for preparing a switching device provided in this application embodiment;

[0041] Figure 17 This is a cross-sectional structural diagram of a radar provided in an embodiment of this application. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0043] To facilitate understanding of the adapter provided in the embodiments of this application, its application scenarios will be introduced first.

[0044] The adapter provided in this application can be used between waveguides and microstrip lines to achieve efficient connection between them.

[0045] For example, some vehicles are typically equipped with onboard antennas. Current onboard antennas usually employ the more traditional PCB (Printed Circuit Board) antenna. In practical applications, PCB antennas can be connected to chips and other devices via microstrip lines to transmit signals. However, with the increasing demands for antenna performance, onboard antennas are gradually evolving towards lower loss, wider bandwidth, and larger array sizes. Therefore, traditional PCB antennas can no longer meet these requirements.

[0046] Compared to PCB printed antennas, waveguide antennas have significant advantages in terms of low loss and wide bandwidth, and waveguide antennas are gradually being widely used.

[0047] However, in practical applications, waveguide antennas typically use waveguides for signal transmission, while chips and other devices generally use microstrip lines. Therefore, a suitable adapter is needed to connect the waveguide antenna (or waveguide) and the chip (or microstrip line) to achieve efficient signal transmission. However, current adapters still have many shortcomings and struggle to achieve cross-plane transmission, thus failing to achieve efficient signal conversion and transmission.

[0048] Therefore, this application provides a switching device that can effectively avoid signal leakage during transmission and achieve efficient signal conversion and transmission.

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0051] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0052] In a switching device provided in this application, the switching device may include: a substrate having a first plate surface and a second plate surface, and the substrate having a through groove, the first end of the through groove penetrating to the first plate surface, the second end of the through groove penetrating to the second plate surface, and the inner wall of the through groove having a conductive layer; a coupling cavity disposed on the first plate surface, and the coupling cavity being coupled to the first end of the through groove; and a resonant cavity disposed on the first plate surface, the resonant cavity having at least one gap and a connecting end, the gap being coupled to the coupling cavity, and the connecting end being used to connect a microstrip line.

[0053] Specifically, such as Figure 1 and Figure 2As shown, in one embodiment provided in this application, the adapter 10 includes a substrate 11, a coupling cavity 12, and a resonant cavity 13. The substrate 11 has a first surface (upper surface in the figure) and a second surface (lower surface in the figure). The substrate 11 has a through-slot 111 penetrating the first and second surfaces, and the inner wall of the through-slot 111 has a conductive layer (not shown in the figure) to enable efficient transmission of electromagnetic signals within the through-slot 11. The coupling cavity 12 is disposed on the upper surface of the substrate 11 and is coupled to the upper end of the through-slot 111. The waveguide 01 can be coupled to the lower end of the through-slot 111, allowing coupling between the coupling cavity 12 and the waveguide 01 through the through-slot 111. The resonant cavity 13 is disposed on the upper surface of the substrate 11 and has a slot 131 and a connection end (not shown in the figure). The slot 131 is coupled to the coupling cavity 12, and the connection end of the resonant cavity 13 is connected to the microstrip line 02 through a gradient transition structure 021. It should be noted that coupling refers to the effective transmission of electromagnetic signals or energy between two components, and is not a limitation on the mechanical structural connection between the two components. In practical applications, various different types of mechanical structures can be used to achieve coupling between two components.

[0054] In the adapter 10 provided in this embodiment, electromagnetic signals can be transmitted between the upper and lower surfaces of the substrate 11 via the through slot 111, thereby achieving a non-planar transmission effect. This also avoids additional insertion loss when the electromagnetic signal passes through the substrate 11, which is beneficial for improving signal transmission efficiency. The resonant cavity 13 is coupled to the coupling cavity 12 via the slot 131, which helps to reduce the overall size of the adapter 10. Furthermore, electromagnetic signals in the resonant cavity 13 can be efficiently transmitted to the coupling cavity 12. Alternatively, electromagnetic signals in the coupling cavity 12 can also be efficiently transmitted to the resonant cavity 13, thereby improving signal transmission efficiency.

[0055] Specifically, the adapter 10 may further include a microstrip line 02 disposed on the first plate surface, and the microstrip line 02 may include a gradient transition structure 021. The connection end of the resonant cavity 13 is used to connect to the microstrip line 02 via the gradient transition structure 021.

[0056] To facilitate understanding of the technical solution of this application, the signal processing flow will be explained in detail below.

[0057] Please continue reading. Figure 1 and Figure 2When a signal is transmitted from microstrip line 02 to waveguide 01, the electrical signal in microstrip line 02 can be converted by the gradient transition structure 021. For example, the quasi-TEM (Transverse Electromagnetic Wave) in microstrip line 02 can be converted into a TE (Transverse Electric Wave) that can propagate within resonant cavity 13 by the gradient transition structure 021. The TE wave propagates within resonant cavity 13 and couples with coupling cavity 12 through slot 131. Coupler cavity 12 resonates under the excitation of slot 131 and converts energy into TE. 10 Wave. The coupling cavity 12 is coupled to the upper end of the through slot 111, and the lower end of the through slot 111 is coupled to the waveguide 01. Therefore, TE 10 Waves can be transmitted through slot 111 to waveguide 01, thus realizing the entire energy transfer process from microstrip line 02 to waveguide 01. TEM waves refer to electromagnetic waves whose electric and magnetic fields lie in a plane perpendicular to the propagation direction. TE waves refer to electromagnetic waves whose electric field vector is perpendicular to the propagation direction, and whose magnetic field vector components include both perpendicular and parallel components to the propagation direction. 10 A wave refers to an electromagnetic wave in a standard waveguide that has a magnetic field component but no electric field component along its propagation direction.

[0058] It is understandable that when a signal is transmitted from waveguide 01 to microstrip line 02, the entire signal transmission process is the reverse of the above, and will not be elaborated here.

[0059] In specific implementations, the substrate 11 can be a printed circuit board (PCB) or a flexible printed circuit (FPC), or other types of board structures. The substrate 11 can be a single-layer board or a multi-layer board. This application does not limit the specific type, number of layers, or shape of the substrate 11. It is understood that when the substrate 11 is a multi-layer board, the first board surface refers to the upper surface of the top layer, and the second board surface refers to the lower surface of the bottom layer.

[0060] In practical applications, microstrip line 02 can be an independent line structure.

[0061] Or, such as Figure 1As shown, the microstrip line 02 can also be directly formed on the upper surface of the substrate 11 using processes such as coating and etching. Furthermore, in the embodiments provided in this application, to improve the transmission effect of electrical signals in the microstrip line 02 and prevent adverse effects such as electromagnetic interference, rows of metal vias 022 are provided on both sides of the microstrip line 02 along its length. It is understood that in other embodiments, the metal vias 022 can be replaced with a structure similar to the microstrip line, or their arrangement can be omitted; this application does not limit this.

[0062] In addition, the specific structural type of the coupling cavity 12 can be varied in actual implementation.

[0063] For example, such as Figure 3 and Figure 4 As shown, in one embodiment provided in this application, the coupling cavity 12 has a stepped structure with an opening towards the substrate. For example, it opens towards the first surface of the substrate 11.

[0064] Specifically, the coupling cavity 12 includes a front cavity 121 and a back cavity 122. The front cavity 121 includes a first cavity 1211 and a second cavity 1212 of unequal height. The height of the first cavity 1211 is slightly greater than the height of the second cavity 1212. In the coupling cavity 12 provided in this application, the stepped structural design can effectively improve the bandwidth of the coupling cavity 12 and ensure the stability of its working performance.

[0065] It is understood that, in other embodiments, the coupling cavity 12 may also be a non-stepped structure.

[0066] For example, such as Figure 5 As shown, in another embodiment provided in this application, the cavity of the coupling cavity 12 is rectangular. Of course, in other embodiments, the cavity of the coupling cavity 12 can also be elliptical, circular, or other shapes. The specific shape of the coupling cavity 12 is not limited in this application.

[0067] In addition, such as Figure 2 As shown. When mounting the coupling cavity 12 onto the substrate 11, a first positioning structure 123 can be provided on the coupling cavity 12 to improve the relative positional accuracy between the coupling cavity 12 and the substrate 11. During assembly, the coupling cavity 12 can be positioned using an auxiliary tooling (not shown in the figure) to accurately mount the coupling cavity 12 at the target position on the substrate 11. Subsequently, a welding process (such as surface mount, laser welding, etc.) can be used to fix the coupling cavity 12 to the upper surface of the substrate 11 to achieve a fixed connection between the coupling cavity 12 and the substrate 11.

[0068] Specifically, such as Figure 2As shown, in the embodiments provided in this application, the first positioning structure 123 includes a positioning hole. An auxiliary tooling (not shown) may include a positioning post.

[0069] In practice, the cross-section of the positioning hole can be circular, elliptical, rectangular, or other polygonal structures. Correspondingly, the cross-section of the positioning post can be circular, elliptical, rectangular, or other polygonal structures.

[0070] Alternatively, the positioning hole and the positioning post can be fitted with a clearance fit. That is, when the positioning post is inserted into the positioning hole, a certain gap can be maintained between the positioning post and the positioning hole to allow for smoother insertion. Furthermore, fixing the coupling cavity 12 onto the base plate 11 facilitates the disassembly of the auxiliary tooling. Alternatively, the positioning post and the positioning hole can be fitted with an interference fit. That is, when the positioning post is inserted into the positioning hole, a tighter fit can be achieved between the positioning post and the positioning hole to prevent loosening, thereby improving the stability between the coupling cavity 12 and the auxiliary tooling.

[0071] In specific configurations, the number of positioning holes and positioning posts can be one or more. For example, there can be two positioning posts. Correspondingly, there can also be two positioning holes. Multiple positioning posts and positioning holes can effectively improve the relative position between the coupling cavity and the auxiliary tooling, allowing the coupling cavity 12 to be more accurately mounted on the substrate 11. In specific configurations, the number of positioning posts can be consistent with the number of positioning holes; that is, one positioning post corresponds to one positioning hole.

[0072] In addition, when fixing the coupling cavity 12 to the substrate 11, the coupling cavity 12 and the substrate 11 can be fixedly connected by welding.

[0073] For example, the coupling cavity 12 can be soldered to the upper surface of the substrate 11 using a surface mount process.

[0074] Please refer to the following: Figure 2 and Figure 3 Specifically, the edge 120 of the opening of the coupling cavity 12 can be welded to the upper surface of the substrate 11. In practice, the thickness of the edge 120 of the opening of the coupling cavity 12 can be minimized as much as possible to effectively reduce the welding area between the coupling cavity 12 and the substrate 11. This avoids problems such as warping of the substrate 11 caused by large-area welding. In addition, it can also reduce defects caused by processing errors to a certain extent.

[0075] It is understood that in other embodiments, the coupling cavity 12 and the substrate 11 can also be fixedly connected in other ways. For example, the coupling cavity 12 and the substrate 11 can be fixedly connected by welding, screws, clips, adhesives, etc. This application does not limit the method of fixing the coupling cavity 12 and the substrate 11.

[0076] When configuring the resonant cavity 13, the specific type and structure of the resonant cavity 13 can be varied.

[0077] For example, such as Figure 6 As shown, in one embodiment provided in this application, the resonant cavity 13 includes a substrate integrated waveguide (SIW).

[0078] Specifically, such as Figure 7 As shown, a substrate integrated waveguide is a microwave transmission line structure that utilizes metal vias on a dielectric substrate to realize the waveguide's field propagation mode. Structurally, the substrate integrated waveguide mainly includes a dielectric substrate 132, with an upper metal layer 133 on the upper surface and a lower metal layer 134 on the lower surface. Multiple metal vias 135 are arranged in a row within the dielectric substrate 132, extending through the upper metal layer 133 and the lower metal layer 134. Furthermore, to allow electromagnetic waves within the substrate integrated waveguide to couple with the coupling cavity through the slot 131, an electric barrier 136 is provided at one end of the substrate integrated waveguide (the left end in the figure). The electric barrier 136 effectively blocks electromagnetic waves within the integrated waveguide, thereby allowing the electromagnetic waves to couple with the coupling cavity through the slot 131.

[0079] In the embodiments provided in this application, the electric wall 131 is composed of a row of spaced-apart metal through holes. It is understood that in other embodiments, the electric wall 131 may also be composed of a metal element embedded in the dielectric substrate 132 or a metal layer disposed at the left end of the dielectric substrate 132. This application does not limit the arrangement of the electric wall 131.

[0080] The dielectric substrate 132 can be a component of the substrate 11. For example, when the substrate 11 is a multilayer board, the dielectric substrate 132 can be the uppermost plate structure located on the substrate 11. Alternatively, the substrate integrated waveguide can also be an independent unit, which is then fixed to the upper surface of the substrate 11 using surface mounting or other processes. In specific applications, the substrate integrated waveguide and the substrate 11 can be an integral structure or a separate structure; this application does not impose specific limitations on this.

[0081] In practical applications, the gap 131 can be formed on the surface of the resonant cavity 13 away from the substrate 11.

[0082] Specifically, such as Figure 7 As shown. The slit 131 can be formed on the surface of the upper metal layer 133 and the slit 131 penetrates the thickness of the upper metal layer 133 so that the electromagnetic signal of the resonant cavity 13 can be transmitted outward through the slit.

[0083] Please refer to the following: Figure 2 Since the coupling cavity 12 is also disposed on the upper surface of the substrate 11 in practical applications, the slot 131 can be formed on the surface of the resonant cavity 13 facing away from the substrate 11 in order to enable the electromagnetic signal transmitted from the slot 131 to be efficiently transmitted into the coupling cavity 12. Furthermore, in specific applications, the slot 131 can be located within the projection range of the second cavity 1212 or within the projection range of the back cavity 122. The relative positional relationship between the slot 131 of the resonant cavity 13 and the coupling cavity 12 is not limited in this application.

[0084] In addition, in specific configurations, the resonant cavity 13 can be made of substrate integrated waveguides, or it can also be made of other materials such as... Figure 8 The rectangular resonant cavity shown. Alternatively, it can be understood that by replacing the two rows of metal vias 135 and electric walls 136 in the substrate integrated waveguide with metal layers, a structure similar to a rectangular resonant cavity can be formed.

[0085] It is understood that in other embodiments, the resonant cavity 13 may also be a cylindrical resonant cavity or the like. However, this application does not limit the specific type of the resonant cavity 13.

[0086] When specifically configuring the resonant cavity 13, the resonant cavity 13 can be directly formed on the first surface of the substrate 11, or the formed resonant cavity 13 can be fixed on the first surface of the substrate 11. This application does not limit the specific forming method of the resonant cavity 11.

[0087] Furthermore, in practical applications, the length of the slit 131 can be controlled to be approximately 0.5λg to enable the adapter to achieve broadband characteristics. Here, λg is the wavelength of the electromagnetic wave propagating in the medium. This medium refers to the substrate 11, the resonant cavity 13, or air. It should be noted that the wavelength of the electromagnetic wave propagating in the resonant cavity 13 can be understood as the wavelength of the electromagnetic wave propagating in the material medium of the resonant cavity 13, or the wavelength of the electromagnetic wave propagating in the cavity of the resonant cavity 13. It is understood that in other embodiments, the length and width of the slit 131 can also be set according to different requirements; this application does not limit the size of the slit 131. In addition, in practical applications, two, three, or even more slits 131 can be provided. Multiple slits can be arranged parallel to each other or intersecting. This application does not limit the number or arrangement of the slits 131.

[0088] For the gradient transition structure 021, such as Figure 6 As shown. Its main function is to realize impedance transformation between resonant cavity 13 and microstrip line 02, and to realize the conversion between TE wave and TEM wave.

[0089] The main body of the gradient transition structure 021 is a microstrip line gradient. There are many forms of microstrip line gradients. For example, a microstrip line gradient can be an arc-shaped gradient, a straight-line gradient, a broken-line gradient, etc.

[0090] For example, such as Figure 6 As shown, in the embodiments provided in this application, the microstrip line gradient line (i.e., the outline of the edge of the gradient transition structure) of the gradient transition structure 021 is an arc-shaped gradient line. It is understood that in specific applications, the form of the microstrip line gradient line can be reasonably selected according to the actual situation, and this application does not limit it in this regard.

[0091] In addition, in order to improve the connection between waveguide 01 and substrate 11, the structure of waveguide 01 can also be adapted during specific settings.

[0092] For example, such as Figure 9 and Figure 10 As shown, in one embodiment of this application, a flange 011 is provided on the end face of one end of the waveguide 01 (the upper end in the figure). The top surface of the flange 011 is used to fit against the lower surface of the substrate 11. Specifically, the structural design of the flange 011 makes it easier to manufacture the top surface of the flange 011 into a plane with high flatness. Therefore, it is beneficial to improve the fit between the waveguide 01 and the lower surface of the substrate 11 and prevent adverse conditions such as signal leakage.

[0093] In practical implementation, the shape and profile of the flange 011 can be adaptively set according to the cross-sectional shape of the cavity 010 in the waveguide 01. For example, when the cross-sectional shape of the cavity 011 in the waveguide 01 is rectangular, the flange 011 can also be set to a rectangular shape. When the cross-sectional shape of the cavity 010 in the waveguide 01 is elliptical, the flange 011 can also be set to an elliptical shape.

[0094] In summary, the flange 011 can be located at the edge of the opening of the cavity 010 in the waveguide 01, thereby effectively preventing signal leakage from the opening of the cavity 010.

[0095] In addition, to improve the signal transmission efficiency between the substrate 11 and the waveguide 01, the cross-sectional shape of the through slot 111 can be the same as that of the cavity 010 to prevent adverse effects such as insertion loss and impedance mismatch when the signal propagates between the waveguide 01 and the through slot 111 of the substrate 11.

[0096] In addition, when waveguide 01 is mounted on the underside of substrate 11, in order to improve the relative positional accuracy between waveguide 01 and substrate 11, a matching positioning structure can be provided for waveguide 01 and substrate 11 to ensure the relative position between waveguide 01 and substrate 11.

[0097] Specifically, such as Figure 11 and Figure 12 As shown, in the embodiment provided in this application, a second positioning structure 012 is provided on the upper side of the waveguide 01, and a third positioning structure 112 is provided on the lower side of the substrate 11. The second positioning structure 012 includes positioning posts. The third positioning structure 112 includes positioning holes.

[0098] First, it should be noted that... Figure 11 In the substrate 11, there are multiple arrayed through slots 111 (24 are shown in the figure, but this is only an example and the specific number is not limited). Figure 12 In the waveguide 01, there are multiple arrayed cavities 010. After the substrate 11 and the waveguide 01 are assembled, the through slots 111 and cavities 010 are coupled one-to-one. In this way, the coupling between multiple through slots 111 and cavities 010 can be achieved simultaneously, which can effectively increase the capacity of the adapter 10, and also facilitates the manufacturing process and simplifies the assembly process.

[0099] Understandably, in practical applications, multiple (e.g., 24) coupling cavities 12 and resonant cavities 13 and other related structures still need to be set on the upper surface of the substrate 11 to achieve bridging between multiple microstrip lines 02 and multiple cavities 010.

[0100] In other embodiments, the number and position of the through slots 111 provided in a single substrate 11 can be reasonably adjusted according to different needs. Correspondingly, the number and position of the cavities 010 provided in a single waveguide 01 can also be reasonably adjusted according to different needs, and this application does not impose specific limitations on this.

[0101] Furthermore, in the embodiments provided in this application, to improve the connection effect between the substrate 11 and the waveguide 01, the second positioning structure 012 includes two cap-shaped positioning posts, which are respectively disposed at two opposite corners of the waveguide 01. The third positioning structure 112 includes two positioning holes, which are respectively disposed at two opposite corners of the substrate 11.

[0102] When assembling the substrate 11 and the waveguide 01, a stable connection between the substrate 11 and the waveguide 01 can be achieved through the second positioning structure 012 and the third positioning structure 112.

[0103] It is understood that, in practical implementation, the cross-section of the positioning hole can be circular, elliptical, rectangular, or other polygonal structures. Correspondingly, the cross-section of the positioning post can be circular, elliptical, rectangular, or other polygonal structures. The number and location of the positioning holes and positioning posts can be reasonably adjusted according to actual needs, and this application does not impose any limitations on this.

[0104] In addition, during assembly, in order to improve the connection strength between waveguide 01 and substrate 11, waveguide 01 and substrate 11 can be fixedly connected by fasteners.

[0105] For example, such as Figure 11 and Figure 12 As shown in one embodiment of this application, the waveguide 01 has multiple through holes 013 (24 shown in the figure), and the lower surface of the substrate 11 has multiple threaded holes 113 (24 shown in the figure), with each through hole 013 corresponding to one of the threaded holes 113. By passing a screw through the through hole 013 of the waveguide 01 and screwing it into the threaded hole 113 in the substrate 11, a fixed connection between the waveguide 01 and the substrate 11 can be achieved. Using screws ensures the connection strength between the waveguide 01 and the substrate 11. Furthermore, it facilitates a detachable connection, thus providing high flexibility.

[0106] It is understood that in other embodiments, the substrate 11 and the waveguide 01 may be fixedly connected in other ways, and this application does not make specific limitations on this.

[0107] The following methods can be used when manufacturing the adapter:

[0108] Specifically, please combine participation Figure 9 and Figure 15 The method may include the following steps:

[0109] S1. A through groove 111 is formed in the substrate 11, and a conductive layer is formed on the inner wall of the through groove 111. The first end (upper end) of the through groove 111 extends to the first plate surface (upper plate surface), and the second end (lower end) of the through groove 111 extends to the second plate surface (lower plate surface).

[0110] S2. The coupling cavity 12 is disposed on the first plate surface so that the coupling cavity 12 is coupled to the first end of the through groove 111.

[0111] S3. The resonant cavity 13 is disposed on the first plate surface. The resonant cavity 13 has at least one slot 131 and a connecting end (not shown in the figure). The slot 131 is coupled to the coupling cavity 12, and the connecting end is used to connect the microstrip line 02.

[0112] In the actual fabrication process, the through-slot 111 in the substrate 11 can be formed using processes such as cutting or CNC machine tool processing. This application does not impose specific limitations on the method of forming the through-slot 111. When a conductive layer is formed on the inner wall of the through-slot 111, conductive materials (such as copper, silver, or alloys) can be directly formed onto the inner wall of the through-slot 111 using processes such as electroplating or vapor deposition. This application does not impose specific limitations on the material and preparation process of the conductive layer.

[0113] The resonant cavity 13 can be directly formed on the first surface of the substrate 111. Alternatively, the resonant cavity 13 can be fabricated first, and then the formed resonant cavity 13 can be fixed to the first surface using surface mounting or other processes. This application does not limit the forming method of the resonant cavity 13 or the assembly process between the resonant cavity 13 and the substrate 11.

[0114] In some fabrication methods, the microstrip line 02 can also be disposed on the first surface of the substrate 11.

[0115] For example, such as Figure 16 As shown, the preparation method provided in the embodiments of this application further includes:

[0116] S4. The microstrip line 02 is disposed on the first plate surface. The microstrip line 02 includes a gradient transition structure 021, and the connection end of the resonant cavity 13 is used to connect to the microstrip line 02 through the gradient transition structure 021. Alternatively, in actual fabrication, processes such as coating and etching can be used to directly form the microstrip line 02 onto the first plate surface of the substrate 11.

[0117] When the coupling cavity 12 is disposed on the first plate surface, the coupling cavity 12 and the substrate 11 can be fixedly connected by welding. Alternatively, the coupling cavity 12 and the substrate 11 can also be fixedly connected by screws, clips, or other connecting components.

[0118] In addition, in order to improve the relative positional accuracy between the coupling cavity 12 and the substrate 11, the coupling cavity can be set at the target position on the first plate surface by auxiliary tooling during assembly.

[0119] Specifically, the method may also include:

[0120] S5. The coupling cavity is positioned at the target location on the substrate using an auxiliary tooling. The coupling cavity 12 has a first positioning structure 123, and the auxiliary tooling has a fixing structure for cooperating with the first positioning structure 123.

[0121] During assembly, the first positioning structure 123 can be engaged with the fixing structure to achieve relative fixation between the coupling cavity 12 and the auxiliary tooling. Then, the coupling cavity 12 is transferred to the first surface of the substrate 11 using the auxiliary tooling to precisely install the coupling cavity 12 at the target position on the substrate 11. Subsequently, welding (such as surface mount, laser welding, etc.) processes can be used to fix the coupling cavity 12 to the upper surface of the substrate 11 to achieve a fixed connection between the coupling cavity 12 and the substrate 11.

[0122] For waveguide 01, waveguide 01 can be placed on the second plate surface of substrate 11, and a fixed connection between waveguide 01 and substrate 11 can be achieved.

[0123] The methods used in the production process may include:

[0124] S6. The top surface of the flange 011 at the first end of the waveguide is attached to the second plate surface.

[0125] The structural design of flange 011 makes it easy to make the top surface of flange 011 into a plane with high flatness. Therefore, it is beneficial to improve the fit between waveguide 01 and the lower surface of substrate 11 and prevent signal leakage and other adverse conditions.

[0126] In addition, to improve the relative positional accuracy between waveguide 01 and substrate 11, the method may further include the following during fabrication:

[0127] S7. Set a second positioning structure in waveguide 01. Figure 9 (Not shown in the image), a third positioning structure is provided on the second surface of the substrate 11. Figure 9 (Not shown in the image).

[0128] During assembly, the second and third positioning structures can be used in conjunction to ensure the relative position between waveguide 01 and substrate 11. Finally, the waveguide 01 and substrate 11 can be fixedly connected using screws, clips, or other connectors.

[0129] It is understood that other methods or processes may be used when manufacturing the adapter 10, and this application does not specifically limit the preparation method of the adapter 10.

[0130] The beneficial effects of the adapter provided in the embodiments of this application will be specifically explained below with reference to experimental data.

[0131] like Figure 13 The diagram shown is a simulation diagram of the signal data of the adapter 10.

[0132] In the diagram, the horizontal axis represents frequency; the vertical axis represents reflected / transmitted power. The solid line L1 represents insertion loss; the dashed line M1 represents the echo from one port of the adapter 10; and the dashed line M2 represents the echo from the other port of the adapter 10.

[0133] from Figure 13 As can be seen, the adapter 10 can achieve a bandwidth range of approximately -20dB (71.7-81.41GHz) and an insertion loss of approximately -2.36dB. That is, the adapter 10 provided in this embodiment can achieve a wide bandwidth range and low insertion loss.

[0134] like Figure 14 The figure shows the electric field intensity distribution of the adapter 10.

[0135] from Figure 14 As can be seen, the stronger electric field is mainly distributed in region A (i.e., one corner of the coupling cavity) and region B (i.e., one corner of the through slot). A stable electric field has been formed at the location where the bottom of the substrate contacts the waveguide, with no strong electric field distribution. Therefore, the entire adapter is not sensitive to the bottom waveguide tolerance. Furthermore, even with the introduction of installation errors, low insertion loss can still be achieved.

[0136] In practical applications, adapters can be used in a variety of different types of electronic devices to achieve coupling between microstrip lines and waveguides.

[0137] For example, such as Figure 17 As shown, taking an electronic device as an example, an automotive radar can be included. The automotive radar may include a chip 03 and a waveguide antenna 04. The chip can be disposed on the upper surface of the substrate 11 and connected to the adapter 10 via a gradient transition structure 021 of the microstrip line 02. The waveguide antenna can be disposed on the lower side of the substrate 11 and coupled to the lower end of the waveguide 01. That is, the adapter 10 can bridge the gap between the chip and the waveguide antenna.

[0138] In the above embodiments, only vehicle-mounted radar was used as an example for specific description. In specific applications, the electronic device can also be a base station, detector, etc. This application does not limit the specific type of electronic device.

[0139] In practical implementation, the aforementioned electronic devices equipped with adapters can also be applied to various types of terminals such as drones, smart homes, smart manufacturing equipment, and surveying equipment. This application does not limit the application scope of the adapters or the electronic devices equipped with them.

[0140] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A switching device, characterized in that, The adapter includes: A substrate has a first plate surface and a second plate surface. The substrate has a through groove, a first end of which extends through the first plate surface and a second end of which extends through the second plate surface. The inner wall of the through groove has a conductive layer. A coupling cavity is disposed on the first plate surface, and the coupling cavity is coupled to the first end of the through slot; A resonant cavity having at least one slot and a connection end, the slot being coupled to the coupling cavity, and the connection end being used to connect a microstrip line; The resonant cavity includes a dielectric substrate and an upper metal layer. The dielectric substrate is part of the substrate. The upper metal layer is located on the first plate surface. The gap is located on the upper metal layer and faces the cavity of the coupling cavity. The first end of the resonant cavity includes the connection end, and the second end of the resonant cavity is provided with an electric wall. The adapter also includes the microstrip line disposed on the first plate surface. The microstrip line includes a gradient transition structure. The connection end is connected to the microstrip line through the gradient transition structure; The second end of the through slot is used for connection with the waveguide.

2. The adapter according to claim 1, characterized in that, The coupling cavity has a stepped structure that opens toward the first surface of the substrate.

3. The adapter according to claim 2, characterized in that, The edge of the opening is welded to the first surface of the substrate.

4. The adapter according to any one of claims 1 to 3, characterized in that, The coupling cavity has a first positioning structure; The first positioning structure is used to position the coupling cavity at a target location on the substrate.

5. The adapter according to any one of claims 1 to 3, characterized in that, The cross-sectional shape of the through slot is the same as that of the waveguide.

6. The adapter according to any one of claims 1 to 3, characterized in that, The length of the gap is 0.5λg; Wherein, λg is the wavelength of the electromagnetic wave propagating in the first medium, which is the substrate, the resonant cavity, or air.

7. The adapter according to any one of claims 1 to 3, characterized in that, The first end face of the waveguide has a flange, and the top surface of the flange is in contact with the second plate surface.

8. The adapter according to claim 7, characterized in that, The waveguide has a second positioning structure, and the second surface of the substrate has a third positioning structure adapted to the second positioning structure.

9. An electronic device, characterized in that, It includes a chip and a waveguide antenna, and also includes the adapter as described in any one of claims 1 to 8; The chip is connected to the resonant cavity via a microstrip line, and the waveguide antenna is connected to the second end of the through slot via the waveguide.

10. The electronic device according to claim 9, characterized in that, The electronic device is a radar.

11. A terminal, characterized in that, It includes the electronic device as described in claim 9 or 10.

12. A preparation method, characterized in that, include: A through groove is formed in a substrate having a first plate surface and a second plate surface, and a conductive layer is provided on the inner wall of the through groove, wherein a first end of the through groove extends through the first plate surface and a second end of the through groove extends through the second plate surface; The coupling cavity is disposed on the first plate surface, and the coupling cavity is coupled to the first end of the through slot; A resonant cavity is formed in the substrate; The resonant cavity has at least one gap and a connection end, and the gap is coupled to the coupling cavity; The microstrip line is placed on the first plate surface; The microstrip line includes a gradient transition structure, and the connection end is connected to the microstrip line through the gradient transition structure.

13. The preparation method according to claim 12, characterized in that, The method further includes connecting the second end of the through slot to the waveguide.

14. The preparation method according to claim 12 or 13, characterized in that, The coupling cavity has a stepped structure that opens toward the first surface of the substrate.

15. The preparation method according to claim 14, characterized in that, The method further includes welding the edge of the opening to the first surface of the substrate.

16. The preparation method according to claim 12 or 13, characterized in that, The coupling cavity has a first positioning structure; The method further includes: The coupling cavity is positioned at a target location on the substrate using an auxiliary tooling, the auxiliary tooling having a fixing structure for cooperating with the first positioning structure.

17. The preparation method according to claim 12 or 13, characterized in that, The method further includes: The top surface of the flange at the first end of the waveguide is attached to the surface of the second plate.

18. The preparation method according to claim 17, characterized in that, The method further includes: A second positioning structure is provided in the waveguide, and a third positioning structure is provided on the second surface of the substrate; The second positioning structure is combined with the third positioning structure to position the waveguide on the second plate surface.

Images