Metal-based circuit board, processing method thereof and automatic drilling and nailing device

Abstract

The application is suitable for the technical field of printed circuit board, and provides a processing method of metal-based circuit board, which comprises the following steps: placing a metal-based circuit board to be drilled on a positioning jig; automatically conveying the positioning jig and the metal-based circuit board to a drilling mechanism; drilling holes in the side wall of the metal-based circuit board by using the drilling mechanism; automatically conveying the positioning jig and the metal-based circuit board after drilling to an embedding mechanism; and embedding copper nails in the holes by using the embedding mechanism. The processing method has high processing efficiency, high drilling and embedding precision, and can obtain products with good quality. The application also provides a metal-based circuit board and an automatic drilling and embedding device.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board production, and in particular to a metal-based circuit board and a processing method thereof, and an automatic drilling and nailing device. Background Art

[0002] With the development of 5G communication technology, people are increasingly concerned about the coverage of 5G networks. 5G networks typically expand their coverage area by building communication base stations. Communication base stations are public mobile communication base stations. Communication base stations typically integrate various components into several modules to facilitate transportation and assembly, speeding up base station construction.

[0003] In the installation of circuit boards, the traditional method requires the use of special molds or fixtures to assemble the circuit boards together. The traditional installation method is not only complicated, but also takes up a lot of space and is costly. In order to save assembly space, a method of embedding copper nails in the side walls of the circuit boards has been designed.

[0004] In the process of manufacturing circuit board products with copper nails embedded in the side walls, the current practice is to first drill holes in the side walls and then embed copper nails in the side walls. This practice requires the production of specific jigs for both drilling holes in the side walls and embedding copper nails in the side walls. In addition, manual loading and changing of materials are required during the drilling and embedding of copper nails in the side walls, which can easily scratch the products. At the same time, drilling copper holes in the side walls and embedding copper nails in the side walls are completed separately, which is inefficient. In addition, after drilling, the board needs to be washed and dried three times horizontally before the copper nails can be embedded. If the water in the holes cannot be dried out, the water overflowing from the holes will cause quality risks such as oxidation of the gold surface, leakage, and high-voltage failure. Summary of the Invention

[0005] In view of this, the present application provides a metal-based circuit board and its processing method, and an automatic drilling and nailing device, which can solve the problems of easy scratches, low efficiency and easy overflow of water in the holes during the processing of circuit board products with copper nails embedded in the side walls.

[0006] An embodiment of the first aspect of the present application provides a method for processing a metal-based circuit board, comprising:

[0007] Place the metal-based circuit board to be drilled on the positioning fixture;

[0008] Automatically transporting the positioning jig and the metal-based circuit board to a drilling mechanism;

[0009] Drilling holes in the sidewalls of the metal-based circuit board using a drilling mechanism;

[0010] Automatically transporting the positioning jig and the drilled metal-based circuit board to a nail embedding mechanism;

[0011] The copper nail is embedded in the hole by using the nail embedding mechanism.

[0012] In one embodiment, during the steps of drilling holes and embedding copper nails, the positioning fixture fixes the metal-based circuit board by vacuum adsorption.

[0013] In one embodiment, after the copper nail is embedded in the hole using the nail embedding mechanism, the processing method further includes:

[0014] The metal-based circuit board is subjected to deionization cleaning.

[0015] In one embodiment, before placing the metal-based circuit board to be drilled on the positioning fixture, the processing method further includes: cutting the material, making the outer layer circuit, applying a protective film, gong plate and grinding plate.

[0016] An embodiment of the second aspect of the present application provides a metal-based circuit board, which is processed using the processing method of the metal-based circuit board described in the first aspect.

[0017] An embodiment of a third aspect of the present application provides an automatic drilling and nailing device, which is used in the metal-based circuit board processing method described in the first aspect. The automatic drilling and nailing device includes a base plate, a material removal mechanism and a conveying mechanism provided on the base plate, and a drilling mechanism and a nailing mechanism provided in sequence along the conveying mechanism.

[0018] The conveying mechanism includes a conveying component and a positioning fixture movably arranged on the conveying component;

[0019] The material picking mechanism is used to grab the metal-based circuit board to be drilled and place the metal-based circuit board in the positioning fixture, the drilling mechanism is used to drill holes in the side wall of the metal-based circuit board, and the nail embedding mechanism is used to embed copper nails into the holes.

[0020] In one embodiment, at least one receiving groove is provided on one side of the positioning jig, and each receiving groove is used to receive a vertically placed metal-based circuit board; and a vacuum adsorption channel communicating with the receiving groove is provided on the positioning jig.

[0021] In one embodiment, the nail embedding mechanism includes a first lifting assembly provided on the base plate, a copper nail pressing cylinder connected to the first lifting assembly, and a nail ejector. The first lifting assembly and the copper nail pressing cylinder are both movable in a direction perpendicular to the base plate, and a driving end of the copper nail pressing cylinder is extendable into the nail ejector.

[0022] The automatic drilling and nailing device also includes a copper nail feeder and a nail feeding tube. The nail feeding tube is connected between the copper nail feeder and the nail output component and is used to transmit the copper nails provided by the copper nail feeder to the nail output component.

[0023] In one embodiment, the conveying mechanism is provided in two groups and the two groups of conveying mechanisms are arranged in parallel and spaced apart, and the conveying mechanism is used to convey the positioning jig along the first direction;

[0024] The nail embedding mechanism also includes a first mounting bracket provided on the base plate, and the first lifting assembly is slidably connected to the first mounting bracket along a second direction; the drilling mechanism includes a second mounting bracket provided on the base plate, a second lifting assembly slidably connected to the second mounting bracket along the second direction, and a drilling spindle connected to the second lifting assembly, wherein the second direction is perpendicular to the first direction.

[0025] In one embodiment, the automatic drilling and nailing device further includes a material discharge bin and a material receiving bin provided on one side of the base plate, wherein the material discharge bin and the material receiving bin respectively accommodate at least one metal-based circuit board;

[0026] The material picking mechanism includes a third mounting frame provided on the base plate, a third lifting assembly slidably connected to the third mounting frame along the second direction, and an adsorption assembly connected to the third lifting assembly, wherein the adsorption assembly is used to adsorb the metal-based circuit board.

[0027] The processing method of the metal-based circuit board provided in the present application uses a positioning fixture to fix and transfer the metal-based circuit board, and sequentially completes the sidewall drilling and sidewall copper nail embedding steps. The sidewall drilling and sidewall copper nail embedding are connected operations. During the processing, there is no need to unload, transfer, or use other fixtures to complete the embedding of the products after drilling. The process from sidewall drilling to sidewall copper nail embedding can be completed in one stop. Therefore, the above processing method improves processing efficiency, avoids the problem of scratched products caused by manual loading and changing materials, and avoids multiple transfers of products that affect processing accuracy. In addition, copper nails are directly embedded after drilling, and there is no foreign matter in the hole, so there is no need to wash the board and dry the product, avoiding the quality risk caused by water overflowing from the hole. Therefore, the above processing method has high processing efficiency, high precision of drilling and embedding copper nails, and can obtain products of better quality.

[0028] The metal-based circuit board provided in the present application is processed using the above-mentioned processing method, and the metal-based circuit board has a good appearance and a high yield.

[0029] The above-mentioned automatic drilling and nailing device is used for processing metal-based circuit boards. The product can be fixed by a positioning jig and the positioning jig and the product can be moved by a conveying component, and the drilling mechanism and the nailing mechanism can be used in sequence to realize drilling and embedding of copper nails on the side wall of the metal-based circuit board. Therefore, the above-mentioned automatic drilling and nailing device realizes the connection processing of drilling and embedding of copper nails, and there is no need to unload and circulate the product after drilling and use other jigs to complete the embedding of nails. Therefore, the above-mentioned automatic drilling and nailing device improves the processing efficiency, avoids the problem of scratched products caused by manual loading and changing of materials, and avoids affecting the processing accuracy by transferring products multiple times; moreover, copper nails are directly embedded after drilling, and there is no foreign matter in the hole, so there is no need to wash the board and dry the product, avoiding the quality risk caused by water overflow in the hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] Figure 1 A flowchart of a method for processing a metal-based circuit board according to an embodiment of the present application;

[0032] Figure 2 A three-dimensional schematic diagram of an automatic drilling and nail embedding device provided in one embodiment of the present application;

[0033] Figure 3 for Figure 2 A partial enlarged view of section A of the automatic drilling and nailing device shown;

[0034] Figure 4 for Figure 2 A three-dimensional schematic diagram of the automatic drilling and nailing device shown in another angle;

[0035] Figure 5 for Figure 2 A three-dimensional schematic diagram of a material taking mechanism in an automatic drilling and nail embedding device is shown;

[0036] Figure 6 for Figure 2 The figure shows a three-dimensional schematic diagram of the drilling mechanism in the automatic drilling and nail embedding device.

[0037] Figure 7 for Figure 2 A three-dimensional schematic diagram of the nail embedding mechanism in the automatic drilling and nail embedding device shown;

[0038] The meanings of the marks in the figure are:

[0039] 100. Automatic drilling and nailing device; 10. Base plate;

[0040] 20. Retrieving mechanism; 21. Third mounting frame; 22. Third lifting assembly; 23. Adsorption assembly; 231. Vacuum suction cup; 232. Adsorption plate;

[0041] 30. Conveying mechanism; 31. Conveying assembly; 32. Positioning fixture; 321. Accommodating tank;

[0042] 40. Drilling mechanism; 41. Second mounting frame; 42. Second lifting assembly; 43. Drilling spindle;

[0043] 50. Nail embedding mechanism; 52. First lifting assembly; 53. Copper nail pressing cylinder; 54. Nail ejector; 55. Copper nail feeder; 56. Nail feed pipe;

[0044] 61. Discharging bin; 62. Receiving bin;

[0045] 200. Metal-based circuit board. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the following further describes this application in detail with reference to the accompanying drawings, i.e., embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0047] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The terms "first" and "second" are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly specifying the number of technical features. "Multiple" means two or more, unless otherwise expressly specified.

[0048] It should also be noted that, in the embodiments of the present application, the same figure mark represents the same component or the same part. For the same parts in the embodiments of the present application, the figure may only mark one of the parts or components as an example. It should be understood that the figure mark also applies to other identical parts or components.

[0049] In order to illustrate the technical solution of the present application, the following description is given with reference to specific drawings and embodiments.

[0050] Please refer to Figure 1 , an embodiment of the first aspect of the present application proposes a method for processing a metal-based circuit board, comprising the following steps.

[0051] Step S1: placing the metal-based circuit board to be drilled on a positioning fixture.

[0052] In one embodiment, the metal-based circuit board is a circuit board used in a power module in a 5G communication base station, but is not limited thereto and can also be used in other products. The metal-based circuit board can be a single-sided aluminum substrate.

[0053] The positioning fixture is used to fix the metal-based circuit board to prevent the metal-based circuit board from shifting in the subsequent process and affecting the processing accuracy.

[0054] Step S2: Automatically transport the positioning jig and the metal-based circuit board to the drilling mechanism.

[0055] In one embodiment, the positioning jig is movably disposed in an automatic drilling and nailing device. After the positioning jig carries and positions the metal-based circuit board, the automatic drilling and nailing device automatically transports the positioning jig and the metal-based circuit board to the bottom of the drilling mechanism.

[0056] Step S3: drilling holes on the sidewalls of the metal-based circuit board using a drilling mechanism.

[0057] The automatic drilling and nailing device includes a drilling mechanism and a nailing mechanism. During this step, the drilling mechanism is used to drill holes in the sidewall of a metal-based circuit board. During drilling, a positioning jig stably secures the metal-based circuit board to ensure drilling accuracy. The holes drilled by the drilling mechanism in the sidewall of the metal-based circuit board can be through-holes or blind vias.

[0058] Optionally, the drilling mechanism drills holes on the side walls on both sides of the metal base circuit board.

[0059] Optionally, the controlled depth of the hole is 7.1±0.1 mm and the hole diameter is 1.4±0.05 mm, but is not limited thereto and can also be set according to requirements.

[0060] Optional side wall drilling parameters include: spindle speed 5.8 rpm / min, tool down speed 0.5-0.8 mm / s, tool return speed 0.9-1.2U.

[0061] Step S4: Automatically transport the positioning jig and the drilled metal-based circuit board to the nail embedding mechanism.

[0062] After drilling, there is no need to remove the metal-based circuit board from the positioning fixture. Instead, the positioning fixture and the metal-based circuit board are automatically transferred to the top embedding mechanism through the automatic drilling and embedding device to prepare for the nail embedding process.

[0063] Step S5: embedding a copper nail into the hole using a nail embedding mechanism.

[0064] In this step, the nail embedding mechanism automatically embeds the copper nails into the holes on the side wall of the metal-based circuit board. Optionally, the nail embedding mechanism embeds the copper nails into the holes on both sides of the metal-based circuit board respectively.

[0065] The copper nails facilitate the installation of metal-based circuit boards (PCBs), saving space within the terminal. For example, in the case of a PCB used in a power module in a 5G communication base station, the copper nails on both sides of the PCB secure the connection frame to the signal pole. Heat transfer from the copper nails to the metal substrate effectively solves the base station's heat dissipation problem during operation and improves the safety of the PCB.

[0066] In the above-mentioned processing method for metal-based circuit boards, a positioning jig is used to fix and transfer the metal-based circuit boards, and the sidewall drilling and sidewall copper nail embedding steps are completed in sequence. The sidewall drilling and sidewall copper nail embedding are connected operations. During the processing process, there is no need to unload the drilled product, transfer it, or use other jigs to complete the embedding. The process from sidewall drilling to sidewall copper nail embedding can be completed in one stop. Therefore, the above-mentioned processing method improves processing efficiency, avoids the problem of scratched products caused by manual loading and changing materials, and avoids the impact of multiple product transfers on processing accuracy. In addition, copper nails are directly embedded after drilling, and there is no foreign matter in the hole, so there is no need to wash the board and dry the product, avoiding the quality risk caused by water overflowing from the hole. Therefore, the above-mentioned processing method has high processing efficiency, high precision in drilling and embedding copper nails, and can obtain better quality products.

[0067] In one embodiment, during the steps of drilling and embedding copper nails, the positioning jig fixes the metal-based circuit board by vacuum adsorption. Accordingly, the positioning jig is provided with adsorption channels, and the adsorption channels are used to connect a vacuum generator, so that the positioning jig can fix the metal-based circuit board by vacuum adsorption. In this way, the positioning jig will not scratch the product, thereby avoiding affecting the appearance of the product. In addition, the suction-type fixation is more flexible, and the metal-based circuit board can be loosened by deflating, without the need for manual board removal, thereby improving production efficiency. For thin products, the positioning jig provided in the present application can ensure that the product does not loosen, avoid the problem of drilling deviation, and avoid the problem of circuit layer cracking caused by the extrusion of copper nails.

[0068] In other embodiments, the positioning fixture may also use clamps or other limiting members to fix the product, and is not limited to the adsorption method.

[0069] In one embodiment, after the copper nails are embedded in the holes using the nail embedding mechanism in step S5, the processing method further includes: performing deionization cleaning on the metal-based circuit board.

[0070] By deionizing the metal-based circuit board after copper nails are embedded in the side wall, impurities on the board surface can be removed, and then it can be packaged and shipped.

[0071] In one embodiment, before placing the metal-based circuit board to be drilled on the positioning jig in step S1, the processing method further includes: cutting the material, forming the outer layer circuit, applying a protective film, and performing a grooving plate and a grinding plate. The grooving plate can be used to form grooves or holes, and the grinding plate can improve the flatness of the board surface. It is understood that one or more of the above processes may be omitted or replaced.

[0072] Optionally, the steps before step S1 specifically include: cutting, outer layer circuit, outer layer etching, outer layer AOI, outer layer CCD shooting, solder mask, silk screen characters, film tearing, immersion gold, flying probe testing, protective film application, gong plate, side wall drilling, and plate grinding.

[0073] An embodiment of the second aspect of the present application provides a metal-based circuit board, which is processed using the processing method of the metal-based circuit board of the first aspect.

[0074] The metal-based circuit board is processed by the above processing method, and the metal-based circuit board has a good appearance and a high yield.

[0075] Holes are provided on one or both side walls of the metal-based circuit board, and copper nails are embedded in the holes. The copper nails can be used to install the metal-based circuit board in the terminal product, saving the space occupied by the metal-based circuit board in the terminal product.

[0076] An embodiment of the third aspect of the present application provides an automatic drilling and nailing device for use in the metal-based circuit board processing method of the first aspect.

[0077] Please refer to Figures 2 to 7 The automatic drilling and nailing device 100 includes a base plate 10, a material taking mechanism 20 and a conveying mechanism 30 arranged on the base plate 10, and a drilling mechanism 40 and a nailing mechanism 50 arranged in sequence along the conveying mechanism 30.

[0078] The conveying mechanism 30 includes a conveyor assembly 31 and a positioning jig 32 movably mounted on the conveyor assembly 31. The pick-up mechanism 20 is used to grab the metal-based circuit board 200 to be drilled and place the metal-based circuit board 200 into the positioning jig 32. The drilling mechanism 40 is used to drill holes in the sidewalls of the metal-based circuit board 200, and the nailing mechanism 50 is used to insert copper nails into the holes.

[0079] The automatic drilling and nail embedding device 100 is applied to the processing method provided in the first aspect, wherein, in step S1, the material picking mechanism 20 places the metal-based circuit board 200 to be drilled on the positioning jig 32; in step S2, the conveying component 31 automatically conveys the positioning jig 32 and the metal-based circuit board 200 to the drilling mechanism 40; in step S3, the drilling mechanism 40 drills holes in the side wall of the metal-based circuit board 200; in step S4, the conveying component 31 automatically conveys the positioning jig 32 and the metal-based circuit board 200 to the nail embedding mechanism 50; in step S5, the nail embedding mechanism 50 embeds copper nails in the holes.

[0080] The above-mentioned automatic drilling and nailing device 100 is used to process the metal-based circuit board 200. The product can be fixed by the positioning fixture 32 and the positioning fixture 32 and the product can be moved by the conveying component 31, and the drilling mechanism 40 and the nailing mechanism 50 can be used in sequence to realize drilling and embedding of copper nails in the side wall of the metal-based circuit board 200. Therefore, the above-mentioned automatic drilling and nailing device 100 realizes the connection processing of drilling and embedding of copper nails, and there is no need to unload, circulate and use other fixtures to complete the embedding of nails after drilling. Therefore, the above-mentioned automatic drilling and nailing device 100 improves the processing efficiency, avoids the problem of scratched products caused by manual loading and changing of materials, and avoids multiple transfers of products that affect the processing accuracy; and, copper nails are directly embedded after drilling, and there is no foreign matter in the hole, so there is no need to wash the board and dry the product, avoiding the quality risk caused by water overflow in the hole.

[0081] Optionally, the bottom plate 10 is a marble table top with a length of 2 m, a width of 1.5 m and a thickness of 30 cm.

[0082] like Figure 3 As shown, in one embodiment, a positioning jig 32 is provided with at least one receiving slot 321 on one side. Each receiving slot 321 is used to accommodate a vertically positioned metal-based circuit board 200. The receiving slots 321 on the positioning jig 32 allow the metal-based circuit board 200 to be placed vertically, facilitating drilling holes in the sidewalls of the metal-based circuit board 200. Furthermore, because the receiving slots 321 are provided on one side of the positioning jig 32, after the metal-based circuit board 200 is placed within the receiving slots 321, the board surface faces outward from the slots 321, preventing the positioning jig 32 from scratching the product.

[0083] The positioning jig 32 is also equipped with vacuum suction channels (not shown) for adsorbing the metal-based circuit board 200. The vacuum suction channels are connected to the receiving groove 321 and are, for example, located on the bottom wall of the receiving groove 321. It is understood that the vacuum suction channels are also connected to a vacuum generator. In this way, the positioning jig 32 can secure the product through vacuum suction, preventing scratches.

[0084] Optionally, the positioning jig 32 may be provided with multiple receiving grooves 321, such as two or five, to further improve processing efficiency. For example, the positioning jig 32 may be provided with five receiving grooves 321, each 1.3 mm long and 0.5 mm deep, with the adsorption channel being a through-hole 8-10 mm in diameter. It will be appreciated that the dimensions of the receiving grooves 321 are adjusted based on the product size.

[0085] Please refer to Figure 2 、 Figure 4 and Figure 7 In one embodiment, the nail embedding mechanism 50 includes a first lifting assembly 52 provided on the base plate, a copper nail pressing cylinder 53 connected to the first lifting assembly 52, and a nail ejecting member 54. The first lifting assembly 52 and the copper nail pressing cylinder 53 can both move in a direction perpendicular to the base plate 10, and the driving end of the copper nail pressing cylinder 53 can extend into the nail ejecting member 54.

[0086] The automatic drilling and nailing device 100 also includes a copper nail feeder 55 and a nail feed tube 56. The nail feed tube 56 is connected between the copper nail feeder 55 and the nail output member 54 and is used to transfer the copper nails provided by the copper nail feeder 55 into the nail output member 54. Optionally, the copper nail feeder 55 can hold 10,000 copper nails. The diameter of the nail feed tube 56 can be adapted to the diameter of the copper nails to ensure that one copper nail can be fed at a time.

[0087] When the copper nail pressing cylinder 53 is in operation, the pressure of the compressed gas is converted into high-speed movement of the piston, and the movement speed can be 10-20 meters per second. After the copper nail is pressed, the copper nail pulling force can reach 13KG.

[0088] During processing, the copper nail feeder 55 can deliver the copper nails to the nail outlet 54 through the nail feeding tube 56, and the first lifting assembly 52 is used to drive the copper nail pressing cylinder 53 to move in a direction perpendicular to the bottom plate 10 ( Figure 2 then, the copper nail pressing cylinder 53 operates, and the driving end of the copper nail pressing cylinder 53 moves along the Z direction to embed the copper nails in the nailing member 54 into the holes in the side walls.

[0089] The above-mentioned nail embedding mechanism 50 can automatically embed copper nails into the holes on the side wall of the product, with high processing efficiency and processing accuracy; through the cooperation of the copper nail feeder 55, the nail feeding tube 56 and the copper nail pressing cylinder 53, continuous processing can be achieved; the setting of the copper nail feeder 55 can reduce the frequency of copper nail discharge and greatly improve production efficiency.

[0090] Please refer to Figure 2 、 Figure 4 、 Figure 6 、 Figure 7 In one embodiment, the conveying mechanism 30 is divided into two groups and the two groups of conveying mechanisms 30 are arranged in parallel and spaced apart. The conveying mechanism 30 is used to convey the conveying mechanism 30 in a first direction ( Figure 2 (X direction) transmission positioning fixture 32.

[0091] The drilling mechanism 40 includes a second mounting frame 41 provided on the bottom plate, a second mounting frame 42 provided along the second direction ( Figure 2 The second direction is perpendicular to the first direction. The nail embedding mechanism 50 also includes a second lifting assembly 42 slidably connected to the second mounting frame 41 (in the middle Y direction) and a drilling spindle 43 connected to the second lifting assembly 42. The second direction is perpendicular to the first direction. The nail embedding mechanism 50 also includes a first mounting frame mounted on the base plate 10. The first lifting assembly 52 is slidably connected to the first mounting frame along the second direction. The drilling spindle 43 is used for depth-controlled drilling. Optionally, the drilling spindle 43 can be a Xuelong drilling spindle with a torque of 750 Nm, meeting drilling production requirements.

[0092] The automatic drilling and nailing mechanism 50 provided in this embodiment is a dual-station processing mechanism. The drilling mechanism 40 and the nailing mechanism 50 can process products on two conveying mechanisms 30. Products on two sets of conveying mechanisms 30 can be produced simultaneously, further improving processing efficiency. In other embodiments, the automatic drilling and nailing mechanism 50 can also be a single-station processing mechanism or a dual-station processing mechanism.

[0093] Please refer to Figure 2 、 Figure 3 、 Figure 5 In one embodiment, the automatic drilling and nailing device 100 further includes a discharge bin 61 and a receiving bin 62 disposed on one side of the base plate 10. The discharge bin 61 and the receiving bin 62 are each configured to accommodate at least one metal-based circuit board 200. The discharge bin 61 and the receiving bin 62 are disposed on the side of the base plate where the material removal mechanism 20 is disposed.

[0094] The material removal mechanism 20 includes a third mounting frame 21 mounted on the base plate, a third lifting assembly 22 slidably mounted on the third mounting frame 21 along a second direction, and a suction assembly 23 connected to the third lifting assembly 22. The suction assembly 23 is used to suction the metal-based circuit board 200. The suction assembly 23 includes a suction plate 232 and a vacuum suction cup 231 mounted on the suction plate 232. The number of vacuum suction cups 231 can be multiple to accommodate the size of the metal-based circuit board 200. In this way, the suction assembly 23 grasps the product through vacuum suction, which is less likely to scratch the product.

[0095] In another embodiment, the material taking mechanism 20 may also include a mechanical gripper; in addition, there may be two material taking mechanisms 20 corresponding to two conveying mechanisms respectively.

[0096] The material picking mechanism 20 is used to absorb and grab products from the discharge bin 61 and place the products on the positioning fixture 32 of any conveying mechanism 30; the material picking mechanism 20 is also used to transfer the products embedded with copper nails from the conveying mechanism 30 to the receiving bin 62. Therefore, the automatic drilling and nailing device 100 provided in the above embodiment can realize automatic material picking and discharging.

[0097] The discharge bin 61 and the receiving bin 62 can be used to discharge or receive different types of boards, so that one machine can be used for multiple purposes.

[0098] Optionally, each of the discharge bin 61 and the receiving bin 62 is provided with a vertically extending storage trough to facilitate simultaneous storage of multiple circuit boards. It is understood that the discharge bin 61 and the receiving bin 62 can be used in conjunction with a lifting mechanism (not shown) to lift the circuit boards in the discharge bin 61 for easy retrieval, or to lower the circuit boards in the receiving bin 62 for easy collection.

[0099] In this embodiment, there are two groups of conveying mechanisms 30, and the second mounting frame 41, the first mounting frame, and the third mounting frame 21 are respectively placed across the two groups of conveying mechanisms 30 to achieve double-station processing.

[0100] Optionally, the conveying assembly includes a guide rail, a slide slidably arranged on the guide rail, and a slide driver for driving the slide to move linearly, and the positioning fixture 32 is arranged on the slide. The slide driver can be a ball screw assembly, of course, it can also be a cylinder, a conveyor, etc. driver.

[0101] Optionally, the first lifting assembly 52, the second lifting assembly 42 and the third lifting assembly 22 may be ball screw assemblies, or of course, driving components such as cylinders.

[0102] The processing method is described below with reference to a specific embodiment.

[0103] The processing methods include: cutting, outer layer circuit, outer layer etching, outer layer AOI, outer layer CCD shooting, solder mask, silk screen printing, film tearing, immersion gold, flying probe testing, film pasting, gong plate, plate grinding, side wall drilling, side wall embedding copper nails, deionized cleaning, FQC, FQA, and packaging.

[0104] The process from cutting to grinding is completed according to conventional manufacturing methods.

[0105] The side wall drilling is performed by using the automatic drilling and nailing device 100 to fix the product in an air suction manner and complete the side wall drilling.

[0106] The copper nails are embedded in the side wall: the product is fixed by an automatic drilling and nail embedding device 100 and the copper nails are embedded in the side wall;

[0107] The side wall drilling and the side wall copper nail embedding are connected operations. The process does not require the drilled product to be unloaded, transferred, and then completed with other fixtures. The process from side wall drilling to side wall copper nail embedding is completed in one stop.

[0108] The process of drilling holes in the side wall and embedding copper nails in the side wall includes: the material taking mechanism 20 takes the board from the discharge bin 61, the conveying mechanism 30 conveys the product, drilling holes in the side wall, pressing copper nails, the material taking mechanism 20 puts the product into the receiving bin 62, and discharges the board.

[0109] The processing method of the metal-based circuit board 200 and the automatic drilling and nailing device 100 provided in the present application can realize the in-line processing of drilling and nailing, with a simple process, high processing efficiency, and improved quality of the processed products.

[0110] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A method for processing a metal-based circuit board, characterized in that: include: The metal-based circuit board to be drilled is grasped by suction using a material picking mechanism and is placed on a positioning jig. The positioning jig is provided with at least one receiving slot on one side, each receiving slot being used to receive a metal-based circuit board. The positioning jig is provided with a vacuum adsorption channel connected to the receiving slot, and the vacuum adsorption channel is used to connect to a vacuum generator. The positioning jig fixes the metal-based circuit board by vacuum adsorption, and the board surface of the metal-based circuit board is placed toward the outside of the receiving slot. Automatically transporting the positioning jig and the metal-based circuit board to a drilling mechanism; The positioning jig fixes the metal-based circuit board by suction, and uses a drilling mechanism to drill holes in the side walls of the metal-based circuit board, wherein the receiving groove allows the metal-based circuit board to be placed vertically so as to drill holes in the side walls of the metal-based circuit board; Automatically transporting the positioning jig and the drilled metal-based circuit board to a nail embedding mechanism; The positioning jig fixes the metal-based circuit board by means of air suction, and the copper nails are embedded in the holes by means of the nail embedding mechanism.

2. The method for processing a metal base circuit board according to claim 1, wherein: After the copper nail is embedded in the hole by using the nail embedding mechanism, the processing method further includes: The metal-based circuit board is subjected to deionization cleaning.

3. The method for processing a metal base circuit board according to claim 1, wherein: Before placing the metal-based circuit board to be drilled on the positioning fixture, the processing method further includes: cutting the material, making the outer layer circuit, applying a protective film, gong plate and grinding plate.

4. A metal-based circuit board, characterized in that: The metal-based circuit board is processed by the processing method of any one of claims 1 to 3.

5. An automatic drilling and nailing device, characterized in that: The automatic drilling and nailing device is used in the metal-based circuit board processing method according to any one of claims 1 to 3, and the automatic drilling and nailing device comprises a base plate, a material taking mechanism and a conveying mechanism provided on the base plate, and a drilling mechanism and a nailing mechanism provided in sequence along the conveying mechanism; The conveying mechanism includes a conveying assembly and a positioning jig movably arranged on the conveying assembly, wherein at least one receiving slot is provided on one side of the positioning jig, each of the receiving slots being used to receive a vertically placed metal-based circuit board, and the positioning jig is provided with a vacuum adsorption channel communicating with the receiving slot, the adsorption channel being used to connect to a vacuum generator, and the positioning jig fixes the metal-based circuit board by vacuum adsorption; The material picking mechanism is used to absorb and grab the metal-based circuit board to be drilled and place the metal-based circuit board in the positioning jig. The board surface of the metal-based circuit board is arranged to face the outside of the accommodating groove. The drilling mechanism is used to drill holes in the side walls of the metal-based circuit board. The nail embedding mechanism is used to embed copper nails into the holes. When drilling and embedding copper nails, the positioning jig fixes the metal-based circuit board by suction.

6. The automatic drilling and nailing device according to claim 5, characterized in that: The nail embedding mechanism includes a first lifting assembly provided on the base plate, a copper nail pressing cylinder connected to the first lifting assembly, and a nail ejector. The first lifting assembly and the copper nail pressing cylinder both move in a direction perpendicular to the base plate, and a driving end of the copper nail pressing cylinder extends into the nail ejector. The automatic drilling and nailing device also includes a copper nail feeder and a nail feeding tube. The nail feeding tube is connected between the copper nail feeder and the nail output component and is used to transmit the copper nails provided by the copper nail feeder to the nail output component.

7. The automatic drilling and nailing device as claimed in claim 6, characterized in that: There are two groups of conveying mechanisms, and the two groups of conveying mechanisms are arranged in parallel and spaced apart, and the conveying mechanisms are used to convey the positioning jig along a first direction; The nail embedding mechanism also includes a first mounting bracket provided on the base plate, and the first lifting assembly is slidably connected to the first mounting bracket along a second direction; the drilling mechanism includes a second mounting bracket provided on the base plate, a second lifting assembly slidably connected to the second mounting bracket along the second direction, and a drilling spindle connected to the second lifting assembly, wherein the second direction is perpendicular to the first direction.

8. The automatic drilling and nailing device according to claim 7, characterized in that: The automatic drilling and nailing device further includes a discharge bin and a receiving bin provided on one side of the base plate, wherein the discharge bin and the receiving bin respectively accommodate at least one metal-based circuit board; The material picking mechanism includes a third mounting frame provided on the base plate, a third lifting assembly slidably connected to the third mounting frame along the second direction, and an adsorption assembly connected to the third lifting assembly, wherein the adsorption assembly is used to adsorb the metal-based circuit board.

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