Overlap detection method, device, electronic device and storage medium for blind and buried vias

Abstract

This specification provides a blind buried via overlap detection method, apparatus, electronic device, and storage medium. The blind buried via overlap detection method obtains multiple first blind buried vias with identical electrical properties from a plurality of blind buried vias, each of which carries corresponding spatial position information. A second blind buried via is then obtained based on the spatial position information of the first blind buried vias, where the spatial position information corresponding to the first and second blind buried vias overlap. This method accurately detects overlap of multiple first blind buried vias with identical electrical properties based on spatial position information, laying the foundation for ensuring good blind buried via design. Furthermore, this overlap detection method detects whether blind buried vias overlap based on spatial position information, resulting in more accurate detection results compared to detection methods that compare the distance between the centers of blind buried vias with their radii.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more specifically, to a method, device, electronic device, and storage medium for detecting overlap of blind and buried vias. Background Art

[0002] With the continuous development of integrated circuit (IC) technology, the computing power of various chips has increased exponentially. Excellent packaging structure design is the key structure to ensure that the chip can fully exert its performance.

[0003] In current packaging structures, various substrates serve to carry circuit components and interconnect them. For example, printed circuit boards (PCBs) not only support integrated circuit chips, capacitors, terminals, and other structures, but also ensure electrical interconnection and signal transmission between these components.

[0004] Blind and buried vias are important structures that ensure electrical interconnection and signal transmission between circuit components. How to ensure a good design of blind and buried vias is one of the directions that technicians in this field are working on. Summary of the Invention

[0005] In view of this, the embodiments of this specification are dedicated to providing a blind buried via overlap detection method, device, electronic device and storage medium to achieve the purpose of detecting overlapping blind buried vias and lay the foundation for ensuring a good design of blind buried vias.

[0006] In a first aspect, a method for detecting overlap of blind and buried vias is provided, which is applied to an electronic design automation process of a circuit board, wherein the circuit board includes a substrate and a plurality of blind and buried vias. The method includes:

[0007] Acquire a plurality of first blind buried vias from the plurality of blind buried vias, wherein the plurality of first blind buried vias have the same corresponding electrical properties, and each first blind buried via carries corresponding spatial position information; the electrical properties are used to indicate a signal transmitted by the first blind buried via; and the spatial position information is used to indicate a position of the first blind buried via in the substrate and a space occupied by the first blind buried via in the substrate;

[0008] A second blind buried via is acquired based on the spatial position information of the first blind buried via, wherein the spatial position information corresponding to the first blind buried via and the second blind buried via overlap.

[0009] Based on the spatial position information of the blind buried vias, it is possible to accurately determine whether there is overlap between the first blind buried via and other blind buried vias, which is conducive to accurately determining the second blind buried via that overlaps with the first blind buried via, laying the foundation for ensuring a good design of the blind buried vias.

[0010] In addition, the overlap detection method detects the overlap between the first blind buried via and other blind buried vias based on spatial position information, and has a more accurate detection result compared to the detection method of comparing the distance between the centers of the blind buried vias and the radius.

[0011] Furthermore, the electronic design automation process of circuit boards usually relies on circuit board design tools. The blind and buried via overlap detection method provided in the embodiments of this specification can be integrated into existing PCB design tools, without the need for circuit board designers to learn other design tools, which is conducive to improving the applicability of the method.

[0012] In one feasible implementation, the spatial position information includes stacking information, circle center coordinates, and a radius; wherein the stacking information is used to indicate the stacking of the substrate through which the blind buried via passes; and obtaining the second blind buried via based on the spatial position information of the first blind buried via includes:

[0013] Acquire a plurality of third blind buried vias from the plurality of first blind buried vias based on stacking information corresponding to each of the plurality of first blind buried vias, wherein the stacking information corresponding to each of the plurality of third blind buried vias overlaps with the stacking information of the first blind buried vias;

[0014] Based on the center coordinates and radii of the first blind buried via and the third blind buried via, the coverage areas of the first blind buried via and the third blind buried via are calculated, and the coverage areas of the first blind buried via and the third blind buried via are compared to obtain the second blind buried via.

[0015] If there is no overlapping stacking information between two blind buried vias, then the two blind buried vias cannot overlap. The stacking information can be used to quickly eliminate blind buried vias that cannot overlap with the first blind buried via, thereby reducing the amount of data processing in subsequent steps with large computational complexity, and is conducive to improving the running speed of the blind buried via overlap detection method.

[0016] In a feasible implementation, the step of obtaining a plurality of third blind buried vias from the plurality of first blind buried vias based on stacking information corresponding to each of the plurality of first blind buried vias includes:

[0017] Comparing stacking information of the plurality of first blind buried vias to obtain a third blind buried via in the same layer and / or in an adjacent layer as the first blind buried via; wherein the stacking information of the third blind buried via in the same layer as the first blind buried via is identical to the stacking information of the first blind buried via; and the stacking information of the third blind buried via in an adjacent layer as the first blind buried via is partially identical to the stacking information of the first blind buried via;

[0018] The calculating, based on the center coordinates and radii of the first blind buried via and the third blind buried via, the coverage areas of the first blind buried via and the third blind buried via, and comparing the coverage areas of the first blind buried via and the third blind buried via to obtain the second blind buried via comprises:

[0019] Eliminate, from among the third blind buried vias in the same layer as the first blind buried via, the third blind buried vias having the same center coordinates as the first blind buried via, and, from among the remaining third blind buried vias, calculate the coverage areas of the first blind buried via and the remaining third blind buried vias based on the radius of the first blind buried via and the third blind buried vias, compare the coverage areas of the first blind buried via and the remaining third blind buried vias, and select the third blind buried via having at least two coordinates identical to the coverage area of ​​the first blind buried via as the second blind buried via;

[0020] In the third blind buried via in an adjacent layer to the first blind buried via, based on the radii of the first blind buried via and the third blind buried via, the coverage areas of the first blind buried via and the third blind buried via are calculated, the coverage areas of the first blind buried via and the third blind buried via are compared, and the third blind buried via having at least two identical coordinates as the coverage area of ​​the first blind buried via is used as the second blind buried via.

[0021] For the third blind buried via in the same layer as the first blind buried via, in this embodiment, the third blind buried via that overlaps with the first blind buried via in area but has the same center coordinates as the first blind buried via is excluded from the third blind buried via that overlaps with the first blind buried via, which helps to reduce the workload of designers when adjusting overlapping blind buried vias.

[0022] Similarly, in addition to the third blind buried via in the same layer as the first blind buried via, the third blind buried via in the adjacent layer to the first blind buried via may also overlap with the first blind buried via. Therefore, first determining the third blind buried via in the adjacent layer to the first blind buried via and then performing overlap judgment is beneficial to simplifying the amount of data running the method and improving the running speed.

[0023] In addition, the blind buried via detection method provided in this embodiment can not only detect whether the third blind buried via in the same layer as the first blind buried via overlaps with the first blind buried via, but can also be applied to detect whether the third blind buried via in the adjacent layer to the first blind buried via overlaps with the first blind buried via, which is beneficial to improving the applicability of the blind buried via overlap detection method.

[0024] In a feasible implementation, after calculating the coverage areas of the first blind buried via and the third blind buried via based on the center coordinates and radii of the first blind buried via and the third blind buried via, and comparing the coverage areas of the first blind buried via and the third blind buried via to obtain the second blind buried via, the method further includes:

[0025] When the stacking information corresponding to each of the first blind buried via and the second blind buried via indicates that at least one stacking layer is overlapped, a prompt is given for the overlapping stacking layer.

[0026] After obtaining the second blind buried via that overlaps with the first blind buried via, a prompt is also given for the overlapping stacking layer, so that the designer can quickly find the stacking layer with the problem and make adjustments.

[0027] In a feasible implementation, before acquiring the second blind buried via based on the spatial position information of the first blind buried via, the method further includes:

[0028] Connection information of the plurality of blind buried vias is obtained, where the connection information represents a connection relationship between one blind buried via and another blind buried via.

[0029] After acquiring a plurality of first blind buried vias from the plurality of blind buried vias, and before acquiring a second blind buried via based on the spatial position information of the first blind buried vias, the method further includes:

[0030] Based on the connection information corresponding to each of the plurality of first blind buried vias, a fourth blind buried via in the plurality of first blind buried vias is removed, wherein the fourth blind buried via has no connection relationship with the first blind buried vias.

[0031] Before performing computationally intensive overlap detection on blind buried vias, the fourth blind buried via that is not connected to the first blind buried via is eliminated. This allows overlap detection to be performed only on blind buried vias that are connected to each other, reducing the amount of data required for overlap detection and improving the efficiency of the method. This is because when a blind buried via is not connected to other blind buried vias, there will be no overlapping blind buried vias. Therefore, a preliminary screening of blind buried vias that may overlap can be performed based on relatively simple connection information, reducing the number of blind buried vias required for detection during the overlap detection step and reducing the computational complexity of this step.

[0032] In a feasible implementation, after obtaining the second blind buried via based on the spatial position information of the first blind buried via, the method further includes:

[0033] Push prompt information, where the prompt information includes spatial position information and electrical properties and / or identity identification of the first blind buried via and the second blind buried via.

[0034] After the existence of overlapping blind buried vias is determined, the spatial position information and electrical properties and / or identity identification of the overlapping blind buried vias (the first blind buried via and the second blind buried via) are pushed in the form of prompt information, which helps designers to promptly understand the relevant information of the overlapping blind buried vias and make timely adjustments.

[0035] In a feasible implementation, before acquiring a plurality of first blind buried vias from the plurality of blind buried vias, the method further includes:

[0036] In response to an information reading operation, spatial position information and electrical properties of blind and buried vias in the substrate corresponding to the information reading operation are read from a preset database.

[0037] Directly reading the spatial position information and electrical properties of blind and buried vias in the target substrate from a preset database helps simplify the method of obtaining spatial position information and reduces the learning cost required for designers to use blind and buried via detection methods.

[0038] In a feasible implementation, before acquiring the second blind buried via based on the spatial position information of the first blind buried via, the method further includes:

[0039] Based on the spatial position information corresponding to each of the plurality of first blind buried vias, a fifth blind buried via is eliminated from the plurality of first blind buried vias, wherein a distance between the fifth blind buried via and the first blind buried via is greater than a preset distance.

[0040] Eliminating the fifth blind buried via before overlapping detection can avoid the problem of large amount of computational data caused by comparing spatial position information of the plurality of first blind buried vias, thereby improving the operating efficiency of the blind buried via overlapping detection method.

[0041] In a second aspect, a blind and buried via overlap detection device is provided, which is applied to an electronic design automation process of a circuit board, wherein the circuit board includes a substrate and a plurality of blind and buried vias. The blind and buried via overlap detection device includes:

[0042] a first acquisition module, configured to acquire a plurality of first blind buried vias from the plurality of blind buried vias, wherein the plurality of first blind buried vias respectively have the same corresponding electrical properties, and each first blind buried via carries corresponding spatial position information; the electrical properties are used to indicate a signal transmitted by the first blind buried via; and the spatial position information is used to indicate a position of the first blind buried via in the substrate and a space occupied by the first blind buried via in the substrate;

[0043] The second acquisition module is configured to acquire a second blind buried via based on the spatial position information of the first blind buried via, wherein the spatial position information corresponding to the first blind buried via and the second blind buried via overlap.

[0044] In a third aspect, an electronic device is provided, comprising: a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when the computer program is executed by the processor, the blind and buried via overlap detection method as described above is implemented.

[0045] In a fourth aspect, a storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the overlapping detection method of blind and buried vias as described above is implemented.

[0046] In a fifth aspect, a computer program product or computer program is provided, which includes computer instructions stored in a computer-readable storage medium; a processor of a computer device reads the computer instructions from the computer-readable storage medium, and when the processor executes the computer instructions, the steps of any of the above-mentioned blind and buried hole overlap detection methods are implemented.

[0047] Embodiments of this specification provide a blind buried via overlap detection method, apparatus, electronic device, and storage medium. The blind buried via overlap detection method obtains multiple first blind buried vias (FBVs) with identical electrical properties from a plurality of blind buried vias, each of which carries corresponding spatial position information. Based on the spatial position information of the first FBVs, a second FBV is then obtained, where the spatial position information corresponding to the first and second FBVs overlap. This method accurately detects overlap of multiple first FBVs with identical electrical properties based on spatial position information, laying the foundation for ensuring good blind buried via design.

[0048] In addition, the overlap detection method detects whether blind and buried vias overlap based on spatial position information, and has a more accurate detection result compared to the detection method of simply comparing the distance between the centers of blind and buried vias and the radius. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 A schematic diagram of a cross-sectional structure of a substrate provided in this specification;

[0050] Figure 2 Provided for the embodiments of this specification Figure 1 A schematic top view of the blind via 21' and the buried via 22';

[0051] Figure 3 A schematic flow chart of a blind and buried via overlap detection method provided in an embodiment of this specification;

[0052] Figure 4 A schematic diagram of a cross-sectional structure of a substrate provided in an embodiment of this specification;

[0053] Figure 5 for Figure 4 A top view of the middle dashed box K1;

[0054] Figure 6 for Figure 4 A top view of the middle dashed box K2;

[0055] Figure 7 for Figure 4 A top view of the middle dashed box K3;

[0056] Figure 8 A schematic top view of three overlapping blind and buried vias provided in an embodiment of this specification;

[0057] Figure 9 A schematic diagram of a cross-sectional structure of another substrate provided in an embodiment of this specification;

[0058] Figure 10 for Figure 9 A top view of the second buried via from the left in the middle;

[0059] Figure 11 A schematic diagram of the coincidence of the centers of blind and buried vias in the same layer provided in an embodiment of this specification;

[0060] Figure 12 A schematic diagram of a cross-sectional structure of another substrate provided in an embodiment of this specification;

[0061] Figure 13 A schematic diagram of a process for obtaining spatial location information and electrical properties of blind and buried vias provided in an embodiment of this specification. DETAILED DESCRIPTION

[0062] This specification describes exemplary embodiments with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown in this specification, but rather include deviations in shape due to, for example, manufacturing. For example, a contact ball shown as a spherical surface will typically have elliptical features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0063] Unless the context requires otherwise, throughout this specification, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that specific features, structures, materials or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner. When describing some embodiments, the terms "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. The embodiments disclosed herein are not necessarily limited to the contents of this specification.

[0064] Application Overview

[0065] In substrates such as PCBs, blind and buried vias are key structures for achieving electrical interconnection. Figure 1 PCB board 1 is usually composed of dielectric layers 12 and metal layers 11 stacked in the thickness direction. Each layer in this stacked structure is called a stack. The metal layer 11 can be divided into routing layers, reference plane layers, and power layers. Two adjacent metal layers 11 are separated by a dielectric layer. The routing layer is mainly used for signal line routing, the reference plane layer is mainly used to provide a reference plane for the routing layer and reduce electromagnetic interference, and the power layer is mainly used to provide power. The metal line pattern in each metal layer 11 is designed according to actual conditions. In addition to separating the metal layers, the dielectric layer 12 is also used to maintain the strength of the entire PCB board.

[0066] PCB board 1 typically has a symmetrical laminate structure, which helps maintain stable physical and electrical performance. The central laminate layer is typically dielectric layer 12, and this dielectric layer 12 is typically thicker than the other dielectric layers 12 to maintain the strength of the entire PCB board 1. If a blind or buried via penetrates this dielectric layer 12, the diameter of the blind or buried via in this layer is typically larger than that in other layers.

[0067] Blind and buried vias are a general term for blind vias 21 and buried vias 22. Blind and buried vias are holes used to achieve electrical interconnection of metal layers in a substrate, and are usually made of metal. Blind vias 21 are metal holes that connect the metal elements of the inner layer of a PCB with the metal elements of the surface layer of the PCB. This hole passes through part of the laminate of the PCB board and does not penetrate the entire PCB board. Buried vias 22 are metal holes that only connect metal elements between inner layers, and the entire buried via 22 is located inside the laminate. The metal element can refer to a trace, a metal plane, an exposed pin (pin) of a chip, an internal pin (pad) of a chip, or one of other blind and buried vias.

[0068] In PCB board 1, each metal layer has its own name. If a blind buried via connects from one metal layer (e.g., metal layer 1) to another metal layer (e.g., metal layer 3), the identifiers (e.g., names, numbers, etc.) of these two metal layers and the stacked layers between them (metal layer A1, dielectric layer B1, metal layer A2, dielectric layer B2, and metal layer A3) serve as the stacked layer information associated with the blind buried via. In other words, the stacked layer information of the blind buried via indicates the stacked layers of the substrate through which the blind buried via penetrates.

[0069] During the design process of PCB board 1, the overlap detection of blind buried vias with the same network attributes is of great significance. The same network attributes refer to the same electrical attributes of the blind buried vias. Specifically, the electrical attributes represent the signals transmitted by the blind buried vias. The way to represent the signals can be that the electrical attributes include the names of the signals transmitted by the blind buried vias and other identifiers. The signal names can include various signal names such as power signal names, data signal names, or clock signal names. Since the number of blind buried vias is very large (in a packaging project, there may be tens of thousands or even millions of blind buried vias), it is inevitable that two or more blind buried vias with the same network attributes will overlap (for example, Figure 1 Blind hole 21 'and buried hole 22 '). Combined with reference Figure 2 , Figure 2 yes Figure 1 The top view of the blind hole 21' and the buried hole 22' is shown in FIG. 2. Since the blind and buried holes need to pass a large current, the circular hole design can make the current pass smoothly. Figure 2 When two blind and buried vias overlap, not only is localized damage more likely to occur during drilling, reducing product yield, but the "deformed" portion 3 caused by the overlap also blocks current flow, negatively impacting the performance, power consumption, and heat generation of the entire circuit. Therefore, it is necessary to inspect such overlapping blind and buried vias.

[0070] As mentioned above, due to the large number of blind and buried vias in a project, manual detection of overlapping blind and buried vias is not only inefficient but also very difficult, making it difficult to systematically and comprehensively detect all overlapping blind and buried vias.

[0071] Therefore, it is necessary to provide a method for detecting overlap of blind and buried vias to achieve the purpose of performing overlap detection of blind and buried vias efficiently and accurately.

[0072] Exemplary Methods

[0073] An exemplary embodiment of the present invention provides a method for detecting overlap of blind and buried vias, which is applied to an electronic design automation (EDA) process of a circuit board, wherein the circuit board includes a substrate and a plurality of blind and buried vias, such as Figure 3 As shown in the figure, the overlapping detection method of blind and buried vias includes:

[0074] S101: Acquire multiple first blind buried vias from the multiple blind buried vias, wherein the multiple first blind buried vias have the same corresponding electrical properties, and each first blind buried via carries corresponding spatial position information; the electrical properties are used to indicate the signal transmitted by the first blind buried via; and the spatial position information is used to indicate the position of the first blind buried via in the substrate and the size of the space occupied by the first blind buried via in the substrate.

[0075] A substrate is the carrier of blind and buried vias. Specific substrate types include, but are not limited to, PCBs and package substrates. The spatial position information of a blind and buried via characterizes its location and the amount of space it occupies within the substrate. By comparing the spatial position information of two blind and buried vias, it's possible to accurately determine whether they overlap within the substrate space.

[0076] The electrical properties characterize the signals transmitted by the blind buried vias. The electrical properties may include identifiers such as the signal names transmitted by the blind buried vias to characterize the signals transmitted by the blind buried vias. The signals transmitted by the blind buried vias include but are not limited to: power signals and data signals. The identifier characterizing the data signal may include the data signal name. The identifier characterizing the power signal may include the power signal name. The power signal name may reflect the name of the power supply connected to the blind buried vias.

[0077] During the EDA process of the circuit board, structures such as the substrate and blind and buried vias can be presented in a digital manner. The circuit board designer can retrieve the substrate, blind and buried vias and related information through the operation of the user interactive interface.

[0078] The multiple blind buried vias targeted at step S101 may be all blind buried vias in the substrate, blind buried vias in a certain area of ​​the substrate, or blind buried vias in certain stacked layers of the substrate, which is not limited in this specification.

[0079] The process of obtaining a plurality of first blind buried vias from the plurality of blind buried vias may include screening based on electrical properties of the plurality of blind buried vias to obtain the plurality of first blind buried vias. The specific screening method may vary depending on the specific content of the electrical properties. When the electrical properties include the names of signals transmitted by the blind buried vias, matching may be performed based on the signal names transmitted by the plurality of blind buried vias during the screening process. If the signal names are the same, the blind buried vias with the same signal names may be considered to have the same electrical properties.

[0080] S102: Acquire a second blind buried via based on the spatial position information of the first blind buried via, wherein the spatial position information corresponding to the first blind buried via and the second blind buried via overlap.

[0081] In this specification, "overlap" may refer to two blind buried vias (e.g., the first blind buried via and the second blind buried via) occupying at least a portion of the same space on the substrate. "Overlap" may also be referred to as "overlap". The specific "overlap" of the two blind buried vias can be referred to Figure 4-Figure 7 The blind via 210 and the buried via 220 may overlap, or the blind via 210 and another blind via 210 may overlap, or the buried via 220 and another buried via 220 may overlap. These overlapping blind vias are design defects.

[0082] Figure 5 、 Figure 6 and Figure 7 They are Figure 4 Schematic top view of the blind buried vias in the dotted box K1, dotted box K2 and dotted box K3. Figure 5 In the figure, the two blind and buried vias overlap slightly, and the centers O1 and O2 of the two blind and buried vias are not in the overlapping area. Figure 6 In the example, the two blind and buried vias largely overlap, and the centers O1 and O2 of the two blind and buried vias are located on each other's circumferences. Figure 7 In the example, the two blind buried vias mostly overlap, and the radii of the two blind buried vias are different. The center O1 of the smaller blind buried via is located in the overlapping area, and the center O2 of the larger blind buried via is located outside the overlapping area.

[0083] Figure 4-Figure 7 Several typical cases where two blind and buried vias overlap are shown. Of course, in other embodiments of this specification, there may also be cases such as Figure 8 The three blind buried vias shown are overlapped (O1, O2 and O3 are the centers of the three overlapping blind buried vias respectively), or there are more blind buried vias overlapping, which is not exhaustively listed in this specification.

[0084] In this embodiment, based on the spatial position information of the blind buried vias, it is possible to accurately determine whether there is overlap between the first blind buried via and other blind buried vias, which is conducive to accurately determining the second blind buried via that overlaps with the first blind buried via, laying the foundation for ensuring a good design of the blind buried vias.

[0085] In addition, the overlap detection method detects the overlap between the first blind buried via and other blind buried vias based on spatial position information, and has a more accurate detection result compared to the detection method of comparing the distance between the centers of the blind buried vias and the radius.

[0086] Furthermore, the electronic design automation process of circuit boards usually relies on circuit board design tools. The blind and buried via overlap detection method provided in the embodiments of this specification can be integrated into existing PCB design tools, without the need for circuit board designers to learn other design tools, which is conducive to improving the applicability of the method.

[0087] In an exemplary embodiment of the present specification, the spatial position information includes blind buried via stacking information, the coordinates of the center of the blind buried via, and the radius of the blind buried via. As previously mentioned, the blind buried via stacking information is used to characterize the stacking of the substrate through which the blind buried via passes. The stacking information may specifically include the identification of the metal layer and dielectric layer of the substrate through which the blind buried via passes. For example, the stacking information may include at least one of the names and numbers (e.g., IDs) of the metal layer and dielectric layer of the substrate through which the blind buried via passes.

[0088] The center coordinates of the blind buried hole refer to the center coordinates of the blind buried hole in each metal layer and / or dielectric layer, and the radius of the blind buried hole refers to the radius of the blind buried hole in each metal layer and / or dielectric layer. Figure 9 , Figure 9 Each metal layer of the substrate includes a metal layer ID (metal layer 1-n), and each dielectric layer also includes a dielectric layer ID (dielectric layer 1-m). Figure 9 The buried via in the hole penetrates the metal layers 2, 3, 4 and the dielectric layers 2 and 3, so the stacking information of the buried via is the metal layer 2-4 and the dielectric layer 2-3. Figure 10 , Figure 10 Figure 3 shows the center coordinates (x1, y1) and radius r1 of the portion of the buried via in metal layer 3. The radius of the blind buried via in different stacks may be the same or different, depending on the overall shape of the blind buried via. For example, when the blind buried via is cylindrical, the radius of the blind buried via is the same in every metal layer and dielectric layer. For another example, when the blind buried via is truncated cone-shaped, the radius of the blind buried via may be different in different stacks.

[0089] In some embodiments, step S102 may include the following steps:

[0090] S1021: Acquire a plurality of third blind buried vias from the plurality of first blind buried vias based on stacking information corresponding to each of the plurality of first blind buried vias, wherein the stacking information corresponding to each of the plurality of third blind buried vias overlaps with the stacking information of the first blind buried vias.

[0091] Still Figure 9 For example, Figure 9 The stacking information of the three blind buried holes in the figure are metal layer 3-5, dielectric layer 3-4, metal layer 2-4, dielectric layer 2-3 and metal layer 6-8, dielectric layer 6-7. The stacking information can be used to determine Figure 9 From the left side, the stacking information between the first and second buried vias overlaps, and the stacking information between the third blind via and the other two buried vias does not overlap. In some embodiments of this specification, since the metal layer penetrated by the blind buried vias is the stacking layer that designers pay more attention to, when obtaining multiple third blind buried vias based on the stacking information corresponding to each of the multiple first blind buried vias, only the metal layer information in the stacking information can be considered, that is, the stacking information is still based on Figure 9 For example, the metal layer information in the stacking information of three blind buried holes are metal layer 3-5, metal layer 2-4 and metal layer 6-8. The metal layer information in the stacking information can be used to determine Figure 9 There is overlap in the stacking information between the first and second buried vias from the left (because metal layer 3 - 5 overlaps with metal layer 2 - 4 ).

[0092] It is not difficult to understand that if there is no overlapping stacking information between two blind buried vias, then the two blind buried vias cannot overlap. The stacking information can be used to quickly remove blind buried vias that cannot overlap with the first blind buried via, thereby reducing the data processing amount of step S1022 and improving the operating speed of the blind buried via overlap detection method.

[0093] S1022: Calculate the coverage areas of the first blind buried via and the third blind buried via based on the center coordinates and radii of the first blind buried via and the third blind buried via, and compare the coverage areas of the first blind buried via and the third blind buried via to obtain the second blind buried via.

[0094] In step S1021, after filtering out a batch of blind buried vias that do not overlap with the first blind buried via stacking information, overlap determination is further performed based on the center coordinates of the first blind buried via and the third blind buried via and the radius of the blind buried via, which is beneficial for reducing the amount of data calculation and improving calculation efficiency.

[0095] Optionally, in an exemplary embodiment of this specification, step S1021 may include the following steps:

[0096] S10211: Compare the stacking information of the plurality of first blind buried vias to obtain a third blind buried via in the same layer and / or in an adjacent layer as the first blind buried via; wherein the stacking information of the third blind buried via in the same layer as the first blind buried via is the same as the stacking information of the first blind buried via; and the stacking information of the third blind buried via in an adjacent layer as the first blind buried via is partially the same as the stacking information of the first blind buried via.

[0097] In an exemplary embodiment of the present specification, step S1022 may include the following steps:

[0098] S10221: Eliminate, from among the third blind buried vias in the same layer as the first blind buried via, the third blind buried vias having the same center coordinates as the first blind buried vias, and calculate, from among the remaining third blind buried vias, the coverage areas of the first blind buried vias and the remaining third blind buried vias based on the radii of the first blind buried vias and the third blind buried vias, compare the coverage areas of the first blind buried vias and the remaining third blind buried vias, and use the third blind buried vias having at least two identical coordinates as the coverage area of ​​the first blind buried vias as the second blind buried vias.

[0099] S10222: In the third blind buried via in the adjacent layer to the first blind buried via, based on the radius of the first blind buried via and the third blind buried via, calculate the coverage area of ​​the first blind buried via and the third blind buried via, compare the coverage area of ​​the first blind buried via and the third blind buried via, and use the third blind buried via having at least two coordinates identical with the coverage area of ​​the first blind buried via as the second blind buried via.

[0100] In this embodiment, for blind buried vias in the same layer, the area occupied by the blind buried vias (or coverage area) is calculated based on the center coordinates of the blind buried vias and the radius of the blind buried vias. If two blind buried vias are in the same layer and their occupied areas overlap, then the two blind buried vias must overlap. However, for blind buried vias with the same center coordinates, the reference Figure 11 , the centers of the two blind and buried holes (O1 and O2) on the same layer coincide, combined with the reference Figure 12 When the centers of two blind and buried vias on the same layer coincide, there may be Figure 12In the two cases shown, the stacking information for blind vias 2101 and 2102 is identical, which could lead to duplicate drilling during the production process and potentially cause adverse consequences. These overlapping blind and buried vias can be detected using other existing inspection tools and are not the focus of this method. Buried vias 2201 and 2202 have overlapping centers, but their stacking information does not overlap, so duplicate drilling will not occur. Ultimately, a buried via connecting the second and fourth metal layers will be formed. This is a reasonable situation and does not require inspection. Therefore, in this embodiment, the third blind buried via, which overlaps with the first blind buried via but has the same center coordinates, is excluded from the overlapping blind buried vias, reducing the workload for designers when adjusting overlapping blind buried vias.

[0101] Since the two circles are spatially tangent, although their coverage areas have one overlapping coordinate at the tangent point, there is no overlapping area between the two circles. Therefore, in this embodiment, the first and third blind buried vias with two or more identical coordinates in their coverage areas are identified as overlapping blind buried vias. Furthermore, in this embodiment, the third blind buried via that overlaps with the first blind buried via is determined based on the number of identical coordinate points in the coverage areas of the first and third blind buried vias, which helps simplify overlap detection rules and improve overlap detection efficiency.

[0102] Similarly, in addition to the third blind buried via in the same layer as the first blind buried via, the third blind buried via in the adjacent layer to the first blind buried via may also overlap with the first blind buried via. Therefore, step S10222 first determines the third blind buried via in the adjacent layer and then performs overlap judgment, which is conducive to simplifying the method operation data volume and improving the operation speed.

[0103] In addition, the blind buried via detection method provided in this embodiment can not only detect whether the third blind buried via in the same layer as the first blind buried via overlaps with the first blind buried via, but can also be applied to detect whether the third blind buried via in the adjacent layer to the first blind buried via overlaps with the first blind buried via, which is beneficial to improving the applicability of the blind buried via overlap detection method.

[0104] In an exemplary embodiment of the present specification, step S102 further includes:

[0105] S103: When the stacking information corresponding to the first blind buried via and the second blind buried via respectively indicates that at least one stacking layer is overlapped, prompt the overlapping stacking layer.

[0106] In this embodiment, after obtaining the second blind buried via that overlaps with the first blind buried via, a prompt is provided for the overlapping stacking layer, so that the designer can quickly find the stacking layer with the problem and make adjustments.

[0107] The method of prompting the overlapping layers includes, but is not limited to, prompting the information of the overlapping layers in the form of text and / or graphics.

[0108] In an exemplary embodiment of this specification, step S101 includes:

[0109] S1011: In response to an information reading operation, spatial position information and electrical properties of blind and buried vias in a substrate corresponding to the information reading operation are read from a preset database, wherein the preset database stores a correspondence between the spatial position information and electrical properties of the substrate and the blind and buried vias.

[0110] In this embodiment, the substrate can be displayed in the interface as follows Figure 13 As shown in the figure, when the user selects the substrate by clicking the mouse or inputting the keyboard, and performs the information reading operation, the spatial position information and electrical properties of the blind and buried holes in the selected substrate can be directly read from the preset database in response to the information reading operation, which is conducive to simplifying the method of obtaining the spatial position information. Figure 13 The process of obtaining spatial position information of substrate 3 after the user selects substrate 3 from substrate 1, substrate 2, and substrate 3 shown in the substrate list and reading the information is shown.

[0111] In an exemplary embodiment of the present specification, step S102 further includes:

[0112] S104: Push prompt information, where the prompt information includes spatial location information and electrical properties and / or identification of the first blind buried via and the second blind buried via.

[0113] In this embodiment, after it is determined that there are overlapping blind buried vias, the spatial position information and electrical properties and / or identity identification of the overlapping blind buried vias (the first blind buried via and the second blind buried via) are pushed in the form of prompt information, which is beneficial for designers to promptly understand the relevant information of the overlapping blind buried vias and make timely adjustments.

[0114] The prompt information may include the spatial location information and electrical properties of the overlapping blind buried vias, the identification of the overlapping blind buried vias, or the spatial location information and electrical properties of the overlapping blind buried vias and the identification of the overlapping blind buried vias. The identification of the blind buried vias may be an identifier such as the blind buried via ID or name, and this specification does not limit this.

[0115] In an exemplary embodiment of this specification, before step S102, the following steps are further included:

[0116] S105: Acquire connection information of the plurality of blind buried vias, where the connection information represents a connection relationship between one blind buried via and another blind buried via.

[0117] The connection information may include the metal elements connected to the blind buried via, for example, whether the blind buried via is connected to at least one of a trace, a metal plane, an exposed chip pin, an internal chip pad, and another blind buried via. For another example, the connection information may directly include information about whether the blind buried via is connected to another blind buried via. When the blind buried via is connected to a pin and a trace, the connection information is "no," and when the blind buried via is connected to another blind buried via, the connection information is "yes."

[0118] Before step S102 and after step S101, the following steps are further included:

[0119] S106: Based on the connection information corresponding to each of the plurality of first blind buried vias, remove a fourth blind buried via from the plurality of first blind buried vias, wherein the fourth blind buried via has no connection relationship with the first blind buried vias.

[0120] Before performing computationally intensive overlap detection on blind buried vias, the fourth blind buried via that is not connected to the first blind buried via is eliminated. This allows overlap detection to be performed only on blind buried vias that are connected to each other, reducing the amount of data required for overlap detection and improving the efficiency of the method. This is because when a blind buried via is not connected to other blind buried vias, there will be no overlapping blind buried vias. Therefore, a preliminary screening of blind buried vias that may overlap can be performed based on relatively simple connection information, reducing the number of blind buried vias required for detection during the overlap detection step and reducing the computational complexity of this step.

[0121] In an exemplary embodiment of this specification, the connection information includes the identity documents (IDs) of other blind buried vias connected to the blind buried via. This connection information can be used to obtain all information connected to the blind buried via. Therefore, the blind buried vias connected to the blind buried via can be identified using the IDs, and overlap detection can be performed on the blind buried vias connected to the other blind buried vias without performing overlap detection on the fourth blind buried via, which can greatly reduce the amount of computation.

[0122] For example, the multiple blind buried vias obtained include 5 blind buried vias, namely blind buried via a, blind buried via b, blind buried via c, blind buried via d, and blind buried via e. Through the connection information acquisition in step S105 and the connection screening in step S106, it is found that blind buried via a and blind buried via b have a connection relationship, while blind buried vias c, d, and e have no connection relationship with other blind buried vias. Therefore, only overlapping detection needs to be performed on blind buried via a and blind buried via b.

[0123] In an exemplary embodiment of this specification, before step S102, the following steps are further included:

[0124] S107: Based on the spatial position information corresponding to each of the plurality of first blind buried vias, remove a fifth blind buried via from the plurality of first blind buried vias, wherein a distance between the fifth blind buried via and the first blind buried via is greater than a preset distance.

[0125] In this embodiment, the fifth blind buried via is eliminated before overlap detection, which can avoid the problem of large amount of computational data caused by comparing spatial position information of the plurality of first blind buried vias, and is conducive to improving the operating efficiency of the blind buried via overlap detection method.

[0126] Exemplary devices

[0127] One or more exemplary embodiments of this specification further provide a blind and buried via overlap detection device, which is applied to an electronic design automation process of a circuit board. The blind and buried via overlap detection device includes:

[0128] A first acquisition module is used to acquire multiple first blind buried vias from the multiple blind buried vias, where the electrical properties corresponding to the multiple first blind buried vias are the same, and each first blind buried via carries corresponding spatial position information; the electrical properties are used to indicate the signal transmitted by the first blind buried vias; and the spatial position information is used to indicate the position of the first blind buried via in the substrate and the size of the space occupied by the first blind buried via in the substrate.

[0129] The second acquisition module is configured to acquire a second blind buried via based on the spatial position information of the first blind buried via, wherein the spatial position information corresponding to the first blind buried via and the second blind buried via overlap.

[0130] The specific definitions of the blind and buried via overlap detection device can be found in the definitions of the blind and buried via overlap detection method described above and will not be repeated here. The various units and modules in the above-mentioned blind and buried via overlap detection device can be implemented in whole or in part through software, hardware, or a combination thereof. The above-mentioned units and modules can be embedded in or independent of the processor in the computer device in hardware form, or can be stored in the memory of the computer device in software form, so that the processor can call and execute the corresponding operations of the above-mentioned modules.

[0131] Exemplary electronic devices

[0132] One or more exemplary embodiments of this specification also provide an electronic device, which includes a memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the blind and buried via overlap detection method according to various embodiments of this specification described in the above "Exemplary Method" of this specification is implemented.

[0133] Exemplary computer program products and storage media

[0134] In addition to the above-mentioned methods and devices, an embodiment of the present application may also be a computer program product, which includes computer program instructions. When the computer program instructions are executed by a processor, the processor executes the steps of the overlap detection method for blind and buried vias according to various embodiments of the present application described in the above-mentioned "Exemplary Method" section of this specification.

[0135] The computer program product may be written in any combination of one or more programming languages ​​to implement the program code for performing the operations of the embodiments of the present application, including object-oriented programming languages ​​such as Java, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0136] In addition, an embodiment of the present application may also be a storage medium on which a computer program is stored, and the computer program is executed by a processor to execute the steps of the blind and buried hole overlap detection method according to various embodiments of the present application described in the above "Exemplary Method" section of this specification.

[0137] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0138] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0139] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A method for detecting overlap of blind and buried vias, characterized in that: An electronic design automation process for a circuit board, the circuit board comprising a substrate and a plurality of blind and buried vias, wherein the blind and buried vias are used to electrically interconnect metal layers in the substrate, and a plurality of metal layers are stacked. The method comprises: A plurality of first blind buried vias are obtained from the plurality of blind buried vias, wherein the plurality of first blind buried vias have the same corresponding electrical properties, and each first blind buried via carries corresponding spatial position information; the electrical properties are used to indicate a signal transmitted by the first blind buried via; the spatial position information is used to indicate a position of the first blind buried via in the substrate and a space occupied by the first blind buried via in the substrate; the spatial position information includes stacking information, center coordinates, and radius; wherein the stacking information is used to indicate a stacking of the substrate through which the blind buried via passes; Based on the stacking information, center coordinates and radius of the first blind buried via, a second blind buried via is obtained, wherein the spatial position information corresponding to the first blind buried via and the second blind buried via overlaps, and the overlap is used to indicate that at least a portion of the first blind buried via and the second blind buried via occupy the same space on the substrate.

2. The method according to claim 1, characterized in that The acquiring of the second blind buried via based on the stacking information, the center coordinates and the radius of the first blind buried via comprises: Acquire a plurality of third blind buried vias from the plurality of first blind buried vias based on stacking information corresponding to each of the plurality of first blind buried vias, wherein the stacking information corresponding to each of the plurality of third blind buried vias overlaps with the stacking information of the first blind buried vias; Based on the center coordinates and radii of the first blind buried via and the third blind buried via, the coverage areas of the first blind buried via and the third blind buried via are calculated, and the coverage areas of the first blind buried via and the third blind buried via are compared to obtain the second blind buried via.

3. The method according to claim 2, characterized in that The step of obtaining a plurality of third blind buried vias from the plurality of first blind buried vias based on stacking information corresponding to each of the plurality of first blind buried vias comprises: Comparing stacking information of the plurality of first blind buried vias to obtain a third blind buried via in the same layer and / or in an adjacent layer as the first blind buried via; wherein the stacking information of the third blind buried via in the same layer as the first blind buried via is identical to the stacking information of the first blind buried via; and the stacking information of the third blind buried via in an adjacent layer as the first blind buried via is partially identical to the stacking information of the first blind buried via; The calculating, based on the center coordinates and radii of the first blind buried via and the third blind buried via, the coverage areas of the first blind buried via and the third blind buried via, and comparing the coverage areas of the first blind buried via and the third blind buried via to obtain the second blind buried via comprises: Eliminate, from among the third blind buried vias in the same layer as the first blind buried via, the third blind buried vias having the same center coordinates as the first blind buried via, and, from among the remaining third blind buried vias, calculate the coverage areas of the first blind buried via and the remaining third blind buried vias based on the radius of the first blind buried via and the third blind buried vias, compare the coverage areas of the first blind buried via and the remaining third blind buried vias, and select the third blind buried via having at least two coordinates identical to the coverage area of ​​the first blind buried via as the second blind buried via; In the third blind buried via in an adjacent layer to the first blind buried via, based on the radii of the first blind buried via and the third blind buried via, the coverage areas of the first blind buried via and the third blind buried via are calculated, the coverage areas of the first blind buried via and the third blind buried via are compared, and the third blind buried via having at least two identical coordinates as the coverage area of ​​the first blind buried via is used as the second blind buried via.

4. The method according to claim 2, characterized in that After calculating the coverage areas of the first blind buried via and the third blind buried via based on the center coordinates and radii of the first blind buried via and the third blind buried via, and comparing the coverage areas of the first blind buried via and the third blind buried via to obtain the second blind buried via, the method further includes: When the stacking information corresponding to each of the first blind buried via and the second blind buried via indicates that at least one stacking layer is overlapped, a prompt is given for the overlapping stacking layer.

5. The method according to any one of claims 1 to 4, characterized in that Before obtaining the second blind buried via based on the stacking information, center coordinates, and radius of the first blind buried via, the method further includes: Acquire connection information of the plurality of blind buried vias, where the connection information represents a connection relationship between one blind buried via and another blind buried via; After acquiring a plurality of first blind buried vias from the plurality of blind buried vias, and before acquiring a second blind buried via based on the stacking information, center coordinates, and radius of the first blind buried vias, the method further includes: Based on the connection information corresponding to each of the plurality of first blind buried vias, a fourth blind buried via in the plurality of first blind buried vias is removed, wherein the fourth blind buried via has no connection relationship with the first blind buried vias.

6. The method according to any one of claims 1 to 4, characterized in that Before obtaining the second blind buried via based on the stacking information, center coordinates, and radius of the first blind buried via, the method further includes: Based on the stacking information, circle center coordinates and radius corresponding to each of the plurality of first blind buried vias, a fifth blind buried via is eliminated from the plurality of first blind buried vias, wherein the distance between the fifth blind buried via and the first blind buried via is greater than a preset distance.

7. The method according to any one of claims 1 to 4, characterized in that Before acquiring a plurality of first blind buried vias from the plurality of blind buried vias, the method further includes: In response to an information reading operation, spatial position information and electrical properties of blind and buried vias in the substrate corresponding to the information reading operation are read from a preset database.

8. A blind and buried via overlap detection device, characterized in that: An electronic design automation process for a circuit board is applied, wherein the circuit board includes a substrate and a plurality of blind and buried vias, wherein the blind and buried vias are used to realize electrical interconnection of metal layers in the substrate, and multiple layers of the metal layers are stacked. The overlapping detection device of the blind and buried vias includes: a first acquisition module, configured to acquire a plurality of first blind buried vias from the plurality of blind buried vias, wherein the plurality of first blind buried vias have the same corresponding electrical properties, and each first blind buried via carries corresponding spatial position information; the electrical properties are used to indicate a signal transmitted by the first blind buried via; the spatial position information is used to indicate a position of the first blind buried via in the substrate and a space occupied by the first blind buried via in the substrate; the spatial position information includes stacking information, center coordinates, and radius; wherein the stacking information is used to indicate a stacking of the substrate through which the blind buried via passes; The second acquisition module is used to acquire a second blind buried via based on the stacking information, center coordinates and radius of the first blind buried via, wherein there is overlap between the spatial position information corresponding to the first blind buried via and the second blind buried via, and the overlap is used to indicate that at least a portion of the first blind buried via and the second blind buried via occupy the same space on the substrate.

9. An electronic device, characterized in that: include: A processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the blind and buried via overlap detection method according to any one of claims 1 to 7.

10. A storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by the processor, the method for detecting overlap of blind and buried vias according to any one of claims 1 to 7 is implemented.

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