A tool for chip lead leveling

Abstract

The present invention discloses a tool for flattening chip leads, comprising a tool base, a pressure block and two side plates; the tool base comprises a base, on which two pressure block docking plates and two side plate docking plates are symmetrically arranged, and the side plate docking plates are arranged in parallel on the outer sides of the pressure block docking plates; a first concave-convex structure is arranged on the side plate docking plates; the pressure block comprises a frame and a side wall; a second concave-convex structure is arranged on the side plate; in a use state, the chip is placed in a space surrounded by the two pressure block docking plates and the upper end surfaces of the base; the lower end surfaces of the pressure block side walls are respectively aligned with the upper end surfaces of the pressure block docking plates to fix the chip leads; the chip leads are placed in the recesses of the first concave-convex structure on the side plate docking plates, and the protrusions of the second concave-convex structure on the side plate are aligned with the recesses of the first concave-convex structure on the side plate docking plates to make the leads flat.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic assembly, and in particular relates to a tool for leveling chip leads. Background Art

[0002] A large number of surface mount chips are used in the electronic assembly process of the module of the power control unit. The chip electrical assembly process involves a variety of different processes. In each process, there is a risk that the chip leads are thin and easily deformed or broken by external factors. Before welding the chip, it is necessary to ensure that the processed leads are flat and the trimming length of the leads on both sides is uniform. The lead leveling and trimming operations of large-size chips are very difficult. Since there is currently no relevant equipment that can simultaneously support the leveling and trimming of surface mount chip leads, the component leads are usually placed on a marble platform for manual leveling. There are certain difficulties in the implementation of the lead leveling process, and the risk of damage is high. After welding, there is a risk that the leads of the chip will be cold-soldered and the overlap length will not meet the relevant standards. Summary of the invention

[0003] The purpose of the present invention is to provide a tool for flattening and trimming the leads of a surface mounted chip, so as to achieve flattening and trimming the leads of the chip, so that the chip has good lead flatness and uniform overlap length after welding, and prevent the occurrence of lead cold welding.

[0004] In order to achieve the above-mentioned object, the present invention provides a tool for chip lead leveling, comprising a tool base, a pressing block and two side plates;

[0005] The tooling base comprises a base, on which two pressing block docking plates and two side plate docking plates are symmetrically arranged, and the side plate docking plates are arranged parallel to the outer sides of the pressing block docking plates; the side plate docking plates are provided with a first concave-convex structure;

[0006] The pressing block comprises a frame and a side wall; the side plate is provided with a second concave-convex structure;

[0007] In the use state, the chip is placed in the space surrounded by the two pressing block docking plates and the upper end surface of the base; the lower end surfaces of the pressing block side walls are respectively aligned with the upper end surfaces of the pressing block docking plates to fix the chip leads; the chip leads are placed in the depressions of the first concave-convex structure on the side plate docking plate, and the protrusions of the second concave-convex structure on the side plate are aligned with the depressions of the first concave-convex structure on the side plate docking plate to make the leads flat.

[0008] Optionally, a positioning pin is provided on the base, and a positioning hole is provided on the frame of the pressing block, and in a state of use, the positioning pin is inserted into the positioning hole.

[0009] Optionally, the positioning pins are symmetrically arranged at the edge of the upper end surface of the base.

[0010] Optionally, the pressing block is a frame structure formed by the frame and the side walls. When in use, the positions of the chip and the leads can be observed through the space formed by the frame and the side walls.

[0011] Optionally, the number of depressions in the first concave-convex structure is not less than the number of chip leads on a single side; and the number of protrusions in the second concave-convex structure is not less than the number of chip leads on a single side.

[0012] Optionally, the depressions of the first concave-convex structure are evenly arranged.

[0013] Optionally, only one chip lead is placed in a depression of the first concave-convex structure.

[0014] Optionally, the plane where the pressing block docking plate is located is perpendicular to the upper end surface of the base.

[0015] Optionally, the upper end surface of the base is rectangular, and the pressing block docking plate and the side plate docking plate are arranged along the long side of the rectangle.

[0016] Optionally, the pressing block butt joint plate and the side plate butt joint plate on the same side fit each other.

[0017] The beneficial effects of the present invention are:

[0018] (1) The present invention provides a tool for adjusting and trimming the special leads of surface mounted chips, which has a simple structure, a reasonable design, and is easy to operate. It greatly saves the time consumed in the previous process of trimming chip leads, and also achieves the process quantitative indicators of chip lead leveling and trimming.

[0019] (2) The present invention can accurately control the flatness and overlap length of the chip leads through the coordination of the tooling base, the pressure block and the side plate, and through the precise control of the size of the pressure block docking plate and the side plate docking plate of the tooling base, the size of the pressure block, and the protrusion size of the side plate. It can also observe the key points during the operation through the gap part of the pressure block, so that the chip lead status meets the process requirements.

[0020] (3) The parameters of the tooling base, the size of the pressing block, the size of the side plate, etc. in the present invention can be individually and accurately designed according to the lead sizes of components of different models and specifications, ensuring that the lead status of various surface mount chips before welding meets the standard requirements, and can be used for subsequent single-variety and large-scale chip lead leveling and trimming. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the tooling structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the structure of the tooling base of the present invention.

[0023] Figure 3 It is a schematic diagram of the briquetting structure of the present invention.

[0024] Figure 4 It is a schematic diagram of the side panel structure of the present invention.

[0025] Figure 5 Schematic diagram of placing chip leads into the tooling base.

[0026] Figure 6 It is a schematic diagram of the cooperation between the pressing block and the tooling base.

[0027] Figure 7 It is a schematic diagram of the coordination between the side panel and the tooling base.

[0028] Figure 8 Schematic diagram of chip leads that have not been leveled and trimmed.

[0029] Fig. 9 This is a schematic diagram of the chip leads after flattening and trimming.

[0030] In the figure, 1-tooling base, 11-base, 12-pressing block docking plate, 13-side plate docking plate, 130-first concave-convex structure, 14-positioning pin, 2-pressing block, 21-frame, 210-positioning hole, 22-side wall, 3-side plate, 30-second concave-convex structure, 4-chip, 40-chip lead. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] like Figure 1 As shown, the present invention provides a tool for chip lead leveling, comprising a tool base 1, a pressing block 2 and two side plates 3.

[0035] like Figure 2 As shown, the tool base 1 is used for the overall counterweight of the tool and for fixed cooperation with the pressure block 2 and the side panel 3. The tool base 1 includes a base 11, on which two pressure block docking plates 12 and two side panel docking plates 13 are symmetrically arranged. The side panel docking plates 13 are arranged parallel to the outside of the pressure block docking plates 12, and their height is higher than the pressure block docking plates 12. Preferably, the upper end face of the base 11 is rectangular, and the pressure block docking plates 12 and the side panel docking plates 13 are respectively arranged on the long sides of the upper end face of the rectangle, and the pressure block docking plates 12 and the side panel docking plates 13 on the same side fit each other. The planes where the pressure block docking plates 12 and the side panel docking plates 13 are located are perpendicular to the upper end face of the base 11. The upper end surface of the side plate docking plate 13 is provided with a first concave-convex structure 130, which is composed of a plurality of depressions and protrusions arranged at intervals, and the width of the depressions of the first concave-convex structure 130 matches the outer diameter of the chip lead to prevent the chip lead from moving laterally along the width direction of the depressions when trimming or other operations are performed on the chip lead. Preferably, the depressions of the first concave-convex structure 130 are evenly arranged.

[0036] like Figure 3 As shown, the pressing block 2 includes two frames 21 and two side walls 22. Preferably, the pressing block 2 is a frame structure composed of the frame 21 and the side wall 22 connected end to end. In the use state, the chip 4 is placed in the space surrounded by the two pressing block docking plates 12 and the upper end surface of the base 11. The pressing block 2 is placed on the tooling base 1 so that the lower end surfaces of the pressing block side walls 22 are respectively aligned with the upper end surfaces of the pressing block docking plates 12 to fix the chip leads 40. Through the space surrounded by the frame 21 and the side wall 22, the position of the chip 4 and the chip leads 40 can be observed from top to bottom (in the direction of the upper end surface of the base 11), preventing obstruction of observation during operation and eliminating the risk of different fixed lengths of the chip leads on both sides, tilting, or accidentally touching other parts when positioning and fixing the chip.

[0037] like Figure 4As shown, the lower end surface of the side plate 3 is provided with a second concave-convex structure 30. The second concave-convex structure 30 is composed of a plurality of depressions and protrusions arranged at intervals. Preferably, the protrusions of the second concave-convex structure 30 are evenly arranged. In the use state, after the pressing block 2 is placed on the tooling base 1, the chip lead 40 is placed in the depression of the first concave-convex structure 130 on the side plate docking plate, and the protrusion of the second concave-convex structure 30 on the side plate is aligned with the depression of the first concave-convex structure 130 on the side plate docking plate to make the lead flat. Preferably, the number of depressions of the first concave-convex structure 130 is not less than the number of chip leads on a single side; the number of protrusions of the second concave-convex structure 30 is not less than the number of chip leads on a single side. Only one chip lead is placed in a depression of a first concave-convex structure 130.

[0038] In some embodiments, a positioning pin 14 is provided on the base 11, and a positioning hole 210 is provided on the pressing block frame 21. When the pressing block 2 is placed on the tooling base 1, the positioning pin 14 can be inserted into the positioning hole 210 to keep the pressing block 2 relatively fixed to the tooling base 1. Preferably, when the upper end surface of the base 11 is rectangular, two positioning pins 14 are symmetrically arranged at the edges of the short sides of the upper end surface of the base 11, located at the center of the short sides, and the positioning hole 210 matched with the positioning pin 14 is also arranged at the center of the pressing block frame 21.

[0039] In some embodiments, the dimensions of the tooling base, the first concave-convex structure, the pressure block, the side plate, and the second concave structure can be individually and precisely designed according to the lead sizes of components of different models and specifications. Through the different dimensional precision control of each component, the tooling base, the pressure block, and the side plate are precisely matched, and the lead overlap length of the surface mount chip can be accurately and effectively controlled to ensure that the chip requirements of various chips meet the standard requirements, and can be used for the subsequent secondary forming of the axial device leads of single-variety and large-volume components.

[0040] The method of use of the present invention is:

[0041] Step 1, such as Figure 5 As shown, a tooling base 1 whose concave size of the first concave-convex structure 130 is adapted to the outer diameter of the chip lead 40 is selected, and the chip 4 is placed on the tooling base 1, and the chip 4 is placed in the space surrounded by the two pressing block docking plates 13 and the upper end surface of the base 11; a plurality of chip leads 40 are placed in the concave of the first concave-convex structure 130, and one chip lead is placed in one concave; since the height of the side plate docking plate 13 is higher than the pressing block docking plate 12, the chip leads placed in the concave of the first concave-convex structure 130 are not easy to slide; the chip leads are flattened by the concave of the first concave-convex structure and fixed to the tooling base 1;

[0042] Step 2, such as Figure 6As shown, according to the size of the upper end surface of the pressing block docking plate 12, the corresponding pressing block 2 is selected so that the lower end surface of the pressing block side wall 22 can match; the pressing block 2 is placed on the tooling base 1 so that the lower end surface of the pressing block side wall 22 is aligned with the upper end surface of the pressing block docking plate 12, and the chip lead 40 is pressed between the lower end surface of the pressing block side wall 22 and the upper end surface of the pressing block docking plate 12 to fix the chip lead 40; at the same time, the positioning pin 14 is inserted into the positioning hole 210 to keep the pressing block 2 and the tooling base 1 relatively fixed;

[0043] Step three, such as Figure 7 As shown, according to the concave size of the first concave-convex structure 130, the convex size of the second concave-convex structure 30 is determined, and the side plate 3 including the convex of the size is placed on the tooling base 1, and the convex of the second concave-convex structure 30 on the side plate is aligned with the concave of the first concave-convex structure 130 on the side plate docking plate to make the lead flat;

[0044] Step 4: Use diagonal pliers or tools such as saw to trim the extended part of the chip lead along the outer wall of the side plate 3. The chip before trimming is as follows: Figure 8 As shown, the trimmed chip is Fig. 9 As shown;

[0045] Step 5: Remove the side panels and the pressing block in turn, and take out the chip with the leads flattened and trimmed.

[0046] In summary, a tooling for chip lead flattening is provided, including a tooling base, a pressure block and two side plates. The tooling base and the pressure block cooperate with each other to fix the chip leads. The chip leads are flattened by the cooperation of the concave and convex structures of the tooling base and the side plates. The excess leads extending out of the side plates are trimmed, which can effectively ensure the uniform flatness of both sides of the chip leads and the uniform length of the trimmed leads. The state of the chip lead flatness exceeding the tolerance caused by tinning, transportation, operation and the like is adjusted and corrected, ensuring the uniformity of the flatness and overlap length standards in the subsequent chip welding process, and preventing the risk of lead cold soldering during welding.

[0047] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A tool for chip lead leveling, characterized in that: It includes a tooling base, a pressing block and two side panels; The tooling base comprises a base, on which two pressing block docking plates and two side plate docking plates are symmetrically arranged, and the side plate docking plates are arranged parallel to the outer sides of the pressing block docking plates; the side plate docking plates are provided with a first concave-convex structure; The pressing block comprises a frame and a side wall; the side plate is provided with a second concave-convex structure; In the use state, the chip is placed in the space surrounded by the two pressing block docking plates and the upper end surface of the base; the lower end surface of the pressing block side wall is respectively aligned with the upper end surface of the pressing block docking plate to fix the chip lead; the chip lead is placed in the depression of the first concave-convex structure on the side plate docking plate, and the protrusion of the second concave-convex structure on the side plate is aligned with the depression of the first concave-convex structure on the side plate docking plate to make the lead flat; The number of depressions in the first concave-convex structure is not less than the number of chip leads on a single side; The number of protrusions of the second concavo-convex structure is not less than the number of chip leads on a single side; Only one chip lead is placed in a concave portion of the first concave-convex structure.

2. The tooling for chip lead leveling according to claim 1, characterized in that: The base is provided with a positioning pin, and the frame of the pressing block is provided with a positioning hole. When in use, the positioning pin is inserted into the positioning hole.

3. The tooling for chip lead leveling according to claim 2, characterized in that: The positioning pins are symmetrically arranged at the edge of the upper end surface of the base.

4. The tooling for chip lead leveling according to claim 1, characterized in that: The pressing block is a frame structure formed by the frame and the side walls. When in use, the positions of the chip and the leads can be observed through the space formed by the frame and the side walls.

5. The tooling for chip lead leveling according to claim 1, characterized in that: The depressions of the first concave-convex structure are evenly arranged.

6. The tooling for chip lead leveling according to claim 1, characterized in that: The plane where the pressing block docking plate is located is perpendicular to the upper end surface of the base.

7. The tooling for chip lead leveling according to claim 1, characterized in that: The upper end surface of the base is rectangular, and the pressing block docking plate and the side plate docking plate are arranged along the long side of the rectangle.

8. The tooling for chip lead leveling according to claim 1, characterized in that: The pressing block butt joint plate and the side plate butt joint plate on the same side are fitted to each other.

Images