A photosensitive amplifier circuit assembly process

Abstract

The present invention relates to the technical field of photosensitive amplifier circuits, and in particular to a photosensitive amplifier circuit assembly process, which can effectively ensure product quality, and comprises the following steps: mounting → splitting → soft braid welding → electrical testing → soft braid folding → photosensitive diode shaping → photosensitive diode assembly → housing assembly → optical testing.

Description

Technical Field

[0001] The invention relates to the technical field of photosensitive amplifier circuits, and in particular to an assembly process of a photosensitive amplifier circuit. Background Art

[0002] For photosensitive amplifier circuits using PCB boards, the conventional packaging process is as follows: the PCB boards from the front-end process are divided into individual circuits (splitters) according to predetermined sizes after the components are mounted using the SMD process; then a series of operations such as welding, inspection, and testing are carried out. After completion, they undergo inspection and packaging processes before finally being put into storage for shipment. The existing inspection and testing operations are too simple, and the quality of the final product is poor. Summary of the invention

[0003] In order to solve the problem of poor quality of existing photosensitive amplifier circuits after assembly, the present invention provides a photosensitive amplifier circuit assembly process, which can effectively ensure product quality.

[0004] The technical solution is as follows: a photosensitive amplifier circuit assembly process, characterized in that it includes the following steps: mounting → splitting → soft braid welding → electrical testing → soft braid folding → photosensitive diode shaping → photosensitive diode assembly → housing assembly → optical testing.

[0005] It is further characterized in that the mounting step is operated as follows: on an automatic screen printer, a lead-free solder paste: Indium 8.9HF is printed on a pad of a PCB board, and then a device is mounted on the pad printed with the solder paste on an automatic mounting machine, and finally the PCB board with the device mounted is sent to a reflow oven to be reflowed using a temperature curve of the solder paste: Indium 8.9HF;

[0006] The operation of the chipping step is as follows: when chipping, first crack the strips, use the PCB cutting machine to cut off the process edge, crack the single strips, and then crack the single pieces;

[0007] The steps for soldering the soft braid are as follows: bake the soft braid at 80°C for 2 hours, then apply a small amount of flux on the pads of the soft braid, manually tin the pads with a soldering iron at 370°C, and then solder using a soft braid soldering fixture;

[0008] The steps of folding the soft braid are as follows: Use a clamp to bend the soft braid with the side with the gold finger facing upward. The folding distance should be 52.0 mm ± 0.5 mm, and avoid forming a large arc at the bend;

[0009] The steps for shaping the photodiode are as follows: use a rib cutting fixture to cut the ribs, and then use a shaping fixture to bend the legs 90 degrees;

[0010] The steps for assembling the photodiode are as follows: Use an assembly fixture to solder the photodiode to the PCB;

[0011] The steps of assembling the shell are as follows: Use a white needle to dispense H20E silver glue on the 8-point position of the outer circle of the diode; install the photodiode and PCB into the shell, install the inner shell, and align the notch of the shell with the plane of the inner shell; press down the soft tape and dispense H20E silver glue on both sides of the notch of the shell; put it in the oven for curing, curing conditions: curing at 150°C for 0.5 hours; use a dispenser to dispense 3M EC 2216 epoxy on the edges of the inner shell and the outer shell, and between the shell and the soft tape; put it in the oven for curing, curing conditions: curing at 75°C for 1 hour.

[0012] Both electrical and optical test steps are performed using test fixtures and supporting test systems.

[0013] After adopting the present invention, the inspection and testing steps include electrical testing, soft braid folding, photodiode shaping, etc., so that the subsequent assembly can effectively ensure the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the photosensitive amplifier circuit product of the present invention. DETAILED DESCRIPTION

[0015] A photosensitive amplifier circuit assembly process, comprising the following steps:

[0016] On an automatic screen printer, print the lead-free solder paste: Indium 8.9HF on the pads of the PCB board, then mount the components on the pads of the PCB board printed with the solder paste on an automatic placement machine, and finally send the PCB board with the components mounted into a reflow oven for reflow using the reflow curve of the solder paste: Indium 8.9HF.

[0017] After the reflow is completed, the chips are split. When splitting, the strips are split first, and the process edges are cut off using a PCB cutting machine to split single strips, and then single chips are split.

[0018] After the single product is cracked, the soft braid is baked at 80°C for 2 hours, then a small amount of flux is applied to the pad of the soft braid, the pad is tinned with a soldering iron at a temperature of 370°C, and then soldered using a soft braid soldering fixture.

[0019] After welding the soft tape, use a dedicated electrical test fixture and test system to test it.

[0020] If the test result is normal, use a special fixture to bend the soft braid (with the gold finger facing up). The folding distance should be 52.0 mm ± 0.5 mm (avoid forming a large arc at the bend).

[0021] Use a special cutting fixture to cut the ribs on the photodiode pins, and then use a special shaping fixture to bend the pins 90 degrees.

[0022] Use a dedicated assembly fixture to solder the photodiode to the PCB.

[0023] Use a white needle to dispense H20E silver glue on the outer circle of the diode at 8 equal parts; install the photodiode and PCB into the shell, and install the inner shell (note that the notch of the outer shell and the plane of the inner shell should be aligned); press down the soft braid and dispense H20E silver glue on both sides of the notch of the outer shell; put it in an oven for curing, curing conditions: curing at 150°C for 0.5 hours; use a dispenser to dispense 3M EC 2216 epoxy resin on the edges of the inner shell and the outer shell, and between the shell and the soft braid; put it in an oven for curing, curing conditions: curing at 75°C for 1 hour.

[0024] Finally, the optical test is carried out using a dedicated test fixture and test system.

[0025] Finally get Figure 1 Products shown.

Claims

1. A photosensitive amplifier circuit assembly process, characterized in that: It includes the following steps: Mounting → chipping → soft braid welding → electrical testing → soft braid folding → photodiode shaping → photodiode assembly → shell assembly → light testing; The operation of the chipping step is as follows: when chipping, first crack the strips, use the PCB cutting machine to cut off the process edge, crack a single strip, and then crack a single piece; The soft braid welding steps are as follows: bake the soft braid at 80°C for 2 hours, then apply a small amount of flux to the pad of the soft braid, manually tin the pad with a soldering iron at a temperature of 370°C, and then use the soft braid welding fixture for welding; The operation of the soft braid folding step is as follows: use the fixture to bend the soft braid, with the side with the gold finger facing up, the folding distance should be 52.0 mm ± 0.5 mm, and avoid large arc formation at the bend; The operation of the shell assembly step is as follows: Use a white needle to dispenser and apply H20E silver glue on the 8-point position of the outer circle of the diode; The photodiode and PCB are installed in the shell, Install the inner shell, aligning the notch of the outer shell with the plane of the inner shell; press down the soft braid and apply H20E silver glue on both sides of the notch of the outer shell; put it in the oven for curing, curing conditions: curing at 150°C for 0.5 hours; use a dispenser to apply 3M EC 2216 epoxy on the edges of the inner shell and the outer shell, and between the shell and the soft braid; put it in the oven for curing, curing conditions: curing at 75°C for 1 hour.

2. A photosensitive amplifier circuit assembly process according to claim 1, characterized in that: The mounting steps are as follows: print the lead-free solder paste: Indium 8.9HF on the pads of the PCB board on an automatic screen printer, then mount the device on the pads printed with the solder paste on an automatic mounting machine, and finally send the PCB board with the device mounted to the reflow oven for reflow using the temperature curve of the solder paste: Indium 8.9HF.

3. A photosensitive amplifier circuit assembly process according to claim 1, characterized in that: The steps for shaping a photodiode are as follows: Use a cutting fixture to cut the ribs, and then use a shaping fixture to bend the legs 90 degrees.

4. A photosensitive amplifier circuit assembly process according to claim 1, characterized in that: The steps for assembling the photodiode are as follows: Use an assembly fixture to solder the photodiode to the PCB board.

5. The photosensitive amplifier circuit assembly process according to claim 1, characterized in that: Both electrical and optical test steps are performed using test fixtures and supporting test systems.

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