A high temperature high pressure rheometer

Abstract

The application discloses a high-temperature and high-pressure rheometer, which comprises a host computer, a magnetic transmission module connected with the host computer, a test rotor, a sample cup and a temperature control module, the host computer can control the rotation of the magnetic transmission module and detect the torque of the magnetic transmission module; one end of the magnetic transmission module is connected with the test rotor, and the other end of the test rotor is arranged in the sample cup; the temperature control module comprises a heating assembly, a semiconductor refrigeration unit, a heat dissipation assembly and a thermal expansion and contraction spring block, the heating assembly is arranged on the outer wall of the sample cup, the heat dissipation assembly is movably arranged on the periphery of the heating assembly, the semiconductor refrigeration unit is fixedly connected with the heat dissipation assembly, and the thermal expansion and contraction spring block is connected with the heating assembly and the heat dissipation assembly respectively, so that the functions of heating and refrigeration of the semiconductor material are fully exerted, and the shortcoming that the natural cooling speed is very slow in the low-temperature section is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of rheometer, in particular to a high-temperature and high-pressure rheometer. BACKGROUND

[0002] The rheometer is a general laboratory instrument for testing the viscosity of fluid and the flow characteristics of fluid, which mainly converts the relationship between torque and rotating speed into the relationship between viscosity and shear rate to characterize the fluid flow characteristic curve, and is mainly applied to the research field related to rheology in various industries such as food, medicine, cosmetics and materials. In the prior art, the temperature control usually adopts water bath or oil bath mode, which has very slow heating and cooling speed, and the temperature cannot be too high. The water bath is not more than 100 DEG C, and the oil bath is not more than 350 DEG C. Moreover, the power is large, the energy consumption is high, and the use is very inconvenient. If only heating wire or ceramic electric heating element is used, cooling cannot be achieved, and the cooling stage can only rely on natural heat dissipation cooling, especially the natural cooling cooling speed is very slow at low temperature stage. SUMMARY

[0003] The present application aims to at least solve one of the technical problems in the prior art, and provide a high-temperature and high-pressure rheometer capable of rapid heating and cooling at low temperature stage.

[0004] The high-temperature and high-pressure rheometer according to the embodiment of the present application comprises: a host computer, a magnetic transmission module connected with the host computer, a test rotor, a sample cup and a temperature control module, the host computer can control driving the magnetic transmission module to rotate, and the host computer can detect the torque of the magnetic transmission module; the magnetic transmission module is connected with one end of the test rotor, and the other end of the test rotor is placed in the sample cup; the temperature control module comprises a heating assembly, a semiconductor refrigeration unit, a heat dissipation assembly and a thermal expansion and contraction spring block, the heating assembly is arranged on the outer wall of the sample cup, the heat dissipation assembly is movably arranged on the periphery of the heating assembly, the thermal expansion and contraction spring block and the semiconductor refrigeration unit are respectively located between the heating assembly and the heat dissipation assembly, and the semiconductor refrigeration unit is fixedly connected with the heat dissipation assembly, the thermal expansion and contraction spring block is respectively abutted with the heating assembly and the heat dissipation assembly, the thermal expansion and contraction spring block expands / contracts to push / pull the heat dissipation assembly away from / close to the heating assembly, so that the semiconductor refrigeration unit is separated / attached with the heating assembly.

[0005] The high-temperature and high-pressure rheometer according to the embodiment of the application has at least the following beneficial effects: the host machine drives the magnetic transmission module to rotate to drive the test rotor to rotate in the sample cup, the sample cup is filled with a liquid to be tested, the temperature control module heats the sample cup to control the temperature of the liquid in the sample cup, the rotation of the test rotor is affected by the state of the liquid at different temperatures and pressures, the state of the test rotor is fed back to the host machine through the magnetic transmission module, and the host machine can obtain the relationship between the viscosity and the shear rate of the liquid through the detected relationship between the torque and the rotation speed; the semiconductor refrigeration unit is composed of semiconductor materials, heat can be absorbed and heat can be emitted at the two ends of the galvanic couple when direct current passes through the galvanic couple composed of two different semiconductor materials in series, and the purpose of heating and refrigeration can be achieved. Since the heat-resistant temperature of the semiconductor refrigeration material is 216 DEG C at present, the welding point melts when the temperature exceeds 216 DEG C, so the high-temperature and high-pressure rheometer of the application is below 200 DEG C, and the semiconductor refrigeration unit participates in refrigeration or heating work; in the heating and temperature rising stage, the end of the semiconductor refrigeration unit abutting against the heating assembly emits heat to accelerate the temperature rising, when the temperature rises to 200 DEG C, the thermal expansion and contraction spring expands to push the movable heat dissipation assembly outward, so that the semiconductor refrigeration unit is separated from the heating assembly, and the heating assembly continues to heat and rise in temperature until a certain high-temperature state; in the temperature reducing stage, when the temperature is above 200 DEG C, the semiconductor refrigeration unit and the heating assembly are still in a separated state, when the temperature is below 200 DEG C, the thermal expansion and contraction spring contracts to pull the heat dissipation assembly close to the heating assembly, so that the semiconductor refrigeration unit is attached to the heating assembly, at this time, the end of the semiconductor refrigeration unit abutting against the heating assembly absorbs heat to refrigerate and accelerate the temperature reducing speed, the function of the semiconductor material that can heat and refrigerate is fully utilized, the shortcoming that the electric heating can only rely on natural cooling to reduce the temperature in the temperature reducing process is improved, especially the shortcoming that the natural cooling speed is very slow in the low-temperature stage is improved, and the semiconductor refrigeration unit has small volume and compact structure, and is convenient to use.

[0006] According to some embodiments of the application, the heating assembly comprises a heating element and a cup-shaped heat conduction block, the heat conduction block is inserted into the sample cup to wrap on the outer wall of the sample cup, and the heating element is arranged on the side wall of the outer surface of the heat conduction block; the heat dissipation assembly is arranged on the bottom of the outer surface of the heat conduction block and can move along the axial direction of the sample cup, the thermal expansion and contraction spring and the semiconductor refrigeration unit are respectively located between the heat conduction block and the heat dissipation assembly, and the thermal expansion and contraction spring is connected with the heat conduction block and the heat dissipation assembly respectively; wherein the cup-shaped heat conduction block can wrap the sample cup, the heat conduction is uniform, and the heat dissipation assembly is arranged at the bottom of the heat conduction block, when the thermal expansion and contraction spring expands or contracts, the heat dissipation assembly can move away from or close to the bottom of the heat conduction block in the vertical direction, and the structure is simple and convenient to implement.

[0007] According to some embodiments of the present application, a rack is further included, and the rack is provided with a driving device, vertical guide rails, a first support and a second support connected with the driving device, one end of the first support is movably connected with the rack, the driving device can drive the first support to slide along the guide rails, the other end of the first support is connected with the main machine, and a detachable connection structure is arranged between the main machine and the magnetic transmission module; one end of the second support is connected with the rack, and the other end of the second support is connected with the heat conduction block; when the driving device drives the first support to automatically slide upwards along the guide rails so that the main machine is not connected with the magnetic transmission module, the torque and the rotating speed detected by the main machine are zero; when the driving device drives the first support to automatically descend to a suitable position, the main machine is connected with the magnetic transmission module to drive the magnetic transmission module to rotate; since the second support fixes the heat conduction block, the magnetic transmission module and the sample cup can be taken out of or returned to the heat conduction block, the overall central axis position is not affected, the first support can be lifted and lowered, the detachable connection of the main machine and the magnetic transmission module in the vertical direction is facilitated, and the automatic driving device is convenient for control.

[0008] According to some embodiments of the present application, a limiting structure is arranged between the sample cup and the heat conduction block to prevent relative rotation.

[0009] According to some embodiments of the present application, the main machine includes a main control module, a torque sensor, a motor and a driving shaft connected with the shaft of the motor, one end of the torque sensor is connected with the output shaft of the motor, the other end of the torque sensor is connected with the driving shaft, the driving shaft is connected with the magnetic transmission module, and the motor and the torque sensor are respectively electrically connected with the main control module; the main control module controls the motor to rotate at a certain rotating speed, the magnetic transmission module transmits the rotating state of the test rotor to the torque sensor through the driving shaft, the torque sensor can detect the corresponding torque, so that the viscosity of the detected liquid is obtained, and the main control module can obtain the relationship between the liquid viscosity and the shear rate through the detected torque and the rotating speed.

[0010] According to some embodiments of the present application, the main machine further includes an encoder electrically connected with the main control module, one end of the encoder is connected with the upper shaft of the motor, the motor rotates at a certain speed according to the instruction of the main control module, the real speed of rotation is fed back to the main control module by the encoder, and the main control module can be corrected according to the difference between the two, so as to achieve precise control of the rotating speed.

[0011] According to some embodiments of the present application, the magnetic transmission module comprises a rotating shell, an outer magnetic block, an isolation sleeve, an inner magnetic block and a rotating shaft, the outer magnetic block is arranged on the inner wall surface of the rotating shell, the inner magnetic block is arranged on the surface of the rotating shaft, the isolation sleeve is sleeved on the rotating shaft to isolate the inner magnetic block and the outer magnetic block, the rotating shell is sleeved on the isolation sleeve, and the main machine is connected with the top end of the rotating shell to drive the rotating shell to rotate, the rotating shell drives the outer magnetic block to rotate around the rotating shaft to generate a magnetic field, under the action of the magnetic field, the inner magnetic block drives the rotating shaft to rotate, thereby driving the test rotor to rotate in the sample, and the torque of the reaction force of the test rotor is directly fed back to the main machine through the magnetic transmission module, the main machine converts the relationship between the torque and the rotating speed into the relationship between the viscosity and the shear rate, and thus the viscosity and rheological test process is completed.

[0012] According to some embodiments of the present application, the upper flange and the lower flange are further included, the upper flange is integrally connected with the isolation sleeve to be sleeved on the rotating shaft, the lower flange is sleeved on the sample cup, and the flange connecting structure is arranged between the upper flange and the lower flange to form a sealed space between the isolation sleeve and the sample cup; the upper flange is integrally connected with the isolation sleeve, and the sealing effect is good.

[0013] According to some embodiments of the present application, the pressure control module is further included, the pressure control module comprises a high-pressure gas pipe and a pressure control pump capable of increasing and reducing pressure and communicating with the high-pressure gas pipe, a through hole is arranged on the sample cup or the upper flange, and the high-pressure gas pipe communicates with the inside of the sample cup through the through hole, so that the structure is simple and the pressure increasing and reducing control is facilitated.

[0014] According to some embodiments of the present application, the external control module capable of controlling the working states of the pressure control pump and the temperature control module is included, the pressure control pump and the temperature control module are respectively electrically connected with the external control module, the temperature and the pressure can be uniformly and centrally controlled through the external control module, and the user is facilitated.

[0015] Additional aspects and advantages of the present application will be given in part in the following description, part will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The specific embodiments of the present application will be further described below in combination with the drawings;

[0017] Figure 1 It is the overall structure diagram of the high-temperature and high-pressure rheometer;

[0018] Figure 2 It is the sectional view of the temperature control module of the high-temperature and high-pressure rheometer;

[0019] Figure 3is a sectional view of a main machine of a high temperature and high pressure rheometer;

[0020] Figure 4 is a sectional view of a magnetic transmission module of a high temperature and high pressure rheometer;

[0021] Figure 5 is an exploded structural view of the magnetic transmission module. DETAILED DESCRIPTION

[0022] This part will describe the specific embodiments of the present application in detail, the preferred embodiments of the present application are shown in the drawings, the role of the drawings is to supplement the description of the text part with figures, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the present application, but it cannot be understood as a limitation on the protection scope of the present application.

[0023] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right and the like, is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation on the present application.

[0024] In the description of the present application, several meanings are one or more, and multiple meanings are more than two, greater than, less than, more than and the like are not included in the number, and above, below and the like are included in the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0025] Reference Figures 1 to 5 , the high temperature and high pressure rheometer of the embodiment of the present application comprises a main machine 100, a magnetic transmission module 200 connected with the main machine 100, a test rotor 310, a sample cup 320 and a temperature control module, the main machine 100 can control the rotation of the magnetic transmission module 200, and the main machine can detect the torque of the magnetic transmission module 200; the magnetic transmission module 200 is connected with one end of the test rotor 310, and the other end of the test rotor 310 is placed in the sample cup 320; the temperature control module comprises a heating assembly, a semiconductor refrigeration unit 420, a heat dissipation assembly and a thermal expansion and contraction spring block 440, the heating assembly is arranged on the outer wall of the sample cup 320, the heat dissipation assembly is movably arranged on the periphery of the heating assembly, and the semiconductor refrigeration unit 420 is fixedly connected with the heat dissipation assembly, the thermal expansion and contraction spring block 440 is connected with the heating assembly and the heat dissipation assembly respectively, the thermal expansion and contraction spring block 440 expands / contracts to push / pull the heat dissipation assembly away from / close to the heating assembly, so that the semiconductor refrigeration unit 420 separates / attaches with the heating assembly.

[0026] The host 100 drives the magnetic transmission module 200 to rotate to drive the test rotor 310 to rotate in the sample cup 320 containing the liquid to be tested, the temperature control module heats the sample cup 320 to control the temperature of the liquid in the sample cup 320, the rotation of the test rotor 310 is affected by the state of the liquid under different temperatures and pressures, and the state of the test rotor 310 is fed back to the host 100 through the magnetic transmission module 200, so that the host 100 can obtain the relationship between the liquid viscosity and the shear rate through the detected torque and the rotation speed. The semiconductor refrigeration unit 200 is composed of semiconductor materials, when direct current passes through the electric couple composed of two different semiconductor materials in series, heat can be absorbed and heat can be emitted at both ends of the electric couple, so that the purposes of heating and refrigeration can be achieved. Since the heat-resistant temperature of the semiconductor refrigeration material is 216 DEG C at present, the solder joint melts when exceeding 216 DEG C, so the high-temperature and high-pressure rheometer of the application is below 200 DEG C, and the semiconductor refrigeration unit 420 participates in the refrigeration or heating work.

[0027] As Figure 2As shown, in some embodiments, the heating assembly includes a heating element 411, which is generally a heating wire or a heating rod, and a cup-shaped heat-conducting block 412, which is inserted into the sample cup 320 to wrap around the outer wall of the sample cup 320, and the heating wire or the heating rod is arranged around the side wall of the outer surface of the heat-conducting block 412; in some embodiments, the heat dissipation assembly includes a fan 431 and a heat dissipation seat 432 connected to the fan 431, the heat dissipation seat 432 is provided with a plurality of heat dissipation fins, the heat-conducting block 412 is provided with a boss, the boss is provided with a first connecting hole, the heat dissipation seat 432 is provided with a second connecting hole, a bolt 452 with a spring 451 sleeved thereon passes through the first connecting hole and the second connecting hole to movably connect the heat dissipation seat 432 and the heat-conducting block 412; a thermal expansion and contraction elastic block 440 and a semiconductor refrigeration unit 420 are located between the heat-conducting block 412 and the heat dissipation seat 432, and the thermal expansion and contraction elastic block 440 is connected to the heat-conducting block 412 and the heat dissipation seat 432 respectively; when the thermal expansion and contraction elastic block 440 expands or contracts, the heat dissipation seat 432 can move away from or close to the bottom of the heat-conducting block 412 along the axis direction of the sample cup 320, wherein the cup-shaped heat-conducting block 412 can wrap around the sample cup 320 to make the heat conduction uniform, and the structure is simple and easy to implement; in the heating and warming stage, the end of the semiconductor refrigeration unit 420 abutting against the heat-conducting block 412 releases heat to accelerate the warming, when the temperature rises to 200℃, the thermal expansion and contraction elastic block 440 will expand to push the heat dissipation seat 432 to move downward, so that the semiconductor refrigeration unit 420 is separated from the heat-conducting block 412, and the heating element 411 continues to heat and warm until a certain high temperature state; in the cooling stage, when the temperature is above 200℃, the semiconductor refrigeration unit 420 is still separated from the heat-conducting block 412, when the temperature is below 200℃, the thermal expansion and contraction elastic block 440 contracts, and the heat dissipation seat 432 moves upward to make the semiconductor refrigeration unit 420 abut against the heat-conducting block 412, at this time, the end of the semiconductor refrigeration unit 420 abutting against the heat-conducting block 412 absorbs heat to cool, which accelerates the cooling speed, fully utilizes the function of the semiconductor material that can heat and cool, improves the shortcoming that the electric heating can only rely on natural cooling to cool down in the cooling process, especially the very slow natural cooling speed in the low temperature stage, and the semiconductor refrigeration unit 420 has small volume and compact structure, which is convenient to use.

[0028] In some embodiments, the heat dissipation assembly is a water-cooled heat dissipation system, which includes a heat dissipation water tank, a water inlet pipe and a water outlet pipe connected to the heat dissipation water tank, the water inlet pipe and the water outlet pipe are respectively connected to an external water source, the heat dissipation water tank is movably connected to the bottom of the heat-conducting block 412, and the semiconductor refrigeration unit 420 and the thermal expansion and contraction elastic block 440 are respectively connected to the heat dissipation water tank and the bottom of the heat-conducting block 412, when the thermal expansion and contraction elastic block 440 expands or contracts, the heat dissipation water tank can move away from or close to the bottom of the heat-conducting block 412 along the axis direction of the sample cup 320, so that the semiconductor refrigeration unit 420 moves away from or close to the bottom of the heat-conducting block 412.

[0029] As Figure 1As shown, in some embodiments, the rack 500 is further provided with a driving device, vertical guide rails 510, a first support 521 and a second support 522 connected with the driving device, one end of the first support 521 is movably connected with the rack 500, the driving device drives the first support 521 to slide along the guide rails 510, the other end of the first support 521 is connected with the main machine 100, and the main machine 100 is detachably connected with the magnetic transmission module 200; one end of the second support 522 is connected with the rack 500, and the other end of the second support 522 is connected with the heat conduction block 412; when the driving device drives the first support 521 to automatically slide upwards along the guide rails 510 so that the main machine 100 is not connected with the magnetic transmission module 200, the torque and the rotation speed detected by the main machine 100 are zero; when the driving device drives the first support 521 to automatically descend to a suitable position, the main machine 100 is connected with the magnetic transmission module 200 to drive the magnetic transmission module to rotate; since the second support 522 fixes the heat conduction block 412, the magnetic transmission module 200 and the sample cup 320 can be taken out of or put back into the heat conduction block 412, which does not affect the position of the overall central axis, the first support 521 can be lifted and lowered, the detachable connection between the main machine 100 and the magnetic transmission module 200 in the vertical direction is facilitated, and the automatic driving device is convenient for control.

[0030] In some embodiments, a limiting structure is arranged between the sample cup 320 and the heat conduction block 412 to prevent relative rotation, such as a clamping groove arranged on the inner wall of the heat conduction block 412 and a buckle arranged on the outer wall of the sample cup 320, the buckle is clamped with the clamping groove to limit the rotation.

[0031] In some embodiments, the driving device includes a driving motor 531 and a lead screw 532, and the driving device is wirelessly connected with a remote controller, the guide rails 510 are two parallel guide rails, the driving motor 531 is arranged between the two guide rails 510 and fixed on the rack 500, the upper end of the motor shaft of the driving motor 531 is connected with the lead screw 532 through a coupling, the first support 521 is fixed on the lead screw 532, the remote controller gives the driving motor 531 a pulse signal, the driving motor 531 drives the lead screw 532 to move, thereby driving the first support 521 to lift and lower, and thereby driving the main machine 100 fixed on the first support 521 to lift and lower.

[0032] As Figure 4 and Figure 5As shown, in some embodiments, the magnetic transmission module 200 includes a rotating housing 210, an outer magnetic block 211, an isolation sleeve 220, an inner magnetic block 231, and a rotating shaft 230. The host 100 includes a main control module, a torque sensor, a motor 110, and a drive shaft 120 connected to the output shaft of the motor. The outer magnetic block 211 is disposed on the inner wall surface of the rotating housing 210, and the inner magnetic block 231 is disposed on the surface of the rotating shaft 230. It should be noted that the size, number, and number of pole pairs of the outer magnetic block 211 and the inner magnetic block 231 are not limited here. The isolation sleeve 220 is sleeved on the rotating shaft 230 to isolate the inner magnetic block 231 and the outer magnetic block 211, and the rotating housing 210 is sleeved on the isolation sleeve 220. One end of the torque sensor is connected to the drive shaft 120, and the other end of the motor 110 and the torque sensor are electrically connected to the main control module. The main control module controls the motor 110 to rotate at a certain speed. The drive shaft 120 is connected to the top of the rotating housing 210 to drive the rotating housing 210 to rotate. The rotating housing 210 drives the outer magnetic block 211 to rotate around the rotating shaft 230 to generate a magnetic field. Under the action of the magnetic field, the inner magnetic block 231 drives the rotating shaft 230 to rotate, thereby driving the test rotor 310 to rotate in the sample cup 320. The magnitude of the torque of the reaction force it receives will be directly fed back to the host 100 through the magnetic transmission module 200. The host 100 converts the relationship between torque and rotation speed into the relationship between viscosity and shear rate, thereby completing the viscosity and rheological testing process. That is, the magnetic transmission module 200 transmits the rotation state of the test rotor 310 to the torque sensor through the drive shaft 120. The torque sensor can detect the corresponding torque and torque, thereby obtaining the viscosity of the tested liquid. The main control module can obtain the relationship between the liquid viscosity and shear rate through the detected relationship between torque and rotation speed.

[0033] like Figure 3 and Figure 4 As shown, in some embodiments, the drive shaft 120 is connected to the top end of the rotating housing 210 by a snap-fit ​​connection. The top end of the rotating housing 210 is provided with a groove 212, and the end of the drive shaft 120 is provided with a snap-fit ​​part 121 that snaps into the groove. The two are detachably connected.

[0034] like Figure 4As shown, in some embodiments, further comprising an upper flange 221 and a lower flange 222, the upper flange 221 is integrally connected with the isolation sleeve 220 to be sleeved on the rotating shaft 230, the lower flange 222 is sleeved on the sample cup 320, and a flange connection structure is arranged between the upper flange 221 and the lower flange 222 to form a sealed space between the isolation sleeve 220 and the sample cup 320. Wherein, the flange connection structure comprises an upper through hole arranged at the edge of the upper flange 221, a lower through hole arranged at the edge of the lower flange 222, and a bolt, the bolt passes through the upper through hole and the lower through hole to tightly abut the upper flange 221 and the lower flange 222 to form a sealed space between the isolation sleeve 220 and the sample cup 320, and the upper flange 221 is integrally connected with the isolation sleeve 220 to have good sealing effect.

[0035] In some embodiments, further comprising a pressure control module, the pressure control module comprises a high-pressure gas pipe 610 and a pressure control pump 620 capable of increasing and reducing pressure in communication with the high-pressure gas pipe, a through hole is arranged on the sample cup 320 or the upper flange 221, and the high-pressure gas pipe 610 communicates with the inside of the sample cup 320 through the through hole, so that the structure is simple and convenient for pressure increasing and reducing control; in some embodiments, a pressure gauge 630 is connected with the high-pressure gas pipe 610 to detect the gas pressure.

[0036] In some embodiments, an external control module capable of controlling the working state of the pressure control pump 620 and the temperature control module is included, the external control module can adopt a remote controller, the pressure control pump 620 and the temperature control module are wirelessly connected with the remote controller, the pressure control pump 620 adopts an intelligent pressure increasing pump with a wireless chip, the temperature control module is also provided with a wireless chip, and the temperature and pressure can be uniformly and centrally controlled through the remote controller, which is convenient for users to use.

[0037] In some embodiments, the host 100 further comprises an encoder, one end of the encoder is connected with the upper shaft of the motor, and the other end of the encoder is electrically connected with the main control module, the motor 110 rotates at a certain speed according to the instruction of the main control module, the real speed of rotation is fed back to the main control module by the encoder, and the main control module corrects the difference between the two to achieve precise speed control.

[0038] Those skilled in the art can easily understand that the above preferred modes can be freely combined and superimposed without conflict.

[0039] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application, any equivalent structural transformation made under the inventive concept of the present application, or direct or indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A high-temperature, high-pressure rheometer, characterized in that, include: The host (100) and the magnetic drive module (200) connected to the host (100) are provided. The host (100) is capable of controlling and driving the magnetic drive module (200) to rotate, and the host (100) is capable of detecting the torque of the magnetic drive module (200). A test rotor (310) and a sample cup (320) are provided. A magnetic drive module (200) is connected to one end of the test rotor (310), and the other end of the test rotor (310) is placed in the sample cup (320). The temperature control module includes a heating component, a semiconductor cooling unit (420), a heat dissipation component, and a thermal expansion and contraction spring (440). The heating component is disposed on the outer wall of the sample cup (320), and the heat dissipation component is movably disposed around the heating component. The thermal expansion and contraction spring (440) and the semiconductor cooling unit (420) are respectively located between the heating component and the heat dissipation component, and the semiconductor cooling unit (420) is fixedly connected to the heat dissipation component. The thermal expansion and contraction spring (440) is connected to both the heating component and the heat dissipation component. The thermal expansion and contraction spring (440) expands / contracts to push / pull the heat dissipation component away from / close to the heating component, so that the semiconductor cooling unit (420) separates / fits with the heating component.

2. The high-temperature and high-pressure rheometer according to claim 1, characterized in that: The heating assembly includes a heating element (411) and a cup-shaped heat-conducting block (412). The heat-conducting block (412) is inserted into the sample cup (320) to wrap around the outer wall of the sample cup (320). The heating element (411) is disposed on the side wall of the outer surface of the heat-conducting block (412). The heat dissipation assembly is disposed at the bottom of the outer surface of the heat-conducting block (412) and is movable along the axial direction of the sample cup (320). The thermal expansion and contraction spring (440) and the semiconductor cooling unit (420) are respectively located between the heat-conducting block (412) and the heat dissipation assembly. The thermal expansion and contraction spring (440) is connected to the heat-conducting block (412) and the heat dissipation assembly respectively.

3. The high-temperature and high-pressure rheometer according to claim 2, characterized in that: It also includes a frame (500), on which a drive device, a vertical guide rail (510), a first bracket (521) and a second bracket (522) connected to the drive device are provided. One end of the first bracket (521) is movably connected to the frame (500), and the drive device can drive the first bracket (521) to slide along the guide rail (510). The other end of the first bracket (521) is connected to the host (100), and a detachable connection structure is provided between the host (100) and the magnetic transmission module (200). One end of the second bracket (522) is connected to the frame (500), and the other end of the second bracket (522) is connected to the heat-conducting block (412).

4. The high-temperature and high-pressure rheometer according to claim 3, characterized in that: A limiting structure is provided between the sample cup (320) and the heat-conducting block (412) to prevent relative rotation.

5. The high-temperature and high-pressure rheometer according to claim 1, characterized in that: The host (100) includes a main control module, a torque sensor, a motor (110), and a drive shaft (120) connected to the output shaft of the motor. One end of the torque sensor is connected to the output shaft of the motor, and the other end of the torque sensor is connected to the drive shaft (120). The drive shaft (120) is connected to the magnetic transmission module (200). The motor (110) and the torque sensor are electrically connected to the main control module.

6. The high-temperature and high-pressure rheometer according to claim 5, characterized in that: The host also includes an encoder electrically connected to the main control module, one end of which is connected to the upper shaft of the motor.

7. The high-temperature and high-pressure rheometer according to claim 1, characterized in that: The magnetic drive module (200) includes a rotating housing (210), an outer magnetic block (211), an isolation sleeve (220), an inner magnetic block (231), and a rotating shaft (230). The outer magnetic block (211) is disposed on the inner wall surface of the rotating housing (210), and the inner magnetic block (231) is disposed on the surface of the rotating shaft (230). The isolation sleeve (220) is sleeved on the rotating shaft (230) to isolate the inner magnetic block (231) and the outer magnetic block (211). The rotating housing (210) is sleeved on the isolation sleeve (220), and the host (100) is connected to the top end of the rotating housing (210) to drive the rotating housing (210) to rotate.

8. The high-temperature and high-pressure rheometer according to claim 7, characterized in that: It also includes an upper flange (221) and a lower flange (222). The upper flange (221) is integrally connected to the isolation sleeve (220) to be sleeved on the rotating shaft (230). The lower flange (222) is sleeved on the sample cup (320). A flange connection structure is provided between the upper flange (221) and the lower flange (222) so that the isolation sleeve (220) and the sample cup (320) form a sealed space.

9. The high-temperature and high-pressure rheometer according to claim 8, characterized in that: It also includes a pressure control module, which includes a high-pressure gas pipe (610) and a pressure control pump (620) that is connected to the high-pressure gas pipe (610) and can increase or decrease pressure. A through hole is provided on the sample cup (320) or the upper flange (221), and the high-pressure gas pipe (610) passes through the through hole and communicates with the inside of the sample cup (320).

10. The high-temperature and high-pressure rheometer according to claim 9, characterized in that: It includes an external control module capable of controlling the working state of the pressure control pump (620) and the temperature control module, and the pressure control pump and the temperature control module are respectively electrically connected to the external control module.

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