Control Method and Coating Equipment of Glue Coating Equipment, and Storage Medium

Abstract

The present invention discloses a control method, a coating device and a storage medium for a coating device. The coating device includes a coating gun and a coating defect detection mechanism, and the coating defect detection mechanism is installed on the coating gun. The method includes: obtaining the global pose of the coating gun, and determining the moving direction of the coating gun according to the global pose of the coating gun; determining the direction information of the glue strip extruded by the coating gun relative to the coating gun according to the moving direction of the coating gun; determining the rotation angle of the coating defect detection mechanism according to the direction information; controlling the coating defect detection mechanism to rotate according to the rotation angle, so that the camera field of view of the coating defect detection mechanism covers the path range of the glue strip. Thus, it is possible to automatically adjust the orientation of the coating defect detection mechanism according to the path direction of the coating gun, so that the camera field of view of the coating defect detection mechanism can always cover the path range of the glue strip, and the universality of the coating device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of visual inspection of gluing defects, and particularly to a control method for a gluing device, a gluing device, and a storage medium. Background Art

[0002] In the field of visual inspection of gluing defects in intelligent manufacturing, in order not to affect production, an online inspection method is generally used to detect gluing defects. The online inspection method is as follows: An image acquisition camera is installed near the gluing gun, and the image acquisition camera moves synchronously with the gluing gun to collect images of the glue strip, and then image recognition and gluing defect analysis are performed on the images.

[0003] During the gluing process, the moving direction of the gluing gun is continuous and random, and the glue is located in the opposite direction of the moving direction of the gluing gun. If a single fixed image acquisition camera is used for shooting, there will be a situation where the glue strip is blocked by the gluing gun, which will affect the detection result of the online inspection.

[0004] In the related detection technology, there is a detection method using a single fixed image acquisition camera. This method is to fix the image acquisition camera within the range that can cover the gluing working path to collect images of the glue strip. However, this method is only applicable to the detection scenario where the change in the gluing path direction is small. Therefore, the universality of this method is low. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems in the related art to some extent.

[0006] To this end, an object of the present invention is to propose a control method for a gluing device to automatically adjust the orientation of the gluing defect detection mechanism according to the path direction of the gluing gun, so that the camera field of view of the gluing defect detection mechanism can always cover the glue strip path range and improve the universality of the gluing device.

[0007] The second object of the present invention is to propose a gluing device.

[0008] The third object of the present invention is to propose a computer-readable storage medium.

[0009] To achieve the above object, an embodiment of the first aspect of the present invention provides a control method for a glue application device, where the glue application device includes a glue gun and a glue application defect detection mechanism, the glue application defect detection mechanism is installed on the glue gun, and the method includes: obtaining the global pose of the glue gun, and determining the moving direction of the glue gun according to the global pose of the glue gun; determining the direction information of the glue strip extruded by the glue gun relative to the glue gun according to the moving direction of the glue gun; determining the rotation angle of the glue application defect detection mechanism according to the direction information; and controlling the rotation of the glue application defect detection mechanism according to the rotation angle, so that the camera field of view of the glue application defect detection mechanism covers the path range of the glue strip.

[0010] In the control method of the glue application device according to the embodiment of the present invention, by obtaining the global pose of the glue gun and determining the moving direction of the glue gun according to the global pose; then, according to the moving direction of the glue gun, determining the direction information of the glue strip relative to the glue gun; after obtaining the direction information of the glue strip relative to the glue gun, determining the required rotation angle of the glue application defect detection mechanism according to the direction information, and controlling the rotation of the glue application defect detection mechanism according to the rotation angle, thereby realizing automatically adjusting the orientation of the glue application defect detection mechanism according to the path direction of the glue gun, so that the camera field of view of the glue application defect detection mechanism can always cover the path range of the glue strip, and improving the universality of the glue application device.

[0011] To achieve the above object, an embodiment of the second aspect of the present invention provides a glue application device, which includes: a memory and a processor, where a computer program is stored on the memory, and when the processor executes the program, the control method of the glue application device as described above is implemented.

[0012] To achieve the above object, an embodiment of the third aspect of the present invention provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the control method of the glue application device according to the first aspect of the present invention is implemented.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0014] Figure 1 is a schematic structural diagram of the glue application device in the embodiment of the present invention;

[0015] Figure 2 is a schematic distribution diagram of a specific coordinate system in the embodiment of the present invention;

[0016] Figure 3 is a flowchart of the control method of the glue application device in the first embodiment of the present invention;

[0017] Figure 4 It is a flowchart of the control method of the glue - applying device according to the second embodiment of the present invention;

[0018] Figure 5 It is a flowchart of the control method of the glue - applying device according to the third embodiment of the present invention;

[0019] Figure 6 It is a flowchart of the control method of the glue - applying device according to the fourth embodiment of the present invention;

[0020] Figure 7 It is a structural block diagram of the glue - applying device according to an embodiment of the present invention. Detailed implementation manners

[0021] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0022] The control method, the glue - applying device, and the storage medium of the glue - applying device according to the embodiments of the present invention will be described below with reference to the accompanying drawings.

[0023] First, the structure of the glue - applying device according to the embodiments of the present invention will be specifically introduced.

[0024] Figure 1 It is a schematic structural diagram of the glue - applying device in the embodiment of the present invention. As Figure 1 shown, the glue - applying device includes a glue - applying gun 110, a glue - applying defect detection mechanism 120, and a flange. It should be noted that the flange is not shown in the figure.

[0025] Among them, the glue - applying gun 110 is in the shape of a long tube. One end of the glue - applying gun 110 has a conical constriction. The other end of the glue - applying gun 110 is fixedly connected to the flange, and the glue - applying gun 110 is installed at the end of the glue - applying device through the flange. Glue flows out from the conical constriction to realize the glue - applying process. The glue - applying defect detection mechanism 120 is sleeved on the middle position of the tube body of the glue - applying gun 110. The glue - applying defect detection mechanism 120 can be a device that can rotate around the glue - applying gun 110 and can collect the image of the glue strip.

[0026] In some embodiments, the glue application defect detection mechanism 120 includes a rotary power assembly 121, a bracket 122, and a camera 123. The rotary power assembly 121 is circular, and the rotary power assembly 121 is sleeved on the body of the glue gun 110. The bracket 122 is composed of two connected fixed rings. One fixed ring is sleeved on the rotary power assembly 121, and the other fixed ring is sleeved on the camera 123. Thus, the camera 123 is installed on the rotary power assembly 121. The rotary power assembly 121 is used to drive the camera 123 to rotate around the glue gun 110, and the camera 123 is used to collect images of the glue strip.

[0027] In this embodiment, the glue application device further includes a control chip, on which a glue application program is running, and the operation of the glue application defect detection mechanism is controlled by the control chip.

[0028] In addition, in the embodiments of the present invention, it is necessary to pre-establish a local coordinate system A_gun of the glue gun, a global coordinate system T_end of the flange, a local coordinate system A_cam of the glue application defect detection mechanism, and a base coordinate system of the glue application device.

[0029] Figure 2 It is a schematic diagram of the distribution of a specific coordinate system in the embodiments of the present invention.

[0030] As Figure 2 shown, the local coordinate system A_gun of the glue gun is a coordinate system described relative to the flange. The origin of the local coordinate system A_gun of the glue gun is set on the axis of the glue gun, the direction of the Z-axis can be set along the axis of the glue gun, and the directions of the X-axis and Y-axis can be flexibly configured according to requirements. Specifically, an initial direction can be set for the X-axis and Y-axis first. During the movement of the glue gun, the origin of the local coordinate system A_gun of the glue gun and the directions of the X-axis and Y-axis will change with the translation or rotation of the glue gun.

[0031] The local coordinate system A_cam of the glue application defect detection mechanism is a coordinate system described relative to the glue gun. The origin of the local coordinate system A_cam of the glue application defect detection mechanism is set on the axis of the glue gun and is flush with the glue application defect detection mechanism. The Z-axis of the local coordinate system A_cam of the glue application defect detection mechanism can have the same direction as the Z-axis of the local coordinate system A_gun of the glue gun, and the X-axis can be set to point along the Z-axis to the axis of the camera optical axis. Specifically, an initial direction can also be set for the X-axis and Y-axis of the local coordinate system A_cam of the glue application defect detection mechanism first. When the glue application defect detection mechanism is working, the origin of the local coordinate system A_cam of the glue application defect detection mechanism and the directions of the X-axis and Y-axis will change with the translation or rotation of the glue application defect detection mechanism.

[0032] The initial directions of the X-axis, Y-axis, and Z-axis of the local coordinate system A_gun of the glue gun can be set to the same directions as the initial directions of the X-axis, Y-axis, and Z-axis of the local coordinate system A_cam of the glue application defect detection mechanism.

[0033] The global coordinate system T_end of the flange is established with the flange as the center. The direction of the Z-axis of the global coordinate system T_end of the flange can be set to the direction opposite to the direction of the Z-axis of the local coordinate system A_gun of the glue gun, and the initial directions of the X-axis and Y-axis can be set to the same directions as the initial directions of the X-axis and Y-axis of the local coordinate system A_gun of the glue gun. The global coordinate system T_end of the flange will change as the flange moves.

[0034] The origin of the base coordinate system of the glue application device can be set to the center point of the base of the glue application device. Similarly, the direction of the Z-axis of the base coordinate system of the glue application device can be set to the same direction as the direction of the Z-axis of the local coordinate system A_gun of the glue gun, and the initial directions of the X-axis and Y-axis can be set to the same directions as the initial directions of the X-axis and Y-axis of the local coordinate system A_gun of the glue gun. It is worth mentioning that all coordinate systems in the embodiments of the present invention can be obtained by rotating and translating the base coordinate system. It should be noted that the base coordinate system of the glue application device is not shown in the figure.

[0035] In this embodiment, the basic parameters of the above coordinate system (i.e., the axis direction parameters, origin parameters, etc.) can be input into the control chip of the glue application device first, and the control chip of the glue application device will automatically establish the above coordinate system. And the glue application device has a pose query function, that is, it can query the pose of each component in its coordinate system. Here it should be noted that the pose refers to the position and attitude. Exemplarily, when the glue application device is working, the pose of the flange in the global coordinate system T_end of the flange can be directly obtained in real time in the control chip of the glue application device.

[0036] Referring to the structure of the above glue application device and the above coordinate system, the control method of the glue application device of the present invention will be specifically introduced below.

[0037] Figure 3 is a flowchart of the control method of the glue application device according to the first embodiment of the present invention. As Figure 3 shown, the method includes the following steps:

[0038] Step S310: Obtain the global pose of the glue gun, and determine the moving direction of the glue gun according to the global pose of the glue gun.

[0039] It should be noted that the global pose of the glue gun refers to: the position and attitude of the glue gun in the global coordinate system of the glue gun.

[0040] When the gluing equipment is working, the current moving direction of the gluing gun in the global coordinate system can be determined by obtaining the global position of the gluing gun in its global coordinate system.

[0041] Figure 4 FIG. 1 is a flow chart of a control method for a glue coating device according to a second embodiment of the present invention. Figure 4 As shown, in some embodiments, obtaining the global pose of the glue gun in step S310 includes the following steps:

[0042] Step S410: In the pre-constructed flange global coordinate system, the global position and orientation of the flange is obtained at every preset period.

[0043] Step S420: Determine the global posture of the glue gun according to the global posture of the flange and the local coordinate system of the glue gun relative to the flange.

[0044] It should be noted that the control chip of the glue coating equipment automatically reads the global position of the flange at a preset interval. The preset interval can be set by the technician based on factors such as the speed of the glue coating gun and the sampling frequency of the glue coating defect detection mechanism. For example, the preset interval can be set to 1s, 2s, etc. The faster the glue coating gun's speed or the higher the required sampling frequency, the shorter the preset interval for obtaining the global position of the flange can be.

[0045] In this embodiment, the gluing device is further provided with a database for storing data, and the control chip is connected to the database. Each time the control chip reads the global position of the flange, it outputs the flange's global position data to the database, which stores the data for subsequent use. In some embodiments, the global position data of the flange can also be stored in a cache.

[0046] In some embodiments, the global pose of the glue gun is determined by the following formula:

[0047] T_gun i =T_end i *A_gun

[0048] Among them, T_gun i is the global pose of the glue gun in the i-th cycle, T_end i is the global pose of the flange in the i-th cycle, and A_gun is the local coordinate system of the glue gun relative to the flange.

[0049] First, it should be noted that the coordinate system and global pose in the embodiments of the present invention can both be represented by a 4×4 vector matrix. The following uses the global coordinate system of a flange as an example to introduce the data format of the coordinate system or global pose.

[0050] The data form of the global coordinate system of the flange can be:

[0051]

[0052] Among them, R_end is the rotation component of the base coordinate system rotated to the global coordinate system of the glue gun, and P_end is the translation component of the base coordinate system translated to the global coordinate system of the glue gun. Specifically, R_end is a 3×3 vector matrix, and its data form can be: P_end is a 3×1 vector matrix, and its data form can be:

[0053] Since the local coordinate of the glue gun is established relative to the flange, and the local coordinate system of the glue gun will change with the movement of the glue gun, that is, the origin of the local coordinate system of the glue gun will translate with the movement of the glue gun. Therefore, the position of the local coordinate system of the glue gun in the global coordinate system of the flange can represent the position of the glue gun in the global coordinate system of the flange.

[0054] Thus, after obtaining the global pose of the flange, by multiplying the global pose T_end of the flange i and the local coordinate system A_gun of the glue gun, the global pose T_gun of the glue gun can be obtained i , and the global pose T_gun of the glue gun i is also a 4×4 vector matrix.

[0055] In this embodiment, after the control chip calculates the global pose of the glue gun, it will also output the global pose of the glue gun to the database for storage. When the data is needed later, the required data is called from the database.

[0056] Figure 5 is the flowchart of the control method of the glue application device in the third embodiment of the present invention. As Figure 5 shown, in some embodiments, in step S310, determining the moving direction of the glue gun according to the global pose of the glue gun includes the following steps:

[0057] Step S510: Determine the translation component in the global pose of the glue gun.

[0058] Step S520: Determine the moving direction of the glue gun according to the translation components of two adjacent cycles.

[0059] After obtaining the global pose of the flange for each cycle and combining it with the local coordinate system of the glue gun, after obtaining the global pose of the glue gun for each cycle, the translation component (denoted as P_gun) in the global pose of the glue gun for each cycle can be obtained through the data representation method of the global pose. By the translation component of the current cycle and the translation component of the previous cycle, the moving direction of the glue gun in the current cycle can be calculated and obtained.

[0060] In some embodiments, the moving direction of the glue gun is determined by the following formula:

[0061]

[0062] where, V_gun i is the moving direction of the glue gun in the i-th cycle, P_gun i is the translation component in the i-th cycle, and P_gun i-1 is the translation component in the (i - 1)-th cycle. In the above formula, |·| represents the modulus of the vector.

[0063] Specifically, when the control chip calculates and obtains the global pose of the glue gun in the current cycle, the translation component of the current cycle is obtained; and the control chip will retrieve the global pose of the glue gun in the previous cycle from the database to obtain the translation component of the previous cycle. After obtaining the translation components of two adjacent cycles, the moving direction of the glue gun in the current cycle can be calculated through the above formula. The obtained moving direction V_gun i , is also represented by a 3×1 vector matrix. And this V_gun i is a direction vector of the glue gun in the global coordinate system. After obtaining the moving direction V_gun i of the glue gun, it is necessary to perform vector normalization on V_gun i to facilitate subsequent calculations.

[0064] Step S320: Determine the direction information of the glue strip extruded by the glue gun relative to the glue gun according to the moving direction of the glue gun.

[0065] During the operation of the glue gun, taking the glue gun as the reference, the moving direction of the glue gun is opposite to the direction of the glue strip extruded by the glue gun. Therefore, through the moving direction of the glue gun in the global coordinate system, the direction information of the glue strip in the global coordinate system can be obtained. It should be noted that the direction information is the direction vector of the glue strip in the global coordinate system.

[0066] In this embodiment, V_glue i is used to represent the direction vector (i.e., direction information) of the glue strip in the global coordinate system in the i-th cycle. Then the calculation method of the glue strip direction vector can be: V_glue i = -V_gun i .

[0067] Step S330: Determine the rotation angle of the glue application defect detection mechanism according to the direction information.

[0068] Figure 6 It is a flowchart of the control method of the glue application equipment according to the fourth embodiment of the present invention. As Figure 6 shown, in some embodiments, step S330 includes the following steps:

[0069] Step S610: Determine the direction vector of the glue strip in the local coordinate system of the glue application defect detection mechanism relative to the flange according to the direction information.

[0070] Step S620: Determine the rotation angle according to the direction vector and the X-axis axial direction of the local coordinate system of the glue application defect detection mechanism relative to the flange.

[0071] After obtaining the direction vector of the glue strip in the global coordinate system, the direction vector of the glue strip in the local coordinate system of the glue application defect detection mechanism can be obtained by converting the direction vector in the global coordinate system into the direction vector in the local coordinate system of the glue application defect detection mechanism, and then the rotation angle that the glue application defect detection mechanism needs to rotate based on its local coordinate system can be calculated.

[0072] In some embodiments, step S610 includes: determining the global pose of the glue application defect detection mechanism according to the local coordinate system of the glue application defect detection mechanism relative to the flange and the global pose of the flange; determining the direction vector according to the direction information and the global pose of the glue application defect detection mechanism.

[0073] Specifically, to obtain the direction vector of the glue strip in the local coordinate system of the glue application defect detection mechanism, it is necessary to first obtain the global pose of the glue application defect detection mechanism in the global coordinate system. In this embodiment, the global pose of the glue application defect detection mechanism is determined by the following formula:

[0074] T_cam i = T_end i * A_cam

[0075] where, T_cam i is the global pose of the glue application defect detection mechanism in the i-th cycle, T_end i is the global pose of the flange in the i-th cycle, and A_cam is the local coordinate system of the glue application defect detection mechanism relative to the flange.

[0076] The principle of obtaining the global pose of the glue application defect detection mechanism is the same as that of obtaining the global pose of the glue gun, which will not be elaborated here. After obtaining the global pose of the glue application defect detection mechanism, the rotation component R_cam of the global pose is obtained through the data representation form of the global pose of the glue application defect detection mechanism. The conversion relationship between the direction vector of the glue strip in the global coordinate system and the direction vector of the glue strip in the local coordinate system of the glue application defect detection mechanism is as follows:

[0077] R_cam * V_gun_in_cam = V_glue

[0078] where V_gun_in_cam represents the direction vector of the glue strip in the local coordinate system of the glue application defect detection mechanism, and V_gun_in_cam is also a 3×1 vector matrix.

[0079] Furthermore, it can be obtained that: V_gun_in_cam = inv(R_cam) * (V_glue), where inv(·) represents the inverse of the matrix.

[0080] In step S620, after obtaining the direction vector of the glue strip in the local coordinate system of the glue application defect detection mechanism, the angle (denoted as step_q) between the projection direction of the direction vector on the xoy plane of the local coordinate system of the glue application defect detection mechanism and the X-axis of the local coordinate system of the glue application defect detection mechanism is solved, and this angle is the rotation angle required for the camera in the glue application defect detection mechanism.

[0081] Since the direction of the X-axis of the local coordinate system of the glue application defect detection mechanism is set as: pointing along the Z-axis to the optical axis of the camera in the glue application defect detection mechanism, and the direction of the X-axis will rotate with the rotation of the camera, the optical axis of the camera is always on the X-axis of the local coordinate system of the glue application defect detection mechanism. By calculating the angle between the projection direction of the glue strip direction vector on the xoy plane of the local coordinate system of the glue application defect detection mechanism and the X-axis of the local coordinate system of the glue application defect detection mechanism, it is possible to obtain the rotation angle of the camera when the camera can be directly above the glue strip to achieve that the camera field of view of the glue application defect detection mechanism covers the path range of the glue strip.

[0082] In some embodiments, the rotation angle step_q is determined by the following formula:

[0083] step_q = atan2(V_gun_in_cam x , V_gun_in_cam Y )

[0084] where V_gun_in_cam x is the component of the projection direction of the direction vector on the xoy plane of the local coordinate system of the glue application defect detection mechanism on the X-axis, V_gun_in_camY It is the component of the projection direction of the direction vector on the xoy plane in the local coordinate system of the glue application defect detection mechanism on the Y axis. By calculating the arctangent values of the above two components, the required rotation angle can be obtained.

[0085] Step S340: Control the rotation of the glue application defect detection mechanism according to the rotation angle, so that the camera field of view of the glue application defect detection mechanism covers the path range of the glue strip.

[0086] Specifically, after the control chip calculates the rotation angle, the control chip controls the rotation power component in the glue application defect detection mechanism according to the rotation angle to control the rotation angle of the camera. Exemplarily, the rotation angle of the camera can be controlled by controlling the output power of the rotation power component.

[0087] Thus, by obtaining the global pose of the glue gun in each preset period, the current moving direction of the glue gun in the global coordinate system is calculated; through the moving direction of the glue gun, the direction information of the glue strip in the global coordinate system can be obtained; the direction information of the glue strip is converted into a direction vector in the local coordinate system of the glue application defect detection mechanism; and then the required rotation angle of the glue application defect detection mechanism is calculated according to the direction vector. Therefore, the control chip controls the rotation of the camera in the glue application defect detection mechanism according to the calculated rotation angle to automatically adjust the sampling range of the camera, and further makes the camera field of view always cover the path range of the glue strip.

[0088] Figure 7 It is the structural block diagram of the glue application device according to an embodiment of the present invention.

[0089] As Figure 7 shown, Figure 7 The glue application device 700 shown includes: a processor 701 and a memory 703. Among them, the processor 701 and the memory 703 are connected, such as through a bus 702. Optionally, the glue application device 700 may further include a transceiver 704. It should be noted that in practical applications, the transceiver 704 is not limited to one, and the structure of the glue application device 700 does not constitute a limitation to the embodiments of the present invention.

[0090] The processor 701 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute various exemplary logical blocks, modules, and circuits described in connection with the disclosure of the present invention. The processor 701 may also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, and the like.

[0091] The bus 702 may include a path for transmitting information between the above components. The bus 702 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The bus 702 may be divided into an address bus, a data bus, a control bus, etc. For the sake of representation, Figure 7 only a thick line is shown in the figure, but it does not mean that there is only one bus or one type of bus.

[0092] The memory 703 may be a ROM (Read Only Memory) or other type of static storage device that can store static information and instructions, a RAM (Random Access Memory) or other type of dynamic storage device that can store information and instructions, or it may also be an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory), or other optical disc storage, optical disc storage (including compact discs, laser discs, optical discs, digital versatile discs, Blu-ray discs, etc.), magnetic storage media, or other magnetic storage devices, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto.

[0093] The memory 703 is used to store the application program code for implementing the solution of the present invention, and is controlled by the processor 701 for execution. The processor 701 is used to execute the application program code stored in the memory 703 to implement the content shown in the foregoing method embodiments.

[0094] Among them, the glue coating device 700 includes but is not limited to: mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Tablet Computers), PMPs (Portable Multimedia Players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. Figure 7 The shown glue coating device 700 is only an example, and should not impose any limitations on the functions and usage scope of the embodiments of the present invention.

[0095] It should be noted that the logic and / or steps represented in the flowchart or described in other ways herein, for example, can be considered as a definite sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution control chip, device or equipment (such as a computer-based control chip, a control chip including a processor, or other control chips that can fetch instructions from the instruction execution control chip, device or equipment and execute the instructions), or used in combination with these instruction execution control chips, devices or equipment. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by or in combination with an instruction execution control chip, device or equipment. More specific examples (non-exhaustive list) of computer-readable media include the following: electrical connection parts (electronic devices) having one or more wirings, portable computer disk cartridges (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber devices, and portable compact disc read-only memory (CDROM). Additionally, a computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, then editing, interpreting or otherwise processing it as appropriate, and then storing it in a computer memory.

[0096] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution control chip. For example, if implemented by hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

[0097] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0098] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0099] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0100] In the present invention, unless otherwise clearly specified or limited, the terms "installed", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0101] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0102] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A control method for a glue coating device, characterized in that, The glue - applying device includes a glue - applying gun and a glue - applying defect detection mechanism. The glue - applying defect detection mechanism is installed on the glue - applying gun. The method includes: Obtain the global pose of the glue - applying gun, and determine the moving direction of the glue - applying gun according to the global pose of the glue - applying gun; Determine the direction information of the glue strip extruded by the glue - applying gun relative to the glue - applying gun according to the moving direction of the glue - applying gun; Determine the rotation angle of the glue - applying defect detection mechanism according to the direction information; Control the rotation of the glue - applying defect detection mechanism according to the rotation angle, so that the camera field of view of the glue - applying defect detection mechanism covers the path range of the glue strip; Wherein, the global pose of the glue - applying gun refers to the position and attitude of the glue - applying gun in the global coordinate system of the glue - applying gun; The glue - applying gun is installed at the end of the glue - applying device through a flange. The obtaining of the global pose of the glue - applying gun includes: In the pre - constructed global coordinate system of the flange, obtain the global pose of the flange at preset intervals; Determine the global pose of the glue - applying gun according to the global pose of the flange and the local coordinate system of the glue - applying gun relative to the flange.

2. The control method of the glue coating device according to claim 1, characterized in that, Determine the global pose of the glue - applying gun through the following formula: T_gun i = T_end i *A_gun where, T_gun i is the global pose of the glue gun in the i-th cycle, T_end i is the global pose of the flange in the i-th cycle, and A_gun is the local coordinate system of the glue gun relative to the flange.

3. The control method of the glue coating device according to claim 1, characterized in that, The determining of the moving direction of the glue - applying gun according to the global pose of the glue - applying gun includes: Determine the translation component in the global pose of the glue - applying gun; Determine the moving direction of the glue - applying gun according to the translation components of two adjacent periods.

4. The control method of the glue coating device according to claim 3, characterized in that, Determine the moving direction of the glue - applying gun through the following formula: Among them, V_gun i is the moving direction of the glue gun in the i-th cycle, P_gun i is the translation component in the i-th cycle, P_gun i-1 is the translation component in the (i - 1)-th cycle.

5. The control method of the glue coating device according to claim 1, characterized in that, The determining of the rotation angle of the glue - applying defect detection mechanism according to the direction information includes: According to the direction information, determine the direction vector of the glue strip in the local coordinate system of the pre - constructed glue - applying defect detection mechanism relative to the flange; Determine the rotation angle according to the direction vector and the X - axis axial direction of the local coordinate system of the glue - applying defect detection mechanism relative to the flange.

6. The control method of the glue coating device according to claim 5, characterized in that The determining of the direction vector of the glue strip in the local coordinate system of the pre - constructed glue - applying defect detection mechanism relative to the flange according to the direction information includes: Determine the global pose of the glue - applying defect detection mechanism according to the local coordinate system of the glue - applying defect detection mechanism relative to the flange and the global pose of the flange; Determine the direction vector according to the direction information and the global pose of the glue - applying defect detection mechanism.

7. The control method of the glue coating device according to claim 6, characterized in that, Determine the global pose of the glue - applying defect detection mechanism through the following formula: T_cam i = T_end i * A_cam Among them, T_cam i is the global pose of the glue application defect detection mechanism in the i-th cycle, T_end i is the global pose of the flange in the i-th cycle, and A_cam is the local coordinate system of the glue application defect detection mechanism relative to the flange.

8. A gluing device, comprising a memory, a processor, and a computer program stored on the memory, characterized in that, When the computer program is executed by the processor, it implements the control method of the glue - applying device according to any one of claims 1 - 7.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the control method of the glue - applying device according to any one of claims 1 - 7.

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