A wafer cleaning device

Abstract

The present invention discloses a wafer cleaning device, which includes: a tank body; a support assembly located in the tank body, which is a rotating member for vertically supporting and driving the wafer to be cleaned to rotate; a cleaning brush horizontally arranged and rolling around its axis; a cleaning member located in the tank body for spraying fluid towards the rotating member to remove particulate matter accumulated on the rotating member; the spraying direction of the cleaning member matches the rotation direction of the wafer to be cleaned.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer post-processing, and more particularly, relates to a wafer cleaning device. Background Art

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in boosting the transformation and upgrading of the manufacturing industry to digitalization and intelligentization. A chip is the carrier of an integrated circuit, and chip manufacturing involves chip design, wafer manufacturing, wafer processing, electrical measurement, cutting and packaging, and testing processes. Among them, chemical mechanical polishing belongs to the wafer manufacturing process, and chemical mechanical polishing (CMP) is an ultra-precision surface processing technology for global planarization.

[0003] After the wafer is chemically mechanically polished, post-processing such as cleaning and drying is required. The purpose of wafer post-processing is to avoid the contamination of semiconductor devices by trace ions and metal particles and ensure the performance and qualification rate of semiconductor devices. Wafer cleaning methods include: brush rolling cleaning, megasonic cleaning, etc. Among them, brush rolling cleaning is more widely used.

[0004] Figure 1 A wafer cleaning device is shown for vertical brush rolling cleaning of wafers, which includes a tank body. A support assembly is arranged inside the tank body, and the support assembly includes a driving wheel and a speed measuring wheel to vertically support the wafer and drive it to rotate; cleaning brushes arranged on both sides of the wafer roll around its axis to contact and clean the surface of the wafer and remove particulate matter on the wafer surface.

[0005] In a wafer cleaning device, generally, washers are configured inside the driving wheel and the speed measuring wheel. Under the frictional force between the washer and the outer edge of the wafer, the wafer to be cleaned rotates counterclockwise or clockwise. During the process of wafer rotation cleaning, the side of the wafer may collide with the driving wheel or the speed measuring wheel, and the abrasives formed by mutual friction between the two will accumulate on the outer peripheral surface of the washer along with the cleaning fluid. In addition, the chemicals used for wafer cleaning will produce residues, and these residues may also accumulate on the outer peripheral surface of the washer. The abrasives and / or residues accumulated on the driving wheel or the speed measuring wheel may reattach to the edge of the rotating wafer and affect the wafer cleaning effect. Summary of the Invention

[0006] Embodiments of the present invention provide a wafer cleaning device, aiming to solve at least one of the technical problems existing in the prior art.

[0007] Embodiments of the present invention provide a wafer cleaning device, including:

[0008] A tank body;

[0009] A support component, located in the groove body, is a rotating part for vertically supporting and driving the wafer to be cleaned to rotate.

[0010] A cleaning brush, horizontally arranged and rolling around its axis.

[0011] A cleaning part, located in the groove body, is used for spraying fluid towards the rotating part to remove the particulate matter accumulated on the rotating part; the spraying direction of the cleaning part matches the rotation direction of the wafer to be cleaned.

[0012] In one embodiment, the spraying direction of the cleaning part is consistent with the rotation direction of the rotating part.

[0013] In one embodiment, the cleaning part sprays fluid towards the center of the rotating part and / or the area below the center of the rotating part, and the sprayed fluid at least partially covers the outer peripheral surface corresponding to the contact position between the rotating part and the outer edge of the wafer.

[0014] In one embodiment, the spraying direction of the cleaning part is away from the area where the wafer to be cleaned is located.

[0015] In one embodiment, the spraying direction of the cleaning part passes through the midpoint of the line connecting the center and the outer edge of the rotating part.

[0016] In one embodiment, the cleaning part is arranged on the same side of the rotating part.

[0017] In one embodiment, the rotating part is a roller structure, and the roller structure includes a disc-shaped front end cover and a rear end cover, which are concentrically assembled to form a gap for defining the wafer to be cleaned, and the cleaning part sprays fluid towards the gap.

[0018] In one embodiment, the rotating part further includes a washer, which is concentrically arranged between the front end cover and the rear end cover, and the outer edge of the wafer to be cleaned abuts against the washer via the gap; the cleaning part sprays fluid towards the outer peripheral surface of the washer.

[0019] In one embodiment, the rotating part includes a first driving wheel, a second driving wheel and a speed measuring wheel located between the two. The spraying angle of the first driving wheel corresponding to the cleaning part is -60~60°, the spraying angle of the second driving wheel corresponding to the cleaning part is -30~80°, and the spraying angle of the speed measuring wheel corresponding to the cleaning part is -30~30°.

[0020] In one embodiment, the cleaning part is a spray pipe and / or a nozzle, and the distance between its spraying port and the landing point of the sprayed fluid is 3~50mm.

[0021] In one embodiment, the installation position of the cleaning part and / or its installation angle relative to the horizontal plane are adjustable.

[0022] In one embodiment, the injection flow rate of the cleaning member is 200 - 2000 mL / min.

[0023] In one embodiment, the wafer cleaning device further includes at least a pair of rinsing members, which are arranged on both sides of the wafer and spray fluid towards the edge area of the wafer in an interleaved manner.

[0024] In one embodiment, the fluid landing point of the rinsing member is located in the area below the center of the wafer to be cleaned.

[0025] In one embodiment, the distance between the fluid landing point of the rinsing member and the outer edge of the wafer is less than or equal to 50 mm.

[0026] The beneficial effects of the present invention include:

[0027] a. A cleaning member is configured for the support assembly of the wafer cleaning device to timely rinse the particulate matter accumulated on the outer peripheral surface of the rotating member, effectively avoiding the particulate matter on the rotating member from splashing onto the wafer surface again;

[0028] b. The injection angle of the cleaning member matches the rotation direction of the wafer to be cleaned to avoid the fluid sprayed from colliding against the rotating member and affecting the flow field inside the tank;

[0029] c. The injection angle of the cleaning member is away from the area where the wafer to be cleaned is located to avoid the particulate matter stripped by the sprayed fluid from splashing back onto the wafer surface;

[0030] d. Rinsing members are configured inside the wafer cleaning device, which are arranged in an interleaved manner and spray fluid towards the edge area of the wafer to rinse the particulate matter sticking back to the wafer surface towards the wafer edge, ensuring the wafer cleaning effect. Description of the Drawings

[0031] Through the detailed description in combination with the following drawings, the advantages of the present invention will become clearer and easier to understand. These drawings are only schematic and do not limit the protection scope of the present invention, where:

[0032] Figure 1 is a schematic diagram of a wafer cleaning device in the prior art;

[0033] Figure 2 is a schematic diagram of the inside of the first driving wheel in the prior art containing abrasives / residues;

[0034] Figure 3 is a schematic diagram of a wafer cleaning device provided by an embodiment of the present invention;

[0035] Figure 4 is a schematic diagram of the injection direction of the cleaning member provided by an embodiment of the present invention passing through the center of the first driving wheel;

[0036] Figure 5 It is a schematic diagram of the injection direction of the cleaning part provided by an embodiment of the present invention passing through the area below the center of the first driving wheel;

[0037] Figure 6 It is a schematic diagram of the injection direction of the cleaning part provided by an embodiment of the present invention passing through the midpoint of the line connecting the center and the outer edge of the washer;

[0038] Figure 7 It is a schematic diagram of a wafer cleaning device corresponding to a counterclockwise rotating wafer provided by an embodiment of the present invention;

[0039] Figure 8 It is a schematic diagram of a wafer cleaning device corresponding to a clockwise rotating wafer provided by an embodiment of the present invention;

[0040] Figure 9 It is a schematic diagram of a wafer cleaning device containing a rinsing part provided by an embodiment of the present invention. Detailed implementation manners

[0041] The following combines specific embodiments and their accompanying drawings to detail the technical solutions of the present invention. The embodiments recorded here are specific specific implementation manners of the present invention, used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation manners of the present invention and the protection scope of the present invention. Except for the embodiments recorded here, those skilled in the art can also adopt other obvious technical solutions based on the content disclosed in the claims and the specification of this application. These technical solutions include technical solutions that make any obvious substitutions and modifications to the embodiments recorded here.

[0042] The drawings in this specification are schematic diagrams, which assist in illustrating the concept of the present invention, and schematically show the shapes of various parts and their mutual relationships. It should be understood that, in order to clearly show the structures of the components in the embodiments of the present invention, the drawings are not drawn in the same proportion, and the same reference numerals are used to represent the same parts in the drawings.

[0043] In the present invention, "Chemical Mechanical Polishing (CMP)" is also called "Chemical Mechanical Planarization (CMP)", and a wafer (Wafer, W) is also called a substrate (Substrate), and their meanings and actual functions are equivalent.

[0044] In the IC manufacturing process, some organic and inorganic substances need to be used in the cleanroom. Due to factors such as personnel and environment, a large amount of pollutants will be generated during the wafer processing. These pollutants generally include particles, organic substances, metal pollutants, and / or oxides, etc. The particle size of the pollutants ranges from a few nanometers to several hundred nanometers. The role of wafer cleaning is to remove the pollutants attached to the wafer surface, so that the particle size and quantity of the contamination particles on the wafer surface are controlled within the process requirements.

[0045] Figure 1 FIG. 4 is a schematic structural diagram of the wafer cleaning device 1. The wafer cleaning device 1 includes a tank body 10. A support assembly 20 is arranged inside the tank body 10 to vertically support and position the wafer W to be cleaned. Cleaning brushes 30 are arranged on both sides of the wafer W. The end of the cleaning brush 30 is connected to a driving motor (not shown), and the driving motor drives the cleaning brush 30 to rotate around its axis. A spraying pipeline is arranged at the upper part of the tank body 10 to spray DIW and / or cleaning liquid onto the wafer W.

[0046] Figure 1 In FIG. 5, the support assembly 20 includes a first driving wheel 21, a second driving wheel 22, and a speed measuring wheel 23. The first driving wheel 21 and the second driving wheel 22 are driving wheels, and the test wheel 23 is a driven wheel. It is arranged at the middle position between the first driving wheel 21 and the second driving wheel 22 to detect the rotation speed of the wafer during the cleaning process and monitor the state of wafer cleaning.

[0047] During wafer cleaning, the first driving wheel 21 and the second driving wheel 22 rotate driven by a driving motor (not shown). Under the action of friction, the wafer W vertically arranged in the gap between the first driving wheel 21 and the second driving wheel 22 rotates around the axis of the wafer. The cleaning brush 30 abuts against the surface of the wafer W and rotates around the axis of the cleaning brush 30. The cleaning brush 30 can be made of a porous material such as polyvinyl alcohol, and the cleaning brush 30 can adsorb a large amount of cleaning liquid for brushing the surface of the wafer W. The rolling cleaning brush 30 contacts the rotating wafer W to remove the pollutants on the surface of the wafer W.

[0048] Figure 2 FIG. 6 shows Figure 1 A cross-sectional view of the first driving wheel 21 in the embodiment. The first driving wheel 21 generally includes a front end cover and a rear end cover. A gasket 20a is arranged between the front end cover and the rear end cover. Moreover, the front end cover and the rear end cover are buckled with each other to form a gap 21a for defining the wafer. The gasket 20a is arranged inside the gap 21a. The gasket 20a is made of a plastic with a certain flexibility. The gasket 20a directly abuts against the outer edge of the wafer, and the two rub against each other to form the power for driving the wafer to rotate.

[0049] As described in the background art, abrasives will be formed by the mutual friction between the wafer and the outer side wall of the support assembly 20. These abrasives will accumulate on the outer peripheral surface of the gasket 20a along with the cleaning fluid, asFigure 2 As shown. In addition, the chemicals used for wafer cleaning can also form residues, and these residues may also accumulate on the outer peripheral surface of the gasket. The abrasives and / or residues as described above adhere to the wafer surface again, causing secondary contamination, especially in the wafer edge region where "special map" defects are extremely likely to occur. The present invention provides a technical solution to solve the above problems:

[0050] As Figure 3 shown, a wafer cleaning device 2 includes:

[0051] A tank body 10;

[0052] A support assembly 20, which is located in the tank body 10. The support assembly 20 is a rotating member for vertically supporting and driving the wafer W to be cleaned to rotate; the rotating member here is the first driving wheel 21, the second driving wheel 22 and the speed measuring wheel 23 described above.

[0053] A cleaning brush 30, which is horizontally arranged and rolls around its axis; the above structure is similar to the structure of the wafer cleaning device 1 shown in Figure 1 and will not be elaborated here.

[0054] Figure 3 In addition, the wafer cleaning device 2 further includes a cleaning member 40. The cleaning member 40 is located inside the tank body 10 and is used to spray fluid towards the rotating member to remove particulate matters such as abrasives and / or residues accumulated on the rotating member, so as to avoid the particulate matters from accumulating at the position where the rotating member contacts the outer edge of the wafer and causing secondary contamination.

[0055] In order to avoid the fluid sprayed by the cleaning member 40 from having a hard collision with rotating components in the tank body 10 such as wafers and rotating members, which may damage the stability of the flow field in the tank body 10 and interfere with the effect of wafer brushing. Figure 3 As shown, the spraying direction of the cleaning member 40 is matched with the rotation direction of the wafer W to be cleaned. In other words, the spraying direction of the cleaning member 40 inside the tank body 10 needs to be adapted to the rotation direction of the wafer W. The spraying directions of the cleaning member 40 configured for wafers W rotating clockwise and counterclockwise are different. Such a setting is to avoid or control the negative impact of the fluid sprayed by the newly added cleaning member 40 on wafer cleaning, reduce wafer brushing defects, especially reduce "special map" defects in the wafer edge region, and ensure a good cleaning effect.

[0056] Figure 3In the illustrated embodiment, the ejection direction of the cleaning member 40 needs to be consistent with the rotation direction of the rotating member. Specifically, the ejection direction of the cleaning member 40 configured for the first driving wheel 21 is consistent with the rotation direction of the first driving wheel 21. That is, the fluid ejected by the cleaning member 40 should follow the rotation direction of the first driving wheel 21, avoiding the ejection direction of the cleaning member 40 being opposite to the rotation direction of the first driving wheel 21, so that the fluid ejected by the cleaning member 40 directly collides with the outer peripheral surface of the first driving wheel 21, resulting in the ejected fluid splashing onto the wafer surface. Figure 3 A similar setting method is adopted for the ejection directions corresponding to the cleaning members 40 configured for the second driving wheel 22 and the speed measuring wheel 23 in

[0057] Since the ejected fluid will strip the particulate matter adhering to the outer peripheral surface of the first driving wheel 21, these particulate matters may splash again and stick back to the wafer surface. To solve this problem, the ejection direction of the cleaning member 40 should be away from the area where the wafer to be cleaned is located. Specifically, the straight line formed by the cleaning member 40 along the ejection direction should not intersect with the area where the wafer W to be cleaned is located, so as to avoid the particulate matter stripped by the ejection fluid of the cleaning member 40 from adhering to the wafer surface again.

[0058] Figure 3 In the illustrated embodiment, the straight lines corresponding to the ejection directions of the cleaning members 40 are all located outside the wafer W to be cleaned, so as to reduce or control the influence of the newly added cleaning members 40 on the wafer brushing effect.

[0059] When setting the position of the cleaning member 40, it is also necessary to consider avoiding the problem that the cleaning member 40 directly ejects the area where the rotating member contacts the outer edge of the wafer. This is because there is a relatively high probability of particulate matter accumulation in the area where the outer edge of the wafer contacts the rotating member, and the fluid ejected by the cleaning member 40 may directly strip and disperse the particulate matter and splash it onto the wafer surface again.

[0060] Figure 4 is a schematic diagram of the first driving wheel 21 and the cleaning member 40 configured therefor according to an embodiment of the present invention. In this embodiment, the cleaning member 40 ejects fluid toward the center of the first driving wheel 21. Specifically, the cleaning member 40 ejects fluid toward the center of the gasket 20a. Such a setting can avoid the cleaning member 40 directly ejecting fluid toward the contact portion between the first driving wheel 21 and the outer edge of the wafer, control the splashing direction and area of the particulate matter stripped from the first driving wheel 21, so as not to interfere with the flow field in the tank 10 and ensure the brushing effect of the wafer.

[0061] Figure 5 is Figure 4In a variation of the corresponding embodiment, in this embodiment, the cleaning member 40 sprays fluid toward the area below the center of the first driving wheel 21. That is, the sprayed fluid of the cleaning member 40 is further away from the contact point between the first driving wheel 21 and the outer edge of the wafer, so as to prevent the abrasions and / or residues accumulated on the first driving wheel 21 from being splashed onto the wafer surface and causing secondary contamination.

[0062] Figure 6 Schematic diagram of the first driving wheel 21 and the cleaning member 40 configured therein provided in one embodiment of the present invention. In this embodiment, the fluid spraying direction of the cleaning member 40 passes through the midpoint of the line between the center and the outer edge of the first driving wheel 21, so as to further move away from the contact point between the first driving wheel 21 and the outer edge of the wafer, thereby preventing the particles accumulated on the first driving wheel 21 from being splashed onto the wafer surface again. Specifically, since the outer edge of the wafer is in direct contact with the gasket 20a, Figure 6 In the embodiment, the fluid injection direction of the cleaning member 40 passes through the midpoint of the line between the center of the gasket 20a and the outer edge of the gasket 20a, so that the particles peeled off from the outer peripheral surface of the gasket 20a fall downward, and the peeled particles are mixed with the cleaning liquid and gathered at the bottom of the tank body 10.

[0063] Figure 6 In the embodiment, the cleaning member 40 is arranged toward the lower side, that is, the fluid sprayed can spray the particles toward the bottom of the tank body 10; if the cleaning member 40 is arranged toward the upper side, the fluid sprayed by the cleaning member 40 is sprayed toward the side wall of the tank body 10. The fluid spraying direction of the cleaning member 40 is set to pass through the midpoint of the line between the center of the gasket 20a and the outer edge of the gasket 20a; in this way, the splashback area of ​​the fluid from the side wall of the tank body 10 can be controlled to prevent the cleaning liquid mixed with particles from splashing back to the surface of the wafer or the surface of the support assembly 20 again.

[0064] Understandably, Figures 4 to 6 The arrangement of the cleaning member 40 is described by taking the first driving wheel 21 as an example, which is also applicable to the arrangement of the cleaning member 40 corresponding to the second driving wheel 22 and the speed measuring wheel 23. That is, the cleaning member 40 should spray the fluid toward the center of the rotating member and / or the area below the center of the rotating member to control the diffusion direction and area of ​​the particles and avoid secondary contamination of the wafer by the particles.

[0065] It should be noted that the fluid sprayed by the cleaning member 40 needs to at least partially cover the outer peripheral surface of the gasket 20a of the rotating member so as to promptly remove the particles accumulated on the outer peripheral surface of the gasket 20a, thereby preventing the particles on the gasket 20a from sticking back to the outer edge of the wafer or even spreading to the edge area of ​​the wafer.

[0066] Figure 3FIG. 0 is a schematic view of a wafer cleaning apparatus 2 provided by the present invention. In this embodiment, a cleaning member 40 needs to be configured for each rotating member of the support assembly 20, that is, cleaning members 40 are respectively configured for the first driving wheel 21, the second driving wheel 22, and the speed measuring wheel 23. Moreover, the cleaning member 40 disposed in the tank body 10 is disposed on the same side of the rotating member. This is because the lateral positions where the washers 20a of the first driving wheel 21, the second driving wheel 22, and the speed measuring wheel 23 are located are basically the same. If the cleaning members 40 configured for adjacent rotating members are respectively disposed on different sides of the rotating member, the fluids ejected by the cleaning members 40 configured for adjacent rotating members will collide with each other. This is not conducive to effectively controlling the particulate matter peeled off by the ejected fluid. If the particulate matter causes re-adhesion, the number of particulate matters on the wafer surface will increase, and it is extremely easy to cause "special map" defects in the wafer edge region.

[0067] Figure 3 In FIG. 4, the wafer W to be cleaned rotates clockwise under the drive of the support assembly 20. The cleaning members 40 are all disposed on the left side of the rotating member, that is, the ejection ports of the cleaning members 40 are uniformly oriented to the right. The cleaning member 40 ejects fluid from left to right to timely remove the particulate matter attached to the rotating member and mix it with the cleaning liquid and converge to the bottom of the tank body 10, avoiding the fluids ejected from colliding with each other and affecting the wafer cleaning effect.

[0068] Figure 3 In the embodiment shown in FIG. 8, the ejection angle θ1 of the cleaning member 40 configured for the first driving wheel 21 is 40°, the ejection angle θ2 of the cleaning member 40 configured for the second driving wheel 22 is -45°, and the ejection angle θ3 of the cleaning member 40 configured for the speed measuring wheel 23 located in the middle position is 30°. Among them, the ejection angle is the angle between the axis of the cleaning member 40 and the horizontal connection line between the centers of the first driving wheel 21 and the second driving wheel 22. The positive and negative of the ejection angle are related to the ejection direction of the cleaning member 40. If the cleaning member 40 ejects fluid from top to bottom, the ejection angle is positive; if the cleaning member ejects fluid from bottom to top, the ejection angle is negative.

[0069] In the present invention, the ejection angle of the cleaning member 40 corresponding to the first driving wheel 21 is -60 to 60°, the ejection angle of the cleaning member 40 corresponding to the second driving wheel 22 is -30 to 80°, and the ejection angle of the cleaning member 40 corresponding to the speed measuring wheel 23 is -30 to 30°, so as to eject fluid toward the outer peripheral surface of the washer 20a of the rotating member and clean the particulate matter accumulated on the outer peripheral area.

[0070] Figure 7FIG. 0 is a schematic diagram of a wafer cleaning device 2 provided by an embodiment of the present invention. Driven by a support assembly 20, a wafer W to be cleaned rotates counterclockwise. The injection angle of a cleaning member 40 configured on a first driving wheel 21 is -40°, the injection angle of the cleaning member 40 configured on a second driving wheel 22 is 45°, and the injection angle of the cleaning member 40 configured on a tachometer wheel 23 located at an intermediate position is 30°. By comparing Figure 3 and Figure 7 it can be seen that when the rotation direction of the wafer is opposite, only by mirroring the original injection direction of the cleaning member 40 along a vertical line passing through the center of the rotating member, the corresponding injection direction and angle of the cleaning member 40 when the rotation direction of the wafer is opposite can be obtained.

[0071] Figure 8 FIG. 8 is a schematic diagram of a wafer cleaning device 2 provided by an embodiment of the present invention. In this embodiment, a wafer W to be cleaned rotates clockwise driven by a support assembly 20. Among them, the injection angle θ1 of the cleaning member 40 configured on the first driving wheel 21 is -45°, the injection angle θ2 of the cleaning member 40 configured on the second driving wheel 22 is -30°, and the injection angle θ3 of the cleaning member 40 configured on the tachometer wheel 23 located at an intermediate position is -60°. That is, the cleaning member 40 injects fluid from bottom to top to clean the particulate matter attached to the rotating member.

[0072] Figure 3 In the embodiment shown, the cleaning member 40 is a spray pipe, and the spray pipe sprays a cleaning liquid towards a gasket 20a of the rotating member to clean the particulate matter attached to the outer peripheral surface of the gasket 20a. The outer diameter of the continuous water column formed by the cleaning member 40 should match Figure 2 the width of the gap 21a shown to prevent the continuous water column from spraying towards the front end cover and / or the rear end cover of the rotating member and aggravating the sputtering of particulate matter.

[0073] As an aspect of this embodiment, the outer diameter of the continuous water column formed by the fluid injected by the cleaning member 40 is 60% to 80% of the width of the gap 21a. Such a setting not only ensures the cleaning of the outer peripheral surface of the gasket 20a but also avoids the sputtering of particulate matter caused by the fluid spraying onto the front end cover and / or the rear end cover of the rotating member.

[0074] It can be understood that the cleaning member 40 can also be a nozzle, such as a columnar nozzle, so that the fluid injected by the cleaning member 40 flushes the particulate matter attached to the outer peripheral surface of the gasket 20a through the gap 21a.

[0075] Figure 4In order to ensure the spraying effect of the cleaning member 40, the distance L between the spraying port of the cleaning member 40 and the landing point of the spraying fluid is 3 to 50 mm. Preferably, the distance between the spraying port of the cleaning member 40 and the landing point of the spraying fluid is 5 to 25 mm. It can be understood that in some embodiments, a position adjusting mechanism needs to be configured for the cleaning member 40 to flexibly change the setting position of the cleaning member 40 and adjust and control the cleaning ability of the cleaning member 40 for the particulate matter on the support assembly 20.

[0076] The setting position of the cleaning member 40 is related to the flushing effect of the rotating member. If the distance between the cleaning member 40 and the corresponding landing point of the rotating member is relatively close, it will cause severe back-splashing, which will in turn affect the cleaning effect of the wafer edge area. In addition, the setting position of the cleaning member 40 is related to factors such as the spraying direction and whether it is close to the inner wall of the tank body 10. Therefore, when setting the setting position of the cleaning member 40, it is necessary to balance the influencing factors such as the flushing effect and fluid back-splashing, and set a reasonable position for the cleaning member 40.

[0077] Furthermore, in order to enhance the angle adjustment ability of the cleaning member 40 relative to the horizontal plane, a cleaning member angle adjustment device needs to be configured inside or outside the tank body 10 to flexibly and accurately adjust the spraying angle of the cleaning member 40. In some embodiments, the end of the cleaning member 40 can be made of a flexible material to flexibly and efficiently adjust the spraying direction of the cleaning member 40, which is applicable to different wafer cleaning processes.

[0078] Figure 3 In the illustrated embodiment, in order to ensure the flushing effect of the abrasives or residues on the support assembly 20 in the wafer cleaning device, the spraying flow rate of the cleaning member 40 is 200 to 2000 mL / min. Preferably, the spraying flow rate of the cleaning member 40 is 500 to 1500 mL / min.

[0079] It should be noted that the spraying flow rate of the cleaning member 40 is related to its setting position. Figure 3 In the lower part of the tank body 10, a liquid discharge port 10a is provided to timely discharge the fluid collected at the bottom of the tank body 10.

[0080] Specifically, the first driving wheel 21 is relatively close to the liquid discharge port 10a, and the cleaning member 40 configured for the first driving wheel 21 is arranged downward; in this case, the flow rate of the cleaning member 40 of the first driving wheel 21 can be set within the range of the midline and above of the spraying flow rate, such as 1200 - 1800 mL / min. Correspondingly, the cleaning member 40 configured for the second driving wheel 22 is arranged obliquely upward, and the cleaning member 40 is close to the inner side wall of the tank body 10; in order to prevent the fluid sprayed onto the inner side wall of the tank body 10 from splashing back onto the wafer surface, it is necessary to precisely control the spraying angle of the cleaning member 40, and it is also necessary to pay attention to the radiation area of the fluid splashing back from the inner side wall of the tank body 10; in this case, the flow rate of the cleaning member 40 of the second driving wheel 22 can be set within the range of the midline and below of the spraying flow rate, such as 600 - 1000 mL / min.

[0081] Figure 9 FIG. 4 is a schematic diagram of a wafer cleaning device 3 provided by an embodiment of the present invention. In this embodiment, a cleaning brush 30 (not shown) is arranged inside the tank body 10, and a cleaning member 40 is configured for the support assembly 20. The wafer cleaning device 3 further includes a rinsing member 50, and the rinsing member 50 is used to rinse the edge area of the wafer to improve the brushing effect of the wafer.

[0082] Further, the rinsing members 50 are arranged on both sides of the wafer, and the rinsing members 50 are arranged in an interleaved manner to spray fluid toward the edge area of the wafer, strengthen the cleaning of the edge area of the wafer, and reduce the influence of abrasives and / or residues on the support assembly 20 on the wafer cleaning effect. Further, the rinsing member 50 arranged on the left side of the wafer sprays fluid toward the edge of the wafer on the right side to wash the possible particles toward the outside of the wafer; similarly, the rinsing member 50 arranged on the right side of the wafer sprays fluid toward the edge of the wafer on the left side to wash the possible particles toward the outside of the wafer.

[0083] It can be understood that the rinsing member 50 also needs to avoid interference with the cleaning brushes 30 arranged on both sides of the wafer; specifically, the setting position of the rinsing member 50 is slightly lower than Figure 1 the position of the cleaning brush 30 shown.

[0084] Figure 9 In the embodiment shown, a rinsing member 50 is configured inside the wafer cleaning device 3, and the fluids sprayed by the rinsing members 50 are interleaved in space without crossing each other to avoid splashing due to the collision of water flows, so as to maintain the relative stability of the flow field in the tank body 10 and improve the cleaning effect of the wafer.

[0085] Figure 9In [the above], the fluid drop point of the flushing member 50 is located in the area below the center of the wafer to be cleaned, so as to timely remove the particulate matter sputtered onto the wafer edge area again, and avoid the further spread of the particulate matter on the surface of the rotating wafer. Preferably, the fluid drop point of the flushing member 50 is arranged adjacent to the first driving wheel 21 and the second driving wheel 22, and the drop point of the fluid ejected by the flushing member 50 is located on the upper side of the first driving wheel 21 and the second driving wheel 22, so as to efficiently remove the particulate matter secondarily attached to the wafer edge area and ensure the cleaning effect of the wafer.

[0086] In some embodiments, the vertical distance between the fluid drop point of the flushing member 50 and the horizontal diameter passing through the center of the wafer is 10 - 15 mm, and the flow rate of the fluid ejected by the flushing member 50 is 500 - 1500 mL / min, so as to remove the particulate matter in the wafer edge area ( Figure 9 the shaded part in [the figure]) from the inside to the outside. Specifically, the ejected water flow pushes the particulate matter from the inside to the outside under the action of centrifugal force until the particulate matter is far away from the wafer surface.

[0087] Furthermore, the distance between the fluid drop point of the flushing member 50 and the outer edge of the wafer should be less than or equal to 50 mm, as Figure 9 shown. Since in the above area, the probability of particulate matter splashing back or reattaching is relatively high, therefore, it is necessary to configure the flushing member 50 to conduct centralized flushing and cleaning.

[0088] Figure 9 In the described embodiment, the number of the flushing members 50 is a pair. It can be understood that the number of the flushing members 50 can also be other numbers, as long as the installation positions of the tank body 10, the cleaning brush 30, the cleaning member 40 and the flushing member 50 are relatively reasonable.

[0089] As Figure 9 a variant of the embodiment, when the quality requirement for the surface of the wafer after cleaning is not high, the wafer cleaning device 3 may not configure the corresponding cleaning member 40 for the support assembly 20, but only configure at least a pair of flushing members 50 on both sides of the wafer, so as to timely flush the particulate matter secondarily sputtered onto the wafer edge area, reduce the "special map" defect, and ensure the cleaning effect of the wafer.

[0090] In summary, the present invention provides a wafer cleaning device for vertically brushing the wafer. The cleaning member 40 and / or the flushing member 50 are configured for the support assembly 20 inside the tank body 10. The cleaning member 40 can timely remove the particulate matter accumulated on the rotating parts of the support assembly 20, so as to avoid or reduce the influence of the particulate matter on the cleaning effect of the wafer. The flushing member 50 further removes the particulate matter splashed back to the wafer edge area, controls the "special map" defect in the wafer edge area, and ensures the cleaning effect of the wafer.

[0091] It should be noted that the cleaning member 40 and / or the rinsing member 50 described in the present invention can also be applied to a horizontal cleaning device for wafers. For example, a cleaning member 40 is configured for a rotating member that drives the wafer to rotate horizontally to remove particulate matter on the outer peripheral surface corresponding to the contact area between the outer edge of the wafer and the rotating member, so as to avoid secondary pollution caused by the particulate matter; for another example, a rinsing member 50 is specifically configured for the edge area of the wafer to strengthen the cleaning of the edge area of the wafer and ensure the cleaning effect of the wafer.

[0092] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0093] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer cleaning device, characterized in that, it includes: a tank body; a support assembly, located in the tank body, which is a rotating member for vertically supporting and driving the wafer to be cleaned to rotate; the rotating member is a roller structure, which includes a disc-shaped front end cover and a rear end cover, and the two are concentrically assembled to form a gap for defining the wafer to be cleaned. A washer is concentrically arranged in the gap, and the outer edge of the wafer to be cleaned abuts against the washer; a cleaning brush, horizontally arranged and rolling around its axis; a cleaning member, located in the tank body, for spraying fluid towards the rotating member to remove particulate matter accumulated on the rotating member; the spraying direction of the cleaning member matches the rotation direction of the wafer to be cleaned and is away from the area where the wafer is located; the cleaning member sprays fluid towards the gap and the outer peripheral surface of the washer; the cleaning member sprays fluid towards the area below the center of the rotating member, and the sprayed fluid at least partially covers the outer peripheral surface corresponding to the contact area between the rotating member and the outer edge of the wafer; at least a pair of flushing members, which are arranged on both sides of the wafer and spray fluid towards the edge area of the wafer in an alternating manner; the fluid landing point of the flushing member is located in the area below the center of the wafer to be cleaned, and the distance from the outer edge of the wafer is less than or equal to 50 mm.

2. The wafer cleaning device according to claim 1, characterized in that, the spraying direction of the cleaning member is consistent with the rotation direction of the rotating member.

3. The wafer cleaning device according to claim 1, characterized in that, the spraying direction of the cleaning member passes through the midpoint of the line connecting the center and the outer edge of the rotating member.

4. The wafer cleaning device according to claim 1, characterized in that, the cleaning member is arranged on the same side of the rotating member.

5. The wafer cleaning device according to claim 1, characterized in that, the rotating member includes a first driving wheel, a second driving wheel and a speed measuring wheel located between the two. The spraying angle of the first driving wheel corresponding to the cleaning member is -60~60°, the spraying angle of the second driving wheel corresponding to the cleaning member is -30~80°, and the spraying angle of the speed measuring wheel corresponding to the cleaning member is -30~30°.

6. The wafer cleaning device according to claim 1, characterized in that, the cleaning member is a spray pipe and / or a nozzle, and the distance between its spraying port and the fluid landing point is 3~50 mm.

7. The wafer cleaning device according to claim 6, characterized in that, the setting position and / or the setting angle of the cleaning member relative to the horizontal plane are adjustable.

8. The wafer cleaning device according to claim 1, characterized in that, the spraying flow rate of the cleaning member is 200~2000 mL / min.

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