A welding head structure and crystal bonding equipment

Abstract

The present invention relates to the field of crystal bonding technology, and discloses a welding head structure and crystal bonding equipment, comprising a first mounting frame, a rotating shaft rotatably connected to the first mounting frame, a crystal bonding arm fixedly connected to the rotating shaft, a suction head disposed at one end of the crystal bonding arm away from the rotating shaft for sucking wafers, and an air pipe connected to the suction head; the rotating shaft is provided with a through hole, the center line of the through hole coincides with the center line of the rotating shaft; the crystal bonding arm is further provided with a fixing column, the fixing column is provided with an air pipe fixing hole; the air pipe fixing hole is arranged at an angle, with one end of the air pipe fixing hole opening toward the rotating shaft and the other end opening toward the crystal bonding arm; the air pipe sequentially passes through the air pipe fixing hole and the through hole and is connected to the suction head; the air pipe on the crystal bonding arm is fixed to the crystal bonding arm. The welding head structure and crystal bonding equipment can effectively increase the service life of the air pipe and improve the crystal bonding accuracy to a certain extent.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal bonding, and in particular to a welding head structure and crystal bonding equipment. Background Art

[0002] In the current bonding head structure of the die bonding equipment, the adsorption head on the die bonding arm is ventilated through an air pipe so that the adsorption head can complete the absorption or placement of the wafer, thereby completing the die bonding process.

[0003] In current welding head structures, the air pipe is often mounted in the air. During the rotation of the die bonding arm, the air pipe may rub against the die bonding arm or other components of the welding head structure, causing greater wear and tear on the air pipe and making it susceptible to damage. In addition, during the rotation of the die bonding arm, the air pipe vibrates significantly, affecting the accuracy of the die bonding arm in picking up or placing the wafer, resulting in a decrease in yield.

[0004] In view of this, it is necessary to design a welding head structure and a die bonding structure to improve the die bonding accuracy and help extend the service life of the air pipe. Summary of the Invention

[0005] The object of the present invention is to provide a welding head structure and a die bonding structure, which can effectively improve the die bonding accuracy and help extend the service life of the air pipe.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A welding head structure includes a first mounting frame, a rotating shaft rotatably connected to the first mounting frame, a crystal bonding arm fixedly connected to the rotating shaft, a suction head disposed at an end of the crystal bonding arm away from the rotating shaft for sucking a wafer, and an air pipe connected to the suction head;

[0008] The rotating shaft is provided with a through hole, the center line of which coincides with the center line of the rotating shaft; the die bonding arm is further provided with a fixing post, the fixing post being provided with an air pipe fixing hole; the air pipe fixing hole is arranged obliquely, with one end of the air pipe fixing hole opening toward the rotating shaft and the other end opening toward the die bonding arm; the air pipe passes through the air pipe fixing hole and the through hole in sequence and is connected to the adsorption head;

[0009] The air pipe on the crystal fixing arm is fixed on the crystal fixing arm.

[0010] Optionally, the air tube on the die-bonding arm is bundled and fixed on the die-bonding arm.

[0011] Optionally, the bonding head structure further includes a second mounting frame, a rotating device for driving the bonding arm to rotate around the rotating axis, and a lifting device for driving the bonding arm to move up and down.

[0012] Optionally, the second mounting frame includes a first fixing plate and a second fixing plate fixedly connected to the first fixing plate;

[0013] The rotating device is mounted on the first fixed plate, the rotating shaft of the rotating device is coaxial with the rotation axis, and a connecting piece connected to the die-bonding arm is provided on the rotating shaft;

[0014] The lifting device includes a driving motor installed on the second fixed plate and a cam installed on the output shaft of the driving motor; a first slide rail is provided on the second mounting frame, and the first mounting frame is slidably mounted on the first slide rail. The driving motor drives the cam to rotate to drive the first mounting frame to move along the first slide rail.

[0015] Optionally, the die-bonding arm includes a first arm portion and a second arm portion connected to the first arm portion, and the second arm portion is mounted on the rotating shaft;

[0016] The second arm portion is provided with an elastic piece, and the first arm portion is fixedly connected to the elastic piece.

[0017] Optionally, a bent clamping arm is provided at one end of the crystal fixing arm away from the rotating shaft, the first end of the clamping arm is fixedly connected to the first arm, the second end is bent and close to the first end to form a fixing hole for fixing the adsorption head, and a fastener for fixing the second end to the first end is detachably installed on the first end.

[0018] Optionally, the air pipe passes through the through hole from bottom to top.

[0019] Optionally, the rotating device is a servo motor.

[0020] Optionally, the lifting device is a servo motor.

[0021] A die bonding device comprises the bonding head structure as described in any one of the above items.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] In this embodiment, the air pipe passes through the through hole to supply air to the adsorption head. During the rotation of the crystal bonding arm, the air pipe will not be affected by the rear section of the pipe after the through hole. The swing amplitude of the air pipe is smaller, which can effectively reduce the impact on the crystal bonding arm and is beneficial to improving the processing accuracy of the crystal bonding arm; the swing amplitude of the air pipe is smaller, and the degree of friction generated by the air pipe and the welding head structure is also effectively reduced, which is beneficial to extending the service life of the air pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the efficacy and objectives that can be achieved by the present invention.

[0026] Figure 1 A schematic diagram of the three-dimensional structure of a welding head structure provided by an embodiment of the present invention;

[0027] Figure 2 for Figure 1 A magnified schematic diagram of position A in the middle;

[0028] Figure 3 A right side view of the welding head structure provided by an embodiment of the present invention;

[0029] Figure 4 A left side view of the welding head structure provided by an embodiment of the present invention;

[0030] Figure 5 A front view of a welding head structure provided by an embodiment of the present invention;

[0031] Figure 6 for Figure 5 Schematic diagram of the AA cross-section structure in.

[0032] Illustrations: 1. First mounting bracket; 2. Rotating axis; 21. Through-hole; 3. Crystal fixing arm; 301. Clamping arm; 31. Fixing column; 32. Air pipe fixing hole; 33. First arm; 34. Second arm; 4. Adsorption head; 5. Air pipe; 6. Second mounting bracket; 7. Rotating device; 8. Lifting device; 61. First fixing plate; 62. Second fixing plate; 71. Connecting piece; 81. First slide rail; 35. Shrapnel. DETAILED DESCRIPTION

[0033] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0035] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0036] Example 1

[0037] The present invention provides a bonding head structure with a clever structural design. After passing through a through hole 21 of a rotating shaft 2, an air pipe 5 supplies compressed air to a suction head 4 on a die bonding arm 3, enabling the suction head to absorb wafers, chips, and the like. Through hole 21 and air pipe fixing holes 32 effectively limit the swing of air pipe 5, effectively reducing its swing and preventing excessive swing from affecting the actual die bonding accuracy. Furthermore, the structure effectively reduces friction between air pipe 5 and other components, extending its service life.

[0038] See also Figures 1 to 5 The welding head structure includes a first mounting frame 1, a rotating shaft 2 rotatably connected to the first mounting frame 1, a crystal bonding arm 3 fixedly connected to the rotating shaft 2, and an air pipe 5 connected to the adsorption head 4;

[0039] An adsorption head 4 for adsorbing the wafer is provided at one end of the crystal bonding arm 3 away from the rotating shaft 2;

[0040] The rotating shaft 2 is provided with a through hole 21, the center line of which coincides with the center line of the rotating shaft 2. The die bonding arm 3 is also provided with a fixing post 31, and the fixing post 31 is provided with an air pipe fixing hole 32. The air pipe fixing hole 32 is arranged at an angle, with one end of the air pipe fixing hole 32 opening toward the rotating shaft 2 and the other end opening toward the die bonding arm 3. The air pipe 5 passes through the air pipe fixing hole 32 and the through hole 21 in sequence and is then connected to the adsorption head 4.

[0041] The air pipe 5 on the die-bonding arm is fixed on the die-bonding arm.

[0042] Specifically, through a clever structural design, the centerline of the trachea 5 is aligned with the axis of the through-hole 21, and the trachea 5 passes through the trachea fixing hole 32. As the die-bonding arm 3 rotates about the rotation axis 2, the section of the trachea 5 located at the rear end of the through-hole 21 does not swing. This effectively prevents excessive vibration of the trachea 5 during the die-bonding process, improves the stability of the die-bonding arm, and thus effectively enhances die-bonding accuracy. The provision of the trachea fixing hole 32 further reduces the degree of swing of the trachea 5 during operation, further improving die-bonding accuracy.

[0043] In addition, the trachea 5 will not be pulled and swing too much, thereby effectively reducing the friction between the trachea 5 and other components, thereby effectively extending the service life of the trachea 5.

[0044] Optionally, the air tube 5 is bundled and fixed on the die-bonding arm 3 , which further reduces the swing of the air tube 5 and improves the die-bonding accuracy.

[0045] Specifically, a trachea fixing hole 32 is provided on the fixed column 31. The section of trachea 5 between the fixed column 31 and the rotating shaft 2 rotates with the die-bonding arm 3, effectively reducing the swing effect of this section of the pipeline and further preventing excessive pipeline swing. It is worth noting that the rotation angle of the trachea 5 section between the fixed column 31 and the rotating shaft 2 is the same as the rotation angle of the die-bonding arm 3.

[0046] Optionally, the welding head structure further includes a second mounting frame 6 , a rotating device 7 for driving the crystal bonding arm 3 to rotate around the rotating shaft 2 , and a lifting device 8 for driving the crystal bonding arm 3 to move up and down.

[0047] Specifically, the rotating device 7 drives the bonding arm 3 to pick up the wafer at different positions. The lifting device 8 drives the bonding arm 3 to rise and fall in the vertical direction to meet the needs of bonding the wafer and avoid collision between the product and the bonding arm 3.

[0048] Optionally, the second mounting bracket 6 includes a first fixing plate 61 and a second fixing plate 62 fixedly connected to the first fixing plate 61;

[0049] The rotating device 7 is mounted on the first fixed plate 61. The rotating shaft of the rotating device 7 is coaxial with the rotating shaft 2. A connecting piece 71 connected to the crystal bonding arm 3 is provided on the rotating shaft.

[0050] The lifting device 8 includes a driving motor installed on the second fixed plate 62 and a cam installed on the output shaft of the driving motor; a first slide rail 81 is provided on the second mounting frame 6, and the first mounting frame 1 is slidably installed on the first slide rail 81. The driving motor drives the cam to rotate to drive the first mounting frame 1 to move on the first slide rail 81.

[0051] Specifically, the rotation axis of the rotating device 7 rotates, driving the connecting member 71 to rotate. The rotation of the connecting member 71 drives the die-bonding arm 3 to rotate about the rotation axis 2, thereby achieving the purpose of controlling the rotation angle of the die-bonding arm 3. In addition, the drive motor drives the cam to rotate, causing the second mounting bracket 6 to rise and fall along the first slide rail 81, thereby controlling the height of the first mounting bracket 1.

[0052] Optionally, the die-fixing arm 3 includes a first arm portion 33 and a second arm portion 34 connected to the first arm portion 33 , and the second arm portion 34 is mounted on the rotating shaft 2 ;

[0053] A spring piece 35 is mounted on the second arm portion 34 , and the first arm portion 33 is fixedly connected to the spring piece 35 .

[0054] Specifically, during die bonding, the adsorption head 4 is pressed to a set position by the elastic force of the spring, thereby attaching the wafer to the set position of the workpiece.

[0055] Optionally, a curved clamping arm 301 is provided at one end of the crystal bonding arm 3, distal from the rotation axis 2. The first end of the clamping arm 301 is fixedly connected to the first arm 33, and the second end is bent and positioned adjacent to the first end to form a fixing hole for securing the adsorption head 4. A fastener for securing the second end to the first end is detachably mounted on the first end. Specifically, within the fixing hole of the adsorption head 4, the second end approaches the first end under the action of the fastener, thereby clamping the adsorption head 4. It should also be noted that the clamping arm 301 has a certain degree of elasticity, allowing the second end to be pressed against the first end by the fastener, thereby clamping the adsorption head 4.

[0056] Optionally, the air pipe 5 passes through the through hole 21 from bottom to top. It is worth noting that the height of the rear section air pipe 5 is lower, which is convenient for installation.

[0057] Optionally, the diameter of the through hole 21 is the same as the diameter of the trachea 5 , or the diameter of the through hole 21 is slightly larger than the diameter of the trachea 5 .

[0058] Optionally, the rotating device 7 is a servo motor to precisely control the rotation angle of the die-bonding arm 3. In this embodiment, the maximum rotation range of the die-bonding arm 3 is 180°. Optionally, the lifting device 8 is a cylinder.

[0059] Example 2

[0060] In this embodiment, a die bonding device is disclosed, which includes the bonding head structure of embodiment 1. The die bonding device may also include other necessary components such as a feeding robot, a die bonding platform, and a blanking robot.

[0061] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0062] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

[0063] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A welding head structure, characterized in that: It comprises a first mounting frame (1), a rotating shaft (2) rotatably connected to the first mounting frame (1), a crystal fixing arm (3) fixedly connected to the rotating shaft (2), an adsorption head (4) arranged at one end of the crystal fixing arm (3) away from the rotating shaft (2) for adsorbing a wafer, and an air pipe (5) connected to the adsorption head (4); The rotating shaft (2) is provided with a through hole (21), and the center line of the through hole (21) coincides with the center line of the rotating shaft (2); the crystal fixing arm (3) is further provided with a fixing column (31), and the fixing column (31) is provided with an air pipe fixing hole (32); the air pipe fixing hole (32) is arranged at an angle, and one end of the air pipe fixing hole (32) opens toward the rotating shaft (2), and the other end opens toward the crystal fixing arm (3); the air pipe (5) passes through the through hole (21) and the air pipe fixing hole (32) in sequence and is connected to the adsorption head (4); The air pipe (5) on the crystal fixing arm is fixed on the crystal fixing arm; The welding head structure further includes a second mounting frame (6), a rotating device (7) for driving the crystal-fixing arm (3) to rotate around the rotating shaft (2), and a lifting device (8) for driving the crystal-fixing arm (3) to move up and down; The second mounting frame (6) comprises a first fixing plate (61) and a second fixing plate (62) fixedly connected to the first fixing plate (61); The rotating device (7) is mounted on the first fixed plate (61), the rotating shaft of the rotating device (7) is coaxial with the rotating shaft (2), and a connecting piece (71) connected to the crystal fixing arm (3) is provided on the rotating shaft; the diameter of the through hole (21) is the same as the diameter of the air pipe (5).

2. The welding head structure according to claim 1, characterized in that: The air pipe (5) on the crystal fixing arm is bundled and fixed on the crystal fixing arm.

3. The welding head structure according to claim 1, characterized in that: The lifting device (8) includes a driving motor mounted on the second fixing plate (62) and a cam mounted on the output shaft of the driving motor; a first slide rail (81) is provided on the second mounting frame (6), and the first mounting frame (1) is slidably mounted on the first slide rail (81); the driving motor drives the cam to rotate to drive the first mounting frame (1) to move along the first slide rail (81).

4. The welding head structure according to claim 1, characterized in that: The crystal fixing arm (3) comprises a first arm portion (33) and a second arm portion (34) connected to the first arm portion (33), and the second arm portion (34) is mounted on the rotating shaft (2); A spring piece (35) is mounted on the second arm portion (34), and the first arm portion (33) is fixedly connected to the spring piece (35).

5. The welding head structure according to claim 4, characterized in that: A bent clamping arm (301) is provided at one end of the crystal fixing arm (3) away from the rotating shaft (2), a first end of the clamping arm (301) is fixedly connected to the first arm (33), a second end is bent and close to the first end to form a fixing hole for fixing the adsorption head (4), and a fastener for fixing the second end to the first end is detachably mounted on the first end.

6. The welding head structure according to claim 1, characterized in that: The air pipe (5) passes through the through hole (21) from bottom to top.

7. The welding head structure according to claim 1, characterized in that: The rotating device (7) is a servo motor.

8. The welding head structure according to claim 1, characterized in that: The lifting device (8) is a servo motor.

9. A die bonding device, characterized in that: The invention comprises a welding head structure as claimed in any one of claims 1 to 8.

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