A bracket, a light-emitting device, and a method for manufacturing the light-emitting device.

Abstract

This invention discloses a support, a light-emitting device, and a method for manufacturing the light-emitting device. The support includes: a first metal support and a second metal support; the first metal support includes at least one negative electrode sub-support and one positive electrode sub-support spaced apart; the negative electrode sub-support includes a negative electrode support layer, and the positive electrode sub-support includes a positive electrode support layer; the second metal support includes at least one data input sub-support, one data output sub-support, one power input sub-support, one power output sub-support, and one signal output sub-support spaced apart; the data input sub-support, data output sub-support, power input sub-support, power output sub-support, and signal output sub-support all include a first signal transmission layer; the negative electrode sub-support is connected to the power output sub-support, and the positive electrode sub-support is connected to the signal output sub-support. The support, light-emitting device, and method for manufacturing the light-emitting device provided in this embodiment can improve the display accuracy of the display device and reduce the manufacturing cost of the display device.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a bracket, a light-emitting device, and a method for manufacturing the light-emitting device. Background Technology

[0002] With the growing popularity of fine-pitch displays, the market demands increasingly higher pixel counts for display products. Existing displays with higher pixel counts require more control chips and associated circuitry on the circuit board housing the light-emitting devices, resulting in a more complex circuit board structure with more layers, thus increasing manufacturing costs. Furthermore, in current displays, the control chip and light-emitting devices are mounted on the same plane of the circuit board. The control chip also occupies a certain area of ​​the circuit board, leading to excessive spacing between the light-emitting devices and a less refined display image. Consequently, the pixel count of the display cannot meet customers' high-precision requirements. Summary of the Invention

[0003] The bracket, light-emitting device, and manufacturing method of the light-emitting device provided in this embodiment can improve the display accuracy of the display device and reduce the manufacturing cost of the display device.

[0004] According to a first aspect of the present invention, a bracket is provided, the bracket comprising: a first metal bracket and a second metal bracket;

[0005] The first metal bracket is located on one side of the second metal bracket;

[0006] The first metal support includes at least one negative pole support and one positive pole support spaced apart;

[0007] The negative electrode support includes a negative electrode support layer, and the positive electrode support includes a positive electrode support layer;

[0008] The second metal bracket includes at least one data input sub-bracket, one data output sub-bracket, one power input sub-bracket, one power output sub-bracket, and one signal output sub-bracket that are spaced apart.

[0009] The data input sub-bracket, the data output sub-bracket, the power input sub-bracket, the power output sub-bracket, and the signal output sub-bracket all include a first signal transmission layer;

[0010] The negative electrode bracket is connected to the power output bracket, and the positive electrode bracket is connected to the signal output bracket.

[0011] Optionally, the negative electrode support also includes a negative electrode support column located on the side of the negative electrode support layer near the second metal support and integrally connected to the negative electrode support layer;

[0012] The positive electrode support also includes a positive electrode support column located on the side of the positive electrode support layer near the second metal support and integrally connected to the positive electrode support layer;

[0013] The negative electrode support column is integrally connected to the first signal transmission layer of the power output sub-bracket;

[0014] The positive electrode support column is integrally connected to the first signal transmission layer of the signal output sub-bracket.

[0015] Optionally, the surface of the negative electrode support layer away from the second metal bracket and the surface of the positive electrode support layer away from the second metal bracket are located on the same plane;

[0016] The surfaces of the negative electrode support layer and the positive electrode support layer away from the second metal bracket are parallel to the surface of the first signal transmission layer away from the first metal bracket.

[0017] Optionally, the data input sub-bracket, the data output sub-bracket, the power input sub-bracket, and the power output sub-bracket all further include signal support pillars and a second signal transmission layer;

[0018] The signal support column is located on the side of the first signal transmission layer away from the first metal bracket;

[0019] The second signal transmission layer is located on the side of the signal support pillar away from the first transmission layer;

[0020] The first signal transmission layer, the signal support column, and the second signal transmission layer in the data input sub-bracket, the data output sub-bracket, the power input sub-bracket, and the power output sub-bracket are all integrally connected and form a stepped structure.

[0021] Optionally, the signal output sub-bracket further includes the signal support column and the second signal transmission layer;

[0022] The first signal transmission layer, the signal support column, and the second signal transmission layer in the signal output sub-bracket are integrally connected and form a stepped structure.

[0023] Optionally, the surfaces of each of the first signal transmission layers that are away from the first metal support are located on the same plane;

[0024] The surfaces of each of the second signal transmission layers that are away from the first metal support are all located on the same plane;

[0025] The surface of the first signal transmission layer away from the first metal support is parallel to the surface of the second signal transmission layer away from the first metal support.

[0026] Optionally, the bracket provided in this embodiment also includes a housing;

[0027] The outer casing encloses the first metal bracket and the second metal bracket, and exposes the surfaces of the negative electrode support layer and the positive electrode support layer away from the second metal bracket, as well as the surfaces of each of the first signal transmission layers and each of the second signal transmission layers away from the first metal bracket.

[0028] Optionally, the outer shell includes a cup-shaped structure and a groove structure;

[0029] The groove structure is located on one side of the cup-shaped structure;

[0030] The cup-shaped structure includes a first bottom layer and an inverted trapezoidal sidewall surrounding and connecting the first bottom layer, the inverted trapezoidal sidewall being located on the side of the first bottom layer away from the groove structure;

[0031] The first bottom layer exposes the surfaces of the negative electrode support layer and the positive electrode support layer away from the second metal bracket;

[0032] The groove structure includes a second bottom layer and an annular sidewall surrounding and connecting the second bottom layer, the annular sidewall being located on the side of the second bottom layer away from the cup-shaped structure;

[0033] The second bottom layer exposes the surface of each of the first signal transmission layers away from the first metal support.

[0034] Optionally, the material of the housing includes at least one of PCT, PPA, and EMC.

[0035] According to a second aspect of the present invention, a light-emitting device is provided, the light-emitting device comprising a bracket provided in any embodiment of the present invention, at least one light-emitting chip, a control chip, a first molding compound and a second molding compound;

[0036] The light-emitting chip is located on the surface of the negative electrode support layer and / or the positive electrode support layer away from the second metal bracket, and the light-emitting chip is connected to the negative electrode support layer and the positive electrode support layer;

[0037] The control chip is located on the surface of any of the first signal transmission layers away from the first metal support, and the control chip is connected to each of the first signal transmission layers;

[0038] The first molding layer encapsulates the light-emitting chip, and the second molding layer encapsulates the control chip.

[0039] According to a second aspect of the present invention, a method for manufacturing the light-emitting device provided in any embodiment of the present invention is provided, the method comprising the following steps:

[0040] A bracket is provided, on which a control chip is disposed on the surface of a first metal bracket away from the bracket in any first signal transmission layer of the bracket, and the control chip is connected to each of the first signal transmission layers;

[0041] A second molding layer is formed, and the control chip is encapsulated by the second molding layer;

[0042] The light-emitting chip is disposed on the surface of a second metal bracket away from the negative electrode support layer and / or the positive electrode support layer of the bracket, and the light-emitting chip is connected to the negative electrode support layer and the positive electrode support layer;

[0043] A first molding layer is formed, and the first molding layer is used to mold the light-emitting chip.

[0044] This embodiment provides a bracket comprising a first metal bracket and a second metal bracket located on one side of the first metal bracket. The first metal bracket includes at least one negative electrode bracket and one positive electrode bracket. Both the negative electrode support layer in the negative electrode bracket and the positive electrode support layer in the positive electrode bracket can support a light-emitting chip. Each first signal transmission layer in the second metal bracket can support a control chip. The control chip is connected to a data input sub-bracket, a data output sub-bracket, a power input sub-bracket, a power output sub-bracket, and a signal output sub-bracket in the second metal bracket. The negative electrode bracket is connected to the power output sub-bracket, and the positive electrode bracket is connected to the signal output sub-bracket. The control chip transmits signals to the light-emitting chip through the signal output sub-bracket and the positive electrode bracket, thereby controlling the light-emitting chip to emit light. The light-emitting chip and the control chip can be located on different planes, which can reduce the spacing between the light-emitting chips, reduce the wiring difficulty and the number of layers on the circuit board, thereby improving the display accuracy of the display device using the bracket provided in this embodiment and reducing the manufacturing cost of the display device. In summary, the bracket provided in this embodiment can improve the display accuracy of the display device and reduce the manufacturing cost of the display device. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figures 1-3 This is a schematic diagram of the structure of a support according to an embodiment of the present invention from different perspectives;

[0047] Figures 4-5 This is a structural schematic diagram of another type of support provided according to an embodiment of the present invention from different perspectives;

[0048] Figures 6-8 This is a schematic diagram of the structure of a light-emitting device under different viewing angles according to an embodiment of the present invention;

[0049] Figure 9 This is a schematic flowchart of a method for manufacturing a light-emitting device according to an embodiment of the present invention. Detailed Implementation

[0050] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0051] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0052] Figures 1-3 This is a schematic diagram of the structure of a bracket provided according to an embodiment of the present invention from different perspectives. Figures 1-3The support provided in this embodiment includes: a first metal support 100 and a second metal support 200; the first metal support 100 is located on one side of the second metal support 200; the first metal support 100 includes at least one negative electrode sub-support 110 and one positive electrode sub-support 120 spaced apart; the negative electrode sub-support 110 includes a negative electrode support layer 111, and the positive electrode sub-support 120 includes a positive electrode support layer 121; the second metal support 200 includes at least one data input sub-support 210, one data output sub-support 230, one power input sub-support 220, one power output sub-support 240, and one signal output sub-support 250 spaced apart; the data input sub-support 210, data output sub-support 230, power input sub-support 220, power output sub-support 240, and signal output sub-support 250 all include a first signal transmission layer 211; the negative electrode sub-support 110 is connected to the power output sub-support 240, and the positive electrode sub-support 120 is connected to the signal output sub-support 250.

[0053] Specifically, the materials of the first metal support 100 and the second metal support 200 can be copper, gold, or silver. The materials of the first metal support 100 and the second metal support 200 can be the same. When the materials of the first metal support 100 and the second metal support 200 are both copper, a layer of nickel, silver, or gold can be coated on the surface of the first metal support 100 and the second metal support 200 to increase their oxidation resistance.

[0054] Both the negative electrode support layer 111 and the positive electrode support layer 121 in the first metal bracket 100 can support a light-emitting chip. The light-emitting chip has a first electrode and a second electrode, wherein the first electrode can be a negative electrode and the second electrode can be a positive electrode. The first electrode of the light-emitting chip is connected to the negative electrode support layer 111, and the second electrode is connected to the positive electrode support layer 121. Each first signal transmission layer 211 in the second metal bracket 200 can support a control chip. The control chip is connected to each first signal transmission layer 211 and can control the light-emitting chip to emit light.

[0055] The relative positions of the data input sub-bracket 210, data output sub-bracket 230, power input sub-bracket 220, power output sub-bracket 240, and signal output sub-bracket 250 are not fixed. The sub-bracket connected to the signal output pin of the control chip is the signal output sub-bracket 250, the sub-bracket connected to the data input pin of the control chip is the data input sub-bracket 210, the sub-bracket connected to the data output pin of the control chip is the data output sub-bracket 230, the sub-bracket connected to the power input pin of the control chip is the power input sub-bracket 220, and the sub-bracket connected to the power output pin of the control chip is the power output sub-bracket 240.

[0056] The first metal bracket 100 may also include multiple negative electrode brackets 110 and multiple positive electrode brackets 120. The second metal bracket 200 may include multiple signal transmission sub-brackets 250 and multiple power output sub-brackets 240. When the control chip controls the light emission of different light-emitting chips, the positive electrode brackets 120 and the signal transmission sub-brackets 250 are connected in a one-to-one correspondence. Different negative electrode brackets 110 may be connected to the same power output sub-bracket 240 or may be connected in a one-to-one correspondence with the power output sub-brackets 240.

[0057] The second metal bracket 200 is located on one side of the first metal bracket 100, which allows the control chip and the light-emitting chip to be placed on different planes. This eliminates the need for a space on the circuit board for the control chip, thereby reducing the spacing between the light-emitting chips and improving the display accuracy of the display device using the bracket provided in this embodiment. Furthermore, having the light-emitting chip and the control chip on different planes reduces the wiring complexity and the number of circuit board layers, thus lowering the manufacturing cost of the circuit board and consequently reducing the manufacturing cost of the display device.

[0058] It should be noted that the embodiment provided in this example Figures 1-3 The relative positional relationship between the data input sub-bracket 210, data output sub-bracket 230, power input sub-bracket 220, power output sub-bracket 240 and signal output sub-bracket 250 is merely illustrative and is not intended to limit the invention. In practical applications, specific relative positional relationships can be set according to actual needs.

[0059] This embodiment provides a bracket comprising a first metal bracket and a second metal bracket located on one side of the first metal bracket. The first metal bracket includes at least one negative electrode bracket and one positive electrode bracket. Both the negative electrode support layer in the negative electrode bracket and the positive electrode support layer in the positive electrode bracket can support a light-emitting chip. Each first signal transmission layer in the second metal bracket can support a control chip. The control chip is connected to a data input sub-bracket, a data output sub-bracket, a power input sub-bracket, a power output sub-bracket, and a signal output sub-bracket in the second metal bracket. The negative electrode bracket is connected to the power output sub-bracket, and the positive electrode bracket is connected to the signal output sub-bracket. The control chip transmits signals to the light-emitting chip through the signal output sub-bracket and the positive electrode bracket, thereby controlling the light-emitting chip to emit light. The light-emitting chip and the control chip can be located on different planes, which can reduce the spacing between the light-emitting chips, reduce the wiring difficulty and the number of layers on the circuit board, thereby improving the display accuracy of the display device using the bracket provided in this embodiment and reducing the manufacturing cost of the display device. In summary, the bracket provided in this embodiment can improve the display accuracy of the display device and reduce the manufacturing cost of the display device.

[0060] Optional, continue to refer to Figures 1-3The negative electrode support 110 also includes a negative electrode support column 112 located on the side of the negative electrode support layer 111 near the second metal support 200 and integrally connected to the negative electrode support layer 111; the positive electrode support 120 also includes a positive electrode support column 122 located on the side of the positive electrode support layer 121 near the second metal support 200 and integrally connected to the positive electrode support layer 121; the negative electrode support column 112 is integrally connected to the first signal transmission layer 211 of the power output sub-support 240; the positive electrode support column 122 is integrally connected to the first signal transmission layer 211 in the signal output sub-support 250.

[0061] Specifically, the negative electrode support post 112 and the positive electrode support post 122 allow for a certain distance between the light-emitting chip on the first metal bracket 100 and the control chip on the second metal bracket 200, thereby facilitating heat dissipation for both the light-emitting chip and the control chip. The integral connection between the negative electrode support post 112 and the negative electrode support layer 111 improves the stability of their connection. Similarly, the integral connection between the positive electrode support post 122 and the positive electrode support layer 121, the integral connection between the negative electrode support post 112 and the first signal transmission layer 211 in the power output sub-bracket 240, and the integral connection between the positive electrode support post 122 and the first signal transmission layer 211 in the signal output sub-bracket 250 all improve connection stability.

[0062] Optional, continue to refer to Figures 1-3 The surfaces of the negative electrode support layer 111 and the positive electrode support layer 121 that are away from the second metal support 200 are located on the same plane; the surfaces of the negative electrode support layer 11 and the positive electrode support layer 121 that are away from the second metal support 200 are parallel to the surface of the first signal transmission layer 211 that is away from the first metal support 100.

[0063] Specifically, the surfaces of the negative electrode support layer 111 and the positive electrode support layer 121 that are away from the second metal support layer 200 are located on the same plane. This facilitates the connection between the light-emitting chip and the negative electrode support layer 111 and the positive electrode support layer 121, and also ensures that the light-emitting chips on the negative electrode support layer 111 and the positive electrode support layer 121 are on the same plane, thus allowing the light emitted by the light-emitting chips to exit onto the same plane. To ensure that the surfaces of the negative electrode support layer 111 and the positive electrode support layer 121 that are away from the second metal support layer 200 are on the same plane, the thickness of the negative electrode support layer 111 and the positive electrode support layer 121 can be made equal during fabrication. The surfaces of the negative electrode support layer 111 and the positive electrode support layer 121 that are away from the second metal support layer 200 are parallel to the surface of the first signal transmission layer 211 that is away from the first metal support layer 100, which facilitates the fabrication of the first metal support layer 100 and the second metal support layer 200.

[0064] Optional, continue to refer to Figures 1-3 The data input sub-bracket 210, data output sub-bracket 230, power input sub-bracket 220, and power output sub-bracket 240 all further include a signal support column 212 and a second signal transmission layer 213. The signal support column 212 is located on the side of the first signal transmission layer 211 away from the first metal bracket 100. The second signal transmission layer 213 is located on the side of the signal support column 212 away from the first signal transmission layer 211. The first signal transmission layer 211, the signal support column 212, and the second signal transmission layer 213 in the data input sub-bracket 210, data output sub-bracket 230, power input sub-bracket 220, and power output sub-bracket 240 are all integrally connected and form a stepped structure.

[0065] Specifically, the integrated connection of the first signal transmission layer 211, signal support pillar 212, and second signal transmission layer 213 improves connection stability. The second signal transmission layer 213 in the data input sub-bracket 210, data output sub-bracket 230, power input sub-bracket 220, and power output sub-bracket 240 can serve as a pin for connection to an external driving circuit. The stepped structure formed by the first signal transmission layer 211, signal support pillar 212, and second signal transmission layer 213 allows them to be located on opposite sides of the signal support pillar 212, facilitating connection between the second signal transmission layer 213 and the external driving circuit. Connecting the first signal transmission layer 211 and the second signal transmission layer 213 via the signal support pillar 212 provides a certain distance between them. When the control chip is located on the side of the first signal transmission layer 211 away from the first metal bracket 100, the signal support pillars 212 around the control chip can protect the control chip and prevent it from coming into contact with other devices and rubbing against them, thereby allowing the control chip to be stably fixed on the first signal transmission layer 211.

[0066] Optional, continue to refer to Figures 1-3 The signal output sub-support 250 also includes a signal support column 212 and a second signal transmission layer 213; the first signal transmission layer 211, the signal support column 212 and the second signal transmission layer 213 of the signal output sub-support 250 are integrally connected and form a stepped structure.

[0067] Specifically, the signal output sub-support 250 includes a signal support pillar 212 and a second signal transmission layer 213. This prevents the first signal transmission layer 211 in the signal output sub-support 250 from being suspended, which is beneficial for the formation of the signal output sub-support 250. It should be noted that the signal output sub-support 250 is used to transmit the drive signal sent by the control chip to the light-emitting chip, and the second signal transmission layer 213 in the signal output sub-support 250 is not connected to the external drive circuit.

[0068] Optional, continue to refer to Figures 1-3 The surfaces of each first signal transmission layer 211 that are away from the first metal support 100 are located on the same plane; the surfaces of each second signal transmission layer 213 that are away from the first metal support 100 are located on the same plane; the surfaces of the first signal transmission layer 211 that are away from the first metal support 100 are parallel to the surfaces of the second signal transmission layer 213 that are away from the first metal support 100.

[0069] Specifically, the surfaces of each first signal transmission layer 211 away from the first metal bracket 100 are located on the same plane, which facilitates the connection between the control chip and each first signal transmission layer 211. Similarly, the surfaces of each second signal transmission layer 213 away from the first metal bracket 100 are located on the same plane, which facilitates the connection between the second signal transmission layer 213 and the external drive circuit. To ensure that the surfaces of the first signal transmission layers 211 and 213 away from the first metal bracket 100 are on the same plane, the thicknesses of the first and second signal transmission layers 211 and 213 can be made equal during fabrication. The surface of the first signal transmission layer 211 away from the first metal bracket 100 is parallel to the surface of the second signal transmission layer 213 away from the first metal bracket 100, further improving the ease of fabrication of the first and second metal brackets 100 and 200.

[0070] Optional, Figures 4-5 This is a schematic diagram of the structure of another support provided according to an embodiment of the present invention from different perspectives. (Refer to...) Figures 4-5 Based on the above embodiments, the bracket provided in this embodiment further includes a housing 300; the housing 300 encloses the first metal bracket 100 and the second metal bracket 200, and exposes the surfaces of the negative electrode support layer 111 and the positive electrode support layer 121 away from the second metal bracket 200 (see reference). Figure 4 ) and the surfaces of each first signal transmission layer 211 and each second signal transmission layer 213 away from the first metal support 100 (reference) Figure 5 ).

[0071] Specifically, the outer casing 300 exposes the surfaces of the negative electrode support layer 111 and the positive electrode support layer 121 away from the second metal bracket 200, facilitating the placement of the light-emitting chip on the surfaces of the negative electrode support layer 111 and the positive electrode support layer 121 away from the second metal bracket 200. The outer casing 300 exposes the surface of each first signal transmission layer 211 in the second metal bracket 200 away from the first metal bracket 100, facilitating the placement of the control chip on the surface of any first signal transmission layer 211 away from the first metal bracket 100. The outer casing 300 exposes the surface of each second signal transmission layer 213 in the second metal bracket 200 away from the first metal bracket 100, or the outer casing 300 exposes the surfaces of the second signal transmission layers 213 in the data input sub-bracket 210, data output sub-bracket 230, power input sub-bracket 220, and power output sub-bracket 240 in the second metal bracket 200 away from the first metal bracket 100, facilitating the connection of the second signal transmission layers 213 to external driving circuits.

[0072] Optional, continue to refer to Figure 4 and Figure 5 The outer casing 300 includes a cup-shaped structure and a groove structure; the groove structure is located on one side of the cup-shaped structure; the cup-shaped structure includes a first bottom layer 311 and an inverted trapezoidal sidewall 312 surrounding and connecting the first bottom layer 311, the inverted trapezoidal sidewall 312 being located on the side of the first bottom layer 311 away from the groove structure; the first bottom layer 311 exposes the surfaces of the negative electrode support layer 111 and the positive electrode support layer 121 away from the second metal bracket 200; the groove structure includes a second bottom layer 321 and an annular sidewall 322 surrounding and connecting the second bottom layer 321; the annular sidewall 322 being located on the side of the second bottom layer 321 away from the cup-shaped structure; the second bottom layer 323 exposes the surface of each first signal transmission layer 211 away from the first metal bracket 100.

[0073] Specifically, the light-emitting chip is set inside the cup-shaped structure, and there is a certain distance between the light-emitting chip and the top of the inverted trapezoidal sidewall 312. Therefore, the cup-shaped structure can protect the light-emitting chip from damage. In addition, the inverted trapezoidal sidewall 312 in the cup-shaped structure can reflect the light emitted by the light-emitting chip, thereby improving the light-emitting efficiency of the light-emitting chip.

[0074] The control chip is housed within the recessed structure, which protects the control chip located on the surface of the first signal transmission layer 211 away from the first metal support from damage by external devices. The plane of the recessed structure away from the top of the cup-shaped structure exposes the second signal transmission layer 213, making it easy for the second signal transmission layer 213 to be connected to an external drive circuit.

[0075] Optionally, the housing material includes at least one of PCT, PPA, and EMC.

[0076] Specifically, PCT, PPA, and EMC are characterized by high temperature resistance, easy availability, and low cost. Using PCT, PPA, and EMC to make the outer shell can reduce the manufacturing cost of the bracket and extend its service life.

[0077] Based on the above embodiments, this embodiment also provides a light-emitting device. Figures 6-8 This is a schematic diagram of the structure of a light-emitting device under different viewing angles according to an embodiment of the present invention. Figures 6-8 The light-emitting device includes a bracket provided in any embodiment of the present invention, at least one light-emitting chip 400, a control chip 500, a first molding compound (not shown in the figure), and a second molding compound (not shown in the figure); the light-emitting chip 400 is located on the surface of the negative electrode support layer 111 and / or the positive electrode support layer 121 away from the second metal bracket 200, and the light-emitting chip is connected to the negative electrode support layer 111 and the positive electrode support layer 121; the control chip 500 is located on the surface of any first signal transmission layer 211 away from the first metal bracket 100, and the control chip 500 is connected to each first signal transmission layer 211; the first molding compound encapsulates the light-emitting chip 400, and the second molding compound encapsulates the control chip 500.

[0078] Specifically, the light-emitting chip 400 can be an LED chip, and can be a conventional chip, a flip chip, or a vertical chip. When the light-emitting chip 400 is a conventional chip, its first electrode is connected to the negative electrode support layer 111 via a gold wire, and its second electrode is connected to the positive electrode support layer 121 via a gold wire. When the light-emitting chip 400 is a flip chip, its first and second electrodes can be directly connected to the negative electrode support layer 111 and the positive electrode support layer 121 respectively via solder. When the light-emitting chip 400 is a vertical chip, its first electrode can be connected to the negative electrode support layer 111 via solder, and its second electrode can be connected to the positive electrode support layer 121 via a gold wire; alternatively, its first electrode can be connected to the negative electrode support layer 111 via a gold wire, and its second electrode can be connected to the positive electrode support layer 112 via solder. The first signal transmission layer 211 carries the control chip 500, and each pin of the control chip 500 is connected to the data input sub-bracket 210, data output sub-bracket 230, power input sub-bracket 220, power output sub-bracket 240, and signal output sub-bracket 250 respectively. Then, the second signal transmission layer 213 is connected to an external driving circuit, which drives the light-emitting chip 400 to emit light through the control chip 500. When both the negative electrode support layer 111 and the positive electrode support layer 121 are equipped with light-emitting chips 400, the light-emitting chips 400 can be connected in series or in parallel.

[0079] The first and second molding layers can be made of silicone or epoxy resin. The first molding layer fills the cup-shaped structure, and the second molding layer fills the groove structure. The first molding layer protects and fixes the light-emitting chip, and the second molding layer protects and fixes the control chip. The first molding layer can be transparent, allowing light emitted by the light-emitting chip to pass through. The first molding layer can also include wavelength conversion materials such as phosphors or quantum dots to convert the light emitted by the light-emitting chip.

[0080] Based on the above embodiments, this embodiment also provides a method for manufacturing a light-emitting device. Figure 9 This is a schematic flowchart illustrating a method for fabricating a light-emitting device according to an embodiment of the present invention. (Refer to...) Figure 9 The fabrication method of this light-emitting device includes the following steps:

[0081] S110. Provide a bracket according to any embodiment of the present invention, wherein a control chip is disposed on the surface of a first metal bracket away from the bracket in any first signal transmission layer of the bracket, and the control chip is connected to each first signal transmission layer.

[0082] S120, Form a second molding layer and mold the control chip with the second molding layer.

[0083] S130. The light-emitting chip is placed on the surface of the second metal bracket away from the bracket in the negative electrode support layer and / or the positive electrode support layer of the bracket, and the light-emitting chip is connected to the negative electrode support layer and the positive electrode support layer.

[0084] S140, Form a first molding layer and encapsulate the light-emitting chip with the first molding layer.

[0085] In fabricating a light-emitting device, the light-emitting chip can be first disposed on the surface of the negative electrode support layer and / or the positive electrode support layer away from the second metal bracket, forming a first molding compound layer. Then, the control chip can be disposed on the surface of any first signal transmission layer away from the first metal bracket, forming a second molding compound layer. Alternatively, the light-emitting chip can be disposed on the surface of the negative electrode support layer and / or the positive electrode support layer away from the second metal bracket, while the control chip is disposed on the surface of any first signal transmission layer away from the first metal bracket, and then both the first and second molding compounds can be formed simultaneously.

[0086] The method for manufacturing the light-emitting device provided in this embodiment is based on the same inventive concept as the light-emitting device provided in any embodiment of the present invention, and has corresponding beneficial effects. The technical details not described in this embodiment are not detailed in the light-emitting device provided in any embodiment of the present invention.

[0087] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0088] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A stent, characterized by, Comprise: a first metal support and a second metal support; the first metal support is located on one side of the second metal support; the first metal support comprises at least one negative sub-support and one positive sub-support which are spaced apart; the negative sub-support comprises a negative support layer, and the positive sub-support comprises a positive support layer; the second metal support comprises at least one data input sub-support, one data output sub-support, one power input sub-support, one power output sub-support and one signal output sub-support; the data input sub-support, the data output sub-support, the power input sub-support, the power output sub-support and the signal output sub-support each comprise a first signal transmission layer; the negative sub-support is connected with the power output sub-support, and the positive sub-support is connected with the signal output sub-support; the negative sub-support further comprises a negative support column which is located on the side of the negative support layer close to the second metal support and is integrally connected with the negative support layer; the positive sub-support further comprises a positive support column which is located on the side of the positive support layer close to the second metal support and is integrally connected with the positive support layer; the negative support column is integrally connected with the first signal transmission layer of the power output sub-support; the positive support column is integrally connected with the first signal transmission layer of the signal output sub-support; the data input sub-support, the data output sub-support, the power input sub-support and the power output sub-support each further comprise a signal support column and a second signal transmission layer; the signal support column is located on the side of the first signal transmission layer away from the first metal support; the second signal transmission layer is located on the side of the signal support column away from the first signal transmission layer; the first signal transmission layer, the signal support column and the second signal transmission layer of the data input sub-support, the data output sub-support, the power input sub-support and the power output sub-support are integrally connected and form a stepped structure.

2. The stent of claim 1, wherein the surface of the negative support layer away from the second metal support and the surface of the positive support layer away from the second metal support are located on the same plane; the surfaces of the negative support layer and the positive support layer away from the second metal support are parallel to the surface of the first signal transmission layer away from the first metal support.

3. The stent of claim 1, wherein the signal output sub-support further comprises the signal support column and the second signal transmission layer; the first signal transmission layer, the signal support column and the second signal transmission layer of the signal output sub-support are integrally connected and form a stepped structure.

4. The stent of claim 3, wherein the surfaces of each first signal transmission layer away from the first metal support are located on the same plane; the surfaces of each second signal transmission layer away from the first metal support are located on the same plane; the surface of the first signal transmission layer away from the first metal support is parallel to the surface of the second signal transmission layer away from the first metal support.

5. The stent defined in Claim 1, wherein, further comprise a shell; The shell covers the first metal support and the second metal support, and exposes the negative support layer and the positive support layer away from the surface of the second metal support and each of the first signal transmission layer and the second signal transmission layer away from the surface of the first metal support.

6. The stent defined in Claim 5, wherein, The shell comprises a cup structure and a groove structure; The groove structure is located on one side of the cup structure; The cup structure comprises a first bottom layer and an inverted trapezoidal sidewall surrounding and connecting the first bottom layer, and the inverted trapezoidal sidewall is located on the side of the first bottom layer away from the groove structure; The first bottom layer exposes the negative support layer and the positive support layer away from the surface of the second metal support; The groove structure comprises a second bottom layer and an annular sidewall surrounding and connecting the second bottom layer, and the annular sidewall is located on the side of the second bottom layer away from the cup structure; The second bottom layer exposes each of the first signal transmission layer away from the surface of the first metal support.

7. The stent defined in Claim 5, wherein, The material of the shell comprises at least one of PCT, PPA and EMC.

8. A light-emitting device, characterized in that, The shell comprises a support, at least one light emitting chip, a control chip, a first plastic sealing layer and a second plastic sealing layer; The light emitting chip is located on the surface of the negative support layer and / or the positive support layer away from the second metal support, and the light emitting chip is connected with the negative support layer and the positive support layer; The control chip is located on the surface of any of the first signal transmission layer away from the first metal support, and the control chip is connected with each of the first signal transmission layer; The first plastic sealing layer seals the light emitting chip, and the second plastic sealing layer seals the control chip.

9. A method for manufacturing a light emitting device as defined in claim 8, wherein The method comprises the following steps: providing a support, arranging a control chip on the surface of any of the first signal transmission layer of the support away from the first metal support of the support, and connecting the control chip with each of the first signal transmission layer; forming a second plastic sealing layer, and sealing the control chip by the second plastic sealing layer; arranging a light emitting chip on the surface of the negative support layer and / or the positive support layer of the support away from the second metal support of the support, and connecting the light emitting chip with the negative support layer and the positive support layer; forming a first plastic sealing layer, and sealing the light emitting chip by the first plastic sealing layer.

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