An electrical connection structure and power distribution device

Abstract

The embodiment of the present application provides an electrical connection structure and a power distribution device. The electrical connection structure comprises at least one bus structure, the bus structure comprises: a bus bar assembly comprising at least two bus bars; a printed circuit board (PCB) assembly comprising at least one PCB, at least one side of the PCB assembly is stacked with the bus bar assembly; wherein the at least two bus bars in the bus bar assembly are misaligned and stacked, the bus bar away from the PCB assembly in the two bus bars stacked adjacently comprises a misaligned part and a stacked part, and the misaligned part is closer to the PCB assembly than the stacked part. The embodiment of the present application is simple to assemble, can reduce the assembly time, and can reduce the number of local stacking layers of the bus bar, reduce the thickness, reduce the material usage, help to reduce the volume and reduce the cost, and meanwhile, the ventilation and heat dissipation effect is good, and the power density is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of power distribution, in particular to an electrical connection structure and a power distribution device. BACKGROUND

[0002] In the frame type and cabinet type power distribution device, various different functional modules such as input circuit, output circuit, power circuit, monitoring circuit, bypass circuit, energy storage device, etc. are electrically connected to each other to realize the overall function. The electrical connection mode of these functional modules has a great influence on the overall architecture, size, assembly complexity, reliability and cost of the product.

[0003] The existing electrical connection mode between various functional modules is complicated, time-consuming, labor-intensive, occupies a large space in the overall machine, is not conducive to heat dissipation, and is difficult to achieve high-density design. SUMMARY

[0004] The embodiments of the present application provide an electrical connection structure and a power distribution device, which are simple to assemble, can reduce assembly time, and can reduce the number of local stack layers of bus bars, reduce thickness, reduce material usage, help reduce volume and cost, and have good ventilation and heat dissipation effect, which is conducive to improving power density.

[0005] To this end, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, the embodiments of the present application provide an electrical connection structure, which comprises at least one bus structure, the bus structure comprising: a bus bar assembly comprising at least two bus bars; a printed circuit board (PCB) assembly comprising at least one PCB, at least one side of the PCB assembly being stacked with the bus bar assembly; wherein the at least two bus bars in the bus bar assembly are misaligned and stacked, the bus bar away from the PCB assembly in the two bus bars stacked adjacent to each other comprising a misaligned portion and a stacked portion, the misaligned portion being closer to the PCB assembly than the stacked portion.

[0007] The electrical connection structure of the embodiments of the present application, since the at least two bus bars in the bus bar assembly are misaligned and stacked, the bus bar away from the PCB assembly in the two bus bars stacked adjacent to each other comprising a misaligned portion and a stacked portion, and the misaligned portion being closer to the PCB assembly than the stacked portion, can reduce the number of local stack layers of the bus bar, i.e. the misaligned portion, reduce thickness, reduce material usage, help reduce volume, reduce weight and cost, and have good ventilation and heat dissipation effect. The PCB can also be provided with an opening to further improve the heat dissipation effect.

[0008] In one possible implementation, the two adjacently stacked buses include: a first bus comprising a plurality of spaced-apart first branches stacked on the PCB assembly; and a second bus stacked on the PCB assembly and at least a portion of the plurality of first branches on the side of the first bus away from the PCB assembly, wherein the misaligned portion of the second bus includes a portion stacked on the PCB assembly, and the stacked portion of the second bus includes a portion stacked on the at least a portion of the first branches. In other words, in this implementation, the plurality of first branches of the first bus are stacked on the PCB assembly, a portion (i.e., the misaligned portion) of the second bus is stacked on the PCB assembly, and another portion (i.e., the stacked portion) is stacked on at least a portion of the first branches. This results in a thinner bus structure at the misaligned portion of the second bus, reducing local thickness and saving material usage.

[0009] In one possible implementation, the first busbar further includes a first main body connected to the plurality of first branches; wherein: the first main body and the plurality of first branches are located in the same plane, and the first main body is stacked on the PCB assembly or located outside the PCB assembly; or, the first main body is located outside the PCB assembly, and the first main body and the PCB assembly are located in the same plane. The first busbar further includes a bending portion, one end of which is connected to the plurality of first branches, and the other end is connected to the first main body. That is, in this implementation, the plurality of first branches are connected together through the first main body, which makes the installation of the first busbar more convenient and saves assembly time. Furthermore, to further reduce the thickness, the first main body can be located outside the PCB assembly, and the bending portion can be used to ensure that the first main body and the PCB assembly are in the same plane.

[0010] In one possible implementation, the second bus includes: a second main body, a portion of which is stacked on the PCB assembly, and another portion of which is stacked on the at least part of the first branch; and a plurality of second branches connected to the second main body and stacked on the PCB assembly. That is, in this implementation, the misaligned portion of the second bus includes a portion of the second main body and a plurality of second branches, the stacked portion of the second bus includes another portion of the second main body, and the structure of the second bus can be similar to that of the first bus, i.e., both buses include a main body and a plurality of branches connected to the main body.

[0011] In one possible implementation, the bus assembly includes a third bus, which is stacked on the side of the second bus away from the PCB assembly, on the misaligned portion of the PCB assembly and the second bus. The misaligned portion of the third bus includes a portion stacked on the PCB assembly, and the stacked portion of the third bus includes a portion stacked on the misaligned portion of the second bus. In other words, in this implementation, the bus structure can be formed by stacking three buses, with the third bus stacked with the second bus and the PCB, which reduces board thickness and helps to reduce volume.

[0012] In one possible implementation, each bus includes one or at least two conductive layers, a first insulating layer between adjacent conductive layers, and a second insulating layer surrounding the outer periphery of the bus; wherein: the conductive layers are electrically connected to the PCB assembly; and / or, connection terminals are provided on the conductive layers, the connection terminals being located on the outside of the PCB assembly. That is, in this implementation, each conductive layer can transmit different signals, an insulating layer is required between adjacent conductive layers to prevent signal crosstalk, and an insulating layer is also required around the outer periphery of the bus. The outer periphery of the bus may include an upper surface, a lower surface, and two side surfaces. The connection terminals can be connected to functional modules within the power distribution device or to devices outside the configuration device; or, the connection terminals of two bus structures can be electrically connected.

[0013] In one possible implementation, the bus includes at least two conductive layers, at least one of which includes a protrusion extending relative to the other conductive layers. That is, in this implementation, the conductive layer may have a protrusion to facilitate connection between the conductive layer and the PCB or to a connector.

[0014] In one possible implementation, the protrusion is electrically connected to the PCB assembly; wherein: the protrusion includes a conductive portion, the conductive portion being electrically connected to a contact on at least one PCB; or, the at least one PCB has a first hole, and the protrusion has a second hole corresponding to the first hole, with a first conductive structure disposed within the first and second holes to electrically connect the at least one PCB and the protrusion. That is, in this implementation, when the protrusion of the conductive layer is electrically connected to the PCB, the conductive portion of the protrusion can be directly electrically connected to a contact on the PCB, or the PCB and the protrusion of the conductive layer can be connected via a first conductive structure.

[0015] In one possible implementation, the bus structure further includes at least one first connector, wherein: a third hole is provided on the at least one PCB, and a first pin of the first connector is electrically connected to the PCB through the third hole; and / or, a fourth hole is provided on the protrusion, the fourth hole corresponding to the third hole on the at least one PCB, and a second pin of the first connector passes through the third hole and the fourth hole to be electrically connected to the protrusion. That is, in this implementation, the first connector may be electrically connected only to the PCB, only to the protrusion of the conductive layer, or both to the PCB and the protrusion of the conductive layer.

[0016] In one possible implementation, the PCB assembly includes at least two PCBs, which are spaced apart in the same plane or located on different planes, and at least one busbar is stacked on the two adjacent PCBs. That is, in this implementation, the number of PCBs in the bus structure can be two or more, and the positions of different PCBs can be flexibly arranged according to operational needs such as the shape of the installation space.

[0017] In one possible implementation, the electrical connection structure includes at least two bus structures, with adjacent bus structures electrically connected in at least one of the following ways: at least one connection terminal of the bus assembly of one of the adjacent bus structures is electrically connected to at least one connection terminal of the bus assembly of the other of the adjacent bus structures; a second connector is provided on the PCB assembly of one of the adjacent bus structures, and a third connector is provided on the PCB assembly of the other of the adjacent bus structures, with the second connector and the third connector electrically connected; a fifth hole is provided on the bus assembly of one of the adjacent bus structures, and a sixth hole is provided on the bus assembly of the other of the adjacent bus structures, with a second conductive structure provided within the fifth hole and the sixth hole to electrically connect the bus assemblies of the adjacent bus structures. That is, in this implementation, the two bus structures can be electrically connected via their respective connection terminals, via connectors, or via a second conductive structure connecting to the bus.

[0018] Secondly, embodiments of this application provide a power distribution device, the power distribution device comprising: the electrical connection structure provided in the first aspect above; and a plurality of functional modules, the functional modules being electrically connected to the connection terminals and / or PCB assembly of the electrical connection structure.

[0019] In one possible implementation, the power distribution device further includes a panel, wherein: the panel has at least one opening, the at least one opening including a first opening; the power distribution device further includes a first connection structure, one end of the first connection structure being electrically connected to the electrical connection structure, and the other end extending out of the panel through the first opening; and / or, the plurality of functional modules include a power supply device, the power supply device being disposed on the panel, the power supply device being provided with a gold finger or a fourth connector, the gold finger or the fourth connector being electrically connected to a first connector on the PCB assembly of the electrical connection structure.

[0020] Other features and advantages of the present invention will be described in detail in the following detailed embodiments section. Attached Figure Description

[0021] The accompanying drawings used in the description of the embodiments or prior art are briefly introduced below.

[0022] Figure 1 This is a schematic diagram of the structure of a power distribution device provided in an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of an electrical connection structure provided in an embodiment of this application;

[0024] Figure 3 for Figure 2 A three-dimensional structural diagram of the bus assembly and PCB assembly after the electrical connection structure is assembled;

[0025] Figure 4 for Figure 3 The diagram shows a top view of the assembled bus and PCB components. Detailed Implementation

[0026] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0027] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can be fixed connections, detachable connections, mating connections or integral connections; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] Furthermore, in the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0030] Currently, electrical connections between functional modules within a power distribution system are typically achieved using copper busbars and cables. Alternatively, printed circuit boards (PCBs) can be used to connect two functional modules. High currents can be transmitted via copper busbars and / or thick cables, while low currents and / or signals can be transmitted via thin cables and / or PCBs. Copper busbars, cables, and PCBs are discrete components and require separate installation and connection, typically achieved through methods such as soldering or screw connections.

[0031] The above-mentioned scheme for electrically connecting various functional modules requires a large number of parts, resulting in complex assembly and high labor costs. In addition, it is difficult to control the high voltage withstand voltage between copper busbars, the cable routing is cumbersome, it occupies a lot of space in the whole machine, it is not conducive to heat dissipation, and it is difficult to achieve high-density design.

[0032] As the requirements for power and voltage of power supply products continue to increase, the design requirements for current carrying capacity and withstand voltage are also rising. This places higher demands on the electrical connections between various functional modules within the power distribution unit. Furthermore, the increased power density also requires more space for heat dissipation. To better meet the power distribution needs of the entire power supply product, the electrical connection design needs to be optimized.

[0033] In view of this, embodiments of this application provide an electrical connection structure and a power distribution device. The power distribution device includes an electrical connection structure and multiple functional modules, which are electrically connected through the electrical connection structure. Specifically, the electrical connection structure is a PCB composite multi-network three-dimensional stacked bus structure. The PCB and multiple single-layer / multi-layer buses of different sizes are bonded together with adhesive materials to form a three-dimensional stacked structure. Electrical connection between the PCB and the bus can be achieved by setting holes on the PCB and the bus to accommodate conductive media, or by using connector pins. Functional modules, such as power supply devices, are inserted into the interfaces of connectors on the PCB through gold fingers / connectors, enabling high current to flow through the bus and low current and small signals to flow through the PCB, thereby achieving the goals of low cost, high current carrying capacity, and high density and simplicity. The solution of this application embodiment solves the problem that the electrical connection structure in the power distribution device has a large number of parts, such as using cables, copper busbars, and PCBs for connection, resulting in high assembly labor costs, and cables blocking heat dissipation channels, which limits the continuous improvement of product power density.

[0034] Figure 1 This is a schematic diagram of a power distribution device provided in an embodiment of this application. Figure 1 As shown, the power distribution device includes an electrical connection structure 10 and multiple functional modules 20. The electrical connection structure includes at least one bus structure H, which includes a bus assembly 1 and a printed circuit board (PCB) assembly 2. The PCB assembly 2 includes at least one PCB. The functional modules 20 are electrically connected to the connection terminals L of the bus assembly 1 and / or the PCB assembly 2 of the electrical connection structure 10. Each functional module can be horizontally or vertically plugged into the PCB. Pads or mounting holes may also be provided on the PCB and the bus to mount other components.

[0035] Furthermore, the power distribution device may also include a panel 30, and multiple functional modules 20 include a power supply device 201. The power supply device 201 is disposed on the panel 30, and the power supply device 201 is provided with a gold finger J or a fourth connector (not shown in the figure). The gold finger J or the fourth connector is electrically connected to the first connector 3 on the PCB assembly 2 of the electrical connection structure 10.

[0036] In addition, the power distribution device also includes a first connection structure 40. The panel 30 is provided with at least one opening, including a first opening. One end of the first connection structure 40 is electrically connected to the electrical connection structure 10, for example, electrically connected to the connection terminal L of the electrical connection structure 10, or electrically connected to the bus assembly 1 and PCB of the electrical connection structure 10 by screws, etc., and the other end extends out of the panel 30 through the first opening.

[0037] The power distribution device may also include a second connection structure (not shown in the figure), at least one opening including the second opening, one end of the second connection structure being connected to a signal connector 4 disposed on the PCB assembly 2 of the electrical connection structure 10, and the other end extending out of the panel 30 through the second opening.

[0038] The power distribution device may also include a third connection structure (not shown in the figure), at least one opening including a third opening, one end of the third connection structure being connected to an auxiliary current-passing device 5 provided on the PCB assembly 2 of the electrical connection structure 10, and the other end extending out of the panel 30 through the third opening.

[0039] Figure 2 This is a schematic diagram of an electrical connection structure provided in an embodiment of this application. Figure 2 As shown, the electrical connection structure includes at least one bus structure H, which includes a bus assembly 1 and a printed circuit board (PCB) assembly 2. Furthermore, the bus structure H may also include at least one of a first connector 3, a signal connector 4, and an auxiliary current-carrying device 5.

[0040] Figure 3 for Figure 2 The diagram shows a three-dimensional structure of the bus assembly and PCB assembly after the electrical connection structure is assembled. Figure 4 for Figure 3 The diagram shows a top view of the assembled bus and PCB components. Figure 3 and Figure 4 As shown, bus assembly 1 includes at least two buses. Printed circuit board (PCB) assembly 2 includes at least one PCB, and bus assembly 1 is stacked on at least one side of PCB assembly 2. PCB assembly 2 and bus assembly 1 can be vertically connected through processes such as lamination and bonding.

[0041] The PCB can be rigid, flexible, or a combination of both. Furthermore, the PCB assembly 2 can include at least two PCBs, which are spaced apart in the same plane or located on different planes, and at least one busbar is stacked on adjacent PCBs.

[0042] In other words, in the bus structure, there can be one or more PCBs, and the multiple PCBs can be on the same plane or distributed on multiple different planes. Furthermore, a bus assembly 1 can be stacked on one side of the PCB assembly 2, or bus assemblies 1 can be stacked on both sides of the PCB assembly 2. In this application, the example of a PCB assembly 2 comprising a single PCB with a bus assembly 1 stacked on one side of the PCB will be used for illustration.

[0043] Continue to refer to Figure 3 and Figure 4At least two buses in bus assembly 1 are staggered and stacked. Among the two adjacent stacked buses, the bus farther from PCB assembly 2 includes a staggered portion and a stacked portion, with the staggered portion being closer to PCB assembly 2 than the stacked portion. Furthermore, an opening K may be provided on the PCB to improve heat dissipation.

[0044] In the electrical connection structure of this application embodiment, since at least two buses in the bus assembly 1 are staggered and stacked, the bus far from the PCB assembly 2 in the two adjacent stacked buses includes a staggered portion and a stacked portion. The staggered portion is closer to the PCB assembly 2 than the stacked portion. In the case of implementing multiple networks, the number of stacked layers in the local area of ​​the bus, i.e. the staggered portion, can be reduced, the thickness can be reduced, the amount of material used can be reduced, the volume can be reduced, the weight and cost can be reduced, and the ventilation and heat dissipation effect is better.

[0045] exist Figure 3 and Figure 4 In the configuration, two buses stacked adjacent to each other include a first bus 11 and a second bus 12. The first bus 11 includes a plurality of first branches 111 spaced apart, which are stacked on the PCB assembly 2. The second bus 12 is stacked on the side of the first bus 11 away from the PCB assembly 2 and on at least a portion of the first branches 111. The misaligned portion of the second bus 12 includes the portion stacked on the PCB assembly 2, and the stacked portion of the second bus 12 includes the portion stacked on at least a portion of the first branches 111.

[0046] Furthermore, for ease of installation and disassembly, the first busbar 11 may also include a first main body 112, which is connected to a plurality of first branch portions 111. The first main body 112 and the plurality of first branch portions 111 are located in the same plane, and the first main body 112 is stacked on the PCB assembly 2 or located on the outside of the PCB assembly 2. Alternatively, to further reduce the thickness, the first main body 112 is located on the outside of the PCB assembly 2, and the first main body 112 and the PCB assembly 2 are located in the same plane. The first busbar 11 also includes a bending portion, one end of which is connected to the plurality of first branch portions 111, and the other end of which is connected to the first main body 112.

[0047] Furthermore, the structure of the second busbar 12 can be the same as or different from that of the first busbar 11, depending on the operational requirements. In one example, such as... Figure 3 and Figure 4As shown, the second bus 12 includes a second main body 121 and a plurality of second branches 122. A portion of the second main body 121 is stacked on the PCB assembly 2, and another portion is stacked on at least a portion of the first branch 111. The plurality of second branches 122 are connected to the second main body 121 and are stacked on the PCB assembly 2. That is, the misaligned portion of the second bus 12 includes a portion of the second main body 121 and a plurality of second branches 122, and the stacked portion of the second bus 12 includes another portion of the second main body 121. The structure of the second bus 12 can be similar to the structure of the first bus, that is, both buses include a main body and a plurality of branches connected to the main body.

[0048] exist Figure 3 and Figure 4 In this embodiment, bus assembly 1 includes two buses. In other embodiments, bus assembly 1 may include three or more buses. For example, in... Figure 3 and Figure 4 Based on the bus structure shown, at least two buses may further include a third bus (not shown in the figure). The third bus is stacked on the side of the second bus 12 away from the PCB assembly 2 on the misaligned portion (such as a part of the second main body 121) of the PCB assembly 2 and the second bus 12. The misaligned portion of the third bus includes the portion stacked on the PCB assembly 2, and the stacked portion of the third bus includes the portion stacked on the misaligned portion of the second bus 12.

[0049] Each bus includes one or at least two conductive layers D. A first insulating layer is provided between adjacent conductive layers D, meaning that adjacent conductive layers D are insulated from each other. A second insulating layer is provided around the outer periphery of the bus. In other words, the PCB and the bus can be connected by lamination or bonding. The bus can form multi-layer and multi-network designs through lamination or bonding. The bus can be laid out horizontally or stacked three-dimensionally, with bending to avoid the intersection areas. Insulation is required between the high and low voltage levels of multi-layer stacked buses. Thus, adjacent buses are insulated from each other, and most of the area between PCB assembly 2 and bus assembly 1 is insulated. Local areas between PCB assembly 2 and bus assembly 1 can be electrically connected. For example, electrical connection can be achieved through the protrusion S of the conductive layer D (described below) and contacts on the PCB, or through the first conductive medium.

[0050] Furthermore, the conductive layer D can be electrically connected to the PCB assembly 2. A connection terminal L can be provided on the conductive layer D, and the connection terminal L is located on the outside of the PCB assembly 2. That is, the conductive layer D needs to be connected to either the PCB assembly 2 or another functional module. When the conductive layer D is connected to another functional module, the conductive layer D needs to be provided with a connection terminal L.

[0051] To facilitate electrical connection between the conductive layer D and the PCB or the first connector 3, the bus may include at least two conductive layers D, wherein at least one conductive layer D includes a protrusion S that extends relative to the other conductive layers D in the at least two conductive layers D.

[0052] exist Figure 3 and Figure 4 In the bus assembly 1, there are two buses, namely a first bus 11 and a second bus 12. Each bus includes two conductive layers D, namely a first conductive layer D1 and a second conductive layer D2. In the first bus 11, a first connection terminal L1 is provided on the first conductive layer D1, and a second connection terminal L2 is provided on the second conductive layer D2. In the second bus 12, a first connection terminal L1' is provided on the first conductive layer D1, and a second connection terminal L2' is provided on the second conductive layer D2.

[0053] Furthermore, the way in which the protruding part S is electrically connected to the PCB assembly 2 can be, but is not limited to, the following two methods:

[0054] Method 1 – The protrusion S includes a conductive portion that is electrically connected to at least one contact on a PCB.

[0055] Method 2 – At least one PCB has a first hole, and a protrusion S has a second hole corresponding to the first hole. A first conductive structure is provided within both the first and second holes to electrically connect at least one PCB and the protrusion S. The first conductive structure may be a screw. Alternatively, the first conductive structure may be formed by filling with a conductive material such as copper paste. Alternatively, the first conductive structure may include a metal pillar, which is electrically connected to the first and second holes by riveting or welding.

[0056] Furthermore, the first connector 3 of the bus structure H can be electrically connected only to the PCB assembly 2, only to the bus assembly 1, or simultaneously to both the bus assembly 1 and the PCB assembly 2. Specifically, at least one PCB may have a third hole, through which the first pin of the first connector 3 is electrically connected to the PCB. The protrusion S may have a fourth hole, corresponding to the third hole on at least one PCB, through which the second pin of the first connector 3 passes to be electrically connected to the protrusion S. In this way, power and signal can achieve the shortest vertical connection path through the connector-PCB-bus.

[0057] exist Figure 3 and Figure 4 Figure 3 Figure 4Only one bus structure H is shown in the diagram. In other embodiments, the electrical connection structure may include at least two bus structures H, which can be electrically connected to achieve cascading expansion of multiple bus structures H. Specifically, adjacent bus structures H are electrically connected in at least one of the following ways:

[0058] Method 1 – At least one connection terminal L of the busbar assembly 1 of one of the two adjacent busbar structures H is electrically connected to at least one connection terminal L of the busbar assembly 1 of the other of the two adjacent busbar structures H, for example, by welding.

[0059] Method 2 - A second connector is provided on the PCB assembly 2 of one of the two adjacent bus structures H, and a third connector is provided on the PCB assembly 2 of the other of the two adjacent bus structures H, and the second connector and the third connector are electrically connected.

[0060] Method 3 – One of the two adjacent busbar structures H has a fifth orifice on its busbar assembly 1, and the other of the two adjacent busbar structures H has a sixth orifice. A second conductive structure is disposed within both the fifth and sixth orifices to electrically connect the busbar assemblies 1 of the two adjacent busbar structures H. The second conductive structure can be the same as the first conductive structure; for details of the second conductive structure, please refer to the relevant description of the first conductive structure.

[0061] In summary, in the solution of using busbars and cables to connect various functional modules, there are a large number of cables, current networks and signal networks intersect, busbar design is complex, assembly takes a long time, occupies a lot of space, and is prone to blocking heat dissipation channels.

[0062] In this embodiment, a PCB composite bus replaces the complex cable design, which facilitates assembly. Insulation layers are provided between the layers of the bus and between the bus and the PCB to achieve reliable insulation. The structure is simple, occupies little space, and is conducive to improving heat dissipation.

[0063] Furthermore, considering that the PCB and bus are stacked and aligned along the thickness direction, resulting in a significant thickness, and that the path for high current to the bus needs to pass through the PCB, requiring a large number of PCB layers, the thickness is further increased. In this embodiment, the PCB and bus are connected by lamination or bonding. The bus features diverse designs and a staggered stacking method for three-dimensional combination. This reduces the thickness and material usage while achieving a high-density layout of multiple high-current networks, thus contributing to reduced volume and cost. Simultaneously, it enables simplified vertical power and signal connections; the shortest vertical connection path is achieved through connector-PCB-bus. Connectors can connect both the PCB and bus, allowing high current to reach the bus directly through the connector without passing through the PCB, thereby reducing the number of PCB layers.

[0064] Specifically, one or more PCBs and at least two bus assemblies can be bonded together along the thickness direction using adhesive to form a three-dimensional stacked structure. The at least two bus assemblies can carry multiple intersecting high-current networks, while the PCB can support complex signal networks and low-current networks. Electrical connections between the bus and the PCB can be achieved directly through PCB vias and conductive media, or via connector pins. Power supplies can be inserted into the connector interfaces on the PCB composite bus via gold fingers or connectors. This PCB composite multi-network three-dimensional stacked bus structure enables a high-density layout of multiple high-current networks. Signal acquisition via the bus eliminates the need for signal sampling cables, avoiding the use of cables, reducing space requirements, and providing good heat dissipation.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electrical connection structure, characterized in that, Includes at least one bus structure (H), said bus structure (H) comprising: Bus assembly (1) includes at least two buses; The printed circuit board (PCB) assembly (2) includes at least one PCB, and the bus assembly (1) is stacked on at least one side of the PCB assembly (2). In this configuration, at least two buses in the bus assembly (1) are staggered and stacked. Among the two adjacent stacked buses, the bus farther from the PCB assembly (2) includes a staggered portion and a stacked portion. The staggered portion is closer to the PCB assembly (2) relative to the stacked portion. The conductive layer of the bus includes a protrusion (S) that is electrically connected to the PCB assembly (2); wherein: The protrusion (S) includes a conductive portion that is electrically connected to a contact on the at least one PCB; or, The at least one PCB is provided with a first hole, and the protrusion (S) is provided with a second hole corresponding to the first hole. The first hole and the second hole are provided with a first conductive structure to electrically connect the at least one PCB and the protrusion (S).

2. The electrical connection structure according to claim 1, characterized in that, The two busbars arranged in adjacent stacks include: The first bus (11) includes a plurality of first branches (111) spaced apart, the plurality of first branches (111) being stacked on the PCB assembly (2); The second bus (12) is stacked on the side of the first bus (11) away from the PCB assembly (2) and on at least a portion of the first branches (111) of the plurality of first branches (111). The misaligned portion of the second bus (12) includes the portion stacked on the PCB assembly (2), and the stacked portion of the second bus (12) includes the portion stacked on the at least a portion of the first branches (111).

3. The electrical connection structure according to claim 2, characterized in that, The first busbar (11) further includes a first main body (112), which is connected to the plurality of first branches (111); wherein: The first main body (112) and the plurality of first branches (111) are located in the same plane, and the first main body (112) is stacked on the PCB assembly (2) or located on the outside of the PCB assembly (2); or, The first main body (112) is located outside the PCB assembly (2). The first main body (112) and the PCB assembly (2) are located in the same plane. The first busbar (11) also includes a bending part. One end of the bending part is connected to the plurality of first branches (111), and the other end is connected to the first main body (112).

4. The electrical connection structure according to claim 2 or 3, characterized in that, The second bus (12) includes: The second main body (121) is partially stacked on the PCB assembly (2), and another part is stacked on the at least part of the first branch (111); Multiple second branches (122) are connected to the second main body (121) and are stacked on the PCB assembly (2).

5. The electrical connection structure according to claim 2 or 3, characterized in that, The bus assembly (1) includes a third bus, which is stacked on the side of the second bus (12) away from the PCB assembly (2) on the misaligned portion of the PCB assembly (2) and the second bus (12). The misaligned portion of the third bus includes a portion stacked on the PCB assembly (2) and a portion stacked on the misaligned portion of the second bus (12).

6. The electrical connection structure according to claim 1 or 2, characterized in that, Each busbar includes one or at least two conductive layers (D), a first insulating layer is disposed between adjacent conductive layers (D), and a second insulating layer is disposed around the outer periphery of the busbar; wherein: The conductive layer (D) is electrically connected to the PCB assembly (2); and / or, A connection terminal (L) is provided on the conductive layer (D), and the connection terminal (L) is located on the outside of the PCB assembly (2).

7. The electrical connection structure according to claim 6, characterized in that, The busbar includes at least two conductive layers (D), and at least one of the at least two conductive layers (D) includes an extension (S) that extends relative to the other conductive layers (D) of the at least two conductive layers (D).

8. The electrical connection structure according to claim 7, characterized in that, The bus structure (H) further includes at least one first connector (3), wherein: At least one PCB is provided with a third hole, and the first pin of the first connector (3) is electrically connected to the PCB through the third hole; and / or, The protrusion (S) is provided with a fourth hole, which corresponds to a third hole on the at least one PCB. The second pin of the first connector (3) passes through the third hole and the fourth hole to be electrically connected to the protrusion (S).

9. The electrical connection structure according to claim 1 or 2, characterized in that, The PCB assembly (2) includes at least two PCBs, which are spaced apart in the same plane or located in different planes, and at least one busbar is stacked on the two adjacent PCBs.

10. The electrical connection structure according to claim 1 or 2, characterized in that, It includes at least two bus structures (H), and adjacent bus structures (H) are electrically connected in at least one of the following ways: At least one connection terminal (L) of the busbar assembly (1) of one of the two adjacent busbar structures (H) is electrically connected to at least one connection terminal (L) of the busbar assembly (1) of the other of the two adjacent busbar structures (H). A second connector is provided on the PCB assembly (2) of one of the two adjacent bus structures (H), and a third connector is provided on the PCB assembly (2) of the other of the two adjacent bus structures (H), wherein the second connector and the third connector are electrically connected; A fifth hole is provided on the busbar assembly (1) of one of the two adjacent busbar structures (H), and a sixth hole is provided on the busbar assembly (1) of the other of the two adjacent busbar structures (H). A second conductive structure is provided in the fifth hole and the sixth hole to electrically connect the busbar assemblies (1) of the two adjacent busbar structures (H).

11. A power distribution device, characterized in that, include: Electrical connection structure (10) according to any one of claims 1-10; Multiple functional modules (20) are electrically connected to the connection terminals (L) of the electrical connection structure (10) and / or the PCB assembly (2).

12. The power distribution device according to claim 11, characterized in that, It also includes panel (30), in which: The panel (30) is provided with at least one opening, the at least one opening including a first opening, the power distribution device further includes a first connection structure (40), one end of the first connection structure (40) is electrically connected to the electrical connection structure (10), and the other end extends out of the panel (30) through the first opening; and / or, The plurality of functional modules (20) include a power supply device (201) disposed on the panel (30), and the power supply device (201) is provided with a gold finger (J) or a fourth connector, which is electrically connected to a first connector (3) on the PCB assembly (2) of the electrical connection structure (10).

Images