A vibration sensing device

Abstract

An embodiment of the present application provides a vibration sensing device, which may include a vibration sensor and at least one vibration component. The vibration sensor has a first resonant frequency, the at least one vibration component may be used to transmit the received vibration to the vibration sensor, and the vibration component may include a liquid disposed in a target cavity and a plate body constituting a part of the cavity wall of the target cavity. The at least one vibration component may provide at least one second resonant frequency for the vibration sensing device, and the at least one second resonant frequency may be different from the first resonant frequency.

Description

[0001] Cross-references

[0002] This application claims priority to Chinese application No. 202110445739.3 filed on April 23, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of sensor devices, and in particular to a vibration sensor device. Background Art

[0004] A vibration sensor device (e.g., a microphone) receives an external vibration signal. Near the resonant frequency of the vibration sensor device, the vibration signal will have a large amplitude due to the resonance effect. Accordingly, the response of the vibration sensor device to the external vibration signal can be manifested as a resonance peak generated near the resonant frequency in its corresponding frequency response curve. The vibration sensor device has a higher sensitivity to inductive vibration near the resonant frequency, but has a lower sensitivity at other frequencies (e.g., 2-5K Hz), resulting in unstable frequency responses of the vibration sensor device in different frequency ranges.

[0005] Therefore, it is desirable to provide a vibration sensing device that improves the sensitivity of the device in sensing vibration, obtains an ideal or desired response curve, and at the same time enables the vibration sensing device to have a more stable frequency response in a wider frequency range. Summary of the invention

[0006] In order to solve the problem of low sensitivity and unstable frequency response of the above-mentioned vibration sensor, the technical solution of this specification is implemented as follows:

[0007] The present application provides a vibration sensing device. The vibration sensing device may include a vibration sensor and at least one vibration component. The vibration sensor has a first resonant frequency. The at least one vibration component may be used to transmit the received vibration to the vibration sensor. The vibration component may include a liquid disposed in a target cavity and a plate body constituting a part of a cavity wall of the target cavity. The at least one vibration component may provide at least one second resonant frequency for the vibration sensing device, and the at least one second resonant frequency may be different from the first resonant frequency.

[0008] In some embodiments, the target cavity may include a first sub-cavity and a second sub-cavity, the first sub-cavity may be used to contain the liquid, and the second sub-cavity may be used to contain one or more fillers selected from gas, liquid or solid.

[0009] In some embodiments, the microphone further comprises an adjustment element, and the adjustment element is used to adjust the size of the first sub-cavity or the second sub-cavity.

[0010] In some embodiments, the vibration sensor may include a bone conduction vibration sensor, and the bone conduction vibration sensor may include a housing, an acoustic-to-electric conversion element, and a vibration transmission element. The housing may generate vibrations in response to an external vibration signal, and the vibration transmission element may transmit the vibrations to the acoustic-to-electric conversion element. The at least one vibration component may be used to receive vibrations of at least one of the housing or the vibration transmission element and transmit them to the acoustic-to-electric conversion element. The acoustic-to-electric conversion element may have different frequency responses to the vibrations transmitted by the vibration transmission element and the vibrations transmitted by the at least one vibration component.

[0011] In some embodiments, the plate body may include a first plate body and a second plate body, and the first plate body and the second plate body may divide the space inside the shell into multiple cavities, and the multiple cavities may include a first cavity defined by the first plate body, the second plate body and the vibration transmitting element, a second cavity defined by the first plate body and a part of the shell, and a third cavity defined by the second plate body and a part of the shell, and the target cavity may include one or more of the multiple cavities.

[0012] In some embodiments, the target cavity may include the first cavity, and the acoustic-to-electric conversion element may be disposed in the first cavity.

[0013] In some embodiments, the vibration assembly may further include a vibration pickup element, which may be disposed between the shell and the vibration transmission element, and is used to vibrate in response to the vibration of the shell, and the vibration assembly is used to form one or more resonance systems, and the one or more resonance systems may include a first resonance system and a second resonance system. The first resonance system may be composed of the liquid and the plate. The second resonance system may be composed of the vibration pickup element, the vibration transmission element, the acoustic-to-electric conversion element, the liquid, and the plate.

[0014] In some embodiments, the target cavity may include at least one of the second cavity or the third cavity, the vibration component may further include a vibration pickup element, the vibration pickup element may be arranged between the shell and the vibration transmission element, and the vibration component may be used to form one or more resonance systems.

[0015] In some embodiments, the first plate body and the second plate body may include rigid plates, and the one or more resonance systems may include a resonance system composed of the vibration transmission element, the acoustic-to-electric conversion element, the liquid, the plate body, and the vibration pickup element.

[0016] In some embodiments, the first plate body and the second plate body may include flexible plates, the one or more resonance systems may include a first resonance system and a second resonance system, the first resonance system may be composed of the vibration transmission element, the acoustic-to-electric conversion element, the liquid, the plate body, and the vibration pickup element, and the second resonance system may be composed of the first plate body, the acoustic-to-electric conversion element, and the second plate body.

[0017] In some embodiments, the vibration sensor device may further include a supporting element, the acoustic-to-electric conversion element may be disposed in the first cavity and divide the first cavity into a first gas cavity and a second gas cavity, the first end of the acoustic-to-electric conversion element may be connected to the supporting element, and the second end of the acoustic-to-electric conversion element may be connected to the vibration transmission element. The first plate and / or the second plate may receive the vibration of the liquid and / or the vibration pickup element, and transmit the vibration to the acoustic-to-electric conversion element through the first gas cavity and / or the second gas cavity to form the second resonance system.

[0018] In some embodiments, the vibration sensor may include an air-conducted vibration sensor, the air-conducted vibration sensor may include an acoustic-to-electric conversion element and a sound inlet hole, the vibration sensing device may include a shell physically connected to the vibration component, the shell and a portion of the vibration sensor may form a receiving space for receiving the vibration component. The shell may be used to generate vibrations in response to an external vibration signal. The vibration component may be acoustically connected to the acoustic-to-electric conversion element through the sound inlet hole, for receiving the vibrations generated by the shell and transmitting the vibrations to the acoustic-to-electric conversion element through the sound inlet hole.

[0019] In some embodiments, at least a portion of the plate body may be physically connected to the shell or disposed in the sound inlet hole, and the target cavity may include a cavity defined by at least a portion of the plate body and the shell.

[0020] In some embodiments, the plate body may include a first plate body and a second plate body, at least one of the first plate body and the second plate body may be physically connected to the shell or disposed in the sound inlet hole, and the target cavity may include a cavity defined by at least the first plate body, the second plate body and at least a portion of the shell.

[0021] Additional features will be described in part in the following description and will become apparent to those skilled in the art by reviewing the following and accompanying drawings, or may be learned by the production or operation of the examples. The features of the present invention may be realized and obtained by practicing or using the various aspects of the methods, tools, and combinations described in the following detailed examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present application will be further described in the form of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:

[0023] Figure 1 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0024] Figure 2 is a frequency response curve of an exemplary vibration sensing device according to some embodiments of the present application;

[0025] Figure 3 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0026] Figure 4A is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0027] Figure 4B is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0028] Figure 4C is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0029] Figure 5 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0030] Figure 6 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0031] Figure 7 is a frequency response curve of an exemplary vibration sensing device according to some embodiments of the present application;

[0032] Figure 8 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0033] Fig. 9 is a frequency response curve of an exemplary vibration sensing device according to some embodiments of the present application;

[0034] Fig.10 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0035] Fig.11 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0036] Fig.12 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0037] Fig.13 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0038] Fig.14 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0039] Fig.15 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0040] Fig.16 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0041] Fig.17 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0042] Fig.18 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0043] Fig.19 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0044] Fig. 20 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0045] Fig.21 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application;

[0046] Fig. 22 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application. DETAILED DESCRIPTION

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0048] It should be understood that the "system", "device", "unit" and / or "module" used herein are a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0049] Various terms are used to describe the spatial and functional relationship between elements (e.g., between parts), including "connection", "engagement", "interface" and "coupling". Unless explicitly described as "direct", when describing the relationship between the first and second elements in this application, the relationship includes a direct relationship in which there are no other intermediate elements between the first and second elements, and an indirect relationship in which there are one or more intermediate elements (in space or function) between the first and second elements. In contrast, when an element is referred to as being "directly" connected, engaged, interfaced or coupled to another element, there is no intermediate element. In addition, the spatial and functional relationship between elements can be achieved in various ways. For example, the mechanical connection between two elements can include a welding connection, a key connection, a pin connection, an interference fit connection, etc., or any combination thereof. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between", "between ...", "adjacent" and "directly adjacent", etc.).

[0050] It should be understood that the terms "first", "second", "third", etc. used herein may be used to describe various elements. These are only used to distinguish one element from another element and are not intended to limit the scope of the elements. For example, the first element may also be referred to as the second element, and similarly, the second element may also be referred to as the first element. As shown in the present application and claims, unless the context clearly indicates an exception, the words "one", "a", "a kind" and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "including" and "comprising" only indicate that the steps and elements that have been clearly identified are included, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements. The term "based on" means "based at least in part". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment". The relevant definitions of other terms will be given in the following description. Below, without loss of generality, when describing the vibration-related technology in the present invention, the description of "sensing device" and "sensor" will be adopted. This description is only one form of conduction application. For ordinary technicians in this field, "sensing device" or "sensor" can also be replaced by other similar words, such as "microphone", "microphone", "hydrophone", "transducer", "acoustic-optical modulator", "acoustic-electric conversion device", "accelerometer", etc. For professionals in this field, after understanding the basic principle of the speaker device, it is possible to make various modifications and changes in form and details to the specific methods and steps of implementing the microphone without deviating from this principle. However, these modifications and changes are still within the scope of protection of this application.

[0051] The embodiment of the present application provides a vibration sensing device. The vibration sensing device can generate parameter changes (e.g., deformation, displacement, voltage change, etc.) according to the vibration signal, thereby converting the vibration signal into an electrical signal. The vibration signal may include a sound signal, a mechanical signal (e.g., mechanical vibration), an electrical signal, an optical signal, a thermal signal, etc.

[0052] The vibration sensing device provided in the present application can be applied to various scenarios that require vibration signal pickup and / or detection. For example, the vibration sensing device can be used in a microphone (such as a bone conduction microphone, an air conduction microphone, etc. or a combination thereof) that converts sound vibration signals into electrical signals for transmission. For another example, the vibration sensing device can be used in an accelerometer that converts vibration signals emitted by a measured object into electrical signals for acceleration analysis. For another example, the vibration sensing device can also be applied to vibration sensing devices such as pressure sensing devices, hydrophones, energy harvesters, and gyroscopes.

[0053] In some embodiments, the vibration sensing device may include a vibration sensor and at least one vibration component. The vibration component may transmit the received vibration to the vibration sensor, and the vibration sensor may convert the vibration signal into an electrical signal so that other devices (e.g., a sampling device, a signal processing device, etc.) may process the electrical signal. In some embodiments, the vibration sensor has a first resonant frequency, and the first resonant frequency is related to the structural parameters (e.g., shape, material, structure, etc.) of the vibration sensor itself. In some embodiments, at least one vibration component may be used to form one or more resonant systems, and one of the one or more resonant systems may include a liquid disposed in the target cavity and a plate body constituting a part of the cavity wall of the target cavity. One or more resonant systems may have at least one second resonant frequency. In some embodiments, at least one second resonant frequency may be the same as or different from the first resonant frequency. By adjusting one or more parameters of the vibration sensor and / or the vibration component, the first resonant frequency and the second resonant frequency may be adjusted, so that the sensitivity of the vibration sensing device in different frequency ranges may be adjusted, and the output stability of the vibration sensing device in a certain frequency range may be improved. In addition, the addition of liquid in the target cavity may also improve the anti-collision performance of the vibration sensing device and improve the reliability of the vibration sensing device.

[0054] Figure 1 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Figure 1 As shown, the vibration sensing device 100 may include a vibration sensor 110 and at least one vibration component.

[0055] The vibration sensor 110 may be an energy conversion device that converts a vibration signal into an electrical signal. According to the vibration transmission method, the vibration sensor 110 may include a bone conduction vibration sensor, an air conduction vibration sensor, or a combination thereof. An air conduction vibration sensor refers to a sensor in which vibration is transmitted by conduction through a gas (e.g., air). A bone conduction vibration sensor refers to a sensor in which vibration is transmitted by conduction through a solid (e.g., bone, skin). For the convenience of description, Figure 1-Figure 14 Take the bone conduction vibration sensor as an example for explanation. Figure 15-Figure 22 Take the air conduction vibration sensor as an example for explanation.

[0056] like Figure 1 As shown, the vibration sensor 110 may include a housing 111 , a vibration transmission element 112 , and an acoustic-electric conversion element 113 . The vibration component may include a liquid and a plate 122 .

[0057] In some embodiments, the housing 111 is configured as a hollow structure, which can be used to accommodate other elements of the vibration sensing device 100 (e.g., vibration components, vibration transmission elements 112, acoustic-electric conversion elements 113, etc.). The shape and / or material of the housing 111 can be set according to actual conditions. The shape of the housing 111 can include regular structures such as a cuboid, a cylinder, a truncated cone, or other irregular structures. The material of the housing 111 can include, but is not limited to, one or more of metals, alloy materials, polymer materials (e.g., acrylonitrile-butadiene-styrene copolymers, polyvinyl chloride, polycarbonate, polypropylene, etc.). The housing 111 can be used to generate vibrations in response to external vibration signals. For example, the housing 111 can receive vibration signals transmitted by the human skull. The vibration signal can be transmitted to the vibration transmission element 112 and / or the vibration component (e.g., the plate 122) through the housing 111.

[0058] The vibration transmission element 112 can be configured to transmit a vibration signal. For example, the vibration transmission element 112 can transmit the vibration signal generated by the shell 111 to the sound-to-electric conversion element 113. In some embodiments, the material of the vibration transmission element 112 can include but is not limited to one or more of semiconductor materials (for example, silicon, silicon dioxide, silicon carbide, silicon nitride, etc. or a combination thereof), metal materials, metal alloys, organic materials, etc. In some embodiments, the vibration transmission element 112 can be physically connected to the plate 122, the shell 111, at least a portion of the sound-to-electric conversion element 113, etc. or a combination thereof. For example, Figure 1 As shown in , the vibration transmission element 112 may be disposed in a space formed by the plate 122 and at least a portion of the housing 111. In some embodiments, the vibration transmission element 112 and the plate 122 may define or form a first cavity 121.

[0059] The acoustic-to-electric conversion element 113 may be used to convert the received vibration signal into an electrical signal. In some embodiments, the acoustic-to-electric conversion element 113 may be disposed in the first cavity 121, such as Figure 1As shown. Specifically, one end of the acoustic-to-electric conversion element 113 can be connected to the side wall of the vibration transmission element 112, and the other end of the acoustic-to-electric conversion element 113 can be suspended in the first cavity 121. In some embodiments, the acoustic-to-electric conversion element 113 may include a capacitive acoustic-to-electric conversion element, a piezoelectric acoustic-to-electric conversion element, or the like, or a combination thereof. In some embodiments, the vibration signal transmitted to the acoustic-to-electric conversion element 113 may cause a change in one or more parameters of the acoustic-to-electric conversion element 113 (for example, capacitance, charge, acceleration, light intensity, frequency response, or the like, or a combination thereof), and the changed parameters can be detected using electrical methods and output an electrical signal corresponding to the vibration signal. For example, a piezoelectric acoustic-to-electric conversion element may be an element that converts a change in a measured non-electrical quantity (for example, pressure, displacement, etc.) into a change in voltage. For example, a piezoelectric acoustic-to-electric conversion element may include a cantilever beam structure (or a diaphragm structure), and the cantilever beam structure may be deformed under vibration, and the inverse piezoelectric effect caused by the deformed cantilever beam structure may generate an electrical signal. For another example, a capacitive acoustic-to-electric conversion element may be an element that converts changes in a measured non-electrical quantity (e.g., displacement, pressure, light intensity, acceleration, etc.) into changes in capacitance. For example, the capacitive acoustic-to-electric conversion element may include a first cantilever beam structure and a second cantilever beam structure. When the first cantilever beam structure and the second cantilever beam structure receive the same vibration signal, they may deform to different degrees, thereby changing the spacing between the first cantilever beam structure and the second cantilever beam structure. The first cantilever beam structure and the second cantilever beam structure may convert the change in the spacing between them into a change in capacitance, thereby realizing the conversion of the vibration signal to the electrical signal.

[0060] In some embodiments, the number, type, arrangement, etc. of the acoustic-to-electric conversion elements 113 can be set according to actual needs. For example, the acoustic-to-electric conversion element 113 may include one or more acoustic-to-electric conversion elements, for example, 2, 3, 5, 7, etc. In some embodiments, different acoustic-to-electric conversion elements 113 may have the same or different frequency responses. For example, acoustic-to-electric converters 113 with different frequency responses can detect the same vibration signal, and different acoustic-to-electric conversion elements 113 can generate electrical signals with different resonant frequencies. The electrical signals generated by one or more acoustic-to-electric conversion elements 113 can be transmitted to other elements (for example, sampling elements, signal processing elements, etc.) for further processing. The further processing of the electrical signals generated by one or more acoustic-to-electric conversion elements 113 may include processing of one of the one or more electrical signals or fusing (for example, electrical series connection, electrical parallel connection, etc.) or processing of multiple electrical signals. In some embodiments, the processing of the electrical signal may include sampling processing, gain and / or attenuation processing, phase adjustment processing, filtering processing, etc. or a combination thereof.

[0061] The vibration assembly may include a liquid disposed in a target cavity (e.g., a first cavity 121) and a plate 122 constituting a portion of the cavity wall of the target cavity. The liquid may be selected to have safety properties (e.g., non-flammable and non-explosive) and stability properties (e.g., non-volatile, non-deteriorating at high temperatures, etc.). For example, the liquid may include oil (e.g., silicone oil, glycerin, castor oil, engine oil, lubricating oil, hydraulic oil (e.g., aviation hydraulic oil), etc.), water (e.g., pure water, other inorganic or organic aqueous solutions, etc. (e.g., salt water), oil-water emulsions or other liquids that meet their performance requirements, or a combination of one or more thereof. The plate may be a rigid plate or a flexible plate. A rigid plate refers to a plate whose Young's modulus is greater than a first modulus threshold. A flexible plate refers to a plate whose Young's modulus is less than a second modulus threshold. In some embodiments, the first modulus threshold and / or the second modulus threshold may be set according to actual needs. In some embodiments, the first modulus threshold may be equal to or unequal to the second modulus threshold. For example, the first modulus threshold may be greater than the second modulus threshold. As an example only, the first modulus threshold may be 20 GPa, 30 GPa, 40 GPa, 50 GPa, etc., and the second modulus threshold may be 1 MPa, 10 MPa, 1 GPa, 10 GPa, etc. In some embodiments, the rigid board may include a semiconductor board, a metal board, a metal alloy board, an organic material board (e.g., a polycarbonate board, a polyvinyl chloride board), etc., or other boards that can play a role in strength support. In some embodiments, the flexible board may include a polymer elastic film such as a polytetrafluoroethylene (PTFE) film, a polydimethylsiloxane (PDMS) film, or a composite film (e.g., a plastic film (such as polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), and polyester (PET), etc.), polyimide (PI), cellophane, silicon film, paper, and / or a metal foil composite film). In some embodiments, the rigid board is not affected by the received vibration signal or is slightly affected, that is, the rigid board does not vibrate or the vibration generated is negligible under the action of the received vibration signal. In some embodiments, the flexible board is easily affected by the received vibration signal, that is, the flexible board can generate corresponding vibration or deformation under the action of the received vibration signal. In some embodiments, the number and / or type of the board body 122 in the vibration sensing device 100 can be set according to actual needs. For example, the board body 122 can include a rigid board and a flexible board. For another example, Figure 1 As shown in , the board body 122 may include two flexible boards (eg, a first board body 1221 and a second board body 1222). For another example, the board body 122 may include two rigid boards.

[0062] In some embodiments, the plate body 122 may include a first plate body 1221 and a second plate body 1222. The first plate body 1221 and the second plate body 1222 may divide the space in the shell 111 into a plurality of cavities, for example, a first cavity 121, a second cavity 123 and a third cavity 125. The first cavity 121 may be defined by the first plate body 1221, the second plate body 1222 and the vibration transmitting element 112. The second cavity 123 may be defined by the first plate body 1221 and a portion of the shell 111. The third cavity 125 may be defined by the second plate body 1222 and a portion of the shell 111. In some embodiments, the acoustic-to-electric conversion element 113 may be disposed in the first cavity 121. In some embodiments, the target cavity refers to a cavity filled with liquid among the plurality of cavities in the shell 111. For example, Figure 1 As shown, when the liquid is filled in the first cavity 121, the target cavity may be the first cavity 121. For another example, Figure 11-13 As shown, when the liquid is filled in the second cavity, the target cavity may be the second cavity. Fig.14 As shown, when the liquid is filled in the second cavity and the third cavity, the target cavity may be the second cavity and the third cavity.

[0063] In some embodiments, when the vibration sensing device 100 is used to pick up or detect vibration, an external vibration signal can be transmitted to the vibration sensor 110. Specifically, the housing 111 can transmit the received vibration signal to the vibration transmission element 112. The vibration transmission element 112 further transmits the vibration signal to the acoustic-to-electric conversion element 113. In some embodiments, the vibration sensor 110 has a first resonant frequency, which means that the acoustic-to-electric conversion element 113 will resonate under the action of the vibration signal at the first resonant frequency, and the acoustic-to-electric conversion element 113 can make the frequency response curve of the vibration sensing device 100 have a resonance peak at the first resonant frequency. At the same time, the external vibration signal can be transmitted to the vibration component through the housing 111 and / or the vibration transmission element 112, and the vibration component can transmit the vibration signal to the acoustic-to-electric conversion element 113. The acoustic-to-electric conversion element 113 can generate an electrical signal after receiving the vibration signal transmitted through the vibration transmission element 112 and the vibration component. The vibration component can be used to form one or more resonant systems. One of the one or more resonant systems can be composed of a liquid in the target cavity and the plate 122. In some embodiments, the resonant system can be represented as a spring-mass system. The liquid can be used as a mass block of the resonance system to provide system mass for the resonance system, and the plate 122 (for example, a flexible plate) can be used as a spring to provide system stiffness for the resonance system. The vibration component is used to receive the vibration of at least one of the shell or the vibration transmission element and transmit it to the acoustic-to-electric conversion element 113. In some embodiments, the vibration component can provide one or more second resonant frequencies for the vibration sensing device, which means that the vibration sensing device 100 will resonate under the action of the vibration signal at the second resonant frequency, thereby generating a resonant peak at the second resonant frequency, that is, at the second resonant frequency, the vibration component can make the frequency response curve of the vibration sensing device 100 have a resonant peak at the second resonant frequency, thereby improving the sensitivity of the vibration sensing device 100 within a certain frequency band including the second resonant frequency. In some embodiments, the second resonant frequency can be the same as or different from the first resonant frequency, that is, the acoustic-to-electric conversion element 113 has the same or different frequency response to the vibration transmitted by the vibration transmission element 112 and the vibration transmitted by the vibration component. In some embodiments, the second resonant frequency can be less than the first resonant frequency.

[0064] In some embodiments, other cavities (e.g., the second cavity 123, the third cavity 125, etc.) in the plurality of cavities except the target cavity may be vacuum or filled with gas (e.g., air, oxygen, nitrogen, inert gas, etc.). For example, the second cavity 123 and / or the third cavity 125 may be filled with gas. In some embodiments, when other cavities in the plurality of cavities except the target cavity are vacuum cavities or include a small amount of gas, the vacuum cavity or the cavity including a small amount of gas has a small effect on the deformation and / or displacement of the plate 122 caused by vibration, and therefore, the vacuum cavity or the cavity including a small amount of gas has a negligible effect on the mechanical resonance system. In some embodiments, when other cavities in the plurality of cavities except the target cavity contain gas (e.g., gas with a relatively atmospheric pressure), the vibration assembly may include the gas contained in the cavity. For example, the gas in the second cavity 123 and / or the third cavity 125 may be used as a spring of the resonance system with the first plate 1221 and / or the second plate 1222, respectively, to provide system stiffness for the resonance system.

[0065] In some embodiments, the gas volume or air pressure contained in other cavities can be adjusted so that the gas in other cavities can mechanically affect the resonant system, and the gas in other cavities can be used as part of the vibration component to provide stiffness for the resonant system. That is to say, the gas in other cavities can vibrate under the action of the received vibration signal, thereby causing the first plate 1221 and / or the second plate 1222 to vibrate. In some embodiments, the stiffness provided by the gas in other cavities to the resonant system is related to the volume, pressure, etc. of the gas. For example, the system stiffness provided by the gas to the resonant system can be increased by adopting and / or designing a larger gas pressure (for example, greater than 1.0×10^5Pa), reducing the volume of other cavities, etc., or a combination thereof. In some embodiments, the ratio of the stiffness provided by the gas in other cavities to the vibration component to the stiffness provided by the plate 122 to the vibration component can be in the range of 0.1-10. In some embodiments, the ratio of the stiffness provided by the gas in other cavities to the vibration component to the stiffness provided by the plate 122 to the vibration component can be in the range of 0.1-1. In some embodiments, the ratio of the stiffness provided by the gas in other cavities to the vibration assembly to the stiffness provided by the plate 122 to the vibration assembly can be in the range of 1-5. In some embodiments, the ratio of the stiffness provided by the gas in other cavities to the stiffness provided by the plate 122 to the vibration assembly can be in the range of 5-8. In some embodiments, the ratio of the stiffness provided by the gas in other cavities to the stiffness provided by the plate 122 to the vibration assembly can be in the range of 8-10. For the influence of the vibration assembly on the frequency response curve of the vibration sensor device 100, please refer to Figure 2 and its related description.

[0066] Figure 2is a frequency response curve of an exemplary vibration sensor device according to some embodiments of the present application. Figure 2 As shown, the frequency response curve 2110 represented by the dotted line is the frequency response curve of the vibration sensor (e.g., vibration sensor 110), that is, the frequency response curve when the vibration sensing device (e.g., vibration sensing device 100) does not have a vibration component. The frequency response curve 2120 represented by the solid line is the frequency response curve of the vibration sensing device (e.g., vibration sensing device 100), that is, the frequency response curve when the vibration sensing device (e.g., vibration sensing device 100) has a vibration component. The horizontal axis represents the frequency, the unit is Hertz (Hz), and the vertical axis represents the sensitivity, the unit is decibel volt (dBV).

[0067] When the frequency response curve 2110 is at the frequency f 0 There is a resonance peak at the frequency f 0 It can be called the resonant frequency of the vibration sensor (also called the first resonant frequency). At the frequency f of the frequency response curve 2120 1 At this point, the vibration component resonates under the action of the received vibration signal, causing the vibration signal to contain a frequency f 1 The frequency band signal or frequency component is amplified, and the resonant frequency f 1 It can be called the resonant frequency or resonance frequency of the vibration component (it can also be called the second resonant frequency). In some embodiments, the first resonant frequency is related to the structural parameters of the vibration sensor. The structural parameters of the vibration sensor may include the size, structure, stiffness, etc. of the shell (for example, shell 111) and / or the vibration element (for example, vibration element 112), the size, mass, etc. of the acoustic-to-electric conversion element (for example, acoustic-to-electric conversion element 113). The second resonant frequency is related to the structural parameters of the vibration component. The structural parameters of the vibration component may include the type and mass of the liquid, the material, size, elastic coefficient, damping, etc. of the plate. The second resonant frequency can be expressed by formula (1):

[0068]

[0069] Wherein, f is the second resonant frequency, K is the system stiffness of the resonant system, and m is the system mass of the resonant system.

[0070] In some embodiments, the system stiffness K of the resonant system can be provided by a plate (e.g., a flexible plate), and the system mass can be provided by the liquid in the target cavity. In some embodiments, the system stiffness K of the resonant system can be provided by a vibration pickup element (e.g., Figure 8 , Fig.10 The vibration pickup element 823 in Fig.11 The vibration pickup element 1123, Fig.12 The vibration pickup element 1223, Fig.13 or Fig.14 The system mass m of the resonant system can be provided by liquid and / or other elements (for example, a plate, a vibration transmission element, an acoustic-electric conversion element, an adjustment element, a support element, etc. or a combination thereof). For details about the resonant system, see Figure 1 as well as Figure 3-22 and its related description.

[0071] In some embodiments, the second resonant frequency of the vibration sensor device and / or the difference between the first resonant frequency and the second resonant frequency (for example, Figure 2 f), the desired or ideal frequency response of the vibration sensor device is obtained. For example, the second resonant frequency of the vibration sensor device can be reduced by selecting a plate with a relatively large elastic coefficient, increasing the contact area between the plate and the liquid, increasing the mass of the liquid, etc., or a combination thereof. For another example, the second resonant frequency of the vibration sensor device can be increased by selecting a plate with a relatively small elastic coefficient, reducing the contact area between the plate and the liquid, reducing the mass of the liquid, etc., or a combination thereof.

[0072] In some embodiments, the second resonant frequency f 1 With the first resonant frequency f 0 can be the same or different. Figure 2 As shown, the second resonant frequency f 1 Can be less than the first resonant frequency f 0 , thereby improving the sensitivity of the vibration sensor device in a relatively low frequency range (for example, a medium and low frequency band). For another example, the second resonant frequency f 1 can be equal to (or approximately equal to) the first resonant frequency f 0 , thereby improving the vibration sensor device in a specific frequency range (for example, including the first resonant frequency f 0 For example, the second resonant frequency f 1 Can be greater than the first resonant frequency f 0 , thereby improving the sensitivity of the vibration sensing device in a relatively high frequency range.

[0073] In some embodiments, the vibration component provides at least one second resonant frequency for the vibration sensor device, which can improve the sensitivity of the frequency response of the vibration sensor device within a specific frequency range, making the frequency response curve flatter within a relatively wide frequency range. Figure 2As shown, the difference between the peak and the trough of the frequency response of the vibration sensor can be represented by (△V1+△V2). After the introduction of the second resonant frequency (that is, after having the vibration component), the difference between the peak and the trough of the frequency response of the vibration sensor device can be represented by △V2, and △V2 is less than (△V1+△V2), that is to say, the second resonant frequency provided by the vibration component makes the frequency response curve of the vibration sensor device flatter, and has higher sensitivity and more stability in a relatively wide frequency range. In some embodiments, after the introduction of the second resonant frequency, the difference between the peak and the trough of the frequency response curve of the vibration sensor device can be in the range of 5dBV to 15dBV. In some embodiments, after the introduction of the second resonant frequency, the difference between the peak and the trough of the frequency response curve of the vibration sensor device can be in the range of 5dBV to 10dBV. In some embodiments, after the introduction of the second resonant frequency, the difference between the peak and the trough of the frequency response curve of the vibration sensor device can be in the range of 10dBV to 15dBV. In some embodiments, after the second resonant frequency is introduced, the absolute value of the difference (for example, △V1) between the difference △V2 between the peak and the trough of the frequency response curve of the vibration sensing device and the difference (△V1+△V2) between the peak and the trough of the frequency response of the vibration sensor may range from 15dBV to 40dBV. In some embodiments, after the second resonant frequency is introduced, the absolute value of the difference (for example, △V1) between the difference △V2 between the peak and the trough of the frequency response curve of the vibration sensing device and the difference (△V1+△V2) between the peak and the trough of the frequency response of the vibration sensor may range from 15dBV to 20dBV. In some embodiments, after the second resonant frequency is introduced, the absolute value of the difference (for example, △V2) between the difference △V2 between the peak and the trough of the frequency response of the vibration sensing device and the difference (△V1+△V2) between the peak and the trough of the frequency response of the vibration sensor may range from 20dBV to 30dBV. In some embodiments, after the second resonant frequency is introduced, the absolute value of the difference (for example, △V1) between the difference △V2 between the peak and the trough of the frequency response curve of the vibration sensing device and the difference (△V1+△V2) between the peak and the trough of the frequency response of the vibration sensor can range from 30dBV to 35dBV.

[0074] Figure 3 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Figure 3 As shown, the vibration sensing device 300 may include a shell 311 , a vibration transmission element 312 , an acoustic-to-electric conversion element 313 , a first cavity 321 , a second cavity 323 , a third cavity 325 , and a plate 322 . Figure 3 One or more elements of the vibration sensing device 300 may be connected to Figure 1One or more elements of the vibration sensor device 100 in the embodiment are the same or similar. For example, the housing 311, the vibration transmission element 312, the acoustic-to-electric conversion element 313, the first cavity 321, the second cavity 323, the third cavity 325, etc. in the vibration sensor device 300 may be the same or similar to the housing 111, the vibration transmission element 112, the acoustic-to-electric conversion element 113, the first cavity 121, the second cavity 123, the third cavity 125, etc. in the vibration sensor device 100, respectively.

[0075] Figure 3 The vibration sensor device 300 shown is Figure 1 The difference between the vibration sensing device 100 shown is that the first plate 1221 and the second plate 1222 in the vibration sensing device 100 are flexible plates, and one of the first plate 3221 and the second plate 3222 in the vibration sensing device 300 is a flexible plate and the other is a rigid plate. The first plate 3221 is a flexible plate and the second plate 3222 is a rigid plate as an example for description.

[0076] In the vibration sensing device 300, the vibration component may include a liquid filled in the first cavity 321 (i.e., the target cavity), a first plate 3221, and a second plate 3222. In the resonance system formed by the vibration component, the liquid in the first cavity 321 may provide system mass, and the first plate 3221 and / or the second plate 3222 may provide system stiffness. Compared with the resonance system provided by the vibration component of the vibration sensing device 100, since the second plate 3222 is a rigid plate, the system stiffness provided by the first plate 3221 and the second plate 3222 in the vibration sensing device 300 may be greater than the system stiffness provided by the first plate 1221 and the second plate 1222 in the vibration sensing device 100. When other conditions (e.g., the mass of the liquid) are the same, according to formula (1), it can be seen that the second resonance frequency of the vibration sensing device 300 may be greater than the second resonance frequency of the vibration sensing device 100. In this embodiment, the second resonant frequency of the resonant system provided by the vibration component can be adjusted by setting the type of the plate and / or the structural parameters of the plate (for example, the size of the elastic modulus), thereby obtaining a desired or ideal frequency response curve.

[0077] Figure 4A 4 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application. The vibration sensing device 400 may include a housing 411, a vibration transmission element 412, an acoustic-electric conversion element 413, a plate 422, a first cavity 430 (i.e., a target cavity), a second cavity 423, and a third cavity 425. One or more elements in the vibration sensing device 400 may be connected to Figure 1 One or more components of the vibration sensing device 100 shown are the same or similar. For example, Figure 4AThe housing 411, the acoustic-electric conversion element 413, the vibration transmission element 412, the plate 422, etc. in the vibration sensor device 400 shown in FIG. Figure 1 The housing 111 , the acoustic-to-electric conversion element 113 , the vibration transmission element 112 , the plate 122 , etc. in the vibration sensor device 100 are the same or similar.

[0078] Figure 4A The vibration sensing device 400 shown in FIG. Figure 1 The difference of the vibration sensing device 100 shown includes that the vibration sensing device 400 may further include an adjustment element 460. In some embodiments, the adjustment element 460 may be disposed in the target cavity 430. In some embodiments, the adjustment element 460 may divide the target cavity 430 into a first target cavity 432 and a second target cavity 434. The first target cavity 432 may also be referred to as a first sub-cavity, and the second target cavity 434 may also be referred to as a second sub-cavity. The first target cavity 432 and / or the second target cavity 434 may be filled with liquid. The first target cavity 432 and the second target cavity 434 may be connected or not connected. For example, as Figure 4A As shown, the target cavity 430 may include a first cavity defined by a first plate 4221, a second plate 4222, and a vibration transmission element 412. The adjustment element 460 may be disposed in the target cavity 430, and physically connected to the first plate 4221 and the second plate 4222, respectively, and the first target cavity 432 and the second target cavity 434 are not connected. For another example, the adjustment element 460 may be disposed in the target cavity 430, and physically connected to one of the first plate 4221 or the second plate 4222 defining the target cavity 430, and the first target cavity 432 and the second target cavity 434 may be connected to each other. For another example, the adjustment element 460 may be disposed in the target cavity 430, and not connected to the first plate 4221 and the second plate 4222, and the first target cavity 432 and the second target cavity 434 may be connected to each other.

[0079] In some embodiments, the adjustment element 460 can be used to define the size of the target cavity 430. In some embodiments, the size of the target cavity 430 (e.g., the first target cavity 432 and the second target cavity 434) can be set and / or adjusted by setting the position, size, quantity and other parameters of the adjustment element 460. As an example only, when the length and height of the adjustment element 460 remain unchanged, the size of the target cavity 430 can be set and / or adjusted by setting and / or adjusting the width of the adjustment element 460. In some embodiments, during the use of the vibration sensor device 400, the position, size, quantity and other parameters of the adjustment element 460 are not adjustable. In some embodiments, during the use of the vibration sensor device 400, the position, size, quantity and other parameters of the adjustment element 460 are adjustable, so that the position, size, quantity and other parameters of the adjustment element 460 can be adjusted during use to adjust the size of the target cavity 430 (e.g., the first target cavity 432 and the second target cavity 434), thereby adjusting the resonant frequency (i.e., the second resonant frequency) of the resonant system of the vibration sensor device 400. For a detailed description, please refer to Figure 6 The regulating element 660 in.

[0080] The shape, size, material and other parameters of the regulating element 460 can be determined according to actual needs. In some embodiments, the shape of the regulating element 460 can include a cylinder, a prism or other regular or irregular shapes. In some embodiments, the material of the regulating element 460 can include but is not limited to one or more of semiconductor materials, metal materials, metal alloys, organic materials, etc. In some embodiments, the regulating element 460 can be made of corrosion-resistant waterproof materials, such as polyimide, parylene, etc.

[0081] In some embodiments, when the first target cavity 432 and the second target cavity 434 are connected to each other, the plate 422 and the liquid in the target cavity 430 can form a resonant system. Figure 1 Compared with the resonant system composed of the plate 122 and the liquid in the target cavity 121, under the same other conditions (for example, liquid type, target cavity volume, etc.), due to the provision of the adjustment element 460, Figure 4A The system stiffness provided by the plate 422 for the resonance system can be greater than the system stiffness provided by the plate 122 for the resonance system, and the system mass provided by the liquid in the target cavity 430 for the resonance system is less than the mass provided by the liquid in the target cavity 121 for the resonance frequency. According to formula (1), the resonance frequency (i.e., the second resonance frequency) of the resonance system of the vibration sensing device 400 can be greater than the resonance frequency (i.e., the second resonance frequency) of the resonance system of the vibration sensing device 100.

[0082] It should be noted that, in some embodiments, the first target cavity 432 and the second target cavity 434 may not be connected. When the first target cavity 432 and the second target cavity 434 are not connected, the plate 422 and the liquid in the first target cavity 432 may form a first resonance system, and the plate 422 and the liquid in the second target cavity 434 may form a second resonance system. In some embodiments, under the same other conditions (for example, the liquid type, density, viscosity, volume and other parameters in the first target cavity 432 and the second target cavity 434 are the same), the resonance frequency of the first resonance frequency system and the second resonance system may be the same, so that the sensitivity and Q value of the vibration sensing device 400 at the resonance frequency of the first resonance frequency system and / or the second resonance system can be improved. In some embodiments, by setting different conditions (for example, designing parameters such as the liquid type, density, viscosity, volume, etc. in the first target cavity 432 and the second target cavity 434), the resonant frequencies of the first resonant frequency system and the second resonant system can be made different, thereby improving the sensitivity of the vibration sensing device 400 at different resonant frequencies of the first resonant frequency system and the second resonant system, and further improving the sensitivity of the vibration sensing device 400 in a relatively wide frequency range.

[0083] When the first target cavity 432 and the second target cavity 434 are not connected, and the first target cavity 432 and the second target cavity 434 are filled with the same liquid and have different sizes, the plate 422 can form a first resonant system with the liquid in the first target cavity 432, and form a second resonant system with the liquid in the second target cavity 434. The resonant frequencies of the first resonant frequency system and the second resonant system can be different. For example, when the adjustment element 460 is arranged along the central axis Z of the vibration sensor device 400 toward the direction of the first target cavity 432, the system mass of the first resonant system is less than the system mass of the second resonant system, so that the resonant frequency of the first resonant system is greater than the resonant frequency of the second resonant system. By setting the adjustment element 460, the number of resonant systems in the vibration sensor device 400 can be increased and / or the resonant frequency of the resonant system can be adjusted, thereby improving the sensitivity or reliability of the resonant system in a specific frequency range (e.g., medium and low frequencies), so that the frequency response curve of the vibration sensor device 400 is more stable in the desired frequency band.

[0084] Figure 4B is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Figure 4B As shown, the vibration sensing device 420 may include a shell 411, a vibration transmission element 412, an acoustic-to-electric conversion element 413, a plate 422, a first cavity 430 (ie, a target cavity), a second cavity 423, a third cavity 425 and an adjustment element 460.

[0085] Figure 4BThe vibration sensing device 420 shown is Figure 4A The difference of the vibration sensing device 400 shown includes that the adjustment element 460 may include a first adjustment element 461 and a second adjustment element 462. The first adjustment element 461 and the second adjustment element 462 may divide the space in the target cavity 430 into a plurality of cavities, for example, a first target cavity 432, a second target cavity 434, and a third target cavity 436. The plurality of target cavities may be filled with liquid, gas, solid, or a combination thereof. For example, the first target cavity 432 and the second target cavity 434 may be filled with liquid, and the third target cavity 436 may be a vacuum or filled with gas (for example, air, oxygen, nitrogen, etc.).

[0086] The first adjustment element 461 and the second adjustment element 462 can be configured to limit the size of the first target cavity 432 and the second target cavity 434 respectively by adjusting their own positions or sizes, so as to adjust the resonant frequency of the resonant system formed by the plate 422 and the liquid in the first target cavity 432 and / or the resonant frequency of the resonant system formed by the plate 422 and the liquid in the second target cavity 434. The third cavity 436 is set to be vacuum or filled with gas, which can facilitate the adjustment and / or movement of the first adjustment element 461 and the second adjustment element 462, and at the same time can reduce the quality of the vibration sensor device 420 and improve the user experience. Among them, the first target cavity 432 or the second target cavity 434 can also be called a first sub-cavity, and the third target cavity 436 can also be called a second sub-cavity.

[0087] Figure 4C is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Figure 4C As shown, the vibration sensor device 440 may include a housing 411, a vibration transmission element 412, an acoustic-electric conversion element 413, a plate 422, a first cavity 430 (i.e., a target cavity), a second cavity 423, a third cavity 425, and an adjustment element 460. The first cavity 430 may include a first target cavity 432, a second target cavity 434, and a third target cavity 436.

[0088] Figure 4C The vibration sensing device 440 is shown with Figure 4B The differences in the vibration sensing device 420 shown include Figure 4B The acoustic-to-electric conversion element 413 of the vibration sensor device 420 shown can be a piezoelectric acoustic-to-electric conversion element, including a cantilever beam structure (or a diaphragm structure). The cantilever beam structure can be deformed under vibration, and the inverse piezoelectric effect caused by the deformed cantilever beam structure can generate an electrical signal. Figure 4CThe acoustic-to-electric conversion element 413 in the vibration sensor device 440 shown can be a capacitive acoustic-to-electric conversion element. The acoustic-to-electric conversion element 413 includes a first cantilever beam structure 4131 and a second cantilever beam structure 4132. In some embodiments, the first cantilever beam structure 4131 and the second cantilever beam structure 4132 can be arranged relative to each other, that is, the first cantilever beam structure 4131 and the second cantilever beam structure 4132 have a directly facing area. For example, the lower surface of the first cantilever beam structure 4131 is opposite to the entire or partial area of ​​the upper surface of the second cantilever beam structure 4132. In some embodiments, the first cantilever beam structure 4131 and the second cantilever beam structure 4132 can produce different degrees of deformation when receiving the same vibration from the vibration transmission element 412 or the first target cavity 432 or the second target cavity 434 at the same time, so that the spacing between the first cantilever beam structure 4131 and the second cantilever beam structure 4132 changes. The first cantilever beam structure 4131 and the second cantilever beam structure 4132 can convert the change of the distance therebetween into the change of capacitance, thereby realizing the conversion of the vibration signal into the electrical signal.

[0089] In some embodiments, plate 422 and the liquid filled in first target cavity 432 and / or plate 422 and the liquid filled in second target cavity 434 may constitute a vibration assembly to provide one or more second resonant frequencies for vibration sensing device 440 .

[0090] In some embodiments, the type, position, quantity, material, etc. of the acoustic-to-electric conversion element 413 can be set according to actual needs. For example, acoustic-to-electric conversion elements 413 (first cantilever beam structure 4131 and second cantilever beam structure 4132) of different lengths can be set so that acoustic-to-electric conversion elements of different lengths have the same or different resonant frequencies. For another example, different numbers of acoustic-to-electric conversion elements 413 can be set on the inner wall of the target cavity 430 or on the side wall of the target cavity 430 where the vibration transmission element 412 is located. For another example, the spacing between the first cantilever beam 4131 and the second cantilever beam 4132 in the acoustic-to-electric conversion element 413 can be set according to needs (for example, the desired or ideal second resonant frequency), so that the signal-to-noise ratio of the microphone 400 can be improved by setting the acoustic-to-electric conversion element 413, thereby obtaining a flatter frequency response curve. Such variations are all within the scope of protection of the present application.

[0091] Figure 5 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Figure 5 As shown, the vibration sensor device 500 may include a vibration sensor 510, a plate 522, a first cavity 521, a second cavity 523 and a third cavity 525. The vibration sensor 510 may include a housing 511, a vibration transmission element 512 and an acoustic-electric conversion element 513.

[0092] Figure 5 One or more of the components of the vibration sensing device 500 shown in FIG. Figure 1 100. For example, the housing 511, the vibration transmission element 512, the acoustic-to-electric conversion element 513, the plate 522, the plate 522, etc. in the vibration sensor 510 in the vibration sensor device 500 may be the same as or similar to the housing 111, the vibration transmission element 112, the acoustic-to-electric conversion element 113, the plate 122, etc. in the vibration sensor 110, respectively.

[0093] Figure 5 The vibration sensing device 500 shown in FIG. Figure 1 The difference of the vibration sensing device 100 shown includes that the target cavity 521 (i.e., the first cavity 521) of the vibration sensing device 500 may include a first sub-cavity and a second sub-cavity. The first sub-cavity may be used to contain liquid, and the second sub-cavity may be used to contain one or more of gas, liquid, and fixed. The first sub-cavity may be the remaining space in the target cavity except the space occupied by the second sub-cavity. In some embodiments, the second sub-cavity may include one or more sub-cavities 572 defined by an elastic membrane 571. In some embodiments, the sub-cavity 572 may be a closed cavity defined by the elastic membrane 571. In some embodiments, the elastic membrane 571 may define structural parameters such as the size and shape of the sub-cavity 572. For example, the larger the area of ​​the elastic membrane 571, the larger the volume of the sub-cavity 572, and the more fillers that can be accommodated. For another example, if the closed elastic membrane 571 constitutes a sphere, the shape of the sub-cavity 572 is a sphere. In some embodiments, the shape of the sub-cavity 572 includes, but is not limited to, a sphere, a prism, a cone, an ellipsoid, and the like. The material of the elastic membrane 571 may be the same as or different from that of the plate 522. In some embodiments, the elastic membrane 571 may include a thin film material (e.g., polyester film, nylon film, plastic film, composite film, etc. or a combination thereof. The size and shape of the elastic membrane 571 may be set according to actual conditions (e.g., the required volume of the subcavity 572, the shape of the subcavity 572, the position of the subcavity 572, etc.). In some embodiments, the elastic membrane 571 may also be an interface between liquid and gas, without the need to add other materials. In some embodiments, when there are multiple subcavities 572, the structural parameters (such as size, shape, etc.) of different subcavities 572 may be the same or different. In some embodiments, the subcavity 572 may be formed by air that has not been discharged from the target cavity. For example, when the amount of filling liquid is less than the volume of the target cavity, bubbles will remain in the target cavity. In some embodiments, the subcavity 572 may also be formed by providing a hydrophobic material on the inner surface of the target cavity or the surface of its internal components. The subcavity 572 is attached to the surface of the hydrophobic material. For example, a super-hydrophobic coating may be provided on a partial area of ​​the inner surface of the target cavity 521 or a partial surface of its internal components.

[0094] In some embodiments, a filler is contained in the subcavity 572. The filler contained in the subcavity 572 can be used to maintain the shape of the subcavity 572. The filler may include one or more of a solid, a gas, and a liquid. In some embodiments, the solid may include a flexible solid (e.g., a resin, a fiber, etc.), a compressible solid (e.g., a sponge, a foam plastic, etc.), a granular solid, etc., or other solids that meet its performance requirements, or a combination of one or more thereof. In some embodiments, the liquid may include oil (e.g., silicone oil, glycerin, lubricating oil, etc.), water (e.g., pure water, other inorganic or organic aqueous solutions, etc. (e.g., salt water)), an oil-water emulsion, or other liquids that meet its performance requirements, or a combination of one or more thereof. In some embodiments, the gas may include oxygen, water vapor, carbon dioxide, a refrigerant, etc., an inert gas (e.g., helium, neon, argon, etc.) or other gases that meet its performance requirements, or a combination of one or more thereof.

[0095] In some embodiments, the filler can be compressed to a certain extent. For example, the subcavity 572 is filled with liquid and gas. When the subcavity 572 is compressed and deformed, the volume of the gas can be compressed and reduced, and the liquid will also deform with the deformation of the subcavity 572. In some embodiments, the fillers in different subcavities 572 can be the same or different.

[0096] The sub-cavity 572 in the target cavity 521 has a certain volume. For example, the ratio of the volume of the sub-cavity to the volume of the target cavity or the liquid can be, for example, any value in the range of 5% to 95%. As an example only, the ratio of the volume of the sub-cavity 572 to the volume of the liquid can be 5%-90%. In some embodiments, the ratio of the volume of the sub-cavity 572 to the volume of the liquid can be 10%-80%. In some embodiments, the ratio of the volume of the sub-cavity 572 to the volume of the liquid can be 20%-60%. In some embodiments, the ratio of the volume of the sub-cavity 572 to the volume of the liquid can be 30%-50%. The number of sub-cavities 572 can be set according to actual conditions, for example, 1, 2, 3, 4 or more.

[0097] In some embodiments, the elastic membrane 571, the sub-cavity 572 and the filler contained in the sub-cavity can be regarded as an elastic whole, which can be deformed when subjected to pressure, such as the vibration signal transmitted by the liquid can compress the elastic whole, causing the elastic membrane 571, the sub-cavity 572 and the filler contained in the sub-cavity to deform and / or displace. The plate body 5221, the plate body 5222, the sub-cavity 572 and its filler and the liquid filled in the first sub-cavity can constitute a vibration component to provide a second resonance system for the vibration sensing device 500. Among them, the plate body 5221, the plate body 5222, the sub-cavity 572 and its filler can be used as a spring of the resonance system to provide system stiffness for the resonance system, and the liquid filled in the first sub-cavity of the target cavity 521 can be used as a mass block of the resonance system to provide system mass for the resonance system. Compared with the vibration sensor device 100 filled with liquid, the vibration sensor device 500 filled with liquid and sub-cavity 572 may have excessive stiffness and excessive damping, which affects the sensitivity of the sensor device 100, because the liquid in the target cavity 521 (e.g., the first sub-cavity) in the vibration sensor device 100 is incompressible. Since the second sub-cavity (e.g., sub-cavity 572) in the target cavity 521 in the vibration sensor device 500 is compressible and has low stiffness, the equivalent stiffness of the plate 522 and the sub-cavity 572 is small, and the second resonant frequency provided by the vibration component to the vibration sensor device 500 can be lower than the second resonant frequency of the vibration sensor device 100. By setting a sub-cavity (e.g., sub-cavity 572) in the target cavity 521, a lower second resonant frequency can be provided for the vibration sensor device 100, and the frequency response of the vibration sensor device 500 can be effectively controlled, thereby improving the overall sensitivity of the vibration sensor device 500, and the frequency response curve is relatively flat, and the effective bandwidth (satisfying the flat frequency response condition) can cover a larger range. In some embodiments, by adjusting the ratio of the volume of the sub-cavity to the volume of the liquid in the vibration sensor device 500, the position of the second resonant frequency of the vibration sensor device 500 can be adjusted, thereby optimizing the frequency response curve of the vibration sensor device 500 to make it flatter.

[0098] Figure 6 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Figure 6 As shown, the vibration sensor device 600 may include a vibration sensor 610, a plate 622, a first cavity 621 (also referred to as a target cavity), a second cavity 623 and a third cavity 625. The vibration sensor 610 may include a housing 611, a vibration transmission element 612 and an acoustic-electric conversion element 613.

[0099] Figure 6One or more elements in the vibration sensing device 600 shown in the figure may be the same as or similar to one or more elements in the vibration sensing device 500. For example, the housing 611, the vibration transmission element 612, the acoustic-to-electric conversion element 613, the plate 622, the elastic membrane 671, the sub-cavity 672, etc. in the vibration sensing device 600 may be the same as or similar to the housing 511, the vibration transmission element 512, the acoustic-to-electric conversion element 513, the plate 522, the elastic membrane 571, the sub-cavity 572, etc. in the vibration sensing device 500, respectively.

[0100] In some embodiments, Figure 6 The vibration sensing device 600 shown in FIG. Figure 5 The difference of the vibration sensing device 500 shown in the figure includes that the vibration sensing device 600 may include an adjustment element 660. The adjustment element 660 is disposed in the target cavity 621 or is used to constitute a part of the cavity wall of the target cavity, and is used to define and / or adjust the size of the target cavity 621. In some embodiments, the adjustment element 660 may include a first adjustment element 661 and a second adjustment element 662. The first adjustment element 661 and the second adjustment element 662 may divide the target cavity 621 into a first target cavity 6212 and a second target cavity 6214. The first target cavity 6212 may be defined by a part of the first plate 6221, a part of the second plate 6222, the first adjustment element 661, and the vibration transmission element 612. The second target cavity 6214 may be defined by a part of the first plate 6221, a part of the second plate 6222, the second adjustment element 662, and the vibration transmission element 612. In some embodiments, when the first adjustment element 661 and the second adjustment element 662 are separated, a cavity 6216 may be formed. The cavity 6216 may be defined by a portion of the first plate 6221, a portion of the second plate 6222, the first adjustment element 661, and the second adjustment element 662. The first target cavity 6212 and / or the second target cavity 6214 are filled with liquid and / or provided with a subcavity 672. The cavity 6216 is vacuum or filled with gas.

[0101] In some embodiments, the size of the first target cavity 6212 and the second target cavity 6214 defined by the adjustment element 660 (e.g., the first adjustment element 661 and / or the second adjustment element) can be predetermined, for example, determined during the production or assembly process of the vibration sensing device 600. Due to the compressibility of the subcavity 672, in some embodiments, the position of the adjustment element 660 can be adjusted during the production, assembly process or after the assembly of the vibration sensing device 600 to adjust the size of the first target cavity 6212 and the second target cavity 6214. For example, the size of the first target cavity 6212 and / or the second target cavity 6214 can be adjusted by adjusting the transverse dimension W between the first adjustment element 661 and the second adjustment element 662 (that is, the cavity 6216) along the X-axis direction. As an example only, the vibration sensing device 600 may include a circuit driving element, which is connected to the first adjusting element 661 and / or the second adjusting element 662, and the circuit driving element may be used to drive the first adjusting element 661 and / or the second adjusting element 662 to move (for example, along the X-axis direction) to adjust the lateral dimension W between the first adjusting element 661 and the second adjusting element 662 along the X-axis direction, thereby adjusting the size of the first target cavity 6212 and / or the second target cavity 6214. The circuit driving element may be configured as an element that drives other elements (for example, the first adjusting element 661, the second adjusting element 662, etc.) to move. In some embodiments, the circuit driving element may adopt one or more driving modes such as piezoelectric driving, electrostatic driving, and electromagnetic driving.

[0102] It should be noted that, since the compressibility of the sub-cavity 672 defined by the elastic membrane 671 is relatively high, the step of driving the adjusting element 660 to limit the size of the target cavity can be performed before the target cavity 621 is filled with liquid, or after the target cavity 621 is filled with liquid and the sub-cavity 672 defined by the elastic membrane 671 is set, or it can be performed during the use of the vibration sensing device 600.

[0103] On the basis of adjusting the resonant frequency of the resonant system in the vibration sensing device 600 by setting the subcavity 672 defined by the elastic membrane 671, the size of the target cavity can be defined and / or adjusted by setting and / or adjusting the adjusting element 660, adjusting the contact area between the plate 622 and the liquid in the target cavity 621, the equivalent stiffness of the subcavity 672 and the liquid in the target cavity 621, adjusting the system stiffness and / or system mass of the resonant system, thereby adjusting the resonant frequency of the resonant system in the vibration sensing device 600 again to obtain a desired or ideal resonant frequency (i.e., a second resonant frequency). For illustration purposes, Figure 7 is a frequency response curve of an exemplary vibration sensor device according to some embodiments of the present application. Figure 7As shown, the abscissa of the frequency response curve represents frequency in Hertz Hz, and the ordinate represents sensitivity in decibel volts dBV. The frequency response curve 7110 represented by the dotted line is the frequency response curve of the vibration sensor 610 of the vibration sensing device 600, wherein the vibration sensor 610 has a first resonant frequency f 0 The frequency response curve 7120 indicated by the solid line is a frequency response curve when the first adjustment element 661 and the second adjustment element 662 in the adjustment element 660 are in the first position and the second position respectively after the vibration sensor device 600 introduces the second resonance system provided by the vibration assembly composed of the plate 622, the liquid and the sub-cavity, wherein the vibration assembly provides the vibration sensor device 600 with a second resonance frequency f 1 The frequency response curve 7130 represented by the dotted line is a frequency response curve when the lateral dimension W of the third target cavity 6216 along the X-axis direction is adjusted by the adjusting element 660, and the first adjusting element 661 and the second adjusting element 662 in the adjusting element 660 are respectively in the third position and the fourth position, wherein the third position may be different from the first position, and the fourth position may be different from the second position. As an example only, the adjusting element 661 can move along the positive direction of the X-axis, and the adjusting element 662 can move along the negative direction of the X-axis. The moving distances of the adjusting element 661 and the adjusting element 662 can be the same or different. The movement of the adjusting element 661 and the adjusting element 662 can reduce the lateral dimension W, so that the volume of the target cavity 6212 and the second target cavity 6214 increases, the contact area between the plate 622 and the liquid in the first target cavity 6212 and the second target cavity 6214 increases, and the compression ratio of the liquid and / or the sub-cavity 672 in the first target cavity 6212 and the second target cavity 6214 is reduced, which is equivalent to reducing the system stiffness of the resonant system, so that the second resonant frequency of the resonant system is reduced from f 1 Reduce to f 2 .like Figure 7 As shown, compared with the frequency response curve 7120, the second resonance peak of the frequency response curve 7130 moves to the left. By setting the adjustment element 660, the resonance frequency of the vibration sensor device 600 can be reduced (for example, from f 1 Reduce to f 2 ), and at the same time, the vibration sensor device 600 has a higher sensitivity in a wider frequency range. For example, before the lateral dimension W is reduced by adjusting the element 660, the target frequency response curve 7120 is at (f 1 -f 0 ) frequency range has a relatively high sensitivity. After the lateral dimension W is reduced by adjusting the element 660, the frequency response curve 7130 of the vibration sensor device 600 is (f 2 -f 0 ) frequency range has relatively high sensitivity, where (f 2-f 0 ) is greater than (f 1 -f 0 ).

[0104] In some embodiments, the vibration component provides at least one second resonant frequency for the vibration sensor device, which can improve the sensitivity of the frequency response of the vibration sensor device within a specific frequency range, making the frequency response curve flatter within a relatively wide frequency range. Figure 7 As shown, the difference between the peak and the trough of the frequency response of the vibration sensor can be represented by (△V1+△V2). After the introduction of the second resonant frequency (that is, after having the vibration component), the difference between the peak and the trough of the frequency response of the vibration sensor device can be represented by △V2, and △V2 is less than (△V1+△V2), that is to say, the second resonant frequency provided by the vibration component makes the frequency response curve of the vibration sensor device flatter, and has higher sensitivity and more stability in a relatively wide frequency range. In some embodiments, after the introduction of the second resonant frequency, the difference between the peak and the trough of the frequency response curve of the vibration sensor device can be in the range of 5dBV to 15dBV. In some embodiments, after the introduction of the second resonant frequency, the difference between the peak and the trough of the frequency response curve of the vibration sensor device can be in the range of 5dBV to 10dBV. In some embodiments, after the introduction of the second resonant frequency, the difference between the peak and the trough of the frequency response curve of the vibration sensor device can be in the range of 10dBV to 15dBV. In some embodiments, after the second resonant frequency is introduced, the absolute value of the difference (for example, △V1) between the difference △V2 between the peak and the trough of the frequency response curve of the vibration sensing device and the difference (△V1+△V2) between the peak and the trough of the frequency response of the vibration sensor may range from 15dBV to 40dBV. In some embodiments, after the second resonant frequency is introduced, the absolute value of the difference (for example, △V1) between the difference △V2 between the peak and the trough of the frequency response curve of the vibration sensing device and the difference (△V1+△V2) between the peak and the trough of the frequency response of the vibration sensor may range from 15dBV to 20dBV. In some embodiments, after the second resonant frequency is introduced, the absolute value of the difference (for example, △V2) between the difference △V2 between the peak and the trough of the frequency response of the vibration sensing device and the difference (△V1+△V2) between the peak and the trough of the frequency response of the vibration sensor may range from 20dBV to 30dBV. In some embodiments, after the second resonant frequency is introduced, the absolute value of the difference (for example, △V1) between the difference △V2 between the peak and the trough of the frequency response curve of the vibration sensing device and the difference (△V1+△V2) between the peak and the trough of the frequency response of the vibration sensor can range from 30dBV to 35dBV.

[0105] Figure 8is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Figure 8 As shown, the vibration sensor device 800 may include a sensor 810, a plate 822, a first cavity 821, a second cavity 825, and a third cavity 827. The sensor 810 may include a housing 811, a vibration transmission element 812, and an acoustic-electric conversion element 813.

[0106] Figure 8 One or more elements of the vibration sensing device 800 shown in FIG. Figure 1 800 may be the same as or similar to the corresponding one or more elements in the vibration sensor device 100 shown in . For example, the housing 811, the vibration transmission element 812, the acoustic-to-electric conversion element 813, the plate 822, etc. in the vibration sensor device 800 may be the same as or similar to the housing 111, the vibration transmission element 112, the acoustic-to-electric conversion element 113, the plate 122, etc. in the vibration sensor device 100.

[0107] Figure 8 The vibration sensing device 800 shown in FIG. Figure 1 The difference of the vibration sensing device 100 shown includes that the vibration assembly of the vibration sensing device 800 further includes a vibration pickup element 823. The vibration pickup element 823 can be configured to generate vibration in response to an external vibration signal transmitted to the housing 811. In some embodiments, the vibration pickup element 823 can be disposed between the housing 811 and the vibration transmission element 812. For example, one end of the vibration pickup element 823 can be physically connected to the housing 811, and the other end can be physically connected to the vibration transmission element 812. The first cavity 821 can be defined and / or formed by the plate 822 and the vibration transmission element 812. The second cavity 823 can be defined and / or formed by at least a portion of the housing 811, the vibration pickup element 823, and the first plate 8221. The third cavity 825 can be defined and / or formed by at least a portion of the housing 811, the vibration pickup element 823, and the second plate 8222. The liquid is filled in the first cavity 821, that is, the first cavity 821 is the target cavity. The vibration pickup element 823 may be directly connected to the acoustic-to-electric conversion element 813 or indirectly connected (for example, Figure 8 The vibration pickup element 823 is connected through the vibration transmission element 812 as shown in the figure), so that the sound-to-electric conversion element 813 receives the vibration of the vibration pickup element 823 and converts the received vibration signal into an electrical signal for output. In some embodiments, the vibration pickup element 823 may include an elastic member or a rigid member, and its material may be the same as or different from that of the plate body 822 (for example, the first plate body 8221 and / or the second plate body 8222).

[0108] In some embodiments, when the vibration pickup element 823 is a rigid member, the vibration pickup element 823 can be used to transmit a vibration signal. For example, the vibration pickup element 823 can transmit the vibration signal generated by the housing 811 to the vibration transmission element 812. In some embodiments, the material of the vibration pickup element 823 can be the same as or different from that of the vibration transmission element 812.

[0109] In some embodiments, the vibration component of the vibration sensing device 800 can provide at least one resonance system for the vibration sensing device 800. For example, when the vibration pickup element 823 is an elastic member, the at least one resonance system that the vibration component can provide for the vibration sensing device 800 may include a first resonance system and a second resonance system. The first resonance system may be composed of the liquid in the target cavity 821 and the plate 822, and the second resonance system may be composed of the vibration transmission element 812, the acoustic-to-electric conversion element 813, the liquid in the target cavity 821, the vibration pickup element 823, and the plate 822. In the first resonance system, the plate 822 (for example, the first plate 8221 and / or the second plate 8222) can serve as a spring of the first resonance system to provide system stiffness therefor, and the liquid in the target cavity 821 can serve as a mass block of the first resonance system to provide system mass therefor. In the second resonant system, the vibration pickup element 823 can act as a spring of the second resonant system to provide it with system stiffness, and the vibration transmission element 812, the acoustic-to-electric conversion element 813, the liquid in the target cavity 821 and the plate 822 can act as a mass block of the second resonant system to provide it with system mass.

[0110] In some embodiments, the first resonant system and the second resonant system can provide at least two second resonant frequencies for the vibration sensing device 800, that is, the setting of the vibration pickup element 823 can introduce a new second resonant frequency based on a second resonant frequency of the vibration sensing device 800. Fig. 9 Take this as an example to illustrate. Fig. 9 is a frequency response curve of an exemplary vibration sensor device according to some embodiments of the present application. Fig. 9 As shown, the frequency response curve 9110 represented by the dotted line is the frequency response curve of the vibration sensor 810, for example, the frequency response curve when the vibration sensor device 800 is not provided with a vibration component and a vibration pickup element 823; the frequency response curve 9120 represented by the solid line is the frequency response curve of the vibration sensor device (for example, the vibration sensor device 100) when a vibration component is provided but no vibration pickup element 823 is provided; the frequency response curve 9130 represented by the double solid line can be the frequency response curve of the vibration sensor device (for example, the vibration sensor device 800) provided with a vibration component and a vibration pickup element 823. The horizontal axis represents the frequency, the unit is Hertz Hz, and the vertical axis represents the sensitivity, the unit is decibel volt dBV.

[0111] The vibration sensor 810 is at a first resonant frequency f 0 The introduction of the first resonance system can make the vibration sensor device have a resonance peak at the second resonance frequency f 1 There is a resonance peak at the second resonance frequency f 1 With the first resonant frequency f 0 can be the same or different. Fig. 9 As shown, the second resonant frequency f 1 Can be less than the first resonant frequency f 0 , the difference between the peak and the trough of the frequency response curve of the vibration sensor device after the vibration component and the vibration pickup element 823 are provided is △V2, when the vibration component and the vibration pickup element 823 are not provided, the difference between the peak and the trough of the frequency response curve of the vibration sensor device is (△V1+△V2), △V2 is less than (△V1+△V2), that is, the second resonant frequency f 1 The introduction of the second resonant system improves the frequency response sensitivity of the vibration sensor device in a relatively low frequency range (for example, a mid-low frequency band), making the frequency response curve of the vibration sensor device flatter in a relatively wide frequency range. Furthermore, the introduction of the second resonant system makes the frequency response curve of the vibration sensor device flatter at the third resonant frequency f 2 There is a new resonance peak, so that the frequency response curve 9130 of the vibration sensor device has three resonance peaks, further improving the sensitivity of the vibration sensor device, and making the frequency response curve 9130 of the vibration sensor device have higher sensitivity in a wider frequency range and be flatter.

[0112] The description of the vibration sensor device 800 is for illustrative purposes only and is not intended to limit the scope of the present application. A person skilled in the art may make various changes and modifications based on the description of the present application. In some embodiments, the second resonant frequency f 1 and the third resonant frequency f 2 The size of can be set according to actual needs, for example, the second resonant frequency f 1 and the third resonant frequency f 2 Can be less than the first resonant frequency f 0 , so that the vibration sensor device 800 can have a higher sensitivity in the target frequency range (for example, the middle and low frequency band). For another example, the second resonant frequency f 1 and the third resonant frequency f 2 Can be greater than the first resonant frequency f 0 , so that the vibration sensor device 800 can have a higher sensitivity in the target frequency range (for example, a higher frequency band). For another example, the second resonant frequency f 1Can be less than the first resonant frequency f 0 , the third resonant frequency f 2 Can be greater than the first resonant frequency f 0 , so that the vibration sensor device 800 can have a higher sensitivity in a wider frequency range and a flatter frequency response curve. These changes and modifications are still within the protection scope of this application.

[0113] Fig.10 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.10 As shown, the vibration sensing device 800 may further include an adjusting element 860, which may be disposed in the target cavity 821 to limit the size of the target cavity 821. In some embodiments, the contact area between the first plate 8221 and / or the second plate 8222 and the liquid in the target cavity 821 and the mass of the liquid in the target cavity 821 may be adjusted by disposing the adjusting element 860, and the system stiffness and system mass of the first resonant system may be adjusted to adjust the resonant frequency of the first resonant system. For example, when the length and height of the adjusting element 860 remain unchanged, the size of the target cavity 821 and / or the contact area between the plate 822 and the target cavity 821 may be increased by reducing the width of the adjusting element 460, and the system stiffness of the first resonant system may be reduced and / or the system mass may be increased, thereby reducing the resonant frequency of the first resonant system.

[0114] In addition, by setting the adjustment element 860, the system mass of the second resonant system can also be adjusted, thereby adjusting the resonant frequency of the second resonant system. For example, by selecting the material of the vibration pickup element 823 (for example, selecting a material with a larger elastic modulus), reducing the volume of the adjustment element 860, increasing the mass of the adjustment element 860, etc., the resonant frequency of the first resonant system and the second resonant system can be reduced, so that the vibration sensor device 800 has a higher sensitivity in a wider frequency range, and the sensitivity of the frequency response curve of the vibration sensor device 800 is improved. For details about the adjustment element, please refer to Figures 4A-4B and its related description.

[0115] Fig.11 1 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application. The vibration sensing device 1100 may include a housing 1111, a vibration transmission element 1112, an acoustic-to-electric conversion element 1113, a plate 1122, a vibration pickup element 1123, an adjustment element 1160, a first cavity 1121, a second cavity 1125, and a third cavity 1127. Fig.11 One or more elements of the vibration sensing device 1100 shown in FIG. 1 may be used in conjunction with Fig.10One or more elements of the vibration sensing device 800 shown in . For example, the housing 1111, the vibration transmission element 1112, the acoustic-to-electric conversion element 1113, the vibration pickup element 1123, the third cavity 1127, etc. in the vibration sensing device 1100 may be respectively the same as or similar to the housing 811, the vibration transmission element 812, the acoustic-to-electric conversion element 813, the vibration pickup element 823, the third cavity 827, etc. in the vibration sensing device 800.

[0116] Fig.11 The vibration sensing device 1100 shown in FIG. Fig.10 The differences between the vibration sensing device 800 shown include the type of plate 1122 (e.g., first plate 1124, second plate 1126, etc.), the location of the target cavity, and the arrangement of the support element 1160 in the vibration sensing device 1100. Fig.11 As shown, the first plate body 1124 and / or the second plate body 1126 in the plate body 1122 of the vibration sensing device 1100 may include a rigid plate, and its Young's modulus is not less than 50 GPa. For example, the first plate body 1124 and the second plate body 1126 may be rigid plates. For another example, the first plate body 1124 may be a rigid plate, and the second plate body 1126 may be a flexible plate. For another example, the first plate body 1124 may be a flexible plate, and the second plate body 1126 may be a rigid plate.

[0117] The second cavity 1125 may be filled with liquid, that is, the second cavity 1125 may be a target cavity. The acoustic-electric conversion element 1113 may be disposed in the first cavity 1121. The first cavity 1121 and / or the third cavity 1127 may be vacuum or filled with gas. In some embodiments, the vibration sensing device 1100 further includes a supporting element 1160, which may be disposed in the first cavity 1130, and the supporting element 1160 may be used to support the first plate 1124 and the second plate 1126. In some embodiments, one end of the supporting element 1160 may be connected to the first plate 1124, and the other end may be connected to the second plate 1126. In some embodiments, the supporting element 1160 may be in the shape of a cylinder, a prism, a prism, or the like. In some embodiments, the supporting element 1160 may include, but is not limited to, one or more of semiconductor materials, metal materials, metal alloys, organic materials, and the like. The structural parameters of the supporting element 1160 are not specifically limited in the embodiments of the present application.

[0118] In some embodiments, the vibration pickup element 1123, the liquid filled in the second cavity 1125, the plate 1122, the vibration transmission element 1112, the acoustic-to-electric conversion element 1113, and the supporting element 1160 can constitute a vibration assembly of the vibration sensing device. In some embodiments, the vibration assembly can provide a first resonance system for the vibration sensing device 1100, wherein the vibration pickup element 1123 can be used as a spring of the first resonance system to provide system stiffness, and the liquid filled in the second cavity 1125, the plate 1122, the vibration transmission element 1112, the acoustic-to-electric conversion element 1113, and the supporting element 1160 can be used as a mass block of the first resonance system to provide system mass. In some embodiments, the first resonance system can provide a second resonance frequency for the vibration sensing device 1100.

[0119] The description of the above-mentioned vibration sensing device 1100 is for the purpose of illustration only and is not intended to limit the scope of the present application. For those of ordinary skill in the art, various changes and modifications can be made according to the description of the present application. In some embodiments, the first plate 1124 and / or the second plate 1126 in the plate 1122 can be a flexible plate, and its Young's modulus can be 1MPa~10GPa. For the purpose of illustration, the first plate 1124 is an example of a flexible plate. When the first plate 1124 is a flexible plate, the vibration element can provide a second resonance system and the first resonance system as described above for the vibration sensing device 1100. The second resonance system can be composed of the first plate 1124, the gas in the first cavity 1121, and the acoustic-electric conversion element 1113. The first plate 1124 can be used as a spring of the first resonance system to provide system stiffness for it, and the gas filled in the first cavity 1121 can be used as a mass block of the first resonance system to provide system mass for it. In some embodiments, the second resonance system can provide the vibration sensing device 1100 with another second resonance frequency that is the same as or different from the above-mentioned second resonance frequency. These changes and modifications are still within the protection scope of this application.

[0120] Fig.12 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.12 As shown, the vibration sensor device 1200 includes a housing 1211, a vibration transmission element, an acoustic-electric conversion element, a plate 1222, a vibration pickup element 1223, and a support element 1260. The housing 1211, the vibration transmission element, the vibration pickup element, etc. can be respectively Fig.11The housing 1111, the vibration transmission element, and the vibration pickup element 1123 in the vibration sensing device 1100 shown in FIG. 1 are the same or similar. The supporting element 1260 of the vibration sensing device 1200 may be the same as or different from the supporting element 1160 in the vibration sensing device 1100. For example, the supporting element 1260 of the vibration sensing device 1200 may be used to support the acoustic-electric conversion element, and the supporting element 1160 in the vibration sensing device 1100 may be used to support the plate 1122.

[0121] In some embodiments, the plate 1222 may include a first plate 1224 and a second plate 1226. The first plate 1224 and / or the second plate 1226 may be a flexible plate, and its Young's modulus may be 1 MPa to 10 GPa. In some embodiments, the first plate 1224 and the second plate 1226 may divide the space in the housing 1211 into a plurality of cavities, for example, a first cavity 1221, a second cavity 1225, and a third cavity 1227. The first cavity 1221 may be defined and / or formed by the first plate 1224, the second plate 1226, and the vibration transmission element (e.g., the first vibration transmission element 1212-1 and the second vibration transmission element 1212-2); the second cavity 1225 may be defined and / or formed by the first plate 1224, the vibration pickup element 1223, and at least a portion of the housing 1211, and the second cavity 1225 may contain liquid; the third cavity 1227 may be defined and / or formed by the second plate 1226, the vibration pickup element 1223, and at least a portion of the housing 1211. In some embodiments, the third cavity 1227 may contain liquid.

[0122] In some embodiments, the first cavity 1221 may be filled with one or more gases (e.g., air, oxygen, nitrogen, inert gas, etc.). In some embodiments, the support element 1260 may divide the first cavity 1221 into a cavity 1231 and a cavity 1232. In some embodiments, the cavity 1231 and the cavity 1232 may be the same cavity or independent cavities. The acoustic-to-electric conversion element may include a first acoustic-to-electric conversion element 1213-1 and a second acoustic-to-electric conversion element 1213-2. In some embodiments, the first acoustic-to-electric conversion element 1213-1 and the second acoustic-to-electric conversion element 1213-2 may be the same structure and may be independent structures. The vibration element may include a first vibration element 1212-1 and a second vibration element 1212-2. In some embodiments, the first vibration element 1212-1 and the second vibration element 1212-2 may be the same structure and may be independent structures. For example, the first vibration element 1212-1 and the second vibration element 1212-2 may be integrally formed. For another example, the first vibration element 1212-1 and the second vibration element 1212-2 may be different parts of the same vibration element. For the convenience of description, the cavity 1231 is taken as an example for explanation. In some embodiments, the first acoustic-to-electric conversion element 1213-1 may be disposed in the cavity 1231. For example, one end of the first acoustic-to-electric conversion element 1213-1 may be connected to the first vibration element 1212-1, and the other end may be connected to the supporting element 1260, thereby dividing the cavity 1233 into a first gas cavity 1233 and a second gas cavity 1235. In some embodiments, the first cavity 1225 may be filled with liquid, that is, the first cavity 1225 may be a target cavity.

[0123] In some embodiments, the vibration pickup element 1223, the liquid filled in the second cavity 1225, the plate 1222, the vibration transmission element, the acoustic-to-electric conversion element, and the supporting element 1260 can constitute a vibration component of the vibration sensing device 1200. In some embodiments, the vibration component can provide one or more resonance systems for the vibration sensing device 1200. The one or more resonance systems may include a first resonance system and a second resonance system. Among them, the vibration pickup element 1223 can be used as a spring of the first resonance system to provide system stiffness for it, and the liquid filled in the second cavity 1225, the plate 1122, the vibration transmission element, the acoustic-to-electric conversion element, and the supporting element 1260 can be used as a mass block of the first resonance system to provide system mass for it. The second resonance system may include the plate 1222, the gas in the cavity 1231, and the acoustic-to-electric conversion element 1213-1. When the vibration sensing device 1200 is used to detect or pick up vibration, the housing 1211 can transfer the received vibration to the vibration transmission element through the vibration pickup element 1223 and / or the liquid in the second cavity 1225, and further transfer it to the acoustic-to-electric conversion element, thereby forming a first resonance system, and the first resonance system can provide a second resonance frequency for the vibration sensing device 1200. At the same time, the vibration of the liquid in the second cavity 1225 can be transmitted to the plate 1222 (for example, the first plate 1224), and the plate 1222 can be deformed under the action of vibration, thereby compressing the gas in the first gas cavity 1233 and / or the second gas cavity 1235, so that the acoustic-to-electric conversion element 1213-1 receives pressure (i.e., vibration signal) to output an electrical signal, thereby forming a second resonance system. In some embodiments, the second resonance system can provide another second resonance frequency for the vibration sensing device 1200. Multiple second resonance frequencies can be the same or different. By introducing two resonance systems, the frequency response curve of the vibration sensor device 1200 can have multiple resonance peaks in a wider frequency range, thereby improving the sensitivity of the vibration sensor device 1200 in a wider frequency range (for example, a higher frequency band) and making the frequency response curve of the vibration sensor device 1200 flatter.

[0124] Fig.13 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.13 As shown, the vibration sensing device 1300 may include a shell 1311, a vibration transmission element 1312, an acoustic-to-electric conversion element 1313, a plate 1322, a vibration pickup element 1323, a first cavity 1321, a second cavity 1325, a third cavity 1327 and a supporting element 1360.

[0125] Fig.13 One or more elements of the vibration sensing device 1300 shown in FIG. Fig.11One or more elements of the vibration sensing device 1100 shown in are the same or similar. For example, the housing 1311, the vibration transmission element 1312, the acoustic-electric conversion element 1313, the plate 1322, the vibration pickup element 1323, the first cavity 1321, the third cavity 1327, the support element 1360, etc. in the vibration sensing device 1300 may be the same or similar to the housing 1111, the vibration transmission element 1112, the acoustic-electric conversion element 1113, the plate 1122, the vibration pickup element 1123, the first cavity 1121, the third cavity 1127, the support element 1160, etc. in the vibration sensing device 1100. Fig.13 The vibration sensing device 1300 shown is Fig.11 The difference of the vibration sensing device 1100 shown includes that the second cavity 1325 (ie, the target cavity of the vibration sensing device 1300) may include a liquid cavity 1325-1 and a gas cavity 1325-2, wherein the liquid cavity 1325-1 may be used to contain liquid, and the gas cavity 1325-2 may be used to contain gas.

[0126] In some embodiments, the first plate body 1324 and / or the second plate body 1326 in the plate body 1322 of the vibration sensing device 1300 may include a rigid plate, and its Young's modulus may be not less than 50 GPa. For example, the first plate body 1324 and the second plate body 1326 may be rigid plates. For another example, the first plate body 1324 may be a rigid plate, and the second plate body 1326 may be a flexible plate. For another example, the first plate body 1324 may be a flexible plate, and the second plate body 1326 may be a rigid plate.

[0127] In some embodiments, when the plate 1324 is a rigid plate, the vibration pickup element 1323, the liquid in the liquid cavity 1325-1, the plate 1322, the vibration transmission element 1312, the acoustic-to-electric conversion element 1313, and the support element 1360 constitute the vibration sensor device 1300, which can provide a first resonance system for the vibration sensor device 1300, wherein the vibration pickup element 1323 can be used as a spring of the first resonance system to provide system stiffness for it, and the liquid in the liquid cavity 1325-1, the plate 1322, the vibration transmission element 1312, the acoustic-to-electric conversion element 1313, and the support element 1360 can be used as a mass block of the first resonance system to provide system mass for it. In some embodiments, the first resonance system can provide a second resonance frequency for the vibration sensor device 1300. In some embodiments, the system mass of the first resonance system can be adjusted or designed by adjusting or designing the size of the liquid cavity 1325-1 and / or the gas cavity 1325-2, the mass of the liquid in the liquid cavity 1325-1, etc., so as to adjust or design the size of the second resonance frequency. For example, the larger the volume of the gas cavity 1325-2, the smaller the mass of the liquid in the liquid cavity 1325-1, and the smaller the system mass of the first resonance system. According to formula (1), the resonance frequency of the first resonance system (i.e., the second resonance frequency) is larger. For another example, the smaller the volume of the gas cavity 1325-2, the larger the mass of the liquid in the liquid cavity 1325-1, and the larger the system mass of the first resonance system. According to formula (1), the resonance frequency of the first resonance system (i.e., the second resonance frequency) is smaller. In some embodiments, the volume of the liquid cavity 1325-1 or the gas cavity 1325-2 can be greater than 0 and less than the volume of the second cavity 1325.

[0128] In some embodiments, when the first plate 1324 is a flexible plate, the vibration assembly can provide one or more second resonance systems and the first resonance system as described above for the vibration sensing device 1300. The second resonance system can be composed of the first plate 1324, the gas in the first cavity 1321, the second plate 1326, and the acoustic-electric conversion element 1313. The first plate 1324 and the second plate 1326 can serve as springs of the second resonance system to provide system stiffness, and the gas filled in the first cavity 1321 can serve as a mass block of the second resonance system to provide system mass. In some embodiments, the second resonance system can provide the vibration sensing device 1300 with another second resonance frequency that is the same as or different from the above-mentioned second resonance frequency.

[0129] about Fig.13The description of the vibration sensing device 1300 is only for the purpose of illustration and is not intended to limit the scope of the present application. For those of ordinary skill in the art, various changes and modifications can be made according to the description of the present application. For example, when the plate 1329-1, the first plate 1324 and / or the second plate 1326 between the liquid cavity 1325-1 and the gas cavity 1325 are flexible plates, the plate 1329-1, the first plate 1324 and / or the second plate 1326 can be used as springs of one or more second resonant systems to provide system stiffness therefor. These changes and modifications are still within the scope of protection of the present application.

[0130] Fig.14 is a cross-sectional view of an exemplary vibration sensing device according to some embodiments of the present application.

[0131] like Fig.14 As shown, the third cavity 1327 of the vibration sensing device 1300 may also be filled with liquid. For example, the third cavity 1327 may include a liquid cavity 1327-1 and a gas cavity 1327-2, wherein the liquid cavity 1327-1 may be used to contain liquid, and the gas cavity 1327-2 may be used to contain gas. The target cavity of the vibration sensing device 1300 may include a second cavity 1325 and a third cavity 1327. The vibration pickup element 1323 of the vibration sensing device 1300, the liquid in the liquid cavity 1325-1, the liquid in the liquid cavity 1327-1, the plate 1322, the vibration transmission element 1312, the acoustic-to-electric conversion element 1313, and the support element 1360 may provide a first resonance system for the microphone 1300. In some embodiments, the vibration pickup element 1323 can act as a spring of the first resonance system to provide system stiffness therefor, and the liquid in the liquid cavity 1325-1, the liquid in the liquid cavity 1327-1, the plate 1322, the vibration transmission element 1312, the acoustic-to-electric conversion element 1313 and the support element 1360 can act as a mass block of the first resonance system to provide system mass therefor.

[0132] In some embodiments, when the first plate 1324 is a flexible plate, the vibration element can provide one or more second resonance systems and the first resonance system as described above for the vibration sensing device 1300. The second resonance system may include the first plate 1324, the gas in the first cavity 1321, the second plate 1326, and the acoustic-electric conversion element 1313. The first plate 1324 and the second plate 1326 can serve as springs of the second resonance system to provide system stiffness, and the gas filled in the first cavity 1321 can serve as a mass block of the second resonance system to provide system mass. In some embodiments, the second resonance system can provide the vibration sensing device 1300 with another second resonance frequency that is the same as or different from the above-mentioned second resonance frequency.

[0133] about Fig.14 The description of the vibration sensing device 1300 is only for the purpose of explanation and is not intended to limit the scope of the present application. For those of ordinary skill in the art, various changes and modifications can be made according to the description of the present application. For example, when the plate 1329-1 between the liquid cavity 1325-1 and the gas cavity 1325, the plate 1329-2 between the liquid cavity 1327-1 and the gas cavity 1327-2, the first plate 1324 and / or the second plate 1326 are flexible plates, the plate 1329-1, the plate 1329-2, the first plate 1324 and / or the second plate 1326 can be used as a spring of a plurality of second resonant systems to provide system stiffness therefor. These changes and modifications are still within the scope of protection of the present application.

[0134] By providing liquid cavities in the second cavity 1325 and the third cavity 1327, the adjustable range of the system mass of the first resonant system can be expanded, so that the second resonant frequency is introduced in a wider frequency range, thereby improving the sensitivity of the vibration sensing device 1300 in a wider frequency range. It should be noted that the size of the liquid cavity 1325-1 and the gas cavity 1325-2 in the second cavity 1325 and / or the liquid cavity 1327-1 and the gas cavity 1327-2 in the third cavity 1327 can be set according to actual needs. For example, the liquid cavity 1325-1 can be equal in size to the second cavity 1325, that is, the liquid fills the entire second cavity 1325 (such as Fig.11 The second cavity 1125 and / or Fig.12 For example, the liquid cavity 1327-1 in the third cavity 1327 may be equal in size to the third cavity 1327, that is, the liquid is filled into the third cavity 1327. For another example, the gas cavity 1325-2 in the second cavity 1325 is equal in size to the second cavity 1325, and the liquid cavity 1327-1 in the third cavity 1327 is equal in size to the third cavity 1327, that is, the gas is filled into the entire second cavity 1325, and the liquid is filled into the entire third cavity 1327. Such changes and / or modifications are still within the scope of protection of the present application.

[0135] Fig.15 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.15 As shown, the vibration sensing device 1500 may include a first housing 1551, a vibration sensor, and a vibration assembly. In some embodiments, the vibration sensor may include a bone conduction vibration sensor, an air conduction vibration sensor, or a combination thereof. For ease of description, Figure 15-22 The vibration sensor shown is explained by taking an air conduction vibration sensor as an example.

[0136] In some embodiments, the first shell 1551 can be connected to the air conduction vibration sensor and the vibration assembly respectively. For example, the air conduction vibration sensor can include a second shell 1552, and the first shell 1551 can be connected to at least a portion of the second shell 1552 (for example, the side wall 1553 of the second shell 1552). In some embodiments, the first shell 1551 and the second shell 1552 can be an integral structure or independent structures. For example, the first shell 1551 and the second shell 1552 can be integrally formed. For another example, the first shell 1551 and the second shell 1552 can be different parts of the same shell. For another example, the first shell 1551 and the second shell 1552 can be physically connected together by any suitable connection method (for example, threaded connection, key connection, pin connection, interference connection, snap connection, riveting, welding, gluing (or bonding), mortise and tenon connection (or mortise and tenon connection), etc. or a combination thereof). In some embodiments, the length of the first shell 1551 (for example, the length of the first shell 1551 along the X-axis direction) is equal to the length of the second shell 1552 in the same direction (for example, the length of the first shell 1551 along the X-axis direction) Figure 15-Figure 20 as shown) or unequal (as shown Figure 21-22 shown).

[0137] In some embodiments, the first housing 1551 and at least a portion of the vibration sensor (e.g., the side wall 1553 of the second housing 1552) form a storage space, which can be used to accommodate the vibration component. The vibration component may include a plate 1510 and a liquid filled in the target cavity 1520. The plate 1510 may include a vibration plate (also referred to as a flexible plate). The target cavity 1520 may be defined by the plate 1510 and at least a portion of the first housing 1551 (e.g., the side wall 1551-1, the side wall 1551-2, and the bottom wall 1551-3 of the first housing). The plate 1510 may be disposed in a space within the first housing 1551. The plate 1510 may be physically connected to the first housing 1551, respectively. For example, the two ends of the plate 1510 may be physically connected to the side wall 1551-1 and the side wall 1551-2 of the first housing 1551, respectively. In some embodiments, the first side wall 1551-1 and the second side wall 1551-22 may be an integral structure or may be independent structures. For example, the first side wall 1551-1 and the second side wall 1551-22 may be integrally formed. For another example, the first side wall 1551-1 and the second side wall 1551-22 may be different parts of the same side wall of the shell. For another example, the first side wall 1551-1 and the second side wall 1551-22 may be physically connected together by any suitable connection method (for example, threaded connection, key connection, pin connection, interference connection, clamping, riveting, welding, gluing (or bonding), mortise (or mortise and tenon connection), etc. or a combination thereof). The plate body 1510 and at least a portion of the first shell 1551 and at least a portion of the second shell 1552 (for example, the sound inlet 1570 and the side wall 1553) may form a second cavity 1554. The second cavity 1554 may be filled with a filler such as a solid, a gas, or a combination thereof.

[0138] In some embodiments, a sound inlet hole 1570 of the sound-to-electric conversion element 1530 may be provided on the second shell 1552. In some embodiments, the size and shape of the sound inlet hole 1570 can be set according to actual needs. The shape of the sound inlet hole 1570 may include regular structures such as a cuboid, a cylinder, a prism, a truncated cone, or other irregular structures. The vibration component can be acoustically connected to the sound-to-electric conversion element 1530 through the sound inlet hole 1570. The acoustic communication between the vibration component and the sound-to-electric conversion element means that the vibration signal (e.g., a sound signal) can be transmitted from the vibration component to the sound-to-electric conversion element through the sound inlet hole. For example, the vibration of the vibration component can pass through the second cavity 1554 and the sound inlet hole 1570, for example, by vibrating the filler in the second cavity 1554 and the air in the sound inlet hole 1570, and the vibration is transmitted to the sound-to-electric conversion element 1530.

[0139] In some embodiments, the first housing 1551 can receive a vibration signal outside the vibration sensing device 1500 and generate vibration. The vibration generated by the first housing 1551 can be transmitted to the plate 1510 through the liquid in the target cavity 1520, thereby causing the plate 1510 to vibrate. In some embodiments, the vibration of the vibration assembly can form one or more resonant systems to provide a second resonant frequency for the vibration sensing device 1500. Further, the vibration of the plate 1510 can be transmitted to the acoustic-to-electric conversion element 1530 through the filler (e.g., air) in the second cavity 1554 and the sound inlet hole 1570. For example, the vibration of the plate 1510 can cause the air in the second cavity 1554 to vibrate, and the air vibration is transmitted to the acoustic-to-electric conversion element 1530 through the sound inlet hole 1570. The acoustic-to-electric conversion element 1530 can generate corresponding parameter (e.g., capacitance, charge, acceleration, light intensity, frequency response, etc. or a combination thereof) changes according to the received vibration, and the changed parameters can be detected by electrical methods and output electrical signals corresponding to the vibration. In some embodiments, the air conduction vibration sensor (for example, the acoustic-to-electric conversion element 1530 in the air conduction vibration sensor) may have a first resonant frequency. In some embodiments, the first resonant frequency may be different from the second resonant frequency. By providing a vibration component in the vibration sensing device 1500, a second resonant frequency may be introduced on the basis of the first resonant frequency of the air conduction sensor, thereby improving the sensitivity of the vibration sensing device 1500, stabilizing the frequency response of the vibration sensing device 1500 within the required frequency band, and filling the target cavity 1520 with liquid may also improve the anti-collision performance of the vibration sensing device 1500. In some embodiments, the magnitude of the second resonant frequency may be adjusted or set by adjusting or setting the structural parameters of the vibration component. The structural parameters of the vibration component may include the type of plate, the position of the plate, the size of the plate, the elastic coefficient of the plate, the type of liquid, the density of the liquid, the viscosity of the liquid, the size of the target cavity, or the like or a combination thereof. For details on adjusting the second resonant frequency by changing the structural parameters of the vibration component, see Figure 16-22 and its related description.

[0140] Fig.16 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.16 As shown, the vibration sensing device 1600 may include a first housing 1651, an air conduction vibration sensor, a vibration assembly, and a target cavity 1620. The air conduction vibration sensor may include a second housing 1652 and an acoustic-to-electric conversion element 1630. The acoustic-to-electric conversion element 1630 may include a sound inlet hole 1670. The vibration assembly may include a plate 1610 and a liquid filled in the target cavity 1620. One or more elements in the vibration sensing device 1600 may be connected to the target cavity 1620. Fig.15One or more elements of the vibration sensing device 1500 shown are the same or similar. For example, the first housing 1651, the second housing 1652, the acoustic-to-electric conversion element 1630, etc. in the vibration sensing device 1600 may be the same or similar to the first housing 1551, the second housing 1552, the acoustic-to-electric conversion element 1530, etc. in the vibration sensing device 1500, respectively.

[0141] Fig.16 The vibration sensing device 1600 shown is Fig.15 The difference of the vibration sensing device 1500 shown includes that the plate 1610 (e.g., a vibration plate) of the vibration assembly 1600 can be disposed in the sound inlet hole 1670 of the acoustic-electric conversion element 1163. Both ends of the plate 1610 can be physically connected to the second shell 1652 (e.g., the side wall of the sound inlet hole 1670). The plate 1610 and at least a portion of the second shell 1652 (e.g., the side wall 1653 of the second shell 1652) and the first shell 1651 (e.g., the side wall 1651-1, the side wall 1651-2 and the bottom wall 1651-3 of the first shell 1651) can define a target cavity. Liquid (e.g., water, oil, etc. or a combination thereof) can be filled in the target cavity 1620. In some embodiments, the side wall 1651-1, the side wall 1651-2 and / or the bottom wall 1651-3 of the shell 1651 can be an integral structure or a mutually independent structure. For example, the side wall 1651-1, the side wall 1651-2 and / or the bottom wall 1651-3 may be integrally formed. For another example, the side wall 1651-1, the side wall 1651-2 and / or the bottom wall 1651-3 may be different parts of the same side wall of the housing 1651. For another example, the side wall 1651-1, the side wall 1651-2 and / or the bottom wall 1651-3 may be physically connected together by any suitable connection method (e.g., threaded connection, key connection, pin connection, interference connection, snap connection, riveting, welding, adhesive connection (or bonding), mortise and tenon connection (or mortise and tenon connection), etc. or a combination thereof).

[0142] In some embodiments, the vibration generated by the first shell 1651 can be transmitted to the plate 1610 through the liquid in the target cavity 1620, thereby causing the plate 1610 to vibrate. In some embodiments, the vibration assembly can form one or more resonant systems to provide a second resonant frequency for the vibration sensing device 1600. Further, the vibration of the plate 1610 can be transmitted to the acoustic-to-electric conversion element 1630 through the sound inlet hole 1670. For example, the vibration of the plate 1610 can cause the air in the sound inlet hole 1670 to vibrate, and the air vibration can be transmitted to the acoustic-to-electric conversion element 1630. The acoustic-to-electric conversion element 1630 can generate a corresponding electrical signal based on the received vibration.

[0143] and Fig.15Compared with the vibration sensing device 1500, Fig.16 The size of the plate 1610 of the vibration sensing device 1600 shown in the figure is relatively small, and the volume of the liquid in the target cavity 1620 is relatively large. For other conditions (e.g., plate material or elastic modulus, density and type of liquid, etc.) being the same, the resonance system formed by the vibration assembly in the vibration sensing device 1600 has a relatively large system stiffness and a relatively large system mass, and therefore, the second resonance frequency of the sensing device 1600 may be greater than, equal to, or less than the second resonance frequency of the sensing device 1500, which depends on the ratio of the system stiffness to the system mass. Therefore, the size of the second resonance frequency provided by the vibration assembly to the vibration sensing device 1600 can be adjusted by adjusting the size and / or position of the plate 1610 and the mass of the liquid in the target cavity 1620, so as to obtain a desired or ideal resonance frequency, thereby improving the sensitivity of the vibration sensing device 1600 in different frequency ranges.

[0144] Fig.17 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.17 As shown, the vibration sensing device 1700 may include a first housing 1751, an air conduction vibration sensor, a vibration assembly, and a target cavity 1720. The air conduction vibration sensor may include a second housing 1752 and an acoustic-to-electric conversion element 1730. The acoustic-to-electric conversion element 1730 may include a sound inlet hole 1770. The vibration assembly may include a plate 1710 and a liquid filled in the target cavity 1720. One or more elements in the vibration sensing device 1700 may be connected to the target cavity 1720. Fig.16 One or more elements of the vibration sensing device 1600 shown are the same or similar. For example, the first housing 1651, the second housing 1752, the acoustic-to-electric conversion element 1730, etc. in the vibration sensing device 1700 may be the same or similar to the first housing 1651, the second housing 1652, the acoustic-to-electric conversion element 1630, etc. in the vibration sensing device 1600, respectively.

[0145] Fig.17 The vibration sensing device 1700 shown is Fig.16 The vibration sensor device 1600 shown in FIG. 1 is different from the vibration sensor device 1600 shown in FIG. 1700 . The plate 1710 of the vibration sensor device 1700 may include a first plate 1712 and a second plate 1714. The second plate 1714 may be disposed in the sound inlet hole 1770 of the acoustic conversion element 1730. Fig.17As shown, the second plate 1714 can be physically connected to the second shell 1752 (e.g., the side wall 1753 of the second shell 1752). Exemplary connection methods can include threaded connection, key connection, pin connection, interference connection, snap connection, riveting, welding, adhesive connection (or bonding), mortise and tenon connection (or mortise and tenon connection), etc. or a combination thereof. The first plate 1712, the second plate 1714, at least a portion of the second shell 1752 (e.g., the side wall 1753 of the second shell 1752) and at least a portion of the first shell 1751 (e.g., the side wall 1751-1 and the side wall 1751-2 of the first shell 1751) can define and / or form the target cavity 1720. The first plate 1712 and at least a portion of the first shell 1751 (eg, the side wall 1751 - 1 , the side wall 1751 - 2 , and the bottom wall 1751 - 3 of the first shell 1751 ) may define and / or form a cavity 1755 , and the cavity 1755 may be a vacuum or contain a gas.

[0146] In some embodiments, the first plate 1712, the second plate 1714, and the liquid in the target cavity 1720 may constitute a vibration component of the vibration sensing device 1700, and the vibration component may form a resonance system to provide a second resonance frequency for the vibration sensing device 1700. The second plate 1714 and the first plate 1712 (or the first plate 1712 and the gas filled in the cavity 1755) may provide system stiffness for the resonance system, and the liquid filled in the target cavity 1720 may provide system mass for the resonance system. In some embodiments, the vibration generated by the first shell 1751 may be transmitted to the plate 1710, thereby causing the vibration of the plate 1710. The vibration of the plate 1710 (for example, the second plate 1714) may be transmitted to the acoustic-to-electric conversion element 1730 through the sound inlet 1770. The acoustic-to-electric conversion element 1730 may generate a corresponding electrical signal based on the received vibration.

[0147] and Fig.16Compared with the resonant system formed by the vibration assembly of the vibration sensor device 1600 shown in , the vibration sensor device 1700 has a first plate 1712. Under the same other conditions (e.g., liquid density, material of the vibrating member, elastic modulus, etc.), the resonant system formed by the vibration assembly of the vibration sensor 1700 has a relatively small system stiffness. The system mass provided by the liquid in the target cavity 1720 of the vibration sensor device 1700 for the vibration assembly can be less than the system mass provided by the liquid in the target cavity 1620 of the vibration sensor device 1600 for the vibration assembly. The second resonant frequency of the vibration sensor device 1700 can be greater than, less than or equal to the second resonant frequency of the vibration sensor device 1600, which depends on the ratio of the system stiffness to the system mass. The second resonant frequency of the vibration sensor device 1700 can also be set and / or adjusted by setting and / or adjusting the structural parameters of one or more elements (e.g., the first plate 1712, the second plate 1714, the target cavity 1720, etc.) in the vibration assembly, thereby improving the sensitivity of the vibration sensor device 1700.

[0148] Fig.18 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.18 As shown, the vibration sensing device 1800 may include a first housing 1851, an air conduction vibration sensor, a vibration assembly, and a target cavity 1820. The air conduction vibration sensor may include a second housing 1852, an acoustic-to-electric conversion element 1830, and a sound inlet hole 1870. The vibration assembly may include a plate 1810 and a liquid filled in the target cavity 1820. One or more elements in the vibration sensing device 1800 may be connected to the target cavity 1820. Fig.15 One or more elements of the vibration sensing device 1500 shown are the same or similar. For example, the first housing 1851, the second housing 1852, the acoustic-to-electric conversion element 1830, etc. in the vibration sensing device 1800 may be the same or similar to the first housing 1551, the second housing 1552, the acoustic-to-electric conversion element 1530, etc. in the vibration sensing device 1500, respectively.

[0149] Fig.18 The vibration sensing device 1800 shown is Fig.15The difference of the vibration sensing device 1500 shown is that the plate 1810 in the vibration assembly of the vibration sensing device 1800 may include a first plate 1812 and a second plate 1814. The first plate 1812 and the second plate 1814 may be physically connected to the first housing 1851. For example, both ends of the first plate 1812 and / or the second plate 1814 may be physically connected to the first housing 1851 (e.g., the side wall 1851-1 and the side wall 1851-2 of the first housing 1851), respectively. The second plate 1814 and at least a portion of the second housing 1852 and at least a portion of the first housing 1851 (e.g., the side wall 1851-2 and the side wall 1851-2 of the first housing 1851) define and / or form a cavity 1854. The first plate 1812, the second plate 1814, and a portion of the first housing 1851 (e.g., the sidewall 1851-2 and the sidewall 1851-2 of the first housing 1851) define and / or form a target cavity 1820. The first plate 1812 and at least a portion of the first housing 1851 (e.g., the sidewall 1851-2, the sidewall 1851-2, and the bottom wall 1851-3 of the first housing 1851) define and / or form a cavity 1855. In some embodiments, the target cavity 1820 is filled with a liquid. The cavity 1854 and / or the cavity 1855 may be vacuum or filled with one or more gases (e.g., air, oxygen, nitrogen, an inert gas, etc.).

[0150] In some embodiments, the first plate 1812, the second plate 1814, and the liquid in the target cavity 1820 may constitute a vibration component of the vibration sensing device 1800. The vibration component may form a resonant system to provide a second resonant frequency for the vibration sensing device 1800. The first plate 1812 (or the first plate 1812 and the gas filled in the cavity 1855) and the second plate 1814 (or the second plate 1814 and the gas filled in the cavity 1854) may serve as springs of the resonant system to provide system stiffness for the resonant system, and the liquid filled in the target cavity 1820 may serve as a mass block of the resonant system to provide system mass for the resonant system.

[0151] In some embodiments, the vibration generated by the first shell 1851 can be transmitted to the plate 1810, and the vibration of the plate 1810 (for example, the second plate 1814) can pass through the cavity 1854 and the sound inlet hole 1870, for example, by vibrating the air in the second cavity 1854 and the air in the sound inlet hole 1870, and transmit the vibration to the sound-to-electric conversion element 1830. The sound-to-electric conversion element 1830 can generate a corresponding electrical signal based on the received vibration. By setting different numbers of plates (for example, Fig.15 or Fig.16 A plate shown in Fig.18The two plates shown in the figure can change the system stiffness of the resonant system formed by the vibration component. The system mass of the resonant system formed by the vibration component can be changed by changing and / or setting the mass of the liquid in the target cavity, and then the second resonant frequency of the vibration sensor device can be adjusted and / or set, so that the resonant frequency of the vibration sensor device can be adjusted according to actual needs and the sensitivity of the vibration sensor device can be improved in different frequency ranges.

[0152] Fig.19 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.19 As shown, the vibration sensing device 1900 may include a first housing 1951, an air conduction vibration sensor, a vibration assembly, and a target cavity 1920. The air conduction vibration sensor may include a second housing 1952 and an acoustic-to-electric conversion element 1930. The acoustic-to-electric conversion element 1930 may include a sound inlet hole 1970. The plate 1910 may include a first plate 1912 and a second plate 1914.

[0153] One or more components of the vibration sensing device 1900 may be connected to Fig.18 One or more elements of the vibration sensing device 1800 shown are the same or similar. For example, the first housing 1951, the second housing 1952, the acoustic-to-electric conversion element 1930, etc. in the vibration sensing device 1900 may be the same or similar to the first housing 1851, the second housing 1852, the acoustic-to-electric conversion element 1830, etc. in the vibration sensing device 1800, respectively.

[0154] Fig.19 The vibration sensing device 1900 shown is Fig.18 The difference of the vibration sensing device 1800 shown is that the second plate body 1914 in the vibration plate 1910 is connected to or disposed adjacent to at least a portion of the second shell 1952 (for example, the side wall 1953 of the second shell 1952).

[0155] The first plate 1912, the second plate 1914, and at least a portion of the first shell 1951 (e.g., the sidewall 1951-2 and the bottom wall 1951-3 of the first shell 1951) define and / or form a target cavity 1920. The target cavity 1920 may be filled with liquid. The first plate 1912 and at least a portion of the first shell 1951 (e.g., the sidewall 1951-2, the bottom wall 1951-2 and the bottom wall 1951-3 of the first shell 1951) define and / or form a cavity 1955. The cavity 1955 may be vacuum or filled with gas. In some embodiments, the vibration assembly of the vibration sensing device 1900 can be composed of at least a portion of the second plate 1914 (for example, the portion of the second plate 1914 that is acoustically connected to the sound inlet hole 1970), the first plate 1912, and the liquid in the target cavity 1920, and the vibration assembly can form a resonant system to provide a second resonant frequency for the vibration sensing device 1900. At least a portion of the second plate 1914 and the first plate 1912 (or the gas filled in the first plate 1912 and the cavity 1955) can be used as springs of this resonant system to provide system stiffness for the resonant system. The liquid filled in the target cavity 1920 can be used as a mass block of the resonant system to provide system mass for the resonant system. In some embodiments, the vibration generated by the first shell 1951 can be transmitted to the plate 1910, and the vibration of the plate 1910 (for example, at least a portion of the second plate 1914) can be transmitted to the sound-to-electric conversion element 1930 through the sound inlet hole 1970 of the sound-to-electric conversion element 1930. The acoustic-to-electric conversion element 1930 can generate a corresponding electrical signal based on the received vibration.

[0156] and Fig.18 Compared with the vibration assembly of the vibration sensor device 1800 shown in FIG. 1 , due to the effect of the side wall 1953 of the second shell 1952, Fig.19 The vibrating size of the second plate 1914 in the vibration sensor device 1900 is smaller than Fig.18 The vibrating size of the second plate 1814 in Fig.19 The second plate 1914 of the vibration sensor device 1900 provides a system stiffness greater than Fig.18 The second plate 1914 of the vibration sensing device 1800 provides stiffness for the vibration assembly. Fig.19 The second resonant frequency provided by the vibration component in the vibration sensing device 1900 may be greater than Fig.18The vibration assembly in the vibration sensor device 1800 provides a second resonant frequency. The second resonant frequency of the vibration sensor device 1800 can be limited and / or adjusted by setting and / or adjusting the structural parameters of one or more elements in the vibration assembly (for example, the size and / or position of the first plate 1912, the size and / or position of the second plate 1914, etc.), so as to obtain the desired or ideal second resonant frequency of the vibration sensor device 1900 and improve the sensitivity of the vibration sensor device 1900 in the frequency range including the desired or ideal second resonant frequency.

[0157] Fig. 20 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig. 20 As shown, the vibration sensing device 2000 may include a first housing 2051, an air conduction vibration sensor, a vibration assembly, and a target cavity 2020. The air conduction vibration sensor may include a second housing 2052, an acoustic-to-electric conversion element 2030, and a sound inlet hole 2070.

[0158] The plate 2010 and the liquid filled in the target cavity 2020 may constitute a vibration component of the vibration sensing device 2000. One or more components of the vibration sensing device 2000 may be connected to the target cavity 2020. Fig.16 One or more elements in the vibration sensing device 1600 shown are the same or similar. For example, the first housing 2051, the second housing 2052, the acoustic-to-electric conversion element 2030, the target cavity 2020, etc. in the vibration sensing device 2000 may be the same or similar to the first housing 1651, the second housing 1652, the acoustic-to-electric conversion element 1630, the target cavity 1620, etc. in the vibration sensing device 1600, respectively.

[0159] Fig. 20 The vibration sensor device 2000 shown in FIG. Fig.16 The difference of the vibration sensing device 1600 shown is that the target cavity 2020 may include one or more sub-cavities defined by elastic membranes, for example, sub-cavity 2022, sub-cavity 2024 and sub-cavity 2026.

[0160] In some embodiments, the elastic membrane and the subcavity defined by it and the filler contained in the subcavity can be regarded as an elastic entity, which can be deformed when subjected to pressure, such as the vibration signal transmitted by the liquid can compress the elastic entity, causing the elastic membrane, the subcavity and the filler contained in the subcavity to deform and / or displace. The plate body 2010, the subcavity and its filler, and the liquid filled in the target cavity 2020 can constitute a vibration component to provide a second resonance system for the vibration sensing device 2000. Among them, the plate body 2010 and the subcavity and its filler can be used as springs of the resonance system to provide system stiffness for the resonance system, and the liquid filled in the target cavity 2020 can be used as a mass block of the resonance system to provide system mass for the resonance system.

[0161] Compared with the vibration sensor device 1600 filled with liquid, the vibration sensor device 2000 filled with liquid and sub-cavity may have excessive stiffness and excessive damping, which affects the sensitivity of the sensor device 1600, because the liquid in the target cavity 1620 in the sensor device 1600 is incompressible. Since the sub-cavity in the target cavity of the vibration sensor device 2000 is compressible and has low stiffness, the equivalent stiffness of the liquid and the sub-cavity is small, and the second resonant frequency of the vibration sensor device 2000 can be lower than the second resonant frequency of the vibration sensor device 1600. By setting the sub-cavity in the target cavity, the frequency response of the vibration sensor device 2000 can be effectively controlled, thereby improving the overall sensitivity of the vibration sensor device 2000, the frequency response curve is relatively flat, and the effective bandwidth (satisfying the flat frequency response condition) can cover a larger range. In some embodiments, by adjusting the ratio of the volume of the sub-cavity to the volume of the liquid in the vibration sensor device 2000, the position of the second resonant frequency of the vibration sensor device 2000 can be adjusted and / or set, so that the frequency response curve of the vibration sensor device 2000 can be optimized to be flatter. For details about the sub-cavity, please refer to Figure 5 and its related description.

[0162] Fig.21 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig.21 As shown, the vibration sensing device 2100 may include a first housing 2151, an air conduction vibration sensor, a vibration assembly, and a target cavity 2120. The air conduction vibration sensor may include a second housing 2152 and an acoustic-to-electric conversion element 2130. The acoustic-to-electric conversion element 2130 may include a sound inlet hole 2170. The sound inlet hole 2170 may be disposed on the second housing 2152 (e.g., a side wall 2153 of the second housing 2152). One or more elements in the vibration sensing device 2100 may be connected to the second housing 2152. Fig.15One or more elements of the vibration sensing device 1500 shown are the same or similar. For example, the first housing 2151, the second housing 2152, the acoustic-to-electric conversion element 2130, etc. in the vibration sensing device 2100 may be the same or similar to the first housing 1551, the second housing 1552, the acoustic-to-electric conversion element 1530, etc. in the vibration sensing device 1500, respectively.

[0163] Fig.21 The vibration sensing device 2100 shown is Fig.15 The difference between the vibration sensing device 1500 shown is that the size of the target cavity 2120 of the vibration sensing device 2100, for example, the size along the X-axis direction, is smaller than the size of the target cavity 1520 of the vibration sensing device 1500 along the X-axis direction.

[0164] like Fig.21As shown, the target cavity 2120 of the vibration sensing device 2100 is defined and / or formed by the plate 2110 and at least a portion of the first shell 2151 (for example, the side wall 2151-1, the side wall 2151-2 and the bottom wall 2151-3 of the first shell 2151). The plate 2110 may include a vibration plate (also referred to as a flexible plate), and at least a portion of the plate 2110 may be physically connected to the first shell 2151. For example, both ends of the plate 2110 may be physically connected to the side wall 2151-1 and the side wall 2151-2 of the first shell 2151, respectively. The vibration assembly of the vibration sensing device 2100 may include the plate 2110 and the liquid filled in the target cavity 2120. In some embodiments, the plate 2110 and the liquid in the target cavity 2120 may constitute the vibration assembly of the vibration sensing device 2100. In some embodiments, the vibration assembly may form one or more resonant systems to provide a second resonant frequency for the vibration sensing device 2100. In some embodiments, the length of the first housing 2151 along the X-axis direction may be smaller than the length of the second housing 2152 along the X-axis direction, and the first housing 2151 may be connected to a portion of the air conduction vibration sensor (e.g., a portion of the side wall 2153 of the second housing 2152). Since the size of the plate 2110 of the vibration sensing device 2100 is smaller than the size of the plate 1510 of the vibration sensing device 1500, under the same other conditions, the system stiffness provided by the plate 2110 of the vibration sensing device 2100 for the vibration component is greater than the system stiffness provided by the plate 1510 of the vibration sensing device 1500 for its vibration component. The system mass provided by the liquid in the target cavity 2120 of the vibration sensing device 2100 for the resonance system may be smaller than the mass provided by the liquid in the target cavity 1520 of the vibration sensing device 1500 for the vibration component. The second resonance frequency of the vibration sensing device 2100 may be greater than the second resonance frequency of the vibration sensing device 1500. By adjusting the length of the first shell 2151 along the X-axis direction, the system stiffness and system mass of the resonance system provided by the vibration component can be reduced, so that the second resonance frequency of the vibration sensor device 2100 can be adjusted and / or set according to actual needs to improve the sensitivity of the vibration sensor device. At the same time, the volume of the shell 2151 can be reduced to improve the user experience.

[0165] In some embodiments, an adjustment element may be provided in the first housing 2151 to adjust the size of the target cavity and thereby adjust the structural parameters of the vibration assembly. Fig. 22 is a cross-sectional view of an exemplary vibration sensor device according to some embodiments of the present application. Fig. 22As shown, the vibration sensing device 2200 may include a first housing 2251, an air conduction vibration sensor, a vibration component, and a target cavity 2220. The air conduction vibration sensor may include a second housing 2252, an acoustic-to-electric conversion element 2230, and a sound inlet hole 2270. The plate 2210 and the liquid filled in the target cavity 2220 may constitute the vibration component of the vibration sensing device 2200. One or more elements in the vibration sensing device 2200 may be connected to the target cavity 2220. Fig.21 One or more elements in the vibration sensor device 2100 shown are the same or similar. For example, the first housing 2251, the second housing 2252, the acoustic-to-electric conversion element 2230, the sound inlet hole 2270, etc. in the vibration sensor device 2200 may be the same or similar to the first housing 2151, the second housing 2152, the acoustic-to-electric conversion element 2130, the sound inlet hole 2170, etc. in the vibration sensor device 2100, respectively.

[0166] Fig. 22 The vibration sensing device 2200 shown is Fig.21 The difference between the vibration sensing device 2100 shown in the figure includes that the vibration sensing device 2200 may include an adjustment element 2240, and the adjustment element 2240 may be disposed in the first shell 2251 and at least a portion of the first shell 2252 (for example, the side wall 2253 of the second shell 2152). For example, the adjustment element 2240 may be physically connected to the second shell 2252 (for example, the side wall 2253 of the second shell 2252) and the first shell 2251 (for example, the bottom wall 2251-3 of the first shell 2251). In some embodiments, the adjustment element 2240 may be disposed in the target cavity 2220 or used to constitute a portion of the cavity wall of the target cavity 2220, for example, as Fig. 22As shown, the two ends of the plate body 2220 can be connected to the adjustment element 2240 and the side wall 2251-1 of the first shell 2251, respectively, and the adjustment element 2240, the plate body 2210 and a part of the first shell 2251 (for example, the side wall 2251-1 and the bottom wall 2251-3 of the first shell 2251) can define the target cavity 2220. By setting and / or adjusting the adjustment element 2240, the structural parameters of the vibration assembly can be set and / or adjusted, thereby adjusting the magnitude of the second resonant frequency of the vibration sensing device 2200. For example, by changing the size and / or position of the adjustment element 2240, the size of the plate body 2210 and / or the mass of the liquid in the target cavity 2220 can be adjusted, thereby adjusting the second resonant frequency of the vibration sensing device 2200. In some embodiments, the position of the adjustment element 2240 can be adjusted during the production and assembly process of the vibration sensor device 2200 or after the assembly is completed to adjust the structural parameters of the plate body 2210 and / or the target cavity 2220, so that the sensitivity of the vibration sensor device 2200 can be improved in different frequency ranges according to actual conditions to meet the personalized setting requirements of different users.

[0167] The description of the above-mentioned vibration sensing device 2100 and / or vibration sensing device 2200 is for illustrative purposes only and is not intended to limit the scope of the present application. For those of ordinary skill in the art, various changes and modifications can be made based on the description of the present application. For example, one or more sub-cavities filled with solids, liquids and / or gases may be provided in the target cavity 2120 of the vibration sensing device 2100 and / or the target cavity 2220 of the vibration sensing device 2200 to improve the compressibility of the target cavity 2220 and facilitate the adjustment and / or setting of the second resonant frequency of the vibration sensing device 2200. For details about the sub-cavities, see Figure 6 Such changes and modifications are still within the protection scope of this application.

[0168] The basic concepts have been described above. Obviously, for those skilled in the art, the above invention disclosure is only used as an example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0169] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment" and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or multiple times in different positions in the present application does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0170] In addition, those skilled in the art will appreciate that various aspects of the present application may be illustrated and described by a number of patentable categories or situations, including any new and useful process, machine, product or combination of materials or any new and useful improvements thereof.

[0171] In addition, unless explicitly stated in the claims, the order of processing elements and sequences, the use of alphanumeric characters, or the use of other names in the present application are not intended to limit the order of the processes and methods of the present application. Although the above disclosure discusses some invention embodiments that are currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of the present application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0172] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0173] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used to describe the embodiments are modified by modifiers such as "approximately", "approximately" or "substantially" in some examples. Unless otherwise specified, "approximately", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical data should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and data used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

Claims

1. A vibration sensing device, include: A vibration sensor having a first resonant frequency, at least one vibration component, for transmitting the received vibration to the vibration sensor, the vibration component comprising a liquid disposed in the target cavity and a plate constituting a part of a cavity wall of the target cavity, The liquid in the target cavity and the plate body constitute a resonance system, providing at least one second resonance frequency for the vibration sensing device, so that the frequency response curve of the vibration sensing device has resonance peaks at both the first resonance frequency and the at least one second resonance frequency, and the at least one second resonance frequency is different from the first resonance frequency.

2. The vibration sensor device according to claim 1, It is characterized in that The target cavity comprises a first sub-cavity and a second sub-cavity, wherein the first sub-cavity is used to contain the liquid, and the second sub-cavity is used to contain one or more fillers selected from gas, liquid or solid.

3. The vibration sensor device according to claim 2, It is characterized in that It further includes an adjusting element, wherein the adjusting element is used to adjust the size of the first sub-cavity or the second sub-cavity.

4. The vibration sensor device according to claim 1, It is characterized in that The vibration sensor comprises a bone conduction vibration sensor, and the bone conduction vibration sensor comprises a housing, an acoustic-electric conversion element, and a vibration transmission element. The housing vibrates in response to an external vibration signal, and the vibration transmission element transmits the vibration to the acoustic-electric conversion element. The at least one vibration component is used to receive the vibration of at least one of the shell or the vibration transmission element and transmit it to the acoustic-to-electric conversion element. The acoustic-to-electric conversion element has different frequency responses to the vibration transmitted by the vibration transmission element and the vibration transmitted by the at least one vibration component.

5. The vibration sensor device according to claim 4, It is characterized in that The plate body includes a first plate body and a second plate body, and the first plate body and the second plate body divide the space inside the shell into multiple cavities. The multiple cavities include a first cavity defined by the first plate body, the second plate body and the vibration transmission element, a second cavity defined by the first plate body and a part of the shell, and a third cavity defined by the second plate body and a part of the shell. The target cavity includes one or more of the multiple cavities.

6. The vibration sensor device according to claim 5, It is characterized in that The target cavity includes the first cavity, and the acoustic-to-electric conversion element is disposed in the first cavity.

7. The vibration sensor device according to claim 6, It is characterized in that The vibration assembly further includes a vibration pickup element, which is disposed between the housing and the vibration transmission element and is used to vibrate in response to the vibration of the housing. The vibration assembly is used to form one or more resonance systems. The one or more resonance systems include a first resonance system and a second resonance system, The first resonance system is composed of the liquid and the plate. The second resonance system is composed of the vibration pickup element, the vibration transmission element, the acoustic-to-electric conversion element, the liquid and the plate.

8. The vibration sensor device according to claim 5, It is characterized in that The target cavity includes at least one of the second cavity or the third cavity, and the vibration component further includes a vibration pickup element disposed between the shell and the vibration transmission element. The vibration component is used to form one or more resonance systems.

9. The vibration sensor device according to claim 8, It is characterized in that The first plate body and the second plate body include rigid plates, The one or more resonance systems include a resonance system composed of the vibration transmission element, the acoustic-to-electric conversion element, the liquid, the plate, and the vibration pickup element.

10. The vibration sensor device according to claim 8, It is characterized in that The first plate body and the second plate body include flexible plates, The one or more resonance systems include a first resonance system and a second resonance system, The first resonance system is composed of the vibration transmission element, the acoustic-electric conversion element, the liquid, the plate, and the vibration pickup element. The second resonance system is composed of the first plate, the acoustic-electric conversion element, and the second plate.

11. The vibration sensor device according to claim 10, It is characterized in that The invention further comprises a supporting element, wherein the acoustic-to-electric conversion element is arranged in the first cavity and divides the first cavity into a first gas cavity and a second gas cavity, wherein a first end of the acoustic-to-electric conversion element is connected to the supporting element, and a second end of the acoustic-to-electric conversion element is connected to the vibration transmission element. The first plate or the second plate receives the vibration of the liquid or the vibration pickup element, and transmits the vibration to the acoustic-electric conversion element through the first gas cavity or the second gas cavity to form the second resonance system.

12. The vibration sensor device according to claim 1, It is characterized in that The vibration sensor comprises an air conduction vibration sensor, the air conduction vibration sensor comprises an acoustic-electric conversion element and a sound inlet hole, the vibration sensing device further comprises a shell physically connected to the vibration component, the shell and a part of the vibration sensor form a receiving space for receiving the vibration component; The housing is configured to generate vibration in response to an external vibration signal, The vibration assembly is acoustically connected to the acoustic-to-electric conversion element through the sound inlet hole, and is used to receive the vibration generated by the shell and transmit the vibration to the acoustic-to-electric conversion element through the sound inlet hole.

13. The vibration sensor device according to claim 12, It is characterized in that The plate body is at least partially physically connected to the shell or disposed in the sound inlet hole, and the target cavity includes a cavity defined by at least the plate body and at least a portion of the shell.

14. The vibration sensor device according to claim 13, It is characterized in that The plate body includes a first plate body and a second plate body, at least one of the first plate body and the second plate body is physically connected to the shell or arranged in the sound inlet hole, and the target cavity includes a cavity defined by at least the first plate body, the second plate body and at least a portion of the shell.

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