A high-performance ultra-thin copper-graphene heat pipe for mobile phones and its preparation method

Abstract

The present invention discloses a high-performance ultra-thin copper-graphene heat pipe for mobile phones and a preparation method thereof, including a first substrate. A first groove is formed in the first substrate, and a first graphene sheet is embedded in the first groove. The first substrate abuts against a second substrate. A second groove is formed in the second substrate, and a second graphene sheet is embedded in the second groove. The first substrate and the second substrate are encapsulated by a third substrate. In the present invention, the effectiveness of the horizontal-vertical heat conduction channels constructed by copper-graphene in the composite heat pipe is proved. This structure greatly improves the overall thermal conductivity of the material. At the same time, the theory that graphene directly contacting the heat source can quickly conduct heat is proved. The composite heat pipe has excellent performance of efficiently transferring heat and efficiently conducting heat, meeting the market demand for heat dissipation with low thickness and high thermal conductivity.

Description

Technical Field

[0001] The present invention relates to the technical field of heat pipes, and particularly to a high-performance ultra-thin copper-graphene heat pipe for mobile phones and a preparation method thereof. Background Art

[0002] Nowadays, mobile phones, tablets and various derivative products are all developing towards lightweight and ultra-thin. However, with the increasing power consumption of processors and other components, in order to provide users with a better hand temperature experience, mobile phones need to achieve stronger heat dissipation under thinner conditions. Due to the strict limitations on the size and internal space of mobile phones, simply increasing the heat conduction area cannot solve the current problem. Heat pipes have always been a good heat dissipation solution. Through heat pipes, heat can be effectively conducted out from the processor and other heat sources and dissipated into the air. However, limited by the internal structure of heat pipes, current ultra-thin heat pipes are not only expensive but also difficult to further reduce the thickness with less performance loss. Therefore, there is an urgent need in the market for a heat dissipation material with ultra-thin thickness and high thermal conductivity. Summary of the Invention

[0003] The purpose of the present invention is to provide a high-performance ultra-thin copper-graphene heat pipe for mobile phones and a preparation method thereof to solve the above problems.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A high-performance ultra-thin copper-graphene heat pipe for mobile phones includes a first substrate. A first groove is formed on the first substrate, and a first graphene sheet is embedded in the first groove. The first substrate abuts against a second substrate. A second groove is formed on the second substrate, and a second graphene sheet is embedded in the second groove. The first substrate and the second substrate are encapsulated by a third substrate.

[0006] Preferably, the first graphene sheet contacts the heat source, and the second graphene sheet is bent to contact the first substrate.

[0007] A preparation method of a high-performance ultra-thin copper-graphene heat pipe for mobile phones is characterized by comprising the following steps:

[0008] S1: Shear a graphene film with a specification of 100 μm into a first graphene sheet with dimensions of 80 mm * 54 mm * 0.1 mm and a second graphene sheet with dimensions of 72 mm * 10 mm * 0.1 mm.

[0009] S2: Take a copper first substrate with a specification of 150 mm * 60 mm * 0.25 mm, and embed the first graphene sheet with dimensions of 80 mm * 54 mm * 0.1 mm in step S1 into the first substrate.

[0010] S3: Take a copper substrate two with a specification of 150mm * 60mm * 0.25mm, and embed the graphene sheet two with a size of 72mm * 10mm * 0.1mm in step S1 into the substrate two;

[0011] S4: Put the assembly in step S3 on the encapsulation substrate three to obtain the overall radiator in preliminary assembly;

[0012] S5: Carry out vacuum hot pressing on the assembly at 1085 °C and 40 MPa for 30 min for shaping to obtain the finished heat pipe.

[0013] Preferably, the graphene sheet two in step S4 is in a long strip shape and contacts the substrate one.

[0014] Preferably, an insulating layer is provided on the outer side of the substrate three.

[0015] In summary, due to the adoption of the above technical solutions, the beneficial effects of the present invention are as follows:

[0016] 1. In this application, it is proved the effectiveness of the horizontal - vertical heat conduction channels constructed by copper - graphene in the composite heat pipe. This structure greatly improves the overall thermal conductivity of the material. At the same time, it proves the theory that graphene in direct contact with the heating element can quickly conduct heat. The composite heat pipe has excellent performance of efficiently transferring heat and efficiently conducting heat, meeting the market demand for heat dissipation with low thickness and high thermal conductivity.

[0017] 2. In this application, under the same conditions, the temperature of the heating element using the composite heat pipe is much lower than that of the copper plate with the same size, and is slightly lower than that of the traditional copper heat pipe with a thickness more than three times its thickness, showing good heat dissipation effect. Brief Description of the Drawings

[0018] Figure 1 Shows the overall structure schematic diagram of the heat pipe provided by the embodiment of the present invention;

[0019] Figure 2 Shows the schematic diagrams of each structure of the heat pipe provided by the embodiment of the present invention;

[0020] Figure 3 Shows the schematic diagram of the comparison result of heat dissipation performance provided by the embodiment of the present invention.

[0021] Legend Explanation:

[0022] 1. Substrate one; 2. Groove one; 3. Graphene sheet one; 4. Substrate two; 5. Groove two; 6. Graphene sheet two; 7. Substrate three. Detailed Embodiments

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0024] Please refer to Figures 1-3 , the present invention provides a technical solution:

[0025] A high-performance ultra-thin copper-graphene heat pipe for mobile phones, including a first substrate 1, characterized in that a first groove 2 is provided on the first substrate 1, a first graphene sheet 3 is embedded in the first groove 2, the first substrate 1 abuts against a second substrate 4, a second groove 5 is provided on the second substrate 4, a second graphene sheet 6 is embedded in the second groove 5, and the first substrate 1 and the second substrate 4 are encapsulated by a third substrate 7.

[0026] The first graphene sheet 3 contacts the heat source, and the second graphene sheet 6 is bent to contact the first substrate 1.

[0027] A preparation method of a high-performance ultra-thin copper-graphene heat pipe for mobile phones, characterized in that it includes the following steps:

[0028] S1: Shear a graphene film with a specification of 100 μm into a first graphene sheet 3 and a second graphene sheet 6 with sizes of 80 mm * 54 mm * 0.1 mm and 72 mm * 10 mm * 0.1 mm respectively;

[0029] S2: Take a copper first substrate 1 with a specification of 150 mm * 60 mm * 0.25 mm, and embed the first graphene sheet 3 with a size of 80 mm * 54 mm * 0.1 mm in step S1 into the first substrate 1;

[0030] S3: Take a copper second substrate 4 with a specification of 150 mm * 60 mm * 0.25 mm, and embed the second graphene sheet 6 with a size of 72 mm * 10 mm * 0.1 mm in step S1 into the second substrate 4;

[0031] S4: Put the assembly in step S3 on the encapsulation third substrate 7 to obtain the overall preliminarily assembled radiator;

[0032] S5: Vacuum hot press the assembly at 1085 °C and 40 MPa for 30 min to obtain the finished heat pipe by shaping.

[0033] The second graphene sheet 6 in S4 is strip-shaped and contacts the first substrate 1.

[0034] An insulating layer is provided on the outer side of the third substrate 7.

[0035] The foregoing description of the embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high-performance ultra-thin copper-graphene heat pipe for mobile phones, comprising a first substrate (1), characterized in that, A first substrate (1) is provided with a first groove (2), and a first graphene sheet (3) is embedded in the first groove (2). The first substrate (1) abuts against a second substrate (4). The second substrate (4) is provided with a second groove (5), and a second graphene sheet (6) is embedded in the second groove (5). The first substrate (1) and the second substrate (4) are encapsulated by a third substrate (7). The first graphene sheet (3) is in contact with a heat source, and the second graphene sheet (6) is bent to be in contact with the first substrate (1). An insulating layer is provided on the outer side of the third substrate (7).

2. A preparation method of a high-performance ultra-thin copper-graphene heat pipe for mobile phones, characterized in that, It includes the following steps: S1: Shear a graphene film with a specification of 100 μm into a first graphene sheet (3) with dimensions of 80 mm * 54 mm * 0.1 mm and a second graphene sheet (6) with dimensions of 72 mm * 10 mm * 0.1 mm. S2: Take a copper first substrate (1) with a specification of 150 mm * 60 mm * 0.25 mm, and embed the first graphene sheet (3) with dimensions of 80 mm * 54 mm * 0.1 mm obtained in S1 into the first substrate (1). S3: Take a copper second substrate (4) with a specification of 150 mm * 60 mm * 0.25 mm, and embed the second graphene sheet (6) with dimensions of 72 mm * 10 mm * 0.1 mm obtained in S1 into the second substrate (4). S4: Put the assembly obtained in S3 on the encapsulating third substrate (7) to obtain an overall preliminarily assembled heat sink. S5: Carry out vacuum hot pressing on the assembly at 1085 °C and 40 MPa for 30 min to obtain a finished heat pipe after shaping. The second graphene sheet (6) in S4 is in the shape of a long strip and is in contact with the first substrate (1).

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