Water cooled head device with pump

Abstract

The present application provides a water-cooling head device with a pump, which is suitable for driving a fluid to exchange heat, and comprises a heat conduction unit, a flow guide unit and a housing unit. The heat conduction unit comprises a heat conductor. The flow guide unit comprises a flow guide cover and a flow guide plate. The flow guide cover cooperates with the heat conductor to define a heat dissipation chamber. The flow guide cover has a water blocking portion. The flow guide plate is arranged in the heat dissipation chamber. One end of the flow guide plate abuts against the water blocking portion to divide the heat dissipation chamber into an upper flow channel and a lower flow channel. The housing unit comprises a housing and a pump module. The pump module drives the fluid in the housing to enter the upper flow channel, enter the lower flow channel and return to the housing, so as to exchange heat with the heat conductor.

Description

TECHNICAL FIELD

[0001] The present invention relates to a water-cooling head device, in particular, a water-cooling head device with a pump. BACKGROUND

[0002] A computer is composed of many semiconductor chips to operate electronic signals. When the semiconductor chips operate the electronic signals, heat is generated. When the heat is accumulated too much and cannot be dissipated, the temperature will be too high and cause damage to the semiconductor chips.

[0003] In the early stage, the electronic components in the semiconductor are not densely composed, and the generated heat is less. The general passive heat dissipation fins can effectively dissipate the heat generated by the semiconductor to the outside.

[0004] However, with the progress of semiconductor technology, more transistors can be arranged in a unit volume of semiconductor chip, which will cause the semiconductor chip to generate a large amount of heat. Therefore, an active heat sink must be provided to effectively dissipate the heat generated by the semiconductor chip to the outside.

[0005] Reference Figure 1 Patent No. 202006305A of Taiwan, China, describes a water-cooling head 1, which includes a housing 11, a liquid inlet 12 arranged in the housing 11, a liquid outlet 13 arranged in the housing 11, an impeller 14 arranged inside the housing 11, a heat conductor 15 arranged inside the housing 11, and a shaft 16 arranged inside the housing 11.

[0006] Among them, the rotating direction of the impeller 14 is parallel to the arrangement direction of the heat conductor 15, the liquid inlet 12 is arranged at the side of the heat conductor 15, the liquid flows from the side of the heat conductor 15 to the center of the heat conductor 15, and is turned outward by the centrifugal force of the rotation of the impeller 14, and flows out to the liquid outlet 13.

[0007] Although the prior art discloses a water-cooling head, actual use still has the following disadvantages:

[0008] I. Slow flow speed:

[0009] When the impeller rotates, suction will be generated at the center to suck the liquid at the heat conductor, and the liquid is discharged outward by centrifugal force. Generally speaking, the "suction liquid" and "push liquid" under the same power, the suction liquid has lower power and slower liquid flow rate.

[0010] II. Easy to accumulate heat:

[0011] At the heat conductor, the liquid flows from the periphery to the center of the heat conductor, resulting in a higher temperature at the center of the heat conductor. This causes heat to accumulate at the center of the semiconductor chip and cannot be effectively dissipated.

[0012] III. Prone to malfunction:

[0013] The shaft is inserted into the housing, the rotor is placed in the liquid, and the magnet is placed inside the housing. The rotor rotates as a whole in the liquid. Tiny foreign objects in the liquid will accumulate and wear down the rotor, making the rotor with impellers prone to failure.

[0014] Therefore, how to effectively guide the flow of liquid and effectively dissipate the heat generated by semiconductor crystals is a goal that relevant technical personnel urgently need to strive for. Summary of the Invention

[0015] In view of this, the object of the present invention is to provide a pumped water cooling head device suitable for driving a fluid to perform heat exchange, the pumped water cooling head device comprising a heat conducting unit, a flow guiding unit, and a housing unit.

[0016] The heat-conducting unit includes a heat conductor.

[0017] The flow guiding unit includes a flow guiding cover disposed on the heat conductor and a flow guiding plate. The flow guiding cover and the heat conductor cooperate to define a heat dissipation chamber. The flow guiding cover has a water-blocking part inside. The flow guiding plate is disposed in the heat dissipation chamber, and one end of the flow guiding plate abuts against the water-blocking part to separate the heat dissipation chamber into an upper flow channel and a lower flow channel.

[0018] The housing unit includes a housing covered by the flow guide cover and capable of containing the fluid, and a pump module disposed in the housing. The pump module drives the fluid in the housing to enter the lower flow channel through the upper flow channel and then return to the housing to exchange heat with the heat conductor.

[0019] Another technical aspect of the present invention is that the pump module described above has a motor disposed in the housing and an impeller connected to the motor and erected vertically. The housing has a drive chamber for accommodating the impeller, and the motor drives the impeller to rotate in the drive chamber.

[0020] Another technical aspect of the present invention is that the aforementioned guide plate defines an XZ plane, the rotation direction of the impeller defines an XY plane, and the XZ plane and the XY plane are perpendicular to each other.

[0021] Another technical aspect of the present invention is that a first flow channel connected to the drive chamber is provided in the aforementioned housing, and a first connection port connected to the first flow channel for fluid input is provided.

[0022] Another technical aspect of the present invention is that the housing is provided with a second flow channel connected to the lower flow channel, a second connection port connected to the second flow channel for fluid output, and a third connection port connected to the second flow channel.

[0023] Another technical aspect of the present invention is that a surrounding wall and a bottom wall connected to the surrounding wall are provided on the aforementioned heat conductor.

[0024] Another aspect of the present invention is that the aforementioned heat-conducting unit further includes a heat-conducting component disposed on the bottom wall and located in the lower flow channel.

[0025] Another technical aspect of the present invention is that the heat-conducting component is composed of multiple heat dissipation fins, and an inclined portion is provided at both the front and rear ends of the heat-conducting component, so that the multiple heat dissipation fins form a shape with lower ends and higher middle.

[0026] Another technical aspect of the present invention is that the above-mentioned guide cover is provided with an inlet and an outlet, the inlet being connected to the upper flow channel and the outlet being connected to the lower flow channel.

[0027] Another technical aspect of the present invention is that the above-mentioned water cooling head device with pump further includes a fixing unit, which includes a fixing bracket connected to the housing and a mounting hole disposed in the fixing bracket.

[0028] The beneficial effect of the present invention is that the centrifugal force of the impeller when it rotates pushes the fluid into the guide cover, and the guide cover directs the fluid to one side of the heat-conducting component, so that it flows through the heat-conducting component to the other side of the heat-conducting component, which can effectively remove the heat of the heat conductor. Attached Figure Description

[0029] Figure 1 It is a cross-sectional schematic diagram illustrating the cross-sectional shape of a cold water head in Taiwan Patent No. 202006305A.

[0030] Figure 2 This is a three-dimensional schematic diagram, illustrating a preferred embodiment of a water-cooled head device with a pump according to the present invention, showing the three-dimensional shape of the water-cooled head device;

[0031] Figure 3 It is a three-dimensional schematic diagram illustrating another three-dimensional form of the water cooling head device in the preferred embodiment;

[0032] Figure 4 It is a top view schematic diagram illustrating the top view shape of the water cooling head device in this preferred embodiment;

[0033] Figure 5This is a cross-sectional schematic diagram illustrating, in this preferred embodiment, the water-cooling head assembly... Figure 4 BB cross-sectional shape

[0034] Figure 6 This is a cross-sectional schematic diagram illustrating, in this preferred embodiment, the water-cooling head assembly... Figure 4 The cross-sectional shape of CC in the image;

[0035] Figure 7 This is an exploded perspective view illustrating the exploded perspective shape of the water-cooling head device in this preferred embodiment; and

[0036] Figure 8 This is a three-dimensional exploded view, illustrating the three-dimensional exploded shape of the water cooling head device from another perspective in this preferred embodiment.

[0037] Symbol explanation:

[0038] 1. Water-cooled injection

[0039] 11. Shell

[0040] 12 Liquid Inlet

[0041] 13 Liquid outlet

[0042] 14 blades

[0043] 15. Heat conductor

[0044] 16 axis

[0045] 3 Thermal Conductive Units

[0046] 31 Heat conductor

[0047] 311 Surrounding the wall

[0048] 312 bottom wall

[0049] 32 Thermal conductive components

[0050] 321 Inclined section

[0051] 4. Flow guiding unit

[0052] 41. Flow deflector cap

[0053] 411 Water-blocking section

[0054] 412 water inlet

[0055] 413 Outlet

[0056] 42 Flow Guide Plate

[0057] 43 Heat dissipation chamber

[0058] 431 Upstream

[0059] 432 Downstream

[0060] 5. Shell Unit

[0061] 51. Housing

[0062] 511 Drive Chamber

[0063] 512 First Stream

[0064] 513 First connection port

[0065] 514 Second Flow Channel

[0066] 515 Second Connection Port

[0067] 516 Third Connection Port

[0068] 52 Pump Module

[0069] 521 motor

[0070] 522 Impeller

[0071] 6 Fixed Units

[0072] 61 Fixture

[0073] 62 Setting Hole

[0074] XY plane

[0075] XZ plane. Detailed Implementation

[0076] The relevant patent features and technical content of this invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. It should be noted before the detailed description that similar components are represented by the same reference numerals.

[0077] See Figure 2 , 3 ,and Figure 7 This is a preferred embodiment of a pumped water cooling head device of the present invention. The pumped water cooling head device is suitable for driving the flow of a heat-conducting fluid. The pumped water cooling head device includes a heat-conducting unit 3, a flow-guiding unit 4, a housing unit 5, and a fixing unit 6.

[0078] See also Figure 4 , Figure 5 ,and Figure 6 , Figure 4 This is a top view of a water-cooled head assembly with a pump. Figure 4 It contains line segments BB and CC. Figure 5yes Figure 4 A cross-sectional view of the midline segment BB. Figure 6 yes Figure 4 A cross-sectional view of the midline segment CC.

[0079] See also Figure 7 and Figure 8 The heat-conducting unit 3 includes a heat conductor 31 and a heat-conducting component 32 disposed on the heat conductor 31.

[0080] The lower surface of the heat conductor 31 can contact a semiconductor chip (not shown) to dissipate heat from the semiconductor chip. The upper surface of the heat conductor 31 is provided with a surrounding wall 311 and a bottom wall 312 connected to the bottom end of the surrounding wall 311. The surrounding wall 311 and the bottom wall 312 cooperate to form a groove on the upper surface of the heat conductor 31. The heat-conducting component 32 is disposed in the groove, and the bottom end of the heat-conducting component 32 contacts the bottom wall 312.

[0081] See Figure 5 The flow guiding unit 4 (see Figure 7 This includes a heat-conducting unit 3 (see reference). Figure 7 The heat conductor 31 has a flow guide cover 41 and a flow guide plate 42, which cooperate with the heat conductor 31 to define a heat dissipation chamber 43.

[0082] The inside of the flow guide cover 41 has a water-blocking part 411. The flow guide plate 42 is disposed in the heat dissipation chamber 43. The upper surface of the flow guide plate 42 abuts against the water-blocking part 411 and divides the heat dissipation chamber 43 into an upper flow channel 431 and a lower flow channel 432. The water-blocking part 411 is used to isolate the fluid entering the lower flow channel 432 and flowing out of the lower flow channel 432.

[0083] The guide cover 41 is provided with an inlet 412 and an outlet 413. The inlet 412 is connected to the upper flow channel 431, and the outlet 413 is connected to the lower flow channel 432. The water blocking part 411 isolates the inlet 412 and the outlet 413.

[0084] See Figure 7 The housing unit 5 includes a housing 51 covered on the flow guide cover 41 and a pump module 52 disposed on the housing 51. The housing 51 can contain the fluid.

[0085] The pump module 52 has a motor 521 disposed in the housing 51 and an impeller 522 connected to the motor 521 and erected vertically. The housing 51 has a drive chamber 511 for accommodating the impeller 522 (see reference). Figure 5The shape of the drive chamber 511 matches the rotation space of the impeller 522, so that the motor 521 can drive the impeller 522 to rotate in the drive chamber 511, and further drive the fluid flow in the drive chamber 511.

[0086] The housing 51 is provided with a first flow channel 512 connected to the drive chamber 511, a first connection port 513 connected to the first flow channel 512 and allowing fluid input, and a lower flow channel 432 (see reference). Figure 5 A second flow channel 514, a second connection port 515 connected to the second flow channel 514 for fluid output, and a third connection port 516 connected to the second flow channel 514 (see reference). Figure 3 ,and Figure 6 ).

[0087] The drive chamber 511 is connected to the inlet 412, and the outlet 413 is connected to the second flow channel 514. When the pump module 52 drives the fluid flow in the housing 51, the fluid sequentially enters the first flow channel 512, the drive chamber 511, the inlet 412, the upper flow channel 431, the lower flow channel 432, the outlet 413, and the second flow channel 514 from the first connection port 513, and then flows outward through the second connection port 515 and the third connection port 516. According to some embodiments of the present invention, the third connection port 516 can allow fluid to flow into the second flow channel 514, and the fluid then flows outward uniformly from the second connection port 515. Alternatively, depending on the design of the external pipeline, the second connection port 515 or the third connection port 516 can be used as the fluid outlet, without limitation.

[0088] Please refer to the following: Figure 5 The heat-conducting component 32 is disposed on the bottom wall 312 (see reference). Figure 7 The bottom surface of the guide plate 42 presses against the top surface of the heat-conducting component 32, which is composed of multiple heat dissipation fins. The height of the multiple heat dissipation fins matches the height of the lower flow channel 432. After the fluid flows into the lower flow channel 432 from the upper flow channel 431, it flows from the right side of the multiple heat dissipation fins to the left side, ensuring full contact between the fluid and the multiple heat dissipation fins to remove their heat. In addition, the multiple heat dissipation fins can conduct heat from the heat conductor 31, which in turn can conduct heat from the semiconductor chip, thus achieving a heat dissipation effect.

[0089] The heat-conducting component 32 has an inclined portion 321 at both its front and rear ends, so that the multiple heat dissipation fins form a shape with lower ends and a higher middle. One inclined portion 321 is located below the interface between the upper flow channel 431 and the lower flow channel 432. The space above the inclined portion 321 allows the fluid entering the lower flow channel 432 from the upper flow channel 431 to be evenly dispersed before flowing into the gaps between the multiple heat dissipation fins. The other inclined portion 321 is located below the outlet 413. The space above the inclined portion 321 allows the fluid flowing out of the multiple gaps to be concentrated before flowing into the second flow channel 514 through the outlet 413.

[0090] Please see Figure 2 , Figure 3 , Figure 7 ,and Figure 8 The flat plate 42 defines an XZ plane by its plate orientation, and the impeller 522 defines an XY plane by its rotation direction. The XZ plane and the XY plane are perpendicular to each other.

[0091] Since the impeller 522 rotates in the XY plane, its rotational force can push the fluid through the inlet 412 and directly impact the upper surface of the guide plate 42. The guide cover 41 designs the upper flow channel 431 as a fan-shaped flow channel (see [link]). Figure 8 The fan-shaped groove next to the lower flow channel 432 is used to guide the fluid impacting the upper surface of the guide plate 42 to enter one side of the lower flow channel 432 evenly.

[0092] See also Figure 5 , Figure 6 , Figure 7 ,and Figure 8 The fixing unit 6 includes a fixing bracket 61 connected to the housing 51 and a mounting hole 62 disposed in the fixing bracket 61. In this preferred embodiment, the housing 51 has a protruding structure at the bottom that matches the shape of the mounting hole 62, so that the bottom of the housing 51 passes through the mounting hole 62. In actual implementation, the housing 51 may not pass through the mounting hole 62, and this should not be a limitation.

[0093] The mounting bracket 61 is locked together with the housing 51, and the heat conductor 31 is locked to the bottom of the housing 51. The mounting bracket 61 can be locked together with the circuit board (not shown in the figure) and make the heat conductor 31 contact the semiconductor chip to exchange heat with the semiconductor chip and remove heat.

[0094] As can be seen from the above description, the water-cooled head device with a pump of the present invention does indeed have the following effects:

[0095] 1. Relatively fast flow rate:

[0096] The impeller 522 rotates in the XY plane, and the guide plate 42 is set in the XZ plane. Therefore, when the impeller 522 rotates, it throws the fluid outward by centrifugal force, so that the fluid impacts the guide plate 42 and enters the upper flow channel 431 and is introduced into the lower flow channel 432. Compared with the prior art, which extracts the fluid from the containment space by means of extraction, this invention can increase the pressure of the fluid by means of impact, thereby accelerating the flow rate of the fluid.

[0097] II. Excellent heat dissipation:

[0098] The inclined portions 321 located on both sides of the heat-conducting component 32 allow fluid to pass evenly through the gaps between the multiple heat dissipation fins and flow from one end of the heat-conducting component 32 to the other end, effectively removing heat from the heat conductor 31 and achieving better heat dissipation.

[0099] Third, it has good durability:

[0100] The motor 521 of the pump module 52 is locked to the housing 51, so the fluid will not come into direct contact with the motor 521. The shaft of the impeller 522 is also not fixed in the housing 51. Therefore, the fluid will not damage the motor 521 or the shaft of the impeller 522. The pump module 52 has better durability.

[0101] In summary, the rotation direction of the impeller 522 is perpendicular to the flat plate setting direction of the guide plate 42, which allows the fluid driven by the impeller 522 by centrifugal force to directly impact the guide plate 42, effectively reducing the loss of flow power. When the fluid in the lower flow channel 432 flows from one end of the heat-conducting component 32 to the other end, it effectively carries away the heat at the center of the heat conductor 31, preventing the heat conductor 31 from accumulating heat and effectively improving the heat dissipation effect. Therefore, the purpose of this invention can indeed be achieved.

[0102] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the description of the invention shall still fall within the scope of the patent of the present invention.

Claims

1. A water-cooled head device with a pump, suitable for driving a fluid to perform heat exchange, comprising: A heat-conducting unit (3) includes a heat conductor (31); A flow guiding unit (4) includes a flow guiding cover (41) disposed on the heat conductor (31) and a flow guiding plate (42). The flow guiding cover (41) cooperates with the heat conductor (31) to define a heat dissipation chamber (43). The flow guiding cover (41) has a water-blocking part (411) inside. The flow guiding plate (42) is disposed in the heat dissipation chamber (43) and parallel to the heat conductor (31). One end of the flow guiding plate (42) abuts against the water-blocking part (411) to divide the heat dissipation chamber (43) into an upper flow channel (431) and a lower flow channel (432). A housing unit (5) includes a housing (51) covered on the flow guide cover (41) and capable of containing the fluid, and a pump module (52) disposed in the housing (51). The pump module (52) drives the fluid in the housing (51) through the upper flow channel (431) into the lower flow channel (432) and back to the housing (51) to exchange heat with the heat conductor (31). The pump module (52) has a motor (521) disposed in the housing (51) and an impeller (522) connected to the motor (521) and erected. The housing (51) has a drive chamber (511) for accommodating the impeller (522). The motor (521) drives the impeller (522) to rotate in the drive chamber (511). The guide plate (42) defines an XZ plane, and the rotation direction of the impeller (522) defines an XY plane. The XZ plane and the XY plane are perpendicular to each other. The guide cover (41) is provided with an inlet (412). The impeller (522) pushes the fluid through the inlet (412) to impact the guide plate (42). The guide cover (41) designs the upper flow channel (431) as a fan-shaped flow channel to guide the fluid impacting the guide plate (42) to enter one side of the lower flow channel (432) evenly.

2. The water-cooled head device with a pump as described in claim 1, characterized in that, The housing (51) is provided with a first flow channel (512) connected to the drive chamber (511) and a first connection port (513) connected to the first flow channel (512) for fluid input.

3. The water-cooled head device with a pump as described in claim 1, characterized in that, The housing (51) is provided with a second flow channel (514) connected to the lower flow channel (432), a second connection port (515) connected to the second flow channel (514) for fluid output, and a third connection port (516) connected to the second flow channel (514).

4. The water-cooled head device with a pump as described in claim 1, characterized in that, The heat conductor (31) is provided with a surrounding wall (311) and a bottom wall (312) connected to the surrounding wall (311).

5. The water-cooled head device with a pump as described in claim 4, characterized in that, The heat-conducting unit (3) further includes a heat-conducting component (32) disposed on the bottom wall (312) and located in the lower flow channel (432).

6. The water-cooled head device with a pump as described in claim 5, characterized in that, The heat-conducting component (32) is composed of multiple heat dissipation fins, and an inclined portion (321) is provided at both the front and rear ends of the heat-conducting component (32) so that the multiple heat dissipation fins form a shape with lower ends and higher middle.

7. The water-cooled head device with a pump as described in claim 1, characterized in that, The guide cover (41) is provided with an outlet (413), the inlet (412) is connected to the upper flow channel (431), and the outlet (413) is connected to the lower flow channel (432).

8. The water-cooled head device with a pump as described in claim 1, characterized in that, It further includes a fixing unit (6), which includes a fixing bracket (61) connected to the housing (51) and a mounting hole (62) provided in the fixing bracket (61).

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