Circuit board with heat dissipation function and manufacturing method thereof

Abstract

The present application provides a method for manufacturing a circuit board with a heat dissipation function, comprising the following steps: providing a substrate; forming a first conductive circuit layer on the substrate; forming a first insulating layer on the first conductive circuit layer, wherein a first through hole is provided in the first insulating layer; filling the first through hole with metal to form a first heat-conducting portion; forming a second conductive circuit layer, a second insulating layer and a copper foil layer on the first insulating layer to obtain an intermediate; providing a groove in the intermediate; forming a second heat-conducting portion in the groove; forming a copper-plated layer on the copper foil layer and the second heat-conducting portion; and etching the copper-plated layer and the copper foil layer to form a third conductive circuit layer, thereby obtaining the circuit board. The circuit board manufactured by the manufacturing method of the present application has a good heat dissipation effect. The present application also provides a circuit board manufactured by the manufacturing method.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board with a heat dissipation function and a manufacturing method thereof. Background Art

[0002] With the development of 5G technology, electronic products are moving towards high integration and miniaturization, which makes the assembly density of electronic components higher and higher, and the power consumption is also increasing. Therefore, the heat dissipation requirements of circuit boards in electronic products are also increasing. The heat dissipation performance of current circuit boards cannot meet the requirements. Summary of the invention

[0003] In view of this, the present application provides a method for manufacturing a circuit board with better heat dissipation effect.

[0004] In addition, it is also necessary to provide a circuit board made by the above-mentioned manufacturing method.

[0005] The present application provides a method for manufacturing a circuit board, comprising the following steps:

[0006] Providing a substrate, comprising a metal layer and an adhesive layer, wherein the metal layer comprises a body and a first column protruding from the body, a groove is formed between the body and the first column, and the adhesive layer is arranged in the groove;

[0007] forming a first conductive circuit layer on the surface of the substrate so that the first conductive circuit layer is thermally connected to the first column;

[0008] forming a first insulating layer on the first conductive circuit layer, wherein a first through hole is formed in the first insulating layer, and the first through hole corresponds to the first conductive circuit layer;

[0009] Filling metal in the first through hole to form a first heat conducting portion;

[0010] forming a second conductive circuit layer on the first insulating layer, wherein the second conductive circuit layer is thermally connected to the first conductive circuit layer through the first heat conducting portion;

[0011] forming a second insulating layer and a copper foil layer in sequence on the second conductive circuit layer to obtain an intermediate;

[0012] A groove is provided in the intermediate body, the groove sequentially passes through the copper foil layer and the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting portion;

[0013] Filling the metal in the groove to form a second heat conducting portion;

[0014] forming a copper plating layer on the copper foil layer and the second heat conducting portion; and

[0015] The copper plating layer and the copper foil layer are etched to form a third conductive circuit layer, thereby obtaining the circuit board.

[0016] The present application also provides a circuit board, comprising:

[0017] A substrate, comprising a metal layer and an adhesive layer, wherein the metal layer comprises a body and a first column protruding from the body, a groove is formed between the body and the first column, and the adhesive layer is arranged in the groove;

[0018] A first conductive circuit layer is located on the surface of the substrate, and the first conductive circuit layer is thermally connected to the first column;

[0019] a first insulating layer, located on the first conductive circuit layer, in which a first through hole is opened, the first through hole corresponds to the first conductive circuit layer, and the first through hole is filled with metal to form a first heat conducting portion;

[0020] A second conductive circuit layer is located on the first insulating layer, and the second conductive circuit layer is thermally connected to the first conductive circuit layer through the first heat conducting portion;

[0021] A second insulating layer, located on the second conductive circuit layer; and

[0022] A third conductive circuit layer is located on the second insulating layer;

[0023] A groove is provided in the circuit board, the groove passes through the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting part, and the metal is filled in the groove to form the second heat conducting part.

[0024] In the present application, the first conductive circuit layer, the second conductive circuit layer and the third conductive circuit layer are arranged on the substrate, and the first heat conducting part is arranged under the second conductive circuit layer, and the second heat conducting part is arranged under the third conductive circuit layer, so that the heat generated by the first conductive circuit layer is transferred to the metal layer, the heat generated by the second conductive circuit layer is transferred to the first heat conducting part, and the heat generated by the third conductive circuit layer is transferred to the second heat conducting part, and the first conductive circuit layer, the second conductive circuit layer and the third conductive circuit layer can be thermally conductive, thereby improving the heat dissipation effect of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the substrate provided in some embodiments of the present application.

[0026] Figure 2 is Figure 1 The schematic diagram of the structure is shown after first conductive circuit layers are formed on two opposite surfaces of the substrate.

[0027] Figure 3 is Figure 2 The schematic diagram of the structure after the first insulating layer is formed on the first conductive circuit layer is shown.

[0028] Figure 4 is Figure 3 A schematic diagram of the structure after a first through hole is opened in the first insulating layer and metal is filled in the first through hole.

[0029] Figure 5 is Figure 4 A schematic structural diagram of a structure after a second conductive circuit layer is formed on the first insulating layer is shown.

[0030] Figure 6 is Figure 5 The schematic diagram of the structure after the second insulating layer and the copper foil layer are sequentially formed on the second conductive circuit layer is shown.

[0031] Figure 7 is Figure 6 A schematic diagram of the structure after a groove and a second through hole are formed in the intermediate body shown.

[0032] Figure 8 is Figure 7 Schematic diagram of the structure after the groove and the second through hole are electroplated with metal and filled with metal.

[0033] Fig. 9 is Figure 8 The schematic diagram of the structure after metal is electroplated on the copper foil layer, the second heat conducting part and the third heat conducting part is shown.

[0034] Fig.10 Yes Fig. 9 The schematic diagram of the structure of the circuit board obtained after etching the copper-plated layer and the copper foil layer is shown.

[0035] Main component symbols

[0036] Circuit board 100

[0037] Substrate 10

[0038] Metal layer 11

[0039] Ontology 111

[0040] The first column 112

[0041] The second column 113

[0042] Adhesive layer 12

[0043] Slot 13

[0044] The first conductive circuit layer 20

[0045] The first insulating layer 30

[0046] First through hole 301

[0047] The first heat transfer portion 31

[0048] The second conductive circuit layer 40

[0049] The second insulating layer 50

[0050] Copper foil layer 60

[0051] Intermediate 70

[0052] Groove 71

[0053] Opening 701

[0054] The second through hole 72

[0055] First metal layer 73

[0056] The second metal layer 74

[0057] The second heat transfer portion 75

[0058] The third heat transfer portion 76

[0059] Copper plating 80

[0060] The third conductive circuit layer 90

[0061] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0062] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0064] In order to further explain the technical means and effects adopted by the present application to achieve the intended purpose, the present application is described in detail below in conjunction with the accompanying drawings and preferred implementation methods.

[0065] Some embodiments of the present application provide a method for manufacturing a circuit board, comprising the following steps:

[0066] Step S11, see Figure 1 , providing a substrate 10.

[0067] In some embodiments, the substrate 10 includes a metal layer 11 and two adhesive layers 12 disposed in the metal layer 11. The metal layer 11 includes a body 111, at least two first columns 112, and a second column 113. The first column 112 and the second column 113 are both protruding from the surface of the body 111. Along the extension direction of the metal layer 11, the width of the second column 113 is greater than the width of the first column 112. A groove 13 is formed between the body 111 and the first column 112 and between the body 111 and the second column 113. The two adhesive layers 12 are respectively located in the groove 13, and the surface of the first column 112 or the second column 113 is substantially flush with the surface of the adhesive layer 12.

[0068] In some embodiments, the metal layer 11 is a thermoelectric separation metal. It should be noted that thermoelectric separation means that heat and electricity are separated, and the conductive part and the heat conductive part are in different positions.

[0069] In some embodiments, the material of the metal layer 11 is aluminum nitride or potassium nitride. The metal layer 11 has good thermal conductivity and certain electrical conductivity. In some embodiments, the adhesive layer 12 can be acrylic adhesive (AD adhesive).

[0070] Step S12, see Figure 2 A first conductive circuit layer 20 is formed on two opposite surfaces of the substrate 10 respectively.

[0071] Specifically, copper foil layers (not shown) are formed on two opposite surfaces of the substrate 10, and two copper foil layers are etched to form two first conductive circuit layers 20. The second pillars 113 correspond to the circuit gaps of the first conductive circuit layer 20.

[0072] Among them, the two first conductive circuit layers 20 are both connected to the first column 112, so as to be thermally conductive with the metal layer 11, so that the heat generated by the two first conductive circuit layers 20 is transmitted to the metal layer 11. Since the metal layer 11 is made of metal, it can absorb this part of the heat or dissipate the heat to the outside, thereby reducing the temperature of the two first conductive circuit layers 20 themselves.

[0073] Step S13, see Figure 3 , a first insulating layer 30 is formed on the two first conductive circuit layers 20 respectively.

[0074] The material of the first insulating layer 30 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc. In this embodiment, the material of the first insulating layer 30 is polypropylene.

[0075] Step S14, see Figure 4 At least one first through hole 301 is respectively opened in the two first insulating layers 30 .

[0076] Specifically, the first through hole 301 may be formed by laser cutting.

[0077] Each of the first through holes 301 penetrates the first insulating layer 30 , and each of the first through holes 301 corresponds to the first conductive circuit layer 20 . That is, the bottom of each of the first through holes 301 is the first conductive circuit layer 20 .

[0078] Step S15 , filling metal into each of the first through holes 301 to form a first heat conducting portion 31 .

[0079] The first heat conducting portion 31 is thermally connected to the corresponding first conductive circuit layer 20 .

[0080] In some embodiments, the metal is a thermoelectric separation metal.

[0081] In some embodiments, the metal is made of aluminum nitride or potassium nitride.

[0082] Step S16, see Figure 5 , a second conductive circuit layer 40 is formed on the two first insulating layers 30 respectively.

[0083] Specifically, copper foil layers (not shown) are respectively formed on the two first insulating layers 30 , and the two copper foil layers are respectively etched to form two second conductive circuit layers 40 .

[0084] The heat generated by the two second conductive circuit layers 40 can be transferred to the first heat-conducting part 31. Since the first heat-conducting part 31 is made of metal, it can absorb this part of heat, so that the temperature of the two second conductive circuit layers 40 itself is reduced. At the same time, since the first heat-conducting part 31 is thermally connected with the first conductive circuit layer 20, the heat generated by the second conductive circuit layer 40 can also be transferred to the metal layer 11 through the first heat-conducting part 31 and the first conductive circuit layer 20 in sequence, and the metal layer 11 absorbs this part of heat or dissipates the heat to the outside.

[0085] Step S17, see Figure 6 , a second insulating layer 50 and a copper foil layer 60 are sequentially formed on the two second conductive circuit layers 40 to obtain an intermediate body 70 .

[0086] The material of the second insulating layer 50 may be the same as that of the first insulating layer 30 . For details, please refer to the material of the first insulating layer 30 , which will not be described in detail herein.

[0087] Step S18, see Figure 7 At least two grooves 71 and at least one second through hole 72 are formed in the intermediate body 70 .

[0088] Specifically, the groove 71 and the second through hole 72 may be formed by laser cutting.

[0089] The two grooves 71 are respectively located on two opposite surfaces of the intermediate body 70. Each groove 71 sequentially penetrates the copper foil layer 60 and the second insulating layer 50. The bottom of each groove 71 corresponds to the second conductive circuit layer 40, and each groove 71 corresponds to the first heat conducting portion 31.

[0090] In some embodiments, each of the grooves 71 includes an opening 701 formed on the copper foil layer 60 , and an inner diameter of the groove 71 decreases gradually from the opening 701 to the bottom of the groove 71 .

[0091] Each of the second through holes 72 penetrates the intermediate body 70. Specifically, each of the second through holes 72 sequentially penetrates the copper foil layer 60, the second insulating layer 50, the second conductive circuit layer 40, the first insulating layer 30, the first conductive circuit layer 20, the substrate 10, the first conductive circuit layer 20, the first insulating layer 30, the second conductive circuit layer 40, the second insulating layer 50, and the copper foil layer 60.

[0092] Step S19, see Figure 8, electroplating metal at least on the inner wall of each of the grooves 71 and each of the second through holes 72 to form a first metal layer 73 and a second metal layer 74 respectively, and then filling the metal into each of the grooves 71 having the first metal layer 73 and each of the second through holes 72 having the second metal layer 74 to form a second heat conducting portion 75 and a third heat conducting portion 76 respectively.

[0093] In some embodiments, the first metal layer 73 is disposed on the inner wall of the groove 71 and the bottom of the groove 71. In other embodiments, the first metal layer 73 may be disposed only on the inner wall of the groove 71. The second metal layer 74 is disposed on the inner wall of the second through hole 72.

[0094] In some embodiments, the first metal layer 73 and the second metal layer 74 can be made of copper.

[0095] Step S20, see Fig. 9 , electroplating metal on each of the copper foil layers 60 , each of the second heat conducting portions 75 , and each of the third heat conducting portions 76 to form two copper plating layers 80 .

[0096] Step S21, see Fig.10 , each of the copper plating layers 80 and each of the copper foil layers 60 are etched to form two third conductive circuit layers 90 respectively, thereby obtaining the circuit board 100.

[0097] The heat generated by the two third conductive circuit layers 90 can be transferred to the second heat-conducting part 75. Since the second heat-conducting part 75 is made of metal, it can absorb this part of heat, so that the temperature of the two third conductive circuit layers 90 itself is reduced. At the same time, since the second heat-conducting part 75 is thermally connected with the first metal layer 73 and the second conductive circuit layer 40, the heat generated by the third conductive circuit layer 90 can also be sequentially transferred to the metal layer 11 through the second heat-conducting part 75, the first metal layer 73, the second conductive circuit layer 40, the first heat-conducting part 31, and the first conductive circuit layer 20, and the metal layer 11 absorbs this part of heat or dissipates the heat to the outside.

[0098] In addition, the heat generated by the first conductive circuit layer 20, the second conductive circuit layer 40 and the third conductive circuit layer 90 can also be transferred to the third heat-conducting portion 76. Since the third heat-conducting portion 76 is made of metal, it can absorb this part of the heat, so that the temperature of the first conductive circuit layer 20, the second conductive circuit layer 40 and the third conductive circuit layer 90 itself is reduced. At the same time, the heat generated by the second conductive circuit layer 40 and the third conductive circuit layer 90 can also be directly transferred to the metal layer 11 through the third heat-conducting portion 76, and the metal layer 11 absorbs this part of the heat or dissipates the heat to the outside.

[0099] The second metal layer 74 can be used to electrically connect the first conductive circuit layer 20 , the second conductive circuit layer 40 , and the third conductive circuit layer 90 .

[0100] The present application may also install electronic components (not shown) on each of the third conductive circuit layers 90 . Heat generated by the electronic components may be transferred to the first heat conducting portion 31 , the second heat conducting portion 75 , the third heat conducting portion 76 and the metal layer 11 .

[0101] See also Fig.10 Some embodiments of the present application further provide a circuit board 100 , which includes a substrate 10 , a first conductive circuit layer 20 , a first insulating layer 30 , a second conductive circuit layer 40 , a second insulating layer 50 and a third conductive circuit layer 90 .

[0102] In some embodiments, the substrate 10 includes a metal layer 11 and two adhesive layers 12 disposed in the metal layer 11. The metal layer 11 includes a body 111, at least two first columns 112, and a second column 113. The first column 112 and the second column 113 are both protruding from the surface of the body 111. Along the extension direction of the metal layer 11, the width of the second column 113 is greater than the width of the first column 112. A groove 13 is formed between the body 111 and the first column 112 and between the body 111 and the second column 113. The two adhesive layers 12 are respectively located in the groove 13, and the surface of the first column 112 or the second column 113 is substantially flush with the surface of the adhesive layer 12.

[0103] In some embodiments, the metal layer 11 is a thermoelectric separation metal. It should be noted that thermoelectric separation means that heat and electricity are separated, and the conductive part and the heat conductive part are in different positions.

[0104] In some embodiments, the material of the metal layer 11 is aluminum nitride or potassium nitride. The metal layer 11 has good thermal conductivity and certain electrical conductivity. In some embodiments, the adhesive layer 12 can be acrylic adhesive (AD adhesive).

[0105] The two first conductive circuit layers 20 are respectively located on two opposite surfaces of the substrate 10. The second columns 113 correspond to the circuit gaps of the first conductive circuit layers 20.

[0106] Among them, the two first conductive circuit layers 20 are both connected to the first column 112, so as to be thermally conductive with the metal layer 11, so that the heat generated by the two first conductive circuit layers 20 is transmitted to the metal layer 11. Since the metal layer 11 is made of metal, it can absorb this part of the heat or dissipate the heat to the outside, thereby reducing the temperature of the two first conductive circuit layers 20 themselves.

[0107] The two first insulating layers 30 are respectively located on the two first conductive circuit layers 20. The material of the first insulating layer 30 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and the like. In this embodiment, the material of the first insulating layer 30 is polypropylene.

[0108] At least one first through hole 301 is respectively provided in the two first insulating layers 30. Each of the first through holes 301 penetrates the first insulating layer 30, and each of the first through holes 301 corresponds to the first conductive circuit layer 20. That is, the bottom of each of the first through holes 301 is the first conductive circuit layer 20. Each of the first through holes 301 is filled with metal to form a first heat conducting portion 31. The first heat conducting portion 31 is thermally connected to the first conductive circuit layer 20 corresponding to it.

[0109] In some embodiments, the metal is a thermoelectric separation metal.

[0110] In some embodiments, the metal is made of aluminum nitride or potassium nitride.

[0111] The two second conductive circuit layers 40 are respectively located on the two first insulating layers 30. The heat generated by the two second conductive circuit layers 40 can be transferred to the first heat-conducting portion 31. Since the first heat-conducting portion 31 is made of metal, it can absorb this part of the heat, so that the temperature of the two second conductive circuit layers 40 itself is reduced. At the same time, since the first heat-conducting portion 31 is thermally conductive with the first conductive circuit layer 20, the heat generated by the second conductive circuit layer 40 can also be transferred to the metal layer 11 through the first heat-conducting portion 31 and the first conductive circuit layer 20 in sequence, and the metal layer 11 absorbs this part of the heat or dissipates the heat to the outside.

[0112] The two second insulating layers 50 are respectively located on the two second conductive circuit layers 40. The material of the second insulating layer 50 can be the same as that of the first insulating layer 30, and the details can be referred to the material of the first insulating layer 30, which will not be described again.

[0113] The two third conductive circuit layers 90 are respectively located on the two second insulating layers 50. At least two grooves 71 and at least one second through hole 72 are provided in the circuit board 100. Each of the grooves 71 penetrates the second insulating layer 50. The bottom of each of the grooves 71 corresponds to the second conductive circuit layer 40, and each of the grooves 71 corresponds to the first heat conducting portion 31. In some embodiments, each of the grooves 71 includes an opening 701 formed on the third conductive circuit layer 90, and the inner diameter of the groove 71 decreases from the opening 701 to the bottom of the groove 71. Each of the second through holes 72 penetrates the circuit board 100.

[0114] Metal is electroplated on at least the inner wall of each of the grooves 71 and each of the second through holes 72 to form a first metal layer 73 and a second metal layer 74, respectively. Then, each of the grooves 71 having the first metal layer 73 and each of the second through holes 72 having the second metal layer 74 are filled with the metal to form a second heat conducting portion 75 and a third heat conducting portion 76, respectively.

[0115] In some embodiments, the first metal layer 73 is disposed on the inner wall of the groove 71 and the bottom of the groove 71. In other embodiments, the first metal layer 73 may be disposed only on the inner wall of the groove 71. The second metal layer 74 is disposed on the inner wall of the second through hole 72.

[0116] In some embodiments, the first metal layer 73 and the second metal layer 74 can be made of copper.

[0117] The heat generated by the two third conductive circuit layers 90 can be transferred to the second heat-conducting part 75. Since the second heat-conducting part 75 is made of metal, it can absorb this part of heat, so that the temperature of the two third conductive circuit layers 90 itself is reduced. At the same time, since the second heat-conducting part 75 is thermally connected with the first metal layer 73 and the second conductive circuit layer 40, the heat generated by the third conductive circuit layer 90 can also be sequentially transferred to the metal layer 11 through the second heat-conducting part 75, the first metal layer 73, the second conductive circuit layer 40, the first heat-conducting part 31, and the first conductive circuit layer 20, and the metal layer 11 absorbs this part of heat or dissipates the heat to the outside.

[0118] In addition, the heat generated by the first conductive circuit layer 20, the second conductive circuit layer 40 and the third conductive circuit layer 90 can also be transferred to the third heat-conducting portion 76. Since the third heat-conducting portion 76 is made of metal, it can absorb this part of the heat, so that the temperature of the first conductive circuit layer 20, the second conductive circuit layer 40 and the third conductive circuit layer 90 itself is reduced. At the same time, the heat generated by the second conductive circuit layer 40 and the third conductive circuit layer 90 can also be directly transferred to the metal layer 11 through the third heat-conducting portion 76, and the metal layer 11 absorbs this part of the heat or dissipates the heat to the outside.

[0119] The second metal layer 74 can be used to electrically connect the first conductive circuit layer 20 , the second conductive circuit layer 40 , and the third conductive circuit layer 90 .

[0120] The present application may also install electronic components (not shown) on each of the third conductive circuit layers 90 . Heat generated by the electronic components may be transferred to the first heat conducting portion 31 , the second heat conducting portion 75 , the third heat conducting portion 76 and the metal layer 11 .

[0121] In the present application, the first conductive circuit layer 20, the second conductive circuit layer 40 and the third conductive circuit layer 90 are arranged on the substrate 10, and the first heat-conducting part 31 is arranged under the second conductive circuit layer 40, and the second heat-conducting part 75 is arranged under the third conductive circuit layer 90, so that the heat generated by the first conductive circuit layer 20 is transferred to the metal layer 11, the heat generated by the second conductive circuit layer 40 is transferred to the first heat-conducting part 31, and the heat generated by the third conductive circuit layer 90 is transferred to the second heat-conducting part 75, and the first conductive circuit layer 20, the second conductive circuit layer 40 and the third conductive circuit layer 90 can be thermally conductive, thereby improving the heat dissipation effect of the circuit board 100.

[0122] The above description is only an optimized specific implementation of the present application, but it cannot be limited to this implementation in the actual application process. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A method for manufacturing a circuit board, characterized in that: The following steps are involved: Providing a substrate, comprising a metal layer and an adhesive layer, wherein the metal layer comprises a body and a first column protruding from the body, a groove is formed between the body and the first column, and the adhesive layer is arranged in the groove; forming a first conductive circuit layer on the surface of the substrate so that the first conductive circuit layer is thermally connected to the first column; forming a first insulating layer on the first conductive circuit layer, wherein a first through hole is formed in the first insulating layer, and the first through hole corresponds to the first conductive circuit layer; Filling metal in the first through hole to form a first heat conducting portion; forming a second conductive circuit layer on the first insulating layer, wherein the second conductive circuit layer is thermally connected to the first conductive circuit layer through the first heat conducting portion; forming a second insulating layer and a copper foil layer in sequence on the second conductive circuit layer to obtain an intermediate; A groove is provided in the intermediate body, the groove sequentially passes through the copper foil layer and the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting portion; Filling the metal in the groove to form a second heat conducting portion; forming a copper plating layer on the copper foil layer and the second heat conducting portion; as well as The copper plating layer and the copper foil layer are etched to form a third conductive circuit layer, thereby obtaining the circuit board.

2. The method for manufacturing a circuit board according to claim 1, characterized in that: After the groove is formed in the intermediate body, the manufacturing method further comprises: A second through hole is formed in the intermediate body, and the through hole passes through the intermediate body; filling the metal in the second through hole to form a third heat conducting portion; and The copper plating layer is formed on the third heat conducting portion.

3. The method for manufacturing a circuit board according to claim 2, characterized in that: After the groove is formed in the intermediate body, the manufacturing method further comprises: forming a first metal layer at least on an inner wall of the groove; and A second metal layer is formed at least on the inner wall of the second through hole.

4. The method for manufacturing a circuit board according to claim 1, characterized in that: The groove includes an opening formed on the copper foil layer, and the inner diameter of the groove decreases from the opening to the bottom of the groove.

5. The method for manufacturing a circuit board according to claim 1, wherein: The metal layer further includes a second column protruding from the body, the groove is formed between the body and the second column, and along the extension direction of the metal layer, the width of the second column is greater than the width of the first column.

6. The method for manufacturing a circuit board according to claim 1, wherein: The metal layer and the metal are both thermoelectric separation metals, and the thermoelectric separation metal is made of aluminum nitride or potassium nitride.

7. A circuit board, characterized in that: include: A substrate, comprising a metal layer and an adhesive layer, wherein the metal layer comprises a body and a first column protruding from the body, a groove is formed between the body and the first column, and the adhesive layer is arranged in the groove; A first conductive circuit layer is located on the surface of the substrate, and the first conductive circuit layer is thermally connected to the first column; a first insulating layer, located on the first conductive circuit layer, in which a first through hole is opened, the first through hole corresponds to the first conductive circuit layer, and the first through hole is filled with metal to form a first heat conducting portion; A second conductive circuit layer is located on the first insulating layer, and the second conductive circuit layer is thermally connected to the first conductive circuit layer through the first heat conducting portion; A second insulating layer, located on the second conductive circuit layer; as well as A third conductive circuit layer is located on the second insulating layer; A groove is provided in the circuit board, the groove passes through the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting part, and the metal is filled in the groove to form the second heat conducting part.

8. The circuit board according to claim 7, characterized in that: A second through hole is also provided in the circuit board, and the second through hole is filled with the metal to form a third heat conducting part.

9. The circuit board according to claim 8, characterized in that: A first metal layer is formed at least on an inner wall of the groove, and a second metal layer is formed at least on an inner wall of the second through hole.

10. The circuit board according to claim 7, characterized in that: The metal layer and the metal are both thermoelectric separation metals, and the thermoelectric separation metal is made of aluminum nitride or potassium nitride.

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