Wafer film coating method

Abstract

The wafer film coating method disclosed in the application controls the whole BG film to be in a flat state before being coated by cooperation between the mold assembly and the fixed angle assembly, keeps the angle between the BG film between the mold roller and the fixed angle roller and the coating platform unchanged, and the mold roller can exhaust the air under the BG film to avoid wrinkles. The hot cutting ring cutter assembly is used for cutting the BG film, the BG film can be cut by the heated blade to avoid wrinkles caused by the ring cutter in the cutting process.

Description

Technical Field

[0001] This invention relates to the field of wafer coating technology, and more particularly to a wafer coating method. Background Technology

[0002] With the advancement of technology, smart wearables, smartphones, and tablets are developing towards higher speeds and larger capacities in storage, and towards thinner sizes. The technological development trend requires flash memory and memory controllers to be thinner and thinner, which makes the problem of chipping when processing and cutting ultra-thin wafers in conventional processes even more challenging.

[0003] To meet the requirements for lightweight chips, the processing technology adopts a method of cutting first and then thinning. The specific operation is as follows: first, the wafer is cut to a suitable depth on the front side, and then a BG film is attached to the front side of the wafer. The BG film can effectively protect the chip on the wafer surface from damage and prevent it from being affected by impurities during the thinning process.

[0004] Silicon carbide wafers are too hard to be cracked by film spreading alone; suitable equipment is needed to cleave them one strip at a time along the dicing grooves. The chip surface is sensitive to debris, so a layer of bleaching film (BG) is applied to the wafer surface during dicing to prevent direct contact between the dicing blades and the wafer surface, and also to prevent debris generated during dicing from contaminating the chip. During the application of the BG film, air may remain between the BG film and the wafer, causing wrinkles on the BG film surface. After the BG film is applied to the wafer, it needs to be cut to a size that matches the wafer. During circumferential dicing, the rotation of the cutting tool can cause wrinkles to appear on the surface of the BG film. Summary of the Invention

[0005] To address the problem of wrinkles appearing in the BG film during wafer lamination and BG film dicing, this invention provides a wafer lamination method.

[0006] The specific plan is as follows:

[0007] A wafer coating method includes the following steps:

[0008] Step 1: The wafers are taken out of the hopper by the transfer robot in the multi-functional robotic arm. Under the action of the wafer receiving mechanism, the wafers are placed on the film-coating platform, which then adsorbs the wafers.

[0009] Step 2: The BG film is transported to the top of the wafer through the composite film placement system, and the BG film is attached to the wafer surface under the action of the molding assembly;

[0010] Step 3: Position the wafer using the vision positioning device in the multi-functional robotic arm, and then perform thermal cutting of the BG film using the rotating cutting component;

[0011] Step four: after the BG film cutting is completed, the wafer after the film is transferred to the transfer manipulator through the wafer receiving mechanism, and then the wafer after the film is transferred to the stock bin;

[0012] Step five: the cut BG film is recycled by the excess material collection system.

[0013] In step one, the wafer receiving mechanism receives the wafer through the liftable lifting column, and after receiving the wafer, the lifting column can be lowered below the film sticking platform, and the wafer is adsorbed by the negative pressure generated on the film sticking platform.

[0014] In step two, the composite film placing system transports the composite film from the placing driven roller system to the film sticking platform through the placing air expansion shaft, and before entering the film sticking platform, the composite film is divided into a protective film and a BG film, the protective film is recycled by the protective film collecting system; the BG film is transported above the film sticking platform.

[0015] The end of the placing air expansion shaft is fixed with a placing electromagnetic brake, and the placing electromagnetic brake is electrically connected between the tension control roller, the tension control roller detects the tension of the film strip and feeds back to the placing electromagnetic brake, so that the composite film is always tensioned; the placing buffer roller is arranged between the placing driven roller system, and the placing buffer roller contacts the composite film through its own gravity.

[0016] In step two, the mold pressing assembly cooperates with the fixed angle assembly when the BG film is attached to the surface of the wafer; the mold pressing roller in the mold pressing assembly can move along the running direction of the mold under the action of the mold moving servo module when the BG film is close to the film sticking platform, and the position of the fixed angle roller in the fixed angle assembly also changes, the angle between the BG film between the mold pressing roller and the fixed angle roller and the horizontal plane of the film sticking platform does not change.

[0017] In step three, the hot cutting is performed by the ring cutting knife assembly fixed in the rotating cutting part of the rotating arm; the ring cutting knife assembly includes a U-shaped cutting knife seat arranged at the end of the rotating arm, a knife holder arranged at the U-shaped opening, a ring cutting knife fixed on the knife holder, and a heating device fixed on the knife seat; along the length direction of the rotating arm, the heating device includes a heat insulation plate fixed on the knife seat, an electric heating plate, and a PCT heater, and the ring cutting knife is fixed between the heat insulation plate and the PCT heater; the electric heating plate is heated by an electric wire.

[0018] The knife seat is rotationally connected to the cutting knife seat, and an angle adjusting mechanism and a reset mechanism are arranged between the knife holder and the cutting knife seat, the angle adjusting mechanism adjusts the angle of the ring cutting knife by pushing the knife seat, and the reset mechanism controls the knife seat to always contact the angle adjusting mechanism.

[0019] The surplus material system comprises a surplus material air expansion shaft, a surplus material driving roller, a surplus material collecting roller system and a surplus material buffer roller, and the cut BG film is conveyed to the surplus material buffer roller by the surplus material collecting roller system.

[0020] An end of the surplus material air expansion shaft is fixed with a surplus material electromagnetic brake, the surplus material electromagnetic brake is electrically connected with a surplus material tension control roller, the surplus material tension control roller detects the tension of the film strip and feeds back to the surplus material electromagnetic brake, so that the cut BG film is always kept in tension; the surplus material buffer roller is arranged between the surplus material driven roller system and contacts the cut BG film through its own gravity.

[0021] In step five, the cut BG film passes through the gap between the two locking plates of the locking device, and then is recycled by the surplus material system; the cut BG film is fixed by controlling the opening and closing of the two locking plates.

[0022] The wafer film coating method disclosed in the application controls the BG film to be in a flat state before film coating through cooperation between the mold assembly and the fixed angle assembly, keeps the angle between the BG film between the mold roller and the fixed angle roller and the film coating platform unchanged, and the mold roller can exhaust the air below the BG film to avoid wrinkles; the hot cutting ring cutter assembly is used for cutting the BG film, which can cut the BG film by using the heated blade to avoid wrinkles caused by the ring cutter during cutting. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a structural schematic view of the full-automatic wafer film coating machine;

[0024] Figure 2 It is a structural schematic view of the mold assembly;

[0025] Figure 3 It is a structural schematic view of the angle fixing assembly Figure 1 ;

[0026] Figure 4 It is a structural schematic view of the angle fixing assembly Figure 1 ;

[0027] Figure 5 It is a structural schematic view of the wafer transfer device;

[0028] Figure 6 It is a structural schematic view of the wafer receiving mechanism;

[0029] Figure 7 It is a working state schematic view of the rotary cutting part;

[0030] Figure 8 It is a structural schematic view of the rotary cutting part Figure 1 ;

[0031] Figure 9 Schematic diagram of the rotary cutting component Figure 2 ;

[0032] Figure 10 Schematic diagram of the ring cutter assembly Figure 1 ;

[0033] Figure 11 Schematic diagram of the ring cutter assembly Figure 2 ;

[0034] Figure 12 This is a schematic diagram of the balancing component.

[0035] Figure 13 This is a diagram illustrating the process of cutting a BG membrane using a circumferential cutter.

[0036] In the diagram: 1. Machine frame; 11. Longitudinal plate; 2. Film application platform; 21. Ring cutting groove; 3. Pressing mold assembly; 31. Pressing mold servo moving module; 32. Pressing mold support; 33. Pressing mold roller; 34. Pressing mold cylinder; 35. Pressing mold bracket; 4. Fixed angle assembly; 41. Fixed angle linear motor; 42. Fixed angle roller; 5. Rotary cutting component; 5. Ring cutting blade assembly; 51. Cutting blade holder; 511. Heating device; 512. Blade holder; 5121. Heat insulation plate; 5122. Electric heating plate; 5123. PTC heater. 124, tension spring 513, angle adjusting bolt 514, ring cutter 515, balancing assembly 52, balancing support 521, balancing spring 522, roller support 523, roller 524, long bolt 525, rotary cutting seat 53, rotary drive motor 54, rotary arm 55, wafer receiving mechanism 6, lifting column 61, lifting plate 62, lifting cylinder 63, multi-functional robot 7, transfer robot 71, suction unit 711, hopper 8, wafer 9, BG film 10. Detailed Implementation

[0037] The technical solutions in the embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the implementation of the present invention, and not all of it. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0038] like Figures 1-13As shown, a fully automatic wafer coating machine is disclosed, including a machine frame 1 with a vertical plate 11 on its upper surface, a wafer coating system, a multi-functional robot system with a multi-functional mechanical arm 7, and a material bin 8. The wafer coating system includes a coating platform 2 set on the machine frame 1, a pressing mold assembly 3 located above the coating platform 2, and a fixed angle assembly 4 set on the vertical plate 11. The fixed angle assembly 4 ensures that when the pressing mold assembly 3 is coating, the angle between the BG film 10 between the pressing roller 33 and the fixed angle roller 42 and the horizontal plane where the coating platform 2 is located remains unchanged. The multi-functional robot arm 7 is equipped with a ring cutter assembly 51 for hot cutting the BG film 10. By cooperating with the molding assembly 3 and the fixed angle assembly 4, the BG film 10 is kept flat before application, and the angle between the BG film 10 and the application platform 2 between the molding roller 33 and the fixed angle roller 42 remains unchanged. The molding roller 33 can remove the air under the BG film 10 to avoid wrinkles. When cutting the BG film 10, a hot-cutting ring cutter assembly 51 is used, which can cut the BG film 10 with a heated ring cutter 515 to avoid wrinkles caused by the blade during the cutting process.

[0039] The molding assembly 3 includes a molding servo moving module 31, on which a molding bracket 32 ​​is slidably connected. A height-adjustable pressing roller 33 is rotatably mounted on the molding bracket 32. When the pressing roller 33 moves downward and contacts the BG film 10, the molding servo moving module 31 controls the molding bracket 32 ​​to move and apply the film in the direction of the BG film 10's movement. When applying the film, the pressing roller 33 can maintain the angle between the BG film 10 and the film application platform 2 by ensuring that the fixed angle roller 42 and the pressing roller 33 move synchronously. The pressing roller 33 can be reciprocated by a fixed angle linear motor and also by an extended plate on the molding bracket 32. The length direction of the extended plate is consistent with the running direction of the film belt, and the pressing roller 33 is rotatably mounted on the extended plate.

[0040] To ensure that the angle between the BG film 10 and the film application platform 2 remains unchanged between the molding roller 33 and the fixed angle roller 42, the running direction of the fixed angle roller 42 can be perpendicular to the direction of the film application platform 2, and the fixed angle roller 42 is rotatably mounted on the fixed angle linear motor 41.

[0041] To ensure that the BG film 10 is subjected to uniform force when the pressing roller 33 presses the BG film 10, the pressing support 32 is a gate-shaped frame, and the film application platform 2 is located inside the gate frame. Pressing cylinders 34 are provided on both sides of the top of the gate-shaped frame. The telescopic rod of the pressing cylinder 34 passes through the top of the gate-shaped frame and is connected to the pressing bracket 35 at the end of the telescopic rod of the pressing cylinder 34. The pressing roller 33 is rotatably connected to the pressing bracket 35.

[0042] The multifunctional manipulator 7 is provided with a rotary cutting component 5, which comprises a rotary cutting seat 53 fixed on the multifunctional manipulator 7, a rotary driving motor 54 fixed on the rotary cutting seat 53, a rotary arm 55 connected to an output shaft of the rotary driving motor 54, a ring cutting knife assembly 51 provided at one end of the rotary arm 55, and a balancing assembly 52 provided at the other end of the rotary arm 55. When the ring cutting knife assembly 51 is used for cutting, a ring cutting groove 21 is arranged on a corresponding work surface. The work surface refers to the film pasting platform 2. The film pasting platform 2 is provided with an adsorption area, a negative pressure cavity is arranged in the adsorption area, a negative pressure source is arranged in the negative pressure cavity, and the negative pressure source generates negative pressure to adsorb the wafer 9 through the negative pressure hole of the adsorption area. The wafer 9 to be pasted is placed in the ring cutting groove 21, and the negative pressure source can adsorb the wafer 9 through the negative pressure hole, so as to avoid the position deviation of the wafer 9 during cutting. The width of the ring cutting groove 21 is 5 mm, the depth of the ring cutting groove 21 is 0.2 mm, the material of the film pasting platform 2 is ceramic, and the inner diameter of the ring cutting groove 21 is 2 mm smaller than the outer diameter of the wafer 9.

[0043] The ring cutting knife assembly 51 comprises a U-shaped cutting knife seat 511 arranged at the end of the rotary arm 55, a ring cutting knife 515 arranged at the U-shaped opening, and a heating device 512 arranged adjacent to the ring cutting knife 515 and used for heating the ring cutting knife 515. The heating device 512 comprises a knife seat 5121 arranged at the U-shaped opening, a heat insulation plate 5122, an electric heating plate 5123, and a PTC heater 5124 fixed in sequence outside the knife seat 5121 along the length direction of the rotary arm 55, and the ring cutting knife 515 is fixed between the electric heating plate 5123 and the PTC heater 5124. The electric heating plate 5123 is heated by an electric wire.

[0044] In order to protect the circuit, a resistance is connected in series on the electric wire, and the type of the resistance used is Pt1000. The heating device 512 can heat the ring cutting knife 515, and the heated ring cutting knife 515 is used for cutting the BG film 10, so as to avoid the wrinkles of the BG film 10 caused by the blade during cutting.

[0045] The knife seat 5121 is rotationally connected to the cutting knife seat 511. The ring cutting knife assembly 51 further comprises an angle adjusting mechanism and a reset mechanism. The angle adjusting mechanism enables the rotation of the ring cutting knife assembly 51 relative to the rotary arm 55, and the reset mechanism enables the fixation of the ring cutting knife assembly 51 after rotation. The angle adjusting mechanism comprises a protrusion arranged at the bottom of the cutting knife seat 511 and an angle adjusting bolt 514 threadedly connected in the protrusion. The movement of the end of the angle adjusting bolt 514 adjusts the angle of the ring cutting knife 515.

[0046] The reset mechanism is a tension spring 513, and the two ends of the tension spring 513 are connected with the bottom of the cutting knife seat 511 and the knife seat 5121 respectively. The two ends of the tension spring are connected with the bottom of the cutting knife seat and the knife seat respectively, and the connecting point of the tension spring and the knife seat 5121 is located on the same side of the hinge point between the ring cutting knife assembly 51 and the cutting knife seat 511.

[0047] The reset mechanism is a compression spring, and the two ends of the compression spring are connected with the bottom of the cutting knife seat 511 and the knife seat 5121 respectively. The connecting point of the compression spring and the knife seat 5121 is located on the different side of the hinge point between the ring cutting knife assembly 51 and the cutting knife seat 511.

[0048] The end of the angle adjusting bolt 514 is provided with a spherical nut, which can protect the knife seat 5121. The angle adjusting mechanism and the reset mechanism can adjust the angle of the ring cutting knife 515 and protect the cutting head of the ring cutting knife 515.

[0049] The rotating arm 55 is provided with an oblong hole, and the length direction of the oblong hole is consistent with the length direction of the rotating arm 55. The balancing assembly 52 is fixed in the oblong hole through positioning bolts and ensures the balance during ring cutting by adjusting the distance between the positioning bolts and the rotating center line. The balancing assembly 52 includes a balancing support 521, the balancing support 521 is connected with a roller support 523 through a balancing spring 522, and the roller support 523 is provided with a roller 524 which rotates thereon. The balancing support 523 is provided with a long bolt, and the end of the long bolt abuts against the roller support 523. The maximum distance of the upward movement of the roller support 523 can be limited, so as to avoid damaging the overall balance of the rotating cutting part 5.

[0050] The multifunctional manipulator 7 is provided with a transfer manipulator 71; the wafer receiving mechanism 6 is arranged on the film pasting platform 2 and is used for receiving the wafer 9 conveyed by the multifunctional manipulator 7. The wafer receiving mechanism 6 includes at least three lifting columns 61 and the film pasting platform 2,

[0051] The film pasting platform 2 is entirely an adsorption area, and a negative pressure cavity is arranged in the adsorption area. A negative pressure source is arranged in the negative pressure cavity, and the negative pressure source generates negative pressure to adsorb the wafer 9 through the negative pressure holes arranged in the adsorption area. The lifting column 61 and the film pasting platform 2 are in sealing sliding connection.

[0052] The middle region of the adsorption area where the lifting column 61 is located does not have an adsorption function, and the lifting column 61 and the film pasting platform 2 are not in sliding connection. The lifting column 61 is preferably four in number.

[0053] The bottom of the lifting column 2 is connected with a lifting plate 62, and the lifting plate 62 is lifted by a lifting cylinder 63. The suction part 711 of the transfer manipulator 71 is in a U shape, and the lifting column 61 will not limit the suction part. The transfer manipulator 71, the lifting column 61 and the film pasting platform 2 constitute a wafer transfer device. The transfer manipulator 71 is provided with a negative pressure adsorption mechanism for adsorbing the wafer 9. The negative pressure adsorption mechanism comprises a suction part with a cavity inside. The negative pressure is generated by a negative pressure source inside the suction part, and the wafer 9 is adsorbed through the small holes on the surface of the suction part. The suction part 711 can be in a U shape, and the lifting column 61 will not limit the suction part. The suction part 711 can also be a suction cup.

[0054] The wafer 9 is sucked from the hopper by the suction part 711 under the action of negative pressure, and is transported to the upper side of the lifting column 62 under the action of the multifunctional manipulator. After the lifting column 62 is lifted, the wafer 9 is placed on the lifting column 62. Then, under the action of the lifting cylinder 63, the wafer 9 is placed on the film pasting platform 2, and the wafer 9 is adsorbed by negative pressure. After the film pasting is completed, the lifting column 62 is lifted under the action of the lifting cylinder 63, the wafer 9 is picked up by the transfer manipulator 71, and is placed back into the hopper. The wafer transfer device can avoid damaging the wafer 9 during the transfer process.

[0055] A wafer film pasting method, comprising the following steps:

[0056] Step one: the wafer 9 in the hopper 8 is taken out by the transfer manipulator 71 in the multifunctional manipulator 7, and the wafer 9 is placed on the film pasting platform 2 under the action of the wafer receiving mechanism 6. The film pasting platform 2 adsorbs the wafer 9.

[0057] Step two: the BG film 10 is transported to the upper side of the wafer 9 by the composite film pasting system, and the BG film 10 is pasted on the surface of the wafer 9 under the action of the mold assembly 31.

[0058] Step three: the position of the wafer 9 is positioned by the visual positioning device in the multifunctional manipulator 7, and the BG film 10 is cut by the rotary cutting part 5.

[0059] Step four: after the BG film 10 is cut, the wafer 9 after film pasting is transferred to the transfer manipulator 71 by the wafer receiving mechanism 6, and then the wafer 9 after film pasting is transferred to the hopper 8.

[0060] Step five: the cut BG film 10 is recycled by the excess material recycling system.

[0061] In step one, the wafer receiving mechanism 6 receives the wafer 9, which comprises receiving the wafer 9 by the lifting column 61 which can be lifted. After receiving the wafer 9, the lifting column 61 can be lowered below the film pasting platform, and the wafer 9 is adsorbed by the negative pressure generated on the film pasting platform 2.

[0062] In step two, the composite film placing system transports the composite film from the film placing driven roller system to the film placing platform through the film placing air expansion shaft. Before entering the film placing platform 2, the composite film is divided into a protective film and a BG film 10. The protective film is recycled through the protective film collecting system. The BG film 10 is transported to above the film placing platform.

[0063] The end of the film placing air expansion shaft is fixed with a film placing electromagnetic brake. The film placing electromagnetic brake is electrically connected with the tension control roller. The tension control roller detects the tension of the film strip and feeds back to the film placing electromagnetic brake to keep the composite film always tensioned. The film placing buffer roller is arranged between the film placing driven roller system. The film placing buffer roller contacts the composite film through its own gravity.

[0064] In step two, the mold pressing assembly 3 cooperates with the fixed angle assembly 4 when the BG film 10 is attached to the wafer 9. The mold pressing roller 33 in the mold pressing assembly 3 can move along the running direction of the mold under the action of the mold pressing moving servo module 31 when the BG film 10 is close to the film placing platform 2. The position of the fixed angle roller 42 in the fixed angle assembly 4 also changes. The angle between the BG film 10 between the mold pressing roller 33 and the fixed angle roller 42 and the horizontal plane of the film placing platform 2 does not change.

[0065] In step three, the rotary cutting part 5 includes a rotary cutting seat 53 fixed on the multifunctional manipulator 7. A rotary drive motor 54 is fixed on the rotary cutting seat 3. The output shaft of the rotary drive motor 54 is connected with a rotary arm 55. The rotary arm 55 is provided with a ring cutting knife assembly 51 at one end and a balance assembly 52 at the other end. The ring cutting knife assembly 51 needs to be provided with a ring cutting groove on the corresponding working surface when cutting.

[0066] The excess material collecting system includes an excess material collecting air expansion shaft, an excess material collecting drive roller, an excess material collecting roller system, and an excess material collecting buffer roller. The cut BG film 10 is transported to the excess material collecting buffer roller by the material collecting roller system,

[0067] The end of the excess material collecting air expansion shaft is fixed with an excess material collecting electromagnetic brake. The excess material collecting electromagnetic brake is electrically connected with the excess material collecting tension control roller. The excess material collecting tension control roller detects the tension of the film strip and feeds back to the excess material collecting electromagnetic brake to keep the cut BG film 10 always tensioned. The excess material collecting buffer roller is arranged between the excess material collecting driven roller system. The excess material collecting buffer roller contacts the cut BG film 10 through its own gravity.

[0068] In step five, the cut BG film 10 passes through the gap between the two lock plates of the locking device, and then is recycled by the excess material system. The cut BG film 10 is fixed by controlling the opening and closing of the two lock plates. Specifically, the lower lock plate is fixed on the vertical plate 11. The upper lock plate controls the lifting of the upper lock plate through the locking cylinder, thereby controlling the closing of the two lock plates.

[0069] Through the cooperation between the pressing die assembly 3 and the fixed angle assembly 4, the BG film 10 is controlled to be in a flat state before being pasted, and the angle between the BG film 10 and the pasting platform between the pressing die roller 33 and the fixed angle roller 42 is kept unchanged, the pressing die roller 33 can exhaust the air below the BG film 10 to avoid wrinkles; the hot cutting ring cutter assembly 51 is used when cutting the BG film 10, the heated blade can be used to cut the BG film 10 to avoid wrinkles caused by the ring cutter 515 in the cutting process. The cooperation between the lifting column 61 and the transfer manipulator 71 can avoid damage to the wafer 9 during transfer. The cooperation between the ring cutter assembly 51 and the balancing assembly 52 can make the ring cutter 515 in a balanced position during the cutting process. The cooperation between the tension spring 513 and the angle adjusting bolt 514 can adjust the angle of the ring cutter 515, which can avoid damage to the cutting head of the ring cutter 515 during cutting.

[0070] The technical means disclosed in the scheme of the present application is not limited to the technical means disclosed in the above-mentioned embodiments, but also includes the technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered to be within the protection scope of the present application.

Claims

1. A wafer film coating method characterized by, The method comprises the following steps: Step one: the wafer in the stock bin is taken out by the transfer manipulator in the multifunctional manipulator, and the wafer is placed on the film sticking platform under the action of the wafer receiving mechanism, and the film sticking platform adsorbs the wafer; Step two: the BG film is transported to the upper side of the wafer by the composite film film-feeding system, and the BG film is attached to the wafer surface under the action of the pressure mold assembly; Step three: the wafer position is positioned by the visual positioning device in the multifunctional manipulator, and the BG film is cut by the rotary cutting part; Step four: after the BG film is cut, the wafer after film sticking is transferred to the transfer manipulator by the wafer receiving mechanism, and then the wafer after film sticking is transferred to the stock bin; Step five: the cut BG film is recycled by the excess material collecting system. In step two, the pressure mold assembly cooperates with the fixed angle assembly when the BG film is attached to the wafer surface; the pressure mold roller in the pressure mold assembly can move along the running direction of the mold under the action of the pressure mold moving servo module when the BG film is close to the film sticking platform, the position of the fixed angle roller in the fixed angle assembly also changes, and the angle between the BG film between the pressure mold roller and the fixed angle roller and the horizontal plane of the film sticking platform is unchanged.

2. The wafer film coating method according to claim 1, wherein In step one, the wafer receiving mechanism receives the wafer, the lifting support capable of lifting receives the wafer, and after receiving the wafer, the lifting support can be lowered below the film sticking platform, and the wafer is adsorbed by the negative pressure generated on the film sticking platform.

3. The wafer film coating method according to claim 1, wherein In step two, the composite film film-feeding system transports the composite film from the film-feeding driven roller system to the film sticking platform through the film-feeding driven roller system, and the composite film is divided into a protective film and a BG film before entering the film sticking platform, the protective film is recycled by the protective film collecting system; the BG film is transported to the upper side of the film sticking platform.

4. The wafer film coating method according to claim 3, wherein The end of the film-feeding inflation shaft is fixed with a film-feeding electromagnetic brake, the film-feeding electromagnetic brake is electrically connected between the tension control roller, the tension control roller detects the tension of the film belt and feeds back to the film-feeding electromagnetic brake to keep the composite film always tensioned; the film-feeding buffer roller is arranged between the film-feeding driven roller system, and the film-feeding buffer roller contacts the composite film through its own gravity.

5. The wafer film coating method according to claim 1, characterized by In step three, the BG film is cut by the ring cutter assembly fixed in the rotary arm of the rotary cutting part; the ring cutter assembly comprises a U-shaped cutter seat arranged at the end of the rotary arm, a cutter holder arranged at the U-shaped opening, a ring cutter fixed on the cutter holder, and a heating device for the ring cutter fixed on the cutter seat; along the length direction of the rotary arm, the heating device comprises a heat insulation plate fixed on the cutter seat, an electric heating plate and a PCT heater, and the ring cutter is fixed between the heat conduction plate and the PCT heater; The electric heating plate is heated by an electric wire.

6. The wafer film coating method according to claim 5, wherein The cutter seat is rotationally connected to the cutting seat, an angle adjusting mechanism and a reset mechanism are arranged between the cutter holder and the cutting seat, the angle adjusting mechanism adjusts the angle of the ring cutter by pushing the cutter seat, and the reset mechanism controls the cutter seat to always contact the angle adjusting mechanism.

7. The wafer film coating method according to claim 1, wherein The excess material collecting system comprises an excess material collecting inflation shaft, an excess material collecting driving roller, an excess material collecting roller system and an excess material collecting buffer roller, and the cut BG film is transported to the excess material collecting buffer roller by the material collecting roller system.

8. The wafer film coating method according to claim 7, wherein The end of the excess material gas expansion shaft is fixed with an excess material electromagnetic brake, and the excess material electromagnetic brake is electrically connected with an excess material tension control roller. The excess material tension control roller detects the tension of the film strip and feeds back to the excess material electromagnetic brake, so as to keep the cut BG film always tensioned. An excess material buffer roller is arranged between the excess material driven roller system, and the excess material buffer roller is in contact with the cut BG film through its own gravity.

9. The wafer film coating method according to Claim 1, characterized by, In step five, the cut BG film passes through the gap between the two locking plates of the locking device, and then is recycled by the excess material system. The cut BG film is fixed by controlling the opening and closing of the two locking plates.

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