Display back panel and display device

Abstract

The present application proposes a display backplane and a display device, wherein the display backplane comprises a backplane layer, a substrate layer, a heat-conducting layer, a light-emitting layer, and a heat-conducting hole that at least penetrates the substrate layer, wherein a heat-dissipating column is arranged in the heat-conducting hole, and the heat-dissipating column is in contact with the heat-conducting layer. The present application improves the heat dissipation efficiency of the display backplane by arranging a heat-conducting hole on the substrate layer and arranging a heat-dissipating column in the heat-conducting hole, so that the heat in the heat-conducting layer is transferred to the backplane layer through the heat-dissipating column in the heat-conducting hole.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display backplane and a display device. Background Art

[0002] The existing light emitting diode display backplane generally includes a driving circuit board and a light emitting diode located on the driving circuit board, such as a Micro LED or a Mini LED.

[0003] The current display backplane is usually bonded to the backplane with heat dissipation adhesive to conduct the heat in the display backplane through the backplane. However, since the substrate in the display backplane bonded with the heat dissipation adhesive is an insulating substrate with poor thermal conductivity, the heat emitted by the light-emitting unit in the display backplane cannot be effectively conducted into the heat dissipation adhesive, resulting in poor heat dissipation effect of the display backplane.

[0004] Therefore, a display backplane is urgently needed to solve the above technical problems. Summary of the invention

[0005] The present application provides a display backplane and a display device to solve the technical problem that the heat dissipation effect of the existing display backplane is poor.

[0006] To solve the above problems, the technical solutions provided by this application are as follows:

[0007] The present application proposes a display backplane, which includes:

[0008] substrate layer;

[0009] A heat-conducting layer, disposed on the surface of the substrate layer;

[0010] A light-emitting layer is disposed on the surface of the heat-conducting layer;

[0011] a back plate layer, disposed on a side of the substrate layer away from the heat conducting layer; and

[0012] A heat conduction hole at least penetrates the substrate layer, and a heat dissipation column is arranged in the heat conduction hole, and the heat dissipation column is respectively in contact with the heat conduction layer and the back plate layer.

[0013] In the display backplane of the present application, the heat conduction hole includes a first sub-hole and a second sub-hole, and the first sub-hole and the second sub-hole are arranged continuously;

[0014] The first sub-hole is located in the substrate layer, and the second sub-hole is located in the backplane layer.

[0015] In the display backplane of the present application, the outer diameter of the first sub-hole is greater than the outer diameter of the second sub-hole.

[0016] In the display backplane of the present application, the thermal conductivity of the heat dissipation column in the first sub-hole is greater than the thermal conductivity of the heat dissipation column in the second sub-hole.

[0017] In the display backplane of the present application, the number of the first sub-holes is greater than the number of the second sub-holes.

[0018] In the display backplane of the present application, the display backplane further includes:

[0019] The heat dissipation joint is arranged between at least two adjacent first sub-holes, the heat dissipation joint is arranged in contact with the at least two adjacent first sub-holes, and the heat dissipation joint is arranged on the surface of the back plate layer close to the substrate layer.

[0020] In the display backplane of the present application, the ratio of the thickness of the heat dissipation combining portion to the thickness of the substrate layer is greater than or equal to one third.

[0021] In the display backplane of the present application, the material of the heat dissipation combining portion is the same as the material of the heat dissipation column in the first sub-hole.

[0022] In the display backplane of the present application, the light-emitting layer includes a plurality of light zones, and each of the light zones is provided with a plurality of light-emitting units arranged in an array;

[0023] Wherein, at least one heat conduction hole is arranged in each of the lamp areas.

[0024] The present application also proposes a display device, comprising a display backplane and a cover layer disposed on the display backplane; wherein the display backplane comprises:

[0025] substrate layer;

[0026] A heat-conducting layer, disposed on the surface of the substrate layer;

[0027] A light-emitting layer is disposed on the surface of the heat-conducting layer;

[0028] a back plate layer, disposed on a side of the substrate layer away from the heat conducting layer; and

[0029] A heat conduction hole at least penetrates the substrate layer, and a heat dissipation column is arranged in the heat conduction hole, and the heat dissipation column is respectively in contact with the heat conduction layer and the back plate layer.

[0030] Beneficial effect: The present application provides heat conduction holes on the substrate layer and fills heat dissipation columns in the heat conduction holes, so that the heat in the heat conduction layer is transferred to the backplane layer through the heat dissipation columns in the heat conduction holes, thereby improving the heat dissipation efficiency of the display backplane. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0032] Figure 1 A first structural diagram showing a back plate for this application;

[0033] Figure 2 This is a structural diagram of the array drive layer in the backplane for this application;

[0034] Figure 3 A second structural diagram showing the back plate for this application;

[0035] Figure 4 A third structural diagram showing the back plate for this application;

[0036] Figure 5 A fourth structural diagram showing the back plate for this application;

[0037] Figure 6 A fifth structural diagram showing a back plate for this application;

[0038] Figure 7 This is a sixth structural diagram of the backplane shown in this application. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0040] Existing display backplanes are usually bonded to the backplane with heat dissipation adhesive to conduct the heat in the display backplane through the backplane. However, since the substrate bonded to the heat dissipation adhesive is an insulating substrate with poor thermal conductivity, the heat emitted by the light-emitting unit in the display backplane cannot be effectively conducted into the heat dissipation adhesive, resulting in poor heat dissipation effect of the display backplane.

[0041] See also Figures 1 to 3 The present application proposes a display backplane 100, which includes a substrate layer 10, a heat-conducting layer 20 arranged on the surface of the substrate layer 10, a light-emitting layer 30 arranged on the surface of the heat-conducting layer 20, and a backplane layer 40 arranged on the side of the substrate layer 10 away from the heat-conducting layer 20.

[0042] In this embodiment, the display backplane 100 further includes a heat-conducting hole 50 at least penetrating the substrate layer 10 , and heat-dissipating columns are disposed in the heat-conducting hole 50 , and the heat-dissipating columns are respectively in contact with the heat-conducting layer 20 and the backplane layer 40 .

[0043] The present application arranges a heat conducting hole 50 on the substrate layer 10 and arranges a heat dissipation column in the heat conducting hole 50, so that the heat emitted by the light-emitting layer 30 in the display backplane 100 is transferred to the backplane layer 40 through the heat conducting layer 20. Through the arrangement in the heat conducting hole 50, the heat in the heat conducting layer 20 can be transferred to the backplane layer 40 through the heat dissipation column in the heat conducting hole 50, thereby improving the heat dissipation efficiency of the display backplane 100.

[0044] It should be noted that the heat dissipation column can be a heat-curing insulating adhesive cured by ultraviolet light.

[0045] It should be noted that the substrate layer 10 can be arranged in contact with the backing layer 40. If other heat-conducting materials can be arranged between the substrate layer 10 and the backing layer 40, it is not limited here.

[0046] The technical solution of the present application is now described in conjunction with specific embodiments.

[0047] In this embodiment, the display backplane 100 can be used as a backlight module, that is, the display backplane 100 can be combined with a liquid crystal display panel to form a liquid crystal display module; or, the display backplane 100 can be used as a direct display device.

[0048] See also Figure 1 The display backplane 100 may include a stacked backplane layer 40, a substrate layer 10, a heat conductive layer 20, an array driving layer 60, a light emitting layer 30, and a protective layer 80 covering the light emitting layer 30, wherein the array driving layer 60 is disposed on the surface of the heat conductive layer 20.

[0049] In this embodiment, the material of the back plate layer 40 may include carbon fiber and resin.

[0050] In this embodiment, the material of the back panel layer 40 may also include a curing agent, a diluent and a toughening agent. By using carbon fiber, resin, curing agent, diluent and toughening agent to form the back panel, the thermal conductivity and electromagnetic shielding performance of the back panel are improved, the thickness and weight of the back panel are reduced, and the back panel has a certain toughness, which can improve the extrusion and impact resistance of the OLED display module.

[0051] In this embodiment, the material of the backplane layer 40 may further include nickel, a curing agent, a diluent and a toughening agent. When forming the backplane, nickel plating may be performed to improve the electromagnetic shielding effect of the backplane.

[0052] In this embodiment, the heat conducting layer 20 may be made of metals with good thermal conductivity, such as copper and aluminum.

[0053] In this embodiment, the material of the substrate layer 10 can be glass, quartz or polyimide. For example, when the display backplane 100 is a flexible backplane, the material of the substrate layer 10 can be composed of flexible materials such as polyimide, or a stacked film layer of flexible material and inorganic material; when the display backplane 100 is a non-flexible backplane, the material of the substrate layer 10 can be composed of glass, quartz or other inorganic insulating materials.

[0054] In this embodiment, the array driving layer 60 may include a plurality of thin film transistors, which may be of an etching barrier type, a back channel etching type, or may be divided into a bottom gate thin film transistor, a top gate thin film transistor, and the like according to the position of the gate electrode and the active layer, without any specific limitation.

[0055] For example, Figure 2 The thin film transistor shown in the figure is a top-gate thin film transistor, which may include a buffer layer 601 arranged on the thermal conductive layer 20, a gate layer 602 arranged on the buffer layer 601, a gate insulating layer 603 arranged on the gate layer 602, an active layer 604 arranged on the gate insulating layer 603, an inter-insulating layer 605 arranged on the active layer 604, a source-drain layer 606 arranged on the inter-insulating layer 605, a planarizing layer 607 arranged on the source-drain layer 606, and a first electrode layer 608 arranged on the planarizing layer 607.

[0056] In this example, see Figure 1 The light-emitting layer 30 may include a plurality of light-emitting units 301, the light-emitting unit 301 may be a Micro LED or a Mini LED, the first electrode terminal 302 in the light-emitting unit 301 is electrically connected to the first electrode layer 608, the second electrode terminal 303 in the light-emitting unit 301 is electrically connected to the second electrode layer, and the second electrode layer (not shown) is connected to a constant voltage source.

[0057] In the display backplane 100 of the present application, the light-emitting layer 30 may include a plurality of light zones, each of which is provided with a plurality of light-emitting units 301 arranged in an array, and each of which may be provided with at least one heat-conducting hole 50 .

[0058] In this embodiment, for a large-sized panel, the number of light-emitting units 301 is large, so the light-emitting layer 30 needs to be divided into zones. For example, each light zone may include 12 light-emitting units 301 distributed in 3*4.

[0059] In the display backplane 100 of the present application, please refer to Figure 3The thermal conductive hole 50 includes a first sub-hole 501 and a second sub-hole 502 . The first sub-hole 501 and the second sub-hole 502 are continuously arranged. The first sub-hole 501 is located in the substrate layer 10 , and the second sub-hole 502 is located in the back plate layer 40 .

[0060] In this embodiment, the first sub-hole 501 is in the substrate layer 10, and the first sub-hole 501 and the second sub-hole 502 are connected. The first sub-hole 501 transfers the heat in the thermal conductive layer 20 to the heat dissipation column in the second sub-hole 502, and transfers the heat to the back plate layer 40 through the heat dissipation column in the second sub-hole 502.

[0061] In this embodiment, the thermal conductivity of the heat dissipation column in the second sub-hole 502 is greater than the thermal conductivity of the back plate layer 40. The first sub-hole 501 and the second sub-hole 502 are butted, and the thermal conductivity of the heat dissipation column in the second sub-hole 502 is greater than the thermal conductivity of the back plate layer 40, which accelerates the exchange of heat in the first sub-hole 501 and the second sub-hole 502.

[0062] and Figure 1 Compared with the structure in, although the back plate layer 40 has a certain thermal conductivity, its thermal conductivity is limited. The thermal conductive hole 50 extends from the thermal conductive layer 20 to the back plate layer 40, and the contact area between the thermal conductive hole 50 and the back plate layer 40 is increased, which accelerates the transfer of heat in the thermal conductive hole 50 and the back plate layer 40.

[0063] In this embodiment, the heat dissipation pillars in the first sub-hole 501 and the heat dissipation pillars in the second sub-hole 502 may be made of the same material.

[0064] In this embodiment, although the provision of the second sub-hole 502 can increase the heat exchange area between the heat dissipation column and the back plate layer 40 , when the contact area between the second sub-hole 502 and the first sub-hole 501 is small, the improvement of the heat dissipation effect is limited.

[0065] In this embodiment, the orthographic projection of the second sub-hole 502 on the first sub-hole 501 may be located inside the first sub-hole 501 , that is, the circumscribed circle area of ​​the second sub-hole 502 is the contact area between the second sub-hole 502 and the first sub-hole 501 .

[0066] In this embodiment, the substrate layer 10 is generally an insulating substrate with poor thermal conductivity. Although the setting of the first sub-hole 501 can improve the heat dissipation effect of the display backplane 100, the overall heat dissipation effect of the second sub-hole 502 and the backplane layer 40 is greater than the overall heat dissipation effect of the first sub-hole 501 and the substrate layer 10, that is, the heat introduced by the first sub-hole 501 into the second sub-hole 502 and the backplane layer 40 is less than the heat exported by the second sub-hole 502 and the backplane layer 40.

[0067] In the display back plate 100 of the present application, the outer diameter of the first sub-hole 501 may be greater than the outer diameter of the second sub-hole 502. Figure 4 The outer diameter of the first sub-hole 501 is larger than the outer diameter of the second sub-hole 502, that is, in addition to the heat in the first sub-hole 501 being transferred to the second sub-hole 502, part of the heat is also transferred to the back plate layer 40, which increases the thermal conductivity efficiency of the first sub-hole 501, so that the heat transferred from the heat dissipation column in the first sub-hole 501 to the second sub-hole 502 and the back plate layer 40 per unit time and the heat extracted from the second sub-hole 502 and the back plate layer 40 per unit time are as equal as possible, thereby maximizing the thermal conductivity efficiency of the display back plate 100.

[0068] In the display backplane 100 of the present application, the thermal conductivity of the heat dissipation column in the first sub-hole 501 may be greater than the thermal conductivity of the heat dissipation column in the second sub-hole 502 .

[0069] In this embodiment, the adjustment of the thermal conductivity of the heat dissipation column in the first sub-hole 501 increases the heat transfer from the heat dissipation column in the first sub-hole 501 to the second sub-hole 502 and the back plate layer 40 per unit time, so that the heat transferred from the heat dissipation column in the first sub-hole 501 to the second sub-hole 502 and the back plate layer 40 per unit time and the heat extracted from the second sub-hole 502 and the back plate layer 40 per unit time are as equal as possible, thereby maximizing the thermal conductivity efficiency of the display back plate 100.

[0070] In the display backplane 100 of the present application, please refer to Figure 5 , the number of the first sub-holes 501 is greater than the number of the second sub-holes 502.

[0071] In this embodiment, the increase in the number of the first sub-holes 501 increases the heat transfer from the thermal conductive layer 20 to the second sub-holes 502 and the back plate layer 40 through the first sub-holes 501 per unit time, so that the heat transferred from the heat dissipation column in the first sub-hole 501 to the second sub-holes 502 and the back plate layer 40 per unit time and the heat extracted from the second sub-holes 502 and the back plate layer 40 per unit time are as equal as possible, thereby maximizing the thermal conductivity efficiency of the display back plate 100.

[0072] In the above embodiment, the outer diameter of the first sub-hole 501, the heat dissipation column in the first sub-hole 501 and the number of the first sub-holes 501 are all set to balance the heat exchange between the substrate layer 10 and the back panel layer 40. The above three embodiments can be combined as long as the thermal conductivity efficiency of the display back panel 100 is maximized.

[0073] In the display backplane 100 of the present application, please refer to Figure 6 The display back panel 100 may further include a heat dissipation coupling portion 70, which may be disposed between at least two adjacent first sub-holes 501, with both ends of the heat dissipation coupling portion 70 contacting the corresponding first sub-holes 501, and the heat dissipation coupling portion 70 disposed on the surface of the back panel layer 40 close to the substrate layer 10.

[0074] In this embodiment, the heat dissipation coupling part 70 is in contact with the surface of the back plate layer 40, and the heat of the thermal conductive layer 20 can be transferred to the heat dissipation coupling part 70 through the heat dissipation column in the first sub-hole 501, and the heat dissipation coupling part 70 transfers the heat to the corresponding back plate layer 40, thereby completing the heat conduction.

[0075] In this embodiment, the heat dissipation combining portion 70 may be connected to two of the first sub-holes 501 , for example Figure 6 The structure shown, or Figure 7 In the structure shown, the heat dissipation combination can be connected to four of the first sub-holes 501 , and the number of the heat dissipation combination and the first sub-holes 501 is not limited here.

[0076] In this embodiment, the material of the heat dissipation joint 70 and the material of the heat dissipation column in the first sub-hole 501 can be the same, that is, the heat transfer between the same materials is continuous; or, the thermal conductivity of the material of the heat dissipation joint 70 can be greater than the thermal conductivity of the heat dissipation column in the first sub-hole 501, that is, since the heat dissipation joint 70 and the back panel layer 40 are in direct contact and the contact area is large, the thermal conductivity of the material of the heat dissipation joint 70 is set to be larger, which can accelerate the transfer of heat in the heat dissipation joint 70 to the back panel layer 40, thereby improving the thermal conductivity efficiency of the display back panel 100.

[0077] In this embodiment, the ratio of the thickness of the heat dissipation joint 70 to the thickness of the substrate layer 10 is greater than or equal to one third. When the heat dissipation joint 70 is provided, it is equivalent to etching a groove in the substrate layer 10 to fill the heat dissipation column in the groove, and the heat dissipation column is connected to the heat dissipation column in the first sub-hole 501; the maximum ratio of the thickness of the heat dissipation joint 70 to the thickness of the substrate layer 10 is 1, that is, the thickness of the heat dissipation joint 70 is equal to the thickness of the substrate layer 10, which is equivalent to hollowing out the substrate layer 10 and setting all the corresponding heat dissipation columns.

[0078] When the existing display backplane 100 is working, a certain temperature difference may occur between the central area and the peripheral area of ​​the display backplane 100, that is, the temperature of the display backplane 100 decreases from the inside to the outside. In this embodiment, more heat-conducting holes 50 may be arranged in the central area of ​​the display backplane 100, and fewer heat-conducting holes 50 may be arranged in the peripheral area, that is, the distribution density of the heat-conducting holes 50 in the central area is greater than the distribution density of the heat-conducting holes 50 in the peripheral area; or, the distribution density of the heat-conducting holes 50 gradually decreases from the central area to the peripheral area.

[0079] The present application also proposes a display device, which includes the above-mentioned display backplane 100 and a cover layer arranged on the display backplane 100, and the display backplane 100 and the cover layer are combined into one body.

[0080] In this embodiment, the display backplane 100 includes a substrate layer 10, a heat-conducting layer 20 arranged on the surface of the substrate layer 10, a light-emitting layer 30 arranged on the surface of the heat-conducting layer 20, and a backplane layer 40 arranged on the side of the substrate layer 10 away from the heat-conducting layer 20, and the substrate layer 10 and the backplane layer 40 are arranged in contact.

[0081] In this embodiment, the display backplane 100 further includes a heat-conducting hole 50 at least penetrating the substrate layer 10 , and heat-dissipating columns are disposed in the heat-conducting hole 50 , and the heat-dissipating columns are respectively in contact with the heat-conducting layer 20 and the backplane layer 40 .

[0082] In this embodiment, the display device may include electronic devices such as a mobile phone, a television, and a laptop computer.

[0083] The present application proposes a display backplane and a display device, wherein the display backplane comprises a backplane layer, a substrate layer, a heat-conducting layer, a light-emitting layer, and a heat-conducting hole that at least penetrates the substrate layer, wherein a heat-dissipating column is arranged in the heat-conducting hole, and the heat-dissipating column is in contact with the heat-conducting layer and the backplane layer, respectively. The present application improves the heat dissipation efficiency of the display backplane by arranging a heat-conducting hole on the substrate layer and filling the heat-dissipating column in the heat-conducting hole, so that the heat in the heat-conducting layer is transferred to the backplane layer through the heat-dissipating column in the heat-conducting hole.

[0084] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0085] The above is a detailed introduction to a display backplane and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display backplane, characterized in that: The invention comprises a substrate layer, a heat-conducting layer arranged on one side of the substrate layer, a light-emitting layer arranged on a side of the heat-conducting layer away from the substrate layer, a back plate layer arranged on a side of the substrate layer away from the heat-conducting layer, and a heat-conducting hole; wherein the heat-conducting hole comprises: A first sub-hole, penetrating the substrate layer; A second sub-hole passes through the back plate layer, and the first sub-hole and the second sub-hole are continuously arranged; Among them, a heat dissipation column is arranged in the heat conductive hole, and the heat dissipation column is in contact with the heat conductive layer and the back plate layer respectively, and the thermal conductivity of the heat dissipation column in the first sub-hole is greater than the thermal conductivity of the heat dissipation column in the second sub-hole, and the heat transferred from the heat dissipation column in the first sub-hole to the second sub-hole and the back plate layer per unit time is equal to the heat extracted from the second sub-hole and the back plate layer per unit time.

2. The display backplane according to claim 1, characterized in that: An outer diameter of the first sub-hole is greater than an outer diameter of the second sub-hole.

3. The display backplane according to claim 1, characterized in that: The number of the first sub-holes is greater than the number of the second sub-holes.

4. The display backplane according to claim 1, characterized in that: The display backplane also includes: The heat dissipation joint is arranged between at least two adjacent first sub-holes, the heat dissipation joint is arranged in contact with the at least two adjacent first sub-holes, and the heat dissipation joint is arranged on the surface of the back plate layer close to the substrate layer.

5. The display backplane according to claim 4, characterized in that: The ratio of the thickness of the heat dissipation combining portion to the thickness of the substrate layer is greater than or equal to one third.

6. The display backplane according to claim 4, characterized in that: The material of the heat dissipation combining portion is the same as that of the heat dissipation column in the first sub-hole.

7. The display backplane according to any one of claims 1 to 6, characterized in that: The light-emitting layer includes a plurality of light zones, each of which is provided with a plurality of light-emitting units arranged in an array; Wherein, at least one heat conduction hole is arranged in each of the lamp areas.

8. A display device, characterized in that: The display device comprises the display backplane as claimed in any one of claims 1 to 7 and a cover layer arranged on the display backplane.

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