A laser cutting system

Abstract

An embodiment of the present invention provides a laser cutting system, which is used to make the cutting thickness of the material to be cut thin, the cutting loss is low, and there is no bevel caused by cutting when cutting materials. The laser cutting system in the embodiment of the present invention includes: a laser, a time compression and spatial dispersion system, and a laser focusing system; the laser is used to provide an incident light beam, the time compression and spatial dispersion system includes a first grating and a first reflector and a second reflector arranged perpendicular to each other, or two second gratings and third gratings arranged in parallel and with the same grating parameters; wherein the time compression and spatial dispersion system is used to spatially disperse the incident light beam to obtain a first spectrum separated in space, and collimate the first spectrum to obtain a parallel spectrum after collimation; the laser focusing system is used to focus the parallel spectrum, and focus the light beam to a predetermined depth of the lower surface of the sample to be cut.

Description

Technical Field

[0001] The invention relates to the technical field of laser cutting, and in particular to a laser cutting system. Background Art

[0002] Laser cutting uses a high-energy-density laser beam to heat the workpiece, causing the temperature to rise rapidly and reach the boiling point of the material in a very short time. The material begins to vaporize and form steam. The steam is ejected at a very high speed, and while the steam is ejected, a cut is formed on the material to achieve the purpose of cutting the material.

[0003] At present, when using laser to cut sample materials, the direct laser focusing cutting method is generally adopted. However, because the laser energy decays slowly near the focus, this direct laser focusing cutting method generally makes the laser incident on the surface of the material to be cut in parallel, so that there is a large bevel angle on the surface of the material after cutting. Therefore, this method needs to consume more materials when cutting materials, and it takes a long time to polish the surface of the material after cutting. Summary of the invention

[0004] An embodiment of the present invention provides a laser cutting system, which is used to first spatially disperse an incident light beam of a laser to obtain a first spectrum separated in space, then collimate the light of the first spectrum to obtain a collimated parallel spectrum, and finally focus the collimated parallel spectrum and vertically incident on a surface to be cut of a sample. Because the energy of the dispersed parallel spectrum decays faster near the focus, the material to be cut has less loss in the direction of cutting thickness (thickness along the incident direction of the light), and there is no bevel caused by cutting.

[0005] The present application provides a laser cutting system, comprising:

[0006] Lasers, time compression and spatial dispersion systems, and laser focusing systems;

[0007] Wherein, the laser is used to provide an incident light beam, the spectral width of the laser is not less than 1 nm, and the laser has an adjustable positive dispersion;

[0008] The time compression and spatial dispersion system comprises a first grating and a first reflector and a second reflector arranged perpendicularly to each other, or two second gratings and a third grating arranged in parallel and having the same grating parameters, wherein the time compression and spatial dispersion system is used to perform spatial dispersion on the incident light beam to obtain a first spectrum separated in space, and to collimate the first spectrum to obtain a collimated parallel spectrum;

[0009] The laser focusing system is used to focus the parallel spectrum and make the focused light spot incident vertically onto the surface of the sample to be cut.

[0010] Optionally, if the time compression and spatial dispersion system includes a first grating and a first reflector and a second reflector disposed perpendicularly to each other, the first grating is used to spatially disperse the incident light beam to obtain a spatially separated first spectrum, and the first reflector and the second reflector disposed perpendicularly to each other are used to reflect the first spectrum to the first grating to collimate the first spectrum to obtain a collimated parallel spectrum.

[0011] Optionally, the first grating is a transmission grating or a reflection grating;

[0012] The time compression and space dispersion system further comprises: an axis displacement platform, wherein the axis displacement platform is interconnected with a first reflector and a second reflector which are arranged perpendicularly to each other;

[0013] The first reflector and the second reflector, which are arranged perpendicular to each other, are used to make the first spectrum emitted from the first grating incident on the first grating in an anti-parallel manner;

[0014] The axis displacement platform is adjusted to adjust the optical path of the light of the first spectrum between the first grating and the first reflector and the second reflector which are perpendicularly arranged to each other, so as to compensate for the temporal dispersion of the parallel spectrum caused by the laser focusing system.

[0015] Optionally, if the time compression and spatial dispersion system includes two second gratings and a third grating that are arranged in parallel and have the same grating parameters, the second grating is used to spatially disperse the incident light beam to obtain a spatially separated first spectrum, and the third grating is used to collimate the first spectrum to obtain a collimated parallel spectrum.

[0016] Optionally, the optical path of the light of the first spectrum between the second grating and the third grating is adjustable.

[0017] Optionally, the time compression and space dispersion system further comprises an adjusting device for adjusting the spacing between the second grating and the third grating;

[0018] The adjusting device is adjusted to adjust the optical path of the light of the first spectrum between the second grating and the third grating, so as to compensate for the temporal dispersion of the parallel spectrum caused by the laser focusing system.

[0019] Optionally, the time compression and space dispersion system further comprises an axis displacement platform and a first reflector and a second reflector disposed perpendicularly to each other, and the axis displacement platform and the first reflector and the second reflector disposed perpendicularly to each other are connected to each other;

[0020] The first reflector and the second reflector, which are arranged perpendicular to each other, are used to make the first spectrum emitted from the second grating incident on the third grating in an anti-parallel manner;

[0021] The axial displacement platform is adjusted to adjust the optical path of the light of the first spectrum between the second grating, the first reflector, the second reflector, and the third grating to compensate for the temporal dispersion of the parallel spectrum caused by the laser focusing system.

[0022] Optionally, both the second grating and the third grating are reflection gratings; or,

[0023] The second grating and the third grating are both transmission gratings; or,

[0024] One of the second grating and the third grating is a reflection grating, and the other is a transmission grating.

[0025] Optionally, the time compression and space dispersion system further comprises:

[0026] A first small hole and a fifth reflecting mirror are coaxially arranged, wherein the first small hole is used to collimate the incident light beam of the laser, and the fifth reflecting mirror is used to reflect the collimated incident light beam of the laser to the second grating.

[0027] Optionally, the time compression and space dispersion system further comprises:

[0028] A second small hole and a sixth reflector are coaxially arranged, wherein the sixth reflector is used to reflect the parallel spectrum emitted from the third grating to the second small hole, and the second small hole is used to collimate the parallel spectrum and make the collimated parallel spectrum incident on the laser focusing system.

[0029] Optionally, the laser cutting system further includes:

[0030] A seventh reflector is disposed between the time compression and space dispersion system and the laser focusing system to change the incident light direction of the parallel spectrum so that the parallel spectrum after the direction is changed is incident to the laser focusing system.

[0031] Optionally, the positive dispersion of the laser is adjusted to compensate for the negative dispersion of the incident light beam of the laser caused by the first grating, or the second grating and the third grating.

[0032] Optionally, the numerical aperture of the laser focusing system is not less than 0.25.

[0033] Optionally, the laser cutting system also includes:

[0034] A sample holder and a three-axis displacement platform, wherein the sample holder and the three-axis displacement platform are connected to each other, the sample holder is used to fix the sample, and the three-axis displacement platform is used to adjust the sample holder in three-dimensional space.

[0035] Optionally, the sample is a transparent material, the transparent material includes diamond, and the laser includes a nanosecond laser, a femtosecond laser or a picosecond laser.

[0036] Optionally, the laser cutting system further includes a numerical control system, and the numerical control system is used to control the movement of the laser and the three-axis displacement platform in three-dimensional space;

[0037] Wherein, when cutting the sample, the numerical control system controls the number of pulses output by the laser per unit time to be evenly distributed within the displacement of the three-axis displacement platform in any direction in three-dimensional space per unit time.

[0038] It can be seen from the above technical solutions that the embodiments of the present invention have the following advantages:

[0039] The laser cutting system in the embodiment of the present application includes: a laser, a time compression and spatial dispersion system, and a laser focusing system; wherein the laser is used to provide an incident light beam, the spectral width of the laser is not less than 1 nm, and the laser has an adjustable positive dispersion; the time compression and spatial dispersion system includes a first grating and a first reflector and a second reflector arranged perpendicular to each other, or two second gratings and a third grating arranged in parallel and having the same grating parameters, wherein the time compression and spatial dispersion system is used to spatially disperse the incident light beam to obtain a first spectrum separated in space, and to collimate the first spectrum to obtain a collimated parallel spectrum; the laser focusing system is used to focus the parallel spectrum and to incident the focused light spot onto a location to be cut at a preset depth on the lower surface of the sample.

[0040] Because in the embodiment of the present application, the incident light beam is spatially dispersed by a time compression and spatial dispersion system to obtain a first spectrum separated in space, the first spectrum is collimated to obtain a collimated parallel spectrum, and finally the parallel spectrum is focused by a laser focusing system, and the focused light spot is incident on the to-be-cut location at a preset depth on the lower surface of the sample. Because the energy of the spatially separated parallel spectrum decays faster near the focus, the material to be cut has less loss in the direction of the cutting thickness (thickness along the direction of incidence of light), and there is no bevel caused by cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 This is a schematic diagram of an embodiment of a laser cutting system in an embodiment of the present application;

[0042] Figure 2 The schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application includes a first grating (transmission grating) and a first reflector and a second reflector arranged perpendicular to each other;

[0043] Figure 3 The time compression and spatial dispersion system in the embodiment of the present application includes a first grating (reflection grating) and a first reflector and a second reflector arranged perpendicular to each other.

[0044] Figure 4 The schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application includes two parallel-arranged second gratings (transmission gratings) and a third grating (transmission grating) with the same grating parameters;

[0045] Figure 5 A schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application, which includes two parallel-arranged second gratings (reflection gratings) and a third grating (reflection grating) with the same grating parameters;

[0046] Figure 6 The schematic diagram of the optical path of the time compression and spatial dispersion system in the embodiment of the present application includes two parallel-arranged second gratings (reflection gratings) and a third grating (transmission grating) with the same grating parameters;

[0047] Figure 7 This is a schematic diagram of an embodiment of a time compression and space dispersion system in a laser cutting system in an embodiment of the present application;

[0048] Figure 8 This is another schematic diagram of an embodiment of the time compression and space dispersion system in the laser cutting system in the embodiment of the present application;

[0049] Fig. 9 This is another schematic diagram of an embodiment of the time compression and space dispersion system in the laser cutting system in the embodiment of the present application;

[0050] Fig.10 This is a schematic diagram of an embodiment of a laser cutting system in an embodiment of the present application. DETAILED DESCRIPTION

[0051] An embodiment of the present invention provides a laser cutting system, which is used to first spatially disperse an incident light beam of a laser to obtain a first spectrum separated in space, then collimate the light of the first spectrum to obtain a collimated parallel spectrum, and finally focus the collimated parallel spectrum and vertically incident on a surface to be cut of a sample. Because the energy of the dispersed parallel spectrum decays faster near the focus, the material to be cut has less loss in the direction of cutting thickness (thickness along the incident direction of the light), and there is no bevel caused by cutting.

[0052] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0053] The terms "first", "second", "third", "fourth", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0054] For ease of understanding, the laser cutting system in this application is described below. Figure 1 , an embodiment of the laser cutting system in the present application comprises:

[0055] Laser 101, time compression and spatial dispersion system 102, and laser focusing system 103;

[0056] Among them, the laser 101 is used to provide an incident light beam, and the laser in the embodiment of the present application has a wide spectral width. Generally, the laser spectral width in the embodiment of the present application is not less than 1 nm, and the laser has adjustable positive dispersion.

[0057] Specifically, because the laser in the embodiment of the present application has a wider spectrum, that is, the pulse width of the laser in the embodiment of the present application is narrower, the laser in the embodiment of the present application is preferably a nanosecond laser, a femtosecond laser or a picosecond laser.

[0058] Dispersion refers to the phenomenon that an incident light beam with a certain spectral width (assuming the spectral width is Δλ) is spatially dispersed into multiple single-wavelength light beams, and this phenomenon is called spatial dispersion. The phenomenon that multiple single-wavelength light beams propagate at different speeds in the same medium (the propagation speed of low-frequency light beams is faster than that of high-frequency light beams) and single-wavelength light beams of different frequencies appear in different positions one after another is called temporal dispersion. Positive dispersion refers to the dispersion phenomenon that a low-frequency light beam appears first in time and a high-frequency light beam appears later. Conversely, negative dispersion refers to the dispersion phenomenon that a high-frequency light beam appears first in time and a low-frequency light beam appears later.

[0059] The time compression and space dispersion system 102 specifically includes a first grating 1021 and a first reflector 10221 and a second reflector 10222 arranged perpendicularly to each other, or two second gratings 1023 and a third grating 1024 arranged in parallel;

[0060] Among them, if the time compression and spatial dispersion system 102 includes a first grating 1021 and a first reflector 10221 and a second reflector 10222 arranged perpendicularly to each other, the first grating 1021 is used to diffract light of different wavelengths in the incident light beam of the laser to different angles to achieve spatial separation and produce so-called spatial dispersion, so as to obtain a first spectrum separated in space, and the first reflector 10221 and the second reflector 10222 arranged perpendicularly to each other are used to reflect the first spectrum to the first grating 1022, "collimate" the light beams of different wavelengths, and realize a "parallel spectrum" in which the light beams of different wavelengths are separated in space but are parallel to each other and propagate in the same direction.

[0061] Specifically, the first grating 1021 in the embodiment of the present application may be a transmission grating or a reflection grating, which is not specifically limited here.

[0062] If the time compression and spatial dispersion system 102 includes two second gratings 1023 and a third grating 1024 which are arranged in parallel and have the same grating parameters, the second grating 1023 is used to diffract the light of different wavelengths in the incident laser beam to different angles to achieve spatial separation and generate the so-called spatial dispersion to obtain a first spectrum separated in space, and the third grating 1024 is used to collimate the light beams of different wavelengths in the first spectrum to obtain parallel spectra which are separated in space but are parallel to each other and propagate in the same direction;

[0063] Specifically, the second grating 1023 and the third grating 1024 here can both be reflection gratings, or both be transmission gratings, or one of them can be a reflection grating and the other can be a transmission grating. There is no specific limitation on the types of the second grating 1023 and the third grating 1024 here.

[0064] The laser focusing system 103 is used to focus the parallel spectrum and vertically irradiate the focused light spot to a location to be cut at a preset depth on the lower surface of the sample, wherein the preset depth determines the thickness of the cut sample.

[0065] Because the first grating, or the second grating and the third grating in the embodiment of the present application generate negative dispersion when dispersing the incident laser light beam, the negative dispersion amount generated by the first grating, or the second grating and the third grating on the incident laser light beam can be compensated by adjusting the positive dispersion amount of the laser in the embodiment of the present application.

[0066] Because in the embodiments of the present application, the incident light beam of the laser is first spatially dispersed by the first grating, and then the first spectrum is reflected to the first grating by the first reflector and the second reflector arranged perpendicular to each other to collimate the first spectrum to obtain a collimated parallel spectrum, or the incident light beam of the laser is first spatially dispersed by the second grating, and then the first spectrum is collimated by the third grating to obtain a collimated parallel spectrum, and finally the parallel spectrum is focused by the laser focusing system, and the focused light spot is vertically incident on the to-be-cut location at a preset depth on the lower surface of the sample, wherein the preset depth (the thickness from the sample surface to the focus) determines the cutting thickness, and because the energy of the spatially separated parallel spectra decays faster near the focus, the material to be cut has less loss in the direction of the cutting thickness (thickness along the incident direction of the light), and there is no bevel caused by the cutting.

[0067] For ease of understanding, Figure 2 The optical path diagram of the time compression and spatial dispersion system 102 including the first grating 1021 (transmission grating) and the first reflector 10221 and the second reflector 10222 arranged perpendicular to each other is given. Figure 3 The optical path diagram of the time compression and spatial dispersion system 102 including the first grating 1021 (reflection grating) and the first reflector 10221 and the second reflector 10222 arranged perpendicular to each other is given. Figure 4 The optical path diagram of the time compression and spatial dispersion system 102 is given, which includes two parallel-arranged second gratings 1023 (transmission gratings) and a third grating 1024 (transmission gratings) with the same grating parameters. Figure 5 The optical path diagram of the time compression and spatial dispersion system 102 is given, which includes two parallel-arranged second gratings 1023 (reflection gratings) and a third grating 1024 (reflection grating) with the same grating parameters. Figure 6 The optical path diagram of the time compression and spatial dispersion system 102 is given, which includes a second grating 1023 (reflection grating) and a third grating 1024 (transmission grating) which are arranged in parallel and have the same grating parameters.

[0068] Specifically, when the time compression and spatial dispersion system 102 includes a first grating 1021 and a first reflector 10221 and a second reflector 10222 disposed perpendicularly to each other, the compression and spatial dispersion system 102 in the laser cutting system is described in detail below. Figure 7 , Figure 7 A schematic diagram of an embodiment of a time compression and spatial dispersion system 102 in a laser cutting system:

[0069] Specifically, when the time compression and spatial dispersion system 102 includes a first grating 1021 and a first reflector 10221 and a second reflector 10222 disposed perpendicularly to each other, the first reflector 10221 and the second reflector 10222 disposed perpendicularly to each other are used to direct the first spectrum emitted from the first grating 1021 to be incident to the first grating 1021 in an anti-parallel manner.

[0070] In addition, the time compression and spatial dispersion system 102 also includes an axial displacement platform 1025, wherein the axial displacement platform 1025 is interconnected with a first reflector and a second reflector that are perpendicular to each other. When the axial displacement platform 1025 is adjusted, the optical path of the light of the first spectrum between the first grating and the first reflector 10221 and the second reflector 10222 that are perpendicular to each other can be adjusted to compensate for the time dispersion caused by the laser focusing system 103 to the parallel spectrum.

[0071] As an optional implementation, the axial displacement platform 1025 is disposed in a direction parallel to the light of the first spectrum.

[0072] For ease of understanding, Figure 7 The optical path diagram of the incident light beam of the laser when it passes through the first grating 1021 (transmission grating), the first reflector 10221 and the second reflector 10222 which are arranged perpendicular to each other, and the laser focusing system 103 is given.

[0073] When the time compression and spatial dispersion system 102 includes two parallel second gratings 1023 and third gratings 1024 with the same grating parameters, the compression and spatial dispersion system 102 in the laser cutting system is described in detail below. Figure 8 , Figure 8 Another embodiment of the time compression and space dispersion system 102 in the laser cutting system is shown in FIG.

[0074] Specifically, when the time compression and space dispersion system 102 includes two second gratings 1023 and third gratings 1024 which are arranged in parallel and have the same grating parameters, the optical path length of the light of the first spectrum between the second grating 1023 and the third grating 1024 can be adjusted.

[0075] As an optional embodiment, when adjusting the optical path of the light of the first spectrum between the second grating 1023 and the third grating 1024, an adjusting device 1026 for adjusting the distance between the second grating 1023 and the third grating 1024 may be provided, so that the optical path of the light of the first spectrum between the second grating 1023 and the third grating 1024 can be adjusted by adjusting the adjusting device 1026, thereby compensating for the temporal dispersion caused by the laser focusing system 103 to the parallel spectrum.

[0076] For ease of understanding, Figure 8 A light path diagram is given when the second grating 1023 and the third grating 1024 are both transmission gratings and the incident light beam of the laser passes through the second grating 1023 and the third grating 1024 .

[0077] As another optional embodiment, when adjusting the optical path of the light of the first spectrum between the second grating 1023 and the third grating 1024, an axial displacement platform 1025 and a first reflector 10221 and a second reflector 10222 arranged perpendicularly to each other may also be provided, wherein the axial displacement platform 1025 and the first reflector 10221 and the second reflector 10222 arranged perpendicularly to each other are connected to each other, and the first reflector 10221 and the second reflector 10222 arranged perpendicularly to each other are used to make the first spectrum emitted from the second grating 1023 incident in reverse parallel to the third grating 1024, so as to collimate the first spectrum and obtain a collimated parallel spectrum;

[0078] When the axial displacement platform 1025 is adjusted, the optical path of the light of the first spectrum between the second grating 1023 , the first reflector 10221 , the second reflector 10222 , and the third grating 1024 can be adjusted to compensate for the temporal dispersion of the parallel spectrum caused by the laser focusing system 103 .

[0079] As an optional implementation, the axial displacement platform 1025 is disposed in a direction parallel to the light of the first spectrum.

[0080] For ease of understanding, Fig. 9 A light path diagram is given when the second grating 1023 and the third grating 1024 are both transmission gratings, and the incident light beam of the laser passes through the second grating 1023, the first reflector 10221 and the second reflector 10222, and the third grating 1024.

[0081] Because the laser cutting system in the embodiment of the present application can adjust the optical path of the light of the first spectrum between the second grating 1023 and the third grating 1024 by an adjustment device or an axial displacement platform, thereby compensating for the temporal dispersion of the parallel spectrum by the laser focusing system 103, the light spot focused at the focus in the embodiment of the present application can achieve a "time-space double focusing effect" to produce extremely high peak light intensity within a very small range at the focus, so as to cut the area to be cut at a preset depth on the lower surface of the sample.

[0082] based on Fig. 9 The laser cutting system in the embodiment of the present application is described below. Fig.10 , Fig.10 Another embodiment of the laser cutting system in the embodiment of the present application:

[0083] In order to save the space volume occupied by the laser cutting system, that is, to achieve miniaturization of the laser cutting system, the time compression and spatial dispersion system 102 in the embodiment of the present application further includes:

[0084] The first pinhole 1027 and the third reflector 1028 are coaxially arranged, wherein the first pinhole 1027 is used to collimate the incident light beam of the laser 101, and the third reflector 1028 is used to reflect the collimated incident light beam of the laser to the second grating, so as to save the space volume occupied by the laser cutting system.

[0085] In order to further miniaturize the laser cutting system, as an optional embodiment, the time compression and spatial dispersion system 102 in the embodiment of the present application further includes:

[0086] The second pinhole 1029 and the fourth reflector 1030 are coaxially arranged, wherein the fourth reflector 1030 is used to reflect the parallel spectrum emitted from the third grating 1024 to the second pinhole 1029, and the second pinhole 1029 is used to collimate the parallel spectrum and inject the collimated parallel spectrum into the laser focusing system 103.

[0087] As an optional embodiment, the laser cutting system further includes: a fifth reflector 104,

[0088] The fifth reflector 104 is disposed between the time compression and spatial dispersion system 102 and the laser focusing system 103 to change the incident light direction of the parallel spectrum so that the parallel spectrum after the change of direction is incident to the laser focusing system 103 .

[0089] Furthermore, when performing laser cutting, it is necessary to focus the laser spot on a spot as small as possible to increase the laser energy density per unit area, and the embodiment of the present application requires that the energy of the laser near the focus decays faster, that is, the embodiment of the present application requires that the laser focusing system 103 has a smaller spot and a shorter light waist after focusing, so the laser focusing system 103 in the embodiment of the present application is required to have a larger numerical aperture. As an optional embodiment, the numerical aperture of the laser focusing system in the embodiment of the present application is generally not less than 0.25.

[0090] Furthermore, in order to fix the sample, the laser cutting system in the embodiment of the present application also includes a sample holder 105 and a three-axis displacement platform 106, wherein the sample holder is used to fix the sample, and the three-axis displacement platform is used to control the position of the sample holder in three-dimensional space.

[0091] In order to achieve precise control of the three-axis displacement platform 106 and the laser 101, the laser cutting system in the embodiment of the present application may also include: a numerical control system 107, which is used to control the movement of the laser and the three-axis displacement platform in three-dimensional space.

[0092] Specifically, when the laser cutting system in the embodiment of the present application cuts a sample, the numerical control system controls the number of pulses output by the laser per unit time to be evenly distributed within the displacement of the three-axis displacement platform in any direction in three-dimensional space per unit time.

[0093] For easier understanding, the following example is given:

[0094] Assuming that the number of laser pulses output by the laser in unit time (1ns) is 3, and the three-dimensional displacement platform moves at a uniform speed along the x-axis direction, and the distance moved by the three-dimensional displacement platform in unit time (1ns) is 1mm, then in the embodiment of the present application, the laser is required to output the first pulse when the displacement of the three-dimensional displacement platform along the x-axis direction is 0mm, output the second pulse when the displacement along the x-axis direction is 1 / 3mm, and output the third pulse when the displacement along the x-axis direction is 2 / 3mm.

[0095] As an optional embodiment, the sample in the embodiment of the present application is generally a transparent material, such as diamond, quartz, corundum and rutile.

[0096] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser cutting system, characterized in that: include: Lasers, time compression and spatial dispersion systems, and laser focusing systems; Wherein, the laser is used to provide an incident light beam, the spectral width of the laser is not less than 1 nm, and the laser has an adjustable positive dispersion; The time compression and spatial dispersion system comprises a first grating and a first reflector and a second reflector arranged perpendicular to each other, the positive dispersion of the laser is used to compensate for the negative dispersion caused by the first grating, wherein the time compression and spatial dispersion system is used to perform spatial dispersion on the incident light beam to obtain a first spectrum separated in space, and to collimate the first spectrum to obtain a collimated parallel spectrum; The laser focusing system is used to focus the parallel spectrum and vertically incident the focused light spot to a predetermined depth on the lower surface of the sample to be cut, wherein the predetermined depth determines the thickness of the cut, and the numerical aperture of the laser focusing system is not less than 0.25; The first grating is a transmission grating or a reflection grating; The time compression and space dispersion system further comprises: an axis displacement platform, wherein the axis displacement platform is interconnected with a first reflector and a second reflector which are arranged perpendicularly to each other; The axis displacement platform is adjusted to adjust the optical path of the light of the first spectrum between the first grating and the first reflector and the second reflector which are perpendicularly arranged to each other, so as to compensate for the temporal dispersion of the parallel spectrum caused by the laser focusing system.

2. The laser cutting system according to claim 1, characterized in that: The first grating is used to spatially disperse the incident light beam to obtain a spatially separated first spectrum, and the first reflector and the second reflector arranged perpendicular to each other are used to reflect the first spectrum to the first grating to collimate the first spectrum to obtain a collimated parallel spectrum.

3. The laser cutting system according to claim 1, characterized in that: The laser cutting system also includes: A fifth reflector is disposed between the time compression and space dispersion system and the laser focusing system to change the incident light direction of the parallel spectrum so that the parallel spectrum after the direction is changed is incident to the laser focusing system.

4. The laser cutting system according to claim 1, characterized in that: The laser cutting system also includes: A sample holder and a three-axis displacement platform, wherein the sample holder and the three-axis displacement platform are connected to each other, the sample holder is used to fix the sample, and the three-axis displacement platform is used to adjust the sample holder in three-dimensional space.

5. The laser cutting system according to claim 1, characterized in that: The sample is a transparent material, the transparent material includes diamond, and the laser includes a nanosecond laser, a femtosecond laser or a picosecond laser.

6. The laser cutting system according to claim 4, characterized in that: The laser cutting system further comprises a numerical control system, which is used to control the movement of the laser and the three-axis displacement platform in three-dimensional space; Wherein, when cutting the sample, the numerical control system controls the number of pulses output by the laser per unit time to be evenly distributed within the displacement of the three-axis displacement platform in any direction in three-dimensional space per unit time.

7. A laser cutting system, characterized in that: include: Lasers, time compression and spatial dispersion systems, and laser focusing systems; Wherein, the laser is used to provide an incident light beam, the spectral width of the laser is not less than 1 nm, and the laser has an adjustable positive dispersion; The time compression and spatial dispersion system comprises a second grating and a third grating which are arranged in parallel and have the same grating parameters, and the positive dispersion of the laser is used to compensate for the negative dispersion of the incident light beam of the laser caused by the second grating and the third grating, wherein the time compression and spatial dispersion system is used to perform spatial dispersion on the incident light beam to obtain a first spectrum separated in space, and to collimate the first spectrum to obtain a collimated parallel spectrum; The laser focusing system is used to focus the parallel spectrum and vertically incident the focused light spot to a predetermined depth on the lower surface of the sample to be cut, wherein the predetermined depth determines the thickness of the cut, and the numerical aperture of the laser focusing system is not less than 0.25; The time compression and spatial dispersion system also includes an adjustment device for adjusting the spacing between the second grating and the third grating; the adjustment device is adjusted to adjust the optical path of the light of the first spectrum between the second grating and the third grating, so as to compensate for the time dispersion caused by the laser focusing system to the parallel spectrum; or, the time compression and spatial dispersion system also includes an axial displacement platform and a first reflector and a second reflector arranged perpendicular to each other, and the axial displacement platform and the first reflector and the second reflector arranged perpendicular to each other are connected to each other; wherein the first reflector and the second reflector arranged perpendicular to each other are used to make the first spectrum emitted from the second grating incident on the third grating in an anti-parallel manner; the axial displacement platform is adjusted to adjust the optical path of the light of the first spectrum between the second grating, the first reflector, the second reflector, and the third grating, so as to compensate for the time dispersion caused by the laser focusing system to the parallel spectrum.

8. The laser cutting system according to claim 7, characterized in that: The second grating is used to perform spatial dispersion on the incident light beam to obtain a spatially separated first spectrum, and the third grating is used to collimate the first spectrum to obtain a collimated parallel spectrum.

9. The laser cutting system according to claim 7, characterized in that: The second grating and the third grating are both reflection gratings; or, The second grating and the third grating are both transmission gratings; or, One of the second grating and the third grating is a reflection grating, and the other is a transmission grating.

10. The laser cutting system according to claim 7, characterized in that: The time compression and space dispersion system further comprises: A first small hole and a third reflector are coaxially arranged, wherein the first small hole is used to collimate the incident light beam of the laser, and the third reflector is used to reflect the collimated incident light beam of the laser to the second grating.

11. The laser cutting system according to claim 10, characterized in that: The time compression and space dispersion system further comprises: A second pinhole and a fourth reflector are coaxially arranged, wherein the fourth reflector is used to reflect the parallel spectrum emitted from the third grating to the second pinhole, and the second pinhole is used to collimate the parallel spectrum and allow the collimated parallel spectrum to be incident on the laser focusing system.

12. The laser cutting system according to claim 7, characterized in that: The laser cutting system also includes: A fifth reflector is disposed between the time compression and space dispersion system and the laser focusing system to change the incident light direction of the parallel spectrum so that the parallel spectrum after the direction is changed is incident to the laser focusing system.

13. The laser cutting system according to claim 7, characterized in that: The laser cutting system also includes: A sample holder and a three-axis displacement platform, wherein the sample holder and the three-axis displacement platform are connected to each other, the sample holder is used to fix the sample, and the three-axis displacement platform is used to adjust the sample holder in three-dimensional space.

14. The laser cutting system according to claim 7, characterized in that: The sample is a transparent material, the transparent material includes diamond, and the laser includes a nanosecond laser, a femtosecond laser or a picosecond laser.

15. The laser cutting system according to claim 13, characterized in that: The laser cutting system further comprises a numerical control system, which is used to control the movement of the laser and the three-axis displacement platform in three-dimensional space; Wherein, when cutting the sample, the numerical control system controls the number of pulses output by the laser per unit time to be evenly distributed within the displacement of the three-axis displacement platform in any direction in three-dimensional space per unit time.

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