Carrying substrate, binding assembly and binding method thereof

Abstract

A carrier substrate (1), a binding component and a binding method thereof, wherein the carrier substrate (1) can be bound to an integrated substrate (2), the thermal expansion coefficient of the carrier substrate (1) is greater than the thermal expansion coefficient of the integrated substrate (2), the integrated substrate (2) comprises second binding terminals (211) distributed at equal intervals along the same direction, the carrier substrate (1) comprises a plurality of first binding terminal groups (11), the plurality of first binding terminal groups (11) are distributed at equal intervals along a first direction, and each first binding terminal group (11) comprises a plurality of first binding terminals (111) distributed at equal intervals along the first direction, the plurality of first binding terminals (111) are used for binding with a plurality of second binding terminals (211) in a one-to-one correspondence; wherein the distance between two adjacent first binding terminal groups (11) is smaller than the distance between two adjacent first binding terminals (111) in the binding terminal group, and the distance between two adjacent first binding terminals (111) in the first binding terminal group (11) is equal to the distance between two adjacent second binding terminals (211). The carrier substrate (1) can improve the binding effect between the first binding terminal (111) and the second binding terminal (211).

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a carrier substrate, a binding component and a binding method thereof. Background Art

[0002] In the prior art, the binding terminals of the substrates to be bound are usually bound by hot pressing technology. When the thermal expansion coefficients of the two substrates to be bound are different, the binding terminals will be misaligned. For example, in a binding technology for display panels, the display panel needs to be bound to a die-attached film. However, since the thermal expansion coefficient of the display panel is greater than that of the die-attached film, the binding effect between the binding terminals on the display panel and the binding terminals on the die-attached film is poor.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field.

[0004] Public Content

[0005] According to one aspect of the present disclosure, there is provided a carrier substrate capable of being bound to an integrated substrate, wherein the thermal expansion coefficient of the carrier substrate is greater than the thermal expansion coefficient of the integrated substrate, the integrated substrate includes a plurality of second binding terminals equidistantly distributed along the same direction, the carrier substrate includes a plurality of first binding terminal groups, the plurality of first binding terminal groups are equidistantly distributed along the first direction, and each of the first binding terminal groups includes a plurality of first binding terminals equidistantly distributed along the first direction, and the plurality of first binding terminals are used for binding with the plurality of second binding terminals in a one-to-one correspondence; wherein the distance between two adjacent first binding terminal groups is smaller than the distance between two adjacent first binding terminals in the first binding terminal group, and the distance between two adjacent first binding terminals in the first binding terminal group is equal to the distance between two adjacent second binding terminals.

[0006] In an exemplary embodiment of the present disclosure, each of the first binding terminal groups includes n first binding terminals, where n is a positive integer greater than 1; the distance between two adjacent first binding terminal groups is S1, the distance between two adjacent first binding terminals in the first binding terminal group is S2, the thermal expansion coefficient of the carrier substrate is a, and the size of the first binding terminal in the first direction is W, then S1=S2-a*n*(S2+W).

[0007] In an exemplary embodiment of the present disclosure, the value of n is 5-35.

[0008] In an exemplary embodiment of the present disclosure, the second binding terminal is in the shape of a long strip, and the arrangement direction of the second binding terminal is perpendicular to the extension direction of the second binding terminal; the first binding terminal is in the shape of a long strip, and the arrangement direction of the first binding terminal is perpendicular to the extension direction of the first binding terminal.

[0009] In an exemplary embodiment of the present disclosure, the first binding terminal is in the shape of an elongated strip, and the straight line where the first binding terminal extends forms a first acute angle with the straight line where the first direction is located, and the value of the first acute angle is 69°-85°; the second binding terminal is in the shape of an elongated strip, and the straight line where the second binding terminal extends forms a second acute angle with the straight line where the second binding terminal is distributed, and the value of the second acute angle is equal to that of the first acute angle.

[0010] In an exemplary embodiment of the present disclosure, the carrier substrate is a flexible display panel, and the integrated substrate is a die-attached film.

[0011] According to one aspect of the present disclosure, a carrier substrate is provided, which includes a plurality of first binding terminal groups, wherein the plurality of first binding terminal groups are evenly spaced along a first direction, and each of the first binding terminal groups includes a plurality of first binding terminals evenly spaced along the first direction; wherein a distance between two adjacent first binding terminal groups is smaller than a distance between two adjacent first binding terminals in the first binding terminal group.

[0012] In an exemplary embodiment of the present disclosure, each of the first binding terminal groups includes n first binding terminals, where n is a positive integer greater than 1; the distance between two adjacent first binding terminal groups is S1, the distance between two adjacent first binding terminals in the first binding terminal group is S2, the thermal expansion coefficient of the carrier substrate is a, and the size of the first binding terminal in the first direction is W, then S1=S2-a*n*(S2+W).

[0013] In an exemplary embodiment of the present disclosure, the value of n is 5-35.

[0014] In an exemplary embodiment of the present disclosure, the first binding terminals are in a long strip shape, and an arrangement direction of the first binding terminals is perpendicular to an extension direction of the first binding terminals.

[0015] In an exemplary embodiment of the present disclosure, the carrier substrate is a flexible display panel.

[0016] According to one aspect of the present disclosure, a binding component is provided, the binding component comprising: a carrier substrate and an integrated substrate, the carrier substrate comprising a plurality of first binding terminal groups, the plurality of first binding terminal groups being distributed at equal intervals along a first direction, and each first binding terminal group comprising a plurality of first binding terminals being distributed at equal intervals along the first direction; wherein the distance between two adjacent first binding terminal groups is smaller than the distance between two adjacent first binding terminals in the first binding terminal group. The thermal expansion coefficient of the integrated substrate is smaller than the thermal expansion coefficient of the carrier substrate, the integrated substrate comprising a plurality of second binding terminals, the plurality of second binding terminals being bound to the plurality of first binding terminals in a one-to-one correspondence, and the plurality of second binding terminals being distributed at equal intervals along the first direction.

[0017] In an exemplary embodiment of the present disclosure, each of the first binding terminal groups includes n first binding terminals, and a value of n is 5-35.

[0018] In an exemplary embodiment of the present disclosure, the second binding terminal is in the shape of a long strip, and the arrangement direction of the second binding terminal is perpendicular to the extension direction of the second binding terminal; the first binding terminal is in the shape of a long strip, and the arrangement direction of the first binding terminal is perpendicular to the extension direction of the first binding terminal.

[0019] In an exemplary embodiment of the present disclosure, the first binding terminal is in the shape of a long strip, and the straight line where the first binding terminal extends forms a first acute angle with the straight line where the first direction is located, and the value of the first acute angle is 69°-85°; the second binding terminal is in the shape of a long strip, and the straight line where the second binding terminal extends forms a second acute angle with the straight line where the first direction is located, and the value of the second acute angle is equal to that of the first acute angle.

[0020] In an exemplary embodiment of the present disclosure, the binding component is a display device, the carrier substrate is a flexible display panel, and the integrated substrate is a die-attached film.

[0021] According to one aspect of the present disclosure, a binding component binding method is provided, the binding method comprising:

[0022] Providing a carrier substrate and an integrated substrate, wherein the thermal expansion coefficient of the integrated substrate is smaller than the thermal expansion coefficient of the carrier substrate;

[0023] The carrier substrate includes a plurality of first binding terminal groups, the plurality of first binding terminal groups are distributed at equal intervals in the same direction, and each of the first binding terminal groups includes a plurality of first binding terminals, the distribution direction of the first binding terminals is the same as the distribution direction of the first binding terminal group, and the distance between two adjacent first binding terminal groups is smaller than the distance between two adjacent first binding terminals in the first binding terminal group;

[0024] The integrated substrate includes a plurality of second binding terminals, the plurality of second binding terminals are used to bind with the plurality of first binding terminals in a one-to-one correspondence, the plurality of second binding terminals are distributed at equal intervals along the same direction, and the distance between two adjacent first binding terminals in the first binding terminal group is equal to the distance between two adjacent second binding terminals;

[0025] Aligning and heating the carrier substrate and the integrated substrate;

[0026] The carrier substrate and the integrated substrate are pressed together.

[0027] In an exemplary embodiment of the present disclosure, each of the first binding terminal groups includes n first binding terminals, where n is a positive integer greater than 1; the distance between two adjacent first binding terminal groups is S1, the distance between two adjacent first binding terminals in the first binding terminal group is S2, the thermal expansion coefficient of the carrier substrate is a, and the size of the first binding terminal in its distribution direction is W, then S1=S2-a*n*(S2+W).

[0028] In an exemplary embodiment of the present disclosure, each of the first binding terminal groups includes n first binding terminals, and a value of n is 5-35.

[0029] In an exemplary embodiment of the present disclosure, the second binding terminal is in a long strip shape, and the arrangement direction of the second binding terminal is perpendicular to the extension direction of the second binding terminal;

[0030] The first binding terminals are in a long strip shape, and an arrangement direction of the first binding terminals is perpendicular to an extension direction of the first binding terminals.

[0031] In an exemplary embodiment of the present disclosure, the first binding terminal is in the shape of a long strip, and the straight line where the first binding terminal extends forms a first acute angle with the straight line where the first direction is located, and the value of the first acute angle is 69°-85°; the second binding terminal is in the shape of a long strip, and the straight line where the second binding terminal extends forms a second acute angle with the straight line where the first direction is located, and the value of the second acute angle is equal to that of the first acute angle.

[0032] In an exemplary embodiment of the present disclosure, the binding component is a display device, the carrier substrate is a flexible display panel, and the integrated substrate is a die-attached film.

[0033] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0035] Figure 1 It is a schematic diagram of the structure of two substrates to be bonded before heating in the prior art;

[0036] Figure 2 It is a schematic diagram of the structure of two substrates to be bonded after being heated in the prior art;

[0037] Figure 3 It is a schematic structural diagram of a carrier substrate and an integrated substrate before heating in an exemplary embodiment of a binding method for a binding assembly disclosed in the present invention;

[0038] Figure 4 It is a schematic diagram of the structure after the carrier substrate and the integrated substrate are heated in an exemplary embodiment of the binding method of the binding assembly disclosed in the present invention;

[0039] Figure 5 It is a schematic structural diagram of a carrier substrate and an integrated substrate before heating in another exemplary embodiment of a binding method for a binding assembly disclosed in the present invention;

[0040] Figure 6 It is a schematic structural diagram of a carrier substrate and an integrated substrate after heating in another exemplary embodiment of the binding method of the binding assembly disclosed in the present invention;

[0041] Figure 7 A schematic diagram of the alignment structure of a carrier substrate and an integrated substrate in another exemplary embodiment of the binding method of a binding component disclosed in the present invention;

[0042] Figure 8 This is a diagram of the alignment structure of the carrier substrate and the integrated substrate after relative movement in the second direction in another exemplary embodiment of the binding component binding method disclosed in the present invention. DETAILED DESCRIPTION

[0043] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the present disclosure will be more comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0044] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned upside down, the component described as "upper" will become the component "lower". Other relative terms, such as "high", "low", "top", "bottom", "left", "right", etc., also have similar meanings. When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0045] The terms "a", "an", and "said" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to indicate an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.

[0046] In the prior art, the substrate to be bonded is usually bonded by a hot pressing technique to achieve bonding of the bonding terminals, such as Figure 1 As shown, it is a schematic diagram of the structure of two substrates to be bound before heating in the prior art, and the two substrates to be bound include substrate 01 to be bound and substrate 02 to be bound. Among them, substrate 01 to be bound includes multiple binding terminals 011, and substrate 02 to be bound includes multiple binding terminals 021. In the prior art, the size of the gap between the binding terminals 011 is equal to the size of the gap between the binding terminals 021, and the size of the binding terminals 011 in the arrangement direction is equal to the size of the binding terminals 021 in the arrangement direction. Figure 2 As shown, it is a schematic diagram of the structure of two substrates to be bound after heating in the prior art. Since the thermal expansion coefficient of substrate to be bound 01 is smaller than that of substrate to be bound 02, during the hot pressing process of substrate to be bound 01 and substrate to be bound 02, at least part of the binding terminals 011 and 021 are shifted in position, thereby reducing the overlapping area of ​​the binding terminals 011 and 021, increasing the resistance between the binding terminals 011 and 021, and reducing the signal transmission effect.

[0047] Based on this, this exemplary embodiment first provides a binding component binding method, and the binding component binding method includes:

[0048] Step S1: providing a carrier substrate and an integrated substrate, wherein the thermal expansion coefficient of the integrated substrate is smaller than the thermal expansion coefficient of the carrier substrate.

[0049] Among them, Figure 3FIG. 1 is a schematic diagram of the structure of the carrier substrate and the integrated substrate before heating in an exemplary embodiment of the binding method of the binding assembly disclosed in the present invention. Figure 3 It can represent a schematic diagram of the structure after the carrier substrate 1 and the integrated substrate 2 are aligned. The carrier substrate 1 may include a plurality of first binding terminal groups 11, and the plurality of first binding terminal groups 11 may be distributed at equal intervals along the first direction X, and each of the first binding terminal groups 11 may include a plurality of first binding terminals 111 distributed at equal intervals along the first direction X, and the distance between two adjacent first binding terminals in each first binding terminal group 11 is S2. The distance S1 between two adjacent first binding terminal groups 11 is less than the distance S2 between two adjacent first binding terminals 111 in the first binding terminal group 11. The integrated substrate 2 may include a plurality of second binding terminals 211, and the plurality of second binding terminals 211 are used for binding with the plurality of first binding terminals 111 in a one-to-one correspondence. After the carrier substrate 1 and the integrated substrate 2 are aligned, the plurality of second binding terminals 211 may also be distributed at equal intervals along the first direction X, and the distance S2 between two adjacent first binding terminals 111 in the first binding terminal group 11 may be equal to the distance S4 between two adjacent second binding terminals 211. Among them, as Figure 3 As shown, two adjacent first binding terminals 111 may include adjacent first sub-binding terminals 3 and second sub-binding terminals 4, the first sub-binding terminal 3 includes a side 31 facing the second sub-binding terminal 4, the second sub-binding terminal 4 includes a side 41 facing the first sub-binding terminal 3, the side 31 and the side 41 may be parallel, and the distance S2 between two adjacent first binding terminals 111 in the first binding terminal group 11 may refer to the distance between the side 41 and the side 31 in the first direction X. Similarly, the distance S4 between two adjacent second binding terminals 211 may refer to the distance between the adjacent two side edges of the two adjacent second binding terminals 211 in the first direction X. The distance S1 between two adjacent first binding terminal groups 11 may refer to the distance between two adjacent first binding terminals in two adjacent first binding terminal groups 11. Wherein, as Figure 3 As shown, the plurality of first binding terminals 111 may be symmetrical relative to the symmetry axis A, and the plurality of second binding terminals 211 may also be symmetrical relative to the symmetry axis A, and the symmetry axis A may be perpendicular to the first direction. Since the exemplary embodiment compresses the distance between adjacent first binding terminal groups 11, the first binding terminals 111 may be displaced relative to the second binding terminals 211 toward the symmetry axis A.

[0050] Step S2: aligning and heating the carrier substrate 1 and the integrated substrate 2. Figure 4As shown, it is a schematic diagram of the structure of the carrier substrate and the integrated substrate after heating in an exemplary embodiment of the binding method of the binding component disclosed in the present invention. Wherein, heating the carrier substrate 1 and the integrated substrate 2 may include heating the area where the first binding terminal 111 in the carrier substrate 1 is located and the area where the second binding terminal 211 in the integrated substrate 2 is located. After heating, the distance S2 between two adjacent first binding terminals 111 in the first binding terminal group 11 will increase, the distance S1 between the first binding terminal groups 11 will increase, and the distance S4 between the second binding terminal groups will increase. Since the thermal expansion coefficient of the carrier substrate 1 is greater than the thermal expansion coefficient of the integrated substrate, the increased distance S2 will be greater than the increased distance S4, and the increased distance S1 will be closer to the increased distance S4, that is, the difference between the increased distance S4 and the increased distance S1 is less than the difference between the distance S4 before the increase and the distance S1 before the increase. Therefore, after heating, the first binding terminal 111 will be displaced relative to the second binding terminal 211 in the direction away from the axis A, thereby achieving a better alignment between the first binding terminal 111 and the second binding terminal 211.

[0051] Step S3: Pressing the carrier substrate 1 and the integrated substrate 2 together to achieve binding of the first binding terminal 111 and the second binding terminal 211 .

[0052] This exemplary embodiment divides the first binding terminals into a plurality of groups, and pre-compresses the distance between the first binding terminal groups, thereby increasing the overlapping area of ​​the first binding terminals and the second binding terminals after the carrier substrate and the integrated substrate are heated, thereby improving the binding effect.

[0053] In the related art, the distance between each adjacent first binding terminal can also be compressed. However, since the pre-compression amount between the adjacent first binding terminals is small, a high-precision process device is required to compress the distance between each adjacent first binding terminal.

[0054] In this exemplary embodiment, each of the first binding terminal groups may include 4 first binding terminals. The thermal expansion coefficient of the carrier substrate may be a, and the size of the first binding terminal in the first direction is W, then S1 may be equal to S2-a*4*(S2+W). It should be understood that when the first binding terminal group includes n first binding terminals, n is a positive integer greater than 1, then S1 may be equal to S2-n*a*(S2+W). It should be noted that this exemplary embodiment only compresses the distance between the first binding terminal groups according to the thermal expansion coefficient of the carrier substrate. In other embodiments, the present disclosure may also simultaneously consider the thermal expansion coefficients of the carrier substrate and the integrated substrate to compress the distance between the first binding terminal groups. When the thermal expansion coefficients of the carrier substrate and the integrated substrate are considered at the same time, S1 may be equal to S2-(ab)*n*(S2+W). Wherein, b is the thermal expansion coefficient of the integrated substrate.

[0055] The present exemplary embodiment divides the first binding terminals into a plurality of groups, and the pre-expansion amount of the carrier substrate in the area where a single first binding terminal group is located can be pre-compressed between the first binding terminal groups. The compression amount required between the first binding terminal groups is obviously greater than the compression amount required between the first binding terminals in the related art. Therefore, the binding method provided by the present exemplary embodiment can achieve pre-compensation for the thermal expansion of the carrier substrate by a process device with lower precision.

[0056] In this exemplary embodiment, before the carrier substrate and the integrated substrate are heated, the sizes of the first binding terminals in the first direction may be equal, the sizes of the second binding terminals in the first direction may be equal, and the size of the first binding terminals in the first direction may be equal to the size of the second binding terminals in the first direction. The second binding terminals may be in the shape of a strip, and the arrangement direction of the second binding terminals may be perpendicular to the extension direction of the second binding terminals; the first binding terminals may be in the shape of a strip, and the arrangement direction of the first binding terminals may be perpendicular to the extension direction of the first binding terminals.

[0057] In this exemplary embodiment, Figure 3 , 4 As shown, the first binding terminal and the second binding terminal may be rectangular. Each first binding terminal group may include 4 first binding terminals, and the symmetry axis A may be located between two adjacent first binding terminal groups. It should be understood that in other exemplary embodiments, the first binding terminal and the second binding terminal may also be other shapes, for example, the first binding terminal and the second binding terminal may be a parallelogram, a right-angled trapezoid, etc. Each first binding terminal group may also include other numbers of first binding terminals, and the number of first binding terminals in each first binding terminal group may be the same or different. The symmetry axis A may also be located at other positions, for example, the symmetry axis A may be located in the area where the first binding terminal group is located.

[0058] In this exemplary embodiment, each of the first binding terminal groups may include n first binding terminals. The larger the value of n, the lower the process accuracy requirement for the carrier substrate in the binding method. At the same time, since the distance between the first binding terminals in the first binding terminal group is not compressed, after the carrier substrate is thermally expanded, at least part of the first binding terminals in the same first binding terminal group and the corresponding second binding terminals will be misaligned. The larger the value of n, the larger the maximum misalignment value of the first binding terminals in the same first binding terminal group. In this exemplary embodiment, n can be 5-30, for example, n can be 5, 10, 15, 20, 25, 30.

[0059] In this exemplary embodiment, Figure 5 , which is a schematic structural diagram of a carrier substrate and an integrated substrate before heating in another exemplary embodiment of the binding method of the binding assembly disclosed in the present invention. Figure 5 The carrier substrate, integrated substrate and Figure 3 The difference between the carrier substrate and the integrated substrate shown is that the straight line where the first binding terminal 111 extends can form a first acute angle β1 with the first direction (i.e., the distribution direction of the first binding terminal); the straight line where the second binding terminal 211 extends can form a second acute angle β2 with the first direction X. The value of the first acute angle β1 can be 69°-85°, for example, the value of the first acute angle β1 can be 69°, 75°, 85°, and the value of the first acute angle β1 can be equal to the value of the second acute angle. Among them, the first binding terminal 111 and the second binding terminal 211 can be parallelograms. Similarly, the distance S1 between two adjacent first binding terminal groups 11 can be equal to S2-n*a*(S2+W), wherein S2 is the distance between two adjacent first binding terminals in the first binding terminal group 11. n is the number of first binding terminals in the first binding terminal group 11, a is the thermal expansion coefficient of the carrier substrate, and W is the size of the first binding terminal in its distribution direction. The distance S2 between two adjacent first binding terminals 111 in the first binding terminal group 11 may be equal to the distance S4 between two adjacent second binding terminals 211.

[0060] like Figure 5As shown, two adjacent first binding terminals 111 may include a first sub-binding terminal 3 and a second sub-binding terminal 4, the first sub-binding terminal 3 includes a side 31 facing the second sub-binding terminal 4, the second sub-binding terminal 4 includes a side 41 facing the first sub-binding terminal 3, the side 31 and the side 41 may be parallel, and the extension direction of the first binding terminal 111 may refer to the extension direction of the side 31. Similarly, the extension direction of the second binding terminal 211 may refer to the extension direction of the side of the second binding terminal on one side of the first direction X (i.e., the distribution direction of the second binding terminal). The distance S2 between two adjacent first binding terminals 111 in the first binding terminal group 11 may refer to the distance between the side 41 and the side 31 in the first direction X. The distance S4 between two adjacent second binding terminals 211 may refer to the distance between the adjacent two sides of the two adjacent second binding terminals 211 in the first direction X. The distance S1 between two adjacent first binding terminal groups 11 may refer to the distance between two adjacent first binding terminals in two adjacent first binding terminal groups 11. As shown Figure 5 As shown, since the exemplary embodiment compresses the distance between adjacent first binding terminal groups 11 , the first binding terminals 111 may be misaligned relative to the second binding terminals 211 .

[0061] like Figure 6 FIG. 1 is a schematic diagram of the structure of the carrier substrate and the integrated substrate after heating in another exemplary embodiment of the binding method of the binding assembly disclosed in the present invention. Since the thermal expansion coefficient of the carrier substrate 1 is greater than the thermal expansion coefficient of the integrated substrate 2, the thermal expansion amount of the carrier substrate 1 after heating is greater than the thermal expansion amount of the integrated substrate 2. Thus, a better alignment of the first binding terminal 111 and the second binding terminal 211 can be achieved.

[0062] There is an alignment error when the carrier substrate 1 and the integrated substrate 2 are aligned, such as Figure 7 FIG. 1 is a schematic diagram of the alignment structure of the carrier substrate and the integrated substrate in another exemplary embodiment of the binding method of the binding assembly disclosed in the present invention. Figure 7 As shown, although the carrier substrate 1 and the integrated substrate 2 have only a small error in the first direction, the overlapping area of ​​the first binding terminal 111 and the second binding terminal 211 changes greatly. In this exemplary embodiment, since the first binding terminal 111 and the second binding terminal 211 are both tilted, this exemplary embodiment can achieve a better alignment effect by relatively moving the carrier substrate 1 and the integrated substrate 2 in the second direction Y, wherein the second direction Y is perpendicular to the first direction X. Figure 8As shown, it is a structural diagram of the alignment of the carrier substrate and the integrated substrate after relative movement in the second direction in another exemplary embodiment of the binding method of the binding component disclosed in the present invention. Obviously, after the carrier substrate and the integrated substrate are relatively moved in the second direction, the first binding terminal 111 and the second binding terminal 211 have a larger overlapping area. In addition, compared with the movement of the first binding terminal 111 and the second binding terminal 211 in the first direction, the first binding terminal 111 and the second binding terminal 211 move a larger distance in the second direction, and the overlapping area between the first binding terminal 111 and the second binding terminal 211 changes slightly. Therefore, the alignment accuracy between the first binding terminal 111 and the second binding terminal 211 can be better controlled by the relative movement of the carrier substrate 1 and the integrated substrate 2 in the second direction.

[0063] In this exemplary embodiment, the binding component may be a display device, the carrier substrate may be a flexible display panel, and the integrated substrate may be a die-attached film, wherein a driver chip for driving the flexible display panel may also be bound to the die-attached film. It should be understood that the carrier substrate, the integrated substrate, and the binding component may also be other structures, for example, the carrier substrate and the integrated substrate may be an integrated circuit board, all of which fall within the scope of protection of the present disclosure.

[0064] This exemplary embodiment also provides a carrier substrate capable of being bound to an integrated substrate, wherein the thermal expansion coefficient of the carrier substrate is greater than the thermal expansion coefficient of the integrated substrate, the integrated substrate includes a plurality of second binding terminals equidistantly distributed along the same direction, the carrier substrate includes a plurality of first binding terminal groups, the plurality of first binding terminal groups are equidistantly distributed along the first direction, and each of the first binding terminal groups includes a plurality of first binding terminals equidistantly distributed along the first direction, the plurality of first binding terminals are used for one-to-one binding with a plurality of second binding terminals; wherein the distance between two adjacent first binding terminal groups is less than the distance between two adjacent first binding terminals in the first binding terminal group, and the distance between two adjacent first binding terminals in the first binding terminal group is equal to the distance between two adjacent second binding terminals.

[0065] In this exemplary embodiment, each of the first binding terminal groups includes n first binding terminals, where n is a positive integer greater than 1; the distance between two adjacent first binding terminal groups is S1, the distance between two adjacent first binding terminals in the first binding terminal group is S2, the thermal expansion coefficient of the carrier substrate is a, and the size of the first binding terminal in the first direction is W, then S1=S2-a*n*(S2+W).

[0066] In this exemplary embodiment, the value of n is 5-35, for example, the value of n can be 5, 10, 15, 20, 25, or 30.

[0067] In this exemplary embodiment, the second binding terminal is in the shape of a long strip, and the arrangement direction of the second binding terminal is perpendicular to the extension direction of the second binding terminal; the first binding terminal is in the shape of a long strip, and the arrangement direction of the first binding terminal is perpendicular to the extension direction of the first binding terminal.

[0068] In this exemplary embodiment, the first binding terminal is in the shape of an elongated strip, and the straight line where the first binding terminal extends forms a first acute angle with the straight line where the first direction is located, and the value of the first acute angle is 69°-85°, for example, the value of the first acute angle can be 69°, 75°, or 85°; the second binding terminal is in the shape of an elongated strip, and the straight line where the second binding terminal extends forms a second acute angle with the straight line where the second binding terminal is distributed, and the value of the second acute angle is equal to the value of the first acute angle.

[0069] In this exemplary embodiment, the carrier substrate is a flexible display panel, and the integrated substrate is a die-attachment film.

[0070] The carrier substrate may be Figure 3 , 5 The above content has already described the structure and working principle of the carrier substrate in detail, which will not be repeated here.

[0071] This exemplary embodiment also provides a carrier substrate, which includes a plurality of first binding terminal groups, wherein the plurality of first binding terminal groups are evenly spaced along a first direction, and each of the first binding terminal groups includes a plurality of first binding terminals evenly spaced along the first direction; wherein a distance between two adjacent first binding terminal groups is smaller than a distance between two adjacent first binding terminals in the first binding terminal group.

[0072] In this exemplary embodiment, each of the first binding terminal groups includes n first binding terminals, where n is a positive integer greater than 1; the distance between two adjacent first binding terminal groups is S1, the distance between two adjacent first binding terminals in the first binding terminal group is S2, the thermal expansion coefficient of the carrier substrate is a, and the size of the first binding terminal in the first direction is W, then S1=S2-a*n*(S2+W).

[0073] In this exemplary embodiment, the value of n is 5-35, for example, the value of n can be 5, 10, 15, 20, 25, or 30.

[0074] In this exemplary embodiment, the first binding terminals are in the shape of long strips, and an arrangement direction of the first binding terminals is perpendicular to an extension direction of the first binding terminals.

[0075] In this exemplary embodiment, the first binding terminal is in the shape of an elongated strip, and the straight line where the first binding terminal extends forms a first acute angle with the straight line where the first direction is located. The value of the first acute angle is 69°-85°, for example, the value of the first acute angle can be 69°, 75°, or 85°.

[0076] In this exemplary embodiment, the carrier substrate is a flexible display panel.

[0077] The carrier substrate may be Figure 3 , 5 The above content has already described the structure and working principle of the carrier substrate in detail, which will not be repeated here.

[0078] This exemplary embodiment also provides a binding component, which includes: a carrier substrate and an integrated substrate, the carrier substrate includes a plurality of first binding terminal groups, the plurality of first binding terminal groups are evenly spaced along a first direction, and each first binding terminal group includes a plurality of first binding terminals evenly spaced along the first direction; wherein the distance between two adjacent first binding terminal groups is smaller than the distance between two adjacent first binding terminals in the first binding terminal group. The thermal expansion coefficient of the integrated substrate is smaller than the thermal expansion coefficient of the carrier substrate, the integrated substrate includes a plurality of second binding terminals, the plurality of second binding terminals are bound to the plurality of first binding terminals one by one, and the plurality of second binding terminals are evenly spaced along the first direction.

[0079] In this exemplary embodiment, each of the first binding terminal groups includes n first binding terminals, and the value of n is 5-35. For example, the value of n can be 5, 10, 15, 20, 25, or 30.

[0080] In this exemplary embodiment, the second binding terminal is in the shape of a long strip, and the arrangement direction of the second binding terminal is perpendicular to the extension direction of the second binding terminal; the first binding terminal is in the shape of a long strip, and the arrangement direction of the first binding terminal is perpendicular to the extension direction of the first binding terminal.

[0081] In this exemplary embodiment, the first binding terminal is in the shape of a long strip, and the straight line where the first binding terminal extends forms a first acute angle with the straight line where the first direction is located, and the value of the first acute angle is 69°-85°, for example, the value of the first acute angle can be 69°, 75°, or 85°; the second binding terminal is in the shape of a long strip, and the straight line where the second binding terminal extends forms a second acute angle with the straight line where the first direction is located, and the value of the second acute angle is equal to the value of the first acute angle.

[0082] In this exemplary embodiment, the binding component is a display device, the carrier substrate is a flexible display panel, and the integrated substrate is a die-attachment film.

[0083] In this exemplary embodiment, the binding component can be as follows Figure 4 , 6 , 8. The combined structure of the integrated substrate and the carrier substrate. The above content has already described the structure and working principle of the binding component in detail, which will not be repeated here.

[0084] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing what is disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The specification and embodiments are to be considered merely as exemplary, and the true scope and spirit of the present disclosure are indicated by the claims.

[0085] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A carrier substrate capable of being bound to an integrated substrate, wherein: The thermal expansion coefficient of the carrier substrate is greater than the thermal expansion coefficient of the integrated substrate, the integrated substrate comprises a plurality of second binding terminals distributed at equal intervals in the same direction, and the carrier substrate comprises: A plurality of first binding terminal groups, wherein the plurality of first binding terminal groups are distributed at equal intervals along a first direction, and each of the first binding terminal groups includes a plurality of first binding terminals distributed at equal intervals along the first direction, and the plurality of first binding terminals are used for binding with the plurality of second binding terminals in a one-to-one correspondence; Wherein, the distance between two adjacent first binding terminal groups is smaller than the distance between two adjacent first binding terminals in the first binding terminal group, and the distance between two adjacent first binding terminals in the first binding terminal group is equal to the distance between two adjacent second binding terminals; Each of the first binding terminal groups includes n first binding terminals, where n is a positive integer greater than 1; The distance between two adjacent first binding terminal groups is S1, the distance between two adjacent first binding terminals in the first binding terminal group is S2, the thermal expansion coefficient of the carrier substrate is a, and the size of the first binding terminal in the first direction is W, then S1=S2-a*n*(S2+W).

2. The carrier substrate according to claim 1, wherein: The value of n is 5-35.

3. The carrier substrate according to claim 1, wherein: The second binding terminal is in a long strip shape, and the arrangement direction of the second binding terminal is perpendicular to the extension direction of the second binding terminal; The first binding terminals are in a long strip shape, and an arrangement direction of the first binding terminals is perpendicular to an extension direction of the first binding terminals.

4. The carrier substrate according to claim 1, wherein: The first binding terminal is in the shape of a long strip, a straight line where the first binding terminal extends and a straight line where the first direction is located form a first acute angle, and a value of the first acute angle is 69°-85°; The second binding terminal is in the shape of a long strip, a straight line where the second binding terminal extends and a straight line where the second binding terminal is distributed form a second acute angle, and the second acute angle is equal to the first acute angle.

5. The carrier substrate according to any one of claims 1 to 4, wherein: The carrier substrate is a flexible display panel, and the integrated substrate is a die-attached film.

6. A binding component, wherein: include: A carrier substrate, the carrier substrate comprising: A plurality of first binding terminal groups, wherein the plurality of first binding terminal groups are distributed at equal intervals along a first direction, and each of the first binding terminal groups includes a plurality of first binding terminals distributed at equal intervals along the first direction; Wherein, the distance between two adjacent first binding terminal groups is smaller than the distance between two adjacent first binding terminals in the first binding terminal group; An integrated substrate, wherein the thermal expansion coefficient of the integrated substrate is smaller than the thermal expansion coefficient of the carrier substrate, and the integrated substrate comprises: a plurality of second binding terminals, the plurality of second binding terminals are bound to the plurality of first binding terminals in a one-to-one correspondence, and the plurality of second binding terminals are distributed at equal intervals along the first direction; Each of the first binding terminal groups includes n first binding terminals, where n is a positive integer greater than 1; The distance between two adjacent first binding terminal groups is S1, the distance between two adjacent first binding terminals in the first binding terminal group is S2, the thermal expansion coefficient of the carrier substrate is a, and the size of the first binding terminal in the first direction is W, then S1=S2-a*n*(S2+W).

7. The binding assembly according to claim 6, wherein: Each of the first binding terminal groups includes n first binding terminals, and the value of n is 5-35.

8. The binding assembly according to claim 6, wherein: The second binding terminal is in a long strip shape, and the arrangement direction of the second binding terminal is perpendicular to the extension direction of the second binding terminal; The first binding terminals are in a long strip shape, and an arrangement direction of the first binding terminals is perpendicular to an extension direction of the first binding terminals.

9. The binding assembly according to claim 6, wherein: The first binding terminal is in the shape of a long strip, a straight line where the first binding terminal extends and a straight line where the first direction is located form a first acute angle, and a value of the first acute angle is 69°-85°; The second binding terminal is in the shape of a long strip, a straight line where the second binding terminal extends and a straight line where the first direction is located form a second acute angle, and the second acute angle is equal to the first acute angle.

10. The binding assembly according to any one of claims 6 to 9, wherein: The binding component is a display device, the carrying substrate is a flexible display panel, and the integrated substrate is a die-attached film.

11. A binding component binding method, wherein: include: Providing a carrier substrate and an integrated substrate, wherein the thermal expansion coefficient of the integrated substrate is smaller than the thermal expansion coefficient of the carrier substrate; The carrier substrate includes a plurality of first binding terminal groups, the plurality of first binding terminal groups are distributed at equal intervals in the same direction, and each of the first binding terminal groups includes a plurality of first binding terminals, the distribution direction of the first binding terminals is the same as the distribution direction of the first binding terminal group, and the distance between two adjacent first binding terminal groups is smaller than the distance between two adjacent first binding terminals in the first binding terminal group; The integrated substrate includes a plurality of second binding terminals, the plurality of second binding terminals are used to bind with the plurality of first binding terminals in a one-to-one correspondence, the plurality of second binding terminals are distributed at equal intervals along the same direction, and the distance between two adjacent first binding terminals in the first binding terminal group is equal to the distance between two adjacent second binding terminals; Aligning and heating the carrier substrate and the integrated substrate; Pressing the carrier substrate and the integrated substrate together; Each of the first binding terminal groups includes n first binding terminals, where n is a positive integer greater than 1; The distance between two adjacent first binding terminal groups is S1, the distance between two adjacent first binding terminals in the first binding terminal group is S2, the thermal expansion coefficient of the carrier substrate is a, and the size of the first binding terminal in its distribution direction is W, then S1=S2-a*n*(S2+W).

12. The binding component binding method according to claim 11, wherein: Each of the first binding terminal groups includes n first binding terminals, and the value of n is 5-35.

13. The binding component binding method according to claim 11, wherein: The second binding terminal is in a long strip shape, and the arrangement direction of the second binding terminal is perpendicular to the extension direction of the second binding terminal; The first binding terminals are in a long strip shape, and an arrangement direction of the first binding terminals is perpendicular to an extension direction of the first binding terminals.

14. The binding component binding method according to claim 11, wherein: The first binding terminal is in the shape of a long strip, and a straight line where the first binding terminal extends and a straight line where the first binding terminal is distributed form a first acute angle, and a value of the first acute angle is 69°-85°; The second binding terminal is in the shape of a long strip, a straight line where the second binding terminal extends and a straight line where the second binding terminal is distributed form a second acute angle, and the second acute angle is equal to the first acute angle.

15. The binding component binding method according to any one of claims 11 to 14, wherein: The binding component is a display device, the carrying substrate is a flexible display panel, and the integrated substrate is a die-attached film.

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