A pressure balancing structure and hydraulic balancing system for press-fit IGBT modules

Abstract

The present invention discloses a hydraulic balancing structure for a press-fit IGBT module, comprising a first housing and a second housing. The first and second housings are fastened relative to each other to form a module, forming a cavity within the module for accommodating a liquid medium. The first and second housings are movable relative to each other, and a sealant is provided on the mating surfaces of the first and second housings to seal the liquid medium within the cavity. The first and second housings are electrically connected to each other to facilitate current transmission. This solution utilizes the liquid medium to achieve force balancing in all directions, ensuring good electrical and thermal contact between the chips in contact with the housing end faces.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and in particular relates to a pressure balancing structure and a hydraulic balancing system for a press-fit type IGBT module. Background Art

[0002] As China's distributed energy generation continues to expand, flexible direct current transmission (HVDC) has become the most user-friendly access method for distributed power sources due to its rapid regulation. Press-fit IGBT devices are ideally suited to the high-power, high-voltage, and high-reliability converter valve components required by future flexible direct current transmission systems. The elastic press-fit assembly, the most critical component in an IGBT module besides the chip, provides continuous mechanical pressure to the chip, ensuring a tight connection between the stacked electrodes and power semiconductor chips, thereby achieving excellent electrical connection and heat dissipation performance.

[0003] Press-fit IGBTs are similar in appearance to devices like thyristors, but they achieve their power capacity by connecting numerous components, called "subunits," in parallel. The electrical connection between the chip and electrodes is achieved through pressure, not conventional wires or welding. Compared to traditional welded IGBT modules, press-fit IGBT modules offer advantages such as ultra-large capacity, high reliability, and a low failure mode. Therefore, press-fit IGBTs are currently primarily used in high-end equipment industries such as flexible DC transmission, large-scale industrial drives, and energy.

[0004] During normal operation, press-fit IGBT modules require pressure to ensure good electrical and thermal contact between the internal chips. Typically, the pressure ranges from 500N to 12,000N.

[0005] The current press-fit IGBT modules have the following technical defects: There are two main structural forms of hard press-fit and elastic press-fit for the pressure required by internal devices. Figure 1 As shown, internal chips and other devices are placed on upper and lower metal hard platforms. Through external pressure, the upper and lower metal bodies transfer the force directly to the chip. Because the internal IGBT module usually has multiple chips connected in parallel, the force on each chip must be consistent to avoid uneven force causing imbalance in electrical and thermal contact, accelerating chip aging and reducing service life. Therefore, this structure has strict requirements on the processing accuracy of the upper and lower metal bodies and chip thickness, and the overall production and assembly costs are relatively high. Elastic pressure welding as shown Figure 2As shown, an elastic element, typically a disc spring assembly, is added between the chip and one of the metal parts. The spring's deformation balances machining tolerances and chip thickness variations. While this elastic crimping structure addresses machining precision issues for the metal parts and chip, it places high demands on the disc spring's force consistency. Furthermore, the spring assembly requires a large number of disc springs, and the thickness precision required is relatively high. This prevents the cumulative dimensional tolerances of multiple parts from accumulating, leading to large deviations from the original dimensions and uneven force distribution. Summary of the Invention

[0006] The purpose of the present invention is to solve the problems existing in the above-mentioned prior art and to provide a pressure balancing structure and a hydraulic balancing system for a press-fit IGBT module. This design utilizes the characteristic of the liquid under pressure to transmit force in all directions in a consistent manner, thereby solving the problems existing in the prior art.

[0007] To achieve the above-mentioned objectives, the present invention adopts the following technical solution: a hydraulic balancing structure for a press-fit IGBT module, comprising a first shell and a second shell; the first shell and the second shell are relatively fastened together to form a module, and a cavity is formed inside the module, and the cavity is used to accommodate a liquid medium; the first shell and the second shell are capable of relative movement, and a sealing body is provided on the mating surfaces of the first shell and the second shell, which is used to seal the liquid medium in the cavity; the first shell and the second shell are electrically connected to realize current transmission.

[0008] As a preferred solution, the electrical connection between the first shell and the second shell includes: providing a conductive contact assembly between the mating surfaces of the first shell and the second shell.

[0009] As a preferred embodiment, the conductive contact assembly includes an intermediate connector and a contact piece installed on the intermediate connector; the intermediate connector includes an intermediate longitudinal plate and an elastic arm arranged on the intermediate longitudinal plate, and the contact piece is fixed on the elastic arm. After the contact piece is pressurized, it can twist and retract under the action of the elastic arm.

[0010] As a preferred solution, a ridge structure is stamped on the contact piece along the length direction of the two elastic arms.

[0011] As a preferred solution, the liquid medium is a conductive medium, and the first shell and the second shell realize current transmission through the liquid medium.

[0012] As a preferred solution, at least one pipe hole is provided on the side wall of the second shell, and the pipe hole is used to be connected to the sealing connecting pipe to achieve the transmission connection of the liquid medium between the modules.

[0013] As a preferred solution, the sealed connecting pipe includes a connecting pipe body and an annular seal. The outer circumferential surface of the insertion end of the connecting pipe body is provided with an annular seal, which is used to seal with the pipe hole. A stopper is provided on the sealed connecting pipe, which is used to cooperate with the first housing stopper to isolate the two modules.

[0014] or;

[0015] The sealed connecting pipe includes a pipe fitting and at least one pipe head, wherein the pipe head is installed at the end of the pipe fitting. After the pipe head and the pipe fitting are installed, a corner structure is formed for connecting two modules at the corner of the liquid link.

[0016] As a preferred solution, at least one plug end of the sealed connecting pipe is fixedly connected to the module or integrally formed, and the sealed connecting pipe can connect the cavities of the two modules.

[0017] Or; the two plug ends of the sealed connecting pipe are respectively connected to the pipe holes of the two modules.

[0018] As a preferred solution, the side wall of the first shell is formed with a clearance hole corresponding to the tube hole, and the insertion end of the sealing connecting tube passes through the clearance hole and extends into the tube hole.

[0019] As a preferred solution, a plug is also included, which is used to seal the unconnected pipe holes when the modules are connected.

[0020] As a preferred solution, a boss is provided on the outer end surface of the first shell, and the boss is used to contact the corresponding chip.

[0021] A second object of the present invention is to provide a hydraulic balancing system, comprising any one of the above-mentioned hydraulic balancing structures, characterized in that: it includes a hydraulic link, the liquid link includes a module and a sealed connecting pipe connected to the module, the liquid link drives the liquid medium to flow between the modules through a pump, and a first pressure gauge is provided on the input side of the liquid link for detecting the pressure value on the input side of the liquid link, and a second pressure gauge is provided on the output side of the liquid link for detecting the pressure value on the output side of the liquid link.

[0022] As a preferred solution, the hydraulic chain is composed of two or more modules connected in series via sealed connecting pipes.

[0023] The present invention has at least the following beneficial effects:

[0024] 1. In this solution, the first and second shells are configured as interlocking modules, with a cavity formed within the module to hold a liquid medium. The liquid medium stored in the cavity, on the one hand, transmits pressure evenly due to its balancing properties; on the other hand, it enables electrical transmission through the connecting contact structure. While transmitting pressure, the internal liquid medium also dissipates heat, ensuring good electrical and thermal contact with the chip in contact with the end faces of the shells.

[0025] 2. In the preferred embodiment, the liquid medium is a non-conductive medium or a conductive medium. When the liquid medium is a non-conductive medium, a conductive contact component needs to be set between the contact surfaces of the first shell and the second shell to realize current transmission through the conductive contact component. When the liquid medium is a conductive medium, current transmission is realized through the liquid medium itself.

[0026] 3. In the preferred solution, in order to ensure the reliability of contact force transmission, each contact point needs to be designed as a circular boss according to the user's molybdenum sheet and chip layout position, so as to be compatible with the user's existing process layout.

[0027] 4. In the preferred embodiment, a sealed connecting pipe is used to connect multiple modules in series to form a liquid link, so that the liquid media in the cavities of multiple modules are connected. A first pressure gauge and a second pressure gauge are respectively provided on the inlet and outlet sides of the formed liquid link. The first and second pressure gauges respectively detect the input side pressure and output side pressure of the liquid entering the link, and are used to monitor the pressure value and flow resistance in the link. With such a setting, on the one hand, the pressure exerted by the liquid medium in the component can be calculated, and on the other hand, a basis for adjusting the output power of the pump can be provided.

[0028] 5. In the preferred embodiment, in order to achieve a better sealing effect of the connection of the sealed connecting pipe, a stop platform is provided in the middle section of the connecting pipe body to ensure the insertion position of the insertion end and to isolate, stop and limit the two modules. An annular seal is provided on the outer cylindrical surface of the insertion end, which extends into the cavity at the tube hole of the second shell to form a sleeve structure for cooperating with the annular seal of the insertion end for sealing. In order to ensure that there is a movable gap between the first shell and the second shell, a clearance hole is also reserved on the first shell, and the clearance hole has a certain gap with the insertion end, which can ensure that the shell can move under the action of the liquid medium without being blocked. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 This is a schematic diagram of hard crimping in the prior art;

[0031] Figure 2 It is a schematic diagram of the elastic pressing structure in the prior art;

[0032] Figure 3 is a cross-sectional view of the pressure equalization structure of the present invention;

[0033] Figure 4 It is an external stereogram of the pressure equalization structure;

[0034] Figure 5 Schematic diagram of the position of the pipe hole and the connecting sleeve;

[0035] Figure 6 It is a longitudinal cross-sectional view of a straight sealing connecting pipe;

[0036] Figure 7 It is a three-dimensional diagram of a straight sealing connecting pipe;

[0037] Figure 8 is a front view of the second shell;

[0038] Figure 9 is a perspective view of the second shell;

[0039] Figure 10 Structure of a conductive contact component Figure 1 ;

[0040] Figure 11 Structure of a conductive contact component Figure 2 ;

[0041] Figure 12 is a three-dimensional diagram of the intermediate connector;

[0042] Figure 13 is a side view of the contact piece;

[0043] Figure 14 A top view of the multi-module serial connection method 1;

[0044] Figure 15 A three-dimensional diagram of the first method of connecting multiple modules in series;

[0045] Figure 16 A top view of the second multi-module serial connection method;

[0046] Figure 17 This is a three-dimensional diagram of the second multi-module serial connection method;

[0047] Figure 18 It is a cross-sectional view of the serial connection position of the sealing connecting pipe;

[0048] Figure 19 It is the structural diagram of the liquid link;

[0049] Figure 20 It is a three-dimensional diagram of a U-shaped sealing connecting pipe;

[0050] Figure 21 for Figure 20 Structural diagram of the middle pipe fitting;

[0051] Figure 22 for Figure 20 Structural diagram of the middle tube head;

[0052] Figure 23 The installation effect of the module Figure 1 ;

[0053] Figure 24 The installation effect of the module Figure 2 ;

[0054] Markings in the figure: 1. first shell, 101. clearance hole, 102. boss; 2. second shell, 201. pipe hole, 202. groove 1, 203. groove 2, 204. connecting sleeve; 3. sealing body; 4. conductive contact assembly, 401. contact piece, 4011. wing tip, 4012. clamping foot end, 4013. stamping bending line, 402. intermediate connecting body, 4021. intermediate longitudinal plate, 4022. elastic arm; 5. liquid medium; 6. plug; 7. sealing connecting pipe, 701. connecting pipe body, 702. annular seal, 703. stopper, 704. pipe fitting, 705. pipe head, 801. first pressure gauge, 802. second pressure gauge; 9. pump;

[0055] 10. Ceramic shell, 20. Molybdenum sheet, 30. Filling medium, 40. Silicon chip, 50. Copper body;

[0056] 60, disc spring assembly, 70, chip;

[0057] 100, module, 110, module rack, 120, partition rib,

[0058] 200. Cavity. DETAILED DESCRIPTION

[0059] The present invention is described in detail below by way of exemplary embodiments. However, it should be understood that elements, structures, and features in one embodiment may also be beneficially combined in other embodiments without further description.

[0060] It should be noted that: unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by persons having ordinary skills in the field to which the invention belongs. The words "one", "an" or "the" and the like used in the patent application specification and claims of the present invention do not express a quantitative limitation, but rather indicate the presence of at least one. Words such as "include" or "comprise" indicate that the elements or objects appearing before "include" or "comprises" include the elements or objects listed after "include" or "comprises" and their equivalents, but do not exclude other elements or objects with the same function.

[0061] like Figure 3 As shown, this embodiment provides a pressure-equalizing structure for a press-fit IGBT module, comprising a first housing 1, a second housing 2, and a sealing body 3. The first housing 1 and the second housing 2 are fastened relative to each other in a vertically opposed manner, forming a sealed cavity 200 between the two housings. The cavity 200 is filled with a liquid medium 5. The sealing body 3 is disposed on the mating surfaces of the first housing 1 and the second housing 2 to seal the liquid medium 5, thereby preventing leakage from the cavity 200. Both the first housing 1 and the second housing 2 are metal bodies, and a conductive connection is formed between them, thereby enabling current transmission. This solution leverages the isotropic force-balancing properties of the liquid medium 5 within the cavity to achieve force balance on the upper and lower metal housing surfaces.

[0062] like Figure 8 and 9 As shown, there are two ways to install the sealing body 3 of this scheme: the first way is: an annular groove 202 is provided on the outer side surface of the second shell 2, and the groove 202 is used to accommodate the sealing body 3, and the outer side of the ring of the sealing body 3 is in sealed contact with the inner wall of the first shell 1; the second way is: an annular groove 1 is provided on the circumference of the inner wall of the first shell 1, and the groove 1 is used to install and accommodate the sealing body 3, and the inner side of the ring of the sealing body 3 is in sealed contact with the outer wall of the second shell 2.

[0063] The function of the liquid medium 5 is to transmit pressure evenly in all directions based on the balanced force transmission characteristics of the liquid within the cavity after being subjected to force, thereby achieving balanced force on the force-bearing surfaces of the first shell 1 and the second shell 2. This ensures that the force transmitted to each chip by the structure is consistent, avoiding uneven force at each contact point of the chip, which would cause imbalance in electrical and thermal contact, thereby delaying chip aging and extending its service life. Therefore, transmitting force in all directions by the liquid medium 5 not only solves the problem of high precision requirements of hard crimping in the prior art, but also solves the problem of uneven force caused by the large demand for disc springs in elastic crimping and the accumulation of dimensional tolerances after multiple parts are stacked.

[0064] like Figure 4-7As shown, in this solution, the contact connection structure of the upper and lower metal shells can effectively ensure the transmission of current. The liquid medium 5 can be a conductive medium or a non-conductive medium. When it is a conductive medium, the first shell 1 and the second shell 2 can directly conduct electricity through the liquid medium 5. When it is a non-conductive medium, it is necessary to set a conductive contact component 4 between the first shell 1 and the second shell 2. There are two ways to install the conductive contact component 4: Implementation method 1: The conductive contact component 4 is installed between the mating surfaces of the two shells, and the conductive contact component 4 is fixed in the groove 203 on the outer wall of the second shell 2. A group of conductive contact components 4 are provided in the groove 203 on each side of the second shell 2. The first conductive end of the conductive contact component 4 is in conductive contact with the second shell 2, and the second conductive end of the conductive contact component 4 is in conductive contact with the inner wall of the first shell 1. The conductive contact assembly 4 is fixed in the second groove 203 and will not fall out. Specifically, the elastic arm 4022 of the conductive contact assembly 4 extends to both ends, and the portion that exceeds the contact piece 401 is fixed in the second groove 203. The two side walls of the second groove 203 are provided with a slot that cooperates with the intermediate connector 402, thereby preventing the conductive contact assembly 4 from falling out of the slot. The second groove 203 is arranged parallel to the first groove 202. Preferably, the second groove 203 is located on the side of the first groove 202 away from the liquid sealing surface. Specifically, the sealing body 3 isolates the conductive contact assembly 4 filled in the second groove 203 from the liquid medium 5. Embodiment 2 is an embodiment without drawings: the conductive contact assembly 4 is fixed in the second groove of the inner wall of the first shell 1. The first conductive end of the conductive contact assembly 4 is in conductive contact with the first shell 1, and the second conductive end of the conductive contact assembly 4 is in conductive contact with the inner wall of the second shell 2. The second groove is arranged parallel to the first groove.

[0065] In this embodiment, the conductive contact assembly 4 is composed of an intermediate connector 402 and a plurality of contact pieces 401 connected together. The intermediate connector 402 includes an intermediate longitudinal plate 4021 and a plurality of pairs of elastic arms 4022 arranged along the length of the intermediate longitudinal plate 4021. The length direction of the elastic arms 4022 is perpendicular to the length direction of the intermediate longitudinal plate 4021. One end of the contact piece 401 is a card foot end 4012, and the other end is a wing tip 4011, wherein the card foot end 4012 is hooked on the thin sheet of the elastic arm 4022. , that is, the foot end 4012 is provided with a bent hook structure, and a hanging shaft 4013 is provided inside the foot end 4012. The hanging shaft 4013 cooperates with the hanging hole 4023 on the elastic arm 4022, so that the elastic arm 4022 is fixedly installed in the bent structure of the foot end 4012 through this structure. The connection method of the foot end 4012 here can also be other methods. In an embodiment not shown in the drawings, for example, the foot end 4012 is clamped or bonded at the thin sheet of the elastic arm 4022, so that The card foot end 4012 is fixedly connected with the elastic arm 4022. In the relaxed state, the elastic arm 4022 forms a certain angle with the plane of the middle longitudinal plate 4021. The elastic arm 4022 will tilt toward the side of the contact piece 401. The function of the elastic arm 4022 is to automatically reset itself after being twisted, so that the contact piece 401 can be twisted and retracted under the drive of the elastic arm 4022. The twisted and retracted state at this point is: since the two ends of the elastic arm 4022 are limited by the card grooves on the two side walls of the groove 203, when the contact piece When one end face A of the mating surface 401 is pressed toward the other end face B, the elastic arm 4022 twists and tilts toward the side of the contact piece 401. The pressed contact piece 401 will apply a certain torsional force to the elastic arm 4022. The elastic arm 4022 is in a tensioned state at this time and has the feature of automatic reset. Therefore, the elastic arm 4022 will apply elastic force to the contact piece 401, and the wing tip 4011 of the contact piece 401 will apply a reverse pressure to the end face A, so that the wing tip 4011 is in close contact with the end face A.

[0066] The pin end 4012 serves as a first conductive end, electrically contacting one side of the two mating surfaces, while the wing tip 4011 serves as a second conductive end, electrically contacting the other side of the two mating surfaces. When the conductive contact assembly 4 is compressed, the contact pieces 401 are arranged in a scale-like manner, partially overlapping along the length of the middle longitudinal plate 4021. When the conductive contact assembly 4 is in a relaxed state, the contact pieces 401 are driven by the elastic arms 4022 to twist and rotate, thereby automatically lifting one end of the wing tip 4011 away from the middle longitudinal plate 4021. It should be noted that when the conductive contact assembly 4 is compressed, not only do the contact pieces 401 partially overlap, but the reaction force of the elastic arms 4022 also causes the wing 4014 of the contact piece 401 to deform to a certain extent. This allows for more reliable contact between the contact piece 401 and the end face of the mating surface. In order to further achieve better results, two stamped bending lines 4015 are stamped on the wing plate 4014 of the contact piece 401 along the length direction of the elastic arm 4022, and an upward protruding ridge structure is formed at the stamped bending line 4015. The top of the ridge structure at this location can directly contact the surface of the shell. Compared with the surface contact on both sides, this solution uses the ridge to contact the surface, which can concentrate the force point of the contact piece 401 on the ridge, increase the pressure during contact, and achieve better contact between the contact piece 401 and the shell, thereby achieving reliable current transmission.

[0067] Specifically, in an embodiment not shown in the drawings, groove one and groove two can also be arranged on the first shell 1 and the second shell 2 respectively. For example, groove one is arranged on the inner wall of the first shell 1, and groove two is arranged on the outer wall of the second shell 2. Conversely, for example, groove one is arranged on the outer wall of the second shell 2, and groove two is arranged on the inner wall of the first shell 1.

[0068] like Figure 4 As shown, in this solution, a number of corresponding cylindrical bosses 102 are provided at the position where the end face of the first shell 1 contacts the chip. The bosses 102 are used to contact the molybdenum sheet, chip, etc. The purpose of their provision is to ensure the reliability of contact force transmission. Therefore, it is necessary to layout the contact points according to the positions of the molybdenum sheet and chip, and design the corresponding positions on the first shell 1 as circular bosses, which are compatible with the existing process layout.

[0069] In this embodiment, a tube hole 201 is provided on at least one sidewall of the second housing 2. The tube hole 201 is used to transport the liquid medium 5 between the modules 100. Specifically, a connecting sleeve 204 extends vertically from the inner wall of the second housing 2 at the tube hole 201 into the cavity 200. The inner diameter of the connecting sleeve 204 is smaller than the inner diameter of the opening of the tube hole 201 on the sidewall of the second housing 2, thereby forming a bell-shaped insertion structure at the tube hole 201 to facilitate the docking and insertion of the end of the sealed connecting tube 7. The module 100 includes a first housing 1 and a second housing 2. When the first and second housings 1 and 2 are fastened together, the sealing body 3 and the conductive contact assembly 4 are located on the mating surfaces of the two, and a cavity 200 for accommodating the liquid medium 5 is formed between the first and second housings 1 and 2.

[0070] In this embodiment, the tube hole 201 of the second shell 2 can be implemented as follows: For example, the first method is: a tube hole 201 is formed on one side wall of the second shell 2, and no tube hole 201 is provided on the other side wall adjacent to or opposite to the tube hole 201, and the second shell 2 is directly integrally formed with one end of the sealing connection tube 7. In this setting method, one module 100 is connected to another module 100 by simply inserting the sealing connection tube 7 provided on one module 100 into the tube hole 201 of the other module 100. Multiple modules 100 can be connected in sequence. The second method is: (1) Tube holes 201 are formed on both opposite side walls of the second shell 2. In this setting method, the two plug-in ends of the sealing connection tube 7 can be respectively inserted into the tube holes 201 on the adjacent sides of the two connected modules 100. (2) Tube holes 201 are formed on two adjacent side walls of the second shell 2. This setting method (2) and the above setting method (1) are used in the same connection situation. The only difference is that the two methods are in different positions when connected. The module 100 of the tube hole 201 of the setting method (1) is used for the vertical arrangement connection position as shown in the figure, and the module 100 of the tube hole 201 of the setting method (2) is used for the corner connection position as shown in the figure; the third method is: tube holes 201 are respectively provided on three or four side walls of the second shell 2. This setting method can maximize the versatility of the module 100, thereby facilitating production according to uniform specifications and facilitating docking during the connection process. In this way, there may be tube holes 201 remaining. In this case, the tube holes 201 that do not need to be connected can be blocked by the plug 6 to seal the liquid medium 5 in the cavity 200.

[0071] In this embodiment, a clearance hole 101 corresponding to the tube hole 201 is provided on the side wall of the first shell 1. The function of the clearance hole 101 is to pass through the insertion end of the sealing connecting tube 7. The diameter of the clearance hole 101 can be the same as the diameter of the large diameter end of the tube hole 201. The large diameter end of the tube hole 201 is the end for guiding the sealing connecting tube 7 to be inserted in the figure, that is, the end of the tube hole 201 close to the clearance hole 101. The large diameter end of the tube hole 201 and the clearance hole 101 adopt a smooth matching transition. The small diameter end of the tube hole 201 is the end located in the cavity 200, that is, the port where the connecting sleeve 204 is located in the cavity. After the sealing connecting tube 7 is inserted into place, a movable gap will be formed between the clearance hole 101 and the tube wall of the insertion end of the sealing connecting tube 7. The purpose is to ensure a free movable gap between the upper and lower shells to ensure that the shells can move freely without being hindered under the pressure transmission of the liquid medium 5.

[0072] This program, such as Figure 7 As shown, the sealing connecting pipe 7 is used to connect two adjacent modules 100. Its structure is as follows: the sealing connecting pipe 7 includes a connecting pipe body 701, an annular seal 702, and a stopper 703. The connecting pipe body 701 is a hollow structure, wherein the hollow tube body is used for the circulation of the liquid medium 5. The two ends of the connecting pipe body 701 are the insertion ends of the connecting module 100. The outer surface of the insertion end is provided with an annular seal 702, which is used to seal with the tube hole 201. Preferably, there can be two or more annular seals 702 at each end. Several annular seals 702 are arranged along the axial direction of the connecting pipe body 701 to enhance the sealing effect through multiple sealing. A stopper 703 is also provided near the middle of the outer surface of the sealing connecting pipe 7, so that the sealing connecting pipe 7 has a thick middle and thin ends. The stopper 703 is used to stop with the housing to ensure that the insertion end is inserted into place and has a stopping and limiting effect on the two modules 100.

[0073] This solution also includes a liquid link consisting of several modules 100 and sealed connecting tubes 7. Several modules 100 are connected in series via the sealed connecting tubes 7 to form an assembly. The sealed connecting tubes 7 are used to connect the modules 100 to achieve the flow of the liquid medium 5 along the direction of the series connection. The liquid link includes the first type of liquid link with a simple straight structure: For this type of liquid link, it is only necessary to arrange the modules and the sealed connecting tubes 7 in a straight line and connect them in sequence. The second type is a liquid link that includes a combination of straight and corner structures. For this type of liquid link, due to the presence of a corner structure, a sealed connecting tube of another structure is required at the corner connection. In one embodiment of the accompanying drawings, the liquid link is U-shaped. Between the two modules 100 at the bend, communication can be achieved using the following two connection directions. The first is to communicate with a sealing connecting pipe of another structure through the two pipe holes 201 located on the same side of the outside. The sealing connecting pipe of this structure is a U-shaped bending structure as a whole. For the sealing connecting pipe of this special structure, the following three implementation methods can be adopted: the sealing connecting pipe includes a pipe fitting 704 and two pipe heads 705. The pipe fitting 704 is a straight rod shape, and the pipe head 705 is an elbow structure. The first structure is: the two pipe heads 705 are detachably arranged at the two ends of the pipe fitting 704, and the pipe fitting 704 is a straight rod structure. The two ends of the pipe fitting 704 are The second structure differs from the first structure only in that the pipe fitting 704 and one of the pipe heads 705 are integrally formed. The third structure differs from the first structure only in that the pipe fitting 704 and the pipe heads 705 are integrally formed. The first and second structures utilize a detachable connection, allowing the pipe fitting 704 to be of different lengths as needed, thereby improving component versatility. The third structure is an integrally formed structure, which facilitates assembly but has a single length specification, requiring production in multiple sizes to meet the needs of different modules.

[0074] In an embodiment not shown in the drawings, the sealing connecting pipe is in an L-shaped bent structure, and the following two implementation methods can be adopted: In both implementation methods, the sealing connecting pipe includes a pipe fitting 704 and a pipe head 705, the pipe fitting 704 is a straight rod shape, and the pipe head 705 is an elbow structure. The first structure is: the pipe head 705 is detachably arranged at one end of the pipe fitting 704, and the other end of the pipe fitting 704 is connected to the pipe hole of the module 100. The setting structure of the connection of the pipe fitting 704 is the same as that of the straight rod-shaped sealing connecting pipe, and an annular sealing member is provided on the outer circular surface of the plug-in end for sealing with the pipe hole of the module 100. The second structure is that the only difference from the first structure is that the pipe head 705 is integrally arranged at one end of the pipe fitting 704. Of the above two methods, the first structure has better versatility than the second structure.

[0075] In this embodiment, multiple modules 100 are connected by pipelines and the like to achieve the circulation of internal liquid. In order to deal with adverse effects such as heat caused by contact resistance, cooling can be achieved through internal liquid. A pump 9 and a first pressure gauge 801 are provided on the input side of the liquid link. The first pressure gauge 801 is provided on the outlet side of the pump 9. The liquid link drives the liquid medium 5 to flow between the modules 100 through the pump 9. The first pressure gauge 801 is used to detect the pressure value on the input side of the liquid link. A second pressure gauge 802 is provided on the outlet side of the liquid link to detect the pressure value on the output side of the liquid link. The first and second pressure gauges 801 and 802 are used to detect the input side pressure and output side pressure of the liquid entering the liquid link, and the size and change value of the input side pressure value and the output side pressure value are obtained, thereby adjusting the output power of the pump 9. As mentioned above, the two pressure gauges can be used to monitor the pressure value and flow resistance in the liquid link, and can provide a basis for adjusting the output power of the pump 9 by calculating the pressure applied by the liquid medium 5 in the liquid link, while effectively ensuring the heat dissipation effect of the liquid medium 5. As Figure 23-24 As shown, each module 100 in the liquid link is nested and installed within a module rack 110. The interior of the module rack 110 is separated into multiple independent module installation areas by partition ribs 120. Each module installation area can fix the position of each module 100, thereby improving the overall structure and connection reliability of the liquid link.

[0076] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. Any technician familiar with the present profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A hydraulic balancing structure for a press-fit IGBT module, characterized by: comprising a first shell and a second shell; The first shell and the second shell are relatively buckled to form a module, and a cavity is formed inside the module, and the cavity is used to accommodate a liquid medium; the liquid medium is a non-conductive medium; The first shell and the second shell are capable of relative movement, and a sealing body is provided on the mating surfaces of the first shell and the second shell for sealing the liquid medium in the cavity; The first shell and the second shell are electrically connected to achieve current transmission; Disposing a conductive contact assembly between the mating surfaces of the first housing and the second housing; The conductive contact assembly includes an intermediate connector and a contact piece installed on the intermediate connector; the intermediate connector includes an intermediate longitudinal plate and an elastic arm arranged on the intermediate longitudinal plate, the contact piece is fixed on the elastic arm, and after the contact piece is compressed, it can be twisted and retracted under the action of the elastic arm; the contact piece is stamped with a convex ridge structure along the length direction of the two elastic arms.

2. The hydraulic balancing structure for a press-fit IGBT module according to claim 1, wherein: At least one pipe hole is provided on the side wall of the second shell, and the pipe hole is used to be connected to the sealing connecting pipe to achieve the transmission connection of the liquid medium between the modules.

3. The hydraulic balancing structure for a press-fit IGBT module according to claim 2, wherein: The sealed connecting pipe includes a connecting pipe body and an annular seal. The outer circumferential surface of the insertion end of the connecting pipe body is provided with an annular seal, which is used to seal with the pipe hole. A stopper is provided on the sealed connecting pipe, which is used to cooperate with the first housing stopper to isolate the two modules. or; The sealed connecting pipe includes a pipe fitting and at least one pipe head, wherein the pipe head is installed at the end of the pipe fitting. After the pipe head and the pipe fitting are installed, a corner structure is formed for connecting two modules at the corner of the liquid link.

4. The hydraulic balancing structure for a press-fit IGBT module according to claim 3, wherein: At least one plug end of the sealing connection pipe is fixedly connected to the module or integrally formed, and the sealing connection pipe can make the cavities of the two modules communicate with each other. Or; the two plug ends of the sealed connecting pipe are respectively connected to the pipe holes of the two modules.

5. A hydraulic balancing structure for a press-fit IGBT module according to any one of claims 2 to 4, characterized in that: The side wall of the first shell is formed with a clearance hole corresponding to the tube hole, and the insertion end of the sealing connecting pipe passes through the clearance hole and extends into the tube hole.

6. The hydraulic balancing structure for a press-fit IGBT module according to claim 5, characterized in that: It also includes a plug, which is used to seal the unconnected pipe holes when the modules are connected.

7. A hydraulic balancing structure for a press-fit IGBT module according to any one of claims 1 to 6, characterized in that: A boss is provided on the outer end surface of the first shell, and the boss is used to contact the corresponding chip.

8. A hydraulic balancing system comprising the hydraulic balancing structure according to any one of claims 1 to 7, characterized in that: The invention comprises a hydraulic link, wherein the liquid link comprises modules and sealed connecting pipes connected to the modules. The liquid link drives the liquid medium to flow between the modules through a pump. A first pressure gauge is provided on the input side of the liquid link for detecting the pressure value on the input side of the liquid link, and a second pressure gauge is provided on the output side of the liquid link for detecting the pressure value on the output side of the liquid link.

9. A hydraulic balancing system according to claim 8, characterized in that: The hydraulic chain is composed of two or more modules connected in series via sealed connecting pipes.

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