Heat dissipation device for electronic components

Abstract

Provided is a heat dissipation device for an electronic component that minimizes the size while improving heat dissipation performance. To this end, the heat dissipation device for an electronic component according to the present invention includes a heat dissipation case formed with an internal space, a shield cover formed of a heat conductive material, disposed in the heat dissipation case, and dividing the internal space into a first chamber that is a vacuum space filled with a refrigerant and a second chamber that is a non-vacuum space, and a printed circuit substrate disposed in the shield cover and provided with a heat generating component, the shield cover using sensible heat transferred from the heat generating component to the shield cover and latent heat transferred from the shield cover to the first chamber to evaporate the refrigerant.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat dissipating apparatus for electronic elements, and more particularly, to a heat dissipating apparatus for electronic elements for dissipating heat generated from a heat source such as an antenna element mounted on a printed circuit substrate. BACKGROUND

[0002] Wireless communication technology, for example, Multiple Input Multiple Output (MIMO) technology is a technology for greatly increasing data transmission capacity by using multiple antennas, and a transmitter transmits mutually different data through each of the transmission antennas, and a receiver distinguishes the spatial multiplexing of the transmission data through appropriate signal processing.

[0003] Therefore, as the number of transmission / reception antennas increases, the channel capacity increases, allowing more data to be transmitted. For example, when the number of antennas increases to 10, compared to the current single antenna system, using the same frequency band ensures approximately 10 times the channel capacity.

[0004] In 4G LTE-advanced, up to 8 antennas are used, and currently, products with 64 or 128 antennas are being developed in the pre-5G stage, and it is expected that 5G will use base station equipment with a larger number of antennas, which is called Massive MIMO technology. Although the current cell operation is two-dimensional (2-Dimension), when the Massive MIMO technology is introduced, 3D beamforming can be achieved, so it is also called FD-MIMO (Full Dimension).

[0005] In the Massive MIMO technology, as the number of ANT increases, the number of transmitters and filters also increases accordingly. Despite this, due to the rental cost or space limitations of the installation site, the radio frequency (RF) components (antenna / filter / power amplifier / transceiver, etc.) become small, light, and inexpensive, and this is a negative factor in reducing weight and size for the Massive MIMO, which requires high output to expand coverage. The power consumption and heat generated by the high output are negative factors in reducing weight and size.

[0006] In particular, when a MIMO antenna in which modules implemented by RF elements and digital elements are combined in a stacked structure is installed in a limited space, in order to maximize the convenience of installation and the space utilization, a demand for compactification and miniaturization design of a plurality of layers constituting the MIMO antenna is emerging, and in this case, there is a need to design a new heat dissipation structure to prevent heat generated from communication components installed on the plurality of layers.

[0007] A "Multiple Input Multiple Output Antenna Device" applying a heat dissipation structure for compactification and miniaturization design of a plurality of layers constituting a MIMO antenna is disclosed in Korean Patent Laid-Open Publication No. 10-2019-0118979 (Publication Date: October 21, 2019) (hereinafter referred to as "the related art").

[0008] The related art includes a heat dissipation body having a protruding heat dissipation fin, and a plurality of unit heat dissipation bodies provided on the heat dissipation body. One end of the plurality of unit heat dissipation bodies is provided to be in contact with a heat generating element of an antenna substrate, and the other end is provided with a plurality of sub heat dissipation fins for dissipating heat transferred from the heat generating element to the outside.

[0009] However, in the related art, the structure for dissipating heat of the heat generating element is a mechanical structure, that is, an air cooling type heat dissipation structure by heat exchange with external air, and thus it is difficult to quickly dissipate heat, and more mechanical heat dissipation structures are required for quick heat dissipation, and thus there is a problem of an increase in size. SUMMARY

[0010] Problems to be Solved by the Invention

[0011] The technical problem of the present application is to provide a heat dissipation device for an electronic element that minimizes the size while improving heat dissipation performance.

[0012] Another technical problem of the present application is to provide a heat dissipation device for an electronic element that can quickly dissipate heat generated in a heat generating element through phase change of a refrigerant.

[0013] The technical problem of the present application is not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art through the following description.

[0014] Solution to Solve the Technical Problem

[0015] To achieve the technical problem, the heat dissipation device of the electronic component according to the present application comprises a heat dissipation shell, a shield and a printed circuit board. The heat dissipation shell has an internal space formed therein. The shield is formed of a heat conductive material. The shield is arranged in the heat dissipation shell to divide the internal space into a first chamber and a second chamber. The first chamber is a vacuum space filled with refrigerant. The second chamber is a non-vacuum space. The printed circuit board is arranged in the shield. The printed circuit board is provided with a heat generating component. The shield uses sensible heat transferred from the heat generating component to the shield and latent heat transferred from the shield to the first chamber to evaporate the refrigerant.

[0016] The heat dissipation shell can be in the shape of a bellows.

[0017] A heat dissipation fin can be formed protruding on the outer side of the heat dissipation shell.

[0018] A power supply unit can be arranged in the first chamber. The power supply unit can supply power to the printed circuit board.

[0019] The outer side of the heat dissipation shell can be surrounded by a finger guard. A plurality of holes can be formed in the finger guard.

[0020] A nozzle and a refrigerant pump can also be included in the heat dissipation device of the electronic component according to the present application. The nozzle can spray the refrigerant into the first chamber. The refrigerant pump can supply the refrigerant to the nozzle.

[0021] A pressure sensing sensor and a controller can also be included in the heat dissipation device of the electronic component according to the present application. The pressure sensing sensor can sense the pressure of the first chamber. For the controller, when the pressure of the first chamber sensed by the pressure sensing sensor is below a first set pressure, the refrigerant pump is operated, and when the pressure of the first chamber sensed by the pressure sensing sensor is above a second set pressure, the refrigerant pump can be stopped. The second set pressure can be a higher pressure than the first set pressure.

[0022] The refrigerant pump can supply the refrigerant condensed in the first chamber to the nozzle.

[0023] The heat dissipation shell can include a shell body and a rear cover. The rear cover can cover the rear surface of the opening of the shell body. A cylindrical insertion portion protruding forward can be formed on the front surface of the rear cover. The first chamber can be the outer side space of the insertion portion in the internal space of the shell body. The second chamber can be the internal space of the insertion portion.

[0024] A shield plate can be provided in the heat dissipation case. In this case, the opening front end of the insertion portion inserted into the case body can cover the shield plate, and the shield cover can be provided separately from the shield plate in the first chamber.

[0025] The heat dissipation device for electronic components according to the present application includes a heat dissipation case and a printed circuit board. The heat dissipation case is formed with an internal space. The printed circuit board is provided in the internal space of the heat dissipation case to divide the internal space into a first chamber and a second chamber. The first chamber is a vacuum space filled with a refrigerant. The second chamber is a non-vacuum space. A heat generating component is provided in the printed circuit board. The printed circuit board can be subjected to a coating process so that the refrigerant does not penetrate. The refrigerant is evaporated by heat generated from the heat generating component.

[0026] The heat dissipation case can have a bellows shape.

[0027] A heat sink can be formed to protrude from an outer side of the heat dissipation case.

[0028] A power supply unit can be provided in the first chamber. The power supply unit can supply power to the printed circuit board.

[0029] An outer side of the heat dissipation case can be surrounded by a finger guard. A plurality of external air inlet and outlet holes can be formed in the finger guard.

[0030] A nozzle and a refrigerant pump can be further included in the heat dissipation device for electronic components according to the present application. The nozzle can spray the refrigerant into the first chamber. The refrigerant pump can supply the refrigerant to the nozzle.

[0031] A pressure sensing sensor and a controller can be further included in the heat dissipation device for electronic components according to the present application. The pressure sensing sensor can sense the pressure of the first chamber. The controller can operate the refrigerant pump when the pressure of the first chamber sensed by the pressure sensing sensor is below a first set pressure, and can stop the refrigerant pump when the pressure of the first chamber sensed by the pressure sensing sensor is above a second set pressure. The second set pressure can be a higher pressure than the first set pressure.

[0032] The refrigerant pump can supply the refrigerant condensed in the first chamber to the nozzle.

[0033] The heat dissipating housing can include a housing body and a rear cover. The rear cover can cover a rear surface of an opening of the housing body. A cylindrical insertion portion protruding forward can be formed at a front surface of the rear cover. At least one flat portion in which the printed circuit board is installed can be formed at an outer side surface of the insertion portion. The first chamber can be an outer side space of the flat portion in an inner space of the housing body. The second chamber can be an inner space of the insertion portion.

[0034] Details of other embodiments are included in the detailed description and the accompanying drawings.

[0035] Effects of the Invention

[0036] In the heat dissipating device for electronic components according to the present invention, when a shield cover is provided, a printed circuit board having a heat generating component is disposed in an inner portion of the shield cover, and heat generated from the heat generating component is transferred to the shield cover. The heat transferred to the shield cover is exchanged with a refrigerant of a first chamber to evaporate and dissipate the refrigerant.

[0037] Also, in the heat dissipating device for electronic components according to the present invention, when the printed circuit board is coated so that a refrigerant does not penetrate into the printed circuit board without the shield cover, the refrigerant of the first chamber is exchanged with heat generated from the heat generating component to evaporate and dissipate the refrigerant.

[0038] As described above, the heat dissipating device for electronic components according to the present invention has an effect of rapidly dissipating heat generated from the heat generating component through phase change of the refrigerant, and does not need to provide a large number of mechanical air-cooled heat dissipating structures, thus having an effect of reducing the size.

[0039] The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the scope of the invention. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 is a perspective view showing a heat dissipating device for electronic components of a first embodiment of the present invention.

[0041] Figure 2 is a perspective view showing Figure 1 is a perspective view showing the heat dissipating device for electronic components of the first embodiment of the present invention with a finger guard removed.

[0042] Figure 3 is a plan view of Figure 1

[0043] Figure 4 is a plan view showing the heat dissipating device for electronic components of the first embodiment of the present invention with the finger guard removed. Figure 3

[0044] Figure 5 is a plan view showing​​Figure 1 The main view.

[0045] Figure 6 To indicate Figure 5 Front view of the finger guard removed.

[0046] Figure 7 for Figure 1 Side sectional view.

[0047] Figure 8 This is a control block diagram illustrating a heat dissipation device for an electronic component according to a first embodiment of the present invention.

[0048] Figure 9 This is a side cross-sectional view showing the heat dissipation device of the electronic component according to the second embodiment of the present invention.

[0049] Figure 10 This is a perspective view showing a heat dissipation device for an electronic component according to a third embodiment of the present invention.

[0050] Figure 11 for Figure 10 Side sectional view.

[0051] Figure 12 To indicate Figure 11 The diagram shows a three-dimensional view of one side of the substrate mounting and printed circuit board.

[0052] Figure 13 To indicate Figure 11 The diagram shows a three-dimensional view of the other side of the substrate mounting and printed circuit board.

[0053] Explanation of reference numerals in the attached figures

[0054] 10: Heat dissipation casing 11: Casing body

[0055] 11A: First fold 11B: Heat sink

[0056] 12: Front cover 12A: Second pleat

[0057] 13: Back cover 13A: Insertion part

[0058] 20: Shielding cover; 30: Printed circuit board

[0059] 40: Finger guard 41: External air inlet / outlet

[0060] 50: Power supply unit; 60: Shielding plate

[0061] C1: First chamber; C2: Second chamber Detailed Implementation

[0062] Hereinafter, a heat dissipation device for an electronic component according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0063] Figure 1 FIG. 1 is a perspective view showing a heat dissipation device of an electronic component according to a first embodiment of the present application, Figure 2 FIG. 2 is a perspective view showing Figure 1 FIG. 3 is a perspective view showing the electronic component of FIG. 2 with a finger guard removed, Figure 3 FIG. 4 is a plan view showing Figure 1 FIG. 5 is a plan view showing the electronic component of FIG. 4 with the finger guard removed, Figure 4 FIG. 6 is a plan view showing Figure 3 FIG. 7 is a plan view showing the electronic component of FIG. 6 with the finger guard removed, Figure 5 FIG. 8 is a front view showing Figure 1 FIG. 9 is a front view showing the electronic component of FIG. 8 with the finger guard removed, Figure 6 FIG. 10 is a front view showing Figure 5 FIG. 11 is a front view showing the electronic component of FIG. 10 with the finger guard removed, Figure 7 FIG. 12 is a side sectional view showing Figure 1 FIG. 13 is a side sectional view showing the electronic component of FIG. 12 with the finger guard removed.

[0064] Referring to Figures 1 to 7 , the heat dissipation device of the electronic component according to the first embodiment of the present application can include a heat dissipation housing 10, a shield 20, a printed circuit substrate 30, and a finger guard 40.

[0065] However, the finger guard 40 has a structure surrounding the outside of the heat dissipation housing 10 to prevent external foreign matter or external impact from being transmitted to the heat dissipation housing 10, while also preventing a person's finger from being externally contacted to the heat dissipation housing 10, the heat dissipation device of the electronic component according to the embodiment of the present application can not include the finger guard 40.

[0066] The heat dissipation housing 10 can be formed in a cylindrical shape having an internal space. However, the shape of the heat dissipation housing 10 is not limited to the cylindrical shape, but can be a cylindrical shape having an internal space. For example, the heat dissipation housing 10 can be formed in a polygonal cylindrical shape such as a triangular cylindrical shape or a quadrangular cylindrical shape.

[0067] The heat dissipation housing 10 can be formed of a material having excellent heat dissipation performance. For example, the heat dissipation housing 10 can be formed of an aluminum material or a stainless steel material.

[0068] The heat dissipation housing 10 can be formed in a bellows shape, and the length thereof can be changed in the front-rear direction in the drawing. That is, a plurality of first wrinkle portions 11A folded in the front-rear direction can be formed to protrude at the outside of the heat dissipation housing 10.

[0069] The plurality of first wrinkle portions 11A can be formed in a folded shape, and can be unfolded or folded by pressure in a first chamber C1.

[0070] That is, when a refrigerant in the first chamber C1 to be described later is vaporized, the plurality of first wrinkle portions 11A can be unfolded by the pressure of the refrigerant to increase the contact area with external air.

[0071] However, the heat dissipation case 10 does not necessarily have to be formed in a bellows shape in order to increase the contact area with the outside air. That is, as will be described later in a second embodiment, a plurality of fins 11B can be provided on the outer side surface of the heat dissipation case 10 instead of the plurality of first corrugated portions 11A.

[0072] The heat dissipation case 10 can include a cylindrical case body 11 having an open front surface and a rear surface, a front cover 12 combined with the front of the case body 11 to cover the open front surface of the case body 11, and a rear cover 13 combined with the rear of the case body 11 to cover the open rear surface of the case body 11.

[0073] The plurality of first corrugated portions 11A can be provided on the outer side surface of the case body 11. The case body 11 can form the circumferential surface of the heat dissipation case 10. The inner space of the case body 11 can be the inner space of the heat dissipation case 10.

[0074] The front cover 12 can form the front surface of the heat dissipation case 10. A plurality of second corrugated portions 12A can be formed in the front cover 12. In the present embodiment, the plurality of second corrugated portions 12A are formed in a ring shape to be provided on concentric circles, but the shape of the plurality of second corrugated portions 12A is not limited to a ring shape and can be formed in a polygonal shape to be provided on concentric circles.

[0075] The plurality of first corrugated portions 11A are unfolded or folded by the pressure in the first chamber C1, whereas the plurality of second corrugated portions 12A can not be unfolded or folded and the shape thereof is not changed. That is, the plurality of second corrugated portions 12A are bent in a "Z" shape in the side cross section, so that one of the second corrugated portions adjacent to each other can have a convex front surface and a concave rear surface, and the other can have a concave front surface and a convex rear surface.

[0076] The rear cover 13 can form the rear surface of the heat dissipation case 10. The rear cover 13 can be provided with a vacuum generating mechanism (not shown) to place the first chamber C1 to be in a vacuum state and a pressure sensing sensor 71 (refer to FIG. 2) to measure the pressure in the first chamber C1, which will be described later. Figure 8 However, the vacuum generating mechanism and the pressure sensing sensor 71 can also be provided on the front cover 12 and do not necessarily have to be provided on the rear cover 13.

[0077] The housing body 11 can be formed in a cylindrical shape having an open front surface and a rear surface. The front cover 12 can be formed in a disc shape to cover the open front surface of the housing body 11. The rear cover 13 can be formed in a disc shape to cover the open rear surface of the housing body 11. The front cover 12 can have a smaller diameter than the rear cover 13. The rear cover 13 can have a larger diameter than the front cover 12. The front cover 12 can be formed to have substantially the same diameter as the outer diameter of the housing body 11. The rear cover 13 can be formed to have a larger diameter than the outer diameter of the housing body 11, such that the edge of the rear cover 13 can be provided to protrude outward of the housing body 11. The edge of the rear cover 13 can be provided to protrude outward of the housing body 11 more than the plurality of first crimped portions 11A.

[0078] The finger guard 40 can be formed in a cylindrical shape having an open rear surface. In the heat dissipation housing 10, the front portion other than the rear cover 13 can be inserted into the inside of the finger guard 40 through the open rear surface of the finger guard 40.

[0079] In the front surface of the rear cover 13, a cylindrical insertion portion 13A can be provided to protrude forward. The insertion portion 13A can be integrally formed on the front surface of the rear cover 13, or can be formed separately from the rear cover 13 and fastened to the rear cover 13 by a plurality of fastening members such as bolts.

[0080] The insertion portion 13A can be inserted into the inside of the housing body 11. The inside space of the insertion portion 13A can be the second chamber C2 described later, and the outside space of the insertion portion 13A in the inside space of the housing body 11 can be the first chamber C1. The shield cover 20 can cover and be combined with the open front end of the insertion portion 13A inserted into the inside of the housing body 11.

[0081] The shield cover 20 can be provided in the inside of the heat dissipation housing 10, and can divide the inside space of the heat dissipation housing 10 into the first chamber C1 and the second chamber C2.

[0082] The first chamber C1 can form the front portion of the inside space of the heat dissipation housing 10, and the second chamber C2 can form the rear portion of the inside space of the heat dissipation housing 10. Also, the second chamber C2 can be provided at a position more inward in the radial direction of the heat dissipation housing 10 than the first chamber C1. The positions of the first chamber C1 and the second chamber C2 are not limited thereto, and the first chamber C1 and the second chamber C2 can be provided in the front-rear direction.

[0083] The shield cover 20 can be divided into the first chamber C1 and the second chamber C2 to be independent spaces from each other. The first chamber C1 and the second chamber C2 can be sealed from each other by the shield cover 20.

[0084] The first chamber C1 can be a space in a vacuum state. That is, the first chamber C1 can be in a vacuum state by the vacuum generating mechanism. The first chamber C1 can be a sealed space.

[0085] The second chamber C2 can be a space in a non-vacuum state. The second chamber C2 can be a sealed space.

[0086] A refrigerant can be filled in the first chamber C1. The refrigerant filled in the first chamber C1 can be vaporized and evaporated by heat generated from the heat generating elements provided on the printed circuit substrate 30 to dissipate the heat.

[0087] The printed circuit substrate 30 can be provided inside the shield cover 20. The shield cover 20 can surround the printed circuit substrate 30 so that the refrigerant filled in the first chamber C1 does not flow into the printed circuit substrate 30.

[0088] The shield cover 20 is composed of two parts which are combined with each other, and after the printed circuit substrate 30 is mounted on the first part, the second part can be combined to the first part while covering the printed circuit substrate 30.

[0089] The shield cover 20 is formed of a heat conductive material, and thus can transfer heat generated from the heat generating elements provided on the printed circuit substrate 30 to the refrigerant filled in the first chamber C1. The shield cover 20 can be made of a metal material, but can be formed of an aluminum material having excellent heat conductivity, or can be formed of a stainless steel material.

[0090] The heat generating elements can be mounted on the printed circuit substrate 30. The heat generating elements can be provided on both surfaces of the printed circuit substrate 30, respectively. That is, the heat generating elements can be provided on a surface of the printed circuit substrate 30 facing the first chamber C1 and a surface of the printed circuit substrate 30 facing the second chamber C2, respectively. However, the heat generating elements do not necessarily have to be provided on both surfaces of the printed circuit substrate 30, but can be provided on at least one of the two surfaces of the printed circuit substrate 30.

[0091] The heat generating elements can include Digital elements, RF elements, and Filter elements.

[0092] The Digital elements generate heat from a front surface, and thus are preferably provided on a surface of the printed circuit substrate 30 facing the first chamber C1.

[0093] The RF elements generate heat from a back surface, and thus are preferably provided on a surface of the printed circuit substrate 30 facing the second chamber C2.

[0094] Also, the Filter elements have a reduced performance in a vacuum state, and thus are preferably provided on a surface of the printed circuit substrate 30 facing the second chamber C2.

[0095] Of course, similar to the filter element, a separate printed circuit board with a heating element whose performance degrades in a vacuum state can also be disposed in the second chamber C2.

[0096] On the other hand, the heat dissipation device for electronic components in embodiments of the present invention may further include a spraying section for spraying refrigerant into a first chamber C1 to fill the first chamber C1 with the refrigerant and a refrigerant supplying section for supplying the refrigerant to the spraying section.

[0097] The spray section can be formed as a tube disposed in the first chamber C1. In this case, a plurality of spray nozzles spaced apart along the length can be formed in the spray section. That is, the spray section can be a tube with a predetermined length and can be formed as having a plurality of nozzles 74 spaced apart along the length (see reference). Figure 8 ).

[0098] The refrigerant supply unit may include a refrigerant pump 73 (see reference). Figure 8 The refrigerant pump 73 can pass through the delivery pipe 75 (see reference). Figure 8 The refrigerant pump 73 is connected to the nozzle 74. The refrigerant pump 73 can pressurize the refrigerant to the delivery pipe 75, and the delivery pipe 75 can connect the refrigerant pump 73 and the nozzle 74 to each other. Therefore, after the refrigerant is pressed to the delivery pipe 75 by the operation of the refrigerant pump 73 moves to the nozzle 74, it can be injected into the first chamber C1 through the plurality of injection ports formed in the nozzle 74.

[0099] The shield 20 can use the sensible heat transferred from the heating element to the shield 20 and the latent heat transferred from the shield 20 to the first chamber C1 to evaporate the refrigerant.

[0100] The refrigerant in the first chamber C1 can be vaporized by the latent heat. The vaporized refrigerant can be condensed by exchanging heat with the outside air through the plurality of first pleats 11A protruding from the outer side of the heat dissipation shell 10.

[0101] The refrigerant supply unit can supply refrigerant that has condensed in the first chamber C1 to the injection unit. For this purpose, a refrigerant pump 73, a delivery pipe 75, and a nozzle 74 are provided in the first chamber C1, such that the refrigerant pump 73 can pressurize the refrigerant that has condensed in the first chamber C1 to the delivery pipe 75, and the refrigerant that has been pressurized to the delivery pipe 75 moves to the nozzle 74 and can then be injected into the first chamber C1 through the plurality of injection ports.

[0102] As described above, the refrigerant in the first chamber C1 can be repeatedly vaporized and condensed, and can be circulated in the first chamber C1 by the refrigerant pump 73 and the nozzle 74.

[0103] On the other hand, a power supply unit 50 can be provided in the first chamber C1. The power supply unit 50 is a structure for supplying power to the electronic elements included in the electronic element heat dissipation device of the embodiment of the present application, and can supply power to the printed circuit board 30.

[0104] The power supply unit 50 can include a substrate and a heating element. Thus, heat can also be generated in the power supply unit 50, and the refrigerant in the first chamber C1 can be vaporized and evaporated by the heat generated in the power supply unit 50, and the heat of the power supply unit 50 can also be dissipated.

[0105] In order to prevent the refrigerant filled in the first chamber C1 from flowing into the power supply unit 50 to cause a short circuit, it is preferable that the power supply unit 50 be coated with a heat dissipation waterproof coating.

[0106] A plurality of external air inlet and outlet holes 41 for the inlet and outlet of external air can be formed in the finger guard 40. Through the plurality of external air inlet and outlet holes 41, external air moves to the outside of the heat dissipation case 10, and thus the heat dissipation case 10 can exchange heat with the external air.

[0107] The finger guard 40 can be composed of a front surface and a circumferential surface. A plurality of external air inlet and outlet holes 41 can be formed in the front surface of the finger guard 40, and a plurality of external air inlet and outlet holes 41 can also be formed in the circumferential surface of the finger guard 40.

[0108] The finger guard 40 can be formed in a lattice structure having a plurality of external air inlet and outlet holes 41, but is not necessarily limited to the lattice structure to have a plurality of external air inlet and outlet holes 41.

[0109] The finger guard 40 can be formed in a cylindrical shape with the rear surface open. However, the shape of the finger guard 40 is not necessarily limited to the cylindrical shape, and can be formed in a shape corresponding to the shape of the heat dissipation case 10.

[0110] The heat dissipation case 10 can be inserted into the inside of the finger guard 40 through the open rear surface of the finger guard 40. When the heat dissipation case 10 is in a state of being inserted into the inside of the finger guard 40, the rear end of the finger guard 40 can be mounted on the front surface of the rear cover 13 of the heat dissipation case 10.

[0111] Figure 8 A control block diagram of the electronic element heat dissipation device of the first embodiment of the present application is shown.

[0112] Referring to Figure 8 , the electronic element heat dissipation device of the first embodiment of the present application can further include a controller 72.

[0113] The controller 72 can control the refrigerant pump 73 according to the pressure of the first chamber C1 of the pressure sensing sensor 71.

[0114] The pressure sensing sensor 71 can input the pressure of the first chamber C1 sensed by the pressure sensing sensor 71 to the controller 72, and the controller 72 can control the refrigerant pump 73 by using the pressure of the first chamber C1 input from the pressure sensing sensor 71.

[0115] For example, the controller 72 operates the refrigerant pump 73 so that the nozzle 74 can inject the refrigerant into the first chamber C1 when the pressure of the first chamber C1 sensed by the pressure sensing sensor 71 is below the first set pressure.

[0116] Also, the controller 72 stops the refrigerant pump 73 so that the nozzle 74 can not inject the refrigerant into the first chamber C1 when the pressure of the first chamber C1 sensed by the pressure sensing sensor 71 is above the second set pressure.

[0117] The second set pressure can be a pressure higher than the first set pressure. The second set pressure can be a safe pressure at which the heat dissipation case 10 does not explode. That is, if the pressure in the first chamber C1 is above the second set pressure, the heat dissipation case 10 can explode, and thus the controller 72 controls the refrigerant pump 73 to stop when the pressure of the first chamber C1 input from the pressure sensing sensor 71 is above the second set pressure, so that the pressure in the first chamber C1 does not increase any more.

[0118] Figure 9 FIG. 6 is a side cross-sectional view of a heat dissipation device of an electronic component according to a second embodiment of the present application. The same reference numerals are used for the same components as those of the first embodiment described above, and detailed descriptions thereof will be omitted, and only the differences will be described.

[0119] Referring to Figure 9 It can be seen that the heat dissipation device of the electronic component according to the second embodiment of the present application is different from the first embodiment shown in FIG. 1. Figure 7

[0120] That is, in the first embodiment described above, the shield cover 20 directly divides the first chamber C1 and the second chamber C2, but in the second embodiment, the shield plate 60 is provided inside the heat dissipation case 10.

[0121] The shield plate 60 can be sealed by covering the open front end of the insertion portion 13A inserted into the inside of the case body 11. In this case, the shield cover 20 can be provided in the first chamber C1 by being spaced forward from the shield plate 60.

[0122] ​Also, in the above-described first embodiment, a plurality of first corrugated portions 11A that expand or collapse according to the pressure of the refrigerant in the first chamber C1 are formed on the outer side surface of the housing body 11, but in the present second embodiment, a plurality of fins 11B are formed on the outer side surface of the housing body 11 in place of the plurality of first corrugated portions 11A.

[0123] The cable connection of the printed circuit board provided in the second chamber C2 is more advantageous in the first embodiment than in the second embodiment, but depending on the manner of the cable connection of the printed circuit board provided in the second chamber C2, either the first embodiment or the second embodiment can be implemented.

[0124] Figure 10 FIG. 1 is a perspective view of a heat dissipation device of an electronic component according to a first embodiment of the present application, Figure 11 FIG. 2 is a side cross-sectional view of the heat dissipation device of the electronic component according to the first embodiment of the present application, Figure 10 FIG. 3 is a side cross-sectional view of the heat dissipation device of the electronic component according to the first embodiment of the present application, Figure 12 FIG. 4 is a perspective view of a substrate mount and a printed circuit board shown in FIG. 1, Figure 11 FIG. 5 is a perspective view of the substrate mount and the printed circuit board shown in FIG. 1, wherein the same reference numerals are assigned to the same constituent elements as those of the first embodiment, and detailed descriptions thereof are omitted, and only the differences are described. Figure 13 Figure 11 Referring to , the heat dissipation device of the electronic component according to the first embodiment of the present application is different from the first and second embodiments described above.

[0125] Figures 10 to 13 That is, in the first and second embodiments described above, the printed circuit board 30 is installed in the shield cover 20 to prevent the penetration of the refrigerant, but in the present third embodiment, the shield cover 20 is not provided, and instead, a heat dissipation / waterproof coating layer is applied to the printed circuit board 30.

[0126] Therefore, in the first and second embodiments described above, the shield cover 20 divides the internal space of the heat dissipation housing 10 into the first chamber C1 and the second chamber C2, but in the present third embodiment, the printed circuit board 30 divides the internal space of the heat dissipation housing 10 into the first chamber C1 and the second chamber C2.

[0127] Also, in the present third embodiment, at least one flat portion can be formed on the outer side surface of the insertion portion 13A. The flat portion can be formed flat to be a portion for mounting the printed circuit board.

[0128] Also, in the present third embodiment, at least one flat portion can be formed on the outer side surface of the insertion portion 13A. The flat portion can be formed flat to be a portion for mounting the printed circuit board.

[0129] ​In the third embodiment of the present application, the insertion portion 13A is rectangular in shape, and therefore four flat portions are formed, and a printed circuit board 30 is attached to each of the four flat portions. However, the insertion portion 13A is not necessarily limited to a rectangular shape, and can be polygonal, including a triangular shape. Further, the insertion portion 13A can be cylindrical with one flat portion formed on one side.

[0130] The first chamber C1 can be an outer side space of the flat portions in the internal space of the housing body 11. That is, the first chamber C1 can be a space between the outer side surfaces of the flat portions and the inner side surface of the housing body 11. Therefore, the number of the first chambers C1 can be equal to the number of the flat portions.

[0131] The second chamber C2 can be an internal space of the insertion portion 13A. The front end of the insertion portion 13A inserted into the housing body 11 is in contact with the rear surface of the front cover 12, and therefore the second chamber C2 can be formed as a sealed space.

[0132] In the heat dissipation device for an electronic component according to the embodiment of the present application configured as described above, the refrigerant filled in the first chamber C1 is vaporized and evaporated by the heat generated from the heat generating element provided on the printed circuit board 30.

[0133] The refrigerant evaporated in the first chamber C1 can be condensed by heat exchange with the outside air through the plurality of first corrugated portions 11A and the plurality of second corrugated portions 12A, or by heat exchange with the outside air through the fins 11B.

[0134] The refrigerant condensed in the first chamber C1 can be moved to the refrigerant pump 73, which can supply the condensed refrigerant to the nozzle 74, which can re-inject the refrigerant into the first chamber C1.

[0135] By repeating this process, the heat generated from the heat generating element can be quickly dissipated.

[0136] As described above, in the heat dissipation device for an electronic component according to the embodiments of the present application, in the case of the first and second embodiments having the shield 20, the inside of the shield 20 is provided with the printed circuit board 30 having the heat generating element, and the heat generated from the heat generating element is transferred to the shield 20. The heat transferred to the shield 20 is exchanged with the refrigerant of the first chamber C1, and the refrigerant is evaporated and dissipated.

[0137] Further, in the heat dissipation device for an electronic component according to the third embodiment not having the shield 20 and the printed circuit board 30 being coated to prevent penetration of the refrigerant, the refrigerant of the first chamber C1 is exchanged with the heat generated from the heat generating element, and the refrigerant is evaporated and dissipated.

[0138] As described above, the heat dissipating device for an electronic component of the embodiment of the present application can rapidly dissipate the heat generated by the heat generating component through the phase change of the refrigerant, and does not need to provide a large number of mechanical air-cooled heat dissipating structures, thus reducing the size.

[0139] It is to be understood that the present application can be carried out by other specific forms without changing the technical spirit or essential characteristics thereof. Therefore, it is to be understood that the embodiments described above are illustrative in all aspects and are not restrictive. The scope of the present application is indicated by the following patent claim scope, not by the above detailed description, and all modifications or variations derived from the meaning and scope of the patent claim scope and its equivalents are to be included in the scope of the present application.

[0140] Industrial applicability

[0141] The present application provides a heat dissipating device for an electronic component which minimizes the size while improving the heat dissipating performance.

Claims

1. A heat dissipating device for electronic components, wherein, including: a heat sink housing formed with an internal space; a shield cover formed of a heat conductive material, disposed in the heat sink housing, and dividing the internal space into a first chamber as a vacuum space filled with a refrigerant and a second chamber as a non-vacuum space; and a printed circuit board disposed in the shield cover and provided with a heat generating element, the shield cover evaporating the refrigerant using sensible heat transferred from the heat generating element to the shield cover and latent heat transferred from the shield cover to the first chamber; the heat sink housing including a housing body and a rear cover covering a rear surface of an opening of the housing body, a front surface of the rear cover being formed with an insertion portion protruding forward, the first chamber being an outside space of the insertion portion in the internal space of the housing body, and the second chamber being an inside space of the insertion portion.

2. The electronic component heat dissipating apparatus according to claim 1, wherein The heat sink housing is in a bellows shape.

3. The electronic component heat dissipating apparatus according to claim 1, wherein A heat sink fin is formed protruding on an outside surface of the heat sink housing.

4. The electronic component heat dissipating apparatus according to claim 1, wherein The heat dissipating device for electronic elements further includes a power supply unit disposed in the first chamber and supplying power to the printed circuit board.

5. The electronic component heat dissipating apparatus according to claim 1, wherein The heat dissipating device for electronic elements further includes a finger guard member surrounding an outside of the heat sink housing and formed with a plurality of external air inlet and outlet holes.

6. The electronic component heat dissipating apparatus according to claim 1, wherein The heat dissipating device for electronic elements further includes: a nozzle injecting the refrigerant into the first chamber; and a refrigerant pump supplying refrigerant to the nozzle.

7. The electronic component heat dissipating device according to claim 6, wherein The heat dissipating device for electronic elements further includes: a pressure sensing sensor for sensing a pressure of the first chamber; and a controller causing the refrigerant pump to operate when the pressure of the first chamber sensed by the pressure sensing sensor is below a first set pressure and causing the refrigerant pump to stop when the pressure of the first chamber sensed by the pressure sensing sensor is above a second set pressure higher than the first set pressure.

8. The electronic component heat dissipating apparatus according to claim 6, wherein The refrigerant pump supplies refrigerant condensed in the first chamber to the nozzle.

9. The heat dissipating device for electronic elements according to claim 1, wherein the insertion portion is a cylindrical insertion portion, the shield cover covers an open front end of the insertion portion inserted into the housing body.

10. The heat dissipating device for electronic elements according to claim 1, wherein the heat sink housing includes a housing body and a rear cover covering a rear surface of an opening of the housing body, a front surface of the rear cover is formed with a cylindrical insertion portion protruding forward, the heat dissipating device for electronic elements further includes a shield plate covering an open front end of the insertion portion inserted into the housing body, the first chamber is an outside space of the insertion portion in the internal space of the housing body, the second chamber is an inside space of the insertion portion, the shield cover is disposed in the first chamber spaced apart from the shield plate.

11. A heat dissipating device for electronic components, wherein, including: a heat sink housing formed with an internal space; and a coated printed circuit board disposed in the internal space of the heat sink housing for dividing the internal space into a first chamber as a vacuum space filled with a refrigerant and a second chamber as a non-vacuum space and provided with a heat generating element, the refrigerant being evaporated by heat generated in the heat generating element; The heat dissipating housing includes a housing body and a back cover covering a rear surface of an opening of the housing body, A front surface of the back cover is formed with an insertion portion protruding forward, At least one flat portion in which the printed circuit board is installed is formed on an outer side surface of the insertion portion, The first chamber is an outer side space of the flat portion in an inner space of the housing body, The second chamber is an inner space of the insertion portion.

12. The electronic component heat dissipating apparatus according to claim 11, wherein The heat dissipating housing is in a bellows shape.

13. The electronic component heat dissipating apparatus according to claim 11, wherein A heat sink is formed protruding on an outer side surface of the heat dissipating housing.

14. The electronic component heat dissipating apparatus according to claim 11, wherein The heat dissipating device of the electronic element further includes a power supply unit provided in the first chamber and supplying power to the printed circuit board.

15. The electronic component heat dissipating apparatus according to claim 11, wherein, The heat dissipating device of the electronic element further includes a finger guard member surrounding an outer side of the heat dissipating housing and formed with a plurality of holes.

16. The electronic component heat dissipating apparatus according to claim 11, wherein The heat dissipating device of the electronic element further includes: a nozzle injecting the refrigerant into the first chamber; and a refrigerant pump supplying the refrigerant to the nozzle.

17. The electronic component heat dissipating device according to claim 16, wherein The heat dissipating device of the electronic element further includes: a pressure sensing sensor sensing a pressure of the first chamber; and a controller operating the refrigerant pump when the pressure sensing sensor senses that the pressure of the first chamber is below a first set pressure and stopping the refrigerant pump when the pressure sensing sensor senses that the pressure of the first chamber is above a second set pressure higher than the first set pressure.

18. The electronic component heat dissipating apparatus according to claim 16, wherein, The refrigerant pump supplies the refrigerant condensed in the first chamber to the nozzle.

19. The heat dissipating device of the electronic element according to claim 11, wherein the insertion portion is a cylindrical insertion portion.

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