Manufacturing method of magnetic attraction sandwich layer and manufacturing method of electronic device protective shell

Abstract

The application discloses a manufacturing method of a magnetic attraction interlayer and a manufacturing method of an electronic equipment protective shell. The magnetic attraction interlayer comprises an interlayer base material and a magnetic attraction piece. The magnetic attraction interlayer is provided with a through mounting hole. The magnetic attraction piece is fixedly embedded in the mounting hole. The manufacturing method of the magnetic attraction interlayer comprises the following steps: the interlayer base material provided with reinforced fiber yarn is adopted, and the through mounting hole is formed on the interlayer base material; the assembly obtained by embedding the magnetic attraction piece into the mounting hole on the interlayer base material is clamped in a shaping die; then, the assembly and the shaping die are loaded into a flexible container, the flexible container is sealed after being exhausted; then, the flexible container and the content are loaded into a hot-pressing tank for hot-pressing treatment; finally, the magnetic attraction interlayer semi-finished product is cut after the hot-pressing treatment is completed. The manufacturing method of the magnetic attraction interlayer adopts the interlayer base material provided with the reinforced fiber yarn, and the semi-finished product before the hot-pressing treatment is clamped and exhausted. The magnetic attraction interlayer prepared in this way has small thickness, firm structure and is not easy to deform.

Description

Technical Field

[0001] This application relates to the technical field of manufacturing methods for layered electronic device protective cases, and in particular to a method for manufacturing a magnetic interlayer and a method for manufacturing an electronic device protective case. Background Technology

[0002] To facilitate secure attachment, an increasing number of electronic device cases incorporate magnetic components. For example, to allow wireless charging devices to charge phones through the case, the thin-walled structure of the case incorporates magnetic components. However, while the technology for electronic device cases has low barriers to entry, competition is becoming increasingly fierce. Even with embedded magnetic components, electronic device cases still need to be sufficiently thin and light, and have a high-quality appearance to gain an effective competitive advantage.

[0003] To facilitate the embedding of magnetic components, an existing method for manufacturing electronic device protective cases involves directly placing the magnetic component onto a sandwich substrate, then fixing the magnetic component to the substrate using hot melt adhesive. To eliminate the height difference between the magnetic component and the sandwich substrate, the front and back of the resulting assembly are finally heat-pressed to the inner and outer shells using an adhesive layer. However, this method suffers from difficulties in controlling the deformation of the sandwich substrate and the adhesive layer due to the height difference between the magnetic component and the sandwich substrate. Consequently, it results in a thicker electronic device protective case and can leave marks on the corresponding magnetic component area, thus reducing the aesthetic appeal.

[0004] To address the technical problem of large deformation in hot-pressing processes, Korean patent document KR102248166B1 discloses a method for manufacturing a protective case for electronic devices without hot-pressing. This method involves creating blind holes in a sandwich substrate, installing magnetic components into these holes, taking two cover plates and applying adhesive to their inner surfaces, and then placing the sandwich substrate with the magnetic components between the two cover plates. The adhesive applied to the cover plates can flow into the blind holes. Because the adhesive has a relatively low curing temperature, the deformation of the two cover plates is small. However, due to the overlap between the magnetic components and the bottom wall of the blind holes, the product manufactured in this way is still relatively thick. Furthermore, because the amount of adhesive flowing into the blind holes is difficult to control, embossing or debossing may still occur at the positions of the cover plates corresponding to the magnetic components, resulting in an unsatisfactory appearance. Summary of the Invention

[0005] The main purpose of this application is to propose a method for manufacturing a magnetic interlayer and a method for manufacturing a protective case for electronic devices, aiming to solve the technical problem that the magnetic interlayer products produced by the existing magnetic clamping manufacturing method are relatively thick, and when applied to the protective case of electronic devices, imprints corresponding to the magnetic components are easily generated.

[0006] To achieve the above objectives, this application proposes a method for manufacturing a magnetic sandwich layer, wherein the magnetic sandwich layer includes a sandwich substrate and a magnetic element, the magnetic sandwich layer has a through mounting hole, and the magnetic element is fixedly embedded in the mounting hole. The method for manufacturing the magnetic sandwich layer includes:

[0007] S100: A through mounting hole is formed in the sandwich substrate, wherein the sandwich substrate includes a hot melt matrix and reinforcing fiber yarn contained in the hot melt matrix;

[0008] S200: The first release film is applied to the upper surface of the lower forming mold;

[0009] S300: Lay the sandwich substrate obtained in step S100 onto the first release film;

[0010] S400: The magnetic chuck is embedded in the mounting hole of the sandwich substrate;

[0011] S500: The second release film is applied to the upper surface of the component obtained in step S400;

[0012] S600: The upper shaping mold is placed on the upper surface of the second release film;

[0013] S700: The components obtained in step S600, the upper shaping mold, the first release film, the second release film, and the lower shaping mold are placed together into the first flexible container;

[0014] S800: Perform air extraction on the first flexible container and seal the first flexible container after the air extraction is completed.

[0015] S900: Place the first flexible container and its contents into an autoclave, and pressurize the autoclave after sealing it, and heat the component obtained in step S800 for a preset time.

[0016] S1000: Stop heating until the component obtained in step S900 cools down to the preset temperature, then remove the magnetic interlayer semi-finished product between the first release film and the second release film;

[0017] S1100: Cut the semi-finished magnetic sandwich panel obtained in step S1000 to obtain a magnetic sandwich panel with a preset external shape and size.

[0018] Preferably, the reinforcing fiber yarn is glass fiber yarn, and the hot-melt matrix is ​​resin; the preset heating time for the component obtained in step S800 in step S900 specifically includes:

[0019] The component obtained in step S800 is heated from the initial temperature to 125 degrees Celsius and held for 15 minutes, and then heated to 135 degrees Celsius and held for 40 minutes.

[0020] Preferably, the pressurization process of the autoclave in step S900 specifically includes: pressurizing the autoclave so that the pressure inside the autoclave is within the range of [0.4, 0.8] MPa.

[0021] Preferably, both the lower and upper shaping molds are plate-shaped; the first flexible container is a metal foil bag, and in the empty and venting state, the first flexible container is sheet-shaped.

[0022] Preferably, the first flexible container is a foil bag.

[0023] Preferably, the sandwich substrate comprises a plurality of stacked sheets, each sheet comprising a hot-melt matrix and reinforcing fiber yarns contained within the hot-melt matrix; the mounting hole comprises an annular hole, and step S100 specifically includes:

[0024] Step S110: Stack multiple sheets together to form a sandwich substrate of a predetermined thickness;

[0025] Step S120: Punch through each of the sheets to form the mounting holes.

[0026] Preferably, the magnetic attracting element includes a main attracting element, the main attracting element includes multiple main magnetic attracting elements and an annular membrane connecting the multiple main magnetic attracting elements into a ring shape; S400 specifically includes:

[0027] The main adsorption element is embedded in the annular hole of the sandwich substrate.

[0028] This application also proposes a method for manufacturing a protective case for an electronic device, the protective case comprising an inner shell, an outer shell, and a magnetic interlayer sandwiched between the inner shell and the outer shell, the method comprising:

[0029] P100: A magnetic interlayer is stacked between the inner shell and the outer shell, wherein the magnetic interlayer is a magnetic interlayer manufactured using the manufacturing method of the magnetic interlayer described in any of the above embodiments;

[0030] P200: Load the components obtained in step P100 into the second flexible container;

[0031] P300: Perform air extraction on the second flexible container and seal the second flexible container after the air extraction is completed;

[0032] P400: Place the second flexible container and its contents into an autoclave, and pressurize the autoclave after sealing it, and heat the component obtained in step P300 for a preset time.

[0033] P500: Stop heating until the component obtained in step P400 cools down to the preset temperature, then remove the electronic device protective case from the second flexible container.

[0034] Preferably, both the inner shell and the outer shell are initially flat; the process further includes the following steps between step P100 and step P200:

[0035] P110: Place the component obtained in step P100 onto the drawing die;

[0036] P120: Place the deep drawing die at a preset position on the upper surface of the component obtained in step P100, wherein the size of the deep drawing die is adapted to the cavity size of the electronic device protective shell;

[0037] P130: Press the drawing mandrel into the inner cavity of the drawing die;

[0038] P140: Clamp the drawing mandrel and the component obtained in step P130 onto the clamping member, so that the component obtained in step P130 maintains a preset deformation state relative to the drawing mandrel;

[0039] Step P200 specifically includes:

[0040] The fastening member, the drawing mandrel, and the assembly obtained in step P130 are placed into the second flexible container.

[0041] Preferably, the fastening element is a silicone bag, the second flexible container is a foil bag, and in the empty and vented state, the second flexible container is sheet-like.

[0042] The manufacturing method of the magnetic sandwich layer in this application uses a sandwich substrate with reinforcing fiber yarns and through mounting holes in the sandwich substrate. The magnetic component is embedded in the mounting holes in the sandwich substrate, resulting in a component with a small initial thickness. The obtained component is clamped in a forming mold; then the component and the forming mold are placed into a flexible container, the air is evacuated, and the flexible container is sealed; then the flexible container and its contents are placed into an autoclave for hot pressing. In this way, the hot melt matrix contained in the sandwich substrate can fully flow and fill the gap between the mounting holes and the magnetic component. Because atmospheric pressure is transmitted through the forming mold (upper forming mold and lower forming mold), and because the reinforcing fiber yarn restricts the flow deformation of the hot melt matrix, the flatness of the magnetic sandwich semi-finished product can be ensured during the hot pressing process while ensuring the application of distributed force. Thus, after cooling, a sheet with a smooth surface and an integral sandwich substrate and magnetic component is obtained. The manufacturing method of the magnetic interlayer in this application uses an interlayer substrate with reinforcing fiber yarn and clamps and vents the semi-finished product before hot pressing. The resulting magnetic interlayer has a small thickness, a strong structure and is not easily deformed. When applied to the manufacturing of electronic device protective cases, it can produce lighter and thinner electronic device protective cases without magnetic component marks and with a higher appearance and texture. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is an exploded structural diagram of an electronic device protective case manufactured according to the manufacturing method of the electronic device protective case proposed in this application.

[0045] Figure 2 This is a schematic flowchart of the first embodiment of the manufacturing method of the magnetic interlayer of this application;

[0046] Figure 3 This is a schematic flowchart of the second embodiment of the manufacturing method of the magnetic interlayer of this application;

[0047] Figure 4 This is a schematic flowchart of the third embodiment of the manufacturing method of the magnetic interlayer of this application;

[0048] Figure 5 This is a detailed flowchart of step S100 in another embodiment of the manufacturing method of the magnetic interlayer of this application;

[0049] Figure 6 This is a schematic flowchart of the first embodiment of the method for manufacturing a protective case for electronic devices according to this application;

[0050] Figure 7 This is a schematic flowchart of the second embodiment of the method for manufacturing a protective case for electronic devices according to this application. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0052] To achieve the above objectives, this application proposes a method for manufacturing a magnetic interlayer, referring to... Figure 1 In one embodiment, the magnetic interlayer 30 includes an interlayer substrate 31 and a magnetic member 32. The magnetic interlayer has a through mounting hole 33, and the magnetic member 32 is fixedly embedded in the mounting hole 33. The interlayer substrate 31 serves to compensate for the height difference between the magnetic member 32 and the outer and inner shells. The thickness of the magnetic member matches the depth of the mounting hole. The mounting hole 33 is a through hole, which minimizes the thickness of the magnetic interlayer. The magnetic member is used to attach to electronic devices and can be a magnet or a common ferrous material.

[0053] Figure 2 This is a schematic flowchart of the first embodiment of the manufacturing method of the magnetic interlayer of this application, with reference to... Figure 2 In the first embodiment, the method for manufacturing the magnetic interlayer includes:

[0054] S100: A through mounting hole is provided in the sandwich substrate, the sandwich substrate including a hot melt matrix and reinforcing fiber yarn contained in the hot melt matrix;

[0055] Reinforcing fiber yarns can restrict the flow of the hot-melt matrix under heating conditions, thereby ensuring the dimensional stability of the base substrate thickness during processing. For example, the hot-melt matrix can be epoxy resin, and the reinforcing fiber yarns can be glass fiber or aramid fiber.

[0056] S200: The first release film is applied to the upper surface of the lower forming mold;

[0057] S300: Lay the sandwich substrate obtained in step S100 onto the first release film;

[0058] By setting a first release film, it is easy to separate the sandwich substrate from the shaping mold in subsequent processes.

[0059] S400: The magnetic chuck is embedded into the mounting hole of the sandwich substrate;

[0060] It is understandable that after the magnetic component is inserted into the mounting hole, there is a certain gap between the magnetic component and the inner wall of the mounting hole. However, in subsequent processes, the softened hot melt substrate can fill the gap, thereby achieving a fixed connection between the magnetic component and the interlayer substrate after cooling.

[0061] S500: The second release film is applied to the upper surface of the component obtained in step S400;

[0062] S600: Cover the upper surface of the second release film with the upper forming mold;

[0063] Similar to the setting of the first release film, the setting of the second release film facilitates the separation of the interlayer substrate from the shaping upper mold in subsequent processes. The shaping upper mold and the shaping lower mold can clamp the component obtained in step S400, thereby shaping the component during hot pressing and keeping it flat. It can be understood that the shaping upper mold and the shaping lower mold have an upper shaping plane and a lower shaping plane, respectively, and the shape of the shaping mold is not limited.

[0064] S700: The components obtained in step S600, the upper shaping mold, the first release film, the second release film, and the lower shaping mold are placed together into the first flexible container.

[0065] S800: The first flexible container is evacuated, and the first flexible container is sealed after the evacuation is completed.

[0066] By evacuating the first flexible container, the container can better enclose the contents through its own deformation. This allows air bubbles in the hot melt matrix to be eliminated during subsequent pressurization and heating processes, and prevents air from the first flexible container from mixing into the hot melt matrix.

[0067] S900: The first flexible container and its contents are placed into the autoclave, and after the autoclave is sealed, the autoclave is pressurized and inflated. The component obtained in step S800 is heated for a preset time.

[0068] In this step, the inflation and pressurization process can be performed before the heating process. However, in order to improve efficiency, the inflation and pressurization process and the heating process overlap in time, that is, the heating process is performed simultaneously after the inflation and pressurization process begins.

[0069] S1000: Stop heating until the component obtained in step S900 cools down to the preset temperature, then remove the magnetic interlayer semi-finished product between the first release film and the second release film;

[0070] After cooling, open the autoclave, take out the first flexible container containing the contents, then open the first flexible container and take out the contents, peel off the upper shaping mold, and tear off the first release film and the second release film to obtain the magnetic sandwich semi-finished product. At this time, the magnetic sandwich has been hardened, and the sandwich substrate and the magnetic component are integrated into a sheet with a smooth surface.

[0071] S1100: Cut the semi-finished magnetic sandwich panel obtained in step S1000 to obtain a magnetic sandwich panel with a preset shape and size.

[0072] In this embodiment, the external dimensions of the semi-finished magnetic interlayer are larger than the preset external dimensions, and the magnetic interlayer of the semi-finished product has extruded hot melt matrix residue during the hot pressing process, which can be used for the manufacture of electronic device protective cases by cutting.

[0073] The manufacturing method of the magnetic sandwich layer in this application uses a sandwich substrate with reinforcing fiber yarns and through mounting holes in the sandwich substrate. The magnetic component is embedded in the mounting holes in the sandwich substrate, resulting in a component with a small initial thickness. The obtained component is clamped in a forming mold; then the component and the forming mold are placed into a flexible container, the air is evacuated, and the flexible container is sealed; then the flexible container and its contents are placed into an autoclave for hot pressing. In this way, the hot melt matrix contained in the sandwich substrate can fully flow and fill the gap between the mounting holes and the magnetic component. Because atmospheric pressure is transmitted through the forming mold (upper forming mold and lower forming mold), and because the reinforcing fiber yarn restricts the flow deformation of the hot melt matrix, the flatness of the magnetic sandwich semi-finished product can be ensured during the hot pressing process while ensuring the application of distributed force. Thus, after cooling, a sheet with a smooth surface and an integral sandwich substrate and magnetic component is obtained. The manufacturing method of the magnetic interlayer in this application uses an interlayer substrate with reinforcing fiber yarn and clamps and vents the semi-finished product before hot pressing. The resulting magnetic interlayer has a small thickness, a strong structure and is not easily deformed. When applied to the manufacturing of electronic device protective cases, it can produce lighter and thinner electronic device protective cases without magnetic component marks and with a higher appearance and texture.

[0074] Furthermore, the reinforcing fiber yarn is glass fiber yarn, and the hot-melt matrix is ​​resin; Figure 3 This is a schematic flowchart of the second embodiment of the manufacturing method of the magnetic interlayer of this application, referring to... Figure 3 In the second embodiment, the preset heating time for the component obtained in step S800 in step S900 specifically includes:

[0075] The component obtained in step S800 is heated from the initial temperature to 125 degrees Celsius and held for 15 minutes, and then heated to 135 degrees Celsius and held for 40 minutes.

[0076] In this embodiment, glass fiber yarn is a common, readily available, and low-cost material, and its application in the sandwich substrate ensures sufficient strength. Resin, such as epoxy resin, is a commonly used electronic material. Compared to sandwich substrates made of pure resin, mixing glass fiber yarn with resin allows for uncontrolled resin flow during heating, thus ensuring the thickness stability of the sandwich substrate. During heating, the component is initially heated at a relatively low temperature to ensure uniform heating, and the molten resin slowly bonds or fills gaps, preventing significant deformation. The temperature is then increased to 135 degrees Celsius, allowing the resin to fully flow and achieve a smooth surface.

[0077] Furthermore, Figure 4 This is a flowchart illustrating the third embodiment of the manufacturing method of the magnetic interlayer of this application, with reference to... Figure 4 In the third embodiment, step S900, which involves pressurizing the autoclave, specifically includes pressurizing the autoclave so that the pressure inside the autoclave is within the range of [0.4, 0.8] MPa.

[0078] In this embodiment, by increasing the pressure inside the autoclave to a preferred range, the forming mold can receive a suitable distributed force, and the hot melt substrate can flow laterally sufficiently.

[0079] Furthermore, both the lower and upper shaping molds are plate-shaped; the first flexible container is a metal foil bag, and in the empty venting state, the first flexible container is sheet-shaped.

[0080] By arranging the two forming dies into plates, the stacking space required is minimized, and uniform pressure can be applied to the components between the lower and upper forming dies. Understandably, for mass production, a rack can be installed inside the autoclave, and multiple sets of forming dies can be placed on the rack. The metal foil bag is not only easy to deform but also heat-resistant and thermally conductive; after hot pressing, the first flexible container can be directly cut open to remove the contents, and the used metal foil bag can be recycled. Since the first flexible container is sheet-like in the vented state, it is less prone to wrinkling when combined with the plate-like lower and upper forming dies. Preferably, the first flexible container is a tin foil bag.

[0081] Furthermore, referring to Figure 1 In the illustrated embodiment, the sandwich substrate comprises a plurality of stacked sheets, each sheet comprising a hot-melt matrix and reinforcing fiber yarns contained within the hot-melt matrix; the mounting hole 32 includes an annular hole 321, see reference. Figure 4 In one embodiment, step S100 specifically includes:

[0082] Step S110: Stack multiple sheets together to form a sandwich substrate of a predetermined thickness;

[0083] Step S120: Punch through each sheet to form mounting holes.

[0084] In this embodiment, since the mounting holes include annular holes, separable "island"-shaped portions will be formed on the sandwich substrate inside the annular holes. If through holes are punched out on each sheet first, and then the sheets are stacked, not only must the through holes be aligned to form the mounting holes, but the separable island-shaped portions must also be aligned. By stacking multiple sheets together first and then punching out the mounting holes, the alignment work is eliminated, thus simplifying manufacturing.

[0085] Furthermore, referring to Figure 1 In the illustrated embodiment, the magnetic attracting member 33 includes a main attracting member 332, which includes a plurality of main magnetic attracting members and an annular membrane connecting the plurality of main magnetic attracting members into a ring shape; S400 specifically includes:

[0086] The main adsorption element is embedded in the annular hole of the sandwich substrate.

[0087] By connecting multiple main magnetic components with a ring-shaped film, the main magnetic component 332 can be accurately and quickly inserted into the mounting hole. The ring-shaped main magnetic component 332 can enclose and form a wireless charging area, making it convenient to charge electronic devices while using a protective case.

[0088] Reference Figure 1 In the illustrated embodiment, the magnetic suction member 33 further includes an auxiliary suction member 332 for assisting in positioning, and the mounting hole 32 further includes a positioning magnetic suction hole 322, with the auxiliary suction member 332 mounted in the positioning magnetic suction hole 322.

[0089] This application also proposes a method for manufacturing a protective case for electronic devices, referring to... Figure 1 In the illustrated embodiment, the electronic device protective case includes an inner shell 10, an outer shell 20, and a magnetic interlayer 30 sandwiched between the inner and outer shells. The electronic device can be a common mobile phone or tablet computer, or other portable electronic devices. By providing the magnetic interlayer 30, the electronic device protective case, along with the electronic device placed within it, can be conveniently mounted onto a stand or charging device. The inner shell 10 and outer shell 20 can be made of plastic or metal; this application does not limit the materials used. The inner shell 10 and outer shell 20 can be in their final form or in an intermediate form requiring further processing. In one embodiment of the final form of the inner shell 10 and outer shell 20, both the inner shell 10 and outer shell 20 include a bottom wall and a side wall located at the outer edge of the bottom wall, thereby forming a cavity open to one side.

[0090] Figure 6 This is a schematic flowchart of the first embodiment of the method for manufacturing a protective case for electronic devices according to this application. (Refer to...) Figure 6In the first embodiment, the method for manufacturing a protective case for an electronic device includes:

[0091] P100: A magnetic interlayer is stacked between the inner shell and the outer shell. The magnetic interlayer is manufactured using the manufacturing method of the magnetic interlayer as described in any of the above embodiments. The specific manufacturing process of the magnetic interlayer manufacturing method is as described in the above embodiments. Since the manufacturing method of this electronic device protective shell adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0092] P200: Load the components obtained in step P100 into the second flexible container;

[0093] P300: Perform evacuation treatment inside the second flexible container, and seal the second flexible container after the evacuation treatment is completed;

[0094] Similar to the first flexible container, when the second flexible container is evacuated, the deformation of the second flexible container can wrap the component, thereby eliminating air bubbles in the hot melt substrate during subsequent pressurization and heating processes, and preventing air from the second flexible container from mixing into the hot melt substrate.

[0095] P400: Place the second flexible container and its contents into the autoclave, and pressurize the autoclave after sealing it, and heat the component obtained in step P300 for a preset time.

[0096] In this step, the inflation and pressurization process can be performed before the heat treatment. However, to improve efficiency, the inflation and pressurization process overlaps with the heat treatment in time; that is, the heat treatment is performed simultaneously after the inflation and pressurization process begins. Through pressurization and heat treatment, the hot-melt matrix of the sandwich substrate softens again and can fully bond with the inner and outer shells respectively. In a specific embodiment, the materials of the inner and outer shells are similar to the material of the sandwich substrate; for example, both the inner and outer shells are made of aramid fiber.

[0097] P500: Stop heating until the component obtained in step P400 cools down to the preset temperature, then remove the electronic device protective case from the second flexible container.

[0098] In this step, after cooling, the inner shell, outer shell, and magnetic interlayer are fully bonded together to form a single structure.

[0099] In this embodiment, since the initial form of the magnetic interlayer is a sheet with a smooth surface, the magnetic interlayer can form a high-quality surface contact with the inner shell and the outer shell. Then, by sealing it in a second flexible container and evacuating the air, it can be ensured that the bonding strength is maintained during the hot pressing process without causing large deformation.

[0100] Furthermore, Figure 7 This is a flowchart illustrating the second embodiment of the method for manufacturing a protective case for electronic devices according to this application. (Refer to...) Figure 7 In the second embodiment, both the inner and outer shells are initially flat; the process between step P100 and step P200 further includes:

[0101] P110: Place the component obtained in step P100 onto the drawing die;

[0102] In this step, the component will cover the cavity of the drawing die. It is understood that, in order to facilitate drawing, the inner shell and the outer shell are made of deformable materials, such as aramid (Kevlar).

[0103] P120: Place the deep drawing core mold at a preset position on the upper surface of the component obtained in step P100. The size of the deep drawing core mold is adapted to the cavity size of the electronic device protective shell.

[0104] P130: Press the drawing mandrel into the inner cavity of the drawing die;

[0105] The deep drawing process is used to form a cavity for housing electronic devices.

[0106] P140: Clamp the drawing mandrel and the component obtained in step P130 onto the clamping member so that the component obtained in step P130 maintains a preset deformation state relative to the drawing mandrel.

[0107] In this step, the drawing mandrel is retained in the cavity of the component, so that it can be used with the clamping component to form the component, preventing the component from having excessive springback deformation after drawing.

[0108] Step P200 specifically includes:

[0109] The fastening element, the drawing mandrel, and the assembly obtained in step P130 are placed into the second flexible container.

[0110] Furthermore, the fastening element is a silicone bag, the second flexible container is a foil bag, and in the empty and vented state, the second flexible container is sheet-like.

[0111] In this embodiment, the silicone bag has a certain degree of heat resistance. Using the silicone bag as a fastening component is simple and convenient and suitable for subsequent hot pressing processes. It is understood that the silicone bag does not need to be sealed in order to facilitate venting. Similar to the first flexible container using a foil bag, the second flexible container also uses a foil bag, which has the effects of being fully deformable, heat-resistant, easy to disassemble and recyclable, and can ensure that pressure is applied evenly to the contents, including the components.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A method for manufacturing a magnetic sandwich layer, the magnetic sandwich layer comprising a sandwich substrate and a magnetic element, the magnetic sandwich layer having a through mounting hole, the magnetic element being fixedly embedded in the mounting hole, characterized in that, The manufacturing method of the magnetic interlayer includes: S100: A through mounting hole is formed in the sandwich substrate, wherein the sandwich substrate includes a hot melt matrix and reinforcing fiber yarn contained in the hot melt matrix; S200: The first release film is applied to the upper surface of the lower forming mold; S300: Lay the sandwich substrate obtained in step S100 onto the first release film; S400: The magnetic chuck is embedded in the mounting hole of the sandwich substrate; S500: The second release film is applied to the upper surface of the component obtained in step S400; S600: The upper shaping mold is placed on the upper surface of the second release film; S700: The components obtained in step S600, the upper shaping mold, the first release film, the second release film, and the lower shaping mold are placed together into the first flexible container; S800: Perform air extraction on the first flexible container and seal the first flexible container after the air extraction is completed. S900: Place the first flexible container and its contents into an autoclave, and after sealing the autoclave, pressurize it by filling it with gas. Heat the component obtained in step S800 from the initial temperature to 125 degrees Celsius and maintain it for 15 minutes, and then heat it to 135 degrees Celsius and maintain it for 40 minutes. S1000: Stop heating until the component obtained in step S900 cools down to the preset temperature, then remove the magnetic interlayer semi-finished product between the first release film and the second release film; S1100: Cut the semi-finished magnetic sandwich panel obtained in step S1000 to obtain a magnetic sandwich panel with a preset external shape and size.

2. The manufacturing method of the magnetic interlayer as described in claim 1, characterized in that, The reinforcing fiber yarn is glass fiber yarn, and the hot-melt matrix is ​​resin.

3. The method for manufacturing the magnetic interlayer as described in claim 1 or 2, characterized in that, The pressurization process of the autoclave in step S900 specifically includes: pressurizing the autoclave so that the pressure inside the autoclave is within the range of [0.4, 0.8] MPa.

4. The manufacturing method of the magnetic interlayer as described in claim 3, characterized in that, Both the lower and upper shaping molds are plate-shaped; the first flexible container is a metal foil bag, and in the empty and venting state, the first flexible container is sheet-shaped.

5. The method for manufacturing the magnetic interlayer as described in claim 4, characterized in that, The first flexible container is a foil bag.

6. The method for manufacturing the magnetic interlayer as described in claim 1, characterized in that, The sandwich substrate comprises a plurality of sheets stacked together, each sheet comprising a hot-melt matrix and reinforcing fiber yarn contained in the hot-melt matrix; The mounting hole includes an annular hole, and step S100 specifically includes: Step S110: Stack multiple sheets together to form a sandwich substrate of a predetermined thickness; Step S120: Punch through each of the sheets to form the mounting holes.

7. The method for manufacturing the magnetic interlayer as described in claim 6, characterized in that, The magnetic attraction component includes a main attraction component, which includes multiple main magnetic attraction components and an annular membrane connecting the multiple main magnetic attraction components into a ring shape. Specifically, S400 includes: The main adsorption element is embedded in the annular hole of the sandwich substrate.

8. A method for manufacturing a protective case for an electronic device, the protective case comprising an inner shell, an outer shell, and a magnetic interlayer sandwiched between the inner shell and the outer shell, characterized in that, The method for manufacturing the protective case for the electronic device includes: P100: A magnetic interlayer is stacked between the inner shell and the outer shell, wherein the magnetic interlayer is a magnetic interlayer manufactured using the manufacturing method of the magnetic interlayer as described in any one of claims 1-7. P200: Load the components obtained in step P100 into the second flexible container; P300: Perform air extraction on the second flexible container and seal the second flexible container after the air extraction is completed; P400: Place the second flexible container and its contents into an autoclave, and pressurize the autoclave after sealing it, and heat the component obtained in step P300 for a preset time. P500: Stop heating until the component obtained in step P400 cools down to the preset temperature, then remove the electronic device protective case from the second flexible container.

9. The method for manufacturing a protective case for electronic devices as described in claim 8, characterized in that, The inner shell and the outer shell are both initially flat; between step P100 and step P200, the following is also included: P110: Place the component obtained in step P100 onto the drawing die; P120: Place the deep drawing die at a preset position on the upper surface of the component obtained in step P100, wherein the size of the deep drawing die is adapted to the cavity size of the electronic device protective shell; P130: Press the drawing mandrel into the inner cavity of the drawing die; P140: Clamp the drawing mandrel and the component obtained in step P130 onto the clamping member, so that the component obtained in step P130 maintains a preset deformation state relative to the drawing mandrel; Step P200 specifically includes: The fastening member, the drawing mandrel, and the assembly obtained in step P130 are placed into the second flexible container.

10. The method for manufacturing a protective case for electronic devices as described in claim 9, characterized in that, The fastening element is a silicone bag, the second flexible container is a tin foil bag, and in the empty and vented state, the second flexible container is sheet-like.

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