Display panel and display device

Abstract

The present invention discloses a display panel and a display device. The display panel and the display device include: a first substrate, the first substrate includes a plurality of sub-pixel regions arranged in an array, each sub-pixel region includes: a main binding pad and a spare binding pad arranged on the first substrate; a micro-light emitting diode electrically connected to the main binding pad or the spare binding pad; the main binding pad and the spare binding pad are in a first symmetric manner with respect to a first symmetric reference object; the sub-pixel region is in a second symmetric manner with respect to a second symmetric reference object; the first symmetric manner and the second symmetric manner are the same; the distance between the vertical projection of the first symmetric reference object on the first substrate and the vertical projection of the second symmetric reference object on the first substrate is S1, and S1≤10μm. The problem that the sub-pixel cannot display when the micro-light emitting diode is damaged is solved; at the same time, even if the sub-pixel is repaired, the light emitting effect of the sub-pixel can still be guaranteed to be consistent with that before repair, thereby ensuring display uniformity.

Description

[0001] This application is a divisional application of application number 202011379140.6, application date November 30, 2020, and invention name “A display panel and display device”. Technical Field

[0002] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel and a display device. Background Art

[0003] At present, Micro Light Emitting Diode (Micro LED) display panels are increasingly attracting attention in the display market due to their advantages such as high brightness, low operating voltage, low power consumption, long life, impact resistance and stable performance.

[0004] Existing Micro-LED display panels include multiple sub-pixels arranged in an array, each sub-pixel includes a main binding pad and a backup binding pad. When the micro-light-emitting diode on the main binding pad is damaged, the micro-light-emitting diode set on the backup binding pad is enabled to ensure the display of the sub-pixel.

[0005] However, in the prior art, the relative positions of the main bonding pad and the spare bonding pad relative to the sub-pixel are different. Because the micro-LED emits light in different directions at different intensities, when the sub-pixel is repaired, the light output effect after the repair will be significantly different from that before the repair, which will undoubtedly affect the display uniformity of the display panel. Summary of the invention

[0006] The embodiments of the present invention provide a display panel and a display device. Even if the sub-pixel is repaired, the light emitting effect of the sub-pixel can still be guaranteed to be consistent with that before the repair, thereby ensuring display uniformity.

[0007] In a first aspect, an embodiment of the present invention provides a display panel, the display panel comprising:

[0008] A first substrate, wherein the first substrate includes a plurality of sub-pixel regions arranged in an array, each sub-pixel region including:

[0009] A main binding pad and a spare binding pad are arranged on the first substrate;

[0010] a micro light emitting diode electrically connected to the main bonding pad or the spare bonding pad;

[0011] The main binding pad and the backup binding pad are in a first symmetric manner with respect to a first symmetric reference object; the sub-pixel region is in a second symmetric manner with respect to a second symmetric reference object;

[0012] The first symmetric manner is the same as the second symmetric manner;

[0013] A distance between a vertical projection of the first symmetric reference object on the first substrate and a vertical projection of the second symmetric reference object on the first substrate is S1, and S1≤10 μm.

[0014] In a second aspect, an embodiment of the present invention further provides a display device, which includes: the display panel described in the first aspect.

[0015] The display panel and display device provided by the embodiments of the present invention set a main binding pad and a spare binding pad in each sub-pixel area. When the micro-light emitting diode on the main binding pad is damaged, the sub-pixel display is guaranteed by enabling the micro-light emitting diode on the spare binding pad, thereby solving the problem in the prior art that when the micro-light emitting diode is damaged, the sub-pixel where the micro-light emitting diode is located cannot be displayed. In addition, since the main binding pad and the spare binding pad are arranged in a first symmetrical manner with respect to the first symmetrical reference object, and the sub-pixel region where the main binding pad and the spare binding pad are located is arranged in a second symmetrical manner with respect to the second symmetrical reference object, the positions of the main binding pad and the spare binding pad relative to the sub-pixel are basically the same, that is, the positions of the micro-light emitting diode electrically connected to the main binding pad and the micro-light emitting diode electrically connected to the spare binding pad relative to the sub-pixel are basically the same, thereby avoiding the difference in the light emitting effect of the sub-pixel caused by the different positions of the main binding pad and the spare binding pad relative to the sub-pixel; and even if the subsequent film layer has an impact on the light emitted by the micro-light emitting diode, since the morphology of the subsequent film layer is symmetrically arranged, the impact of the subsequent film layer on the light emitted by the micro-light emitting diode electrically connected to the main binding pad and the impact of the light emitted by the micro-light emitting diode electrically connected to the spare binding pad are basically the same. In this way, even if the sub-pixel is repaired, the light emitting effect after the repair is basically the same as that before the repair, thereby avoiding the obvious difference in the light emitting effect of the sub-pixel after the repair and before the repair, thereby affecting the display uniformity of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0017] Figure 1 is a structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0018] Figure 2 yes Figure 1 Enlarged view of the dashed box in the middle;

[0019] Figure 3 is a schematic diagram of a partial film layer structure of a display panel provided by an embodiment of the present invention;

[0020] Figure 4 is a schematic diagram of a partial structure of a display panel provided by an embodiment of the present invention;

[0021] Figure 5 It is a structural schematic diagram of a single-electrode micro light-emitting diode provided by an embodiment of the present invention;

[0022] Figure 6 It is a schematic structural diagram of a dual-electrode micro light-emitting diode provided by an embodiment of the present invention;

[0023] Figure 7 is a schematic diagram of a partial film layer structure of another display panel provided by an embodiment of the present invention;

[0024] Figure 8 is a partial structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0025] Fig. 9 is a partial structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0026] Fig.10 is a partial structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0027] Fig.11 is a partial structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0028] Fig.12 is a partial structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0029] Fig.13 is a partial structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0030] Fig.14 is a schematic diagram of a partial film layer structure of another display panel provided by an embodiment of the present invention;

[0031] Fig.15 is a partial structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0032] Fig.16 It is a structural schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be fully described below in combination with the drawings in the embodiments of the present invention through specific implementation methods. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work fall within the protection scope of the present invention.

[0034] In view of the problems in the background technology, an embodiment of the present invention provides a display panel. Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention, Figure 2 yes Figure 1 The enlarged image of the dotted box in the figure is as follows: Figure 1 and Figure 2 As shown, the display panel 100 provided by the embodiment of the present invention includes: a first substrate 10, the first substrate 10 includes a plurality of sub-pixel areas BB arranged in an array, each sub-pixel area BB includes: a main binding pad 20 and a spare binding pad 30 arranged on the first substrate 10; a micro-light emitting diode (not shown in the figure) electrically connected to the main binding pad 20 or the spare binding pad 30; the main binding pad 20 and the spare binding pad 30 are in a first symmetric manner with respect to the first symmetric reference object 40; the sub-pixel area BB is in a second symmetric manner with respect to the second symmetric reference object 50; the first symmetric manner and the second symmetric manner are the same; the distance between the vertical projection of the first symmetric reference object 40 on the first substrate 10 and the vertical projection of the second symmetric reference object 50 on the first substrate 10 is S1, S1≤10μm. It should be noted that when it comes to the size of different products, S1 can be set by referring to the following formula, that is, S1 / Q1<50%; wherein Q1 is the size of the long side of the micro-light emitting diode.

[0035] Specifically, in the present embodiment, a main binding pad 20 is set in each sub-pixel area BB and a spare binding pad 30 is set. When the micro-LED on the main binding pad 20 is damaged, the micro-LED with the same light-emitting color set on the spare binding pad 30 is enabled, that is, the micro-LED set on the spare binding pad 30 replaces the damaged micro-LED on the main binding pad 20 to emit light, thereby realizing sub-pixel display. This solves the problem in the prior art that when the micro-LED in the sub-pixel area is damaged, the sub-pixel where the micro-LED is located cannot be displayed, thereby affecting the display effect.

[0036] Furthermore, considering that the intensity of light emitted by the micro-LED itself in different directions is different, and the position of the binding pad determines the position of the micro-LED, and the position of the micro-LED determines the light emitting effect of the sub-pixel where the micro-LED is located, when the main binding pad 20 and the spare binding pad 30 are set at different positions relative to the sub-pixel, the positions of the micro-LED electrically connected to the main binding pad 20 and the micro-LED electrically connected to the spare binding pad 30 relative to the sub-pixel will also be different, thus causing differences in the light emitting effect of the sub-pixel. In addition, considering that some film layers on the side of the micro-LED away from the first substrate 10 will have different morphologies at the edge and the center during the manufacturing process, for example, when the quantum dot structure is printed by inkjet printing technology, a coffee ring effect will appear in which the thickness of the quantum dot structure at the edge position of the sub-pixel area BB is larger and the thickness of the quantum dot structure in the middle is smaller; for example, when the color block structure is manufactured, a bull horn-shaped protrusion will be formed at the overlap between the color block structure and the shielding structure. Therefore, when the main binding pad 20 and the backup binding pad 30 are set at different positions relative to the sub-pixel, when the light emitted by the micro-LED electrically connected to the main binding pad 20 and the light emitted by the micro-LED electrically connected to the backup binding pad 30 pass through the subsequent film layer of the sub-pixel, the subsequent film layer has different effects on the light, which will also lead to different light emitting effects of the sub-pixel. Figure 3 is a schematic diagram of a partial film layer structure of a display panel provided by an embodiment of the present invention, such as Figure 3As shown, the main binding pad 20 is close to the center of the sub-pixel area BB, and the spare binding pad 30 is close to the edge of the sub-pixel area BB, that is, the main binding pad 20 and the spare binding pad 30 have a relatively large difference in position relative to the sub-pixel. When the color-resistance structure 60 is arranged on the side of the micro-LED 21 away from the first substrate 10, when the light emitted by the micro-LED 21 electrically connected to the main binding pad 20 and the light emitted by the micro-LED 21 electrically connected to the spare binding pad 30 pass through the color-resistance structure 60, due to the different morphologies of the edge and the center of the color-resistance structure 60, The color resist structure 60 has different effects on the light emitted by the micro-LED 21 electrically connected to the main binding pad 20 near the center of the sub-pixel area BB and the light emitted by the micro-LED 21 electrically connected to the spare binding pad 30 near the edge of the sub-pixel area BB, resulting in differences in the light emitting effects of the sub-pixels; that is, when the micro-LED 21 on the main binding pad 20 is damaged and the micro-LED 21 on the spare binding pad 30 is started to ensure that the sub-pixel emits light, there is a significant difference in the light emitting effect of the sub-pixel, thus affecting the display effect. Therefore, in this embodiment, the main binding pad 20 and the spare binding pad 30 are arranged in a first symmetrical manner with respect to the first symmetrical reference object 40, and the sub-pixel area BB is arranged in a second symmetrical manner with respect to the second symmetrical reference object 50, and the first symmetrical manner and the second symmetrical manner are the same, so that the positions of the main binding pad 20 and the spare binding pad 30 relative to the sub-pixel are basically the same, that is, the positions of the micro-LED electrically connected to the main binding pad 20 and the micro-LED electrically connected to the spare binding pad 30 relative to the sub-pixel are the same; and even if the subsequent film layer has an impact on the light emitted by the micro-LED, since the morphology of the subsequent film layer is symmetrically arranged, the impact of the subsequent film layer on the light emitted by the micro-LED electrically connected to the main binding pad 20 and the impact of the micro-LED electrically connected to the spare binding pad 30 are basically the same. In this way, even if the sub-pixel is repaired, the light emitting effect after the repair is basically the same as that before the repair, thereby avoiding obvious differences in the light emitting effect of the sub-pixel after the repair and before the repair, which affects the display uniformity of the display panel.

[0037] The first symmetry mode and the second symmetry mode may be axial symmetry, or they may be central symmetry, etc. When the first symmetry mode and the second symmetry mode are axial symmetry, the corresponding symmetry reference object is the symmetry axis; when the first symmetry mode and the second symmetry mode are central symmetry, the corresponding symmetry reference object is the symmetry center.

[0038] For example, see Figure 2, the first symmetry mode and the second symmetry mode are both axisymmetric; the first symmetry reference object 40 is the first symmetry axis, and the second symmetry reference object 50 is the second symmetry axis; the first symmetry axis and the second symmetry axis are parallel. That is, the main binding pad 20 and the spare binding pad 30 are axisymmetric about the first symmetry axis, and the sub-pixel area BB where the main binding pad 20 and the spare binding pad 30 are located is axisymmetric about the second symmetry axis, and the first symmetry axis and the second symmetry axis are parallel, and the distance between the vertical projection of the first symmetry axis on the first substrate 10 and the vertical projection of the second symmetry axis on the first substrate 10 is S1, S1≤10μm, for example, S1 is 0, that is, the first symmetry axis and the second symmetry axis coincide.

[0039] For example, Figure 4 is a partial structural diagram of a display panel provided by an embodiment of the present invention, such as Figure 4 As shown, both the first symmetry mode and the second symmetry mode are centrally symmetric; the first symmetry reference object 40 is the first symmetry center, and the second symmetry reference object 50 is the second symmetry center. That is, the main binding pad 20 and the spare binding pad 30 are centrally symmetric about the first symmetry center, and the sub-pixel area BB where the main binding pad 20 and the spare binding pad 30 are located is centrally symmetric about the second symmetry center, and the distance between the vertical projection of the first symmetry center on the first substrate 10 and the vertical projection of the second symmetry center on the first substrate 10 is S1, S1≤10μm, for example, S1 is 0, that is, the first symmetry center and the second symmetry center coincide.

[0040] Optionally, the first substrate 10 may be a rigid substrate or a flexible substrate. When the first substrate 10 is a rigid substrate, the material of the first substrate 10 may include, for example, glass, etc.; when the first substrate 10 is a flexible substrate, the material of the first substrate 10 may include, for example, at least one of polyetherimide (PEI), polyethylene terephthalate (PET), polyimide (PI) and polyethylene naphthalate (PEN), etc.

[0041] Optionally, the micro-LED may include a single-electrode micro-LED or a dual-electrode micro-LED. Those skilled in the art may make a selection based on actual conditions, and this embodiment does not make any specific limitation. Figure 5 is a schematic diagram of the structure of a single-electrode micro light-emitting diode provided by an embodiment of the present invention, such as Figure 5 As shown, when the micro-LED includes a single-electrode micro-LED, the single-electrode micro-LED includes a first electrode 61 , a first-type semiconductor layer 62 , an active layer 63 , a second-type semiconductor layer 64 and a second electrode 65 which are sequentially arranged away from the first substrate 10 . Figure 6 is a schematic diagram of the structure of a dual-electrode micro light-emitting diode provided by an embodiment of the present invention, such as Figure 6As shown, when the micro-light emitting diode includes a dual-electrode micro-light emitting diode, the dual-electrode micro-light emitting diode includes a first-type semiconductor layer 62, an active layer 63 and a second-type semiconductor layer 64 arranged in sequence away from the first substrate 10; it also includes a first electrode 61 and a second electrode 65; wherein the first electrode 61 is located on the side of the first-type semiconductor layer 62 away from the active layer 63; the second electrode 65 is located on the side of the second-type semiconductor layer 64 close to the active layer 63.

[0042] It can be understood that the display panel 100 in the embodiment of the present invention can be an active matrix light emitting diode display panel or a passive matrix light emitting diode display panel. When the display panel 100 is an active matrix light emitting diode display panel, each sub-pixel region BB in the display panel 100 is also provided with a driving circuit (not shown in the figure), which is electrically connected to the micro-light emitting diode and is used to drive the micro-light emitting diode in the corresponding sub-pixel region BB to emit light. Under the premise of being able to achieve the above functions, the embodiment of the present invention does not specifically limit the specific structure of the driving circuit; when the display panel 100 is a passive matrix light emitting diode display panel, each micro-light emitting diode can be driven by row, by column or individually, and the specific driving method is not specifically limited in the embodiment of the present invention.

[0043] Optional, Figure 7 is a schematic diagram of a partial film layer structure of another display panel provided by an embodiment of the present invention, such as Figure 7 As shown, the sub-pixel area BB also includes a first reflection unit 81 and a second reflection unit 82, the first reflection unit 81 is located on the side of the main binding pad 20 close to the first substrate 10, and the second reflection unit 82 is located on the side of the spare binding pad 30 close to the first substrate 10; the first reflection unit 81 and the second reflection unit 82 are in the seventh symmetry mode with respect to the seventh symmetry reference object 83; the first symmetry mode is the same as the seventh symmetry mode; the distance between the vertical projection of the seventh symmetry reference object 83 on the first substrate and the vertical projection of the first symmetry reference object on the first substrate is S6, S6≤10μm. It should be noted that when it comes to the size of different products, S6 can be set by referring to the following formula, that is, S6 / Q1<50%; wherein Q1 is the size of the long side of the micro light emitting diode 21. Figure 7Take S6 as 0, that is, the first reference object 40, the second reference object 50 and the seventh symmetric reference object 83 overlap as an example. When the light emitted by the micro-LED 21 of the main binding pad 20 is emitted, the first reflection unit 81 reflects the light emitted by it; when the micro-LED 21 electrically connected to the backup binding pad 30 is started, the second reflection unit 82 reflects the light emitted by it, that is, the light output efficiency of the sub-pixel is improved by the set reflection unit; in addition, since the reflection units are set under the main binding pad 20 and the backup binding pad 30, and the first reflection unit 81 and the second reflection unit 82 are in the seventh symmetric manner with respect to the seventh symmetric reference object 83; the first symmetric manner is the same as the seventh symmetric manner; the distance between the vertical projection of the seventh symmetric reference object 83 on the first substrate 10 and the vertical projection of the first symmetric reference object 40 on the first substrate 10 is small, which further makes the light output effect of the sub-pixel after repair and before repair basically the same. Optionally, when the display panel is an active matrix light emitting diode display panel, the driving circuit in the display panel, for example, includes multiple metal layers, and the first reflective layer and the second reflective layer, for example, can be arranged on the same layer as the metal layer on the side of the multiple metal layers closest to the main binding pad, thereby simplifying the process steps.

[0044] In summary, the display panel provided by the embodiment of the present invention sets a main binding pad and a spare binding pad in each sub-pixel area. When the micro-LED on the main binding pad is damaged, the sub-pixel display is guaranteed by starting the micro-LED on the spare binding pad, thereby solving the problem in the prior art that the sub-pixel where the micro-LED is located cannot be displayed when the micro-LED is damaged. In addition, since the main binding pad and the spare binding pad are arranged in a first symmetrical manner with respect to the first symmetrical reference object, and the sub-pixel area where the main binding pad and the spare binding pad are located is arranged in a second symmetrical manner with respect to the second symmetrical reference object, the positions of the main binding pad and the spare binding pad relative to the sub-pixel are basically the same, that is, the micro-LED electrically connected to the main binding pad is The positions of the photodiode and the micro-LED electrically connected to the spare binding pad relative to the sub-pixel are basically the same, which avoids the difference in the light emitting effect of the sub-pixel caused by the different positions of the main binding pad and the spare binding pad relative to the sub-pixel; and even if the subsequent film layer has an impact on the light emitted by the micro-LED, since the morphology of the subsequent film layer is symmetrically arranged, the impact of the subsequent film layer on the light emitted by the micro-LED electrically connected to the main binding pad and the impact of the micro-LED electrically connected to the spare binding pad are basically the same. In this way, even if the sub-pixel is repaired, the light emitting effect after the repair is basically the same as that before the repair, which avoids the obvious difference in the light emitting effect of the sub-pixel after the repair and before the repair, which affects the display uniformity of the display panel.

[0045] Optional, continue to see Figure 2The distance W1 between the main bonding pad 20 and the backup bonding pad 30 ranges from 10 μm to 50 μm. For example, the distance W1 between the main bonding pad 20 and the backup bonding pad 30 is 10 μm, 15 μm, 20 μm, 30 μm or 50 μm. The distance range between the main binding pad 20 and the spare binding pad 30 is set to 10μm-50μm. This will not cause the main binding pad 20 and the spare binding pad 30 to be located at the edge of the sub-pixel area BB due to the distance between the main binding pad 20 and the spare binding pad 30 being too large. In this way, no matter whether the micro-LED electrically connected to the main binding pad 20 emits light or the micro-LED on the spare binding pad 30 is enabled to emit light, the light output flux of the sub-pixel will be reduced and affect the light output effect. The distance between the main binding pad 20 and the spare binding pad 30 is not too small, which will cause a short circuit between the main binding pad 20 and the spare binding pad 30 and affect the display of the micro-LED. Therefore, in this embodiment, it is better to set the distance range between the main binding pad 20 and the spare binding pad 30 to 10μm-50μm, so as to ensure a better light output effect of the display panel 100 while not affecting the normal display of the micro-LED.

[0046] In addition, not only can the distance between the main binding pad and the backup binding pad be limited to prevent the main binding pad and the backup binding pad from short-circuiting, but also the position relationship between the main binding pad and the backup binding pad can be set to prevent the main binding pad and the backup binding pad from short-circuiting. Figure 8 is a partial structural diagram of another display panel provided by an embodiment of the present invention, such as Figure 8 As shown, the first symmetry mode and the second symmetry mode are both central symmetry; the first symmetry reference object is the first symmetry center, and the second symmetry reference object is the second symmetry center; wherein, Figure 8Take S1 as 0, that is, the first symmetry center and the second symmetry center coincide as an example. The main binding pad 20 includes a first main binding pad 21 and a second main binding pad 22; the spare binding pad 30 includes a first spare binding pad 31 and a second spare binding pad 32, that is, the type of the micro-light emitting diode electrically connected to the main binding pad 20 or the micro-light emitting diode electrically connected to the spare binding pad is a dual-electrode micro-light emitting diode. Among them, the projection of the first spare binding pad 31 on the line connecting the first main binding pad 21 and the second main binding pad 22 is located at the gap EE between the first main binding pad 21 and the second main binding pad 22; the projection of the second main binding pad 22 on the line connecting the first spare binding pad 31 and the second spare binding pad 32 is located at the gap DD between the first spare binding pad 31 and the second spare binding pad 32. That is, by staggering the first main binding pad 21 and the second main binding pad 22 in the main binding pad 20 and the first backup binding pad 31 and the second backup binding pad 32 in the backup binding pad 30, a short circuit between the first main binding pad 21 and the second main binding pad 22 and the first backup binding pad 31 and the second backup binding pad 32 can be avoided.

[0047] Optionally, when both the first symmetry mode and the second symmetry mode are axisymmetric; the first symmetry reference object is the first symmetry axis, and the second symmetry reference object is the second symmetry axis; when the first symmetry axis and the second symmetry axis are parallel, the second symmetry axes of each sub-pixel region are parallel. In order to illustrate this beneficial effect, the following content will be compared with the case where the second symmetry axes of each sub-pixel region in the display panel are partially parallel and partially perpendicular. Among them, take S1 as 0, that is, the first symmetry axis and the second symmetry axis coincide as an example.

[0048] For example, Fig. 9 is a partial structural diagram of another display panel provided by an embodiment of the present invention, such as Fig. 9As shown, the plurality of sub-pixel regions BB include a first sub-pixel region BB1, a second sub-pixel region BB2 and a third sub-pixel region BB3, wherein the second symmetric axis of the first sub-pixel region BB1 is parallel to the second symmetric axis of the second sub-pixel region BB2, and the second symmetric axis of the first sub-pixel region BB1 is perpendicular to the second symmetric axis of the third sub-pixel region BB3. Since the directions of the symmetric axes are different, it means that the placement directions of the micro-LEDs are different. Thus, when the micro-LEDs are transported to the corresponding sub-pixel regions BB, since the second symmetric axis of the first sub-pixel region BB1 is parallel to the second symmetric axis of the second sub-pixel region BB2, the micro-LEDs in the first sub-pixel region BB1 and the micro-LEDs in the second sub-pixel region BB2 can be transported at the same time, while the second symmetric axis of the first sub-pixel region BB1 is perpendicular to the second symmetric axis of the third sub-pixel region BB3, so the micro-LEDs in the third sub-pixel region BB3 cannot be transported using the same transport process. In addition, since the original process for transferring the micro-LEDs in the display panel is already relatively complicated, if the directions of the symmetric axes are different, the cost and efficiency of preparing the display panel will inevitably be further increased.

[0049] Fig.10 is a partial structural diagram of another display panel provided by an embodiment of the present invention, such as Fig.10 As shown, the multiple sub-pixel regions BB include a first sub-pixel region BB1, a second sub-pixel region BB2, and a third sub-pixel region BB3, wherein the second symmetric axis of the first sub-pixel region BB1, the second symmetric axis of the second sub-pixel region BB2, and the second symmetric axis of the third sub-pixel region BB3 are all parallel. Since the directions of the symmetric axes of the sub-pixel regions BB are the same, that is, regardless of whether the micro-LEDs are located at the main binding pad 20 or the spare binding pad 30, the placement directions of the micro-LEDs in the sub-pixel regions BB are the same, the same transfer process can be used to transfer the micro-LEDs corresponding to all sub-pixel regions BB, without increasing the process difficulty while ensuring that the light emitting effects of the sub-pixels after repair are basically consistent with those before repair.

[0050] Optionally, when both the first symmetry mode and the second symmetry mode are axisymmetric; the first symmetry reference object is the first symmetry axis, and the second symmetry reference object is the second symmetry axis; when the first symmetry axis and the second symmetry axis are parallel, the second symmetry axis of the sub-pixel region is parallel to the long side of the sub-pixel region. In order to illustrate the beneficial effect, the following content will be compared with the case where the second symmetry axis of each sub-pixel region in the display panel is parallel to the short side of the sub-pixel region. Among them, take S1 as 0, that is, the first symmetry axis and the second symmetry axis coincide as an example.

[0051] For example, Fig.11is a partial structural diagram of another display panel provided by an embodiment of the present invention, such as Fig.11 As shown, the second symmetry axis of the sub-pixel region BB is parallel to the short side of the sub-pixel region BB. At this time, if the micro-LED on the spare binding pad 30 is enabled to ensure the sub-pixel display, the distance L2 from the edge of the micro-LED to the edge of the area where the main binding pad 20 is located is long, and the light uniformity in the sub-pixel region BB covered by the light emitted by the micro-LED on the spare binding pad 30 is poor.

[0052] Fig.12 is a partial structural diagram of another display panel provided by an embodiment of the present invention, such as Fig.12 As shown, the second symmetry axis of the sub-pixel region BB is parallel to the long side of the sub-pixel region BB. At this time, if the micro-LED on the spare binding pad 30 is enabled to ensure the sub-pixel display, the distance L1 from the edge of the micro-LED to the edge of the area where the main binding pad 20 is located is shorter, then the difference in the light within the sub-pixel region BB covered by the light emitted by the micro-LED on the spare binding pad 30 is smaller, the sub-pixel light is more uniform, and the display effect of the display panel is improved.

[0053] Considering that other structures may be set in the sub-pixel area, the specific setting method of the structure may also affect the light emission effect of the sub-pixel. The following will be described in detail with reference to typical examples to ensure that even if the sub-pixel is repaired, the light emission effect after repair is basically the same as that before repair, wherein the first symmetry mode and the second symmetry mode are axially symmetric, and S1 is 0, that is, the first symmetry reference object and the second reference object coincide with each other.

[0054] Optional, Fig.13 is a partial structural diagram of another display panel provided by an embodiment of the present invention, such as Fig.13 As shown, the sub-pixel region BB includes a color resist structure 60, and the color resist structure 60 is in a third symmetric manner with respect to the third symmetric reference object 80; the first symmetric manner is the same as the third symmetric manner; the distance between the vertical projection of the third symmetric reference object 80 on the first substrate 10 and the vertical projection of the first symmetric reference object 40 on the first substrate 10 is S2, and S2≤10μm. It should be noted that when it comes to the size of different products, S2 can be set by referring to the following formula, that is, S2 / Q1<50%; wherein Q1 is the size of the long side of the micro-LED. Fig.13 Take S2 ​​as 0, that is, the first reference object 40, the second reference object 50 and the third reference object 80 coincide with each other as an example.

[0055] The color of the light allowed to pass through the color-resistance structure 60 is the same as the color of the light emitted by the sub-pixel corresponding to the color-resistance structure 60, and the color display of the display panel is realized by setting the color-resistance structure 60. As can be seen from the above content, when the color-resistance structure 60 is manufactured, a horn-shaped protrusion will be formed at the overlap between the color-resistance structure 60 and the shielding structure, resulting in different morphologies at the edge and the center of the color-resistance structure 60. In this embodiment, the color resist structure 60 is arranged in a third symmetrical manner with respect to the third symmetrical reference object 80; the first symmetrical manner is the same as the third symmetrical manner, and the distance between the vertical projection of the third symmetrical reference object 80 on the first substrate 10 and the vertical projection of the first symmetrical reference object 40 on the first substrate 10 is small. Even if the morphology of the edge and the center of the color resist structure 60 is different, the morphology is symmetrically arranged, so that the light emitted by the micro-light emitting diode electrically connected to the main binding pad 20 after passing through the color resist structure 60 is basically consistent with the light emitting effect of the micro-light emitting diode electrically connected to the spare binding pad 30 after passing through the color resist structure 60. That is to say, even if the sub-pixel is repaired, the light emitting effect after the repair is basically consistent with that before the repair, thereby ensuring the display uniformity of the display panel 100.

[0056] On the basis of the above scheme, optionally, the first substrate includes a red sub-pixel area, a green sub-pixel area, and a blue sub-pixel area; wherein, this embodiment does not limit the arrangement of the red sub-pixel area, the green sub-pixel area, and the blue sub-pixel area, for example, it can be a standard arrangement or a diamond arrangement, etc. Each sub-pixel area is provided with a main binding pad and a spare binding pad; a red light micro-light emitting diode is provided on the main binding pad or the spare binding pad of the red sub-pixel area; a green light micro-light emitting diode is provided on the main binding pad or the spare binding pad of the green sub-pixel area; a blue light micro-light emitting diode is provided on the main binding pad or the spare binding pad of the blue sub-pixel area. In this way, the color display of the display panel can be realized, and at the same time, the light emitting effect of the sub-pixel after and before the repair can be basically consistent, thereby ensuring the display uniformity of the display panel.

[0057] Optional, continue to see Fig.13 , the sub-pixel region BB further includes a shielding structure 70, and the shielding structure 70 is in a fourth symmetric manner with respect to the fourth symmetric reference object 90; the first symmetric manner and the fourth symmetric manner are the same; the distance between the vertical projection of the fourth symmetric reference object 90 on the first substrate and the vertical projection of the first symmetric reference object 40 on the first substrate is S3, S3≤10μm. It should be noted that when it comes to the size of different products, S3 can be set by referring to the following formula, that is, S3 / Q1<50%; wherein Q1 is the size of the long side of the micro-LED. Fig.13Take S3 being 0, that is, the first reference object 40 , the second reference object 50 , and the fourth reference object 90 coincide with each other as an example.

[0058] Among them, the shielding structure 70 can be composed of black material or light-absorbing material of other colors, so that most of the light irradiated thereon can be absorbed. The shielding structure 70 is set to block the light leakage between sub-pixels. In this embodiment, the shielding structure 70 is set to be in a fourth symmetric manner with respect to the fourth symmetric reference object 90; the first symmetric manner is the same as the fourth symmetric manner; the distance between the vertical projection of the fourth symmetric reference object 90 on the first substrate and the vertical projection of the first symmetric reference object on the first substrate is small, so that whether the micro-light emitting diode on the main binding pad 20 is enabled or the micro-light emitting diode on the spare binding pad 30 is enabled, the shielding effect of the shielding structure 70 on the light is consistent, and then the effect of the light emitted by the sub-pixel is consistent, ensuring the display uniformity of the display panel 100.

[0059] Optional, Fig.14 is a schematic diagram of a partial film layer structure of a display panel provided by an embodiment of the present invention, such as Fig.14 As shown, the sub-pixel region also includes a retaining wall structure 91, and the retaining wall structure 91 is in a fifth symmetric manner with respect to the fifth symmetric reference object 92; the first symmetric manner is the same as the fifth symmetric manner; the distance between the vertical projection of the fifth symmetric reference object 92 on the first substrate 10 and the vertical projection of the first symmetric reference object 40 on the first substrate 10 is S4, and S4≤10μm. It should be noted that when it comes to the size of different products, S4 can be set by referring to the following formula, that is, S4 / Q1<50%; wherein Q1 is the size of the long side of the micro-light-emitting diode. Fig.14 Take S4 as 0, that is, the first reference object 40 , the second reference object 50 , the fourth reference object 90 and the fifth symmetric reference object 92 coincide with each other as an example.

[0060] Among them, the retaining wall structure 91 is used to limit the position of the micro-LED, and at the same time, it can also prevent the crosstalk of light between adjacent sub-pixels. In this embodiment, the retaining wall structure 91 is set to be in a fourth symmetric manner with respect to the fourth symmetric reference object 90; the first symmetric manner is the same as the fourth symmetric manner; the distance between the vertical projection of the fourth symmetric reference object 90 on the first substrate 10 and the vertical projection of the first symmetric reference object 40 on the first substrate 10 is small, so that no matter whether the micro-LED on the main binding pad 20 or the micro-LED on the spare binding pad 30 is enabled, the shielding effect of the retaining wall structure 91 on the light is consistent, and then the effect of the light emitted by the sub-pixel is consistent, ensuring the display uniformity of the display panel 100.

[0061] Optional, continue to see Fig.14, at least part of the sub-pixel regions BB also include a quantum dot structure 93, and the quantum dot structure 93 is in a sixth symmetric manner with respect to the sixth symmetric reference object 94; the first symmetric manner and the sixth symmetric manner are the same; the distance between the vertical projection of the sixth symmetric reference object 94 on the first substrate 10 and the vertical projection of the first symmetric reference object 40 on the first substrate 10 is S5, and S5≤10μm. It should be noted that when it comes to the size of different products, S5 can be set by referring to the following formula, that is, S5 / Q1<50%; wherein Q1 is the size of the long side of the micro-LED. Fig.14 Take S5 being 0, that is, the first reference object 40 , the second reference object 50 , the fourth reference object 90 , the fifth symmetric reference object 92 , and the sixth symmetric reference object 94 coincide with each other as an example.

[0062] The quantum dot structure 93 is used to convert the color of the light emitted by the micro-LED, and the color of the light emitted after passing through the quantum dot structure 93 is the same as the color of the light emitted by the sub-pixel corresponding to the quantum dot structure 93. As can be seen from the above content, when the quantum dot structure 93 is printed by inkjet printing technology, for example, a coffee ring effect will occur in which the thickness of the quantum dot structure 93 at the edge of the sub-pixel area BB is larger and the thickness of the quantum dot structure 93 in the middle is smaller, resulting in different morphologies at the edge and the center of the quantum dot structure 93. In this embodiment, the quantum dot structure 93 is arranged in a sixth symmetrical manner with respect to the sixth symmetrical reference object 94; the first symmetrical manner is the same as the sixth symmetrical manner; the distance between the vertical projection of the sixth symmetrical reference object 94 on the first substrate 10 and the vertical projection of the first symmetrical reference object 40 on the first substrate 10 is small. Even if the morphology of the edge and the center of the quantum dot structure 93 is different, this morphology is symmetrically arranged, so whether it is enabling the micro-light emitting diode on the main binding pad 20 or enabling the micro-light emitting diode on the spare binding pad 30, after the conversion of the quantum dot structure 93, the effect of the light emitted by the sub-pixel is consistent, that is, even if the sub-pixel is repaired, the light emitting effect after the repair is basically the same as that before the repair, thereby ensuring the display uniformity of the display panel 100.

[0063] Optional, continue to see Fig.14 , at least part of the sub-pixel regions BB further include a first reflective layer 95 located above the quantum dot structure 93 (i.e., the side of the quantum dot structure 93 away from the first substrate 10) and a second reflective layer 96 located below the quantum dot structure 93 (i.e., the side of the quantum dot structure 93 close to the first substrate 10); that is, the first reflective layer 95 and the second reflective layer 96 are used to form a half-wavelength cavity, so as to increase the brightness of the vertically emitting quantum dot structure light source and improve the luminous efficiency of the sub-pixel. Similarly, the first reflective layer 95 and the second reflective layer 96 are both symmetrically arranged, for example, centrally symmetrical or axially symmetrical.

[0064] On the basis of the above scheme, optional, continue to refer to Fig.14 The first substrate 10 includes a red sub-pixel area BB4, a green sub-pixel area BB5 and a blue sub-pixel area BB6; the red sub-pixel area BB4 includes a red quantum dot structure 931; the green sub-pixel area BB5 includes a green quantum dot structure 932; and each sub-pixel area BB is provided with a blue light micro-LED 97.

[0065] Specifically, the red quantum dot structure 931 in the red sub-pixel area BB4 converts the blue light emitted by the blue light micro-LED 97 into red light, and the green quantum dot structure 932 in the green sub-pixel area BB5 converts the blue light emitted by the blue light micro-LED 97 into green light. Since the blue light micro-LED 97 emits blue light, the quantum dot structure 93 does not need to be set in the blue sub-pixel area BB6. The color display of the display panel 100 is completed through the above settings.

[0066] Optional, continue to see Fig.14 , the vertical projections of at least two of the first symmetric reference object 40, the second symmetric reference object 50, the third symmetric reference object 80, the fourth symmetric reference object 90, the fifth symmetric reference object 92 and the sixth symmetric reference object 94 on the first substrate 10 overlap. Fig.14 Take the example that the first symmetric reference object 40, the second symmetric reference object 50, the third symmetric reference object 80, the fourth symmetric reference object 90, the fifth symmetric reference object 92 and the sixth symmetric reference object 94 are all symmetric axes, and the vertical projections of the first symmetric reference object 40, the second symmetric reference object 50, the third symmetric reference object 80, the fourth symmetric reference object 90, the fifth symmetric reference object 92 and the sixth symmetric reference object 94 on the first substrate 10 all overlap. That is, by setting the main binding pad 20 and the spare binding pad 30 symmetrically, and the sub-pixel area BB where the main binding pad 20 and the spare binding pad 30 are located is a symmetrical area, and the structure in the sub-pixel area BB, for example, the color resistance structure 60, the retaining wall structure 91, the quantum dot structure 93, and the shielding structure 70 are symmetrically arranged, so that the light emitting effect of the micro-LED 97 electrically connected to the main binding pad 20 and the light emitting effect of the micro-LED 97 electrically connected to the spare binding pad 30 are basically consistent, so that even if the sub-pixel is repaired, the light emitting effect after the repair is basically consistent with that before the repair.

[0067] Optional, continue to see Fig.14The display panel 100 further includes a second substrate 99, and the display panel 100 is encapsulated and protected by the second substrate 99. Optionally, the color resistance structure 60, the quantum dot structure 93, the shielding wall structure 91, etc. can be arranged on the second substrate 99, and then the first substrate 10 and the second substrate 99 are bonded by a bonding process to form a display panel; or after the micro-LEDs are transferred, the above structure can be arranged on the side of the micro-LEDs away from the first substrate 10, which is not limited in this embodiment, and those skilled in the art can prepare it according to the actual situation of the product.

[0068] The above embodiments are applicable to both non-curved display panels and curved display panels. However, the curved display panel can also be configured separately according to its own characteristics. Fig.15 is a partial structural diagram of another display panel provided by an embodiment of the present invention, such as Fig.15 As shown, when the display panel 100 is a curved display panel, the display panel 100 includes a curved portion; the bending axis ZZ of the curved portion is perpendicular to the first symmetry axis and the second symmetry axis. Fig.15 Take the coincidence of the first symmetry axis and the second symmetry axis as an example. The advantage of such a setting is that even if the bending portion may cause deformation of the film layer (such as the color resist structure or the quantum dot structure) arranged on the bending portion, since the bending axis ZZ of the bending portion is perpendicular to the first symmetry axis and the second symmetry axis, the deformation of these film layers is also symmetrical, thus avoiding the problem of different light emission effects of the sub-pixel before and after repair when the deformation is asymmetrical.

[0069] Based on the above inventive concept, an embodiment of the present invention further provides a display device. The display device includes the display panel described in any embodiment of the present invention. Therefore, the display device provided by the embodiment of the present invention has the corresponding beneficial effects of the display panel provided by the embodiment of the present invention, which will not be repeated here. Exemplarily, the display device can be an electronic device such as a mobile phone, a computer, a smart wearable device (for example, a smart watch), and a vehicle-mounted display device, which is not limited by the embodiment of the present invention.

[0070] For example, Fig.16 Schematic diagram of a display device provided by an embodiment of the present invention. Fig.16 As shown, the display device 101 includes the display panel 100 in the above embodiment.

[0071] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: A first substrate, wherein the first substrate includes a plurality of sub-pixel regions arranged in an array, and the sub-pixel regions include: A main binding pad and a spare binding pad are arranged on the first substrate; a micro light emitting diode electrically connected to the main binding pad or the spare binding pad; The main binding pad and the backup binding pad are in a first symmetric manner with respect to a first symmetric reference object; the sub-pixel region is in a second symmetric manner with respect to a second symmetric reference object; The first symmetric manner is the same as the second symmetric manner; The distance between the vertical projection of the first symmetric reference object on the first substrate and the vertical projection of the second symmetric reference object on the first substrate is S1, S1 / Q1<50%; Wherein, Q1 is the size of the long side of the micro light emitting diode; The sub-pixel area also includes a blocking structure, which is in a fourth symmetric manner with respect to a fourth symmetric reference object; the first symmetric manner is the same as the fourth symmetric manner; the distance between the vertical projection of the fourth symmetric reference object on the first substrate and the vertical projection of the first symmetric reference object on the first substrate is S3, and S3 / Q1 is less than 50%.

2. The display panel according to claim 1, characterized in that: The first symmetry mode and the second symmetry mode are both axial symmetry; the first symmetry reference object is the first symmetry axis, and the second symmetry reference object is the second symmetry axis; the first symmetry axis and the second symmetry axis are parallel.

3. The display panel according to claim 2, characterized in that: The second symmetry axes of the sub-pixel regions are parallel.

4. The display panel according to claim 2, characterized in that: The second symmetry axis of the sub-pixel region is parallel to the long side of the sub-pixel region.

5. The display panel according to claim 2, characterized in that: The display panel includes a bent portion; a bending axis of the bent portion is perpendicular to the first symmetry axis and the second symmetry axis.

6. The display panel according to claim 1, characterized in that: The first symmetry mode and the second symmetry mode are both central symmetry; the first symmetry reference object is the first symmetry center, and the second symmetry reference object is the second symmetry center.

7. The display panel according to claim 6, characterized in that: The main binding pads include a first main binding pad and a second main binding pad; the spare binding pads include a first spare binding pad and a second spare binding pad; The projection of the first backup binding pad on the line connecting the first main binding pad and the second main binding pad is located in the gap between the first main binding pad and the second main binding pad; the projection of the second main binding pad on the line connecting the first backup binding pad and the second backup binding pad is located in the gap between the first backup binding pad and the second backup binding pad.

8. The display panel according to claim 1, characterized in that: The sub-pixel region includes a color-resistance structure, and the color-resistance structure is in a third symmetric manner with respect to a third symmetric reference object; the first symmetric manner is the same as the third symmetric manner; A distance between a vertical projection of the third symmetric reference object on the first substrate and a vertical projection of the first symmetric reference object on the first substrate is S2, and S2 / Q1<50%.

9. The display panel according to claim 1, characterized in that: The sub-pixel area also includes a retaining wall structure, which is in a fifth symmetric manner with respect to a fifth symmetric reference object; the first symmetric manner is the same as the fifth symmetric manner; the distance between the vertical projection of the fifth symmetric reference object on the first substrate and the vertical projection of the first symmetric reference object on the first substrate is S4, and S4 / Q1 is less than 50%.

10. The display panel according to claim 9, characterized in that: At least a portion of the sub-pixel areas also include a quantum dot structure, and the quantum dot structure is in a sixth symmetric manner with respect to a sixth symmetric reference object; the first symmetric manner and the sixth symmetric manner are the same; the distance between the vertical projection of the sixth symmetric reference object on the first substrate and the vertical projection of the first symmetric reference object on the first substrate is S5, and S5 / Q1<50%.

11. The display panel according to claim 10, characterized in that: The first substrate includes a red sub-pixel area, a green sub-pixel area and a blue sub-pixel area; the red sub-pixel area includes a red quantum dot structure; the green sub-pixel area includes a green quantum dot structure; and each sub-pixel area is provided with a blue light micro-light emitting diode.

12. The display panel according to claim 10, characterized in that: At least two of the first symmetric reference object, the second symmetric reference object, the third symmetric reference object, the fourth symmetric reference object, the fifth symmetric reference object, and the sixth symmetric reference object have vertical projections overlapped on the first substrate.

13. The display panel according to claim 1, characterized in that: The first substrate includes a red sub-pixel area, a green sub-pixel area and a blue sub-pixel area; the red sub-pixel area is provided with a red light micro-light emitting diode; the green sub-pixel area is provided with a green light micro-light emitting diode; and the blue sub-pixel area is provided with a blue light micro-light emitting diode.

14. The display panel according to claim 1, characterized in that: The distance between the main bonding pad and the backup bonding pad is in the range of 10 μm-50 μm.

15. A display device, characterized in that: A display panel comprising any one of claims 1-14.

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