Antenna Structure and Its Electronic Package

Abstract

An antenna structure and its electronic package, including a ground layer disposed on one side of an insulator, and a first antenna portion and a second antenna portion vertically erected on the ground layer and embedded in the insulator. A gap is formed between the first antenna portion and the second antenna portion to electrically match the first antenna portion and the second antenna portion with each other, and the ground layer is electrically connected to the second antenna portion but not electrically connected to the first antenna portion.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging process, and more particularly to an electronic package with an antenna structure. Background Art

[0002] Currently, wireless communication technologies have been widely applied to various consumer electronic products (such as mobile phones, tablet computers, etc.) to facilitate the reception or transmission of various wireless signals. In addition, to meet the portability and Internet access convenience of consumer electronic products, the manufacturing and design of wireless communication modules are developed towards the requirements of being light, thin, short, and small. Among them, the patch antenna is widely used in the wireless communication modules of electronic products due to its characteristics such as small volume, light weight, and easy manufacturing.

[0003] Currently, the related application technologies of 5G will be fully commercialized in the future. Its application frequency range is about the high-frequency band between 1 GHz and 1000 GHz. Its commercial application mode is 5G combined with 4G LTE, and a cellular base station is erected outdoors to cooperate with the small base stations installed indoors. Therefore, a large number of antennas will be used in the 5G mobile communication in the base station to meet the large-capacity, fast transmission, and low latency of the 5G system.

[0004] Figure 1 FIG. is a three-dimensional schematic diagram of an existing wireless communication module. As Figure 1 shown, the wireless communication module 1 includes: a substrate 10, a plurality of electronic components 11 disposed on the substrate 10, an antenna structure 12, and a packaging material 13. The substrate 10 is a circuit board; the electronic components 11 are disposed on the substrate 10 and electrically connected to the substrate 10; the antenna structure 12 is planar and has an antenna body 120 and a wire 121, and the antenna body 120 is electrically connected to the electronic component 11 through the wire 121; the packaging material 13 covers the electronic components 11 and a part of the wire 121. On the other hand, in the 5G system, due to the requirements of signal quality and transmission speed, more antenna configurations are needed to improve the signal quality and transmission speed.

[0005] However, in the existing wireless communication module 1, the antenna structure 12 is planar, and the length and width dimensions of the substrate 10 are both fixed. Therefore, it is not only difficult to reduce the volume of the substrate 10, but also the radiation direction of the antenna structure 12 is limited, which restricts the function of the antenna structure 12. If it is configured to operate with the antenna of the 5G system, the signal emission efficiency will be poor, making it difficult for the wireless communication module 1 to meet the requirements of the antenna operation of the 5G system.

[0006] Therefore, how to overcome the problems of the above-mentioned existing technologies has actually become an urgent issue to be solved currently. Summary of the Invention

[0007] In view of the above-mentioned deficiencies of the prior art, the present invention provides an antenna structure and its electronic package.

[0008] In a first aspect of the present invention, an antenna structure is provided, including: an insulator having opposite sides; a first antenna portion including at least one columnar antenna body embedded in the insulator and at least one active line disposed on the surface of the insulator and connected to the antenna body, wherein the antenna body extends from one side of the insulator to the other side, so that the antenna body communicates with the opposite sides of the insulator; a second antenna portion including at least one conductive column embedded in the insulator and at least one auxiliary line disposed on the surface of the insulator and connected to the conductive column, wherein the conductive column is arranged corresponding to the antenna body, so that the conductive column extends from one side of the insulator to the other side, so that the conductive column communicates with the opposite sides of the insulator, and a gap is formed between the antenna body and the conductive column, so that the first antenna portion and the second antenna portion match each other; and a ground layer disposed on one side of the insulator and electrically connected to the second antenna portion, wherein the ground layer is not electrically connected to the first antenna portion.

[0009] In the aforementioned antenna structure, a plurality of conductors surrounding the antenna body are arranged in the insulator.

[0010] In the aforementioned antenna structure, a plurality of the ground layers isolated from each other are arranged in the insulator.

[0011] In the aforementioned antenna structure, the first antenna portion and / or the second antenna portion is located within the vertical projection range of the ground layer.

[0012] In the aforementioned antenna structure, the vertical projection range of the ground layer is larger than the vertical projection range of the first antenna portion and / or the vertical projection range of the second antenna portion.

[0013] In the aforementioned antenna structure, an opening area is formed in the ground layer for the antenna body to pass through the opening area without contacting the ground layer.

[0014] In the aforementioned antenna structure, one end side of the antenna body serves as a signal source, and the other end side is exposed outside the insulator for serving as a transmission source. For example, the active line horizontally extends from the end side of the antenna body exposed outside the insulating layer and is disposed on the insulator.

[0015] In the aforementioned antenna structure, one end side of the conductive column is connected to the ground layer, and the other end side is exposed outside the insulator. For example, the auxiliary line horizontally extends from the end side of the conductive column exposed outside the insulating layer and is disposed on the insulator.

[0016] In the aforementioned antenna structure, the auxiliary line and the active line are separated from each other.

[0017] In the aforementioned antenna structure, the auxiliary line and the functional line are arranged in alignment on an imaginary straight line.

[0018] In the aforementioned antenna structure, the second antenna portion is used as a ground, such that the first antenna portion and the second antenna portion form a dipole antenna.

[0019] In the aforementioned antenna structure, the conductive column is arranged parallel to the antenna body.

[0020] A second aspect of the present invention provides an electronic package, comprising: the antenna structure described in the first aspect; and an electronic component communicatively connected to the first antenna portion and the second antenna portion, such that the insulator carries the electronic component.

[0021] In the aforementioned electronic package, the insulator is provided with a circuit structure electrically connected to the electronic component, which is electrically connected to the first antenna portion and the second antenna portion.

[0022] In the aforementioned electronic package, it further includes a ground portion combined with the insulator. For example, the ground portion is a conductive structure embedded in the insulator. Further, the insulator is provided with a circuit structure electrically connected to the electronic component, which is electrically connected to the ground portion. Alternatively, the ground portion includes a plurality of conductive layers and a plurality of conductive vias electrically connecting the plurality of conductive layers to the ground layer, such that a part of the conductive layers is exposed outside the insulator for use as an external pad.

[0023] As can be seen from the above, in the electronic package and its antenna structure of the present invention, mainly by disposing the first antenna portion above the ground layer, and the distribution range of the first antenna portion and the second antenna portion is not greater than the layout range of the ground layer. Therefore, compared with the prior art, the antenna structure of the present invention can effectively reduce the layout range of the antenna, so as to facilitate reducing the layout area of the insulator, and can increase the flexibility of antenna configuration.

[0024] In addition, the distribution range of the first antenna portion and the second antenna portion is not greater than the layout range of the ground layer, such that the radiation direction of the end side of the antenna body exposed outside the insulator is perpendicular to the functional line or the surface of the insulator. Therefore, the radiation direction of the antenna structure is not restricted, which is beneficial to improving the function of the antenna structure. Thus, compared with the prior art, when the antenna structure is applied to the antenna operation of the system, the efficiency of transmitting signals can be improved, and the electronic package can easily meet the requirements of the antenna operation of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a perspective schematic view of an existing wireless communication module.

[0026] Figure 2A It is a cross-sectional schematic view of the antenna structure of the present invention.

[0027] Figure 2B This is a three-dimensional schematic diagram of the antenna structure of the present invention.

[0028] Figure 3A This is a cross-sectional schematic diagram of the electronic package of the present invention.

[0029] Figure 3B is Figure 3A a partial top view schematic diagram of

[0030] Description of reference numerals in the drawings

[0031] 1: Wireless communication module

[0032] 10: Substrate

[0033] 11: Electronic component

[0034] 12: Antenna structure

[0035] 120: Antenna body

[0036] 121: Conductive wire

[0037] 13: Encapsulation material

[0038] 2: Antenna structure

[0039] 2a: First antenna part

[0040] 2b: Second antenna part

[0041] 2c: Insulator

[0042] 20: Base

[0043] 20a: First surface

[0044] 20b: Second surface

[0045] 22: Antenna body

[0046] 22a, 22b: End sides

[0047] 220: Active circuit

[0048] 221: Pad part

[0049] 23: Insulating layer

[0050] 23a: Surface

[0051] 24: Conductive column

[0052] 24a, 24b: End sides

[0053] 240: Auxiliary circuit

[0054] 25a, 25b: Ground layer

[0055] 250: Conductive body

[0056] 3: Electronic package

[0057] 30: Circuit structure

[0058] 301: First circuit layer

[0059] 302: Second circuit layer

[0060] 31: Electronic component

[0061] 310: Conductive bump

[0062] 34: Grounding portion

[0063] 340: Conductive layer

[0064] 341: Conductive blind hole

[0065] 342: External pad

[0066] 36: Conductive element

[0067] A: Opening area

[0068] d: Thickness

[0069] h: Height

[0070] L: Imaginary straight line

[0071] L1, L2: Length

[0072] t: Spacing Detailed implementation manners

[0073] The following describes the implementation manners of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0074] It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limited conditions under which the present invention can be implemented. Therefore, they do not have technical essential meanings. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical solutions disclosed in the present invention. At the same time, the terms such as "upper", "first", "second", and "one" used in this specification are only for the convenience of clear narration and are not used to limit the scope under which the present invention can be implemented. The change or adjustment of their relative relationships, without substantial change of the technical solutions, should also be regarded as the scope within which the present invention can be implemented.

[0075] Figure 2A and Figure 2B is a schematic diagram of the antenna structure 2 of the present invention. In this embodiment, the antenna structure 2 is in the form of a dipole antenna.

[0076] As Figure 2A shown, the antenna structure 2 includes: an insulator 2c, a first antenna portion 2a coupled to the insulator 2c, and a second antenna portion 2b.

[0077] The insulator 2c includes a base portion 20 and an insulating layer 23 disposed on the base portion 20, and the base portion 20 has opposite first and second surfaces 20a and 20b such that the insulating layer 23 is formed on the second surface 20b of the base portion 20.

[0078] In this embodiment, the base portion 20 includes dielectric materials, polyimide (PI for short), dry film, epoxy resin, or molding compound, etc., but is not limited to the above.

[0079] In addition, at least one ground layer 25a, 25b is disposed on the base portion 20. For example, a plurality of mutually isolated ground layers 25a, 25b are disposed on the base portion 20, which are respectively disposed on the first surface 20a and the second surface 20b of the base portion 20, and are connected between the ground layers 25a, 25b by a plurality of conductors 250 such as conductive blind vias. Specifically, the ground layers 25a, 25b can be formed by a processing method of coating a metal layer (such as copper), such as sputtering, vapor deposition, electroplating, or chemical plating, or by a setting method such as lamination or foiling (such as a metal foil in a mesh or any pattern).

[0080] In addition, the insulating layer 23 includes dielectric materials, polyimide (PI for short), dry film, epoxy resin, or molding compound, etc., but is not limited to the above. It should be understood that the base portion 20 and the insulating layer 23 can be of the same material or different materials according to requirements.

[0081] The first antenna portion 2a includes an antenna body 22 embedded in the insulator 2c, which is in the shape of a conductive column and extends from one side of the insulator 2c to the other side, so that the antenna body 22 communicates with the opposite sides of the insulator 2c, such that one end side 22a of the antenna body 22 is located in the base portion 20 for serving as a signal source, and the other end side 22b of the antenna body 22 is exposed outside the insulator 2c for serving as a transmitting source.

[0082] In this embodiment, one end side 22a of the antenna body 22 communicates with the first surface 20a and the second surface 20b of the base 20, and the antenna body 22 passes through the insulating layer 23, so that the other end side 22b of the antenna body 22 is exposed on the surface 23a of the insulating layer 23. For example, the antenna body 22 may form a pad portion 221 on the first surface 20a of the base 20, and the grounding layers 25a, 25b are formed with an opening area A, so that the antenna body 22 passes through the opening area A without contacting the grounding layers 25a, 25b, and the pad portion 221 is located in the opening area A without contacting the grounding layers 25a, 25b.

[0083] In addition, the first antenna portion 2a further includes an active line 220 connecting the antenna body 22, which horizontally extends from the end side 22b of the antenna body 22 exposed to the insulating layer 23 and is disposed on the surface 23a of the insulating layer 23, so as to change the wavelength (or frequency) of the signal emitted by the antenna body 22 by adjusting the length L1 of the active line 220 (as Figure 2B shown), that is, there is a proportional relationship between the length L1 of the active line 220 and the radiation wavelength.

[0084] In addition, the length of the active line 220 is adjusted at the same height as the thickness d of the insulating layer 23 of the antenna body 22 to change the impedance value of the antenna body 22.

[0085] In addition, the first antenna portion 2a can be formed by processing methods such as laying a metal layer (such as copper), such as sputtering, vaporing, electroplating or chemical plating, etc.; or, the first antenna portion 2a can be formed by setting methods such as pressing or attaching a frame.

[0086] The second antenna portion 2b includes a conductive column 24 embedded in the insulator 2c, which extends from one side of the insulator 2c to the other side, so that the conductive column 24 communicates with the opposite sides of the insulator 2c, so that one end side 24a of the conductive column 24 is connected to the grounding layers 25a, 25b, and the other end side 24b of the conductive column 24 is exposed outside the insulator 2c.

[0087] In this embodiment, the conductive column 24 is arranged parallel to the antenna body 22, so that a gap t is formed between the antenna body 22 and the conductive column 24, so that the first antenna portion 2a and the second antenna portion 2b are symmetrically arranged with each other, and the first antenna portion 2a and the second antenna portion 2b are electrically matched with each other. For example, the second antenna portion 2b is used as a ground, so that the first antenna portion 2a and the second antenna portion 2b form a dipole antenna.

[0088] In addition, the second antenna portion 2b further includes an auxiliary line 240 connecting to the conductive column 24. The auxiliary line 240 horizontally extends from the end side 24b of the conductive column 24 exposed outside the insulating layer 23 and is disposed on the surface 23a of the insulating layer 23, so that the auxiliary line 240 cooperates with the functional line 220 to adjust its length L2 (as Figure 2B shown), enabling the antenna body 22 to conform to the waveform of the signal to be emitted. For example, the auxiliary line 240 and the functional line 220 are separated from each other and maintain a distance of the interval t, and both are aligned with each other and arranged on an imaginary straight line L, as Figure 2B shown.

[0089] In addition, the ground layers 25a, 25b can be selectively covered, as required, with the vertical projection range of the surface area of the base 20, such as Figure 2B the entire surface shown, so that its vertical projection range is greater than the vertical projection range of the first antenna portion 2a and / or the vertical projection range of the second antenna portion 2b. For example, the first antenna portion 2a and / or the second antenna portion 2b are located within the vertical projection range of the ground layers 25a, 25b

[0090] In addition, the second antenna portion 2b can be formed by means of processing such as laying a metal layer (such as copper), such as sputtering, vaporing, electroplating or chemical plating; or the conductive column 24 can be formed by means of setting such as pressing or attaching a frame.

[0091] It should be understood that the base 20 and / or the insulating layer 23 can be used, as required, in a patterned (such as electroplating metal or etching metal) wiring process, such as a Redistribution Layer (RDL) process, to fabricate the first antenna portion 2a and the second antenna portion 2b together.

[0092] Therefore, the antenna structure 2 of the present invention mainly stands the first antenna portion 2a above the ground layers 25a, 25b, so that the radiation direction of the exposed end side 22b of the antenna body 22 is perpendicular to the functional line 220 or the first surface 20a of the base 20 (or towards the column direction of the antenna body 22), and the distribution range (or vertical projection range) of the first antenna portion 2a and the second antenna portion 2b is not greater than the layout range (or vertical projection range) of the ground layers 25a, 25b. Therefore, compared with the prior art, the antenna structure 2 of the present invention can effectively reduce the layout range of the antenna, so as to facilitate reducing the layout area of the insulator 2c (or the first surface 20a of the base 20), and can increase the flexibility of antenna configuration.

[0093] In addition, since the distribution range (or vertical projection range) of the first antenna portion 2a (or the active line 220) is not greater than the layout range (or vertical projection range) of the grounding layer 25a, the grounding layer 25a can act as a reflector to effectively reflect the signal of the active line 220. Therefore, the radiation direction of the exposed end side 22b of the antenna body 22 can be perpendicular to the active line 220 or the first surface 20a of the base 20 (or towards the column direction of the antenna body 22). Thus, the radiation direction of the antenna structure 2 is not restricted, which is beneficial to improving the function of the antenna structure 2.

[0094] In addition, a plurality of grounding conductors 250 are arranged around the signal source of the antenna body 22 (the antenna body 22 is located at the end side 22a or the pad portion 221 of the base 20), that is, the conductors 250 are arranged around the antenna body 22 to shield the signal source, thereby reducing signal distortion or loss of the antenna body 22.

[0095] Figure 3A It is a cross-sectional schematic diagram of the electronic package 3 of the present invention. As Figure 3A shown, the electronic package 3 includes an antenna structure 2 and at least one electronic component 31 communicatively connecting the first antenna portion 2a and the second antenna portion 2b.

[0096] In this embodiment, the electronic package 3 further includes a grounding portion 34 disposed on the insulator 2c, and the insulator 2c carries the electronic component 31.

[0097] A circuit structure 30 is disposed on the base 20 of the insulator 2c to form a package substrate (substrate) having a core layer and a circuit layer or a multi-layer circuit layer without a core layer (coreless), and the circuit structure 30 includes at least a first circuit layer 301 and a second circuit layer 302 formed in the base 20, such as a fan-out type redistribution layer (redistribution layer, abbreviated as RDL).

[0098] In this embodiment, one grounding layer 25b is disposed on the second surface 20b of the base 20, and the other grounding layer 25a is disposed in the base 20 to isolate the grounding layers 25a and 25b from each other, and the two are connected to each other by at least one conductor 250.

[0099] The insulating layer 23 of the insulator 2c is bonded to the second surface 20b of the base 20, and the material forming the insulating layer 23 is, for example, polyimide (abbreviated as PI), dry film or molding compound, etc., but is not limited to the above.

[0100] The electronic component 31 is disposed on the base 20. It can be disposed on the first surface 20a or the second surface 20b, or even can be disposed on the first surface 20a and the second surface 20b simultaneously according to requirements, and can be embedded in the base 20 and / or the insulating layer 23 according to requirements.

[0101] In this embodiment, the electronic component 31 is an active component, a passive component, or a combination of both. Among them, the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. For example, the electronic component 31 is a semiconductor chip with millimeter-wave (㎜Wave) function, and is disposed on the first circuit layer 301 and the second circuit layer 302 in a flip-chip manner by a plurality of conductive bumps 310 such as solder material or copper material and is electrically connected to the first circuit layer 301 and the second circuit layer 302; or, the electronic component 31 can be electrically connected to the first circuit layer 301 and the second circuit layer 302 by a plurality of bonding wires (not shown) in a wire bonding manner; or, the electronic component 31 can directly contact the first circuit layer 301 and the second circuit layer 302. However, the manner in which the electronic component 31 is electrically connected to the circuit layer is not limited to the above.

[0102] Therefore, by using a carrier board for packaging process to fabricate the base 20 and the circuit structure 30 to carry the electronic component 31, the electronic component 31 can communicate and connect the first antenna portion 2a and the second antenna portion 2b through the first circuit layer 301 and the second circuit layer 302.

[0103] The first antenna portion 2a is disposed on the base 20, combined with the insulating layer 23, and electrically connected to the electronic component 31 through the first circuit layer 301.

[0104] In this embodiment, the first antenna portion 2a is not buried in the base 20. Its antenna body 22 stands on the second surface 20b of the base 20 and is embedded in the insulating layer 23. One end side 22a of the antenna body 22 is combined with the second surface 20b of the base 20 and electrically connected to the first circuit layer 301, and the other end side 22b of the antenna body 22 is exposed outside the insulating layer 23 and serves as a transmitting source. For example, one end side 22a of the antenna body 22 can be combined with the second surface 20b of the base 20 through the pad portion 221 and electrically connected to the first circuit layer 301, and the grounding layers 25a, 25b are formed with an opening area A for the pad portion 221 and the first circuit layer 301 to pass through the opening area A without contacting the grounding layers 25a, 25b.

[0105] In addition, the functional circuit 220 of the first antenna portion 2a horizontally extends from the exposed end side 22b of the antenna body 22 and is disposed on the surface 23a of the insulating layer 23.

[0106] The second antenna portion 2b is also erected on the base portion 20, combined with the insulating layer 23, and electrically connected to the electronic component 31 through the second circuit layer 302.

[0107] In this embodiment, a gap t is maintained between the conductive column 24 of the second antenna portion 2b and the antenna body 22, so that the first antenna portion 2a and the second antenna portion 2b are mutually matched to form a dipole antenna, and the auxiliary circuit 240 of the second antenna portion 2b horizontally extends from the exposed end side 24b of the conductive column 24 and is disposed on the surface 23a of the insulating layer 23. For example, the auxiliary circuit 240 is separated from the functional circuit 220 to maintain the distance of the gap t, and the two are aligned and arranged on an imaginary straight line L, as Figure 3B shown.

[0108] The grounding portion 34 is a conductive structure embedded in the base portion 20, and thus it can be fabricated together with the second circuit layer 302. For example, the grounding portion 34 includes a plurality of conductive layers 340 electrically connected to the second circuit layer 302 and a plurality of conductive blind holes 341 electrically connecting the conductive layers 340 and the grounding layer 25a, and the conductive layer 340 can be exposed on the first surface 20a of the base portion 20 for use as an external pad 342.

[0109] In addition, the electronic package 3 further includes a plurality of conductive elements 36, which are disposed on the first surface 20a of the base portion 20. For example, the conductive element 36 is, for example, a solder ball, which is disposed on the external pad 342 to electrically connect the second circuit layer 302 and / or the first circuit layer 301.

[0110] Therefore, the electronic package 3 of the present invention adopts the design of the antenna structure 2, so that the electronic package 3 can effectively reduce the layout range of the antenna, which is beneficial to reducing the area of the carrier board used in the packaging process, and can increase the flexibility of antenna configuration.

[0111] In addition, since the radiation direction of the antenna structure 2 is not limited, which is beneficial to improving the function of the antenna structure 2, when the antenna structure 2 is applied to the antenna operation of the 5G system, the efficiency of transmitting signals can be improved, so that the electronic package 3 can easily meet the requirements of the antenna operation of the 5G system.

[0112] In addition, the electronic package 3 can utilize the grounding layers 25a, 25b to prevent problems such as cross talking, noise interfering, and radiation interference of the antenna body 22 to the electronic component 31.

[0113] In summary, for the electronic package and its antenna structure of the present invention, by disposing the first antenna portion above the grounding layer and ensuring that the distribution ranges of the first antenna portion and the second antenna portion do not exceed the layout range of the grounding layer, the antenna structure of the present invention can effectively reduce the layout range of the antenna, which is beneficial to reducing the layout area of the insulator and increasing the flexibility of antenna configuration.

[0114] In addition, by making the radiation direction of the exposed end side of the antenna body outside the insulator perpendicular to the surface of the active circuit or the insulator, the radiation direction of the exposed end side of the antenna body outside the insulator is perpendicular to the surface of the active circuit or the insulator, which is beneficial to enhancing the function of the antenna structure. Therefore, when the antenna structure is applied to the antenna operation of the system, the efficiency of transmitting signals can be improved, making the electronic package easily meet the requirements of the antenna operation of the system.

[0115] The above embodiments are only used to illustrate the principles and effects of the present invention by way of example, rather than to limit the present invention. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the protection of the rights of the present invention shall be as listed in the claims.

Claims

1. An antenna structure, characterized in that, Comprising: An insulator having opposite sides; A first antenna portion including at least one columnar antenna body embedded in the insulator and at least one functional circuit disposed on the surface of the insulator and connected to the antenna body, wherein the antenna body extends from one side of the insulator to the other side, such that the antenna body communicates with the opposite sides of the insulator; A second antenna portion including at least one conductive column embedded in the insulator and at least one auxiliary circuit disposed on the surface of the insulator and connected to the conductive column, wherein the conductive column is arranged corresponding to the antenna body, such that the conductive column extends from one side of the insulator to the other side, such that the conductive column communicates with the opposite sides of the insulator, and a gap is formed between the antenna body and the conductive column, such that the first antenna portion and the second antenna portion match each other; and A ground layer disposed on one side of the insulator and electrically connected to the second antenna portion, and not electrically connected to the first antenna portion.

2. The antenna structure according to claim 1, characterized in that, A plurality of conductors are disposed in the insulator around the antenna body.

3. The antenna structure according to claim 1, characterized in that The insulator is provided with a plurality of mutually isolated ground layers.

4. The antenna structure according to claim 1, wherein The first antenna portion and / or the second antenna portion is located within the vertical projection range of the ground layer.

5. The antenna structure according to claim 1, wherein The vertical projection range of the ground layer is greater than the vertical projection range of the first antenna portion and / or the vertical projection range of the second antenna portion.

6. The antenna structure according to claim 1, wherein The ground layer is formed with an opening area for the antenna body to pass through the opening area without contacting the ground layer.

7. The antenna structure according to claim 1, wherein One end side of the antenna body serves as a signal source, and the other end side is exposed outside the insulator for serving as a transmitting source.

8. The antenna structure according to claim 7, wherein, The functional circuit extends horizontally from the end side of the antenna body exposed outside the insulating layer and is disposed on the insulator.

9. The antenna structure according to claim 1, characterized in that, One end side of the conductive column is connected to the ground layer, and the other end side is exposed outside the insulator.

10. The antenna structure according to claim 9, characterized in that, The auxiliary circuit extends horizontally from the end side of the conductive column exposed outside the insulating layer and is disposed on the insulator.

11. The antenna structure according to claim 1, characterized in that, The auxiliary circuit is separated from the functional circuit.

12. The antenna structure according to claim 1, wherein, The auxiliary circuit and the functional circuit are aligned and arranged on an imaginary straight line.

13. The antenna structure according to claim 1, wherein The second antenna portion is used for grounding, such that the first antenna portion and the second antenna portion form a dipole antenna.

14. The antenna structure according to claim 1, wherein The conductive column is arranged parallel to the antenna body.

15. An electronic package, characterized in that, Comprising: The antenna structure according to any one of claims 1 to 14; And An electronic component communicatively connected to the first antenna portion and the second antenna portion, and the insulator bears the electronic component.

16. The electronic package according to claim 15, wherein The insulator is provided with a circuit structure electrically connected to the electronic component, which is electrically connected to the first antenna portion and the second antenna portion.

17. The electronic package according to claim 15, wherein, The electronic package further includes a ground portion combined with the insulator.

18. The electronic package according to claim 17, wherein, The ground portion is a conductive structure embedded in the insulator.

19. The electronic package according to claim 18, wherein, The insulator is provided with a circuit structure electrically connected to the electronic component, and the circuit structure is electrically connected to the ground portion.

20. The electronic package according to claim 17, wherein, The ground portion includes a plurality of conductive layers and a plurality of conductive blind vias electrically connecting the plurality of conductive layers to the ground layer, and part of the conductive layers are exposed outside the insulator for serving as external pads.

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