Electronic devices

Abstract

The present disclosure relates to an electronic device, belonging to the field of electronic technology. The electronic device includes a card tray installation assembly, and the card tray installation assembly includes a mounting bracket and a first seal; the mounting bracket has a card tray slot, and the first inner wall of the card tray slot has a card tray hole, the first inner wall is close to the outer side of the mounting bracket, and the card tray hole connects the card tray slot and the outer side of the mounting bracket; the first seal is attached to the mounting bracket and surrounds the card tray slot, and is used to isolate the area where the card tray slot is located from other areas of the mounting bracket. The electronic device provided by the present disclosure has a card tray installation assembly that can effectively avoid corrosion failure of the electronic device due to poor sealing of the card tray hole.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] Chip cards, such as SIM cards, are usually provided on electronic devices such as mobile phones and tablets to realize functions such as making calls. The chip card usually needs to be mounted on a card tray, and the end of the card tray carrying the chip card extends into the interior of the electronic device through the card tray hole opened on the electronic device to integrate the chip card with the electronic device. When users use electronic devices, corrosive media such as sweat on their hands and rain in the air can easily enter the interior of the electronic device through the card tray hole, causing the electronic device to corrode and fail. Therefore, it is necessary to ensure the sealing performance of the electronic device at the opening position such as the card tray hole to prevent the corrosive medium from corroding the electronic device.

[0003] In the related art, an annular rubber sleeve is usually installed on the card tray, so that when the card tray is accommodated in the card tray hole, the annular rubber sleeve is tightly attached to the outside of the card tray hole to seal from the outside of the card tray hole to prevent the corrosive medium from entering the interior of the electronic device from the card tray hole. However, this sealing method is difficult to achieve effective sealing of the card tray hole. Summary of the invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides an electronic device, which can effectively avoid the corrosion failure of the electronic device due to the poor sealing of the card holder hole. The technical solution is as follows:

[0005] An embodiment of the present disclosure provides an electronic device, the electronic device comprising a card tray mounting assembly, the card tray mounting assembly comprising a mounting bracket and a first sealing member;

[0006] The mounting bracket has a card holder slot, a first inner wall of the card holder slot has a card holder hole, the first inner wall is close to the outer side of the mounting bracket, and the card holder hole communicates the card holder slot and the outer side of the mounting bracket;

[0007] The first sealing member is attached to the mounting bracket and surrounds the card bracket slot, and is used to isolate the area where the card bracket slot is located from other areas of the mounting bracket.

[0008] Optionally, the first seal comprises a first sub-seal and a second sub-seal;

[0009] The first sub-seal is in a strip shape, the first sub-seal is attached to the first inner wall, and the first sub-seal is located on a side of the card holder hole away from the bottom of the card holder slot;

[0010] The second sub-seal is a frame-shaped member with a notch, and the second sub-seal is attached to the periphery of the second inner wall of the card holder slot, and the second inner wall is the inner wall of the card holder slot except the first inner wall;

[0011] Two ends of the first sub-sealing member and the second sub-sealing member are respectively connected.

[0012] Optionally, a sealing surface is provided on the first inner wall, the sealing surface is recessed toward the outer side of the mounting bracket, and at least a portion of the first sub-seal is attached to the sealing surface.

[0013] Optionally, a sealing step is formed on the second inner wall, and the second sub-seal is supported by a top surface of the sealing step.

[0014] Optionally, a height of the first sub-sealing member in a thickness direction of the electronic device is greater than a height of the second sub-sealing member in the thickness direction of the electronic device.

[0015] Optionally, a card pin hole is further provided on the first inner wall, the card pin hole communicates with the card tray slot and the outer side of the mounting bracket, and the card pin hole is located between the first sealing component and the bottom of the card tray slot.

[0016] Optionally, the card tray mounting assembly further includes a second sealing member, and the electronic device further includes a battery cover;

[0017] The battery cover covers the outside of the mounting bracket, and the second sealing member is attached between the battery cover and the mounting bracket.

[0018] Optionally, the card tray mounting assembly is located on a middle frame of the electronic device, and the electronic device further includes a card tray body and a mainboard;

[0019] The card tray body has a chip card, and the card tray body extends through the card tray hole into the card tray slot so that the chip card is accommodated in the card tray slot;

[0020] The mainboard covers the opening side of the card tray slot, and the mainboard is electrically connected to the chip card;

[0021] The first sealing member is respectively fitted with the mainboard and the mounting bracket to seal the gap between the mainboard and the mounting bracket.

[0022] Optionally, the electronic device further includes a screen, a screen accessory, a middle frame accessory and a buffer;

[0023] The card tray slot is formed on the middle frame, and the screen is located at one side of the slot bottom of the card tray slot;

[0024] The middle frame accessory surrounds the outer side of the edge of the middle frame, and the screen accessory surrounds the outer side of the edge of the screen, and the middle frame accessory and the screen accessory are connected together in the thickness direction of the electronic device;

[0025] The buffer is embedded in the outer side of the corner of the electronic device, and a first portion of the buffer is exposed from the middle frame attachment, and a second portion of the buffer is exposed from the screen attachment.

[0026] Optionally, a first assembly groove is provided on an outer side surface of the middle frame attachment, and a first through hole is provided on a side of the first assembly groove close to the screen attachment;

[0027] The outer side of the screen attachment is provided with a second assembly groove, and the second assembly groove has a second through hole on a side close to the middle frame attachment;

[0028] The buffer member passes through the first through hole and the second through hole, and the first portion of the buffer member is located in the first assembly groove, and the second portion is located in the second assembly groove.

[0029] Optionally, there is a gap between the buffer and the screen;

[0030] One end of the second portion of the buffer away from the middle frame attachment is connected to the screen.

[0031] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0032] In the disclosed embodiment, a first seal surrounding the card tray slot is used to isolate the area where the card tray slot is located from other areas of the mounting bracket, so that when the card tray mounting assembly is assembled in an electronic device, it is difficult for the corrosive medium in the card tray slot to enter the interior of the electronic device through the first seal.

[0033] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the description, are used to explain the principles of the present disclosure. In the drawings:

[0035] Figure 1 is a structural schematic diagram of a card tray installation assembly according to an embodiment;

[0036] Figure 2 yes Figure 1 A local enlarged view at position A;

[0037] Figure 3yes Figure 1 A local enlarged view at position B in FIG.

[0038] Figure 4 is a schematic structural diagram of an electronic device according to an embodiment;

[0039] Figure 5 yes Figure 4 Schematic diagram of the cross-sectional structure at position C;

[0040] Figure 6 is a schematic structural diagram of another electronic device according to an embodiment;

[0041] Figure 7 yes Figure 6 Schematic diagram of the cross-sectional structure at position D;

[0042] Figure 8 yes Figure 6 A local enlarged view at position E in FIG.

[0043] Fig. 9 yes Figure 6 Schematic diagram of the cross-sectional structure at position F in FIG.

[0044] Legend

[0045] 200, card tray installation assembly; 201, installation bracket; 2011, card tray slot; 2012, card tray hole; 2013, sealing surface; 20131, transition surface; 2014, sealing step; 2015, card pin hole;

[0046] 202, first sealing member; 2021, first sub-sealing member; 2022, second sub-sealing member;

[0047] 203, second sealing member;

[0048] 300, middle frame;

[0049] 400. Cato body;

[0050] 500, motherboard;

[0051] 600, upper bracket;

[0052] 700, battery cover;

[0053] 800, middle frame attachment; 801, first assembly groove; 802, first through hole;

[0054] 900, screen attachment; 901, second assembly groove; 902, second through hole; 903, protrusion;

[0055] 1000, screen;

[0056] 1100, buffer part; 1101, first part; 1102, second part; 1103, transition part.

[0057] The above drawings show clear embodiments of the present disclosure, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present disclosure in any way, but to illustrate the concepts of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0058] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present disclosure. Instead, they are merely examples of devices consistent with some aspects of the present disclosure as detailed in the attached claims. In order to make the technical solutions and advantages of the present disclosure clearer, the structure, functions and advantages of the card tray mounting assembly will be described in detail below in conjunction with the accompanying drawings.

[0059] like Figure 1 As shown, the electronic device provided by the embodiment of the present disclosure includes a card tray installation assembly 200. The card tray installation assembly 200 includes a mounting bracket 201 and a first sealing member 202. The mounting bracket 201 has a card tray slot 2011, and the first inner wall of the card tray slot 2011 has a card tray hole 2012, the first inner wall is close to the outer side of the mounting bracket 201, and the card tray hole 2012 connects the card tray slot 2011 and the outer side of the mounting bracket 201. The first sealing member 202 is attached to the mounting bracket 201 and surrounds the card tray slot 2011, and is used to isolate the area where the card tray slot 2011 is located from other areas of the mounting bracket 201.

[0060] In the disclosed embodiment, the area where the card tray slot 2011 is located is isolated from other areas of the mounting bracket 201 by means of a first seal 202 surrounding the card tray slot 2011, so that when the card tray mounting assembly 200 is assembled in an electronic device, it is difficult for the corrosive medium in the card tray slot 2011 to enter the interior of the electronic device through the first seal 202.

[0061] Compared to the traditional card tray installation assembly, the card tray installation assembly 200 provided in the embodiment of the present disclosure isolates the card tray slot 2011 as a whole from other matching structures inside the electronic device. Even if the card tray hole 2012 itself is poorly sealed and the external corrosive medium enters the interior of the card tray slot 2011 through the card tray hole 2012, the first seal 202 can also block the corrosive medium in the card tray slot 2011 and prevent it from entering the interior of the electronic device through the card tray slot 2011.

[0062] Alternatively, if Figure 1 As shown, the first seal 202 may include a first sub-seal 2021 and a second sub-seal 2022. The first sub-seal 2021 may be a strip-shaped one, and the second sub-seal 2022 may be a frame-shaped one with a notch. The first sub-seal 2021 may be attached to the first inner wall of the card tray slot 2011 (i.e., the inner wall on the side where the card tray hole 2012 is provided), and is located above the card tray hole 2012 (i.e., the side away from the bottom of the card tray slot 2011). The second sub-seal 2022 may be attached to the periphery of the second inner wall of the card tray slot 2011 (i.e., the remaining inner walls in the card tray slot 2011 except the first inner wall). The two ends of the first sub-seal 2021 and the second sub-seal 2022 may be connected respectively.

[0063] In the present disclosure, the side where the bottom of the card holder slot 2011 is located is regarded as the lower side, and the opening side of the card holder slot 2011 is regarded as the upper side.

[0064] In a specific implementation, the first sub-seal 2021 and the second sub-seal 2022 can be integrally formed, that is, the first sub-seal 2021 as a whole can be a closed frame. Alternatively, the first sub-seal 2021 and the second sub-seal 2022 can be separately formed, and the length of the first sub-seal 2021 can match the length of the notch in the second sub-seal 2022.

[0065] It is understandable that when the card tray mounting assembly 200 of the present disclosure is not assembled into an electronic device, a certain gap may exist between the two ends of the first sub-seal 2021 and the second sub-seal 2022 (i.e., the length of the first sub-seal 2021 may be slightly smaller than the length of the notch in the second sub-seal 2022). When the card tray mounting assembly 200 is assembled into an electronic device, the first sub-seal 2021 and the second sub-seal 2022 are squeezed and deformed by other matching structures, and at this time, the two ends of the first sub-seal 2021 and the second sub-seal 2022 may be connected respectively to isolate the area where the card tray slot 2011 is located from other areas of the mounting bracket 201.

[0066] Alternatively, there may be an overlapped portion between the two ends of the first subseal 2021 and the second subseal 2022 (i.e., the length of the first subseal 2021 may be slightly greater than the length of the notch in the second subseal 2022) to ensure the tightness and reliability of the connection between the two ends of the first subseal 2021 and the second subseal 2022. Figure 1As shown, the second sub-seal 2022 may include a first frame edge, a second frame edge, and a third frame edge connected in sequence, and the first frame edge and the third frame edge may be arranged opposite to each other and may extend in a length direction perpendicular to the first sub-seal 2021. The two ends of the second frame edge may be respectively connected to the first frame edge and the end of the third frame edge away from the first sub-seal 2021. The end of the first frame edge close to the first sub-seal 2021 may have an overlapping portion (which may be referred to as a first overlapping portion), and the first overlapping portion may extend to the bottom of the first sub-seal 2021 in a direction close to the third frame edge (that is, the first overlapping portion may be located on a side of the first sub-seal 2021 close to the caulking hole 2012).

[0067] In other embodiments, the end of the third frame edge close to the first sub-seal 2021 may also have an overlapping portion (which may be referred to as a second overlapping portion), and the second overlapping portion may extend toward the direction close to the first frame edge to below the first sub-seal 2021. That is, at least one of the first frame edge and the end of the third frame edge close to the first sub-seal 2021 may have an overlapping portion, and the overlapping portion may extend to below the first sub-seal 2021.

[0068] The overlapping portion described above is shown as extending toward the inside of the second sub-sealing member 2022 . In other embodiments, the overlapping portion may also extend toward the outside of the second sub-sealing member 2022 .

[0069] Alternatively, if Figure 1 and Figure 2 As shown, a sealing surface 2013 may be provided on the first inner wall of the card holder slot 2011 . The sealing surface 2013 may be recessed toward the outer side of the mounting bracket 201 , and at least a portion of the first sub-seal 2021 may be attached to the sealing surface 2013 .

[0070] Specifically, Figure 2 As shown, the two ends of the sealing surface 2013 may have arc-shaped transition surfaces 20131, respectively, and the two ends of the sealing surface 2013 may be connected to the first inner wall through the arc-shaped transition surfaces 20131. The first sub-seal 2021 may include a main body and extensions located at both ends of the main body. The main body of the first sub-seal 2021 may be attached to the sealing surface 2013, and the extensions at each end of the first sub-seal 2021 may be attached to the corresponding transition surface 20131, and further extend to the first inner wall along the length direction of the first sub-seal 2021. In a specific implementation, the length of the sealing surface 2013 may be substantially equal to the length of the trouser hole 2012, and the centers of the sealing surface 2013 and the trouser hole 2012 along the length direction may be aligned. That is, the arc-shaped transition surface 20131 may be aligned with the end of the trouser hole 2012. In other embodiments, the arc-shaped transition surface 20131 may also be located only at one end of the sealing surface 2013 .

[0071] When the card tray mounting assembly 200 of the present invention is not assembled into an electronic device, one end of the first sub-seal 2021 close to the card pin hole 2015 may also be aligned with the end of the sealing surface 2013. At this time, there may be a certain gap between the two ends of the first sub-seal 2021 and the second sub-seal 2022. When the card tray mounting assembly 200 is assembled into the electronic device, the first sub-seal 2021 and the second sub-seal 2022 are respectively squeezed and deformed by other matching structures, and then the two ends of the first sub-seal 2021 and the second sub-seal 2022 can be respectively connected together.

[0072] Further, the lower end of the sealing surface 2013 (i.e., the side close to the bracket hole 2012) may have a sealing step, and the lower end of the first sub-seal 2021 is supported by the top surface of the sealing step. That is, there may be a certain distance between the lower end of the sealing surface 2013 and the top end of the bracket hole 2012, the sealing surface 2013 may be recessed toward the outer side of the mounting bracket 201 relative to the first inner wall at the certain distance, and the lower end of the main body of the first sub-seal 2021 is connected to the lower end of the sealing surface 2013.

[0073] Alternatively, if Figure 1 and Figure 3 As shown, a sealing step 2014 may be provided on the second inner wall of the card holder slot 2011 , and the second sub-sealing member 2022 may be supported by the top surface of the sealing step 2014 .

[0074] In a specific implementation, the second inner wall of the card tray slot 2011 may have a plurality of sealing steps 2014, and the plurality of sealing steps 2014 may be arranged at intervals on the second inner wall. Alternatively, the second inner wall of the card tray slot 2011 may have only one sealing step 2014, and the sealing step 2014 may extend continuously along the second inner wall of the card tray slot 2011.

[0075] Figure 3 The example shown is that the sealing step 2014 extends outward relative to the second inner wall of the card tray slot 2011. In a specific implementation, the sealing step 2014 can also extend toward the inner side of the card tray slot 2011 relative to the second inner wall of the card tray slot 2011. Exemplarily, the second inner wall of the card tray slot 2011 can have a protrusion protruding toward the inner side of the card tray slot 2011. The protrusion is oriented perpendicular to the second inner wall, so that the protrusion and the second inner wall located above the protrusion (i.e., the side away from the bottom of the card tray slot 2011) can form a sealing step, and the second sub-seal 2022 can be supported by the upper end surface of the protrusion. There are many ways to set the sealing step 2014. In a specific implementation, the setting method of the sealing step 2014 can be adapted to the shape of the peripheral structure of the card tray slot 2011.

[0076] Compared with the traditional card tray installation assembly, the shape and installation method of the first sealing member 202 provided by the present disclosure are easier to assemble, which effectively improves the installation efficiency of the card tray installation assembly 200 and the electronic device. In addition, the first sealing member 202 provided by the present disclosure will not affect the assembly of the card tray body 400, resulting in the problem that the card tray body 400 is difficult to plug and unplug, and there will be no problems such as flanging during the assembly process of the card tray body 400. The sealing effect is good, which improves the quality of products such as the card tray installation assembly 200 and electronic devices.

[0077] like Figure 4 and Figure 5 As shown, when the card tray installation assembly 200 provided by the present disclosure is assembled into an electronic device, the opening side of the card tray slot 2011 may be covered with the mainboard 500, one side end surface of the mainboard 500 may be pressed against the sealing surface 2013 through the first sub-seal 2021, and the lower end surface of the mainboard 500 may be pressed against the sealing step 2014 through the second sub-seal 2022. Therefore, the second sub-seal 2022 may be squeezed and deformed by the mainboard 500 in the thickness direction of the mounting bracket 201, and the first sub-seal 2021 may be squeezed and deformed by the mainboard 500 in the direction perpendicular to the thickness direction of the mounting bracket 201.

[0078] Since the first subseal 2021 and the second subseal 2022 have different setting positions and extrusion deformation directions, optionally, the height of the first subseal 2021 in the thickness direction of the mounting bracket 201 may be greater than the height of the second subseal 2022 in the thickness direction of the mounting bracket 201 .

[0079] The first sub-seal 2021 is disposed at the installation gap between the mounting bracket 201 and the mainboard 500 perpendicular to the thickness direction of the mounting bracket 201, so increasing the height of the first sub-seal 2021 in the thickness direction of the mounting bracket 201 can effectively seal the installation gap, preventing the corrosive medium in the card holder slot 2011 from entering the interior of the electronic device through the installation gap. The height of the first sub-seal 2021 in the thickness direction of the mounting bracket 201 may not be less than the thickness of the mainboard 500 on the side close to the sealing surface 2013.

[0080] The second sub-seal 2022 is arranged between the card holder slot 2011 and the installation gap of the main board 500 along the thickness direction of the installation bracket 201. In order to prevent the main board 500 from being lifted up and affecting the coordination with other structures, the height of the second sub-seal 2022 in the thickness direction of the installation bracket 201 can be reduced on the basis of ensuring the sealing performance of the card holder slot 2011.

[0081] Optionally, the material of the first sealing member 202 may be foam. Compared with traditional silicone materials, foam has stronger deformation ability and is less likely to cause problems such as increased appearance gap or flange.

[0082] Optionally, the first sealing member 202 is attached to the mounting bracket 201 by gluing. In a specific implementation, glue can be applied on the back of the first sealing member 202, and the first sealing member 202 is attached to the mounting bracket 201 by glue to fix the position of the first sealing member 202.

[0083] The card tray mounting assembly 200 provided in the embodiment of the present disclosure isolates the area where the card tray slot 2011 is located from other areas of the mounting bracket 201 through a first sealing member 202 surrounding the card tray slot 2011, so that when the card tray mounting assembly 200 is assembled in an electronic device, it is difficult for the corrosive medium in the card tray slot 2011 to enter the interior of the electronic device through the first sealing member 202.

[0084] In a specific electronic device, taking a mobile phone as an example, the card tray installation assembly 200 can be located on the middle frame body 300 of the electronic device. In a specific implementation, the mounting bracket 201 in the card tray installation assembly 200 can be a part of the middle frame body 300, or the mounting bracket 201 can be installed on the middle frame body 300.

[0085] Alternatively, if Figure 4 and Figure 5 As shown, the electronic device may further include a card holder body 400 and a mainboard 500. The card holder body 400 may have a chip card, and the card holder body 400 may extend into the card holder slot 2011 through the card holder hole 2012 so that the chip card is accommodated in the card holder slot 2011. The mainboard 500 may cover the opening side of the card holder slot 2011 and may be electrically connected to the chip card. The first sealing member 202 may be respectively attached to the mainboard 500 and the mounting bracket 201 to seal the gap between the mainboard 500 and the mounting bracket 201.

[0086] Specifically, the first sub-seal 2021 may be attached to the first inner wall of the card holder slot 2011 and located above the card holder hole 2012. The second sub-seal 2022 may be attached to the periphery of the second inner wall of the card holder slot 2011.

[0087] The electronic device provided by the present disclosure seals the gap between the mainboard 500 and the mounting bracket 201 by means of a first sealing member 202 surrounding the card tray slot 2011, so as to isolate the area where the card tray slot 2011 is located from other areas of the mounting bracket 201, thereby making it difficult for the corrosive medium in the card tray slot 201 to enter the interior of the electronic device through the first sealing member 202.

[0088] Alternatively, if Figure 5 As shown, the second sub-seal 2022 can be squeezed and deformed by the main board 500 in the thickness direction of the mounting bracket 201. The first sub-seal 2021 can be squeezed and deformed by the main board 500 in the direction perpendicular to the thickness direction of the mounting bracket 201.

[0089] In a specific implementation, the electronic device may further include an upper bracket 600 and a battery cover 700. The upper bracket 600 may be located above the mainboard 500 (i.e., on a side away from the card holder slot 2011) to press the mainboard 500 onto the mounting bracket 201. The battery cover 700 covers the outside of the mounting bracket 201 and the upper bracket 600. The battery cover 700 is provided with an opening at a position corresponding to the card holder hole 2012, and the opening may penetrate the side wall of the electric cover 7 so that the card holder body 400 extends through the opening into the card holder hole 2012 and the card holder slot 2011.

[0090] The first sub-seal 2021 may be disposed between the mounting bracket 201 and the mounting gap of the mainboard 500 perpendicular to the thickness direction of the mounting bracket 201. The height of the first sub-seal 2021 in the thickness direction of the mounting bracket 201 may not be less than the thickness of the mainboard 500 on the side close to the sealing surface 2013, so as to fully seal the mounting gap between the mounting bracket 201 and the mainboard 500. There may be a certain distance between the upper end surface of the first sub-seal 2021 and the battery cover 700, that is, the height of the first sub-seal 2021 in the thickness direction of the mounting bracket 201 may be slightly lower than the sum of the thickness of the mainboard 500 and the upper bracket 600 on the side close to the sealing surface 2013, so as to prevent the first sub-seal 2021 from lifting the battery cover 700.

[0091] Optionally, the first inner wall of the card tray slot 2011 may also have a card pin hole 2015, which can connect the card tray slot 2011 and the outside of the mounting bracket 201, and the card pin hole 2015 can be located below the first sealing component 202, that is, the card pin hole 2015 can be located between the first sealing component 202 and the bottom of the card tray slot 2011.

[0092] In a specific implementation, the position of the transition surface 20131 can be aligned with the end of the card holder hole 2012, so that the main part of the first sub-seal 2021 can be located above the card holder hole 2012, and the extension part of one end of the first sub-seal 2021 can be located above the card pin hole 2015, so as to seal the card holder slot 2011 and the mainboard 500 as a whole. Even if the card holder hole 2012 itself is not well sealed, and the external corrosive medium enters the interior of the card holder slot 2011 through the card holder hole 2012, the first seal 202 can also block the corrosive medium in the card holder slot 2011, and it will not enter the interior of the electronic device through the card holder slot 2011.

[0093] Compared with the traditional card tray installation assembly, by setting the card pin hole 2015 below the first sealing member 202, the sealing structure for the card tray hole can be omitted.

[0094] Alternatively, if Figure 4 and Figure 5As shown, in order to prevent external corrosive media from entering the interior of the electronic device through the installation gap between the battery cover 700 and the mounting bracket 201, the above-mentioned card tray mounting assembly 200 may also include a second sealing member 203. The second sealing member 203 may be attached between the battery cover 700 and the mounting bracket 201.

[0095] In a specific implementation, the second seal 203 may be an arc-shaped seal to adapt to the shape of the inner wall of the battery cover 700. The second seal 203 may be arranged corresponding to the sealing surface 2013, that is, the second seal 203 may be arranged outside the side wall where the sealing surface 2013 is located.

[0096] like Figure 6 and Figure 7 As shown, the electronic device may further include a screen 1000, a screen accessory 900, a middle frame accessory 800, and a buffer 1100. The card tray slot 2011 may be formed on the middle frame body 300, and the screen 1000 may be located on one side of the slot bottom of the card tray slot 2011. The middle frame accessory 800 may be surrounded on the outside of the edge of the middle frame body 300, the screen accessory 900 may be surrounded on the outside of the edge of the screen 1000, and the middle frame accessory 800 and the screen accessory 900 may be connected together in the thickness direction of the electronic device. The buffer 1100 may be embedded in the outer side of the corner of the electronic device, and the first part 1101 of the buffer 1100 may be exposed from the middle frame accessory 800, and the second part 1102 may be exposed from the screen accessory 900.

[0097] In the present disclosure, when the electronic device is assembled, along the thickness direction of the electronic device, the direction from the battery cover 700 to the screen 1000 is from top to bottom, and the battery cover 700, the middle frame accessory 800, the screen accessory 900 and the screen 1000 can be observed from the outside of the electronic device from top to bottom. The outer side surface of the corner of the electronic device may be composed of at least the outer side surfaces of the corners of the middle frame accessory 800 and the screen accessory 900.

[0098] The electronic device may have four corner outer sides, and each corner outer side may be provided with a buffer 1100. In a specific implementation, the buffer 1100 may be provided at a position selected as required.

[0099] When an electronic device falls from a height, the corners of the electronic device are at a greater risk of being hit. The middle frame attachment 800 and the screen attachment 900 may be deformed or even damaged when hit, and the deformation stress may be further transmitted to the inside of the electronic device, which may cause the components inside the electronic device to fail, and squeeze the screen 1000, causing the screen 1000 to break and fail.

[0100] In the related art, the impact deformation of the electronic device is often reduced by increasing the strength of the middle frame body 300 and the middle frame accessory 800, or increasing the gap between the middle frame body 300 and the middle frame accessory 800 and other structures to avoid device and screen failure caused by impact. However, the above solutions cannot effectively avoid the problem of deformation and cracking of electronic devices caused by impact.

[0101] In the present disclosure, the buffer 1100 is embedded in the outer side of the corner of the electronic device, and a portion of the buffer 1100 is exposed from the middle frame accessory 800 and the screen accessory 900 respectively. In this way, when the electronic device falls from a height, the buffer 1100 is hit first, which can effectively cushion the impact force on the electronic device, thereby effectively avoiding device and screen failure caused by the impact.

[0102] In addition, the first part 1101 and the second part 1102 of the buffer 1100 can be exposed from the middle frame accessory 800 and the screen accessory 900 respectively, so that the buffer 1100 can play a role in connecting the middle frame accessory 800 and the screen accessory 900, so that zero gap assembly can be achieved between the middle frame accessory 800 and the screen accessory 900, and the buffer 1100 can also effectively prevent the middle frame accessory 800 and the screen accessory 900 from being separated due to impact.

[0103] In the present disclosure, the material of the middle frame body 300 can generally be alloy, the material of the middle frame attachment 800 can generally be plastic, and the buffer 1100 can be liquid silicone with strong deformation ability. The first part 1101 and the second part 1102 in the buffer 1100 can be independently provided or integrally formed.

[0104] In a specific implementation, the outer side surface of the corner of the electronic device may generally be an arc, and the arc has a highest point, and all the highest points on the outer side surface of the corner may be located on an arc line. In other words, there is a position located at the outermost side in the outer side surface of the corner. The outermost position is most susceptible to impact relative to other positions, so the buffer 1100 can extend a certain distance to both sides with the outermost position as the center point. That is, the first part 1101 and the second part 1102 of the buffer 1100 can be exposed from the outermost positions of the middle frame attachment 800 and the screen attachment 900, respectively, to ensure that when the electronic device falls from a height, the first part 1101 and the second part 1102 of the buffer 1100 are hit first. The width of the buffer 1100 may be no less than one-fourth of the arc of the outer side surface of the corner to fully protect the position of the electronic device that is vulnerable to impact.

[0105] Alternatively, along the thickness direction of the electronic device, the area from the outer side of the battery cover 700, through the middle frame attachment 800 and the screen attachment 900 to the outer side of the screen 1000 may also be an arc, and the arc may also have a highest point, and all the highest points on the arc area may be located on an arc line. The arc line where the highest point on the outer side of the corner is located and the arc line where the highest point of the arc area is located may have an intersection. The buffer 1100 may cover the area determined by a circle with a radius of 0.5 mm and the intersection as the center.

[0106] Alternatively, if Figure 8 As shown, the outer side of the middle frame attachment 800 may have a first assembly groove 801, and the side of the first assembly groove 801 close to the screen attachment 900 may have a first through hole 802. The outer side of the screen attachment 900 may have a second assembly groove 901, and the side of the second assembly groove 901 close to the middle frame attachment 800 may have a second through hole 902. The buffer 1100 may pass through the first through hole 802 and the second through hole 902, and the first part 1101 of the buffer 1100 may be located in the first assembly groove 801, and the second part 1102 may be located in the second assembly groove 901.

[0107] In a specific implementation, the middle frame body 300 and the middle frame accessory 800 can be combined together by injection molding, and the middle frame body 300 is embedded in the inner side of the middle frame accessory 800. The screen accessory 900 can be fixed to the middle frame accessory 800 by glue dispensing, and the buffer 1100 can be injected into the first assembly groove 801 and the second assembly groove 901 by injection molding, so that the buffer 1100 and the middle frame accessory 800 and the screen accessory 900 are connected to each other.

[0108] like Figure 7 and Figure 8 As shown, the upper end surface of the screen attachment 900 (i.e., the end surface connected to the middle frame attachment 800) may have a protrusion 903, and the protrusion 903 faces the direction of the middle frame attachment 800. Correspondingly, the middle frame attachment 800 has a recessed portion adapted to the protrusion 903. When the middle frame attachment 800 and the screen attachment 900 are assembled together, the protrusion 903 can extend into the recessed portion.

[0109] The buffer 1100 may further include a transition portion 1103, which may be located in the first through hole 802 and the second through hole 902, so that the transition portion 1103 may abut against the screen accessory 900 to protect the screen accessory 900. Figure 8 As shown, a portion of the second through hole 902 is located on the protrusion 903 , so that the transition portion 1103 can abut against the protrusion 903 .

[0110] The opening side of the first assembly groove 801 may face the outside of the middle frame attachment 800, and the groove bottom of the first assembly groove 801 may be located on the middle frame attachment 800. The opening side of the second assembly groove 901 may face the lower end of the screen attachment 900, that is, the side away from the middle frame attachment 800, and the second through hole 902 may be located at the groove bottom of the second assembly groove 901, so that the second part 1102 of the buffer 1100 can continue to extend downward to cover a part of the screen 1000. Alternatively, the opening side of the second assembly groove 901 may also face the outside of the screen attachment 900, the second through hole 902 may be located on the side wall of the second assembly groove 901, and the groove bottom of the second assembly groove 901 may be located on the inner side of the screen attachment 900 (that is, the side close to the edge of the screen 1000).

[0111] Alternatively, if Fig. 9 As shown, there may be a gap d between the buffer 1100 and the screen 1000. By way of example, the gap d may be 0.03 mm.

[0112] The second portion 1102 of the buffer 1100 is connected to the screen 1000 at one end away from the middle frame attachment 800. In a specific implementation, the second portion 1102 of the buffer 1100 may protrude a certain distance h relative to the screen 1000, so that the buffer 1100 can cover at least a portion of the screen 1000, thereby effectively preventing the screen 1000 from being hit. Exemplarily, the distance h may be not less than 0.1 mm.

[0113] The above embodiments are described using a mobile phone as an example. However, the electronic device provided by the present disclosure may also be any electronic device such as a tablet computer, a laptop computer, a computer, a television, a camera, etc.

[0114] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0115] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the claims above.

[0116] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that: The electronic device comprises a card tray mounting assembly (200), wherein the card tray mounting assembly (200) comprises a mounting bracket (201) and a first sealing member (202); The mounting bracket (201) has a card holder slot (2011), a first inner wall of the card holder slot (2011) has a card holder hole (212), the first inner wall is close to the outer side of the mounting bracket (201), and the card holder hole (212) communicates the card holder slot (2011) and the outer side of the mounting bracket (201); The first sealing member (202) is attached to the mounting bracket (201) and surrounds the card holder slot (2011), and is used to isolate the area where the card holder slot (2011) is located from other areas of the mounting bracket (201). The first sealing member (202) comprises a first sub-seal (2021) and a second sub-seal (2022); the first sub-seal (2021) is strip-shaped and attached to the first inner wall, and the first sub-seal (2021) is located on a side of the card holder hole (2012) away from the bottom of the card holder slot (2011); the second sub-seal (2022) is frame-shaped with a notch and attached to a surface adjacent to a side of the second inner wall of the card holder slot (2011) away from the bottom of the slot, the second inner wall being an inner wall of the card holder slot (2011) other than the first inner wall, wherein the second inner wall has a sealing step (2014), and the second sub-seal (2022) is supported by the top surface of the sealing step (2014); the first sub-seal (2021) and the second sub-seal (2022) are connected at both ends respectively, The first inner wall also has a card pin hole (2015), the card pin hole (2015) communicating with the card tray slot (2011) and the outer side of the mounting bracket (201), and the card pin hole (2015) is located between the first sub-seal (2021) and the bottom of the card tray slot (2011).

2. The electronic device according to claim 1, characterized in that: The first inner wall has a sealing surface (2013), the sealing surface (2013) is recessed toward the outside of the mounting bracket (201), and at least a portion of the first sub-seal (2021) is attached to the sealing surface (2013).

3. The electronic device according to claim 1, characterized in that: The height of the first sub-sealing member (2021) in the thickness direction of the electronic device is greater than the height of the second sub-sealing member (2022) in the thickness direction of the electronic device.

4. The electronic device according to claim 1, characterized in that: The card tray mounting assembly further comprises a second sealing member (203), and the electronic device further comprises a battery cover (700); The battery cover (700) covers the outside of the mounting bracket (201), and the second sealing member (203) is attached between the battery cover (700) and the mounting bracket (201).

5. The electronic device according to any one of claims 1 to 4, characterized in that: The card tray mounting assembly is located on the middle frame (300) of the electronic device, and the electronic device further comprises a card tray body (400) and a mainboard (500); The card tray body (400) has a chip card on it, and the card tray body (400) extends through the card tray hole (2012) into the card tray slot (2011), so that the chip card is accommodated in the card tray slot (2011); The main board (500) covers the opening side of the card tray slot (2011), and the main board (500) is electrically connected to the chip card; The first sealing member (202) is respectively fitted to the main board (500) and the mounting bracket (201) to seal the gap between the main board (500) and the mounting bracket (201).

6. The electronic device according to claim 5, characterized in that: The electronic device further comprises a screen (1000), a screen accessory (900), a middle frame accessory (800) and a buffer component (1100); The card tray slot (2011) is formed on the middle frame (300), and the screen (1000) is located on one side of the slot bottom of the card tray slot (2011); The middle frame accessory (800) surrounds the outer side of the edge of the middle frame (300), the screen accessory (900) surrounds the outer side of the edge of the screen (1000), and the middle frame accessory (800) and the screen accessory (900) are connected together in the thickness direction of the electronic device; The buffer component (1100) is embedded in the outer side of the corner of the electronic device, and the first part (1101) of the buffer component (1100) is exposed from the middle frame attachment (800), and the second part (1102) is exposed from the screen attachment (900).

7. The electronic device according to claim 6, characterized in that: The outer side surface of the middle frame attachment (800) is provided with a first assembly groove (801), and the first assembly groove (801) has a first through hole (802) on a side close to the screen attachment (900); The outer side surface of the screen attachment (900) is provided with a second assembly groove (901), and the side of the second assembly groove (901) close to the middle frame attachment (800) is provided with a second through hole (902); The buffer member (1100) passes through the first through hole (802) and the second through hole (902), and the first portion (1101) of the buffer member (1100) is located in the first assembly groove (801), and the second portion (1102) is located in the second assembly groove (901).

8. The electronic device according to claim 6, characterized in that: There is a gap between the buffer member (1100) and the screen (1000); One end of the second portion (1102) of the buffer component (1100) away from the middle frame attachment (800) is connected to the screen (1000).

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