Loudspeaker with multiple resonators

Abstract

This disclosure relates to speakers with multiple resonators. Aspects of the subject technology relate to electronic devices with speakers with resonators acoustically coupled to a front cavity of the speaker, such as a Helmholtz resonator. A speaker module for an electronic device can include multiple resonators, including a first resonator acoustically separated from and at least partially disposed within a second resonator. An acoustic barrier between the first and second resonators can have a different liquid resistance than a liquid disposed between the first resonator and a back cavity of the speaker module and / or between the speaker and an external environment. In one or more implementations, a third resonator can be provided that is spatially separated from the first and second nested and / or adjacent resonators.

Description

TECHNICAL FIELD

[0001] This specification generally relates to audio transducers for electronic devices, including, for example, loudspeakers having multiple resonators. BACKGROUND

[0002] Electronic devices, such as computers, media players, cellular telephones, wearable devices, and earphones, are often provided with loudspeakers for generating sound output from the device. However, particularly as devices are implemented in smaller and smaller form factors, and as users demand higher quality audio, it can be challenging to provide loudspeakers that generate high quality sound, particularly in compact devices such as portable electronic devices. BRIEF DESCRIPTION OF DRAWINGS

[0003] Some features of the subject technology are set forth in the appended claims. However, for purpose of explanation, several aspects of the subject technology are set forth in the following figures.

[0004] Figure 1 A perspective view of an example electronic device having an audio transducer with multiple resonators is shown in accordance with various aspects of the subject technology.

[0005] Figure 2 A cross-sectional side view of a portion of an example electronic device having an audio transducer module with multiple resonators is shown in accordance with various aspects of the subject technology.

[0006] Figure 3 A top view of an audio transducer module having multiple resonators is shown in accordance with various aspects of the subject technology, with a top wall of an enclosure of the module removed.

[0007] Figure 4 A cross-sectional side view of an audio transducer module including acoustically separated, spatially nested resonators is shown in accordance with various aspects of the subject technology.

[0008] Figure 5 A bottom perspective cross-sectional view of a portion of an audio transducer module of Figure 4 is shown in accordance with various aspects of the subject technology.

[0009] Figure 6 A cross-sectional side view of an additional resonator for an audio transducer module is shown in accordance with various aspects of the subject technology.

[0010] Figure 7 A top view of a portion of an audio transducer module having multiple resonators is shown in accordance with various aspects of the subject technology, with a top wall of an enclosure of the module removed.

[0011] Figure 8An electronic system that can be used to implement one or more implementations of the subject technology is shown. DETAILED DESCRIPTION

[0012] The detailed description set forth below is intended as a description of various configurations of the subject technology and is not intended to represent the only configurations in which the subject technology can be practiced. The appended drawings are incorporated herein and constitute a part of the detailed description. The detailed description includes specific details for the purpose of providing a thorough understanding of the subject technology. However, it will be clear and apparent to those skilled in the art that the subject technology is not limited to the specific details set forth herein and can be practiced without some of the specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts of the subject technology.

[0013] Portable electronic devices, such as mobile phones, portable music players, tablet computers, laptop computers, wearable devices, such as smart watches, earphones, earbuds, or other wearable electronic devices, and the like, often include one or more audio transducers, such as microphones, or speakers for generating sound.

[0014] However, when attempting to implement an audio transducer module (e.g., a speaker module or a speaker) in a device, challenges can arise when constraints on spatial integration with other device components, liquid resistance, and / or other constraints compete with audio quality constraints. These challenges can be particularly difficult when attempting to implement an audio transducer module into a compact device, such as a portable device or a wearable device.

[0015] For example, to accommodate spatial constraints, a speaker can be provided with an extended path length from the transducer to a sound outlet port. However, such an extended path length can result in undesirable peaks and / or roll-off in the mid- and / or high-frequency range response of the module.

[0016] According to various aspects disclosed in this subject matter, a loudspeaker module (loudspeaker) may be provided with multiple resonators (e.g., Helmholtz resonators or HHR), each resonator having a corresponding frequency. For example, a loudspeaker module may include a first resonator acoustically coupled to the front cavity of the loudspeaker module, which addresses the mid-range frequency response of the loudspeaker module (e.g., between about 2 kHz and 4 kHz) (e.g., reducing undesired frequency response peaks in this mid-range frequency response). In one or more embodiments, the loudspeaker module may also include a second and / or a third resonator, which mitigate the roll-off of the loudspeaker module's frequency response in a relatively high frequency range (e.g., above about 8 kHz), such as by redistributing energy and sound pressure levels from about 8 kHz and / or attenuating them to a wider frequency band. In one or more embodiments, the loudspeaker module may include a first and a second resonator that are spatially nested and have independent entry points on the rear side of the front cavity of the loudspeaker module.

[0017] According to the various aspects disclosed in this subject matter, a loudspeaker for an electronic device can be provided, which has a flat response at high frequencies while maintaining the fluid resistance of the device. In one or more specific embodiments, a first resonator and a second resonator (e.g., a Helmholtz resonator) are provided, the first and second resonators including respective adjacent ports to the front cavity of the loudspeaker. The chamber for the first resonator and the channel between the port and the chamber may be at least partially embedded or nested in the chamber of the second resonator and acoustically separated from the chamber of the second resonator. A third resonator may also be provided, which may be adjacent to and / or nested within the first and / or second resonators, or spatially separated from the first and second resonators.

[0018] Figure 1 The image shows an exemplary electronic device including a speaker. Figure 1 In the example, device 100 (e.g., electronic device) has been implemented using a housing that is small enough to be portable and carried by the user (e.g., Figure 1 The device 100 may be a handheld electronic device such as a tablet computer, cellular phone, or smartphone. Figure 1 As shown, device 100 includes a display such as display 110 mounted on the front of housing 106. Device 100 includes one or more input / output devices (such as a touchscreen integrated into display 110), buttons or switches (such as button 104), and / or other input / output components disposed above or behind display 110 or disposed above or behind other portions of housing 106. Display 110 and / or housing 106 include one or more openings to accommodate button 104, a speaker, a light source, or a camera.

[0019] In Figure 1 example, the housing 106 includes two openings 108 on a bottom sidewall of the housing 106. One or more of the openings 108 form a port for an audio component. For example, one of the openings 108 can form a speaker port for a speaker disposed within the housing 106, and another of the openings 108 can form a microphone port for a microphone disposed within the housing 106. The openings 108 can be open ports, or can be completely or partially covered with a permeable membrane or mesh structure that allows air and sound to pass through the openings. Although two openings 108 are shown in Figure 1 , this is merely illustrative. One opening 108, two openings 108, or more than two openings 108 can be provided on the bottom sidewall (as shown), on another sidewall (e.g., a top sidewall, a left side sidewall, or a right side sidewall), on a rear surface of the housing 106, and / or on a front surface of the housing 106 or the display 110. In some implementations, one or more sets of openings 108 in the housing 106 can align with a single port of an audio component within the housing 106. The housing 106, which can sometimes be referred to as a case, can be formed of plastic, glass, ceramic, fiber composite, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of any two or more of these materials.

[0020] Figure 1 The configuration of the device 100 is merely illustrative. In other implementations, the device 100 can be a computer, such as a computer integrated into a display (such as a computer monitor), a laptop computer, a wearable device (such as a smartwatch, a pendant device, or other wearable or micro device), a media player, a gaming device, a navigation device, a computer monitor, a television, a headset, an earbud, or other electronic equipment.

[0021] In some implementations, the device 100 can be provided in the form of a wearable device, such as a smartwatch. In one or more implementations, the housing 106 can include one or more interfaces for mechanically coupling the housing 106 to a strap or other structure for securing the housing 106 to a wearer. The device 100 can include one, two, three, or more than three audio components each mounted adjacent to one or more of the openings 108.

[0022] A speaker disposed within the housing 106 transmits sound through at least one associated opening 108. A microphone can also be disposed within the housing 106 that receives sound through at least one associated opening in the housing 106. In one or more implementations, a speaker module can be mounted such that an output port of the speaker module is mounted adjacent to and in alignment with a corresponding opening 108. The speaker module can include a front cavity, a back cavity, and a plurality of resonators, as described in further detail below.

[0023] Figure 2 A cross-sectional view of a portion of the device 100 in which an audio component is mounted is shown. In Figure 2 In the example shown, the device 100 includes a speaker module 200. The speaker module 200 includes a housing 202 (e.g., a speaker housing) that is mounted adjacent to at least one opening 108 in the housing 106. The housing 202 can be formed of one or more materials, such as plastic or metal. As shown, the speaker module 200 can include a front cavity 208 and a back cavity 212 that are separated by a structure 210. The structure 210 can include a diaphragm 214 that is capable of being actuated to produce sound, and an inner wall 216 that at least partially separates the front cavity 208 and the back cavity 212.

[0024] As shown, the speaker module 200 can include an output port 211 that is acoustically coupled to the front cavity 208 and that is aligned with and mounted adjacent to the opening 108, such that sound produced by the diaphragm 214 (e.g., in response to a control signal received from a control circuit, such as the device circuitry 299) can be transmitted through the opening 108 to an external environment. For example, the output port 211 can be sealed to the opening 108 using a sealing material 279. The opening 108 can be an open port or can include a cover 289 (such as a membrane or mesh structure) that prevents debris and / or liquid from entering through the opening 108, but that is permeable to sound and air. In one or more implementations, the device 100 can not be provided with a cover, or the cover 289 can not prevent liquid from entering through the opening 108. As described in further detail below, the speaker module 200 can be provided with a seal (e.g., a waterproof or water-resistant seal) at any interface that separates the front cavity 208 from the back cavity 212 or that separates the front cavity 212 from an internal cavity of the device (e.g., a cavity within the housing 106 of the device in which the speaker module 208 is disposed). Circuitry 221 of the speaker module 200 (e.g., including a voice coil for actuating the diaphragm 214 to produce sound) can be coupled to device circuitry, such as the device circuitry 299 (e.g., one or more processors of the device) via a connector 215. The connector 215 can include a flexible integrated circuit or another flexible or rigid conductive connector.

[0025] As Figure 2As shown, the front cavity 208 is partially defined by the top wall 204 of the housing 202 for the speaker module 200, and partially by the inner wall 216, which at least partially separates the front cavity 208 from the rear cavity 212 within the housing. As shown, the rear cavity 212 is partially defined by the inner wall 216 and the rear wall 206 of the housing 202.

[0026] like Figure 2 As shown, the loudspeaker module 200 may include a first port 218 in an inner wall 216 and a second port 220 in an inner wall 216. A first resonator chamber 222 may be acoustically coupled to the front cavity 208 via the first port 218 and may be at least partially defined by a structure 217 that separates the first resonator chamber 222 from the rear cavity 212 and / or from the external environment of the loudspeaker module 200. Figure 2 In one example, the speaker module includes a gap between structure 217 and the rear wall 206 of housing 202, which is fluidly coupled to the rear cavity 212. However, in other embodiments, the first resonator chamber 222 may extend into and be partially defined by a portion of the rear wall 206.

[0027] The loudspeaker module 200 may also include a second resonator chamber 224, which is acoustically coupled to the front cavity 208 via a second port 220 and is acoustically separated from the first resonator and disposed within the first resonator chamber 222. For example, configuration 219 may acoustically separate the first resonator chamber 222 from the second resonator chamber 224, which is at least partially disposed within the first resonator chamber 222.

[0028] For simplicity, the first resonator chamber 222 and the second resonator chamber 224 are in Figure 2 The diagram shows direct coupling to the front cavity 208 via corresponding first port 218 and second port 220. However, as described in further detail below, corresponding first and second channels (also referred to herein as necks) extending between the corresponding first and second ports and the corresponding first and second resonator chambers can be provided. In various specific embodiments, the dimensions (e.g., length, width, height, cross-sectional area, etc.) of the first and second channels can be arranged to provide desired frequency control of sound entering and / or exiting the corresponding first and second resonator chambers.

[0029] In one or more embodiments, a structure 217 separating the first resonator chamber 222 from the rear cavity 212 acoustically and fluidly separates the first resonator chamber 222 from the rear cavity 212. For example, structure 217 may provide a liquid-resistant seal (e.g., a waterproof rating of IPX7 or higher, or generally any IPX rating seal) between the first resonator chamber 222 and the rear cavity 212. If, for example, liquid from the external environment enters the front cavity 208 and / or the first resonator chamber 222 through opening 108 (e.g., if device 100 is exposed to water or another liquid or immersed in a liquid such as water), providing a liquid-resistant fluid seal between the first resonator chamber 222 and the rear cavity 212 helps protect the circuitry 221 of the speaker module 200 and / or the device circuitry 299 of the device from liquid damage.

[0030] It should also be understood that structure 217, which separates the second resonator chamber 224 from the first resonator chamber 222 by nesting the second resonator chamber 224 within the first resonator chamber 222, can have a less stringent sealing threshold than structure 219. For example, structure 217 may provide an acoustic separation between the second resonator chamber 224 and the first resonator chamber 222 while providing a less liquid-resistant seal (e.g., a seal with a waterproof rating less than IPX7), which in some cases may allow liquid to leak from the second resonator chamber 224 into the first resonator chamber 222. Because structure 219 provides a liquid-resistant seal between the first resonator chamber 222 and the rear cavity 212, even if liquid were to leak from the second resonator chamber 224 into the first resonator chamber 222, it will prevent the liquid from leaking into the rear cavity 212. In this way, the nested arrangement of the acoustically separated first resonator chamber 222 and the second resonator chamber 224 can improve the liquid resistance of the device while simplifying the manufacturing process and requirements.

[0031] like Figure 2 As shown, the speaker module 200 may also include a third port 226 in the inner wall 216. The third resonator chamber 228 may be acoustically coupled to the front cavity 208 via the third port 226 (e.g., and via a corresponding channel or neck extending between the third port 226 and the third resonator chamber 228).

[0032] In one or more embodiments, one or more resonator chambers in the resonator chamber of speaker module 200 may include pressure vents that allow air to pass between the resonator chamber and the rear cavity 212. For example, in Figure 2In particular embodiments, the third resonator chamber 228 is shown as having an air pressure vent 230 that allows air to pass between the third resonator chamber 228 and the back cavity 212 while preventing liquid from passing through the air pressure vent 230. However, this is merely illustrative, and the first resonator chamber 222, the second resonator chamber 224, and the third resonator chamber 228 can have no vent or other fluidic coupling to the back cavity 212.

[0033] In Figure 2 In the example shown, the first port 218 and the second port 220 for the first resonator chamber 222 and the second resonator chamber 224 are positioned adjacent to each other in the inner wall 216, and the third port 226 for the third resonator chamber 228 is spatially separated from the first port 218 and the second port 220.

[0034] For example, Figure 3 A top view of the speaker module 200 is shown, with the top wall 204 removed so that the example locations of the first port 218, the second port 220, and the third port 226 can be seen. In Figure 3 In the example shown, the top surface of the diaphragm 214 is visible, and the diaphragm 214 is coupled to the inner wall 216 by a surround 302 that allows the diaphragm 214 to actuate to produce sound in the front cavity 208 that is emitted from the output port 211. As Figure 3 The first port 218, the second port 220, and the third port 226 are shown as being positioned away from the output port 211 (e.g., in a region of the front cavity that would experience a pressure peak or maximum in the absence of the ports and the corresponding resonators) to improve the acoustic performance (e.g., efficiency in flattening the speaker response at the desired frequencies) of the corresponding resonators formed by the first resonator chamber 222, the second resonator chamber 224, and the third resonator chamber 228. Figure 3 The first port 218 and the second port 220 are also shown as being positioned adjacent to each other and above the nested first resonator chamber 222 and the second resonator chamber 224, and the third port 226 and the third resonator chamber 228 are spatially separated from the first port 218 and the second port 220.

[0035] As Figure 3As shown, the loudspeaker module 200 may include a first acoustic mesh 304 above the first port 218 and a second acoustic mesh 306 above the second port 220. As shown, the first acoustic mesh 304 may be spatially and acoustically separated from the second acoustic mesh 308. In this way, the mesh structures of the first acoustic mesh 304 and the second acoustic mesh 306 can be individually tuned to control (e.g., high frequencies) the sound input to and / or output from the first resonator chamber 222 and the second resonator chamber 224, respectively. In one or more embodiments, the loudspeaker module 200 may include a pressure vent 309, which is formed separately from the resonator and allows for airflow and / or pressure equalization between the front chamber 208 and the rear chamber 212 while preventing fluid from passing through the vent.

[0036] According to one or more specific implementations of the technology of this subject, it is possible to... Figure 3 The line AA is intercepted Figure 4 Additional features of the first and second resonators of the loudspeaker module 200 can be seen in the cross-sectional side view. For example... Figure 4 As shown, the speaker module may include a frame 400. A portion of the frame 400 may be formed, for example... Figure 2 and Figure 3 216. Inner wall.

[0037] like Figure 4 As shown, the first acoustic grid 304 can span the opening in the frame 400 corresponding to the first port 218, and the second acoustic grid 306 can span the opening in the frame 400 corresponding to the second port 220. Figure 4 The diagram also illustrates how the loudspeaker module 200 may include a first channel 410 extending between a first port 218 and a first resonator chamber 222, and a second channel 408 extending between a second port 220 and a second resonator chamber 224 (e.g., due to the cover structure 219) acoustically separated from the first channel 410. In this example, the second channel 408 is parallel to the first channel 410 and extends through a portion of the first resonator chamber 222 (e.g., through a portion of the same recess 444 forming the first resonator chamber 222).

[0038] like Figure 4As shown, the cover structure 219 can be a first cover structure that acoustically separates the first resonator chamber 222 from the second resonator chamber 224, acoustically separates the first passageway 410 from the second passageway 408, and has a first side 440 that defines a portion of the first passageway 410 and a second side 442 that defines a portion of the second passageway 408. In this example, the cover structure 219 is attached (e.g., using an adhesive, such as glue, or using another attachment material or mechanism) to the first flange 420 within the recess 444 in the frame 400 of the speaker module 200.

[0039] In this example, the structure 217 separating the first resonator chamber 222 from the back volume 212 (e.g., including the region 430 between the structure 217 and the back wall 206) acoustically and fluidically separates the first resonator chamber 222 from the back volume 212. For example, the structure 217 separating the first resonator chamber 222 from the back volume 212 can form a second cover structure for the first resonator chamber 222. The second cover structure can be attached by a liquid-proof seal to the second flange 422 within a recess in the frame of the speaker module (e.g., using a liquid-proof adhesive or other sealing attachment disposed between a protrusion on the structure 217 and the second flange 422, and forming a seal between the protrusion and the second flange that is rated IPX7 or greater). For example, the second flange 422 can have a width that is wider than a width of the first flange 420 to allow the liquid-proof seal between the protrusion on the structure 217 and the second flange 422 to be more robust than the acoustic seal between the cover structure 219 and the first flange 420.

[0040] In Figure 4 this example, the cover structure 219 also includes an extension structure 406. As shown, the extension structure 406 extends parallel to and is spatially separated from the first side 440. In this example, the first side 440 of the cover structure 219 defines a portion of the first passageway 410 on a first side of the first passageway 410, and the extension structure 406 defines a second side of the portion of the first passageway 410.

[0041] Figure 5 A bottom perspective view of a portion of the speaker module 200 of Figure 4 is shown, with a cross-section taken along the same line A-A and rotated one hundred and eighty degrees in the plane of the drawing with respect to Figure 3 In this example, the back wall 206 of the enclosure 202 and the structure 217 are removed for clarity. Figure 4 Figure 5 In this example, the back wall 206 of the enclosure 202 and the structure 217 are removed for clarity. Figure 5 ​The speaker module 200 is shown to include a frame 400, an aspect of which a first resonator chamber 222 is formed in part by a recess 444 in the frame 400, which is acoustically coupled to the front cavity 208 and fluidly separated from the rear cavity 212 (e.g., when the structure 217 is sealed to the second flange 422, such as by using a liquid-resistant adhesive, ultrasonic welding or another sealing attachment).

[0042] Figure 5 The bottom perspective view also provides a view of a portion of the second resonator chamber 224, which is acoustically coupled to the front cavity 208 and is acoustically separated from and disposed within the first resonator chamber 222 (e.g., within the recess 444 that also forms the first resonator chamber 222). Figure 5 Additional features of the cover structure 219 for the second resonator chamber 224 are also shown. As shown, when installed, the cover structure 219 may be disposed within a recess 444 in the frame 400 and may have a first side 440 defining a first channel 410 between the front cavity 208 and the first resonator chamber 222, and a second side 442 defining a second channel 408 between the front cavity 208 and the second resonator chamber 224. Figure 5 As shown, the cover structure 219 can be attached to the frame 400 within the recess 444 using an acoustic seal (e.g., between the first flange 420 and one or more protrusions 500 on the structure 219). The acoustic seal between the first flange 420 and the protrusions 500 may have a greater effect than the liquid-resistant seal used for the structure 219 (the liquid-resistant seal between the flange 422 and one or more protrusions on the structure 217, which...). Figure 5 (Not shown in the image) Liquid resistance is small.

[0043] Figure 6 A cross-sectional side view of a portion of the speaker module 200 is shown, with the cross-section passing through the third resonator chamber 228 and the third port 226. As shown, the third resonator chamber 228 may be formed by a recess 604 in the frame 400, which does not reach the rear cavity 212 or any other internal cavity within the speaker module or any device in which the speaker module may be embedded. For this reason, the third resonator chamber 228 may be provided without a separate cover between the third resonator chamber and the rear cavity.

[0044] exist Figure 6 In the example, the third resonator chamber 228 may be partially defined by a cover 602 disposed between the third resonator chamber 228 and the front cavity 208. The cover 602 may be formed of, for example, metal (e.g., steel, aluminum, or a combination of metals) and may also partially define a channel 600 extending from the third port 226 to the third resonator chamber 228. Figure 3 and Figure 6In the example, the third port 226 is covered by an acoustic mesh 308. However, in other specific implementations, the third port 226 may not be provided with an acoustic mesh (e.g., where the dimensions of the third port 226 and / or the dimensions (e.g., cross-sectional area) and / or length of the channel 600 are sufficiently controlled (e.g., damped) for the frequencies of sound entering and / or leaving the third resonator, which are chamber 228).

[0045] Figure 7 It shows Figure 3 An enlarged top view of a portion of the loudspeaker module 200 is provided to illustrate the characteristics of the relative positions of the ports of the plurality of resonators used in the loudspeaker module. (See image.) Figure 7 As shown, the first port 218 may have a first width W1, the second port 220 may have a second width W2, and the third port 226 may have a third width W2. Figure 6 In the example, for clarity, the first port 218, the second port 220, and the third port 226 without an acoustic mesh are shown.

[0046] exist Figure 7 In the example, the first port 218 and the second port 220 are separated by a first distance D1, which is substantially smaller than the width W1 of the first port 218. In this example, the third port 226 and the first port 218 are separated by a second distance D2, which is substantially larger than the width W1 of the first port 218 (and the width W2 of the second port 220 and the width of the third port 226). In conjunction with this... Figures 2 to 7 In the aforementioned arrangement, the first resonator chamber 222 and the second resonator chamber 224 are formed within a common recess (e.g., recess 444) in the frame of the speaker module, and the third resonator chamber 228 is formed within a separate recess (e.g., recess 604) in the frame 400 of the speaker module 200. However, it should also be understood that other arrangements are contemplated, in which, for example, the third resonator chamber 228 is acoustically separated from the first resonator chamber 222 and disposed within the first resonator chamber 222 (e.g., spatially separated from or disposed within the second resonator chamber 224).

[0047] Figure 8 An electronic system 800 is shown that can be used to implement one or more specific embodiments of the subject matter technology. The electronic system 800 may be... Figure 1One or more of the devices 100 shown, and / or can be part of the one or more of the devices 100. The electronic system 800 can include various types of computer readable media and interfaces for various other types of computer readable media. The electronic system 800 includes a bus 808, one or more processing unit(s) 812, a system memory 804 (and / or cache), a ROM 810, a permanent storage device 802, an input device interface 814, an output device interface 806, and one or more network interfaces 816, or a subset or variation thereof.

[0048] The bus 808 generally represents all system, peripheral, and chipset buses that communicatively interconnect the many components of the electronic system 800. In one or more implementations, the bus 808 communicatively connects the one or more processing units 812 with the ROM 810, the system memory 804, and the permanent storage device 802. The one or more processing units 812 retrieve instructions from these various memory units and data to process in order to execute the processes of the subject disclosure. In different implementations, the one or more processing units 812 can be a single processor or a multi-core processor.

[0049] The ROM 810 stores static data and instructions that are needed by the one or more processing units 812 and other modules of the electronic system 800. The permanent storage device 802, on the other hand, can be a read-and-write memory device. The permanent storage device 802 can be a non-volatile memory unit that even when the electronic system 800 is off, retains the instructions and data stored in it. In one or more implementations, a mass storage device (such as a magnetic or optical disk and its corresponding disk drive) can be used as the permanent storage device 802.

[0050] In one or more implementations, a removable storage device (such as a floppy disk, flash drive, and its corresponding disk drive) can be used as the permanent storage device 802. Like the permanent storage device 802, the system memory 804 can be a read-and-write memory device. However, unlike the permanent storage device 802, the system memory 804 can be a volatile read-and-write memory, such as a random access memory. The system memory 804 can store any of the instructions and data that one or more processing units 812 can need at runtime. In one or more implementations, the processes of the subject disclosure are stored in the system memory 804, the permanent storage device 802, and / or the ROM 810. From these various memory units, the one or more processing units 812 retrieve the instructions to execute and the data to process in order to execute the processes of one or more implementations.

[0051] Bus 808 also connects to input and output devices interface(s) 814 and 806. The input device interface(s) 814 enable(s) a user to communicate information and select commands to the electronic system 800. Input devices that can be used with the input device interface(s) 814 include, for example, alphanumeric keyboards and pointing devices (also called “cursor control devices”). Output device interface(s) 806 enables, for example, a display of information generated by the electronic system 800. Output devices that can be used with the output device interface(s) 806 include, for example, printers and display devices, such as a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, a flexible display, a flat-panel display, a solid-state display, a projector, a speaker, or speaker module, or any other device for outputting information. One or more implementations can include devices that function as both input and output devices, such as a touchscreen. In these implementations, feedback provided to the user can be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user can be received in any form, including acoustic, speech, or tactile input.

[0052] Finally, as shown in Figure 8 Bus 808 also couples electronic system 800 to one or more networks and / or to one or more network nodes through one or more network interfaces 816. In this manner, the electronic system 800 can be a part of a computer network such as a LAN, a wide-area network (“WAN”), or an Intranet, or a part of the network of networks, such as the Internet. Any or all components of the electronic system 800 can be used in conjunction with the subject disclosure.

[0053] According to some aspects of the subject disclosure, a speaker is provided, the speaker comprising: a frame; an enclosure; a front cavity partially bounded by a top wall of the enclosure and partially bounded by a portion of the frame at least partially separating the front cavity from a rear cavity within the enclosure; a first resonator chamber partially formed by a recess in the frame, the first resonator chamber acoustically coupled to the front cavity and fluidically separated from the rear cavity; and a second resonator chamber acoustically coupled to the front cavity and acoustically separated from and disposed within the recess.

[0054] According to other aspects of the subject disclosure, a speaker is provided that includes a front cavity partially bounded by a top wall of an enclosure for the speaker and partially bounded by an inner wall that at least partially separates the front cavity from a back cavity within the enclosure; a first port in the inner wall; a second port in the inner wall; a first resonator chamber acoustically coupled to the front cavity via the first port and at least partially bounded by a structure separating the first resonator chamber from the back cavity; and a second resonator chamber acoustically coupled to the front cavity via the second port and acoustically separated from the first resonator and disposed within the first resonator chamber.

[0055] According to other aspects of the subject disclosure, an electronic device is provided that includes control circuitry; and a speaker communicatively coupled to the control circuitry. The speaker includes a front cavity partially bounded by a top wall of an enclosure for the speaker and partially bounded by an inner wall that at least partially separates the front cavity from a back cavity within the enclosure; a first port in the inner wall; a second port in the inner wall; a first resonator chamber acoustically coupled to the front cavity via the first port and at least partially bounded by a structure separating the first resonator chamber from the back cavity; and a second resonator chamber acoustically coupled to the front cavity via the second port and acoustically separated from the first resonator and disposed within the first resonator chamber.

[0056] Implementations within the scope of the present disclosure can be partially or fully implemented with tangible computer-readable storage media (or multiple tangible computer-readable storage media of one or more types) having stored thereon instructions that, when executed by a computerized or processorized device, cause the device to carry out operations according to particular implementations. Tangible computer-readable storage media can also be non-transitory in nature.

[0057] Computer-readable storage media can be any storage media that can be read by a general or special purpose computing device, including any processing electronics and / or processing circuitry capable of executing instructions. For example, without limitation, computer-readable media can include any volatile semiconductor memory, such as RAM, DRAM, SRAM, T-RAM, Z-RAM, and TTRAM. Computer-readable media can also include any non-volatile semiconductor memory, such as ROM, PROM, EPROM, EEPROM, NVRAM, flash memory, nvSRAM, FeRAM, FeTRAM, MRAM, PRAM, CBRAM, SONOS, RRAM, NRAM, racetrack memory, FJG, and Millipede memory.

[0058] Moreover, the computer-readable storage medium can include any non- semiconductor memory, such as optical disk storage, magnetic disk storage, magnetic tape, other magnetic storage devices, or any other storage device that can store one or more instructions. In one or more implementations, the tangible computer-readable storage medium can be directly coupled to a computing device, while in other implementations, the tangible computer-readable storage medium can be indirectly coupled to a computing device, e.g., via one or more wired connections, one or more wireless connections, or any combination thereof.

[0059] The instructions can be directly executable, or can be used to develop executable instructions. For example, the instructions can be implemented as executable or non- executable machine code, or as high-level language instructions that can be compiled to produce executable or non-executable machine code. Further, the instructions can also be implemented as, or can include, data. The computer-executable instructions can also be organized in any format, including routines, subroutines, programs, data structures, objects, modules, applications, applets, functions, etc. As recognized by those of skill in the art, details including, but not limited to, the number, structure, sequence, and organization of instructions can vary significantly without altering the underlying logic, function, processing, and output.

[0060] While the above discussion primarily refers to microprocessor or multi-core processors that execute software, one or more implementations are performed by one or more integrated circuits such as ASICs or FPGAs. In one or more implementations, such integrated circuits execute instructions stored on the integrated circuits themselves.

[0061] The various functions discussed above can be implemented in digital electronic circuitry, in computer software, firmware, or hardware. The techniques can be implemented using one or more computer program products. Programmable processors and computers can be included in or packaged as mobile devices. The processes and logic flows can be performed by one or more programmable processors and by one or more programmable logic circuitry. General and special purpose computing devices and storage devices can be interconnected through communication networks.

[0062] Some implementations include electronic components, such as microprocessors, storage and memory that store computer program instructions in a machine -readable or computer-readable medium (alternatively referred to as computer-readable storage media, machine-readable media, or machine-readable storage media). Some examples of such computer- readable media include RAM, ROM, read-only compact discs (CD-ROM), recordable compact discs (CD-R), rewritable compact discs (CD-RW), read-only digital versatile discs (e.g., DVD-ROM, dual-layer DVD-ROM), a variety of recordable / rewritable DVDs (e.g., DVD-RAM, DVD-RW, DVD+RW, etc.), flash memory (e.g., SD cards, mini-SD cards, micro-SD cards, etc.), magnetic and / or solid-state hard drives, ultra-density optical discs, any other optical or magnetic media, and floppy disks. The computer-readable media can store a computer program that is executable by at least one processing unit and includes sets of instructions for performing various operations. Examples of computer programs, or computer code, include machine code, such as is produced by a compiler, and files including higher-level code that is executed by a computer, an electronic component, or a microprocessor using an interpreter. While the above discussion primarily refers to microprocessor or multi-core processors that execute software, some implementations are performed by one or more integrated circuits, such as application specific integrated circuits (ASICs) or field programmable gate arrays (FPGAs). In some implementations, such integrated circuits execute instructions that are stored on the circuit itself.

[0063] While the above discussion primarily refers to microprocessor or multi-core processors that execute software, some implementations are performed by one or more integrated circuits, such as application specific integrated circuits (ASICs) or field programmable gate arrays (FPGAs). In some implementations, such integrated circuits execute instructions that are stored on the circuit itself.

[0064] As used in this description and claims, the terms “computer”, “processor”, and “memory” all refer to electronic or other technological devices. These terms exclude people or groups of people. For purposes of this description, the term “display” or “displaying” mean displaying on an electronic device. As used in this description and claims, the terms “computer readable medium” and “computer-readable media” are entirely restricted to tangible, physical objects that store information in a form that is readable by a computer. These terms exclude wireless signals, wired download signals, and any other ephemeral signals.

[0065] Many of the above-described features and applications can be implemented as software processes that are specified as a set of instructions recorded on a computer readable storage medium (also referred to as computer readable medium). When these instructions are executed by one or more processing unit(s) (e.g., one or more processors, cores of processors, or other processing units), they cause the processing unit(s) to perform the actions indicated in the instructions. Examples of computer readable media include, but are not limited to, CD-ROMs, flash drives, RAM chips, hard drives, EPROMs, etc. Computer readable media does not include carrier waves and electronic signals over wire, fiber optic, or other communication media.

[0066] In this specification, the term "software" is meant to include firmware residing in read-only memory or applications stored in magnetic storage which can be read into memory for processing by a processor. Also, in some embodiments, various software aspects of the subject disclosure can be implemented as sub-parts of a larger program; for example, a software aspect can be implemented as a sub-part of a program used to implement an operating system or a stand-alone application. In some embodiments, software aspects of the subject disclosure can be implemented as separate programs. Finally, any combination of separate programs that together implement a software aspect described herein is within the scope of the subject disclosure. In some embodiments, the software programs, when installed to operate on one or more electronic systems, define one or more specific machine implementations that execute and perform the operations of the software programs.

[0067] A computer program (also known as a program, software, software application, script, or code) can be written in any form of programming language, including compiled or interpreted languages, declarative or procedural languages, and it can be deployed in any form, including as a stand-alone program or as a module, component, subroutine, object, or other unit suitable for use in a computing environment. A computer program may, but need not, correspond to a file in a file system. A program can be stored in a portion of a file that holds other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in question, or in multiple coordinated files (e.g., files that store one or more modules, sub programs, or code portions). A computer program can be deployed to be executed on one computer or on multiple computers that are located at one site or distributed across multiple sites and

[0068] It should be understood that the particular order in which the steps of processes presented in this disclosure can be performed can depend as desired by the design. The particular order of steps set forth in processes should be understood as illustration rather than a requirement. Further, the steps of the processes presented in this disclosure can be performed concurrently, serially or in any order as desired. Additionally, certain of the steps can be optional. As such, unless otherwise specifically required by the design, the particular order of steps set forth in processes should not be understood as a requirement but, instead, as an illustration. Some of the steps can be performed simultaneously. For example, in certain situations, multitasking and parallel processing can be advantageous.

[0069] The previous description is provided to enable any person skilled in the art to practice the various aspects described herein. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other aspects. Thus, the claims are not intended to be limited to the aspects shown herein, but is to be accorded the full scope consistent with the language claims, wherein reference to an element in the singular is not intended to mean "one and only one" unless specifically so stated, but rather "one or more." Unless otherwise noted, the term "some" refers to one or more. Pronouns in the masculine (his) include the feminine and neuter gender (her and it) and vice versa, and the singular include the plural and vice versa, unless specifically stated. The terms "about" and "substantially" are used to describe acceptable variability in a measurement, value, or number that is difficult to precisely determine due to the limitations inherent in measuring such a quantity. These terms are not intended to be absolute terms, but are intended to connote an acceptable close variation of a value.

[0070] The predicate words "configured to", "operable to", and "programmed to" do not imply any particular tangible or intangible modification of a subject, but, rather, are intended to be synonymous with the phrase "caused to", unless specifically stated otherwise. For example, a processor configured to monitor and control operations is a processor that is caused to monitor and control operations. Likewise, a processor configured to execute code is a processor that is caused to execute code.

[0071] The phrase "aspect" does not mean that this aspect is required by the subject technology or that this aspect applies to all configurations of the subject technology. A disclosure related to one aspect can apply to all configurations or one or more configurations. The phrase "aspect" can refer to one or more aspects and vice versa. The phrase "configuration" does not mean that this configuration is required by the subject technology or that this configuration applies to all configurations of the subject technology. A disclosure related to a configuration can apply to all configurations or one or more configurations. The phrase "configuration" can refer to one or more configurations and vice versa.

[0072] The word "example" is used herein to mean "serving as an example or illustration." Any aspect or design that is described herein as "example" is not necessarily to be construed as preferred or advantageous over other aspects or designs.

[0073] In one aspect, the term "coupled" and the like can refer to a direct coupling. In another aspect, the term "coupled" and the like can refer to an indirect coupling.

[0074] Terms such as top, bottom, front, back, side, horizontal, vertical, and the like refer to an arbitrary frame of reference, and not to the usual gravitational reference frame. Thus, such terms can extend upwardly, downwardly, diagonally, or horizontally in a gravitational reference frame.

[0075] All structural and functional equivalents to the elements of the various aspects described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are expressly incorporated herein by reference and intended to be encompassed by the claims. Moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether these disclosure is explicitly recited in the claims. No claim element is to be construed as a means plus function unless the element is expressly recited using the phrase "means for." Furthermore, to the extent that the term "comprising" is used in the detailed description and claims, it is intended to be taken in its broadest possible way to include the several alternatives as set forth herein.

Claims

1. A loudspeaker, comprising: A front cavity, which is partially defined by a top wall of a housing for the loudspeaker and partially by an inner wall that at least partially separates the front cavity from the rear cavity within the housing; The first port in the inner wall; The second port in the inner wall; A first resonator chamber, acoustically coupled to the front cavity via the first port, and at least partially defined by a structure separating the first resonator chamber from the rear cavity; A second resonator chamber, which is acoustically coupled to the front cavity via the second port, and is disposed within the first resonator chamber; A first channel extends between the first port and the first resonator chamber; as well as The second channel, which is acoustically separated from the first channel, extends between the second port and the second resonator chamber; as well as A cover structure, the cover structure: i) acoustically separating the first resonator chamber from the second resonator chamber, and ii) acoustically separating the first channel from the second channel, the cover structure including a first side defining a portion of the first channel and a second side defining a portion of the second channel.

2. The loudspeaker of claim 1, wherein the second channel is parallel to the first channel and extends through a portion of the first resonator chamber.

3. The loudspeaker of claim 1, wherein the cover structure is attached to a first flange within a recess in the frame of the loudspeaker.

4. The loudspeaker of claim 3, wherein the structure separating the first resonator chamber from the rear cavity acoustically and fluidly separates the first resonator chamber from the rear cavity.

5. The loudspeaker according to claim 4, wherein: The cover structure defines a first cover structure. The structure separating the first resonator chamber from the rear cavity includes a second cover structure for the first resonator chamber, and The second cover structure is attached to the second flange within the recess in the frame via a liquid-resistant seal.

6. The loudspeaker of claim 5, wherein the width of the second flange is wider than the width of the first flange.

7. The loudspeaker of claim 1, wherein the cover structure further comprises an extension structure, wherein the first side of the cover structure defines a portion of the first channel on the first side of the first channel, and wherein the extension structure defines a second side of the portion of the first channel.

8. The loudspeaker according to claim 1, further comprising: A first acoustic grid is positioned above the first port; as well as A second acoustic grid above the second port, the second acoustic grid being spatially and acoustically separated from the first acoustic grid.

9. The loudspeaker according to claim 1, further comprising: The third port in the inner wall; as well as The third resonator chamber is coupled to the front cavity through the third port.

10. The loudspeaker of claim 9, wherein the first port and the second port are spaced apart by a first distance, the first distance being less than the width of the first port, and wherein the third port and the second port are spaced apart by a second distance, the second distance being greater than the width of the first port.

11. The loudspeaker of claim 10, wherein the first resonator chamber and the second resonator chamber are formed in a common recess in the frame of the loudspeaker, and the third resonator chamber is formed in a separate recess in the frame of the loudspeaker.

12. The loudspeaker of claim 9, wherein the third resonator chamber is acoustically separated from the first resonator chamber and disposed within the first resonator chamber.

13. A loudspeaker, comprising: frame; shell; A front cavity, which is partially defined by the top wall of the housing and partially by a portion of the frame, the frame at least partially separating the front cavity from the rear cavity within the housing; A first resonator chamber, which is partially formed by a recess in the frame, is acoustically coupled to the front cavity and fluidly separated from the rear cavity; The second resonator chamber is acoustically coupled to the front cavity and is acoustically separated from the recess and disposed within the recess. as well as A first cover for the first resonator chamber, the first cover being attached to the frame within the recess using a liquid-resistant seal.

14. The loudspeaker of claim 13, further comprising a second cover for the second resonator chamber, the second cover being disposed within the recess in the frame and having a first side defining a first channel between the front cavity and the first resonator chamber, and a second side defining a second channel between the front cavity and the second resonator chamber.

15. The loudspeaker of claim 14, wherein the second cover is attached to the frame within the recess using an acoustic seal, the acoustic seal having a lower liquid resistance than the liquid-resistant seal of the first cover.

16. An electronic device comprising: Control circuit; as well as A loudspeaker, communicatively coupled to the control circuit, the loudspeaker comprising: A front cavity, which is partially defined by a top wall of a housing for the loudspeaker and partially by an inner wall that at least partially separates the front cavity from the rear cavity within the housing; The first port in the inner wall; The second port in the inner wall; A first resonator chamber, acoustically coupled to the front cavity via the first port, and at least partially defined by a structure separating the first resonator chamber from the rear cavity; The second resonator chamber is acoustically coupled to the front cavity via the second port, and is acoustically separated from and disposed within the first resonator chamber; A first acoustic grid, the first acoustic grid being located above the first port; and A second acoustic grid above the second port, the second acoustic grid being spatially and acoustically separated from the first acoustic grid.

17. The electronic device of claim 16, further comprising a device housing with an opening, wherein the speaker further comprises an output port from the front cavity, and wherein the output port of the speaker is aligned with the opening in the device housing.

18. The electronic device of claim 16, further comprising: A first channel extends between the first port and the first resonator chamber; as well as The second channel, which is acoustically separated from the first channel, extends between the second port and the second resonator chamber.

19. The electronic device of claim 18, further comprising a cover structure that: i) acoustically separates the first resonator chamber from the second resonator chamber, and ii) acoustically separates the first channel from the second channel, the cover structure including a first side defining a portion of the first channel and a second side defining a portion of the second channel.

20. The electronic device of claim 19, wherein the cover structure is attached to a first flange within a recess in the frame of the speaker.

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