Submerged liquid-cooled data center

Abstract

The present disclosure provides an immersed liquid cooling data center, and relates to the technical field of data center. The immersed liquid cooling data center comprises at least one subsystem, the subsystem comprises a heat exchange unit module, a plurality of cabinet modules and a plurality of pipe box modules, the heat exchange unit module is configured to provide circulating power for cooling liquid and exchange heat of the cooling liquid to an external cold source, the cabinet module comprises a box body, the box body has a liquid inlet and a liquid outlet, the box body is used for accommodating electronic devices and cooling liquid, the pipe box module comprises a liquid inlet pipe and a liquid return pipe, a plurality of liquid return pipes are connected in sequence, and one of the liquid return pipes is connected to the input port of the heat exchange unit module, a plurality of liquid inlet pipes are connected in sequence, and one of the liquid inlet pipes is connected to the output port of the heat exchange unit module, the liquid inlet is communicated with the liquid inlet pipe, and the liquid outlet is communicated with the liquid return pipe. The immersed liquid cooling data center adopts modular design, is simple to construct, is easy to manage, is conducive to later expansion, can shorten the construction period, and can effectively save construction manpower.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of data centers, in particular to an immersion liquid cooling data center. BACKGROUND

[0002] Heat dissipation is a prominent factor in the design of computer systems and data centers. The number of high-performance electronic components, such as processors, is steadily increasing, thereby increasing the amount of heat generated and dissipated during the daily operation of servers. If the environment in which the servers are allowed to operate is allowed to warm up over time, the reliability of the servers used within the data center will decrease. Maintaining a proper thermal environment is essential for the normal operation of these servers in the data center, as well as the performance and service life of the servers.

[0003] To this end, the method of liquid cooling instead of air cooling for heat dissipation is gradually becoming mainstream, and the immersion liquid cooling technology is widely used due to its high heat dissipation performance. The existing immersion liquid cooling data center generally adopts the traditional construction mode, which generally needs to wait for the completion of the civil construction, and after detailed site investigation and drawing checking, the indoor liquid cooling equipment, pipe network system and other parts are subjected to deepening design and installation construction, resulting in a long construction period, and a large number of manpower needs to be invested during construction, and the installation difficulty is large, and it is not conducive to the later expansion. SUMMARY

[0004] The present disclosure provides an immersion liquid cooling data center.

[0005] According to the immersion liquid cooling data center provided by the present disclosure, the immersion liquid cooling data center comprises at least one subsystem, and the subsystem comprises:

[0006] A heat exchange unit module configured to provide circulating power for the cooling liquid and exchange heat of the cooling liquid to an external cold source;

[0007] A plurality of cabinet modules, the cabinet module comprising a cabinet having a liquid inlet and a liquid outlet, the cabinet being used to accommodate electronic devices and cooling liquid;

[0008] A plurality of pipe box modules, the pipe box module comprising a liquid inlet pipe and a liquid return pipe, the liquid return pipes of the plurality of pipe box modules being connected in sequence, and one of the liquid return pipes being connected to the input port of the heat exchange unit module, the liquid inlet pipes of the plurality of pipe box modules being connected in sequence, and one of the liquid inlet pipes being connected to the output port of the heat exchange unit module, the liquid inlet being communicated with the liquid inlet pipe, and the liquid outlet being communicated with the liquid return pipe.

[0009] In an embodiment of the present disclosure, the pipe box module further comprises a support and a stepping plate laid on the top of the support, and the liquid inlet pipe and the liquid return pipe are fixed to the support and located below the stepping plate.

[0010] In one embodiment of the present disclosure, the pedal is detachably connected to the support; and / or, the pedal is made of metal material; and / or, the pedal has a plurality of grids.

[0011] In one embodiment of the present disclosure, the pipe box module further comprises a water collecting tray mounted on the support, the water collecting tray being located below the liquid inlet pipe and the liquid return pipe.

[0012] In one embodiment of the present disclosure, the immersion liquid cooling data center further comprises a frame module, the frame module comprising a main frame and a power bridge arranged on the main frame, and at least one of the subsystems being arranged in the main frame.

[0013] In one embodiment of the present disclosure, the immersion liquid cooling data center comprises a plurality of the frame modules, the plurality of the frame modules being arranged in an array, and the main frames of any two adjacent frame modules being detachably connected.

[0014] In one embodiment of the present disclosure, the main frame is provided with two of the subsystems, and the two subsystems are arranged in sequence along a first direction.

[0015] The plurality of cabinet modules in each of the subsystems are arranged in a row along a second direction, and the plurality of frame modules in each of the subsystems are arranged in a row along the second direction, the first direction being perpendicular to the second direction.

[0016] The two rows of pipe box modules are located between the two rows of cabinet modules.

[0017] In one embodiment of the present disclosure, the immersion liquid cooling data center further comprises a hoisting module, the hoisting module comprising a track arranged on the main frame and a hoisting device slidingly arranged on the track, the track being located above the cabinet modules and below the power bridge.

[0018] In one embodiment of the present disclosure, the track is annular.

[0019] In one embodiment of the present disclosure, the main frame is provided with a plurality of partitions in a vertical direction, and each of the partitions is provided with at least one of the power bridges.

[0020] The technology according to the present disclosure can realize the modular design of the immersion liquid cooling data center, shorten the engineering cycle, reduce the installation difficulty, and facilitate the later expansion.

[0021] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor to limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description. Attached Figure Description

[0022] The accompanying drawings are provided to better understand this solution and do not constitute a limitation of this disclosure. Wherein:

[0023] Figure 1 This is a schematic diagram of the structure of an immersion liquid cooling system according to an embodiment of the present disclosure;

[0024] Figure 2 This is a structural schematic diagram of two tube box modules according to an embodiment of the present disclosure;

[0025] Figure 3 This is a structural schematic diagram of the bracket, water collection tray, inlet pipe and return pipe of two pipe box modules according to an embodiment of this disclosure;

[0026] Figure 4 This is a schematic diagram of the structure of two supports according to an embodiment of the present disclosure;

[0027] Figure 5 This is a structural schematic diagram of the bracket and water collection tray of two pipe box modules according to an embodiment of the present disclosure;

[0028] Figure 6 This is a schematic diagram of the main framework according to an embodiment of the present disclosure;

[0029] Figure 7 This is a schematic diagram of the framework module according to an embodiment of the present disclosure;

[0030] Figure 8 This is a schematic diagram of the structure after multiple frame modules are spliced ​​together according to the embodiments of this disclosure;

[0031] Figure 9 This is a structural schematic diagram of multiple frame modules and hoisting modules according to embodiments of the present disclosure;

[0032] Figure 10 This is a structural schematic diagram of a hoisting module according to an embodiment of the present disclosure.

[0033] In the picture:

[0034] 1. Heat exchange unit module;

[0035] 2. Rack module;

[0036] 3. Pipe box module; 31. Inlet pipe; 32. Return pipe; 33. Support; 34. Collection tray; 35. Pedal;

[0037] 4. Frame module; 41. Main frame; 411. Mezzanine; 42. Cable tray;

[0038] 5. Lifting module; 51. Track; 52. Lifting equipment. Detailed Implementation

[0039] Exemplary embodiments of the present disclosure are described herein with reference to the accompanying drawings, which are meant to be exemplary in nature, and include various details intended to facilitate understanding of the present disclosure. Thus, it should be apparent to those skilled in the art that various modifications and changes can be made in the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, it should be apparent to those skilled in the art that the descriptions set forth in this specification are meant to be illustrative only and should not be taken as restrictive.

[0040] Reference will now be made to Figures 1 to 3 Embodiments of the present disclosure provide an immersion liquid cooling data center. The immersion liquid cooling data center comprises at least one subsystem, the subsystem comprising a heat exchange unit module 1, a plurality of cabinet modules 2 and a plurality of pipe box modules 3.

[0041] The cabinet module 2 comprises a box body for accommodating electronic devices such as servers, switches, power supplies, etc. The box body has a liquid inlet and a liquid outlet. The cooling liquid can flow into the box body through the liquid inlet, and the electronic devices can be immersed in the cooling liquid and exchange heat with the cooling liquid to avoid temperature exceeding the standard. The cooling liquid that absorbs the heat of the electronic devices can flow out of the box body through the liquid outlet.

[0042] The heat exchange unit module 1 is configured to provide circulating power for the cooling liquid and exchange heat of the cooling liquid to an outdoor cold source. Specifically, the heat exchange unit module 1 comprises a circulating pump and a heat exchanger. The circulating pump can provide circulating power for the cooling liquid. The heat exchanger has a primary side and a secondary side. The pipeline of the primary side is used for the cooling liquid to flow through, and the pipeline of the secondary side is used for a heat exchange working medium to flow through. The heat exchange working medium is provided by an external cold source. When the heat exchange working medium flows through the pipeline of the secondary side of the heat exchanger, it can exchange heat with the cooling liquid in the pipeline of the primary side to reduce the temperature of the cooling liquid. The heat exchanger is preferably a water-water heat exchanger.

[0043] The pipe box module 3 comprises a liquid inlet pipe 31 and a liquid return pipe 32, which are independent of each other. In order to save space, the liquid inlet pipe 31 and the liquid return pipe 32 can be arranged in parallel and spaced apart. The liquid return pipes 32 of the plurality of pipe box modules 3 are connected in sequence, and one of the liquid return pipes 32 is connected to the heat exchange unit module 1. The liquid inlet pipes 31 of the plurality of pipe box modules 3 are connected in sequence, and one of the liquid inlet pipes 31 is connected to the heat exchange unit module 1. The liquid inlet is communicated with the liquid inlet pipe 31, and the liquid outlet is communicated with the liquid return pipe 32. Specifically, the liquid return pipe 32 connected to the heat exchange unit module 1 is connected to the inlet of the pipeline of the primary side of the heat exchanger, and the liquid inlet pipe 31 connected to the heat exchange unit module 1 is connected to the output end of the circulating pump. The outlet of the pipeline of the primary side of the heat exchanger is connected to the input end of the circulating pump, and the cooling liquid can be driven by the circulating pump to flow through the plurality of cabinet modules 2 and then return to the heat exchanger.

[0044] The liquid return pipes 32 of the plurality of pipe box modules 3 in the subsystem are connected in sequence to form a liquid return main pipe, and the liquid inlet pipes 31 of the plurality of pipe box modules 3 are connected in sequence to form a liquid inlet main pipe. The liquid inlet main pipe and the liquid return main pipe have similar structures. Taking the liquid inlet main pipe as an example, the liquid inlet main pipe can be a straight-through pipe or a ring-shaped pipe. When the liquid inlet main pipe is a straight-through pipe, the two ends of the liquid inlet main pipe need to be blocked. The liquid inlet pipe 31 is connected with a liquid inlet branch pipe, which is used to connect with the liquid inlet of the tank. The liquid return pipe 32 is connected with a liquid return branch pipe, which is connected with the liquid outlet of the tank. It should be noted that, according to actual needs, the liquid return branch pipe can be connected with the liquid outlet of only one tank, or connected with the liquid outlets of multiple tanks, or blocked without being connected with the liquid outlet of the tank. Similarly, the liquid inlet branch pipe can be connected with the liquid inlet of only one tank, or connected with the liquid inlets of multiple tanks, or blocked without being connected with the liquid inlet of the tank.

[0045] In order to facilitate disassembly and assembly, the two adjacent liquid inlet pipes 31 in the liquid inlet main pipe and the two adjacent liquid return pipes 32 in the liquid return main pipe can be connected by quick clamping chucks.

[0046] In order to prevent the liquid inlet pipe 31 and the liquid return pipe 32 from being corroded, the liquid inlet pipe 31 and the liquid return pipe 32 are made of corrosion-resistant metal materials, such as stainless steel.

[0047] The submerged liquid-cooled data center provided by the present disclosure can arrange the number of subsystems according to the specific conditions of the completed site, and the number of cabinet modules 2 in the subsystem can also be arranged according to actual needs, while matching the number of pipe box modules 3. The construction is simple, easy to manage, and the quality is controllable. It is also conducive to the expansion in the later period. Compared with the traditional construction mode, it does not need to be based on the construction site to carry out deepening design, which can effectively shorten the construction period and effectively save the construction labor. It should be noted that the total heat dissipation demand of the electronic devices in each cabinet module 2 in the subsystem cannot exceed the heat dissipation capacity of the heat exchange unit module 1, wherein, Figure 1 The subsystem includes two cabinet modules 2.

[0048] Please refer to Figures 2 to 5 In an embodiment of the present disclosure, the pipe box module 3 further includes a support 33, and the liquid inlet pipe 31 and the liquid return pipe 32 are fixed to the support 33. The support 33 can support the liquid inlet pipe 31 and the liquid return pipe 32. The support 33 can be spliced by metal profiles, such as square steel.

[0049] Please refer to Figure 2In one embodiment of this disclosure, the pipe box module 3 further includes a foot pedal 35. The foot pedal 35 is laid on top of the bracket 33 and located above the inlet pipe 31 and the return pipe 32, so as to facilitate the operator to walk on the pipe box module 3, thereby facilitating the maintenance of electronic devices in the cabinet module 2.

[0050] In one embodiment of this disclosure, the pedal 35 is detachably connected to the bracket 33. Specifically, the pedal 35 can be clipped onto the bracket 33 or installed on the bracket 33 via detachable connectors such as bolts. This facilitates maintenance of the inlet pipe 31 and return pipe 32 below the pedal 35 by the operator. Of course, in other embodiments, the pedal 35 can also be welded to the bracket 33.

[0051] In one embodiment of this disclosure, the pedal 35 is made of metal, such as steel, stainless steel, or aluminum alloy. A pedal 35 made of metal provides strong support and prevents breakage. In other embodiments, the metal material can be replaced with plastic or wood.

[0052] In one embodiment of this disclosure, the pedal 35 has multiple grids, which can reduce the weight of the pedal 35 and make it easier for operators to disassemble and assemble it, and can also prevent water from accumulating on the surface of the pedal 35.

[0053] Please refer to Figure 3 and Figure 4 In one embodiment of this disclosure, the pipe box module 3 further includes a water collection tray 34, which is mounted on the bracket 33 and located below the inlet pipe 31 and the return pipe 32. By providing the water collection tray 34, condensate water condensed on the surfaces of the inlet pipe 31 and the return pipe 32 can be collected, thereby optimizing the environment. The water collection tray 34 can be made of corrosion-resistant materials such as stainless steel to enhance its corrosion resistance.

[0054] In one embodiment of this disclosure, the water collection tray 34 is U-shaped, which is simple in structure and easy to manufacture. If the arrangement direction of two adjacent pipe box modules 3 is consistent with the extension direction of the water collection tray 34, the two water collection trays 34 can be spliced ​​together by bolts, nuts or other connecting parts. It should be noted that when the two water collection trays 34 are spliced ​​together, a sealing gasket can be added between the two water collection trays 34 to prevent water leakage at the splice.

[0055] Please refer to Figure 1 , Figures 6 to 8 The immersion liquid-cooled data center also includes a frame module 4, which includes a main frame 41 and an electrical cable tray 42 disposed on the main frame 41. At least one subsystem is disposed within the main frame 41. The main frame 41 supports the electrical cable tray 42, which is used to arrange the cables of various electronic devices.

[0056] The main frame 41 can be assembled by metal profiles, and in the present disclosure, the main frame 41 is exemplarily made of square steel. The size of the main frame 41 can be determined according to the number of cabinet modules 2 in the subsystem; or the main frame 41 can be set to a standard size, but the maximum number of cabinet modules 2 contained in the subsystem accommodated in the main frame 41 will also be limited by the size of the main frame 41.

[0057] The number of subsystems accommodated in the main frame 41 can be set as needed. As shown in Figure 1 , a scheme in which two subsystems are provided in the main frame 41 is exemplarily shown, and the two subsystems are arranged in sequence along a first direction. The plurality of cabinet modules 2 in each subsystem are arranged in a row along a second direction, and the plurality of frame modules 4 in each subsystem are also arranged in a row along the second direction, the first direction and the second direction being perpendicular to each other; the two rows of pipe box modules 3 are located between the two rows of cabinet modules 2. In this way, in the two subsystems, the two rows of pipe box modules 3 are close to each other and located between the two rows of cabinet modules 2, so that the operator can walk on the two rows of pipe box modules 3 at the same time, and maintain the two rows of cabinet modules 2 at the same time, improving the maintenance efficiency. Exemplarily, the first direction can be the width direction of the main frame 41, and the second direction can be the length direction of the main frame 41.

[0058] The heat exchange unit module 1 in each subsystem can be arranged in the same row as the plurality of cabinet modules 2, specifically, the heat exchange unit module 1 can be located between any two cabinet modules 2, or at either end of the row of cabinet modules 2.

[0059] Please refer to Figure 6 , in an embodiment of the present disclosure, the main frame 41 is spaced apart in the vertical direction by a plurality of partitions 411, and each partition 411 is provided with at least one electrical bridge 42. As shown in Figure 6 , a scheme in which the main frame 41 is spaced apart in the vertical direction by two partitions 411 corresponding to each subsystem is exemplarily shown, and each partition 411 is provided with two electrical bridges 42. Among them, one of the two electrical bridges 42 of each partition 411 can be used to arrange weak current cables, and the other can be used to arrange strong current cables, which is convenient for maintenance.

[0060] Please refer to Figure 1 and Figure 8In an embodiment of the present disclosure, the immersion liquid cooling data center comprises a plurality of frame modules 4 arranged in an array, and any two adjacent frame modules 4 are detachably connected by the main frames 41. In this way, the immersion liquid cooling data center as a whole is more compact. In particular, the main frame 41 can be provided with a plurality of mounting holes, and the two main frames 41 can be connected together by bolts passing through the mounting holes and being screwed with nuts. Figure 1 and Figure 8 The number of frame modules 4 is two, and the two frame modules 4 are arranged in a row of two columns.

[0061] Please refer to Figure 9 and Figure 10 In an embodiment of the present disclosure, the immersion liquid cooling data center further comprises a hoisting module 5, which comprises a track 51 arranged on the main frame 41 and a hoisting device 52 slidingly arranged on the track 51. The track 51 is located above the cabinet module 2 and below the power bridge 42. The hoisting module 5 facilitates the hoisting of electronic devices into or out of the cabinet, and makes full use of the space between the subsystem and the power bridge 42. In particular, the hoisting device is preferably an electric hoist, and the top roller of the electric hoist can roll along the track 51, so that the electric hoist can be moved above any cabinet module 2.

[0062] In order to facilitate the hoisting of electronic devices into or out of the cabinet of the cabinet module 2, the top of the cabinet is provided with an opening, and a cover plate that can be opened and closed is arranged to open or close the opening. In this way, electronic devices can directly enter or exit the cabinet in the vertical direction.

[0063] In an embodiment of the present disclosure, the track 51 can be spliced by a plurality of track sections, and adjacent track sections can be detachably connected. In this way, the track 51 can be spliced according to the number and position of the frame modules 4. In other embodiments, the track 51 can also be provided as a whole.

[0064] In an embodiment of the present disclosure, the track 51 is in the shape of a ring. As shown in Figure 9 Since two subsystems are arranged in the frame module 4, the two rows of cabinet modules 2 are arranged in parallel and at intervals, and the ring-shaped track 51 can traverse above the two rows of cabinet modules 2. In this way, one hoisting device can meet the hoisting requirements of electronic devices in the two rows of cabinet modules 2, which can effectively reduce the cost and improve the operation and maintenance efficiency. Of course, in other embodiments, the track 51 can also be provided in a straight line, or in the shape of L, U, etc.

[0065] The above detailed description does not limit the scope of the disclosure. Various modifications, combinations, sub-combinations and alternatives can be made to the detailed description. Any modification, equivalent replacement and improvement etc. made within the spirit and principle of the disclosure shall be included in the scope of the disclosure.

Claims

1. Submerged liquid-cooled data center, characterized in that: The sub-system comprises at least one sub-system, and the sub-system comprises: A heat exchange unit module (1) configured to provide circulating power for the cooling liquid and exchange heat of the cooling liquid to an external cold source; A plurality of cabinet modules (2) comprising a box body having a liquid inlet and a liquid outlet, the box body being used to accommodate electronic devices and cooling liquid; A plurality of pipe box modules (3) comprising a liquid inlet pipe (31) and a liquid return pipe (32), the liquid return pipes (32) of the plurality of pipe box modules (3) being connected in sequence, and one of the liquid return pipes (32) being connected to the input port of the heat exchange unit module (1), the liquid inlet pipes (31) of the plurality of pipe box modules (3) being connected in sequence, and one of the liquid inlet pipes (31) being connected to the output port of the heat exchange unit module (1), the liquid inlet being communicated with the liquid inlet pipe (31), and the liquid outlet being communicated with the liquid return pipe (32); The immersion liquid cooling data center further comprises a frame module (4), the frame module (4) comprises a main frame (41), and a bridge frame (42) is arranged on the main frame (41), and at least one of the sub-systems is arranged in the main frame (41); The immersion liquid cooling data center further comprises a hoisting module (5), the hoisting module (5) comprises a track (51) arranged on the main frame (41), and a hoisting device (52) slidably arranged on the track (51), the track (51) being located above the cabinet module (2) and below the bridge frame (42); The number of the sub-systems is arranged according to the specific situation of the completed civil engineering, and the number of the cabinet modules (2) and the pipe box modules (3) in the sub-systems is also arranged according to actual needs; The main frame (41) is spaced apart in the vertical direction and is provided with a plurality of partitions (411), and each partition (411) is provided with at least one bridge frame (42).

2. The submerged liquid-cooled datacenter of claim 1, wherein, The pipe box module (3) further comprises a support (33) and a stepping plate (35) arranged on the top of the support (33), and the liquid inlet pipe (31) and the liquid return pipe (32) are fixed to the support (33) and located below the stepping plate (35).

3. The submerged liquid-cooled datacenter of claim 2, wherein, The stepping plate (35) and the support (33) are detachably connected; and / or, the stepping plate (35) is made of metal material; and / or, the stepping plate (35) has a plurality of grids.

4. The submerged liquid-cooled datacenter of claim 2, wherein, The pipe box module (3) further comprises a water collecting tray (34) mounted on the support (33), and the water collecting tray (34) is located below the liquid inlet pipe (31) and the liquid return pipe (32).

5. The submerged liquid-cooled datacenter of claim 1, wherein, The immersion liquid cooling data center comprises a plurality of frame modules (4), and the plurality of frame modules (4) are arranged in an array, and the main frames (41) of any two adjacent frame modules (4) are detachably connected.

6. The submerged liquid-cooled datacenter of claim 1, wherein, Two sub-systems are arranged in the main frame (41) in sequence along a first direction. The plurality of cabinet modules (2) in each of the subsystems are arranged in rows along a second direction, and the plurality of frame modules (4) in each of the subsystems are arranged in rows along the second direction, the first direction and the second direction being perpendicular; The two rows of tube-bank modules (3) are located between the two rows of cabinet modules (2).

7. The submerged liquid-cooled datacenter of claim 1, wherein, The track (51) is annular.

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