Electroplating device and electroplating method for ceramic pad array housing

Abstract

The present invention provides an electroplating device and method for a ceramic pad array housing. The electroplating device includes a device body, wherein a plurality of boss structures are fixedly connected to the edge region of the upper surface of the device body, and a plurality of spring pins are mounted on the upper surface region surrounded by the plurality of boss structures. The upper surface of the spring pins in a free state is higher than the upper surface of the steps of the boss structures, and the upper surface of the spring pins in a fully retracted state is lower than the upper surface of the steps of the boss structures. When the electroplating device accommodates the ceramic pad array housing, the steps of the boss structures support the ceramic pad array housing, and the plurality of spring pins contact the plurality of pads of the ceramic pad array housing in a one-to-one correspondence. The device body also includes an electroplating interface structure, which is electrically connected to the spring pins through the device body. The present invention is capable of electroplating ceramic pad array housings without electroplating lines.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic packaging, and in particular to an electroplating device and an electroplating method for a ceramic pad array housing. Background Art

[0002] To ensure the solderability of alloy solder, the solderability and reliability of interconnect wire bonds with the chip, and the resistance of the packaged electronic devices to harsh environments such as salt spray and water vapor, the metal parts and exposed metallized surface of the ceramic pad array housing require plating. Currently, the plating method for ceramic pad array housings is to extend a non-interconnected electroplating line from each network inside the ceramic component to the periphery of the ceramic component. The sidewalls around the ceramic component are then metallized to connect the various networks inside the ceramic component. During electroplating, metal wire is used to bind the sidewalls for electroplating.

[0003] However, the existing plating method of the ceramic pad array housing has at least the following problems:

[0004] On the one hand, as the degree of integration of integrated circuits becomes higher and higher, the wiring space inside the ceramic housing becomes increasingly tight while the volume of the ceramic housing remains unchanged and the internal wiring density continues to increase, making it increasingly difficult to lead out the electroplating wires. Sometimes, there is no space in the high-density ceramic pad array housing to lead out the electroplating wires. On the other hand, with the rapid development of the integrated circuit industry, the application frequency requirements for chips and the corresponding ceramic pad array housings are also becoming higher and higher. At this time, if the high-frequency signal transmitted inside the ceramic housing is led out through the electroplating wire, the signal electric field will propagate outward, resulting in increased signal transmission loss, decreased signal transmission quality, and deterioration of the electrical performance of the housing. Summary of the Invention

[0005] An embodiment of the present invention provides an electroplating device and an electroplating method for a ceramic pad array housing to solve the problem of deterioration of the electrical performance of the housing caused by the existing electroplating method of leading out the electroplating wires, and the problem that the high-density ceramic pad array housing has no space to lead out the electroplating wires, resulting in the inability to electroplate.

[0006] In a first aspect, an embodiment of the present invention provides an electroplating device for a ceramic pad array housing, the electroplating device comprising a device body, a plurality of boss structures fixedly connected to an edge region of an upper surface of the device body, and a plurality of spring pins mounted on an upper surface region surrounded by the plurality of boss structures;

[0007] The upper surface of the spring pin in a free state is higher than the upper surface of the step of the boss structure, and the upper surface of the spring pin in a fully retracted state is lower than the upper surface of the step of the boss structure. When the electroplating device accommodates a ceramic pad array housing, the step of the boss structure supports the ceramic pad array housing, and the multiple spring pins are in one-to-one contact with the multiple pads of the ceramic pad array housing.

[0008] The device body also includes an electroplating interface structure, which is electrically connected to the spring pin through the device body.

[0009] In a possible implementation, a stopper is provided on the upper surface of the boss structure. When the electroplating device accommodates the ceramic pad array housing, the stopper can press the ceramic pad array housing.

[0010] In a possible implementation, the limiter is rotatably connected to the boss structure via a rotation shaft fixed on the boss structure.

[0011] In a possible implementation, the limiter is a telescopic limiter.

[0012] In a possible implementation, the electroplating interface structure is disposed outside the boss structure.

[0013] In a possible implementation, the electroplating interface structure is a hanging ear structure.

[0014] In a possible implementation, all parts of the electroplating device except the electroplating interface structure and the spring pins are covered with insulating material.

[0015] In a possible implementation, the insulating material is polyvinyl chloride or polystyrene.

[0016] In one possible implementation, the ceramic pad array housing includes a ceramic quad-no-lead housing.

[0017] In a second aspect, an embodiment of the present invention provides an electroplating method using the electroplating device according to the first aspect, comprising:

[0018] Before electroplating, the ceramic pad array housing is placed in an electroplating device, and the ceramic pad array housing is supported by the steps of the boss structure;

[0019] Using external force to press down the ceramic pad array housing so that each pad of the ceramic pad array housing contacts the corresponding spring pin;

[0020] The electroplating device is placed in the electroplating solution environment, and then the electroplating interface structure is energized to perform electroplating.

[0021] An embodiment of the present invention provides an electroplating device and an electroplating method for a ceramic pad array housing, wherein the electroplating device includes a device body, a plurality of boss structures are fixedly connected to the edge area of the upper surface of the device body, and a plurality of spring pins are installed in the upper surface area surrounded by the plurality of boss structures; wherein the upper surface of the needle tip of the spring pin in a free state is higher than the upper surface of the step of the boss structure, and the upper surface of the needle tip of the spring pin in a fully retracted state is lower than the upper surface of the step of the boss structure; when the electroplating device accommodates the ceramic pad array housing, the step of the boss structure supports the ceramic pad array housing, and the plurality of spring pins are in one-to-one contact with the plurality of pads of the ceramic pad array housing; the device body also includes an electroplating interface structure, and the electroplating interface structure is electrically connected to the spring pins through the device body.

[0022] This electroplating device, employing this specific structure, can electroplate any ceramic pad array housing without plating wires. This eliminates the need for extended plating wires, ensuring high-frequency chip applications and resolving the issues of increased signal transmission loss, reduced signal transmission quality, and deteriorating housing electrical performance associated with existing plating methods that require extended plating wires. Furthermore, because the electroplating device does not require extended plating wires from the ceramic pad array housing, it can also electroplate high-density ceramic pad array housings, resolving the issue of high-density ceramic pad array housings being unable to be plated due to a lack of space for extended plating wires. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 is a schematic structural diagram of a ceramic pad array housing provided by an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the inner layer wiring structure of the ceramic member of the ceramic pad array housing provided by an embodiment of the present invention;

[0026] Figure 3 Schematic diagram of the structure of the electroplating device provided by an embodiment of the present invention;

[0027] Figure 4 is a flow chart for implementing the electroplating method provided by an embodiment of the present invention;

[0028] Figure 5 It is a schematic diagram of the assembly of the electroplating device and the ceramic pad array housing provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0029] In the following description, specific details such as particular system structures and techniques are provided for purposes of illustration, not limitation, to facilitate a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clear, specific embodiments will be described below with reference to the accompanying drawings.

[0031] As described in the related art, on the one hand, as the degree of integration of integrated circuits becomes higher and higher, the wiring space inside the ceramic shell becomes increasingly tight while the volume of the ceramic shell remains unchanged and the internal wiring density continues to increase, making it increasingly difficult to lead out the electroplating wires. Sometimes, there is no space in the high-density ceramic pad array shell to lead out the electroplating wires; on the other hand, with the rapid development of the integrated circuit industry, the application frequency requirements for chips and the corresponding ceramic pad array shells are also becoming higher and higher. At this time, if the high-frequency signal transmitted inside the ceramic shell is led out to the electroplating wire, the signal electric field will propagate outward, resulting in increased signal transmission loss and decreased signal transmission quality, which will deteriorate the electrical performance of the shell.

[0032] In order to solve the problems of the prior art, an embodiment of the present invention provides an electroplating device and an electroplating method for a ceramic pad array housing. The electroplating device for a ceramic pad array housing provided by an embodiment of the present invention is first introduced below.

[0033] In order to facilitate understanding of the electroplating device for a ceramic pad array housing provided by an embodiment of the present invention, the ceramic pad array housing is first introduced.

[0034] like Figure 1 As shown, a schematic diagram of a ceramic pad array housing is shown. The ceramic pad array housing is usually made of a ceramic body plated with nickel and gold. The ceramic body is a multi-layer wiring structure. The ceramic body is generally provided with a multi-layer cavity. The cavity is provided with a bonding area and a chip mounting area. The bottom of the ceramic pad array housing is provided with a pad. The ceramic body is a multi-layer wiring structure. Figure 2 The figure shows a schematic diagram of the internal wiring structure of a ceramic component using the existing electroplating method with lead-out plating lines. The outer thick black lines are the lead-out plating lines. During electroplating, a non-interconnected plating line is first extended from each network within the ceramic component to the periphery of the ceramic component. The sidewalls of the ceramic component are then metallized to connect the internal networks. During electroplating, metal wire is used to bind the sidewalls for plating. After electroplating, the metallization of the sidewalls is removed by grinding to form the finished ceramic pad array housing.

[0035] Next, the electroplating device for the ceramic pad array housing provided by the embodiment of the present invention is introduced.

[0036] The electroplating device for a ceramic pad array housing includes a device body, with multiple boss structures fixedly connected to the edge area of the upper surface of the device body. A plurality of spring pins are mounted on the upper surface area surrounded by the multiple boss structures. In a free state, the upper surface of the spring pins is higher than the upper surface of the steps of the boss structures, while in a fully retracted state, the upper surface of the spring pins is lower than the upper surface of the steps of the boss structures. With the boss structures, when the electroplating device houses the ceramic pad array housing, the steps of the boss structures support the ceramic pad array housing, and the multiple spring pins make one-to-one contact with the multiple pads of the ceramic pad array housing.

[0037] Furthermore, the device body also includes a plating interface structure, which is electrically connected to the pogo pins through the device body. For example, the device body can be made of a conductive material, such as copper, aluminum alloy, stainless steel, or other materials that are conductive, acid-resistant, alkali-resistant, and heat-resistant. As another example, the portion of the device body that electrically connects the plating interface structure to the pogo pins can be made of a conductive material, while the remaining portions can be made of other materials. This can reduce manufacturing costs.

[0038] In some embodiments, a stopper may be provided on the upper surface of the boss structure to secure the ceramic pad array housing. Thus, when the electroplating apparatus accommodates the ceramic pad array housing, the stopper can press against the ceramic pad array housing to secure it, thereby preventing it from moving and ensuring the electroplating effect.

[0039] In some embodiments, the stopper can be rotatably connected to the boss structure via a rotational shaft fixed to the boss structure. In this way, when the electroplating apparatus accommodates the ceramic pad array housing, the stopper can be moved to rotate above the ceramic pad array housing, thereby pressing the ceramic pad array housing.

[0040] In some embodiments, the stopper may be a telescopic stopper. In this way, when the electroplating device accommodates the ceramic pad array housing, the stopper can be extended to press the ceramic pad array housing.

[0041] In some embodiments, the electroplating interface structure can be disposed outside the device body so as not to block placement of the ceramic pad array housing in the electroplating device and not affect electroplating. For example, the electroplating interface structure can be disposed outside the boss structure.

[0042] In some embodiments, the electroplating interface structure can adopt a hanging ear structure. For example, two hanging ears can be provided, and the two hanging ears are respectively located on the boss structure on both sides of the device body. In this way, the electroplating device can be conveniently tied to the electroplating rack by the electroplating wire, thereby improving the electroplating efficiency.

[0043] In some embodiments, in order to prevent the electroplating device from being corroded by the electroplating solution or from being plated with gold during gold plating, which may cause economic losses, the parts of the electroplating device other than the electroplating interface structure and the spring pins may be covered with insulating materials, such as polyvinyl chloride or polystyrene.

[0044] In some embodiments, the electroplating device for ceramic pad array housings can electroplate all leadless and plated-line-free ceramic pad array housings, such as Ceramic Quad Flat Non-leaded Package (CQFN) type housings.

[0045] In order to better understand the electroplating device for the ceramic pad array housing provided by the embodiment of the present invention, a specific implementation structure of the electroplating device is provided below.

[0046] like Figure 3 As shown, a plating device with a stopper and a hanging ear plating interface structure is shown, wherein the device body 4 adopts a quadrilateral structure, and a boss structure 1 is fixedly connected to each of the four sides of the upper surface of the device body 4, and a plurality of spring pins 3 are arranged on the upper surface of the device body 4. Figure 3 As can be seen in the figure, the spring pins 3 are in a free state, with the upper surface of each spring pin 3 higher than the upper surface of the step 5 of the boss structure. To secure the ceramic pad array housing, a limiter 7 is provided on the upper surface 6 of each boss structure 1. The electroplating interface structure of the device body 4 utilizes ear hook structures 2, which are located on the boss structures on both sides of the device body 4.

[0047] also, Figure 3 Also shown is a spring pin 3, which consists of a needle head 3-1, a needle tube 3-2, and a spring 3-3. It should be noted that due to deformation of the ceramic pad array housing during the production process, the ceramic surface where the pads are located may be uneven. In this case, if the electroplating device and the pads adopt a "hard contact" method without a spring structure, it is very easy for some pads to have poor electrical connection with the electroplating device. Therefore, by equipping each pad with an independent spring pin 3, this poor electrical connection can be avoided, ensuring that all pads are properly electrically connected to the electroplating device.

[0048] It's worth noting that the four bosses on the four sides of the device body are shorter than the four sides of the device body. For example, the bosses can be one-fourth or one-fifth the size of the corresponding sides of the device body. This ensures that after the electroplating device is assembled with the ceramic pad array housing, the electroplating solution can flow fully between the bottom of the ceramic pad array housing and the pogo pins, facilitating gold plating of the pads.

[0049] In addition, an embodiment of the present invention also provides an electroplating method using an electroplating device of a ceramic pad array housing, such as Figure 4 As shown, the implementation process is as follows:

[0050] Step 410: Before electroplating, place the ceramic pad array housing into an electroplating device, and ensure that the ceramic pad array housing is supported by the steps of the boss structure.

[0051] Step 420: Use external force to press the ceramic pad array housing downward so that each pad of the ceramic pad array housing contacts the corresponding spring pin.

[0052] In some embodiments, for an electroplating device with a stopper, the stopper can be used to press the ceramic pad array housing to fix the ceramic pad array housing. Figure 5 FIG. 1 shows a schematic diagram of an assembly of an electroplating device with a rotary stopper and a ceramic pad array housing. Figure 5 In the embodiment of the present invention, the ceramic pad array housing can be fixed in the electroplating device by rotating the limiter 90 degrees.

[0053] Step 430: Place the electroplating device in an electroplating solution environment, and then energize the electroplating interface structure to perform electroplating.

[0054] In some embodiments, the electroplating apparatus can be mounted on a corresponding electroplating rack. For example, for an electroplating apparatus with a lug-shaped electroplating interface, the lug-shaped electroplating interface can be mounted on the electroplating rack. The electroplating rack is then placed in a plating solution environment so that the electroplating apparatus is submerged in the plating solution. The electroplating interface of the electroplating apparatus is then energized to perform electroplating.

[0055] In an embodiment of the present invention, an electroplating device for a ceramic pad array housing is provided, the electroplating device comprising a device body, wherein a plurality of boss structures are fixedly connected to an edge area of an upper surface of the device body, and a plurality of spring pins are installed in an upper surface area surrounded by the plurality of boss structures; wherein the upper surface of the needle tip of the spring pin in a free state is higher than the upper surface of the step of the boss structure, and the upper surface of the needle tip of the spring pin in a fully retracted state is lower than the upper surface of the step of the boss structure; when the electroplating device accommodates the ceramic pad array housing, the step of the boss structure supports the ceramic pad array housing, and the plurality of spring pins are in one-to-one contact with the plurality of pads of the ceramic pad array housing; the device body further comprises an electroplating interface structure, which is electrically connected to the spring pins through the device body.

[0056] This electroplating device, employing this specific structure, can electroplate any ceramic pad array housing without plating wires. This eliminates the need for extended plating wires, ensuring high-frequency chip applications and resolving the issues of increased signal transmission loss, reduced signal transmission quality, and deteriorating housing electrical performance associated with existing plating methods that require extended plating wires. Furthermore, because the electroplating device does not require extended plating wires from the ceramic pad array housing, it can also electroplate high-density ceramic pad array housings, resolving the issue of high-density ceramic pad array housings being unable to be plated due to a lack of space for extended plating wires.

[0057] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0058] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. An electroplating device for a ceramic pad array housing, characterized in that: The electroplating device includes a device body, a plurality of boss structures are fixedly connected to the edge area of the upper surface of the device body, and a plurality of spring pins are installed in the upper surface area surrounded by the plurality of boss structures; The upper surface of the spring pin in a free state is higher than the upper surface of the step of the boss structure, and the upper surface of the spring pin in a fully retracted state is lower than the upper surface of the step of the boss structure. When the electroplating device accommodates the ceramic pad array housing, the step of the boss structure supports the ceramic pad array housing, and the plurality of spring pins are in one-to-one contact with the plurality of pads of the ceramic pad array housing. The device body further includes an electroplating interface structure, wherein the electroplating interface structure is electrically connected to the spring pin through the device body; The electroplating interface structure is arranged on the outside of the boss structure; The electroplating interface structure is a hanging ear structure; A stopper is provided on the upper surface of the boss structure. When the electroplating device accommodates the ceramic pad array housing, the stopper can press the ceramic pad array housing.

2. The electroplating device for a ceramic pad array housing according to claim 1, wherein: The limiter is rotatably connected to the boss structure via a rotating shaft fixed on the boss structure.

3. The electroplating device for a ceramic pad array housing according to claim 1, wherein: The limiter is a telescopic limiter.

4. The electroplating device for a ceramic pad array housing according to claim 1, wherein: All parts of the electroplating device except the electroplating interface structure and the spring pins are covered with insulating material.

5. The electroplating device for a ceramic pad array housing according to claim 4, wherein: The insulating material is polyvinyl chloride or polystyrene.

6. The electroplating device for a ceramic pad array housing according to claim 1, wherein: The ceramic pad array housing includes a ceramic quad leadless housing.

7. An electroplating method using the electroplating device according to any one of claims 1 to 6, characterized in that: include: Before electroplating, the ceramic pad array housing is placed in the electroplating device, and the ceramic pad array housing is supported by the steps of the boss structure; Using external force to press the ceramic pad array housing downward so that each pad of the ceramic pad array housing contacts the corresponding spring pin; The electroplating device is placed in an electroplating solution environment, and then the electroplating interface structure is energized to perform electroplating.

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