A memory chip package and a method for manufacturing the same

Abstract

The present invention provides a storage chip package and a preparation method thereof, including a circuit board. A mounting groove is vertically provided in the middle of the circuit board. A chip body is provided in the mounting groove. Reinforcing blocks are provided on both sides of the chip body. On the opposite sides of the two reinforcing blocks, there are buckle grooves adapted to the chip body. The two sides of the chip body are respectively clamped in the two buckle grooves. Mounting guide grooves are vertically provided on the opposite side walls of the mounting groove. A clamping device for clamping the reinforcing block is provided on the groove wall of the mounting guide groove. A vertically arranged metal base is provided at the lower end of the chip body. The lower end of the metal base is connected to the bottom of the mounting groove, solving the problem that after the chip is injection-molded and encapsulated, due to its sealing performance, the heat dissipation of the chip itself is limited, resulting in the chip being easily damaged when working in a high-temperature environment for a long time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly relates to a storage chip package and a preparation method thereof. Background Art

[0002] After the main functional devices of the chip are fabricated, the chip needs to be encapsulated to form a chip package. Currently, the commonly used encapsulant is epoxy molding compound. Epoxy molding compound uses epoxy resin as the matrix resin, phenolic resin as the curing agent, and then adds some fillers, such as fillers, flame retardants, colorants, coupling agents and other trace components. Under the action of heat and the curing agent, the epoxy groups of the epoxy resin open the ring and chemically react with the phenolic resin, generating a cross-linking curing effect to make it a thermosetting plastic.

[0003] After the chip is injection-molded and encapsulated, due to its sealing property, the heat dissipation of the chip itself is limited, resulting in the chip being easily damaged when working in a high-temperature environment for a long time. Summary of the Invention

[0004] The purpose of the present invention is to provide a storage chip package and a preparation method thereof, so as to solve the problem that after the chip is injection-molded and encapsulated, due to its sealing property, the heat dissipation of the chip itself is limited, resulting in the chip being easily damaged when working in a high-temperature environment for a long time.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A storage chip package includes a circuit board. A mounting groove is vertically provided in the middle of the circuit board. A chip body is provided in the mounting groove. Reinforcing blocks are provided on both sides of the chip body. On the opposite side of the two reinforcing blocks, there are buckle grooves adapted to the chip body. The two sides of the chip body are respectively clamped in the two buckle grooves. Mounting guide grooves are vertically provided on the opposite side walls of the mounting groove. The groove wall of the mounting guide groove is provided with a clamping device for clamping the reinforcing block. A vertically arranged metal base is provided at the lower end of the chip body, and the lower end of the metal base is connected to the bottom of the mounting groove.

[0007] A further technical solution is that the clamping device includes a first compression spring and a first clamping block. On the groove wall of the mounting guide groove facing the mounting groove, a plurality of first sliding grooves are horizontally provided at equal intervals up and down. One end of the horizontally arranged first compression spring is connected to the groove wall of the first sliding groove, and the other end is connected to the first clamping block slidably arranged in the first sliding groove. A second clamping block is provided at the end of the reinforcing block away from the chip body. The upper half of the end of the first clamping block facing the second clamping block is provided with a first arc portion, and the lower half of the end of the second clamping block facing the first clamping block is provided with a second arc portion.

[0008] A further technical solution is that a heat-conducting plate is provided at the lower end of the chip body, and two spaced-apart and vertically arranged heat-dissipating columns are provided on the lower end surface of the heat-conducting plate, and the metal base is a telescopic column.

[0009] A further technical solution is that the metal base includes a first column body, a second column body and a second compression spring. A limiting groove is provided at the bottom of the installation groove. The lower end of the first column body is fixedly arranged in the limiting groove. A second sliding groove is vertically provided on the upper end surface of the first column body. The second compression spring is vertically arranged in the second sliding groove, and the upper end of the second compression spring is connected to the lower end of the second column body slidably arranged in the second sliding groove. The upper end surface of the second column body is connected to the heat-conducting plate.

[0010] A further technical solution is that a plurality of horizontally arranged grooves are provided at intervals up and down on the groove wall of the installation groove. Pins are provided in the horizontally arranged grooves. One end of the pins in the installation groove is connected to an integrated wire, and the integrated wire is connected to the chip body through a connecting wire.

[0011] A further technical solution is that two injection holes are provided at the bottom of the circuit board. The two injection holes are symmetrically arranged with respect to the metal base, and both of the two injection holes are communicated with the installation groove.

[0012] A method for preparing a chip package body is to clamp both ends of the chip body in the buckle grooves of the reinforcing blocks, and make the second clamping block and the first clamping block be buckled and connected along the installation guiding groove, so that a heat-dissipating cavity is left between the chip body and the bottom of the installation groove. At the same time, an insulating packaging material is injected into the upper part of the installation groove and the injection holes.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0014] The chip body is fixedly arranged in the installation groove by the clamping device through the reinforcing blocks, so that the chip body maintains a stable position after installation. And because the reinforcing blocks are connected to the clamping device, it is avoided that the clamping device directly contacts the chip body and causes extrusion to the chip body. Furthermore, the chip body is effectively protected from being damaged during installation. The metal base provided at the lower end of the chip body is convenient for heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of a chip package body and a preparation method thereof according to the present invention.

[0016] Figure 2 It is a top view of the circuit board in the present invention.

[0017] Icons: 1 - circuit board, 2 - mounting groove, 3 - chip body, 4 - reinforcement block, 5 - snap groove, 6 - mounting guide groove, 7 - metal base, 8 - first compression spring, 9 - first latch, 10 - first chute, 11 - second latch, 12 - first arc portion, 13 - second arc portion, 14 - heat conducting plate, 15 - heat dissipation column, 16 - first cylinder, 17 - second cylinder, 18 - second compression spring, 19 - limiting groove, 20 - second chute, 21 - horizontal groove, 22 - pin, 23 - integrated wire, 24 - connecting wire, 25 - injection hole. Detailed implementation mode

[0018] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0019] Embodiment 1:

[0020] Figure 1-2 A preferred implementation mode of a storage chip package body and a preparation method thereof according to the present invention is shown. The storage chip package body in this embodiment specifically includes a circuit board 1. A mounting groove 2 is vertically provided in the middle of the circuit board 1. A chip body 3 is provided in the mounting groove 2. Reinforcement blocks 4 are provided on both sides of the chip body 3. Snap grooves 5 adapted to the chip body 3 are provided on the opposite sides of the two reinforcement blocks 4. The two sides of the chip body 3 are respectively clamped in the two snap grooves 5. Mounting guide grooves 6 are vertically provided on the opposite side walls of the mounting groove 2. A clamping device for clamping the reinforcement block 4 is provided on the groove wall of the mounting guide groove 6. A vertically arranged metal base 7 is provided at the lower end of the chip body 3. The lower end of the metal base 7 is connected to the bottom of the mounting groove 2.

[0021] In the present invention, the chip body 3 is fixedly arranged in the mounting groove 2 by the clamping device through the reinforcement block 4, so that the chip body 3 maintains a stable position after installation. And by connecting the reinforcement block 4 with the clamping device, it is avoided that the clamping device directly contacts the chip body 3 and causes extrusion to the chip body 3, thereby effectively protecting the chip body 3 from being damaged during installation. The metal base 7 provided at the lower end of the chip body 3 is convenient for heat dissipation.

[0022] By using the provided metal base 7, a heat dissipation cavity is reserved between the chip body 3 and the bottom of the mounting groove 2.

[0023] Embodiment 2:

[0024] On the basis of Embodiment 1, the clamping device includes a first compression spring 8 and a first clamping block 9. A plurality of first sliding grooves 10 are horizontally arranged at equal intervals up and down on one side wall of the installation guiding groove 6 facing the installation groove 2. One end of the horizontally arranged first compression spring 8 is connected to the groove wall of the first sliding groove 10, and the other end is connected to the first clamping block 9 slidably arranged in the first sliding groove 10. One end of the reinforcing block 4 away from the chip body 3 is provided with a second clamping block 11. The upper half of one end of the first clamping block 9 facing the second clamping block 11 is provided with a first arc portion 12, and the lower half of one end of the second clamping block 11 facing the first clamping block 9 is provided with a second arc portion 13. When installing the chip body 3, the two sides of the chip body 3 are respectively clamped in the two clamping grooves 5, and then the second clamping block 11 is slid in the installation guiding groove 6 along the installation guiding groove 6. When the second arc portion 13 of the second clamping block 11 contacts and presses the first arc portion 12 of the first clamping block 9, the first clamping block 9 is pressed to contract the first compression spring 8 until the first clamping block 9 completely slides into the first sliding groove 10. At this time, continue to press down the second clamping block 11. When the chip body 3 is installed in the preset position, the first clamping block 9 is arranged on the upper end surface of the second clamping block 11 to limit and fix the second clamping block 11, so that the chip body 3 is stably installed in the installation groove 2.

[0025] A heat conducting plate 14 is provided at the lower end of the chip body 3. Two spaced and vertically arranged heat dissipating columns 15 are provided on the lower end surface of the heat conducting plate 14. The metal base 7 is a telescopic column, and the heat conducting plate 14 and the heat dissipating columns 15 further dissipate heat from the chip body 3.

[0026] The metal base 7 includes a first column body 16, a second column body 17 and a second compression spring 18. A limiting groove 19 is provided at the bottom of the installation groove 2. The lower end of the first column body 16 is fixedly arranged in the limiting groove 19. A second sliding groove 20 is vertically arranged on the upper end surface of the first column body 16. The second compression spring 18 is vertically arranged in the second sliding groove 20, and the upper end of the second compression spring 18 is connected to the lower end of the second column body 17 slidably arranged in the second sliding groove 20. The upper end surface of the second column body 17 is connected to the heat conducting plate 14. When installing chip bodies 3 with different thicknesses, it is required that the metal base 7 has different heights. Therefore, the first column body 16 and the second column body 17 are slidably connected vertically, and the second compression spring 18 makes the second column body 17 always have an upward extrusion force to ensure that the entire metal base 7 is always stably connected to the chip body 3. The metal base 7 is used for heat conduction and can be made of common copper material.

[0027] The groove wall of the installation groove 2 is provided with a plurality of horizontal grooves 21 arranged at intervals up and down. A pin 22 is arranged in the horizontal groove 21. One end of the pin 22 in the installation groove 2 is connected to an integrated wire 23. The integrated wire 23 is connected to the chip body 3 through a connection wire 24. Two injection holes 25 are provided at the bottom of the circuit board 1. The two injection holes 25 are symmetrically arranged with respect to the metal base 7, and both of the two injection holes 25 are communicated with the installation groove 2. The integrated wire 23 and the connection wire 24 are arranged in the installation groove 2, and then injection molding is carried out into the installation groove 2 to ensure the connection stability between the pin 22, the integrated wire 23, the connection wire 24 and the chip body 3.

[0028] A preparation method of a chip package body. Both ends of the chip body 3 are clamped in the buckle grooves 5 of the reinforcing blocks 4. Along the installation guide groove 6, the second clamping block 11 is buckled and connected with the first clamping block 9, so that a heat dissipation cavity is left between the chip body 3 and the bottom of the installation groove 2. At the same time, an injection-molded insulating packaging material is injected into the upper part of the installation groove 2 and the injection holes 25.

[0029] By providing two injection holes 25 at the bottom of the circuit board 1, injection molding can be carried out into the installation groove 2 at the same time. The injection-molded insulating packaging material here can be silicone or ABS plastic.

[0030] Although the present invention has been described herein with reference to a number of illustrative embodiments of the present invention, it should be understood that those skilled in the art can design many other modifications and embodiments that will fall within the scope of the principles and spirit of the present application. More specifically, within the scope of the present application disclosure, the drawings and the claims, various variations and improvements can be made to the components and / or the layout of the subject combination layout. In addition to the variations and improvements made to the components and / or the layout, other uses will also be apparent to those skilled in the art.

Claims

1. A storage chip package, characterized in that: It includes a circuit board (1). An installation groove (2) is vertically provided in the middle of the circuit board (1). A chip body (3) is provided in the installation groove (2). Reinforcing blocks (4) are provided on both sides of the chip body (3). On the opposite sides of the two reinforcing blocks (4), buckle grooves (5) adapted to the chip body (3) are provided. The two sides of the chip body (3) are respectively clamped in the two buckle grooves (5). Installation guide grooves (6) are vertically provided on the opposite side walls of the installation groove (2). A clamping device for clamping the reinforcing block (4) is provided on the groove wall of the installation guide groove (6). A vertically arranged metal base (7) is provided at the lower end of the chip body (3). The lower end of the metal base (7) is connected to the bottom of the installation groove (2). A heat conducting plate (14) is provided at the lower end of the chip body (3). Two spaced and vertically arranged heat dissipation columns (15) are provided on the lower end surface of the heat conducting plate (14). The metal base (7) is a telescopic column. The metal base (7) includes a first column body (16), a second column body (17) and a second compression spring (18). A limiting groove (19) is provided at the bottom of the installation groove (2). The lower end of the first column body (16) is fixedly arranged in the limiting groove (19). A second sliding groove (20) is vertically provided on the upper end surface of the first column body (16). The second compression spring (18) is vertically arranged in the second sliding groove (20), and the upper end of the second compression spring (18) is connected to the lower end of the second column body (17) slidably arranged in the second sliding groove (20). The upper end surface of the second column body (17) is connected to the heat conducting plate (14).

2. The chip storage package according to claim 1, wherein: The clamping device includes a first compression spring (8) and a first clamping block (9). A plurality of first sliding grooves (10) which are horizontally arranged at equal intervals up and down are provided on the side groove wall of the installation guide groove (6) facing the installation groove (2). One end of the horizontally arranged first compression spring (8) is connected to the groove wall of the first sliding groove (10), and the other end is connected to the first clamping block (9) slidably arranged in the first sliding groove (10). A second clamping block (11) is provided at the end of the reinforcing block (4) away from the chip body (3). The upper half of the end of the first clamping block (9) facing the second clamping block (11) is provided with a first arc part (12). The lower half of the end of the second clamping block (11) facing the first clamping block (9) is provided with a second arc part (13).

3. A chip storage package according to claim 1, characterized in that: A plurality of horizontally arranged grooves (21) which are spaced up and down are provided on the groove wall of the installation groove (2). Pins (22) are provided in the horizontally arranged grooves (21). One end of the pins (22) in the installation groove (2) is connected to an integrated wire (23). The integrated wire (23) is connected to the chip body (3) through a connecting wire (24).

4. A chip storage package according to claim 1, characterized in that: Two injection holes (25) are provided at the bottom of the circuit board (1). The two injection holes (25) are symmetrically arranged with respect to the metal base (7), and both of the two injection holes (25) are communicated with the installation groove (2).

5. A method for preparing a storage chip package according to any one of claims 1-4, characterized in that: Clamp both ends of the chip body (3) in the buckle slots (5) of the reinforcement blocks (4), and along the installation guide slots (6), snap the second clamping blocks (11) and the first clamping blocks (9) together, so as to leave a heat dissipation cavity between the chip body (3) and the bottom of the installation slot (2). At the same time, inject an insulating encapsulation material above the installation slot (2) and into the injection holes (25).

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