A method for slotting a packaging structure and a packaging structure

Abstract

The present invention relates to the technical field of packaging structure processing, and discloses a grooving method for a packaging structure and a packaging structure. The grooving method for a packaging structure comprises: providing a structure to be packaged, the structure to be packaged comprises a circuit board substrate, an electronic component and a shielding member, the shielding member connects a conductor through a shielding groove to isolate electromagnetic interference inside and outside the enclosed area; obtaining installation position information of the shielding member relative to the circuit board substrate; plastic-sealing the structure to be packaged to form a packaging layer, and forming a packaging structure; and opening a shielding groove on the packaging layer facing the shielding member according to the installation position information. The installation position information of the present invention is the relative position of the shielding member and the circuit board substrate, so it can compensate for the installation error of the shielding member, effectively avoid the risk of displacement of the shielding groove caused by the deviation of the installation position of the shielding member, ensure the accuracy of the opening position of the shielding groove, improve the yield rate of the packaging structure, and make the performance of the processed packaging structure more stable.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging structure processing, and in particular to a packaging structure grooving method and a packaging structure. Background Art

[0002] At present, the shielding parts used to shield electromagnetic interference between different modules are plastic-encapsulated in the packaging layer, so that they can be connected with the subsequent plating layer to play the role of electronic shielding. To achieve the above purpose, the shielding parts need to be exposed through laser grooving.

[0003] In the prior art, the shielding component is plastic-encapsulated in the packaging layer, and the iron cover is set on the PCB by the SMT process. Due to the limitation of the processing accuracy of the SMT process, the installation position of the shielding component on different products will inevitably have deviations, but the laser processing head can only process the shielding groove based on the positioning result of the PCB based on the existing positioning points. Therefore, when there is a deviation in the installation position of the shielding component, the installation error of the shielding component cannot be compensated. If the shielding component is offset too much, it will be like Figure 1 The risk of the shielding grooves being displaced as shown could result in shield failure, affecting the overall performance of the circuit board.

[0004] Therefore, a method for cutting a slot of a packaging structure and a packaging structure are urgently needed to solve the above problems. Summary of the invention

[0005] Based on the above, the object of the present invention is to provide a method for opening a groove of a packaging structure and a packaging structure, wherein the grooves are opened more accurately, the yield rate is higher, and the performance is more stable.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] A method for cutting grooves in a packaging structure, the method comprising:

[0008] Providing a structure to be packaged, the structure to be packaged comprising a circuit board substrate, an electronic component and a shielding member, wherein the shielding member is connected to a conductor via a shielding groove to isolate electromagnetic interference inside and outside the enclosed area;

[0009] Acquiring installation position information of the shielding component relative to the circuit board substrate;

[0010] Plastic-sealing the structure to be packaged to form a packaging layer, and forming a packaging structure;

[0011] A shielding groove facing the shielding component is opened on the packaging layer according to the installation position information.

[0012] As a preferred solution for a grooving method of a packaging structure, the shielding component has a characteristic positioning portion, and the circuit board substrate is provided with multiple positioning points; the characteristic positioning portion and the positioning points are identified by a CCD positioning device to obtain the installation position information of the shielding component relative to the circuit board substrate.

[0013] As a preferred solution for a grooving method of a packaging structure, the feature positioning portion includes a first edge and a second edge, wherein the first edge and the corresponding positioning point are used to identify position information in a first direction, and the second edge and the corresponding positioning point are used to identify position information in a second direction.

[0014] As a preferred scheme of a grooving method for a packaging structure, when the shielding component is at the target position, the position information of the shielding component relative to the positioning points is preset position information, and the preset position information includes a first target distance between a first side of the shielding component at the target position and a line connecting at least two of the positioning points, a second target distance between a second side of the shielding component at the target position and a line connecting at least two of the positioning points, and a target rotation direction and a target rotation angle of the shielding component relative to a circuit board substrate.

[0015] As a preferred solution of the slotting method of a packaging structure, the installation position information of the shielding component relative to the circuit board substrate is obtained, and the installation position information includes: a first distance between a first side of the shielding component at a current position and a line connecting at least two of the positioning points; a second distance between a second side of the shielding component at a current position and a line connecting at least two of the positioning points; a rotation direction and a rotation angle of the shielding component;

[0016] Calculate the offset information between the installation position information and the preset position information, wherein the difference between the first distance and the first target distance is the offset in the first direction, and the difference between the second distance and the second target distance is the offset in the second direction; the difference between the rotation angle and the target rotation angle is the offset in the rotation direction;

[0017] A shielding groove facing the shielding component is opened on the packaging layer according to the offset information.

[0018] As a preferred scheme of a grooving method for a packaging structure, before opening a shielding groove facing the shielding component on the packaging layer according to the offset information, it also includes judging whether the offset information exceeds a preset range. If so, an alarm is issued and the process ends.

[0019] A packaging structure is manufactured by using the grooving method of the packaging structure described in any of the above solutions.

[0020] The beneficial effects of the present invention are:

[0021] The present invention obtains the installation position information of the shielding component relative to the processing machine after installing the electronic component on the circuit board substrate and the shielding component covering the electronic component. Since the installation position information is the relative position of the shielding component and the processing machine, the installation position information can compensate for the installation error of the shielding component, so that after the packaging is completed, the shielding groove can be opened according to the accurate position of the shielding component, which effectively avoids the risk of displacement of the shielding groove caused by the deviation of the installation position of the shielding component, ensures the accuracy of the opening position of the shielding groove, improves the yield rate of the packaging structure, and makes the performance of the processed packaging structure more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0023] Figure 1 It is a schematic diagram of the displacement of the shielding groove caused by the slotting method of the packaging structure provided by the prior art;

[0024] Figure 2 is a schematic diagram of a packaging structure provided by a specific embodiment of the present invention;

[0025] Figure 3 is a schematic diagram of another packaging structure provided by a specific embodiment of the present invention;

[0026] Figure 4 is a schematic diagram of a processing device and a packaging structure of a packaging structure provided in a specific embodiment of the present invention;

[0027] Figure 5 It is a schematic diagram of identifying the installation position of the CCD positioning device provided in a specific embodiment of the present invention.

[0028] In the figure:

[0029] 10. Circuit board substrate; 21. Electronic component; 22. Shielding member; 221. First side; 222. Second side; 30. Packaging layer; 41. Shielding groove;

[0030] 100, positioning point; 300, laser machine. DETAILED DESCRIPTION

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0032] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0033] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0035] like Figure 2-Figure 4 As shown, the present embodiment also discloses a packaging structure, which is manufactured by a grooving method of a packaging structure. The packaging structure includes a circuit board substrate 10, an electronic component 21 arranged on the circuit board substrate 10, and a packaging layer 30 for packaging the electronic component 21. A shielding member 22 for shielding the electronic component 21 is also provided on the circuit board substrate 10. A shielding groove 41 is also provided on the packaging layer 30, and the shielding groove 41 is directly opposite to the shielding member 22. The shielding member 22 is connected to the conductor through the shielding groove 41 to isolate the electromagnetic interference inside and outside the enclosed area. The shielding groove 41 of the above-mentioned packaging structure is accurately opened, and the overall performance is more stable.

[0036] This embodiment provides a method for grooving a packaging structure, which can be used for processing the above packaging structure. The method for grooving a packaging structure includes: providing a structure to be packaged, the structure to be packaged includes a circuit board substrate 10, an electronic component 21 and a shielding member 22, the shielding member 22 is connected to a conductor through a shielding groove 41 to isolate electromagnetic interference inside and outside the enclosed area; obtaining the installation position information of the shielding member 22 relative to the circuit board substrate 10; plastic-sealing the structure to be packaged to form a packaging layer 30, and forming a packaging structure; and opening a shielding groove 41 on the packaging layer 30 facing the shielding member 22 according to the installation position information.

[0037] By installing the electronic component 21 and the shielding component 22 covering the electronic component 21 on the circuit board substrate 10, the installation position information of the shielding component 22 relative to the circuit board substrate 10 is obtained. Since the installation position information is the relative position of the shielding component 22 and the circuit board substrate 10, the installation position information can compensate for the installation error of the shielding component 22, so that after the packaging is completed, the shielding groove 41 can be opened according to the accurate position of the shielding component 22, effectively avoiding the risk of displacement of the shielding groove 41 caused by the installation position deviation of the shielding component 22, ensuring the accuracy of the opening position of the shielding groove 41, improving the yield rate of the packaging structure, and making the performance of the processed packaging structure more stable.

[0038] As an alternative to slotting a package structure, Figure 5 As shown, obtaining the installation position information of the shielding component 22 relative to the circuit board substrate 10 specifically includes: the shielding component 22 has a characteristic positioning portion, and the circuit board substrate 10 is provided with multiple positioning points 100; the characteristic positioning portion and the positioning points 100 are identified by a CCD positioning device to obtain the installation position information of the shielding component 22 relative to the circuit board substrate 10.

[0039] Specifically, the feature positioning portion includes a first side 221 and a second side 222, wherein the first side 221 and the corresponding positioning point 100 are used to identify the position information of the first direction, and the second side 222 and the corresponding positioning point 100 are used to identify the position information of the second direction. Optionally, the first side 221 and the second side 222 are two sides arranged at an angle. In this embodiment, the first side 221 and the second side 222 are perpendicular to each other.

[0040] Further, when the shielding member 22 is at the target position, the position information of the shielding member 22 relative to the positioning point 100 is the preset position information, and the preset position information includes the first target distance between the first side 221 of the shielding member 22 at the target position and the line connecting at least two positioning points 100, the second target distance between the second side 222 of the shielding member 22 at the target position and the line connecting at least two positioning points 100, and the target rotation direction and target rotation angle of the shielding member 22 relative to the circuit board substrate 10. It can be understood that the preset position information is stored in the equipment used for mining by the slotting method using the above-mentioned packaging structure.

[0041] As an optional scheme for the grooving method of a packaging structure, the specific steps of opening the shielding groove 41 include: obtaining the installation position information of the shielding component 22 relative to the circuit board substrate 10, the installation position information including: a first distance between the first side 221 of the shielding component 22 when it is in the current position and a line connecting at least two positioning points 100; a second distance between the second side 222 of the shielding component 22 when it is in the current position and a line connecting at least two positioning points 100; a rotation direction and a rotation angle of the shielding component 22; wherein a line connecting two positioning points 100 at a first distance from the first side 221 is parallel to the first side 221, and similarly, a line connecting two positioning points 100 at a second distance from the second side 222 is parallel to the second side 222.

[0042] Calculate the offset information between the installation position information and the preset position information, wherein the difference between the first distance and the first target distance is the offset in the first direction, and the difference between the second distance and the second target distance is the offset in the second direction; the difference between the rotation angle and the target rotation angle is the offset in the rotation direction; by calculating the offset information, it is helpful to improve the adjustment time and thus improve the processing efficiency.

[0043] A shielding groove 41 facing the shielding element 22 is opened on the packaging layer 30 according to the offset information.

[0044] It is worth noting that the CCD positioning device is connected to the laser machine 300 for opening the shielding groove 41, and the preset position information is pre-stored in the CCD positioning device. The CCD positioning device calculates the obtained installation position information and the pre-stored preset position information to obtain the offset information, and sends the offset information to the laser machine 300. The laser machine 300 adjusts the position according to the offset information to process the shielding groove 41 that meets the offset information and faces the electronic component 21, thereby ensuring the accuracy of the opening position of the shielding groove 41.

[0045] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The content of this specification should not be understood as limiting the present invention.

Claims

1. A method for slotting a packaging structure, characterized in that: The grooving method of the packaging structure comprises: A structure to be packaged is provided, the structure to be packaged comprising a circuit board substrate (10), an electronic component (21) and a shielding member (22), wherein the shielding member (22) is connected to a conductor via a shielding groove (41) to isolate electromagnetic interference inside and outside the enclosed area; Acquiring installation position information of the shielding component (22) relative to the circuit board substrate (10); Plastic-sealing the structure to be packaged to form a packaging layer (30), and forming a packaging structure; According to the installation position information, a shielding groove (41) facing the shielding element (22) is opened on the packaging layer (30); The shielding component (22) has a characteristic positioning portion, and the circuit board substrate (10) is provided with a plurality of positioning points (100); the characteristic positioning portion and the positioning points (100) are identified by a CCD positioning device to obtain installation position information of the shielding component (22) relative to the circuit board substrate (10); The feature positioning portion comprises a first edge (221) and a second edge (222), wherein the first edge (221) and the corresponding positioning point (100) are used to identify position information in a first direction, and the second edge (222) and the corresponding positioning point (100) are used to identify position information in a second direction.

2. The method for cutting a groove of a packaging structure according to claim 1, characterized in that: When the shielding component (22) is at the target position, the position information of the shielding component (22) relative to the positioning points (100) is preset position information, and the preset position information includes a first target distance between a first side (221) of the shielding component (22) at the target position and a line connecting at least two of the positioning points (100), a second target distance between a second side (222) of the shielding component (22) at the target position and a line connecting at least two of the positioning points (100), and a target rotation direction and a target rotation angle of the shielding component (22) relative to the circuit board substrate (10).

3. The method for cutting grooves in a packaging structure according to claim 2, characterized in that: Acquiring installation position information of the shielding component (22) relative to the circuit board substrate (10), the installation position information comprising: a first distance between a first side (221) of the shielding component (22) at a current position and a line connecting at least two of the positioning points (100); a second distance between a second side (222) of the shielding component (22) at a current position and a line connecting at least two of the positioning points (100); and a rotation direction and rotation angle of the shielding component (22); Calculate the offset information between the installation position information and the preset position information, wherein the difference between the first distance and the first target distance is the offset in the first direction, and the difference between the second distance and the second target distance is the offset in the second direction; the difference between the rotation angle and the target rotation angle is the offset in the rotation direction; A shielding groove (41) facing the shielding element (22) is opened on the packaging layer (30) according to the offset information.

4. The method for cutting grooves in a packaging structure according to claim 3, characterized in that: Before the shielding groove (41) facing the shielding element (22) is opened on the packaging layer (30) according to the offset information, it is also included to determine whether the offset information exceeds a preset range, and if so, an alarm is issued and the process ends.

5. A packaging structure, characterized in that: The packaging structure is manufactured by the grooving method according to any one of claims 1 to 4.

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