Printed circuit board including a ground trace

Abstract

A printed circuit board includes a first layer including a first ground, the first ground including a first opening, wherein a first ground trace is in the first opening; a second layer disposed in a direction away from the first layer and including a second ground, the second ground including a second opening, wherein the second opening at least partially overlaps the first opening and wherein a second ground trace is in the second opening; a third layer between the first layer and the second layer and including a third opening, wherein the third opening at least partially overlaps the first opening and wherein a first via pad is in the third opening; and a fourth layer between the second layer and the third layer and including a fourth opening, wherein the fourth opening at least partially overlaps the third opening and wherein a second via pad is in the fourth opening.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to printed circuit boards including ground lines. Background Technology

[0002] To meet the increasing demand for wireless data traffic since the deployment of 4G communication systems, efforts have been made to develop improved 5G or pre-5G communication systems. Therefore, 5G or pre-5G communication systems are also referred to as "beyond 4G network" communication systems or "post-LTE" systems.

[0003] 5G communication systems are considered to be implemented in millimeter-wave bands (e.g., 60 GHz band) to achieve higher data rates. To reduce radio wave propagation loss and increase transmission distance in the UHF band, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, and massive MIMO technologies are discussed in 5G communication systems.

[0004] In addition, in 5G communication systems, development for system network improvements is underway based on advanced small cells, cloud radio access networks (cloud RAN), ultra-dense networks, device-to-device (D2D) communication, wireless backhaul, moving networks, cooperative communication, cooperative multipoint (CoMP), and receiver interference cancellation.

[0005] In 5G systems, hybrid FSK and QAM modulation (FQAM) and sliding window superposition coding (SWSC) as advanced coding and modulation (ACM), as well as filter bank multicarrier (FBMC), non-orthogonal multiple access (NOMA) and sparse code multiple access (SCMA) as advanced access technologies, have also been developed. Summary of the Invention

[0006] Technical issues

[0007] To provide compact products, printed circuit boards (such as printed circuit boards (PCBs) and flexible PCBs (FPCBs)) can be used to connect antennas and communication modules (such as 5G, WiFi, etc.) or for high-speed interfaces. Regarding PCBs for electronic devices, grounding in areas adjacent to via pads can be removed to prevent signal congestion. However, when electronic devices are used in the UHF band, impedance mismatch can occur in open areas where no grounding is formed, leading to RF losses.

[0008] Various embodiments of this disclosure may provide a printed circuit board that can reduce impedance mismatch that can occur in an opening region formed on a ground having via pads located thereon.

[0009] The problems to be solved by the embodiments of this disclosure are not limited to those described above, and can be extended in various ways without departing from the spirit and scope of this disclosure.

[0010] Technical solution

[0011] According to various embodiments of the present disclosure, a printed circuit board is provided. The printed circuit board includes: a first layer including a first ground, the first ground including a first opening, wherein at least one first ground line is in the first opening; a second layer disposed in a direction away from the first layer and including a second ground, the second ground including a second opening, wherein the second opening at least partially overlaps with the first opening, and wherein at least one second ground line is in the second opening; a third layer between the first layer and the second layer and including a third opening, wherein the third opening at least partially overlaps with the first opening, and wherein a first via pad is in the third opening; a fourth layer between the second layer and the third layer and including a fourth opening, wherein the fourth opening at least partially overlaps with the third opening, and wherein a second via pad is in the fourth opening; and a via, which is at least partially surrounded by the first via pad and the second via pad.

[0012] Technical effect

[0013] Printed circuit boards according to various embodiments of this disclosure can reduce UHF signal loss by being configured to form a ground line capacitively coupled to the path pads.

[0014] Printed circuit boards according to various embodiments of this disclosure can provide impedance matching by using ground lines formed by adjacent pathways. Attached Figure Description

[0015] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0016] Figure 2 This is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0017] Figure 3 This is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0018] Figure 4 This is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0019] Figure 5 This is a rear perspective view of a first support member according to various embodiments of the present disclosure.

[0020] Figure 6 This is a perspective view of a printed circuit board according to various embodiments of the present disclosure.

[0021] Figure 7 It shows along Figure 6 A perspective view of the cross-section of the face intercepted by line A-A'.

[0022] Figure 8 It shows along Figure 6 A cross-sectional view of the surface intercepted by line B-B' in the diagram.

[0023] Figure 9 This is a perspective view of a printed circuit board according to an embodiment of the present disclosure.

[0024] Figure 10 This is a perspective view of a printed circuit board according to another embodiment of the present disclosure.

[0025] Figure 11 This is a perspective view of a printed circuit board according to another embodiment of the present disclosure.

[0026] Figure 12 This is a perspective view of a printed circuit board according to another embodiment of the present disclosure.

[0027] Figure 13 This is a perspective view of a printed circuit board according to another embodiment of the present disclosure.

[0028] Figure 14 This is a graph showing the S-parameters of an electronic device according to various embodiments of the present disclosure. Detailed Implementation

[0029] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0030] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input device 150, sound output device 155, display device 160, audio module 170, sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of these components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display).

[0031] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) and an auxiliary processor 123 (e.g., graphics processing unit (GPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, auxiliary processor 123 may be adapted to consume less power than main processor 121, or adapted for a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or it can be implemented as part of the main processor 121.

[0032] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 may control at least some of the functions or states associated with at least one component of the electronic device 101 (other than the main processor 121), such as display device 160, sensor module 176, or communication module 190. Alternatively, when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101, such as display device 160, sensor module 176, or communication module 190. According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123.

[0033] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0034] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0035] Input device 150 can receive commands or data from outside electronic device 101 (e.g., a user) to be used by components of electronic device 101 (e.g., processor 120). Input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (e.g., stylus).

[0036] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0037] Display device 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display device 160 may include touch circuitry adapted to detect touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of the force caused by touch.

[0038] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or an external electronic device (e.g., electronic device 102 (e.g., a speaker or headphones)) that is directly or wirelessly connected to the electronic device 101.

[0039] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0040] Interface 177 may support one or more specific protocols used to enable direct or wireless connection between electronic device 101 and external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0041] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0043] Camera module 180 can capture still images and moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0044] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0045] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0046] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0047] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, the antenna module may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, antenna module 197 may include multiple antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0048] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0049] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 and electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would run on electronic device 101 can be run on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or should perform a function or service in response to (based on) a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, either with further processing or without further processing. For this purpose, technologies such as cloud computing, distributed computing, or client-server computing may be used.

[0050] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0051] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0052] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0053] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-described components or operations may be omitted, or one or more other components or operations may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0054] Figure 2 This is a front perspective view of an electronic device 101 according to various embodiments of the present disclosure. Figure 3 This is a rear perspective view of an electronic device 101 according to various embodiments of the present disclosure.

[0055] refer to Figure 2 and Figure 3 According to one embodiment, the electronic device 101 may include a housing 310, the housing 310 including a front surface 310A, a rear surface 310B, and side surfaces (e.g., surrounding the space between the front surface 310A and the rear surface 310B) Figure 2 and Figure 3 (side surface 310C in the middle). According to another embodiment, the housing 310 may refer to the formation of Figure 2 The first surface shown in the figure (e.g.) Figure 2 (front surface 310A), second surface (e.g.) Figure 3 The structure of a portion of the rear surface 310B and the side surface 310C.

[0056] According to one embodiment, the front surface 310A may be formed of a front panel 302 (e.g., a glass panel including various coatings, or a polymer panel), at least a portion of which is substantially transparent. The rear surface 310B may be formed of a rear panel 311. For example, the rear panel 311 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 310C may be coupled to the front panel 302 and the rear panel 311, and may be formed of a side frame structure (or “side member”) 318 including metal and / or polymer. In some embodiments, the rear panel 311 and the side frame structure 318 may be integrally formed and may include the same material (e.g., ceramic).

[0057] In the illustrated embodiment, the front panel 302 may include two first edge regions 310D, which curve seamlessly from the front surface 310A toward the rear panel 311 and are disposed at the long, opposing ends of the front panel 302. In the illustrated embodiment (see...) Figure 3 The rear panel 311 may include two second edge regions 310E, which are curved from the rear surface 310B toward the front panel 302 to extend seamlessly and are disposed at their long ends opposite each other. In some embodiments, the front panel 302 (or the rear panel 311) may include only one of the first edge region 310D (or the second edge region 310E). In another embodiment, a portion of the first edge region 310D or the second edge region 310E may not be included therein. In an embodiment, when viewed from the side surface of the electronic device 101, the side frame structure 318 may have a first thickness (or width) on the side surface side excluding the first edge region 310D or the second edge region 310E, and may have a second thickness thinner than the first thickness on the side surface side including the first edge region 310D or the second edge region 310E.

[0058] According to one embodiment, the electronic device 101 may include a display 301, an audio module (e.g., a microphone hole 303, an external speaker hole 307, and a receiver hole 314, such as...) Figure 1 The audio module 170 and sensor module (e.g.) Figure 1 The sensor module 176), camera module (e.g., first camera module 305 and second camera module 312), and key input device 317 (e.g.) Figure 1 The input device 150), and connector holes (e.g., first connector hole 308 and second connector hole 309, such as...) Figure 1 At least one of the connection terminals 178 in the electronic device 101. In some embodiments, at least one of the components of the electronic device 101 (e.g., key input device 317 or first connector hole 308) may be omitted, and the electronic device 101 may additionally include other components.

[0059] According to one embodiment, for example, the display 301 may be exposed through a considerable portion of the front panel 302. In some embodiments, at least a portion of the display 301 may be exposed through the front surface 310A and the first edge region 310D forming the side surface 310C of the front panel 302. In some embodiments, the corners of the display 301 may be formed to have a shape substantially the same as the external shape of the adjacent front panel 302. In another embodiment, to increase the area allowing the display 301 to be exposed, the gap between the outer periphery of the display 301 and the outer periphery of the front panel 302 may be formed to be substantially the same.

[0060] In one embodiment, the surface of the housing 310 (or the front panel 302) may include a screen display area formed to be visually exposed to the display 301. As an example, the screen display area may include a front surface 310A and a first edge region 310D of a side surface.

[0061] In another embodiment, a recess or opening may be formed in a portion of the screen display area of ​​the display 301 (e.g., the front surface 310A or the first edge region 310D), and at least one of the receiver hole 314, the sensor module (not shown), the light-emitting element (not shown), and the first camera module 305 may be included therein, with the at least one of the audio module 314, the sensor module (not shown), the light-emitting element (not shown), and the camera module 305 aligned with the recess or opening. In another embodiment (not shown), at least one of the receiver hole 314, the sensor module (not shown), the first camera module 305, and the light-emitting element (not shown) may be included on the rear surface of the screen display area of ​​the display 301.

[0062] In another embodiment, the display 301 may be connected to or configured to a proximity touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field stylus.

[0063] In some embodiments, at least a portion of the key input device 317 may be disposed in the first edge region 310D and / or the second edge region 310E.

[0064] According to one embodiment, for example, the audio module may include a microphone hole 303 and a speaker hole. The microphone hole 303 may have a microphone disposed therein for acquiring external sound, and in some embodiments, multiple microphones may be arranged to detect the direction of sound. The speaker hole may include an external speaker hole 307 for telephone calls and a receiver hole 314. In some embodiments, the speaker hole and microphone hole 303 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included therein without a speaker hole.

[0065] According to one embodiment, for example, a sensor module (not shown) may be configured to generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 101. For example, the sensor module (not shown) may include a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front surface 310A of the housing 310, and / or a third sensor module (not shown) (e.g., an HRM sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on the rear surface 310B of the housing 310. In some embodiments, the fingerprint sensor may be disposed on both the rear surface 310B and the front surface 310A (e.g., the display 301) of the housing 310. The electronic device 101 may also include a sensor module, such as at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown).

[0066] According to one embodiment, for example, the camera module may include a first camera module 305 disposed on the front surface 310A of the electronic device 101, and a second camera module 312 and / or a flash 313 disposed on the rear surface 310B. Each of the first camera module 305 and the second camera module 312 may include one or more lenses, an image sensor, and / or an image signal processor. For example, the flash 313 may include a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be arranged on one surface of the electronic device 101.

[0067] According to one embodiment, the key input device 317 may be disposed on the side 310C of the housing 310. In another embodiment, the electronic device 101 may not include some or all of the aforementioned key input device 317, and the key input device 317 not included therein may be implemented as different types, such as soft keys, on the display 301.

[0068] According to one embodiment, for example, a light-emitting element (not shown) may be disposed on the front surface 310A of the housing 310. For example, the light-emitting element (not shown) may be configured to provide status information of the electronic device 101 in the form of light. In another embodiment, for example, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module 305. For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0069] According to one embodiment, for example, the connector hole may include a first connector hole 308 and / or a second connector hole 309 (e.g., a headphone jack), the first connector hole 308 being capable of accommodating a connector (e.g., a USB connector) for transmitting power and / or data to or receiving power and / or data from an external electronic device, and the second connector hole 309 being capable of accommodating a connector for transmitting audio signals to or receiving audio signals from an external electronic device.

[0070] Figure 4 This is an exploded perspective view of an electronic device 101 according to various embodiments of the present disclosure. Figure 5 yes Figure 4 Rear perspective view of the first support member 332.

[0071] refer to Figure 4 and Figure 5 Electronic device 101 (e.g.) Figure 2 and Figure 3 The electronic device 101 in the middle may include a front panel 320 (e.g., Figure 2 Front panel 302), display 330 (e.g.) Figure 2 The display 301), first support member 332 (e.g., bracket), main printed circuit board 340 (e.g., PCB), printed circuit board 400 (e.g., FPCB), battery 350, second support member 360 (e.g., rear cover), first antenna 334, second antenna 370 and rear plate 380 (e.g., Figure 3 (The rear plate 311 in the middle). In some embodiments, at least one of the components of the electronic device 101 (e.g., the first support member 332 or the second support member 360) may be omitted, or other components may be additionally included. At least one of the components of the electronic device 101 may be with Figure 2 or Figure 3 At least one of the components of the electronic device 101 is the same or similar, and repeated descriptions will be omitted below.

[0072] According to one embodiment, for example, the first support member 332 may be disposed inside the electronic device 101 to connect to the side frame structure 331 (e.g. Figure 2 The first support member 332 may be formed integrally with the side bezel structure 318 or the side bezel structure 331. For example, the first support member 332 may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. The first support member 332 may have one surface to which the display 330 is coupled and another surface to which the main printed circuit board 340 is coupled.

[0073] According to various embodiments, the antenna structure may be formed from a portion of the side frame structure 331 and / or the first support member 332, or a combination thereof. For example, the first antenna 334 may be formed from a portion of the side frame structure 331 and / or the first support member 332, or a combination thereof. The first antenna 334 may be located in at least a portion of the space formed by the portion of the side frame structure 331 and / or the first support member 332, or a combination thereof. According to one embodiment, the first antenna 334 may include at least one radiating conductor and may receive signals from a communication module (e.g., a radiating conductor) disposed on a main printed circuit board 340. Figure 1 The communication module 190 in the middle is fed to transmit wireless signals. Here, transmission can mean sending, receiving, or at least one of sending and receiving wireless signals. According to one embodiment, the first antenna 334 can be an antenna configured to send or receive wireless signals in a frequency band of tens of GHz or higher. For example, the first antenna 334 can be an antenna for millimeter-wave communication. According to various embodiments, the first antenna 334 can include multiple antennas for communication in multiple frequency bands that are different from each other. For example, the first antenna 334 can include a first-1 antenna 334a for communication in a first frequency band (e.g., 10 GHz) and a first-2 antenna 334b ​​for communication in a second frequency band (e.g., 18 GHz). Figure 5 The configuration of the first antenna 334 in the middle can be with Figure 1 The configuration of antenna module 197 is completely or partially the same.

[0074] According to one embodiment, for example, the main printed circuit board 340 may have a processor, memory, and / or interface mounted thereon. For example, the processor may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, and a communication processor.

[0075] According to one embodiment, the memory may include volatile memory or non-volatile memory.

[0076] According to one embodiment, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface can electrically or physically connect electronic device 101 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0077] According to one embodiment, the battery 350 may be a device configured to supply power to at least one component of the electronic device 101, such as a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 350 may be disposed on a plane substantially the same as the main printed circuit board 340. The battery 350 may be integrally disposed within the electronic device 101, or may be configured to be detachable from / attached to the electronic device 101.

[0078] According to one embodiment, a second support member 360 (e.g., a rear housing) may be disposed between the main printed circuit board 340 and the second antenna 370. According to another embodiment, the second support member 360 may include a surface thereto connected to at least one of the main printed circuit board 340 and the battery 350, and another surface thereto connected to the second antenna 370.

[0079] According to one embodiment, the second antenna 370 may be disposed between the rear panel 380 and the battery 350. For example, the second antenna 370 may include a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. For example, the second antenna 370 may perform short-range communication with an external device, or may transmit or receive power for wireless charging. The rear panel 380 may form the rear surface of the electronic device 101 (e.g., Figure 3 At least a portion of the rear surface 310B in the middle. Figure 5 The configuration of the second Sky370 can be compared with Figure 1 The configuration of antenna module 197 is completely or partially the same.

[0080] According to one embodiment, the printed circuit board 400 can electrically connect the first antenna 334 and the main printed circuit board 340. For example, the printed circuit board 400 can be a flexible printed circuit board type radio frequency cable (FRC). According to one embodiment, the printed circuit board 400 can be disposed in at least a portion of the first support member 332. For example, the printed circuit board 400 can be disposed in at least a portion of another surface of the first support member 332 oriented in a second direction (-Z direction).

[0081] According to various embodiments, the printed circuit board 400 can be electrically connected to the first antenna 334 and the communication module (e.g.) via the connecting member 480. Figure 1 The communication module 190 in the middle). For example, the connecting member 480 may include a first connecting member 482 for connecting to the first antenna 334, and a connecting member 482 for connecting to the communication module (e.g., the communication module 190 in the middle). Figure 1The communication module 190 in the middle is connected to the second connecting member 484. According to one embodiment, the first connecting member 482 may be connected to a plurality of first antennas 334. For example, the first connecting member 482 may include a first-1 connecting member 482a connected to a first-1 antenna 334a and a first-2 connecting member 482b connected to a first-2 antenna 334b.

[0082] Figure 6 This is a perspective view of a printed circuit board according to various embodiments of the present disclosure.

[0083] according to Figure 6 The printed circuit board 400 may include a ground line 404, a ground 406, a pass pad 408, and a pass 450. Figure 6 The configuration of the printed circuit board 400 in the middle can be with Figure 5 The configuration of the circuit board 400 is completely or partially the same.

[0084] According to various embodiments, ground 406 can be directed to electronic devices (e.g., Figure 1 Electronic components (e.g., electronic devices 101) Figure 5 The first antenna 334 in the circuit provides a reference potential. For example, ground 406 can be capacitively coupled to the via pad 408 of the printed circuit board 400. For example, ground 406 can include the first ground described below (e.g., Figure 7 The first ground 416) and the second ground (e.g. Figure 7 The second grounding (426) in the middle.

[0085] According to various embodiments, the passage 450 can electrically connect wire lines (e.g., on different layers of the printed circuit board 400) to wire lines (e.g.) Figure 7 (First line 434b and second line 444b in the example). For example, the interior of the passage 450 may be filled with electrical conductors, and the lines may be electrically connected through the electrical conductors within the passage 450 and the passage pads 408.

[0086] According to various embodiments, the via pad 408 may be formed in a shape that surrounds at least a portion of the via 450. For example, the via pad may be formed in a shape substantially similar to the shape of the via 450 (e.g., a circle) to surround the via 450, and may be formed in various shapes other than those shown (e.g., ellipse, polygon, etc.).

[0087] According to various embodiments, the pass pad 408 may surround at least a portion of the pass 450. According to one embodiment, the pass 450 may extend through the pass pad 408. For example, the pass pad 408 may surround at least a portion of a side surface (e.g., an XY plane) of the pass 450. According to another embodiment, the pass 450 may be disposed between a plurality of pass pads 408. For example, the pass 450 may be disposed between a first pass pad 434a and a second pass pad 444a.

[0088] According to various embodiments, the printed circuit board 400 may include a first substrate 400a and a second substrate 400b connected to the first substrate 400a. At least one of the first substrate 400a and the second substrate 400b may be formed of a flexible printed circuit board. According to one embodiment, the second substrate 400b may include more layers than the first substrate 400a. For example, the second substrate 400b may include four conductive layers, while the first substrate 400a may include two conductive layers. As the number of layers of the first substrate 400a and the second substrate 400b changes, the impedance of the printed circuit board 400 may vary in the region where the pass pads 408 and the passes 450 (pass pads 408 and passes 450 connecting to wires of the first substrate 400a and the second substrate 400b) are disposed.

[0089] According to various embodiments, the printed circuit board 400 may include an opening 402 formed in ground 406 at a location corresponding to the via pad 408. For example, when the printed circuit board 400 is viewed in a second direction (-Z direction), at least a portion of the opening 402 may be formed to overlap with the via pad 408. Therefore, crosstalk of signals passing around the ground 406 in which the opening 402 is formed can be reduced. For example, the opening 402 can reduce the area in which the via pad 408 and the ground 406 directly face each other, thereby reducing interference between the via pad 408 and the ground 406.

[0090] According to various embodiments, the printed circuit board 400 may include a ground line 404 located in the opening 402. For example, the ground line 404 may be disposed on the printed circuit board 400 and cross the opening 402. In one embodiment, the ground line 404 may form a capacitive coupling with at least one of the inner layers of the printed circuit board 400. For example, the ground line 404 may form a capacitive coupling with a pass pad 408. Through the capacitance formed between the ground line 404 and the pass pad 408, the printed circuit board 400 may be configured to have a characteristic impedance Z0 having a preset value (e.g., about 50 Ω).

[0091] According to various embodiments, the fifth width w5, which is the width of the second line 444b, can be greater than the first width w1, which is the width of the ground line 404. For example, relative to the first width w1 and / or the second width (e.g., Figure 8 The second width w2 and the fifth width w5 can be formed to achieve a specified ratio (e.g., four to five times). For example, the first width w1 can be formed to be approximately 45 μm and the fifth width w5 can be formed to be approximately 200 μm.

[0092] According to various embodiments, the characteristic impedance can be formed based on the capacitance C. According to one embodiment, the characteristic impedance Z0 can be expressed as Equation 1, as shown below. In Equation 1, R can represent resistance, L can represent inductance, G can represent conductance, and C can represent capacitance.

[0093] Equation 1

[0094]

[0095] According to various embodiments, capacitor C can be formed based on the area of ​​the overlap between the via pad 408 and the ground line 404 (e.g., area A in Equation 2 as shown below) and the distance between the via pad 408 and the ground line 404 (e.g., distance d in Equation 2). The area A of the overlap between the via pad 408 and the ground line 404 can be based on a first width w1 and a fourth width (e.g., the width of the ground line 404) of the ground line 404. Figure 8 The fourth width w4 is formed, and the distance d between the pass pad 408 and the ground line 404 can be based on the first thickness (e.g., the fourth width w4). Figure 8 The first thickness t1) or the third thickness (e.g.) Figure 8 At least one of the third thickness t3) is formed. According to one embodiment, capacitor C can be expressed as Equation 2 as shown below. In Equation 2, ε0 can represent the material located between the pass pad 408 and the ground line 404 (e.g., Figure 8 The dielectric constant of the insulating layer (470) in the middle.

[0096] Equation 2

[0097]

[0098] According to various embodiments, when ground line 404 is viewed in a first direction (+Z direction) or a second direction (-Z), ground line 404 may at least partially overlap the via pad 408 and / or the trace (e.g., Figure 7 (The first line route 434b and the second line route 444b in the diagram). In addition, the ground line 404 is not limited to the example shown and can be formed in various shapes.

[0099] According to one embodiment, the passage 450 can be disposed at various locations on the printed circuit board 400. According to one embodiment, the passage 450 can be disposed at a location on the printed circuit board 400 adjacent to the connecting member 480. For example, the passage 450 can be electrically connected to at least one of the first connecting member 482 and the second connecting member 484. Multiple passages 450 can be provided and can include a first passage 450a connected to the first connecting member 482 and a second passage 450b connected to the second connecting member 484. According to another embodiment, the passage 450 can be disposed on the second substrate 400b adjacent to the first substrate 400a. For example, the passage 450 can include first passage pads (e.g., those electrically connected to the first substrate 400a and the second substrate 400b respectively). Figure 7 The first channel pad 434a) and the second channel pad (e.g. Figure 7 The second path pad 444a is shown in the figure. The ground line 404 may be configured to correspond to the path pad 408 and the path 450 to transform the impedance of the path pad 408 and the path 450 to a preset impedance. According to various embodiments, the path pad 408 may be located in at least a portion of the opening 402.

[0100] According to various embodiments, the printed circuit board 400 may include a ground path 460. The ground path 460 may be connected to a ground 406, thereby stably maintaining the potential of the printed circuit board 400. For example, the ground path 460 may be formed to extend through at least a portion of the ground 406.

[0101] Figure 7 It shows along Figure 6 A perspective view of the cross-section of the face intercepted by line A-A'. Figure 8 It shows along Figure 6 A cross-sectional view of the surface intercepted by line B-B' in the diagram.

[0102] according to Figure 7 and Figure 8 The printed circuit board 400 may include a plurality of conductive layers 401. For example, the printed circuit board 400 may include a first layer 410 oriented in a first direction (+Z direction), a second layer 420 oriented in a second direction (-Z direction) opposite to the first direction (+Z direction), and a plurality of conductive layers disposed between the first layer 410 and the second layer 420. For example, the printed circuit board 400 may also include a third layer 430 disposed between the first layer 410 and the second layer 420, and a fourth layer 440 disposed between the third layer 430 and the second layer 420.

[0103] According to one embodiment, the first layer 410 and / or the second layer 420 may be formed to be thicker than the third layer 430 and / or the fourth layer 440. For example, the first layer 410 and / or the second layer 420 may be formed to have a thickness of approximately 20 μm, and the third layer 430 and / or the fourth layer 440 may be formed to have a thickness of approximately 6 μm.

[0104] In this disclosure, for ease of illustration, although a printed circuit board formed of four layers is described, the printed circuit board including ground lines described in this disclosure can also be applied to printed circuit boards with four or more layers, such as printed circuit boards formed of six or eight layers. Figure 7 and Figure 8 The configuration of the printed circuit board 400 in the middle can be with Figure 5 and Figure 6 The configuration of the printed circuit board 400 in the middle is completely or partially the same.

[0105] According to various embodiments, the thickness of the conductive layer 401 can be formed differently. For example, the thickness of the first layer 410 and the second layer 420 exposed to the outside of the printed circuit board 400 can be thicker than the thickness of the inner layers of the printed circuit board 400 (e.g., the third layer 430 or the fourth layer 440).

[0106] According to various embodiments, the first layer 410 may include a first ground 416, and the second layer 420 may include a second ground 426. Figure 7 The configuration of the first ground 416 and the second ground 426 in the middle can be with Figure 6 The configuration of ground 406 in the circuit is completely or partially the same. According to one embodiment, the first ground 416 may be capacitively coupled to a third layer 430 disposed below the first layer 410 (e.g., in the -Z direction), and the second ground 426 may be capacitively coupled to a fourth layer 440. Therefore, crosstalk of signals in the printed circuit board 400 can be reduced by the first ground 416 and the second ground 426. The configuration of the first ground 416 and the second ground 426 can be the same as... Figure 6 The configuration of grounding 406 in the middle is completely or partially the same.

[0107] According to various embodiments, the first layer 410 may include a first opening 412, and the second layer 420 may include a second opening 422. The configuration of the first opening 412 and / or the second opening 422 may be consistent with... Figure 6 The configuration of the openings 402 in the circuit is completely or partially identical. According to various embodiments, at least one of the first opening 412 and / or the second opening 422 may be formed in the printed circuit board 400. For example, the first layer 410 may include the first opening 412, and the second layer 420 may not include the second opening 422.

[0108] According to various embodiments, the first opening 412 may be a hole extending through the first ground 416 at a location corresponding to the via pad 408. According to one embodiment, the first ground 416 in which the first opening 412 is formed can reduce signal crosstalk. For example, the first opening 412 may be formed in the first ground 416 corresponding to the via pad 408, thus reducing the area where the first ground 416 with the first opening 412 and the first via pad 434a face each other. Therefore, interference to signals passing through the via pad 408 can be reduced.

[0109] According to various embodiments, the second opening 422 may be a hole extending through the second ground 426 at a location corresponding to the via pad 408. According to one embodiment, the second ground 426 in which the second opening 422 is formed can reduce signal crosstalk. For example, the second opening 422 may be formed in the second ground 426 corresponding to the via pad 408, thus reducing the area of ​​the second ground 426 with the second opening 422 facing each other and the second via pad 444a. Therefore, interference to signals passing through the via pad 408 can be reduced. According to one embodiment, at least a portion of the second opening 422 may be formed corresponding to at least a portion of the first opening 412.

[0110] According to various embodiments, the printed circuit board 400 may include a first conductive member 434 and / or a second conductive member 444 located on at least one of the conductive layers 401. For example, the first conductive member 434 may include a first pass pad 434a and a first line 434b, and the second conductive member 444 may include a second pass pad 444a and a second line 444b.

[0111] According to various embodiments, the first conductive member 434 may be disposed on the third layer 430, and the second conductive member 444 may be disposed on the fourth layer 440. The first conductive member 434 and the second conductive member 444 may be electrically connected through a passage 450.

[0112] According to various embodiments, the printed circuit board 400 may include a ground line 404. The ground line 404 may be disposed on a plane substantially the same as the first layer 410 or the second layer 420 (e.g., an XY plane). For example, the ground line 404 may be located in at least one of a first opening 412 in the first layer 410 or a second opening 422 in the second layer 420. According to one embodiment, the first layer 410 may include a first ground line 414. The first ground line 414 may be capacitively coupled to at least one of the inner layers of the printed circuit board 400 (e.g., a third layer 430 or a fourth layer 440). For example, the first ground line 414 may be capacitively coupled to at least one of a first pass pad 434a and a second pass pad 444a. According to one embodiment, the second layer 420 may include a second ground line 424. The second ground line 424 may be capacitively coupled to at least one of the inner layers of the printed circuit board 400 (e.g., a third layer 430 or a fourth layer 440). According to one embodiment, the first ground line 414 and the second ground line 424 may be positioned corresponding to each other. According to various embodiments, the first ground wire 414 and the second ground wire 424 are not limited to the embodiments shown, and can be formed in various shapes (e.g., form or thickness, etc.). For example, each of the first ground wire 414 and the second ground wire 424 can be formed as multiple wires, and the multiple ground wires can be arranged differently.

[0113] According to various embodiments, at least one of the first ground line 414 and the second ground line 424 may have a position corresponding to at least a portion of the passage 450. For example, when viewing the printed circuit board 400 from above (+Z direction) (e.g., when viewing the printed circuit board in the second direction (-Z), at least a portion of the first ground line 414 or the second ground line 424 may overlap at least a portion of the passage 450.

[0114] According to various embodiments, the printed circuit board 400 may include at least one of a first ground line 414 and / or a second ground line 424. For example, the printed circuit board 400 may include a first layer 410 including a first ground 416 and a second layer 420 including a second ground 426, the first ground 416 having a first opening 412 formed therethrough, the first ground line 414 being disposed in the first opening 412. According to another embodiment, the second ground 426 may not include the opening corresponding to the first opening 412 and / or the ground line corresponding to the first ground line 414.

[0115] According to various embodiments, the third layer 430 may include a third opening 432, and the fourth layer 440 may include a fourth opening 442. The third opening 432 and / or the fourth opening 442 may be configured to correspond to at least a portion of the first opening 412 or the second opening 422. For example, when the printed circuit board 400 is viewed from above (+Z direction), the first opening 412, the second opening 422, the third opening 432, and the fourth opening 442 may at least partially overlap each other.

[0116] According to various embodiments, a printed circuit board 400 may include a third layer 430 containing a first via pad 434a and a fourth layer 440 containing a second via pad 444a. According to one embodiment, the first via pad 434a may be located in at least a portion of a third opening 432. For example, the first via pad 434a may be formed extending from a region of the third layer 430 to a third opening 432 adjacent to a via 450. At least a portion of the first via pad 434a may be exposed through a first opening 412 in a first direction (e.g., the +Z direction). According to one embodiment, the second via pad 444a may be located in at least a portion of a fourth opening 442. For example, the second via pad 444a may be formed extending from a region of the fourth layer 440 to a fourth opening 442 adjacent to a via 450. The second via pad 444a may be at least partially exposed through a second opening 422 in a second direction opposite to the first direction (e.g., the -Z direction). Figure 7 and Figure 8 The configuration of the first channel pad 434a and the second channel pad 444a in the middle can be compared with... Figure 6 The configuration of the 408 pads in the circuit is completely or partially the same.

[0117] According to various embodiments, the first conductive member 434 may include a first path pad 434a for covering at least a portion of the path 450 and a first line 434b for transmitting signals. The first line 434b may be electrically connected to the path 450 via the first path pad 434a. According to one embodiment, the first path pad 434a may be integrally formed with the first line 434b.

[0118] According to various embodiments, the second conductive member 444 may include a second path pad 444a for covering at least a portion of the path 450 and a second line 444b for transmitting signals. The second line 444b may be electrically connected to the path 450 via the second path pad 444a. According to one embodiment, the second path pad 444a may be integrally formed with the second line 444b.

[0119] According to various embodiments, ground wire 404 may be configured to form capacitive coupling with at least one of the first path pad 434a and / or the second path pad 444a. According to one embodiment, first ground wire 414 may be configured to form capacitive coupling with the first path pad 434a. For example, the first ground wire 414 may be a wire passing through a first opening 412 of the first ground 416. At least a portion of the first ground wire 414 may face at least a portion of the first path pad 434a. According to one embodiment, second ground wire 424 may be configured to form capacitive coupling with the second path pad 444a. For example, the second ground wire 424 may be a wire passing through a second opening 422 of the second ground 426. At least a portion of the second ground wire 424 may face at least a portion of the second path pad 444a. According to one embodiment, ground wire 404 may form capacitive coupling with the first line 434b and / or the second line 444b. For example, at least a portion of the first ground line 414 may overlap with at least a portion of the first line 434b, and the first ground line 414 may form capacitive coupling with the first pass pad 434a and the first line 434b. As another example, at least a portion of the second ground line 424 may overlap with at least a portion of the second line 444b, and the second ground line 424 may form capacitive coupling with the second pass pad 444a and the second line 444b.

[0120] According to various embodiments, the ground line 404 can be configured to have an impedance for stably holding signals passing through the path 450. According to one embodiment, the width of the ground line 404 and the width of the path 450 can be configured to have a predetermined ratio. For example, a third width w3 for the path 450 can be configured to be greater than a first width w1 for the first ground line 414 and / or a second width w2 for the second ground line 424. For example, the third width w3 can be configured to reach a specified ratio (e.g., approximately three times) relative to the first width w1 and / or the second width w2. According to another embodiment, the area of ​​the ground line 404 facing the first path pad 434a or the second path pad 444a can be configured to have a predetermined ratio to the thickness of the insulating layer 470. For example, a first thickness t1 for the thickness of the first insulating layer 473 can be greater than the first width w1 of the first ground line 414. Additionally, a fourth width w4 for the width of the first path pad 434a can be greater than the first width w1 of the first ground line 414. As another example, the third thickness t3 of the third insulating layer 477 can be greater than the second width w2 of the second ground line 424. Additionally, the fourth width w4 of the second pass pad 444a can be greater than the second width w2 of the second ground line 424. For example, the fourth width w4 can be formed to achieve a specified ratio (e.g., approximately six times) relative to the first width w1 and / or the second width w2. According to various embodiments, the widths of the first pass pad 434a and the second pass pad 444a are not limited to the shown fourth width w4, and the first pass pad 434a and the second pass pad 444a can be formed to have widths different from each other. According to one embodiment, the first width w1 and the second width w2 can be formed to be approximately 45 μm. According to one embodiment, the third width w3 can be formed to be approximately 150 μm, and the fourth width w4 can be formed to be approximately 300 μm.

[0121] According to various embodiments, at least a portion of the passage 450 may be surrounded by multiple layers. For example, at least a portion of the passage 450 may be surrounded by a first passage pad 434a and a second passage pad 444a. According to one embodiment, the passage 450 may be disposed between multiple conductive layers (e.g., a third layer 430 and a fourth layer 440). For example, the passage 450 may be disposed between the first passage pad 434a and the second passage pad 444a. According to another embodiment, the passage 450 may extend through at least a portion of the multiple conductive layers (e.g., the third layer 430 and the fourth layer 440). For example, the passage 450 may extend through the first passage pad 434a and the second passage pad 444a.

[0122] According to various embodiments, the printed circuit board 400 may include a ground path 460. The ground path 460 may be connected to a ground 406, thereby stably maintaining the potential of the printed circuit board 400. For example, the ground path 460 may be formed through a first layer 410 in which a first ground 416 is disposed and a second layer 420 in which a second ground 426 is disposed.

[0123] According to various embodiments, the printed circuit board 400 may include an insulating layer 470. The insulating layer 470 may separate the components of the printed circuit board 400 (e.g., first path pad 434a and second path pad 444a).

[0124] According to various embodiments, the insulating layer 470 may include multiple layers. For example, the insulating layer 470 may include a first insulating layer 473 disposed between a first layer 410 and a third layer 430, a second insulating layer 475 disposed between a third layer 430 and a fourth layer 440, and a third insulating layer 477 disposed between a fourth layer 440 and a second layer 420. According to one embodiment, the first insulating layer 473 may be disposed between a first ground line 414 and a first path pad 434a. The first ground line 414 and the first path pad 434a may be spaced apart by a first thickness t1 equal to the thickness of the first insulating layer 473. According to another embodiment, the second insulating layer 475 may be disposed between the first path pad 434a and the second path pad 444a, and may surround the path 450. The first path pad 434a and the second path pad 444a may be spaced apart by a second thickness t2 equal to the thickness of the second insulating layer 475. According to another embodiment, the third insulating layer 477 may be disposed between the second path pad 444a and the second ground line 424. The second ground wire 424 and the second path pad 444a can be set to a third thickness t3 spaced apart from the thickness of the third insulating layer 477.

[0125] According to various embodiments, the thickness of the insulating layer 470 can be formed differently. According to one embodiment, the first thickness t1 of the first insulating layer 473 and the third thickness t3 of the third insulating layer 477 can be formed differently. According to one embodiment, when the first opening 412 is formed in the first layer 410 and the opening is not formed in the second layer 420 (not shown), the third thickness t3 of the third insulating layer 477 can be greater than the first thickness t1 of the first insulating layer 473.

[0126] According to various embodiments, the insulating layer 470 may include a fourth insulating layer 471 disposed on the upper part (e.g., in the +Z direction) of the first insulating layer 473 or a fifth insulating layer 479 disposed on the lower part (e.g., in the -Z direction) of the third insulating layer 477.

[0127] According to one embodiment, the first thickness t1 of the first insulating layer 473 and / or the second thickness t2 of the second insulating layer 475 can be formed to be approximately 50 μm, and the third thickness t3 of the third insulating layer 477 can be formed to be approximately 85 μm. According to one embodiment, the thickness of the fourth insulating layer 471 and / or the fifth insulating layer 479 can be formed to be approximately 24 μm.

[0128] According to various embodiments, the insulating layer 470 can be formed of various materials. For example, the insulating layer 470 may include at least one of polyimide, polyester, and polytetrafluoroethylene.

[0129] Figure 9 This is a perspective view of a printed circuit board according to an embodiment of the present disclosure. Figure 10 This is a perspective view of a printed circuit board according to another embodiment of the present disclosure. Figure 11 This is a perspective view of a printed circuit board according to another embodiment of the present disclosure. Figure 12 This is a perspective view of a printed circuit board according to another embodiment of the present disclosure. Figure 13 This is a perspective view of a printed circuit board according to another embodiment of the present disclosure. At least one of the elements of the printed circuit board 400 according to various embodiments of the present disclosure can be coupled with... Figures 6 to 8 At least one of the components of the printed circuit board 400 is the same or similar, so its repeated description will be omitted.

[0130] according to Figures 9 to 13 The printed circuit board 400 may include an opening 402, a first ground line 414, a second ground line 424, a first channel pad 434a, and a second channel pad 444a. Figures 9 to 13 The configuration of the first ground line 414, the second ground line 424, the first channel pad 434a, and the second channel pad 444a can be consistent with... Figures 6 to 8 The configurations of opening 402, first ground line 414, second ground line 424, first channel pad 434a, and second channel pad 444a are completely or partially identical. For ease of explanation, although... Figures 9 to 13 The insulating layer is omitted in the illustration, but according to one embodiment, the printed circuit board 400 may include... Figure 8 The insulating layer 470 in the middle.

[0131] According to various embodiments, at least a portion of the first ground line 414 and / or the second ground line 424 disposed in the opening 402 may be configured as at least a portion of the overlapping path 450. For example, at least a portion of the first ground line 414 may face the first path pad 434a, and at least a portion of the second ground line 424 may face the second path pad 444a.

[0132] According to various embodiments, a first ground line 414 and / or a second ground line 424 may be positioned within an opening 402 of the printed circuit board 400. For example, the first ground line 414 may be disposed on a plane substantially the same as the first layer 410, and the second ground line 424 may be disposed on a plane substantially the same as the second layer 420. The first ground line 414 may be capacitively coupled to a first pass pad 434a, and the second ground line 424 may be capacitively coupled to a second pass pad 444a.

[0133] According to various embodiments, when the printed circuit board 400 is viewed in a second direction (-Z direction), the first ground line 414 and / or the second ground line 424 can be configured with respect to the first ground line (e.g., ...). Figure 7 The first route 434b) and / or the second route (e.g.) Figure 7 The second line route 444b in the diagram has various angles (e.g., approximately 45 degrees or approximately 90 degrees). For example, refer to... Figure 9 The first ground wire 414 and / or the second ground wire 424 can be configured with respect to the first ground wire route (e.g., Figure 7 The first route 434b) and / or the second route (e.g.) Figure 7 The second line route 444b) has essentially right angles. For example, refer to Figure 10 The first ground wire 414 and / or the second ground wire 424 can be configured with respect to the first ground wire route (e.g., Figure 7 The first route 434b) and / or the second route (e.g.) Figure 7 The second line route 444b) has an angle of approximately 45 degrees.

[0134] According to various embodiments, the printed circuit board 400 may include a ground path 460. The first layer 410 and the second layer 420 of the printed circuit board 400 may be electrically connected through the ground path 460. For example, a first ground wire 414 may be connected to one end of the ground path 460, and a second ground wire 424 may be connected to the other end of the ground path 460.

[0135] According to various embodiments, the first ground wire 414 and / or the second ground wire 424 can be formed in multiple ways.

[0136] According to various embodiments, reference Figure 11 and Figure 12The first ground line 414 may include a first-1 ground line 414a and a first-2 ground line 414b intersecting the first-1 ground line 414a. According to one embodiment, the first ground line 414 may include a first central region 414c, in which the first-1 ground line 414a and the first-2 ground line 414b overlap, and when viewed from above (+Z direction) of the printed circuit board 400, the first central region 414c may overlap at least a portion of the via 450. According to another embodiment, when viewed from above of the printed circuit board 400, the first central region 414c may overlap at least a portion of the via 450 and at least a portion of the first via pad 434a. According to one embodiment, the first-1 ground line 414a and the first-2 ground line 414b may be arranged in different directions with respect to the first central region 414c. According to one embodiment, when the printed circuit board 400 is viewed from above (+Z direction), the first-1 ground line 414a and the first-2 ground line 414b can be formed to have an angle (e.g., about 90 degrees) relative to each other.

[0137] According to various embodiments, the second ground line 424 may include a second-1 ground line 424a and a second-2 ground line 424b intersecting the second-1 ground line 424a. According to one embodiment, the second ground line 424 may include a second central region (not shown), in which the second-1 ground line 424a and the second-2 ground line 424b overlap, and when viewed from above (+Z direction) of the printed circuit board 400, the second central region may overlap at least a portion of the passage 450. For example, the second central region (not shown) may be a region corresponding to the first central region 414c. According to another embodiment, when viewed from above of the printed circuit board 400, the second central region may overlap at least a portion of the passage 450 and at least a portion of the second passage pad 444a. According to one embodiment, the second-1 ground line 424a and the second-2 ground line 424b may be arranged in different directions with respect to the second central region. According to one embodiment, when the printed circuit board 400 is viewed from above (+Z direction), the second-1 ground line 424a and the second-2 ground line 424b can be formed to have an angle (e.g., about 90 degrees or about 135 degrees) relative to each other.

[0138] According to various embodiments, the first ground line 414 can be formed in various shapes. For example, when the printed circuit board 400 is viewed in a second direction (-Z direction), the first ground line 414 can be configured to overlap at least a portion of the first line path 434b and the second line path 444b. According to one embodiment, the first ground line 414 may include a first-1 ground line 414a configured to correspond to the second line path 444b and a first-2 ground line 414b configured to correspond to the first line path 434b. According to one embodiment, the first line path 434b and the second line path 444b can be arranged at various angles (e.g., approximately 180 degrees or approximately 135 degrees).

[0139] According to various embodiments, reference Figure 13 The first layer 410 may include a first ground shield 414d. The first ground shield 414d may be formed to protrude from a portion of the first ground line 414. For example, when the printed circuit board 400 is viewed in a second direction (-Z), the first ground shield 414d may overlap at least a portion of the first pass pad 434a. According to one embodiment, at least a portion of the first ground shield 414d may form capacitive coupling with the first pass pad 434a.

[0140] According to various embodiments, the printed circuit board 400 may include pathways (e.g. Figure 6 and 7 The first ground shield 414d may not be exposed in the first direction (+Z direction) when viewed in the second direction (-Z direction). According to various embodiments, the second layer 420 may include a second ground shield (not shown). The second ground shield may be configured corresponding to the first ground shield 414d. For example, the second ground shield may have a structure that protrudes from a portion of the second ground wire 424. According to one embodiment, when viewed from above, the second ground shield may overlap at least a portion of the second path pad 444a. According to another embodiment, when viewed in the second direction (-Z direction), the first ground shield 414d, the first path pad 434a, the second path pad 444a, and the second ground shield (not shown) may overlap each other.

[0141] Figure 14 This is a graph showing the S-parameters of an electronic device according to various embodiments of the present disclosure.

[0142] according to Figure 14 Electronic devices (e.g.) Figure 1 The S-parameters of the electronic device 101 in the circuit can be based on the printed circuit board (e.g., Figure 6 The structure of the printed circuit board 400 in the circuit board is changed. For example, the first waveform l1 may include a ground line (e.g.) disposed thereon. Figure 6 The ground wire in the 404 printed circuit board (e.g.) Figure 6 Electronic devices (e.g., printed circuit boards 400) in the printed circuit board 400 Figure 1 The S-parameters of the electronic device 101 in the image are as follows: the second waveform l2 can be the S-parameters of an electronic device including a printed circuit board on which no ground line is provided. According to one embodiment, in a first frequency range A1 from 4 GHz to 11 GHz and a second frequency range A2 from 13 GHz to 18 GHz, the first waveform l1 can obtain more stable S-parameters compared to the second waveform l2. For example, in the first frequency range A1 and the second frequency range A2, the decibel (dB) deviation of the first waveform l1 can be smaller than the decibel deviation of the second waveform l2.

[0143] According to various embodiments of this disclosure, printed circuit boards (e.g.) Figure 5 The printed circuit board 400 in the middle may include: in a first direction (e.g. Figure 7 The first layer oriented in the first direction (+Z direction) (e.g.) Figure 7 The first layer 410), the first layer (e.g. Figure 7 The first layer 410 includes a first opening formed therein (e.g. Figure 7 The first ground (e.g., the first opening 412) in the middle) Figure 7 The first grounding 416), wherein the first ground wire (e.g. Figure 7 The first ground wire 414) is located in the first opening; in the second direction opposite to the first direction (e.g. Figure 7 The second layer oriented in the second direction (-Z direction) (e.g.) Figure 7 The second layer (420) in the middle, the second layer (e.g. Figure 7 The second layer 420 includes a second opening formed therein (e.g., Figure 7 The second ground (e.g., the second opening 422) in the second opening) Figure 7 The second ground (426) in the middle, wherein the second opening corresponds to at least a portion of the first opening and the second ground wire (e.g. Figure 7 The second ground wire 424 is located in the second opening; it is disposed between the first and second layers and includes a third opening (e.g. Figure 7 The third layer (e.g., the third opening 432) in the middle Figure 7 The third layer 430), the third opening corresponds to at least a portion of the first opening, and the first pass pad (e.g. Figure 7 The first pass pad 434a is located in the third opening; it is disposed between the second and third layers and includes a fourth opening (e.g. Figure 7 The fourth layer of the fourth opening 442 in the middle (e.g.) Figure 7The fourth layer (440) in the middle, the fourth opening corresponds to at least a portion of the third opening, and the second channel pad (e.g. Figure 7 The second path pad 444a) is located in the fourth opening; and the path (e.g. Figure 7 The path 450 in the middle is at least partially surrounded by the first path pad and the second path pad.

[0144] According to various embodiments, the first ground line can be configured to form capacitive coupling with the first path pad, and the second ground line can be configured to form capacitive coupling with the second path pad.

[0145] According to various embodiments, when the printed circuit board is viewed in a second direction, the first ground line and the second ground line may overlap at least a portion of the path.

[0146] According to various embodiments, the first ground wire may include a first-1 ground wire (e.g., Figure 11 The first-1 ground wire 414a) and the first-2 ground wire that intersects with the first-1 ground wire (e.g.) Figure 11 The first-second ground wire (414b) and the second ground wire includes the second-first ground wire (e.g., ground wire 2-1). Figure 11 The second-1 ground wire 424a) and the second-2 ground wire that intersects with the second-1 ground wire (e.g.) Figure 11 (424b, the second-2nd ground wire in the middle).

[0147] According to various embodiments, the first ground wire may include a first central region (e.g., Figure 11 In the first central region 414c), ground wires 1-1) and 1-2 overlap in the first central region, and the second ground wire may include the second central region (e.g. Figure 11 In the second central region 424c), the second-1 ground line and the second-2 ground line overlap in the second central region, and when the printed circuit board is viewed in the second direction, at least a portion of the first central region and the second central region may overlap at least a portion of the path.

[0148] According to various embodiments, the third layer may include a first trace extending from the first path pad (e.g., Figure 7 The first line path 434b in the first layer, and the fourth layer may include a second line path extending from the second path pad (e.g., ...). Figure 7 The second route (444b) in the middle.

[0149] According to various embodiments, when the printed circuit board is viewed in a second direction, at least a portion of the first ground line can overlap at least a portion of the first line, and at least a portion of the second ground line can overlap at least a portion of the second line.

[0150] According to various embodiments, the width of the first ground line may be smaller than the width of the first channel pad, and the width of the second ground line may be smaller than the width of the second channel pad.

[0151] According to various embodiments, the printed circuit board may also include components configured to connect to an antenna module (e.g., Figure 1 At least one first connecting member (e.g., antenna module 197) in the antenna module 197 Figure 5 The first connecting member 482 in the middle) and configured to be connected to the communication module (e.g. Figure 1 The second connecting component (e.g., the communication module 190 in the middle) Figure 5 The second connecting member 484 in the middle.

[0152] According to various embodiments, the pathway may include a first pathway connected to the first connecting member (e.g., Figure 6 The first passage 450a) and the second passage connected to the second connecting member (e.g. Figure 6 The second pathway 450b in the middle.

[0153] According to various embodiments, the printed circuit board may also include a flexible first substrate (e.g., Figure 6 The first substrate 400a) and at least one second substrate extending from the first substrate (e.g., Figure 6 The second substrate 400b in the first substrate and the second channel pad can be electrically connected to at least one of the first substrate or the second substrate.

[0154] According to various embodiments, when the printed circuit board is viewed in a second direction, the first ground line may at least partially overlap the second ground line.

[0155] According to various embodiments, the first ground wire may include a first ground shield corresponding to the first pad (e.g., Figure 12 The first ground shield 414d in the circuit board may include a second ground shield corresponding to the second pad, and when the printed circuit board is viewed in the second direction, the first ground shield and the second ground shield at least partially overlap each other.

[0156] According to various embodiments, the printed circuit board may also include a ground path extending through the first, second, third, and fourth layers (e.g., ...). Figure 8 The grounding path 460 in the middle can be used to electrically connect the first ground wire and the second ground wire.

[0157] According to various embodiments, a first insulating layer (e.g., disposed between the first ground wire and the first path pad) is provided. Figure 8 The first insulating layer 473), and the second insulating layer disposed between the first and second path pads and surrounding at least a portion of the path (e.g., the first insulating layer 473), and the second insulating layer disposed between the first path pad and the second path pad and surrounding at least a portion of the path. Figure 8The second insulating layer 475), and the third insulating layer (e.g., disposed between the second ground wire and the second path pad) Figure 8 The third insulating layer 477 can be further included therein.

[0158] According to various embodiments of this disclosure, printed circuit boards (e.g.) Figure 5 The printed circuit board 400 in the middle may include: in a first direction (e.g. Figure 7 The first layer oriented in the +Z direction (e.g.) Figure 7 The first layer 410), the first layer (e.g. Figure 7 The first layer 410 includes a first opening formed therethrough (e.g., ...). Figure 7 The first ground (e.g., the first opening 412) in the middle) Figure 7 The first grounding 416), the first ground wire (e.g. Figure 7 The first ground wire 414) is located in the first opening; the second layer (e.g. Figure 7 The second layer 420), in a second direction opposite to the first direction (e.g. Figure 7 Oriented in the -Z direction and including a second ground (e.g. Figure 7 The second grounding (426) in the middle; the third layer (e.g. Figure 7 The third layer 430 is disposed between the first layer and the second layer, and is a third opening (e.g., a portion of the first opening) corresponding to at least a portion of the first opening. Figure 7 The third opening 432) passes through it to form the third layer (e.g. Figure 7 The third layer 430) includes a first pass pad extending to the third opening (e.g. Figure 7 The first channel pad 434a in the middle); the fourth layer (e.g. Figure 7 The fourth layer 440), disposed between the second and third layers, and corresponding to at least a portion of the third opening (e.g., the fourth opening). Figure 7 The fourth opening 442) passes through it to form the fourth layer (e.g. Figure 7 The fourth layer (440) includes a second pass pad extending to the fourth opening (e.g., Figure 7 The second path pad 444a in the middle); and the path (e.g. Figure 7 The path 450 is surrounded by a first path pad and a second path pad.

[0159] According to various embodiments, when the printed circuit board is viewed in a second direction, the first ground line may overlap at least a portion of the path.

[0160] According to various embodiments, the first ground line can be configured to form capacitive coupling with the first path pad, and the second ground line can be configured to form capacitive coupling with the second path pad.

[0161] According to various embodiments of this disclosure, electronic devices (e.g.) Figure 1 The electronic device 101 in the middle may include a display (e.g., Figure 2 The display 301 in the middle), and the battery configured to power the display (e.g. Figure 4 The battery 350 in the middle) and the printed circuit board (e.g. Figure 6 The printed circuit board 400 in the middle may include: a first layer (e.g., Figure 7 The first layer 410 includes a first opening formed therethrough (e.g., ...). Figure 7 The first ground (e.g., the first opening 412) in the middle) Figure 7 The first grounding 416), the first ground wire (e.g. Figure 7 The first ground wire 414 in the middle is positioned in the first opening; the second layer (e.g. Figure 7 The second layer 420 includes a second opening formed therethrough (e.g., ...). Figure 7 The second ground (e.g., the second opening 422) in the second opening) Figure 7 The second ground (426) in the middle, the second opening corresponds to at least a portion of the first opening, and the second ground wire (e.g. Figure 7 The second ground wire 424) is positioned in the second opening; the third layer (e.g. Figure 7 The third layer 430 is disposed between the first and second layers and includes a third opening (e.g., ...). Figure 7 The third opening 432 in the first opening corresponds to at least a portion of the first opening, and the first pass pad (e.g. Figure 7 The first channel pad 434a) is located in the third opening; the fourth layer (e.g. Figure 7 The fourth layer (440) is located between the second and third layers and includes a fourth opening (e.g., ...). Figure 7 The fourth opening 442 in the middle corresponds to at least a portion of the third opening, and the second channel pad (e.g. Figure 7 The second path pad 444a) is positioned in the fourth opening; and the path (e.g. Figure 7 The path 450 is located between the first path pad and the second path pad.

[0162] According to various embodiments, the electronic device may also include an antenna module (e.g. Figure 1 Antenna module 197) and communication module (e.g., electrically connected to antenna module) Figure 1 The communication module 190 in the middle, wherein the printed circuit board may include a first connecting member (e.g., connected to the antenna module) Figure 5 The first connecting member 482 in the middle) and the second connecting member connected to the communication module (e.g. Figure 5 The second connecting member 484 in the passage may be located adjacent to at least one of the first connecting member or the second connecting member.

[0163] The printed circuit boards including the various ground lines of this disclosure are not limited to the above-described exemplary embodiments and drawings, and those skilled in the art to which this disclosure pertains will understand that various substitutions, modifications and alterations are possible within the scope of this disclosure.

Claims

1. A printed circuit board, comprising: a first layer comprising a first ground, the first ground comprising a first opening, wherein at least one first ground line is in the first opening; a second layer disposed in a direction away from the first layer and comprising a second ground, the second ground comprising a second opening, wherein the second opening at least partially overlaps the first opening, and wherein at least one second ground line is in the second opening; a third layer between the first layer and the second layer and comprising a third opening, wherein the third opening at least partially overlaps the first opening, wherein a first via pad is in the third opening, wherein the third layer comprises a first routing line extending from the first via pad; a fourth layer between the second layer and the third layer and comprising a fourth opening, wherein the fourth opening at least partially overlaps the third opening, wherein a second via pad is in the fourth opening, wherein the fourth layer comprises a second routing line extending from the second via pad; and a via at least partially surrounded by the first via pad and the second via pad, when the printed circuit board is viewed in the direction: the first opening, the second opening, the third opening, and the fourth opening at least partially overlap each other, the at least one first ground line and the at least one second ground line overlap at least a portion of the via, at least a portion of the at least one first ground line overlaps at least a portion of the first routing line, and at least a portion of the at least one second ground line overlaps at least a portion of the second routing line. the at least one first ground line is configured to form a capacitive coupling with the first via pad, and the at least one second ground line is configured to form a capacitive coupling with the second via pad.

2. The printed circuit board of claim 1, wherein, the at least one first ground line comprises a 1-1 ground line and a 1-2 ground line crossing the 1-1 ground line, and 3. The printed circuit board of claim 1, wherein, the at least one second ground line comprises a 2-1 ground line and a 2-2 ground line crossing the 2-1 ground line. the at least one first ground line comprises a first central region, the 1-1 ground line and the 1-2 ground line overlap in the first central region, 4. The printed circuit board of claim 3, wherein, the at least one second ground line comprises a second central region, the 2-1 ground line and the 2-2 ground line overlap in the second central region, and at least a portion of the first central region and the second central region overlap at least a portion of the via in the direction. when the printed circuit board is viewed in the direction, the first ground line at least partially overlaps the second routing line, and a width of the first ground line is less than a width of the second routing line.

5. The printed circuit board of claim 1, wherein, a width of the at least one first ground line is less than a width of the first via pad, and 6. The printed circuit board of claim 1, wherein, a width of the at least one second ground line is less than a width of the second via pad.

7. The printed circuit board of claim 1, further comprising: a first connection member for connecting to an antenna module; and a second connection member for connecting to a communication module. ​ ​ 8. The printed circuit board of claim 7, wherein, The via includes a first via connected to the first connection member and a second via connected to the second connection member.

9. The printed circuit board of claim 1, further comprising: a flexible first substrate; and at least one second substrate extending from the first substrate, wherein the first via pad and the second via pad are electrically connected to at least one of the first substrate and the at least one second substrate.

10. The printed circuit board of claim 9, further comprising: a first insulating layer disposed between the first layer and the third layer, wherein the first ground line and the first via pad are spaced apart by a first thickness of the first insulating layer; a second insulating layer disposed between the third layer and the fourth layer, wherein the first via pad and the second via pad are spaced apart by a second thickness of the second insulating layer; and a third insulating layer disposed between the fourth layer and the second layer, wherein the second ground line and the second via pad are spaced apart by a third thickness of the third insulating layer, the third thickness being greater than the first thickness, wherein the second substrate includes more conductive layers than the first substrate, the second substrate having the via disposed thereon.

11. The printed circuit board of claim 1, wherein, The at least one first ground line at least partially overlaps the at least one second ground line in the direction.

12. The printed circuit board of claim 1, wherein, The at least one first ground line includes a first ground shield corresponding to the first via pad, The at least one second ground line includes a second ground shield corresponding to the second via pad, and The first ground shield and the second ground shield at least partially overlap in the direction.

13. The printed circuit board of claim 1, further comprising a ground via extending through the first layer, the second layer, the third layer, and the fourth layer, wherein The at least one first ground line and the at least one second ground line are electrically connected by the ground via.

14. An electronic device, comprising: the printed circuit board of claim 1; a display; and a battery configured to supply power to the display.

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