Three-dimensional stacked shielding structure and three-dimensional stacked shielding method

Abstract

The present disclosure provides a three-dimensional stacked shielding structure and a three-dimensional stacked shielding method, which relate to the field of semiconductor technology. In the three-dimensional stacked shielding structure, the first substrate includes a pad 1 and a pad 2 that are arranged opposite to each other, and the two are electrically connected, and at least one of the pad 1 and the pad 2 is grounded; wherein the pad 2 includes two welding points at different positions; each metal column is electrically connected to the pad 1, and the metal column is provided with a through hole, and the through hole passes through the pad 1, the first substrate and the pad 2; the chip 1 is electrically connected to the first substrate and is located in the area surrounded by multiple metal columns; the two ends of each electrical connection arc are respectively connected to the two welding points of the pad 2, and the electrical connection arc is convexly arranged on the second surface in a ridge shape; the second substrate is provided with a chip 2; the second substrate is electrically connected to the second surface, and part or all of the chip 2 is located between multiple electrical connection arcs. Electromagnetic shielding of chip 1 and chip 2 located between multiple electrical connection arcs can be achieved. The process is simple and the packaging efficiency is high.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a three-dimensional stacked shielding structure and a three-dimensional stacked shielding method. Background Art

[0002] In existing three-dimensional stacked structures, multiple chips or devices are often integrated. In order to prevent electromagnetic interference between multiple chips or devices, or to prevent interference from external electromagnetic waves, electromagnetic shielding design is performed. The existing electromagnetic shielding structure has cumbersome processes, complex structures, and is prone to shielding failure. Summary of the invention

[0003] The objects of the present invention include, for example, providing a three-dimensional stacked shielding structure and a three-dimensional stacked shielding method, which can improve the electromagnetic shielding effect and have high packaging efficiency.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides a three-dimensional stacked shielding structure, comprising:

[0006] A first substrate, the first substrate comprises a first surface and a second surface which are arranged opposite to each other, the first surface is provided with a first solder pad, the second surface is provided with a second solder pad, the first solder pad and the second solder pad are arranged opposite to each other and are electrically connected, at least one of the first solder pad and the second solder pad is grounded; wherein the second solder pad comprises two soldering points at different positions;

[0007] A plurality of metal pillars, each of which is electrically connected to the first pad, and each of which is provided with a through hole, and the through hole passes through the first pad, the first substrate and the second pad;

[0008] Chip 1, the chip 1 is electrically connected to the first substrate and is located in a region surrounded by the plurality of metal pillars;

[0009] A plurality of electrical connection arcs, each of which has two ends connected to the two welding points of the second welding pad, and the electrical connection arcs are convexly disposed on the second surface in a ridge shape;

[0010] The second substrate is provided with a second chip; the second substrate is electrically connected to the second surface, and part or all of the second chip is located between a plurality of the electrical connection arcs.

[0011] In an optional embodiment, it further includes a plastic packaging body and a shielding metal layer, wherein the plastic packaging body seals the first substrate and the second substrate, and the metal column is exposed from the plastic packaging body;

[0012] The shielding metal layer is arranged outside the plastic package body and is electrically connected to the metal column.

[0013] In an optional embodiment, the shielding metal layer fills the through hole and fills and wraps the electrical connection arc.

[0014] In an optional embodiment, the plastic sealing body includes an intermediate plastic sealing body and an outer plastic sealing body, the intermediate plastic sealing body is filled between the first substrate and the second substrate, and the electrical connection arc forms a ridge-like cavity structure, and the shielding metal layer is filled in the ridge-like cavity structure;

[0015] The outer plastic packaging body seals the first substrate, and the shielding metal layer is arranged on the outer plastic packaging body.

[0016] In an optional embodiment, on the same electrical connection arc, the first distance between the arcs on both sides is W, the second distance between the ridged high point of the electrical connection arc and the second substrate is H, and the particle diameter of the intermediate layer plastic package is greater than the first distance and greater than the second distance.

[0017] In an optional embodiment, a pad three is provided on the second surface of the first substrate, and a metal ball is provided on the pad three. The metal ball is electrically connected to the second substrate; the metal ball is located inside or outside the area surrounded by the plurality of electrical connection arcs.

[0018] In a second aspect, the present invention provides a three-dimensional stacking shielding method, comprising:

[0019] A first substrate is provided; the first substrate comprises a first surface and a second surface which are arranged opposite to each other, the first surface is provided with a first solder pad, the second surface is provided with a second solder pad, the first solder pad and the second solder pad are arranged opposite to each other and are electrically connected, at least one of the first solder pad and the second solder pad is grounded; wherein the second solder pad comprises two soldering points at different positions;

[0020] A plurality of metal columns are arranged on the first substrate; wherein each of the metal columns is electrically connected to the first pad, and the metal columns are provided with a through hole, and the through hole passes through the first pad, the first substrate and the second pad;

[0021] Mounting chip 1 on the first substrate; wherein the chip 1 is located in an area surrounded by a plurality of the metal pillars;

[0022] A plurality of electrical connection arcs are provided; wherein two ends of each of the electrical connection arcs are respectively connected to the two welding points of the second welding pad, and the electrical connection arcs are convexly provided on the second surface in a ridge shape;

[0023] Providing a second substrate; wherein the second substrate is provided with a second chip;

[0024] The first substrate is mounted on the second substrate; wherein the second substrate is electrically connected to the second surface, and part or all of the second chip is located between a plurality of the electrical connection arcs.

[0025] In an optional embodiment, it also includes:

[0026] Plastic-sealing the first substrate and the second substrate to form a plastic-sealed body;

[0027] A shielding metal layer is arranged on the plastic package body; wherein the shielding metal layer is electrically connected to the metal column; the shielding metal layer fills the through hole, and fills and wraps the electrical connection arc.

[0028] In an optional embodiment, the plastic packaging body includes an outer plastic packaging body and an intermediate plastic packaging body; and the step of providing a plurality of metal pillars on the first substrate includes:

[0029] A glue film is disposed on the first surface of the first substrate; a plurality of electroplating tanks are opened on the glue film to expose the pad;

[0030] Electroplating metal in each of the electroplating tanks to form a plurality of the metal pillars;

[0031] The step of plastic-sealing the first substrate and the second substrate to form a plastic-sealed body comprises:

[0032] Plastic encapsulation of the second substrate, so that the plastic encapsulation material is filled between the first substrate and the second substrate to form an intermediate layer plastic encapsulation body;

[0033] After plastic-sealing the second substrate, removing the protective film on the first substrate;

[0034] After removing the adhesive film, the first substrate is plastic-sealed so that the plastic sealing material covers the first substrate to form the outer plastic sealing body.

[0035] In an optional embodiment, the step of providing a shielding metal layer on the plastic package body includes:

[0036] A solder ball is arranged on a side of the second substrate away from the first substrate; the plastic package body, the first substrate and the second substrate are cut to form a single product; metal is sputtered on the other surfaces of the single product except the side where the solder ball is arranged to form the shielding metal layer;

[0037] Alternatively, the second substrate is not plastic-sealed, and the first substrate is directly plastic-sealed to form an outer plastic-sealed body, and then the outer plastic-sealed body and the first substrate are cut; a metal layer is sprayed on the cut outer plastic-sealed body and the first substrate to form the shielding metal layer.

[0038] The beneficial effects of the embodiments of the present invention include, for example:

[0039] The three-dimensional stacked shielding structure mounts the first substrate on the second substrate, and the grounding of the metal column can achieve electromagnetic shielding for chip one. The grounding of multiple electrical connection arcs can achieve electromagnetic shielding for chip two surrounded by multiple electrical connection arcs. The mounting efficiency is high and the electromagnetic shielding is reliable. In addition, the chips are mounted on the first substrate and the second substrate respectively, with high integration and compact structure. The multiple electrical connection arcs can play a buffering role during the mounting process and have a certain capillary effect, thereby improving the filling effect of the filler between the first substrate and the second substrate. The three-dimensional stacked shielding method has a simple process and high packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 A schematic diagram of a first structure of a three-dimensional stacked shielding structure provided by the first embodiment of the present invention;

[0042] Figure 2 A schematic diagram of a partial structure of a three-dimensional stacked shielding structure provided in the first embodiment of the present invention;

[0043] Figure 3 A schematic diagram of a second structure of the three-dimensional stacked shielding structure provided by the first embodiment of the present invention;

[0044] Figure 4 A schematic diagram of a third structure of the three-dimensional stacked shielding structure provided by the first embodiment of the present invention;

[0045] Figure 5 A schematic diagram of a process for manufacturing a first substrate in a three-dimensional stacked shielding method provided by a second embodiment of the present invention;

[0046] Figure 6 A schematic diagram of a process for mounting a second substrate and a first substrate in a three-dimensional stacked shielding method provided by a second embodiment of the present invention;

[0047] Figure 7 Schematic diagram of the process after mounting the first substrate in the three-dimensional stacking shielding method provided by the second embodiment of the present invention Figure 1 ;

[0048] Figure 8 Schematic diagram of the process after mounting the first substrate in the three-dimensional stacking shielding method provided by the second embodiment of the present invention Figure 2 ;

[0049] Fig. 9 A schematic diagram of another process in the three-dimensional stacking shielding method provided in the second embodiment of the present invention.

[0050] Icons: 100-three-dimensional stacked shielding structure; 110-first substrate; 111-first surface; 112-second surface; 113-pad one; 114-pad two; 115-pad three; 116-adhesive film; 117-plating tank; 118-solid via; 120-metal column; 121-through hole; 130-chip one; 140-electrical connection arc; 141-ridged cavity structure; 150-metal ball; 160-second substrate; 161-pad four; 162-pad five; 163-pad six; 165-second solder ball; 170-chip two; 171-protective glue; 173-heat dissipation glue; 180-plastic package; 181-middle layer plastic package; 183-outer layer plastic package; 190-shielding metal layer. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0054] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0055] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0056] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0057] First embodiment

[0058] Please refer to Figure 1 , combined with Figure 5 The present embodiment provides a three-dimensional stacked shielding structure 100, comprising a first substrate 110, a plurality of metal pillars 120, a chip 130, a plurality of electrical connection arcs 140, and a second substrate 160. The first substrate 110 comprises a first surface 111 and a second surface 112 which are arranged opposite to each other, a pad 113 is provided on the first surface 111, and a pad 2 114 is provided on the second surface 112, the pad 113 and the pad 2 114 are arranged opposite to each other and are electrically connected, and at least one of the pad 113 and the pad 2 114 is grounded; and the pad 2 114 comprises two welding points at different positions. Each metal column 120 is electrically connected to pad 113, and a through hole 121 is provided in the metal column 120, and the through hole 121 passes through pad 113, the first substrate 110 and pad 2 114; chip 130 is electrically connected to the first substrate 110 and is located in the area surrounded by multiple metal columns 120; the two ends of each electrical connection arc 140 are respectively connected to two welding points of pad 2 114, and the electrical connection arc 140 is convexly arranged on the second surface 112 in a ridge shape; the second substrate 160 is provided with chip 2 170; the second substrate 160 is electrically connected to the second surface 112, and part or all of chip 2 170 is located between multiple electrical connection arcs 140. The first substrate 110 is mounted on the second substrate 160, and the metal column 120 is grounded to achieve electromagnetic shielding of chip 130. The grounding of multiple electrical connection arcs 140 can achieve electromagnetic shielding of chip 2 170 surrounded by multiple electrical connection arcs 140. The mounting efficiency is high and the electromagnetic shielding is reliable. The chips are mounted on the first substrate 110 and the second substrate 160 respectively, with high integration and compact structure. The multiple electrical connection arcs 140 can play a buffering role in the mounting process and have a certain capillary effect, thereby improving the filling effect of the filler between the first substrate 110 and the second substrate 160.

[0059] Optionally, the second chip 170 mounted on the second substrate 160 can be a regular chip or a flip chip. In this embodiment, the second chip 170 is a flip chip, and a protective glue 171 is provided at the bottom of the flip chip to protect the welding structure between the bottom bump of the second chip 170 and the second substrate 160. The protective glue 171 has an insulating property and can prevent other conductive media from entering and causing a short circuit in the second chip 170.

[0060] Optionally, the electrical connection arc 140 spans across the through hole 121, that is, the two welding points are respectively located on both sides of the through hole 121. Of course, the two or more welding points can also be located on the same side of the through hole 121. Each pad 114 is provided with one or more electrical connection arcs 140, and the multiple electrical connection arcs 140 can be arranged side by side or crosswise, which is not specifically limited here.

[0061] Optionally, the three-dimensional stacked shielding structure 100 further includes a plastic package 180 and a shielding metal layer 190, wherein the plastic package 180 seals the first substrate 110 and the second substrate 160, and the metal column 120 is exposed from the plastic package 180; the shielding metal layer 190 is disposed outside the plastic package 180 and is electrically connected to the metal column 120. Since the metal column 120 is grounded, the shielding metal layer 190 can achieve electromagnetic shielding of all chips on the first substrate 110 and the second substrate 160, with good shielding effect and reliable structure.

[0062] Optionally, the shielding metal layer 190 fills the through hole 121 and fills and wraps the electrical connection arc 140. It can be understood that during the formation of the shielding metal layer 190, if metal slurry is used, the metal slurry can enter the through hole 121 from the top of the metal column 120, reach between the first substrate 110 and the second substrate 160 along the through hole 121, and fill the ridge-shaped cavity structure 141 formed by multiple electrical connection arcs 140 to improve the electromagnetic shielding effect. The electrical connection arc 140 has a certain capillary effect, which helps the shielding metal layer 190 to climb, which is conducive to improving the filling effect of the shielding metal layer 190.

[0063] Optionally, the plastic packaging body 180 includes an intermediate layer plastic packaging body 181 and an outer layer plastic packaging body 183, the intermediate layer plastic packaging body 181 is filled between the first substrate 110 and the second substrate 160, and the ridge of the electrical connection arc 140 forms a cavity, that is, a ridge-shaped cavity structure 141 is formed, and the ridge-shaped cavity structure 141 is filled with a shielding metal layer 190; the outer layer plastic packaging body 183 plastic-packages the first substrate 110, and the shielding metal layer 190 is arranged on the outer layer plastic packaging body 183.

[0064] Combination Figure 2Optionally, on the same electrical connection arc 140, the first distance between the arcs on both sides is W, the second distance between the ridged high point of the electrical connection arc 140 and the second substrate 160 is H, and the particle diameter of the intermediate layer plastic package 181 is greater than the first distance and greater than the second distance. In this way, it is conducive to forming a cavity in the ridged structure of the electrical connection arc 140, that is, the intermediate layer plastic package 181 does not fill the ridged cavity structure 141. It is easy to understand that the cavity of the ridged structure is formed after the outer layer plastic package 183 is formed. In the process of spraying or sputtering the shielding metal layer 190, the particles of the shielding metal layer 190 are smaller, and the shielding metal layer 190 can flow in from the through hole 121 of the metal column 120 to fill the ridged cavity structure 141 and the through hole 121. It can be understood that there is a second distance H between the protruding high point of the electrical connection arc 140 and the second substrate 160 , which can prevent the electrical connection arc 140 from touching the second substrate 160 , thereby protecting the electrical connection arc 140 .

[0065] Combination Figure 3 Optionally, in some embodiments, the intermediate layer plastic sealing body 181 may also be omitted, that is, the intermediate layer plastic sealing body 181 is not provided.

[0066] Optionally, the second surface 112 of the first substrate 110 is provided with a pad 3 115, and the pad 3 115 is provided with a metal ball 150, and the metal ball 150 is electrically connected to the second substrate 160; the metal ball 150 is located inside or outside the area surrounded by the plurality of electrical connection arcs 140. It is easy to understand that the pad 3 115 is a functional pad. Figure 4 As shown, pad three 115 can be arranged within a region surrounded by a plurality of electrical connection arcs 140. Figure 1 As shown, the pad three 115 and the metal ball 150 may also be arranged outside the area surrounded by the multiple electrical connection arcs 140, which is not specifically limited here.

[0067] Second embodiment

[0068] Combination Figures 5 to 8 , an embodiment of the present invention provides a three-dimensional stacking shielding method, comprising:

[0069] A first substrate 110 is provided; the first substrate 110 includes a first surface 111 and a second surface 112 arranged opposite to each other, the first surface 111 is provided with a pad 113, the second surface 112 is provided with a pad 2 114 and a pad 3 115, the pad 113 and the pad 2 114 are arranged opposite to each other and are electrically connected, and at least one of the pad 113 and the pad 2 114 is grounded; wherein the pad 2 114 includes two welding points at different positions. Optionally, the pad 2 114 is grounded, and the first substrate 110 can achieve electrostatic discharge through the pad 2 114 and the metal pillar 120, so as to prevent the chip inside the three-dimensional stacked shielding structure 100 from being broken down by electrostatics.

[0070] A plurality of metal pillars 120 are arranged on the first substrate 110. Each metal pillar 120 is electrically connected to the pad 1 113, and a through hole 121 is provided in the metal pillar 120, and the through hole 121 passes through the pad 1 113, the first substrate 110 and the pad 2 114. Optionally, the first substrate 110 is placed with the side with the pad 1 113 facing upward, and a glue film 116 is attached to the side with the pad 1 113 of the first substrate 110, and the glue film 116 can be a photoresist, and the photoresist is opened by exposure and development to form a plating tank 117 to expose the pad 1 113, and a metal can be electroplated in the plating tank 117 by chemical electroplating to form the metal pillar 120. Of course, the electroplated metal can be copper, silver, gold, aluminum or a mixed metal, which is not specifically limited here.

[0071] Through etching or laser drilling, a through hole 121 is formed on the surface of the metal pillar 120. The through hole 121 penetrates the metal pillar 120, the pad 1 113, the solid via 118 inside the first substrate 110, and the pad 2 114. The solid via 118 in this embodiment is used to electrically connect the pad 1 113 and the pad 2 114.

[0072] Optionally, pad 1 113 and pad 2 114 may be electrically connected through an internal line or through a solid via 118. Alternatively, pad 1 113 and pad 2 114 may be electrically connected by filling a conductive shielding metal layer 190 in through hole 121, the shielding metal layer 190 fills through hole 121 and overflows from the bottom of through hole 121, and the overflowing shielding metal layer 190 is connected to pad 2 114, so as to realize electrical connection between pad 1 113 and pad 2 114. No specific limitation is made here.

[0073] The first substrate 110 is turned over so that the side with the second pad 114 faces upward, and a plurality of electrical connection arcs 140 are arranged. Optionally, the electrical connection arcs 140 are formed by wire bonding on the second pad 114, wherein the two ends of each electrical connection arc 140 are respectively connected to the two welding points of the second pad 114, and the electrical connection arc 140 is convexly arranged on the second surface 112 in a ridge shape. The electrical connection arc 140 can cross the through hole 121. A metal ball 150, i.e., a first solder ball, is arranged on the third pad 115. In this step, the adhesive film 116 on the first surface 111 does not need to be removed, and the adhesive film 116 can protect the metal column 120 when the first solder ball is arranged.

[0074] A second substrate 160 is provided. The second substrate 160 is provided with a second chip 170. Optionally, a fourth pad 161 and a fifth pad 162 are provided on one side of the second substrate 160, and a sixth pad 163 is provided on the other side. The fourth pad 161 can be used as a functional pad, the fifth pad 162 is used for mounting the second chip 170, and the sixth pad 163 is used for implanting the second solder ball 165.

[0075] Chip 2 170 is mounted on pad 5 162. Chip 2 170 can be a regular chip or a flip chip. In this embodiment, chip 2 170 is a flip chip, and a protective glue 171 is provided at the bottom of the flip chip to protect the welding structure between the bottom bump of chip 2 170 and the second substrate 160. The protective glue 171 has an insulating property and can prevent other conductive media from entering and causing a short circuit in chip 2 170.

[0076] Optionally, a heat dissipation adhesive 173 may be applied to the side of the chip 2 170 away from the second substrate 160. The heat dissipation adhesive 173 plays a role in bonding and fixing and heat dissipation, improving the heat dissipation performance and improving the mounting stability of the first substrate 110 and the second substrate 160. The heat dissipation adhesive 173 is not limited to insulating adhesive or conductive adhesive.

[0077] Mount the first substrate 110 to the second substrate 160, wherein the second substrate 160 is electrically connected to the second surface 112, and part or all of the second chip 170 is located between the plurality of electrical connection arcs 140. Optionally, mount the second surface 112 of the first substrate 110 to the second substrate 160, wherein the first solder ball is electrically connected to the pad 4 161. The first solder ball can be fixed to the pad 4 161 of the second substrate 160 by reflow.

[0078] The middle layer plastic encapsulation body 181 is formed. The plastic encapsulation process is used to fill the middle gap at the bottom of the first substrate 110 with plastic encapsulation material. The particle diameter of the plastic encapsulation material is greater than the first distance W and greater than the second distance H. In this way, it is beneficial for the electrical connection arc 140 to form a ridge-like cavity structure 141, that is, the middle layer plastic encapsulation body 181 does not fill the ridge-like cavity structure 141 of the electrical connection arc 140.

[0079] The film 116 (photoresist) is removed by chemical cleaning to expose the metal pillars 120 of the first substrate 110. In this embodiment, the film 116 is removed after the intermediate plastic package 181 is formed, so as to prevent the intermediate plastic package 181 from covering the first surface 111 of the first substrate 110.

[0080] Chip 130 is mounted on the first substrate 110. Chip 130 is located in the area surrounded by multiple metal pillars 120. Optionally, chip 130 can be a regular chip or a flip chip. In this embodiment, chip 130 is a flip chip, and a protective glue 171 is provided at the bottom of the flip chip to protect the welding structure between the bottom bump of chip 130 and the first substrate 110. The protective glue 171 has an insulating property and can prevent other conductive media from entering and causing a short circuit in chip 130.

[0081] The outer plastic encapsulation body 183 is formed. The plastic encapsulation process is used again to form the outer plastic encapsulation body 183 on the first surface 111 of the first substrate 110 to protect the structure on the first surface 111. Optionally, the metal column 120 is exposed from the outer plastic encapsulation body 183, that is, the height of the outer plastic encapsulation body 183 is less than the height of the metal column 120.

[0082] A ball planting process is adopted to plant a second solder ball 165 on a side of the second substrate 160 away from the first substrate 110 .

[0083] The packaging structure is separated into individual products by a cutting process. The individual products are placed on a jig, and the second solder ball 165 is protected by a protective film on the jig. A metal sputtering process is then performed to form a shielding metal layer 190 on the outer plastic package 183, which further plays an electromagnetic shielding role and can achieve electromagnetic shielding of all chips. Optionally, metal is sputtered on the surfaces of the individual products other than the side with the second solder ball 165 to form a shielding metal layer 190, that is, the shielding metal layer 190 covers the upper surface of the outer plastic package 183 and the side of the entire product.

[0084] It can be understood that the metal column 120 leaks out of the surface of the outer plastic package 183, and the shielding metal layer 190 covers the metal column 120 after the metal sputtering. The metal column 120 can improve the bonding force between the shielding metal layer 190 and the outer plastic package 183 in the metal sputtering process. Avoid the problem of poor bonding between the plastic package and the metal layer in the traditional process of sputtering the metal layer on the surface of the plastic package. In addition, the metal column 120 and the shielding metal layer 190 can also play a heat dissipation role and improve the heat dissipation effect. Optionally, the height of the metal column 120 leaking out of the surface of the outer plastic package 183 can be easily controlled during the metal sputtering process. For example, the height of the metal column 120 is 10um, and after the shielding metal layer 190 covers the metal column 120, the height of the shielding metal layer 190 must be greater than 10um. In this way, the thickness of the shielding metal layer 190 can be preliminarily estimated. In the traditional detection of the thickness of the metal layer, the product needs to be sliced, and after cutting the plastic package, the shielding layer is measured using a measuring tool. In this embodiment, the metal pillar 120 is exposed from the plastic package body 180, which can avoid the slicing process in the traditional process, simplify the process, ensure the thickness of the shielding metal layer 190, and improve the electromagnetic shielding effect.

[0085] During the sputtering process, the shielding metal layer 190 enters from the through hole 121 of the metal column 120, flows along the through hole 121 to the space between the first substrate 110 and the second substrate 160, fills the ridge-shaped cavity structure 141 formed by the electrical connection arc 140, and improves the electromagnetic shielding effect. It is easy to understand that the setting of the electrical connection arc 140 can play a capillary role, which can improve the filling effect of the shielding metal layer 190 in the ridge-shaped cavity, thereby improving the electromagnetic shielding effect. In addition, during the process of mounting the first substrate 110 to the second substrate 160, it can play a buffering role to prevent the first substrate 110 from being deformed and damaged due to excessive mounting pressure or excessive plastic packaging pressure.

[0086] Alternatively, if Fig. 9 In this embodiment, the second substrate 160 may not be encapsulated, and the first substrate 110 may be directly encapsulated to form an outer layer of encapsulated body 183, and then the outer layer of encapsulated body 183 and the first substrate 110 may be cut; and a metal layer may be sprayed on the cut outer layer of encapsulated body 183 and the first substrate 110 to form a shielding metal layer 190. That is, the intermediate layer of encapsulated body 181 is not formed in this method. Fig. 9 The dotted line in the figure indicates the cutting position. Specifically, after mounting the first substrate 110 to the second substrate 160, the first substrate 110 is directly plastic-sealed to form an outer plastic-sealed body 183, and the outer plastic-sealed body 183 and the first substrate 110 are cut. In this state, the second substrate 160 is not cut, and the first substrate 110 after cutting is still on the second substrate 160, which is convenient for spraying the structure on the second substrate 160 as a whole board, thereby improving the spraying efficiency. The spraying liquid is a metal liquid, which forms a shielding metal layer 190. The spraying liquid is coated on the upper surface of the outer plastic-sealed body 183, and fills the ridge-shaped cavity structure 141 of the electrical connection arc 140 through the through hole 121 of the metal column 120. In the process of spraying the upper surface of the outer plastic-sealed body 183, the spraying liquid can partially overflow and climb to the side of the outer plastic-sealed body 183. In this embodiment, the metal column 120 can be grounded. After the spraying is completed, the second solder balls 165 are implanted on the second substrate 160, and the second substrate 160 is cut into single separated products.

[0087] It should be noted that, during the spraying or sputtering process, the shielding metal layer 190 covers the outer plastic package 183 and fills the ridge-shaped cavity structure 141. The ridge-shaped cavity structure 141 here includes not only the arch bridge shape formed by a single electrical connection arc 140, but also the middle area surrounded by multiple electrical connection arcs 140. That is, the areas surrounded by multiple electrical connection arcs 140 are all filled with the shielding metal layer 190, thereby improving the electromagnetic shielding effect.

[0088] Of course, in other implementations, the shielding metal layer 190 may also be formed by other methods such as electroplating or lamination, which is not specifically limited here.

[0089] Optionally, in other embodiments, according to actual needs, the pad three 115 can also be arranged in the area surrounded by multiple pads two 114, that is, the pad two 114 is arranged on the outside of the first substrate 110, so that the electrical connection arc 140 is designed on the periphery, and has an electromagnetic shielding effect on the chip two 170 surrounded by the electrical connection arc 140. Correspondingly, the first solder ball is correspondingly arranged on the inner side of the electrical connection arc 140 and is electrically connected to the second substrate 160. The shielding metal layer 190 can be formed by spraying. During the spraying process, the metal liquid overflows from the upper surface of the outer plastic package 183 and climbs to the side. The outer electrical connection arc 140 can block the metal liquid from transitioning to climb inward and fill, thereby enhancing the electromagnetic shielding effect. It should be understood that the metal column 120 can achieve electromagnetic shielding of the chip one 130, the electrical connection arc 140 can achieve electromagnetic shielding of the chip two 170, and the shielding metal layer 190 can achieve electromagnetic shielding of the entire structure, thereby improving the electromagnetic shielding effect.

[0090] It should be noted that a chip three may also be disposed on the outer side of the metal pillar 120 on the first substrate 110 to improve chip integration, and electromagnetic shielding of the chip three may be achieved through the shielding metal layer 190 .

[0091] Optionally, the grounding setting in this embodiment can be grounding of the metal pillar 120, grounding of the electrical connection arc 140, or grounding through a grounding line inside the first substrate 110 or the second substrate 160, which is not specifically limited here. For example, the second pad 114 is grounded to dissipate internal static electricity.

[0092] In this embodiment, some contents not mentioned are the same as those described in the first embodiment and will not be repeated here.

[0093] In summary, the beneficial effects of the embodiments of the present invention include:

[0094] The three-dimensional stacked shielding structure 100 mounts the first substrate 110 on the second substrate 160, and the metal column 120 is grounded to achieve electromagnetic shielding for chip one 130. The grounding of multiple electrical connection arcs 140 can achieve electromagnetic shielding for chip two 170 surrounded by multiple electrical connection arcs 140. The mounting efficiency is high and the electromagnetic shielding is reliable. In addition, the chips are mounted on the first substrate 110 and the second substrate 160 respectively, with high integration and compact structure. Multiple electrical connection arcs 140 can play a buffering role during the mounting process. When the shielding metal layer 190 is formed by spraying or sputtering metal, the metal layer enters the ridge-shaped cavity structure 141 of the electrical connection arc 140 through the through hole 121. The electrical connection arc 140 has a certain capillary effect, which improves the filling effect of the ridge-shaped cavity structure 141, thereby improving the electromagnetic shielding effect. The shielding metal layer 190 can achieve full electromagnetic shielding of the entire structure.

[0095] This three-dimensional stacking shielding method has simple process, high packaging efficiency and good electromagnetic shielding effect. In addition, there can be multiple grounding points, which can avoid the problem that the grounding points are arranged in the substrate circuit layer in the traditional process, and the capillaries caused by cutting lead to poor bonding between the side wall grounding circuit and the metal layer.

[0096] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A three-dimensional stacked shielding structure, characterized in that: include: A first substrate, the first substrate comprises a first surface and a second surface which are arranged opposite to each other, the first surface is provided with a first solder pad, the second surface is provided with a second solder pad, the first solder pad and the second solder pad are arranged opposite to each other and are electrically connected, at least one of the first solder pad and the second solder pad is grounded; wherein the second solder pad comprises two soldering points at different positions; A plurality of metal pillars, each of which is electrically connected to the first pad, and each of which is provided with a through hole, and the through hole passes through the first pad, the first substrate and the second pad; Chip 1, the chip 1 is electrically connected to the first substrate and is located in a region surrounded by the plurality of metal pillars; A plurality of electrical connection arcs, each of which has two ends connected to the two welding points of the second welding pad, and the electrical connection arcs are convexly disposed on the second surface in a ridge shape; The second substrate is provided with at least one chip 2; the second substrate is electrically connected to the second surface, and at least one chip 2 is located between a plurality of electrical connection arcs.

2. The three-dimensional stacked shielding structure according to claim 1, characterized in that: It also includes a plastic packaging body and a shielding metal layer, wherein the plastic packaging body plastic-packages the first substrate and the second substrate, and the metal column is exposed from the plastic packaging body; The shielding metal layer is arranged outside the plastic package body and is electrically connected to the metal column.

3. The three-dimensional stacked shielding structure according to claim 2, characterized in that: The shielding metal layer fills the through hole and fills and wraps the electrical connection arc.

4. The three-dimensional stacked shielding structure according to claim 3, characterized in that: The plastic sealing body comprises an intermediate plastic sealing body and an outer plastic sealing body, the intermediate plastic sealing body is filled between the first substrate and the second substrate, and the electrical connection arc forms a ridge-like cavity structure, and the shielding metal layer is filled in the ridge-like cavity structure; The outer plastic packaging body seals the first substrate, and the shielding metal layer is arranged on the outer plastic packaging body.

5. The three-dimensional stacked shielding structure according to claim 4, characterized in that: On the same electrical connection arc, the first distance between the arcs on both sides is W, the second distance between the ridged high point of the electrical connection arc and the second substrate is H, and the particle diameter of the intermediate layer plastic package body is greater than the first distance W and greater than the second distance H.

6. The three-dimensional stacked shielding structure according to claim 1, characterized in that: A third pad is disposed on the second surface of the first substrate. A metal ball is disposed on the third pad. The metal ball is electrically connected to the second substrate. The metal ball is located inside or outside the area surrounded by the plurality of electrical connection arcs.

7. A three-dimensional stacking shielding method, characterized in that: include: A first substrate is provided; the first substrate comprises a first surface and a second surface which are arranged opposite to each other, the first surface is provided with a first solder pad, the second surface is provided with a second solder pad, the first solder pad and the second solder pad are arranged opposite to each other and are electrically connected, at least one of the first solder pad and the second solder pad is grounded; wherein the second solder pad comprises two soldering points at different positions; A plurality of metal columns are arranged on the first substrate; wherein each of the metal columns is electrically connected to the first pad, and the metal columns are provided with a through hole, and the through hole passes through the first pad, the first substrate and the second pad; Mounting chip 1 on the first substrate; wherein the chip 1 is located in an area surrounded by a plurality of the metal pillars; A plurality of electrical connection arcs are provided; wherein two ends of each of the electrical connection arcs are respectively connected to the two welding points of the second welding pad, and the electrical connection arcs are convexly provided on the second surface in a ridge shape; Providing a second substrate; wherein the second substrate is provided with at least one chip 2; The first substrate is mounted to the second substrate; wherein the second substrate is electrically connected to the second surface, and at least one chip 2 is located between a plurality of electrical connection arcs.

8. The three-dimensional stacking shielding method according to claim 7, characterized in that: Also includes: Plastic-sealing the first substrate and the second substrate to form a plastic-sealed body; A shielding metal layer is arranged on the plastic package body; wherein the shielding metal layer is electrically connected to the metal column; the shielding metal layer fills the through hole, and fills and wraps the electrical connection arc.

9. The three-dimensional stacking shielding method according to claim 8, characterized in that: The plastic package body includes an outer plastic package body and an intermediate plastic package body; the step of arranging a plurality of metal pillars on the first substrate includes: A glue film is disposed on the first surface of the first substrate; a plurality of electroplating tanks are opened on the glue film to expose the pad; Electroplating metal in each of the electroplating tanks to form a plurality of the metal pillars; The step of plastic-sealing the first substrate and the second substrate to form a plastic-sealed body comprises: Plastic encapsulation of the second substrate, so that the plastic encapsulation material is filled between the first substrate and the second substrate to form an intermediate layer plastic encapsulation body; After plastic-sealing the second substrate, removing the adhesive film on the first substrate; After removing the adhesive film, the first substrate is plastic-sealed so that the plastic-sealing material covers the first substrate to form the outer plastic-sealing body.

10. The three-dimensional stacking shielding method according to claim 9, characterized in that: The step of providing a shielding metal layer on the plastic package body comprises: A solder ball is arranged on a side of the second substrate away from the first substrate; the plastic package body, the first substrate and the second substrate are cut to form a single product; metal is sputtered on the other surfaces of the single product except the side where the solder ball is arranged to form the shielding metal layer; Alternatively, the second substrate is not plastic-sealed, and the first substrate is directly plastic-sealed to form an outer plastic-sealed body, and then the outer plastic-sealed body and the first substrate are cut; a metal layer is sprayed on the cut outer plastic-sealed body and the first substrate to form the shielding metal layer.

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