Method and apparatus for acoustic testing of MEMS devices

Abstract

An embodiment provides a method for acoustically testing at least one MEMS device among a plurality of MEMS devices. The method includes providing at least one MEMS device. Furthermore, the method includes exciting the at least one MEMS device to generate acoustic vibrations. Furthermore, the method includes detecting the acoustic vibrations of the at least one MEMS device via at least one acoustic sensor. Furthermore, the method includes evaluating the acoustic vibrations of the at least one MEMS device detected by the at least one acoustic sensor to test the at least one MEMS device for target functionality.

Description

Technical Field

[0001] Embodiments of the present invention provide methods for acoustically testing at least one MEMS device (micro-electromechanical system) of a plurality of MEMS devices. Further embodiments relate to apparatus for acoustically testing at least one MEMS device of a plurality of MEMS devices. Some embodiments relate to acoustically testing MEMS. Background Art

[0002] Checking microelectromechanical systems (MEMS) for their desired functional modes presents a nontrivial technical challenge. Thus, a MEMS that is proven to be fully electrically functional may contain mechanical defects. Conversely, it is also possible to have mechanical movement but no electrical function, such as an electrical short circuit.

[0003] Furthermore, purely electrical measurements can be problematic because some MEMS structures involved in the desired function only flow very low currents and exhibit correspondingly high resistance / impedance (in the MOhm or GOhm range). Consequently, metrology methods often require long integration times. These methods appear uneconomical for optimized production lines. A potential solution is to examine whether electrical excitation (or stimulation) of the MEMS results in mechanical movement. This can be done optically, as in prior art, but this presents significant complexity for measuring more than a single chip. The underlying optics and their form factor contribute to the problem. For very small MEMS structures, a very expensive measurement distance is required, which can also be very time-consuming due to their modal capabilities (e.g., stroboscopes). Furthermore, current prior art does not allow for optical testing of the internal structures of covered or capped MEMS, making it impossible to detect defects caused by the capping / covering. Furthermore, currently developed optical systems that can expose structures through silicon (i.e., the outer cap / cover) are still limited in scope, making them incapable of fully inspecting larger chips. The later in the supply chain a defect that already exists or is introduced during the production process is discovered, the more expensive the entire manufacturing process becomes.

[0004] Therefore, a basic object of the present invention is to improve the current situation. Summary of the Invention

[0005] An embodiment provides a method for acoustically testing at least one MEMS device. The method includes the steps of providing at least one MEMS device. In addition, the method includes the steps of exciting the at least one MEMS device to generate acoustic vibrations (or oscillations). In addition, the method includes the steps of detecting the acoustic vibrations of the at least one MEMS device by at least one sound sensor (or acoustic sensor). In addition, the method includes the steps of evaluating the acoustic vibrations of the at least one MEMS device detected by the at least one sound sensor to test the at least one MEMS device for target functionality.

[0006] In an embodiment, when providing the at least one MEMS device, a wafer including a plurality of MEMS devices may be provided, wherein when activating the at least one MEMS device, at least one MEMS device of the plurality of MEMS devices may be activated.

[0007] In an embodiment, the at least one MEMS device may be tested on the wafer level before dicing the plurality of MEMS devices.

[0008] In an embodiment, when providing the at least one MEMS device, an integrated circuit or a chip including the at least one MEMS device may be provided.

[0009] In an embodiment, the at least one MEMS device may be tested while the integrated circuit or chip is being manufactured.

[0010] In an embodiment, at the end of the integrated circuit or chip manufacturing, the at least one MEMS device may be tested.

[0011] In an embodiment, the method may further include providing a test apparatus, and contacting the at least one MEMS device by means of the test apparatus, wherein the at least one MEMS device is stimulated by means of the test apparatus.

[0012] In an embodiment, the test device may be a probe, a part of a probe, or a test card.

[0013] In an embodiment, the testing device may comprise the at least one sound sensor.

[0014] In an embodiment, the test apparatus may be at least partially acoustically transparent in a region adjacent to the at least one MEMS device, wherein the at least one sound sensor may be arranged adjacent to the at least partially acoustically transparent region of the test apparatus.

[0015] In an embodiment, the at least one MEMS device may be a group of MEMS devices, wherein the test apparatus is at least partially acoustically transparent in a region adjacent to the group of MEMS devices, wherein the at least one sound sensor is arranged adjacent to the at least partially acoustically transparent region of the test apparatus.

[0016] In an embodiment, the test device may be a first test device, which contacts a first side of the at least one MEMS device, wherein the method may further include providing a second test device and contacting a second side of the at least one MEMS device opposite to the first side by means of the second test device, the second test device comprising the at least one sound sensor.

[0017] In an embodiment, the second testing apparatus may comprise a support for the wafer, the support being at least partially acoustically transparent in a region adjacent to the at least one MEMS device, wherein the at least one sound sensor is arranged adjacent to the at least partially acoustically transparent region of the support.

[0018] In an embodiment, the at least one MEMS device may be a group of MEMS devices, wherein the support body is at least partially acoustically transparent in a region adjacent to the group of MEMS devices, wherein the at least one sound sensor is arranged adjacent to the at least partially acoustically transparent region of the support body.

[0019] In an embodiment, the at least one MEMS device may be a group of MEMS devices, wherein the group of MEMS devices is excited to generate acoustic vibrations, wherein the acoustic vibrations of the group of MEMS devices are detected by the at least one sound sensor.

[0020] In an embodiment, the at least one sound sensor may be precisely one sound sensor associated with the set of MEMS devices.

[0021] In an embodiment, the at least one sound sensor may comprise precisely one sound sensor array associated with the set of MEMS devices.

[0022] In an embodiment, the at least one sound sensor may include a plurality of sound sensors, wherein each sound sensor of the plurality of sound sensors is associated with a MEMS device of the set of MEMS devices.

[0023] In an embodiment, the at least one sound sensor may include a plurality of sound sensor arrays, wherein each sound sensor array of the plurality of sound sensor arrays is associated with a MEMS device of the set of MEMS devices.

[0024] In an embodiment, the plurality of sound sensors or the array of sound sensors may be acoustically shielded from each other.

[0025] In an embodiment, the MEMS devices of the set of MEMS devices may be acoustically shielded from each other.

[0026] In an embodiment, the group of MEMS devices may be excited simultaneously by different signals having non-overlapping frequencies.

[0027] In an embodiment, the group of MEMS devices may be excited simultaneously by different signals with overlapping frequencies.

[0028] In an embodiment, the group of MEMS devices may be excited in succession by the same signal.

[0029] In an embodiment, the group of MEMS devices may be activated simultaneously.

[0030] In an embodiment, the at least one MEMS device may be a MEMS speaker, a MEMS microphone, a MEMS pump, a MEMS actuator, a MEMS transmission, or a MEMS-based medical testing device.

[0031] In an embodiment, the at least one sound sensor may be a microphone or a structure-borne sound sensor.

[0032] A further embodiment provides a testing device for performing acoustic testing on at least one MEMS device of a plurality of MEMS devices arranged on a wafer, the testing device being configured to contact at least one MEMS device of the plurality of MEMS devices arranged on the wafer, the testing device being configured to excite the at least one MEMS device to generate acoustic vibrations, the testing device comprising at least one sound sensor configured to detect the acoustic vibrations of the at least one MEMS device, the testing device being configured to provide at least one signal, the at least one signal being dependent on the acoustic vibrations of the at least one MEMS device detected by the sound sensor, the testing device being a probe or a test card.

[0033] A further embodiment provides an apparatus for acoustically testing at least one MEMS device of a plurality of MEMS devices arranged on a wafer, the apparatus comprising a first testing apparatus and a second testing apparatus, the first testing apparatus being configured to contact a first side of the at least one MEMS device of the plurality of MEMS devices arranged on the wafer, the first testing apparatus being configured to excite the at least one MEMS device to generate acoustic vibrations, the second testing apparatus being configured to contact a second side of the at least one MEMS device opposite to the first side, the second testing apparatus comprising at least one sound sensor configured to detect the acoustic vibrations of the at least one MEMS device, the apparatus being configured to evaluate the acoustic vibrations of the at least one MEMS device detected by the at least one sound sensor to test the at least one MEMS device for a target function.

[0034] Further embodiments provide methods, apparatus, and computer programs for acoustic testing and acoustic characterization of microelectromechanical systems (MEMS). BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Embodiments of the present invention will be described in more detail with reference to the accompanying drawings, in which:

[0036] Figure 1 A flow chart showing a method for acoustically testing at least one MEMS device of a plurality of MEMS devices according to an embodiment of the present invention is shown.

[0037] Figure 2 is a schematic diagram of an apparatus for acoustically testing at least one MEMS device of a plurality of MEMS devices at a wafer level according to an embodiment,

[0038] Figure 3 is a schematic diagram of an apparatus for acoustically testing a plurality of MEMS devices at a wafer level using an acoustic sensor according to an embodiment,

[0039] Figure 4 is a schematic diagram of an apparatus for acoustically testing a plurality of MEMS devices at a wafer level using an acoustic sensor array according to an embodiment,

[0040] Figure 5 is a schematic diagram of an apparatus for performing acoustic testing on a group of MEMS devices at a wafer level using one acoustic sensor for each MEMS device in a group of MEMS devices according to an embodiment,

[0041] Figure 6is a schematic diagram of an apparatus for acoustically testing a group of MEMS devices at a wafer level using an acoustic sensor array for each MEMS device in the group according to an embodiment,

[0042] Figure 7 is a schematic diagram of an apparatus for performing acoustic testing on a group of MEMS devices of a plurality of MEMS devices at a wafer level using an acoustic sensor according to an embodiment,

[0043] Figure 8 is a schematic diagram of an apparatus for performing acoustic testing on a group of MEMS devices of a plurality of MEMS devices at a wafer level using an acoustic sensor array according to an embodiment,

[0044] Figure 9 is a schematic diagram of an apparatus for acoustically testing a plurality of MEMS devices at a wafer level using an acoustic sensor according to an embodiment,

[0045] Figure 10 is a schematic diagram of an apparatus for acoustically testing a plurality of MEMS devices at a wafer level using an acoustic sensor array according to an embodiment,

[0046] Figure 11 is a schematic diagram of an apparatus for performing acoustic testing on a group of MEMS devices at a wafer level using one acoustic sensor for each MEMS device in a group of MEMS devices according to an embodiment,

[0047] Figure 12 is a schematic diagram of an apparatus for acoustically testing a group of MEMS devices at a wafer level using an acoustic sensor array for each MEMS device in the group according to an embodiment,

[0048] Figure 13 is a schematic diagram of an apparatus for performing acoustic testing on a group of MEMS devices of a plurality of MEMS devices at a wafer level using an acoustic sensor according to an embodiment,

[0049] Figure 14 is a schematic diagram of an apparatus for performing acoustic testing on a group of MEMS devices of a plurality of MEMS devices at a wafer level using an acoustic sensor array according to an embodiment,

[0050] Figure 15 is a schematic diagram of a wafer tester with probes, which can be used Figures 3 to 14 The embodiment described in

[0051] Figure 16 is a schematic diagram of an apparatus for acoustically testing at least one MEMS device after molding / packaging the at least one MEMS device according to an embodiment, and

[0052] Figure 17 Schematic diagram of acoustic inspection of at least one MEMS device during and at the end of a production line. DETAILED DESCRIPTION

[0053] In the following description of the embodiments of the present invention, equivalent components or components with equivalent effects will be provided with equivalent reference numerals in the drawings so that the description thereof can be interchanged with each other.

[0054] Figure 1 A flow chart illustrating a method 100 for acoustically testing at least one MEMS device of a plurality of MEMS devices according to an embodiment of the present invention is shown. The method 100 includes a step 102 of providing at least one MEMS device. Furthermore, the method 100 includes a step 104 of exciting the at least one MEMS device to generate acoustic vibrations. Furthermore, the method 100 includes a step 106 of detecting the acoustic vibrations of the at least one MEMS device via at least one acoustic sensor. Furthermore, the method 100 includes a step 108 of evaluating the acoustic vibrations of the at least one MEMS device detected by the at least one acoustic sensor to test the at least one MEMS device for target functionality.

[0055] In an embodiment, in step 102, a wafer including a plurality of MEMS devices may be provided, wherein in step 104, at least one of the plurality of MEMS devices is excited to generate acoustic vibrations. Of course, in step 104, more (e.g., a proper subset) or all of the plurality of MEMS devices may be excited to generate acoustic vibrations, i.e., excited one by one, in groups, or simultaneously. Thus, it is possible to test at least one, more, or all of the plurality of MEMS devices at the wafer level, for example, for target functionality, before cutting the plurality of MEMS devices.

[0056] In an embodiment, in step 102 , of course, individual or several cut MEMS devices may also be provided and excited to generate acoustic vibrations, in step 104 , for testing the MEMS devices for target functionality, for example before and / or after packaging.

[0057] In addition, in an embodiment, a portion of a product or a final product including at least one MEMS device may be provided in step 102, and the portion of the product or the final product may be excited to generate acoustic vibrations in step 104 to test the portion of the product or the final product for target functionality. Thus, it is possible to test the product during the manufacture of the product including at least one MEMS device (i.e., in-line) or immediately after the manufacture of the product (i.e., end-of-line).

[0058] Embodiments of the present invention allow for testing of at least one MEMS device during or after manufacturing the at least one MEMS device, before or after packaging the at least one MEMS device, or during or after integrating the at least one MEMS device into a product.

[0059] Later, we will explain in more detail Figure 1 Detailed embodiments of the method 100, a computer program for executing the method 100, and a corresponding apparatus are shown.

[0060] Embodiments allow for acoustic testing and / or acoustic characterization of one or more MEMS devices, for example, in the field of semiconductor manufacturing, and in manual, semi-automatic, or fully automated implementations within a production line or product value chain. Thus, embodiments may relate to steps within the value chain of an entire production process or a portion thereof within a production line. Thus, various embodiments may include one or more sub-aspects, which are briefly described below.

[0061] In an embodiment, acoustic testing and / or acoustic characterization of one or more MEMS devices in the field of semiconductor manufacturing further includes wafer testing, such as manual or semi-automatic testing using a probe (probe testing), or fully automatic testing using a probe card for the wafer (wafer probe card testing), as well as testing during assembly (assembly testing), such as testing after molding / packaging and other suitable or semiconductor-specific manufacturing steps.

[0062] In an embodiment, acoustic testing and / or acoustic characterization of one or more MEMS devices in the field of semiconductor manufacturing, production line or product value chain includes any test possible in the chain during manufacturing (in-line test), such as testing during printed circuit board assembly (PCB assembly test or in-circuit test) or testing after temperature stepping (post-temperature test) or stress testing, as well as testing after the corresponding product is manufactured (end-of-line test) or product sub-step.

[0063] Embodiments of acoustic testing and acoustic characterization involve one or more DUTs (DUT = device under test), where, in the field of semiconductor manufacturing, DUT refers to a chip or a substructure of a chip, and in the field of production lines refers to a product or a subproduct with integrated MEMS, which is checked for electrical and / or mechanical parameters by electrical or mechanical or electromechanical excitation / activation / signals and these functions are evaluated from the point of view of defined and / or formulated acoustic tests.

[0064] For example, the DUTs can be categorized into four groups based on the following evaluations: 1.) DUT exhibits full acoustic functionality (e.g., characterized as green), 2.) DUT exhibits limited acoustic functionality but within defined acoustic limits (e.g., characterized as yellow), 3.) DUT exhibits limited acoustic functionality but outside defined acoustic limits (e.g., characterized as orange), and 4.) DUT exhibits no acoustic functionality (red). In an embodiment, the DUTs can also be categorized into a different number of groups based on the evaluations, such as two groups, for example: 1.) DUT functional and 2.) DUT non-functional.

[0065] For evaluating the DUT, one can use, for example, the acoustic tests described below and, for example, define the acoustic limits of the DUT.

[0066] In an embodiment, the aging identification of individual defective DUTs can be performed by simultaneously exciting many DUTs using a narrow wavelength band that can distinguish the stimulus.

[0067] In an embodiment, testing individual DUTs for achieved sound pressure levels may be performed using broadband excitation.

[0068] In one embodiment, an acoustic inspection based on the "rubbing and buzzing" principle can be performed. This can specifically search for scraping or rattling noises caused by loose or overtightened equipment. For example, defects produce narrowband excitation, which results in a broad spectrum. This allows for isolation or compensation of ambient noise.

[0069] In an embodiment, the DUT may be tested for resonant frequency, intermodulation distortion, multi-tone distortion, total harmonic distortion, and / or phase response / group delay.

[0070] In embodiments, the use of a microphone array allows for the identification and definition of the emission characteristics of individual DUTs, for example, through interference or moiré effects. Furthermore, defective areas on the wafer can be identified very quickly. This can be used, for example, as a short-term test to identify critical production errors at an early stage. Furthermore, pulsed measurements can enable parallel measurement of any DUT while accounting for time delays.

[0071] In an embodiment, the DUT may be subjected to acoustic stress testing.

[0072] In embodiments, the apparatus for accommodating MEMS or DUTs, probes, and / or further apparatus or equipment for acoustic testing are augmented and / or supplemented by specific configurations described below. The primary action here is to place an acoustic sensor (e.g., a microphone or structure-borne sound sensor) or an acoustic sensor array (e.g., a microphone array or structure-borne sound sensor array) at an acoustically detectable location, for example, above the DUT's sound outlet, directly adjacent to one or more DUTs. Therefore, depending on the MEMS production method and test variations, the detectable placement of the probe in semiconductor manufacturing is represented by a location above or below the wafer or chip. This can vary considerably within the production line and is consistent only with the aforementioned primary point. A secondary point is ensuring proper electrical, mechanical, or electromechanical actuation of the DUT or DUTs. Both in semiconductor production and on the production line, electrical actuation can be performed using suitable electrical contacts, such as microscopic needles or pins, for example, using contact pressure appropriate to the application. If necessary, mechanical actuation can be achieved using suitable actuators, such as loudspeakers, for example.

[0073] Specific embodiments of the present invention will be described below.

[0074] 1. Wafer testing

[0075] In an embodiment, the acoustic inspection and / or acoustic characterization (of one or more MEMS) may be performed after the wafer with the still pure MEMS ICs (IC=Integrated Circuit) is finished.

[0076] 1.1 Acoustic probe testing

[0077] Figure 2 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing at least one MEMS device 7 of a plurality of MEMS devices at wafer level is shown.

[0078] The apparatus 11 may include a receiving device 1 for receiving (and, for example, for placing) a wafer 2 having a plurality of MEMS devices. Furthermore, the apparatus 11 may include a testing device 10 (for example, such as a probe card, a probe, or a portion of a probe) configured to contact at least one MEMS device 7 and, for example, mechanically or electrically excite the at least one MEMS device 7 to generate acoustic vibrations, for example, by a test needle 5 in contact with contacts 6 of the at least one MEMS device 7. The testing device 10 may further include at least one sound sensor 8 (for example, a microphone) configured to detect the acoustic vibrations of the at least one MEMS device 7.

[0079] Here, the at least one sound sensor 8 can be arranged adjacent to the at least one MEMS device 7, for example, in an area of an emission angle (for example, a main emission angle) of acoustic vibrations of the at least one MEMS device 7, such as in an area between (or adjacent to) a test pin 5 in contact with the at least one MEMS device 7, and / or adjacent to the at least one MEMS device 7 and an area 14 of the test apparatus 10 that is at least partially acoustically transparent (for example, through a sound hole). The apparatus 11 (for example, the test apparatus 10) can optionally include (for example, if necessary) an acoustic shielding device 13 (for example, a noise shield) that is configured to shield the at least one sound sensor 8 from the environment and / or other MEMS devices of the plurality of MEMS devices.

[0080] like Figure 2 As shown, the test device 10 can be part of a probe card or probe 3 of a device 11. The probe 3 can comprise, for example, a device 4 for a probe card 10 and, for example, a board 9 with an evaluation unit and, if applicable, a connection to a tester.

[0081] in other words, Figure 2 According to an embodiment, a schematic diagram of an apparatus for acoustic probe testing is shown, where individual DUTs (MEMS devices) are tested by a single acoustic sensor (eg, microphone).

[0082] exist Figure 2 In the illustrated embodiment, although it is assumed that a single MEMS device 7 of a plurality of MEMS devices is tested by a single acoustic sensor 8, it is pointed out that the present invention is not limited to such an embodiment. Instead, in an embodiment, acoustic testing can be performed on a single MEMS device of a plurality of MEMS devices, a group of MEMS devices, or all MEMS devices. Here, one acoustic sensor or an array of acoustic sensors can be used for each MEMS device, or one acoustic sensor or an array of acoustic sensors can be used for several MEMS devices of a plurality of MEMS devices (such as a group of MEMS devices having at least two MEMS devices) or all MEMS devices. Figures 3 to 14 Briefly discuss these different implementation aspects.

[0083] Figure 3 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing a MEMS device 7 of a plurality of MEMS devices at a wafer level using an acoustic sensor 8 is shown. Figure 2 In the illustrated embodiment, the test apparatus 10 may include an acoustic sensor 8 disposed adjacent to one MEMS device 7 of the plurality of MEMS devices. Figure 3A so-called single DUT test (MEMS device test) is shown with a single sound sensor, such as a microphone, for example.

[0084] Figure 4 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing a plurality of MEMS devices 7 at a wafer level using an acoustic sensor array 8 is shown. Figure 3 In the embodiment shown, Figure 4 In the embodiment shown, an acoustic sensor array (eg, a microphone array) 8 can be used instead of a single acoustic sensor to perform acoustic testing on the MEMS device 7. In other words, Figure 4 A so-called single DUT (MEMS device) test is shown with an acoustic sensor array, such as, for example, a microphone array.

[0085] Figure 5 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing a group 30 of a plurality of MEMS devices 7_1 to 7_3 using one acoustic sensor 8_1 to 8_3 for each MEMS device 7_1 to 7_3 at a wafer level is shown. Figure 3 In the embodiment shown, Figure 5 In the illustrated embodiment, a group 30 of MEMS devices 7_1 to 7_3 can be tested, with one sound sensor 8_1 to 8_3 associated with each MEMS device in the group 30 of MEMS devices 7_1 to 7_3. Here, the sound sensors 8_1 to 8_3 can be arranged adjacent to respective MEMS devices 7_1 to 7_3 in the group 30 of MEMS devices 7_1 to 7_3, such as in an area between (or adjacent to) a test pin contacting the respective MEMS device 7_1 to 7_3, and / or arranged adjacent to the respective MEMS device 7_1 to 7_3 and on the respective area 14_1 to 14_3 of the test apparatus 10 that is at least partially acoustically transparent (e.g., through a sound hole). In other words, Figure 5 Shows so-called multi-DUT (MEMS device) testing with a single acoustic sensor (e.g., microphone) per DUT.

[0086] Figure 6 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing each MEMS device 7_1 to 7_3 of a group 30 of multiple MEMS devices 7_1 to 7_3 at a wafer level using an acoustic sensor array 8_1 to 8_3 is shown. Figure 5 In the embodiment shown, Figure 6In the embodiment shown, instead of one sound sensor per MEMS device, the group 30 of MEMS devices 7_1 to 7_3 may use one sound sensor array 8_1 to 8_3 for each MEMS device 7_1 to 7_3. In other words, Figure 6 Shows so-called multi-DUT (MEMS device) testing where each DUT is tested using an acoustic sensor array (e.g., a microphone array).

[0087] Figure 7 According to an embodiment, a schematic diagram of an apparatus 11 for performing acoustic testing on a group 30 of a plurality of MEMS devices 7_1 to 7_3 at a wafer level using an acoustic sensor 8 is shown. Figure 5 In the embodiment shown, Figure 7 In the embodiment shown, the group 30 of MEMS devices 7_1 to 7_3 may be acoustically tested using a single acoustic sensor 8, rather than using one acoustic sensor for each MEMS device. Figure 7 The so-called multi-DUT (MEMS device) testing with a single acoustic sensor (such as a microphone, for example) is demonstrated.

[0088] Figure 8 According to an embodiment, a schematic diagram of an apparatus 11 for performing acoustic testing on a group 30 of a plurality of MEMS devices 7_1 to 7_3 at a wafer level using an acoustic sensor array 8 is shown. Figure 7 In the embodiment shown, Figure 8 In the embodiment shown, the acoustic sensor array 8 may be used to perform acoustic testing on the group 30 of MEMS devices 7_1 to 7_3, rather than using a single acoustic sensor. In other words, Figure 8 The so-called multi-DUT (MEMS device) testing by means of a single sound sensor array (such as, for example, a microphone array) is demonstrated.

[0089] Figure 9According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing MEMS devices 7 of a plurality of MEMS devices at wafer level using acoustic sensors 8 is shown. The apparatus 11 may include a first testing apparatus 10 (a probe card, a probe, or a portion of a probe) configured to contact a first side 32 of at least one MEMS device 7 and, for example, mechanically or electrically excite the at least one MEMS device 7 to generate acoustic vibrations, for example, by a test needle 5 in contact with a contact 6 of the at least one MEMS device 7. In addition, the apparatus 11 may include a second testing apparatus 34 configured to contact a second side 36 of the MEMS device 7, wherein the second testing apparatus 34 may include at least one acoustic sensor 8 (e.g., a microphone) configured to detect the acoustic vibrations of the at least one MEMS device 7.

[0090] Here, the at least one sound sensor 8 can be arranged adjacent to the at least one MEMS device 7, for example, in the region of the (back) emission angle (e.g., main emission angle) of the acoustic vibrations of the at least one MEMS device 7, for example, below the region 14 of the test device 10 that is arranged adjacent to the at least one MEMS device 7 and is at least partially acoustically transparent (e.g., transparent through the sound hole). Alternatively (or additionally), the sound sensor can also be arranged in the region of the first test device 10 between (or adjacent to) the test pins that contact the MEMS device 7, for example. Figure 7 The device 11 (eg, such as the second test device 34 ) may optionally (eg, if necessary) include an acoustic shielding device 13 (eg, a noise shield) configured to shield the at least one sound sensor 8 from the environment and / or other MEMS devices of the plurality of MEMS devices.

[0091] like Figure 9 As shown in the example, the second testing device 34 may be part of the receiving device 1 for receiving (and, for example, placing) the wafer 2 .

[0092] in other words, Figure 9 A so-called single DUT (MEMS device) test with a single sound sensor (microphone 8 ) is shown.

[0093] Figure 10 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing a plurality of MEMS devices 7 at a wafer level using an acoustic sensor array 8 is shown. Figure 9 In the embodiment shown, Figure 10In the embodiment shown, an acoustic sensor array (eg, a microphone array) 8 may be used to perform acoustic testing on the MEMS device 7, rather than using a single acoustic sensor. In other words, Figure 10 A so-called single DUT (MEMS device) test is shown with an acoustic sensor array, such as, for example, a microphone array.

[0094] Figure 11 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing each MEMS device 7_1 to 7_3 of a group 30 of multiple MEMS devices 7_1 to 7_3 at a wafer level using an acoustic sensor 8_1 to 8_3 is shown. Figure 10 In the embodiment shown, Figure 11 In the embodiment shown, a group 30 of MEMS devices 7_1 to 7_3 can be tested, with one sound sensor 8_1 to 8_3 associated with each MEMS device 7_1 to 7_3 of the group 30 of MEMS devices 7_1 to 7_3. Here, each sound sensor 8_1 to 8_3 can be arranged adjacent to a respective MEMS device 7_1 to 7_3 of the group 30 of MEMS devices 7_1 to 7_3, such as below a respective region 14_1-14_3 of a second test fixture 34 that is arranged adjacent to the respective MEMS device 7_1 to 7_3 and is at least partially acoustically transparent (e.g., transparent through a sound hole). Alternatively (or additionally), the respective sound sensors can also be arranged in a region of the first test fixture 10 between (or adjacent to) the probes contacting the respective MEMS devices 7_1 to 7_3, such as Figure 11 In other words, Figure 11 Shows so-called multi-DUT (MEMS device) testing with a single acoustic sensor (e.g., microphone) per DUT.

[0095] Figure 12 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing each MEMS device 7_1 to 7_3 of a group 30 of multiple MEMS devices 7_1 to 7_3 at a wafer level using an acoustic sensor array 8_1 to 8_3 is shown. Figure 11 In the embodiment shown, Figure 12 In the embodiment shown, each MEMS device 7_1 to 7_3 of the group 30 MEMS devices 7_1 to 7_3 may use one sound sensor array 8_1 to 8_3, rather than using a single sound sensor for each MEMS device. In other words, Figure 12Shows so-called multi-DUT (MEMS device) testing where each DUT is tested using an acoustic sensor array (e.g., a microphone array).

[0096] Figure 13 According to an embodiment, a schematic diagram of an apparatus 11 for performing acoustic testing on a group 30 of a plurality of MEMS devices 7_1 to 7_3 at a wafer level using an acoustic sensor 8 is shown. Figure 11 In the embodiment shown, Figure 13 In the embodiment shown, the group 30 of MEMS devices 7_1 to 7_3 may be acoustically tested using a single acoustic sensor 8, rather than using one acoustic sensor for each MEMS device. Figure 13 The so-called multi-DUT (MEMS device) testing with a single acoustic sensor (such as a microphone, for example) is demonstrated.

[0097] Figure 14 According to an embodiment, a schematic diagram of an apparatus 11 for performing acoustic testing on a group 30 of a plurality of MEMS devices 7_1 to 7_3 at a wafer level using an acoustic sensor array 8 is shown. Figure 13 In the embodiment shown, Figure 8 In the embodiment shown, the acoustic sensor array 8 may be used to perform acoustic testing on the group 30 of MEMS devices 7_1 to 7_3, rather than using a single acoustic sensor. In other words, Figure 14 The so-called multi-DUT (MEMS device) testing by means of a single sound sensor array (such as, for example, a microphone array) is demonstrated.

[0098] In an embodiment, a so-called acoustic probe test can be used in a manual or semi-automatic procedure. Here, a wafer 2 to be tested is introduced into an apparatus 1 which brings the wafer 2 to a defined position. A probe 3 comprising corresponding equipment 4 is applied to the wafer 2 (depending on the setup). The electrical connection to the microscopically small contacts 6 of the individual MEMS-ICs of the DUT 7 is made via test needles 5 applied to the probe 3. Depending on the application (see Figures 3 to 8 as well as Figures 9 to 14 ) and there are different placements of microphones 8 or microphone arrays (for example, see Figure 3) are positioned within the test pin array. Test pins 5 and microphones 8 or microphone arrays 8 are attached to probes 3 at defined locations. The resulting position depends on the type and complexity of the MEMS or DUT 7 being tested. Probes 3 are applied to wafer 2 at defined locations and with defined contact pressure. Probes 9 initiate electrical, mechanical, or electromechanical signals, perform the aforementioned acoustic inspection / test, and generate individual acoustic characterizations of the MEMS IC or DUT 7, which determine the functional category to which the individual MEMS IC or DUT 7 is assigned.

[0099] 1.2 Acoustic wafer probe card testing

[0100] Figure 15 A schematic diagram of a wafer prober is shown, which has a probe 17, a device 18 for the probe, a probe card 10 and a receiving device 16 (wafer chuck) for a wafer, wherein the wafer prober can be used before the wafer is Figures 3 to 14 In particular, Figure 3 The test device 10 described in 8 can be used, for example, in the form of a probe card 10 between the probe 17 and the wafer 2 to perform acoustic testing on at least one MEMS device of the wafer 2. Of course, it is also possible to use Figures 9 to 14 The test devices 10 and 34 described in the foregoing, wherein the first device 10 can be used, for example, in the form of a probe card 10 between the probe 17 and the wafer 2, and wherein the second test device 34 can be used between the wafer 2 and the wafer chuck 16 or in the form of a (extended) wafer chuck 16. In other words, Figure 15 A so-called wafer prober is shown, which has a so-called acoustic wafer probe test probe.

[0101] In an embodiment, a so-called acoustic wafer probe card test can be used in a fully automated procedure. Here, a wafer 2 to be tested is introduced into a device 15 on a wafer chuck 16. Probes 17 applied to the wafer 2 (e.g., between the probes 18 and the probe card 10), including corresponding devices 18, comprise an interface with the probe card 10, with which the wafer 2 is tested. Test needles 5 attached to the probe card 10 are in contact with individual MEMS ICs or DUTs 7 (cf. Figure 2 ) of microscopic small contacts 6 (cf. Figure 2 ) to make electrical contact. In the test pin array, there are microphones or microphone arrays 8 with different placements (cf. Figure 2 ), depending on the application (please refer to Figures 2 to 14). Test needles and microphones or microphone arrays are applied at defined positions on the probe card. The position results depend on the type and complexity of the MEMS or DUT 7 being tested. Therefore, the size of the probe card defines the maximum possible number of MEMS or DUTs. Probes with a probe card are applied to the wafer at defined positions and defined contact pressures. The probe 19 initializes electrical, mechanical or electromechanical signals, performs the above-mentioned acoustic inspection / testing, and generates individual acoustic characterizations of the MEMS IC or DUT, which determines to which functional category the individual MEMS IC or DUT is assigned. In addition, the probe 20 can use the probe to subject the currently tested MEMS IC or DUT to further electrical testing. The test program can be checked by the field of view 22. The status of the machine can be identified by the signal light 21. Here, for example, the color coding can be as follows: red - error in the program flow or functional error in the machine, yellow - warning for the current program flow or warning for the machine function, green - successful completion of the program or machine function. All subunits are connected to the wiring (such as cable harness) 23.

[0102] 2. Assembly test / testing during assembly

[0103] Figure 16 According to an embodiment, a schematic diagram of an apparatus 11 for acoustically testing at least one MEMS device 7 after molding / packaging the at least one MEMS device is shown.

[0104] The apparatus 11 may include a receiving device 25 for receiving (and, for example, for positioning) at least one MEMS device, such as an integrated circuit having at least one MEMS device. Furthermore, the apparatus 11 may include a testing device 10 (e.g., part of a probe card or probe) configured to contact the at least one MEMS device 7 and, for example, mechanically or electrically excite the at least one MEMS device 7 to generate acoustic vibrations, for example, via a test needle 5 contacting a contact 6 of the at least one MEMS device 7. The testing device 10 may further include at least one sound sensor 8 (e.g., a microphone) configured to detect the acoustic vibrations of the at least one MEMS device 7.

[0105] Here, the at least one sound sensor 8 can be arranged adjacent to the at least one MEMS device 7, for example, in an area of an emission angle (e.g., a main emission angle) of acoustic vibrations of the at least one MEMS device 7, such as between (or adjacent to) a test pin 5 in contact with the at least one MEMS device 7, and / or adjacent to the at least one MEMS device 7 and on an area 14 of the test apparatus 10 that is at least partially acoustically transparent (e.g., transparent through a sound hole). The apparatus 11 (e.g., the test apparatus 10) can optionally (e.g., if necessary) include an acoustic shielding device 13 (e.g., a noise shield) configured to shield the at least one sound sensor 8 from the environment and / or other MEMS devices of the plurality of MEMS devices.

[0106] like Figure 16 As shown, the test device 10 can be part of a probe card or probe 27 of the device 11, for example. The probe 27 can, for example, comprise the device 24 for the probe card 10 and, for example, the electronic component 12 and, if applicable, a connection 26 to an evaluation unit and, if applicable, a connection to a prober.

[0107] in other words, Figure 16 An example of a so-called assembly test or a test during assembly using a so-called acoustic post-mold / encapsulation test is presented.

[0108] In an embodiment, after the molding / encapsulation process of embedding the individual MEMS (IC) or DUT in epoxy resin, the completed individualized MEMS (IC) or DUT can be subjected to acoustic testing and acoustic characterization, for example, in a subsequent final semiconductor test - the so-called acoustic post-molding / encapsulation test. The test bench includes devices 24 and 25 for positioning and fixing the MEMS IC or DUT 7, depending on the package. It accommodates the MEMS IC or DUT 7. The probe 27 includes an acoustic test unit 28, which has different settings depending on the application (see Figures 2 to 14 ), is placed on the MEMS IC or DUT 7 and is connected to the probe 19 (see Figure 15 ) initiates electrical, mechanical or electromechanical signals, performs the above-mentioned acoustic inspection / test, and generates individual acoustic characterization of the MEMS IC or DUT, which determines to which functional category the individual MEMS IC or DUT is assigned. Figure 15 ) The prober can be used to subject the MEMS IC or DUT 7 currently under test to further electrical testing.

[0109] 3. Production line testing

[0110] 3.1 Acoustic in-line testing

[0111] So-called acoustic in-line testing describes a procedure in which sub-products are subjected to acoustic testing and acoustic characterization between individual product manufacturing steps, e.g. Figure 17 shown.

[0112] In detail, Figure 17 Schematic diagram showing acoustic testing of at least one MEMS device in a production line (in-line) and at the end of the production line (end-of-line). Figure 17 Positions are presented for so-called production line tests, so-called acoustic in-line tests, and so-called acoustic end-of-line tests, which are performed by means of special containment equipment with special probe equipment.

[0113] The application-specific receiving device 30 holds the DUT. Figure 16 ) probe 27 (see Figure 16 ) is placed on the DUT. Detector 19 (please refer to Figure 15 ) initiates electrical, mechanical, or electromechanical signals, performs the aforementioned acoustic inspection / testing, and generates an individual acoustic characterization of the DUT, which determines whether the DUT is suitable for continued production, should be repaired, or rejected. Another aspect of this embodiment is the ability to perform sorting until individual chips are identified. For identification purposes, this method can also be used to add markings on the MEMS to associate the chip with the location and time of production.

[0114] 3.2 Acoustic end-of-line testing

[0115] The so-called acoustic end-of-line test describes a procedure in which the end product is subjected to acoustic testing and acoustic characterization at the end of one or several production chains. An application-specific holding device 30 holds the DUT. Figure 16 ) probe 27 (see Figure 16 ) is placed on the DUT. Detector 19 (please refer to Figure 15 ) initializes electrical or mechanical or electromechanical signals and performs the above-mentioned acoustic inspection / test and produces an individual acoustic characterization of the DUT, which determines whether the DUT meets the defined quality requirements or whether it is rejected.

[0116] 3.3 MEMS final application operation

[0117] All the methods described previously as sub-aspects are used when the MEMS is monitored, characterized, and actuated during operation in the final application. Here, signal processing using a computer program is used, which uses the energy converted in the system for actuation. By feeding in data from the previous embodiments, the behavior is evaluated using previously implemented parameters without continuous acoustic characterization, and the actuation is adjusted to the MEMS state.

[0118] 4. Further Examples

[0119] Using the embodiments described herein, there is a way to acoustically evaluate the conversion of electrical energy received by a MEMS. In one, more, or each step of the value chain, a probability can be assigned (e.g., by a computer program) that the device will be affected by predetermined parameters and whether it can be sensed from an economic point of view for further processing. The type of energy converted from electrical energy to heat energy and acoustic energy (such as atmospheric noise) can be used for evaluation. In a further embodiment, electromagnetic waves can be detected using the described arrangement.

[0120] Although the embodiments described herein use acoustic sensors to directly detect acoustic vibrations generated by MEMS devices, it should be noted that, in some embodiments, an acoustic filter may be provided in the acoustic path. Additionally, an amplifier or signal processing device may be provided during driving.

[0121] In embodiments, energy distribution in a MEMS may be detected and, for example, evaluated.

[0122] In an embodiment (eg using a computer program), an acoustic characterization can be performed for evaluating a signal or signal class of energy emitted and measured by a sound sensor (eg a microphone). Here, methods for compensating for nonlinear behavior can be applied.

[0123] It is pointed out that a size-reduced MEMS device is also to be understood as a MEMS device, such as a NEMS (Nano-Electro-Mechanical Systems) device or an even further miniaturized electro-mechanical system.

[0124] Although some aspects have been described with device as background, it is clear that these aspects also represent the description of corresponding methods, so that the program block or equipment of the device correspond to the feature of corresponding method steps or method steps.Similarly, the description of the project or feature of corresponding program block or corresponding device is also represented with method steps as background or as method steps.For example, some or all of the method steps can be performed by (or using) hardware devices, such as microprocessors, programmable computers or electronic circuits.In certain embodiments, some or more of the most important method steps can be performed by this device.

[0125] Depending on certain implementation requirements, embodiments of the present invention may be implemented in hardware or software. Implementations may be performed using a digital storage medium, such as a floppy disk, DVD, Blu-ray Disc, CD, ROM, PROM, EPROM, EEPROM, or flash memory, a hard drive, or another magnetic or optical memory, storing electronically readable control signals that cooperate or are capable of cooperating with a programmable computer system to perform the method. Thus, the digital storage medium may be computer-readable.

[0126] Some embodiments according to the invention comprise a data carrier comprising electronically readable control signals, which are capable of cooperating with a programmable computer system, causing it to perform one of the methods described herein.

[0127] Generally speaking, the embodiments of the present invention can be implemented as a computer program product with a program code. When the computer program product is executed on a computer, the program code is operative to perform one of the methods.

[0128] The program code can, for example, be stored on a machine-readable carrier.

[0129] Other embodiments comprise the computer program for performing one of the methods described herein, wherein the computer program is stored on a machine readable carrier.

[0130] In other words, an embodiment of the inventive method is, therefore, a computer program comprising a program code for performing one of the methods described herein, when the computer program runs on a computer.

[0131] A further embodiment of the inventive method is, therefore, a data carrier (or a digital storage medium or a computer-readable medium) comprising or having recorded thereon the computer program for performing one of the methods described herein. The data carrier, the digital storage medium or the computer-readable medium are typically tangible and / or non-transitory or non-volatile.

[0132] A further embodiment of the inventive method is, therefore, a data stream or a sequence of signals representing the computer program for performing one of the methods described herein.The data stream or the sequence of signals can, for example, be configured to be transferred via a data communication connection, for example via the Internet.

[0133] A further embodiment comprises a processing means, for example a computer, or a programmable logic device, configured to be adapted to perform one of the methods described herein.

[0134] A further embodiment comprises a computer having installed thereon the computer program for performing one of the methods described herein.

[0135] Yet another embodiment of the present invention includes an apparatus or system configured to transfer a computer program for performing at least one of the methods described herein to a receiver. The transfer can be performed electronically or optically, for example. The receiver can be, for example, a computer, a mobile device, a memory device, or the like. The apparatus or system can include, for example, a file server for transferring the computer program to the receiver.

[0136] In some embodiments, a programmable logic device (e.g., a field programmable gate array, or FPGA) can be used to perform some or all of the functions of the methods described herein. In some embodiments, the field programmable gate array can be used in conjunction with a microprocessor to perform one of the methods described herein. Generally speaking, in some embodiments, the methods are performed by any hardware device. This can be general-purpose hardware, such as a computer processor (CPU), or hardware specific to the method, such as an ASIC.

[0137] The apparatus described herein can be implemented, for example, using a hardware device, or using a computer, or using a combination of a hardware device and a computer.

[0138] The apparatus described herein, or any component of an apparatus described herein, may be implemented at least partially in hardware and / or software (computer program).

[0139] The methods described herein can be implemented, for example, using a hardware device, or using a computer, or using a combination of a hardware device and a computer.

[0140] The methods described herein, or any component of the methods described herein, may be performed at least in part by hardware and / or by software.

[0141] The above embodiments are merely illustrative of the principles of the present invention. It is understood that modifications and variations of the arrangements and details described herein will be readily apparent to those skilled in the art. Accordingly, it is intended that the present invention be limited solely to the scope of the appended patent claims and not to the specific details presented herein through the description and explanation of the embodiments.

Claims

1. A method (100) for acoustically testing at least one MEMS device (7) among a plurality of MEMS devices (7_1-7_3), wherein the method (100) comprises: providing (102) the plurality of MEMS devices (7_1-7_3) having the at least one MEMS device (7), providing a test device (10), and contacting the at least one MEMS device (7) via the test device (10), exciting (104) the at least one MEMS device (7) via the test device (10) to generate acoustic vibrations, detecting (106) acoustic vibrations of the at least one MEMS device (7) by at least one acoustic sensor (8) of the testing apparatus (10), evaluating (108) acoustic vibrations of the at least one MEMS device (7), testing the at least one MEMS device (7) for a target function by detecting it with the at least one acoustic sensor (8), The test device (10) is a probe, a part of a probe or a test card.

2. The method (100) according to claim 1, wherein before dicing the plurality of MEMS devices (7_1-7_3), the at least one MEMS device (7_2) is tested on a wafer level, Or wherein after cutting the plurality of MEMS devices (7_1-7_3), the at least one MEMS device (7_2) is tested.

3. The method (100) according to claim 1, wherein the test apparatus (10) is at least partially acoustically transparent at least in a region (14) adjacent to the at least one MEMS device (7), The at least one acoustic sensor (8) is arranged adjacent to an at least partially acoustically transparent region (7) of the test device (10).

4. The method (100) according to claim 3, wherein the at least one MEMS device (7) is a group of MEMS devices (7_1-7_3), wherein the test apparatus (10) is at least partially acoustically transparent at least in a region (14_1-14_3) adjacent to the set of MEMS devices (7_1-7_3), The at least one sound sensor (8) is arranged adjacent to an at least partially acoustically transparent area (14_1-14_3) of the test device (10).

5. The method (100) according to claim 1, wherein the at least one MEMS device (7) is a group of MEMS devices (7_1-7_3), wherein the set of MEMS devices (7_1-7_3) is excited to generate acoustic vibrations, The acoustic vibrations of the group of MEMS devices (7_1-7_3) are detected by the at least one sound sensor (8).

6. The method (100) according to claim 5, wherein said at least one sound sensor (8) is precisely one sound sensor (8) associated with said set of MEMS devices (7_1-7_3), Or wherein the at least one sound sensor (8) comprises precisely one sound sensor array associated with the set of MEMS devices (7_1-7_3).

7. The method (100) according to claim 5, wherein the at least one sound sensor (8) comprises a plurality of sound sensors (8_1-8_3), wherein each sound sensor of the plurality of sound sensors is associated with a MEMS device of the set of MEMS devices (7_1-7_3), Or wherein the at least one sound sensor (8) comprises a plurality of sound sensor arrays (8_1-8_3), wherein each sound sensor array in the plurality of sound sensor arrays (8_1-8_3) is associated with a MEMS device in the group of MEMS devices (7_1-7_3).

8. The method (100) according to claim 7, The plurality of sound sensors (8_1-8_3) or the sound sensor array (8_1-8_3) are acoustically shielded from each other, and / or the MEMS devices of the group of MEMS devices (7_1-7_3) are acoustically shielded from each other.

9. The method (100) according to claim 5, The group of MEMS devices (7_1-7_3) are excited simultaneously by different signals with non-overlapping frequencies.

10. The method (100) according to claim 5, The group of MEMS devices (7_1-7_3) are excited simultaneously by different signals with overlapping frequencies.

11. The method (100) according to claim 5, The group of MEMS devices (7_1-7_3) are successively excited by the same signal.

12. The method (100) according to claim 8, The group of MEMS devices (7_1-7_3) are excited simultaneously.

13. The method (100) according to claim 1, The at least one MEMS device (8) is a MEMS speaker, a MEMS microphone, a MEMS pump, a MEMS actuator, a MEMS transmission or a MEMS-based medical testing device.

14. The method (100) according to claim 1, The at least one sound sensor (8) is a microphone or a structure-borne sound sensor.

15. A method (100) for acoustically testing at least one MEMS device (7): providing (102) at least one MEMS device (7), exciting (104) the at least one MEMS device (7) to generate acoustic vibrations, detecting (106) acoustic vibrations of the at least one MEMS device (7) by at least one sound sensor (8), evaluating (108) the acoustic vibrations of the at least one MEMS device (7) detected by the at least one sound sensor (8) to test the at least one MEMS device (7) for a target function, A first test device (10) is provided, and a first side (32) of the at least one MEMS device (7) is contacted by the first test device (10), wherein: exciting the at least one MEMS device (7) by means of the first testing device (10), A second test device (34) is provided and a second side (36) of the at least one MEMS device (7) opposite to the first side (32) is contacted by the second test device (34), wherein the second test device (34) includes the at least one sound sensor (8).

16. The method (100) according to claim 15, in, The second test device (34) comprises a support (1) for the wafer (2), wherein the support (1) is at least partially acoustically transparent at least in a region (14) adjacent to the at least one MEMS device (7), and Therein, the at least one sound sensor (8) is arranged adjacent to an at least partially acoustically transparent area (14) of the support body (1).

17. The method (100) according to claim 16, in, The at least one MEMS device (7) is a group of MEMS devices (7_1-7_3), wherein the support body (1) is at least partially acoustically transparent at least in a region (14_1-14_3) adjacent to the group of MEMS devices (7_1-7_3), The at least one sound sensor (8) is arranged adjacent to an at least partially acoustically transparent region (14_1-14_3) of the support body (1).

18. A method (100) for acoustically testing at least one MEMS device (7): providing (102) at least one MEMS device (7), exciting (104) the at least one MEMS device (7) to generate acoustic vibrations, detecting (106) acoustic vibrations of the at least one MEMS device (7) by at least one sound sensor (8), evaluating (108) the acoustic vibrations of the at least one MEMS device (7) detected by the at least one sound sensor (8) to test the at least one MEMS device (7) for a target function, in, The at least one MEMS device (7) is a group of MEMS devices (7_1-7_3), wherein the set of MEMS devices (7_1-7_3) are excited to generate acoustic vibrations, wherein the acoustic vibrations of the group of MEMS devices (7_1-7_3) are detected by the at least one sound sensor (8), wherein the at least one sound sensor (8) comprises a plurality of sound sensors (8_1-8_3), wherein each sound sensor of the plurality of sound sensors (8_1-8_3) is associated with a MEMS device of the group of MEMS devices (7_1-7_3), Or wherein the at least one sound sensor (8) comprises a plurality of sound sensor arrays (8_1-8_3), wherein each sound sensor array of the plurality of sound sensor arrays (8_1-8_3) is associated with a MEMS device of the group of MEMS devices (7_1-7_3).

19. The method (100) according to claim 18, wherein the plurality of sound sensors (8_1-8_3) or the sound sensor array (8_1-8_3) are acoustically shielded from each other, And / or wherein the MEMS devices in the group of MEMS devices (7_1-7_3) are acoustically shielded from each other.

20. The method (100) according to claim 18, in, The group of MEMS devices (7_1-7_3) are excited simultaneously by different signals with non-overlapping frequencies.

21. The method (100) according to claim 18, in, The group of MEMS devices (7_1-7_3) are excited simultaneously by different signals with overlapping frequencies.

22. The method (100) according to claim 18, in, The group of MEMS devices (7_1-7_3) are successively excited by the same signal.

23. A computer storage medium storing a computer program, which, when the computer program is run on a computer, a microprocessor, an FPGA or an ASIC, performs the method (100) according to claim 1, or claim 15, or claim 18.

24. A testing device (10) for performing acoustic testing on at least one MEMS device (7_2) among a plurality of MEMS devices (7_1-7_3) arranged on a wafer (2). wherein the testing device (10) is configured to contact at least one MEMS device (7_2) of the plurality of MEMS devices (7_1-7_3) arranged on the wafer (2), wherein the testing apparatus (10) is configured to excite the at least one MEMS device (7_2) to generate acoustic vibrations, wherein the testing apparatus comprises at least one sound sensor (8) configured to detect the acoustic vibrations of the at least one MEMS device (7_2), wherein the testing device (10) is configured to provide at least one signal, the at least one signal being dependent on the acoustic vibration of the at least one MEMS device (7_2) detected by the sound sensor, The test device (10) is a probe, a part of a probe or a probe card.

25. An apparatus (11) for acoustically testing at least one MEMS device (7_2) of a plurality of MEMS devices (7_1-7_3) arranged on a wafer (2), The device (11) comprises a first testing device (10) and a second testing device (34), wherein the first test device (10) is configured to contact a first side (32) of the at least one MEMS device (7_2) among the plurality of MEMS devices (7_1-7_3) arranged on the wafer (2), wherein the first testing device (10) is configured to excite the at least one MEMS device (7_2) to generate acoustic vibrations, wherein the second testing device (34) is configured to contact a second side (36) of the at least one MEMS device (7_2) opposite to the first side (32), wherein the second testing device (34) comprises at least one sound sensor (8), the at least one sound sensor (8) being configured to detect the acoustic vibration of the at least one MEMS device (7_2), The apparatus (11) is configured to evaluate the acoustic vibrations of the at least one MEMS device (7_2) detected by the at least one sound sensor (8) to test the at least one MEMS device (7_2) for a target function.

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